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Thunder i7501Xtreme
Covers models:
///
S2726UG5N/S2726G5N
S2726
Revision 1.01
Copyright © TYAN Computer Corporation, 2002- 2003. All rights reserved. No part of this manual
may be reproduced or translated without prior written consent from TYAN Comp uter Corp.
All registered and unregistered trademarks and company names contained in this manual are
property of their respective owners including, but not limited to the following.
TYAN, Thunder i7501Xtreme S2726 are trademarks of TYAN Computer Corporation.
Intel, Xeon, and combinations thereof are trademarks of Intel Corporation.
AMI, AMIBIOS are trademarks of AMI Software Inc.
Microsoft, Windows are trademarks of Microsoft Corporation.
IBM, PC, AT, PS/2 are trademarks of IBM Corporation.
Winbond is a trademark of Winbond Electronics Corporation.
Portable Document Format (PDF) is a trademark of Adobe Corporation.
Information contained in this document is furnished by TYAN Computer Corporation and has been
reviewed for accuracy and reliability prior to printing. TYAN assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to sale and/or use of TYAN products including
liability or warranties relating to fitness for a particular purpose or merchantability. TYAN retains the
right to make changes to product descriptions and/or specifications at any time, without notice. In
no event will TYAN be held liable for any direct or indirect, incidental or consequential damage,
loss of use, loss of data or other malady resulting from errors or inaccuracies of information
contained in this document.
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Table of Contents
Before you begin…
Chapter 1: Introduction
1.1 Congratulations!
1.2 Hardware Specifications
1.3 Software Specifications
Chapter 2: Board Installation
2.0 Picture of S2726UG5N Board
2.1 Board Jumpers and Fan locations
2.2 LED locations
2.3 Jumper Information
2.4 LED Information
2.5 Fan Header Information
2.6 PCI Setup & Bus Diagram
2.7 Mounting the Motherboard
2.8 Installing the Memory
2.9 Installing the Processors & Heatsinks
2.10 Attaching Drive Cables
2.11 Installing Add-In cards
2.12 Connecting External Devices
2.13 Installing the Power Supply
2.14 Finishing up
Chapter 3: BIOS
3.1 Main Setup
3.2 Advanced Settings
3.3 IDE Configuration
3.4 Floppy Configuration
3.5 Boot Settings Configuration
3.6 Super IO Configuration
3.7 Onboard Device Configuration
3.8 USB Configuration
3.9 PCIPnP
3.10 Chipset
3.11 North Bridge Configuration
3.12 ICH3 Chipset Configuration
3.13 Intel PCI- 64 Hub Configuration
3.14 ACPI
3.15 ACPI Advanced
3.16 Boot
3.17 Security
3.18 Exit
Chapter 4: Diagnostics
4.1 Hardware Monitor Information
4.2 Beep Codes
4.3 Flash Utility
Appendix I: Onboard LAN LED Color Def.
Appendix II: Glossary
Appendix III: SMDC
Appendix IV: Riser Cards
Appendix V: Pin outs for jumpers/headers
Technical Support
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Before you begin…
Check the box contents!
The retail motherboard package should contain the following:
1x Thunder i7501Xtreme motherboard
2x CPU retention brackets
1x 34-Pin floppy drive cable
1x Ultra160/320 LVD SCSI cable (if optional SCSI included)
1x Ultra-DMA-100/66/33 IDE cable
1x Thunder i7501Xtreme Quick Reference guide/sticker.
1x Thunder i7501Xtreme User’s Manual
1x TYAN driver CD
1x Adaptec Ultra160/Ultra320 SCSI driver diskette (if optional SCSI included)
1x I/O shield with 5 LAN ports
If any of these items are missing, please contact your vendor/dealer for replacement before
continuing with the installation process.
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Chapter 1: Introduction
1.1 – Congratulations!
You have just purchased one of the most advanced Dual Intel processor solutions, the Thunder
i7501Xtreme. Based on Intel's E7501 chipset, the Thunder i7501Xtreme is Hyper-Threading
ready - utilizing onboard resources so that a second thread of data can be processed in one
processor. With two Gigabit Ethernet ports and one fast Ethernet port, six DDR DIMM sockets,
plus an optional Dual Channel Ultra320 SCSI, the Thunder i7501Xtreme is fast and flexible
enough to fit your server needs.
Remember to visit TYAN’s Website at http://www.tyan.com. There you can find information on all
of TYAN’s products with FAQs, distributors list and BIOS setting explanations.
1.2 – Hardware Specifications
Processor
• Dual PGA604 ZIF sockets
• Supports up to two Intel Xeon processors with
512KB L2 cache
• Onboard VRM (VRM 9.1 spec)
• Front-Side Bus support for 533 & 400MHz
Chipset
• Intel E7501 chipset
• MCH + ICH3 + P64H2 + P64H2 + FWH
• Each P64H2 supports two up to PCI- X
133MHz buses.
• Winbond 83627HF Super I/O ASIC
Memory
• Six 184- pin 2.5-Volt DDR DIMM sockets
• Supports up to 12GB of Registered
DR200/266 (PC1600/PC2100)
• Dual channel memory bus
• Supports only Registered ECC type memory
modules
Expansion Slots
• Two 64-bit 133/100/66MHz (3.3V) PCI -X slots
• One 32-bit 33MHz (5V) PCI slot
• Total of three usable slots
Integrated SCSI (manufacturing option)
• Adaptec AIC-7902 (2726UG5N)
• Connects to PCI -X bus
• Dual Channel Ultra 320MB/sec
• Supports 15 LVD SCSI devices per channel
ZCR for Adaptec 7902 SCSI(320MB/s)
Adaptec: 2010s ZCR card (Skyhawk)
Intel: Intel® RAID Controller SRCZCR
* For more details, please see the Thunder
i7501 FAQ page on the Tyan website:
http://www.Tyan.com.
Integrated 2D/3D Graphics
• ATI RAGE XL graphics controller
• 8 MB frame buffer
• Standard 15- pin analog VGA port
Integrated LAN Controllers
• Four 10/100/1000 GbE ports
• 2 x Intel 82546 controller
• Operating at PCI- X 133MHz Bus
(Independent Bus)
• One 10/100 port
• Intel 82551 controller
• 5 LAN ports total.
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Integrated PCI IDE
• Dual Channel master mode
• Supports up to four Enhanced IDE devices
• Support for ATA-100/66/33 IDE and ATAPI
compliant devices
Integrated I/O
• One floppy connector supports up to two
drives
• Two 9-pin 16550-based serial ports (one via
optional cable)
• One 25-pin SPP/ECP/EPP parallel port
header
• Two USB 1.1 ports
• Two internal USB headers
• PS/2 keyboard and mouse ports
Form Factor
• SSI EEB v3.0 footprint (12" x 13")
• EPS12V power connectors (24 -pin and 8-pin)
• Serial (one) and VGA port
• Stacked USB (two) ports + (one) LAN port
• Side-by- side LAN (two) ports
• Stacked keyboard and mouse ports
1.3 Software Specifications
Hyper-Threading Support In:
Win2K Server
Win2K Advanced Server
XP Pro
Linux (Kernel 2.4.18)
NT 4.0 Server
TYAN reserves the right to add su pport or
discontinue support for any OS with or
without notice.
Intelligent Platform Management Interface
(Manufacturing Option)
§ QLogicTM Zircon Baseboard
Management Controller (BMC)
based on powerful ARM7 technology
§ Tailored for IPMI highest 1.5 Spec.
§ Supports KCS and BT styles
§ Supports flexible Windows and Linux
based Management Solution
§ Supports RMCP and SNMP
protocols
§ Supports ASF standard and EMP
§ I2C serial multi-master controllers
and UARTs
§ Built-in IPMB connector
§ Supports remote Power on/off and
reset support (I PMI-over-LAN)
§ Server Management Daughter card
via built- in 2x25 header
Hardware Monitoring
• Winbond W83782D hardware monitoring.
ASIC
• CPU temperature/voltage monitoring
• Total 11 fan headers:
- Three monitored and controlled 3-pin fan
headers
- Three monitored 3- pin fan headers
- Five additional 3-pin fan headers
• 2-pin chassis intrusion header
• 3-pin Wake-on- LAN (WoL) header
BIOS
• AMI BIOS on 4Mbit Flash ROM
• User settings for hardware monitoring
• Auto- configuration of IDE hard drive types
• Multiple boot options
Regulatory
• FCC DoC (Declaration of Conformity)
• European CE (Declaration of Conformity)
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Chapter 2: Board Installation
WARNING: The Thunder i7501 Xtreme only
supports EPS12V power supplies and will not
operate with other types. Refer to section 2.12 for
instructions on installing EPS12V power supplies.
DO NOT use ATX 2.x, ATX12V and dual AMDGES
power supplies as they will damage the board and
void your warranty.
Only EEB V3.0 form factor chassis is supported.
Oth er form factors may short the board because the
installation studs are in different locations than
ones required by the Thunder i7501 Xtreme.
Installation
You are now ready to install your motherboard. The mounting hole pattern of the Thunder i7501
Xtreme matches the EEB V3.0 specification. Before continuing with installation, confirm that your
chassis supports a standard EEB V3.0 motherboard.
How to install our products right….the first time!
The first thing you should do is read this user’s manual. It contains important information that will
make configuration and setup much easier. Here are some precautions you should take when
installing your motherboard:
(1) Ground yourself properly before removing your motherboard from the antistatic bag.
Unplug the power from your computer power supply and then touch a safely grounded
object to release static charge (i.e. power supply case). For the safest conditions, Tyan
recommends wearing a static safety wrist strap.
(2) Hold the motherboard by its edges and do not touch the bottom of the board, or flex the
board in any way.
(3) Avoid touching the motherboard components, IC chips, connectors, memory modules,
and leads.
(4) Place the motherboard on a grounded antistatic surface or on the antistatic bag that the
board was shipped in.
(5) Inspect the board for damage.
The following pages include details on how to install your motherboard into your chassis, as well
as installing the processor, memory, disk drives and cables.
NOTE DO NOT APPLY POWER TO THE BOARD IF IT HAS BEEN DAMAGE D
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2.0 – Board
The following is an image of the S2726UG5N Thunder i7501Xtreme.
The above photograph is purely representative. Due to engineering updates and new board
revisions, certain components may change and or be repositioned. The picture above may
or may not look exactly like the board you received.
The following page includes details on the vital components of this motherboard.
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2.1 – Board Jumpers, and Fan locations
J49
J43
J65
J38
J34
J67
J68
J55
J53
J58
J41
J40
J50
J51
J39
J22
J21
JP3
J42
This jumper diagram is representative of the latest board revision available at the time of
publishing. The board you receive may or may not look exactly like the above diagram.
See the jumper descriptions on next page.
2.2 LED locations
D36
D11
NOTE: See page 11 for information on the LEDs
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2.3 – Jumper Information
Jumper Function Ref. Page
J21
J22
J34
J38*
J39***
J40
J41**
J42
J43***
J49
J50
J51
J53, J58
J67&J68
J55
J65
JP3
* WOL is only supported by LAN1 (82551, 10/100 Mbps)
** J41 is an LED INPUT. The idea is to run a wire from the activity LED output header of any plug-
in HD controller card (e.g. a RAID card) to the motherboard, so that the card's LED can be
"combined " with the IDE and SCSI activity indicators on the motherboard and then driven to the
J40 HD LED output. In other words, when a card's LED lights up, so will the front-panel hard-disk
activity indicator. This is useful for chassis that have only a single LED to indicate HD activity from
multiple controller sources. (Pin 1 = negative terminal of the add -on card's LED header, Pin 2 = do
not connect.)
*** (j39,J43) These jumpers are reserved. Reserved jumpers are for engineering purposes only.
Jumper Example
CMOS Clear Page 9
External speaker header Page 46
Serial Port internal header Page 46
WOL ( Wake On LAN) See Below
Hardware Monitor LED ( Reserved ) See below
Front panel connector Page 10
Hard disk activity LED external input See below
SMDC (Server Management Daughter Card) connector Page 43 & 47
I2C bus connector ( Reserved ) See below
Hyper Threading control Page 10
USB header #2 Page 30
USB header #3 Page 30
Intel GbE 82546 (4x GbE) 4- pin external LAN
activity/link LED headers. Note: Left most pin is pin1.
Intel 82551 4-pin external LAN activity/link LED header Page 37 & 46
Force 400Mhz FSB instead of 533Mhz FSB Page 10
FAN 3 current rate select Page 11
Page 37 & 46
Jumper OFF – open (without pin)
Jumper ON – closed (with pin)
1
You can reset the CMOS settings in case an incorrect setting causes sy stem
instability or you have forgotten your system/setup password or have just
flashed your BIOS by using these jumpers.
- Power off system, disconnect power supply from motherboard
- Set jumper J21 to Clear CMOS
- Wait about 5 seconds
- Set jumper J21 to Normal
CMOS Reset (J21)
1
Clear CMOS
Default
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Force 400MHz FSB (J65)
.
Default
Jumper Open = 533Mhz FSB (4 x133Mhz)
Jumper Closed= Force 400Mhz FSB (4x 100Mhz)
Force 100MHz
Hyper-Threading (J49)
Jumper open = BIOS controls Hyper- Threading.
Default
Jumper closed = Disables Hyper-Threading, no matter what the BIOS
setting is.
Hyper - Threading
Disabled
Front Panel Connector (J40)
Your chassis will usually come with connectors to install onto the motherboard, such as HD and
Power LEDs. The Front Panel Connector (J40) has been implemented for such purposes.
Front Panel Connector (J40)
J40
2.4 – LED Information
10
Your chassis will usually come with connectors to
install onto the motherboard, such as HD and Power
LEDs. The Front Panel Connector (J40) has been
implemented for such purposes.
HD LED Header
Power LED Header
Power-On Switch
Reset Switch
Chassis Intrusion Header
= Pin 1 & 3
= Pin 2 & 4
= Pin 6 & 8
= Pin 5 & 7
= Pin 17 & 18
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LEDs Description ( see page 8 for location)
D11
D36
CPU Voltage Mismatch (LED)
Red LED activates if single CPU is placed in CPU 2 socket. May also
activate if CPUs are mismatched – ie. Using two different Xeons. If
installing only one CPU, it must be placed in CPU 1. (Light will remain off
if CPUs are placed correctly.)
Power on LED
2.5 – Fan Header Information
Fan # Fan Description Monitoring Functions Max Amp Rated
1 CPU 2 fan RPM Read and controlled 1.2A
2 CPU 1 fan RPM Read and controlled 1.2A
3 Chassis fan 3 RPM Read and controlled
(see information below for fan 3)
4 Chassis fan 4 RPM Read 1.2A
5 Chassis fan 5 RPM Read 1.2A
6 Chassis fan 6 RPM Read 1.2A
7 Chassis fan 7 None 2A
8 Chassis fan 8 None 2A
9 Chassis fan 9 None 2A
10 Chassis fan 10 None 2A
11 Chassis fan 11 None 2A
Use these headers to connect cooling fans, both chassis and
processor fans, to your motherboard. Cooling fans help keep the
system more stable and operating reliably for its product life.
+12V fans supported
FAN3 Current Rate Select (JP3)
1.2A
11
Jumper open = FAN3 supports RPM read and fan
control. FAN3 current rate is up to 1.2 Amperes.
Jumper closed = FAN3 supports RPM read, but no
fan control. FAN3 current rate is up to 2 Amperes.
http://www.TYAN.com
Normal Up to 2 Amp on FAN3
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2.6 – PCI Setup
Slot (1): 64
-
bit 133MHz (3.3V) PCI
-
X
3.3 volt cards accepted
Slot (2): 32 -bit 33MHz (5V) PCI
5 volt and 3.3 volt cards accepted
Slot (3): 64 -bit 100/133MHz PCI-X
2726GN5 (non SCSI version
supports PCI-X 133)
3.3 volt cards accepted
Supports Zero Channel RAID
The PCI -X slots on the Thunder
i7501 Xtreme operate on
independent PCI-X buses, which
gives you maximum bandwidth.
Bus Diagram of S2726UG5N
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2.7 – Mounting the Motherboard
Before installing your motherboard, make sure your chassis has the necessary motherboard
support studs installed. These studs are usually metal and are gold in color. Usually, the chassis
manufacturer will pre-install the support studs. If you’re unsure of stud placement, simply lay the
motherboard inside the chassis and align the screw holes of the motherboard to the studs inside
the case. If there are any studs missing, you will know right away since the motherboard will not
be able to be securely installed.
Some chassis’ include plastic studs instead of metal. Although the plastic studs are usable, Tyan
recommends using metal studs with screws that will fasten the motherboard more securely
in place.
Below is a chart detailing what the most common motherboard studs look like and how they
should be installed.
TIP: Use metal studs if possible, as they hold the motherboard i nto place more securely than
plastic standoffs.
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2.8– Installing the Memory
Before attempting to install any memory, make sure that the memory you have is compatible with
the motherboard as well as the processor. For example, while PC1600 DDR modules are
compatible with all DDR based motherboards, they will not work if you are required to run the
motherboard and processor buses at 133MHz. For this, PC2100 DDR modules are required.
Critically important is whether you’re using the recommended memory for the current board you
have. For this information, please check Tyan’s web site at: www.tyan.com
The following diagrams show some types of DDR modules you may encounter:
Double-Sided x4 ECC DDR SDRAM DIMM
Double-Sided x8 ECC DDR SDRAM DIMM
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Memory Installation Procedure
The Thunder i7501 Xtreme requires that memory modules be installed in pairs. Please
refer to the next page for exact details on installing memory modules correctly.
When installing memory modules, make sure the modules align properly with the memory socket.
There should be keys (small indents) on your memory modules that fit according to the keys in the
memory socket. DDR modules and sockets have only one key, which is slightly near the center of
the module/socket. SDRAM modules (also referred to as PC100 or PC133) and their sockets have
two keys and will not insert into DDR DIMM sockets. The method of installing memory modules is
detailed in the following diagrams.
Once the memory modules are firmly seated in the socket, two clamps on either side will close
and secure the module into the socket. Sometimes you may need to close the clamps manually.
To remove the memory module, simply push the clamps outwards until the memory module pops
up. Then simply remove the module.
TIP: When installing memory, a module may require a considerable amount of force to seat
properly, although this is very rare. To avoid bending and damaging your motherboard, place it on
its anti- static bag and onto a flat surface, and then proceed with memory installation.
NOTE
YOU MUST unplug the power connector to the motherboard before performing
system hardware changes, to avoid damaging the board or expansion device.
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Memory Pair Installation
You must install the first two memory modules in DIMM A1 and DIMM B1. Both modules
must be the same in both size and density. Modules must also use the same chip configuration.
Each module that is installed must physically have the same number of memory chips on them.
All memory sockets must be populated by the same memory type, either x4 modules or x8 You
cannot mix and match x4 and x8 modules together.
A few things to remember:
• At least TWO Registered ECC DDR SDRAM modules must be installed for the system
to turn on and POST (Power On Self Test) and DIMM modules must be installed in
pairs.
• When installing modules, install them in this order: A1, B1, A2, B2, etc.
• The Thunder i7501 Xtreme supports up to 12GB of memory with 2GB registered DDR
• 128MB, 256MB, 512MB, 1GB, and 2GB Registered PC2100/PC1600 DDR SDRAM
memory modules are supported in x4 or x8 configuration
• Use ONLY x8 OR x4 type memory modules. Mixing memory types may affect stability.
RAM chips are organized as x4 bits or x8 bits. On a memory module you’re just lining all
these chips up in parallel so you have a 64-bit wide data bus. All 512MB modules are
made using 16 piecesc of either 64Mbit x4, or 32Mbit x8. If you use sixteen x8 chips you
would get a 128- bit data bus, so it has to be split into two separate banks. Each with 64bit bus. That’s why 512MB modules based on x8 chips are dual bank. To build 256MB
modules you can either use sixteen 32Mx4 chips, or eight 32Mx8 chips. But you can’t
build a 256MB module using 64Mx4 chips. To build 1GB modules you have to use
thirty-two 64Mx4 chips. Two 64Mx4 chips are stacked on top of each other with a lead
frame in between. Stacking basically converts two 64Mx4 chips into one 128Mx4 chip or
one 64Mx8 chip. Then you stick 16 stacks onto a PCB. Stacking also saves real estate,
so you can fit more chips onto a shorter PCB and keep trace lengths in spec.
If you are still unsure whether you are using x4 or x8 memory you can research the memory chip
by the SDRAM part numbers, or go to http://www.google.com and search for jedec 21-c 4.20.4.
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2.9 – Installing the Processor(s) and Heatsinks
Your Thunder i7501Xtreme supports the latest processor technologies from Intel. Check the
following page on TYAN’s website for latest processor support: http://www.Tyan.com
The following diagrams will detail how to install your processor(s):
The CPU Voltage Mismatch (LED) – Refer to D11 on page 8 and page 11.
Will light up red if there is a mismatch in CPU voltage. Only identical CPUs can
REMINDER
be used.
When installing only 1 processor, ensure to install it in CPU socket 1.
The processors you choose to use may not look exactly like the one pictured above, nor will the
socket look exactly the same. For example, your processor may appear to be in a different color
and have different markings on it. The diagram is provided as a visual guide to help you install
socket processors.
1. Lift the lever on the socket until it is approximately 130o or as far back as possible
to the socket.
2. Align the processor with the socket. There are keys underneath the processor just like
on memory modules to ensure that they insert the correct way.
3. Seat the processor firmly into the socket by gently pressing down until the processor
sits flush with the socket.
4. Place the socket lever back down until it snaps into place.
5. Your processor is installed.
6. Repeat these steps for the second processor if you are using two processors.
Take care when installing Xeon processors as they have fragile connector pins and can
bend and break if inserted improperly.
Heatsink Installation
After you are done installing the processor(s), you should proceed to installing their heatsinks.
Heatsinks will ensure that the processors do not overheat and continue to operate at maximum
performance for as long as you own them. Overheated processors may damage the motherboard.
Because there are many different types of heatsinks available from many different manufacturers,
a lot of them have their ow n method of installation, and information on choosing the appropriate
heatsink. The i7501Xtreme does support the Intel PWT (Processor Wind Tunnel) heatsinks.
Please refer to Intel’s website:
http://www.intel.com/support/processors/xeon/intnotes.htm#Identifying for specific information on
installation of the PWT old and new versions. The next page contains installation instructions for
the CPU retention brackets included with your i7501Xtreme.
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The following diagrams will illustrate how to install the included heatsink retention modules:
1) Align the heatsink mounting bracket to the holes around the processor socket
2) Insert Black securing peg into bracket holes
3) Insert White locking peg into Black securing peg
4) Repeat process to mount all other brackets
5) Seat heatsink between brackets on processor
6) Attach heatsink clips
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Finishing Installing the Heatsink
After you finish installing the heatsink onto the processor and socket, attach the end wire of the
fan (which should already be attached to the heatsink) to the motherboard. The following diagram
illustrates how to connect fans onto the motherboard.
After you’re finished installing all the fans you can connect your drives (hard drives, CD- ROM
drives, etc.) to your motherboard.
2.10– Attaching Drive Cables
Attaching IDE drive cabling is simple. These cables are “keyed” to only allow them to be
connected in the correct manner. Tyan motherboards have two on-board IDE channels, each
supporting two drives. The black connector designates the Primary channel, while the white
connector designates the Secondary channel.
Attaching IDE cables to the IDE connectors is illustrated below:
Simply plug in the BLUE END of the IDE cable into the motherboard IDE connector, and the other
end(s) into the drive(s). Each standard IDE cable has three connectors, two of which are closer
together. The BLUE connector that is furthest away from the other two is the end that connects to
the motherboard. The other two connectors are used to connect to drives.
TIP: Pin 1 on the IDE cable (usually designated by a colored wire) faces the drive’s power
connector.
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Floppy Drives
Attaching a floppy drive can be done in a similar manner to an IDE drive. See the diagram below
for an example of a floppy cable. Most of the current floppy drives on the market require that the
cable be installed with the colored stripe positioned next to the power connector. In most cases,
there will be a key pin on the cable which will force proper connection of the cable.
The first floppy drive (commonly denoted as
A:) is usually attached to the end of the cable
with the twist in it. Drive B: is usually connected
to the second or third connector in the cable
(the second or third connector after you install
Drive A:).
Refer to your floppy drive’s installation
instructions (if available), or contact your dealer
if you are unsure about how to attach the
floppy drive(s). Remember, you can only have
2 floppy drives connected at any given time.
Below are some symptoms of incorrectly installed floppy drives. While they are minor and
installing them incorrectly doesn’t cause severe problems, it may cause your system to freeze or
crash when trying to read and/or write to diskettes.
Symptoms of incorrectly installed floppy drives
Usually caused by faulty cables, cables put in
backwards, a bad floppy drive or a bad
motherboard. Try another floppy drive to verify
Drive is not automatically detected
the problem if the cable is properly installed or
try replacing the actual cable. Also check to
see if the onboard floppy controller is enabled
in the BIOS setup.
Drive Fail message at bootup
Drive does not power on
The cable, floppy drive or motherboard may be
faulty. Try another drive or cable to verify.
Check power cable and cabling. Maybe a bad
power supply or drive cable problem.
Usually signifies that the cable on the drive is
Drive activity light is constantly on
on backwards, which is a common issue.
Reverse the cable at the floppy drive end and
try again.
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2.11 – Installing Add-In Cards
Before installing add-in cards, it’s helpful to know if they are fully compatible with your
motherboard. For this reason, we’ve provided the diagrams below, showing the most common
slots that may appear on your motherboard. Not all of the slots shown will necessarily appear on
your motherboard, however, there will be combinations of what you see here.
Simply find the appropriate slot for your add- in card and insert the card firmly. Do not force any
add-in cards (or anything else) into any slots if they won’t seat in place. It’s better to try another
slot or return the faulty card rather than damaging both the motherboard and the add -in card.
TIP: It’s good practice to install add-in cards in a staggered manner, rather than directly adjacent
to each other. This allows air to more easily circulate within the chassis, providing improved
cooling for all installed devices.
NOTE
YOU MUST unplug the power connector from the motherboard before performing
system hardware changes to avoid damaging the board or expansion device.
Before Continuing onto section 2.11 – Connecting External Devices, make sure everything is
properly connected. Things like jumpers and case wiring are the most common causes of
troubleshooting frustrations, both for the end-user and for any company doing technical support.
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2.12 – Connecting External Devices
Connecting external devices to the motherboard is an easy task. The standard devices you should
expect to plug into the motherboard are keyboards, mice, and printer cables. The following
diagram will detail the ATX port stack for the following board:
S2726 Thunder i7501 Xtreme
At times, the PS/2 ports for keyboard and mice may be mixed up. Simply remember that the port
that is closest to the motherboard belongs to the keyboard and the one on top belongs to the
mouse.
Besides being used primarily to connect printers, the Printer Port is also used for devices such as
Zip drive, some external CD-RW drives and or other external devices. More on the uncommon
side these days are the Serial Ports. They were primarily used to connect external modems, but
most modems today are using USB or are installed internally.
TIP: While the ports have been created to accept connectors in only one direction. Attaching
connectors in the incorrect orientation can damage, bend and or break the pins.
2.13 – Installing the Power Supply
There are two power connectors on your Thunder i7501Xtreme. By default, the Thunder
i7501Xtreme requires that you have an EPS12V power supply that has a 24- pin and an 8-pin
power connector. Please be aware that ATX 2.x, ATX12V and dual AMDGES (24+8-pin) power
supplies are not compatible with the board nor would they supply enough power.
1. Disconnect power supply from electrical outlet
2. Connect EPS 12V 8 -pin power connector
3. Connect EPS 12V 24 -pin power connector
4. Connect power cable to power supply to power outlet
Make sure you have connected BOTH the 24-pin and 8- pin connectors before attempting to
apply power to the board.
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2.14 – Finishing Up
Congratulations on making it this far! You’re finished setting up the hardware aspect of your
computer. Before closing up your chassis, make sure that all cables and wires are connected
properly, especially IDE cables and most importantly, jumpers. You may have difficulty powering
on your system if the motherboard jumpers are not set correctly.
In the rare circumstance that you have experienced difficulty, you can find help by asking your
vendor for assistance. If they are not available for assistance, please find setup information and
documentation online at our website or by calling your vendor’s support line.
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Chapter 3: BIOS Setup
Installation
The BIOS is the basic input/output system, the firmware on the motherboard that enables your
hardware to interface with your software. This chapter describes different settings for the BIOS
that can be used to configure your system.
The BIOS section of this manual is subject to change without notice and is provided for reference
purposes only. The settings and configurations of the BIOS are current at the time of print, and
therefore may not match exactly what is displayed on screen.
This section describes the BIOS setup program. The setup program lets you modify basic
configuration settings. The settings are then stored in a dedicated, battery-backed memory (called
NVRAM) that retains the information when the power is turned off.
This motherboard’s BIOS is a customized version of the industry-standard BIOS for IBM PC AT-
compatible personal computers. The BIOS provides critical, low-level support for the system’s
central processing unit (CPU), memory, and I/O subsystems.
This BIOS has been customized by adding important features such as virus and password
protection, power management, and chipset “tuning” features that control the system. This section
will guide you through the process of configuring the BIOS for your system setup.
Starting Setup
The BIOS is immediately activated when you turn on the computer. The BIOS reads system
configuration in CMOS RAM and begins the process of checking out the system and configuring it
through the Power-On-Self- Test (POST).
When these preliminary tests are complete, the BIOS searches for an operating system on one of
the system’s data storage devices (hard drive, CD-ROM, etc). If one is found, the BIOS will launch
that operating system and hand control over to it. You can enter the BIOS setup by pressing the
[Delete] key when the machine boots up and begins to show the memory count.
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Setup Basics
The table below shows how to navigate in the setup program using the keyboard.
Key Function
Tab Moves from one selection to
the next
Left/Right Arrow Keys Change from one menu to the
next
Up/Down Arrow Keys More between selections
Enter Opens highlighted section
PgUp/PgDn Keys Change settings.
Getting Help
Pressing [F1] will display a small help window that describes the appropriate keys to use and the
possible selections for the highlighted item. To exit the Help Window, press [ESC] or the [F1] key
again.
In Case of Problems
If you discover that you have trouble booting the computer after making and saving the changes
with the BIOS setup program, you can restart the computer by holding the power button down until
the computer shuts off (usually within 4 seconds); resetting by pressing CTRL-ALT-DEL; or
clearing the CMOS.
The best advice is to only alter settings that you thoroughly understand. In particular, do not
change settings in the Chipset section unless you are absolutely sure of the outcome. Tyan or
your system manufacturer for the best performance and reliability carefully chose the Chipset
defaults. Even a seemingly small change to the Chipset setup options may cause the system to
become unstable or unusable.
Setup Variations
Not all systems will have the same BIOS setup layout or options. While the basic look and function
of the BIOS setup remains more or less the same for most systems, the appearance of your Setup
screen may differ from the charts shown in this section. Each system design and chipset
combination requires a custom configuration. In addition, the final appearance of the Setup
program depends on the system designer. Your system designer may decide that certain items
should not be available for user configuration, and remove them from the BIOS setup program.
NOTE: On the following pages, options written in bold type represent the BIOS Setup default.
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3.1 – Main BIOS Setup
In this screen, you can alter general features such as the date and time, as well as access the IDE
configuration screens. Note that the options listed below are for options that can directly be
changed within the Main Setup screen.
The System Time will always display the current time in a 24- hour
System Time
format. You may adjust the System Time according to your location.
Adjusting the clock in your operating system will also change the
System Time inside BIOS setup.
System Date
System Date displays the current date and can be changed just like
System Time.
Master/Slave Setup
All the options in this section are automatically detected by the motherboard chipset and BIOS.
You do not need to configure this section.
3.2 – Advanced Settings
IDE Configuration
Floppy Configuration
Boot Settings Configuration
Super IO Configuration
All settings discussed in following sections.
Remote Access Configuration
Onboard Device Configuration
USB Configuration
3.3 – IDE Configuration
Options related to the IDE controller can be altered thro ugh the following.
Onboard PCI IDE
Controller
Primary Master/Slave
Secondary Master/Slave
Hard Disk Write Protect
Both
Primary
Secondary
Auto
Disabled
Enabled
Disabled
Leave as Default. This setting toggles the
onboard IDE drive controller on or off.
Leave as Default. This setting toggles the
detection of drives attached to the IDE
controller
Toggles the use of boot sector protection.
This ensures that no viruses can damage the
hard drive.
ATAPI Detect Time Out
ATAPI 80pin Cable
Detect
0, 5, 10, 15, 2.0x,
2.5x, 3.0x, 3.5x
Host & Device
Host
Device
Defines how long the system will try to detect
ATAPI devices for.
Toggles the detection of 80wire IDE cables.
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3.4 – Floppy Configuration
Options related to floppy drives can be altered through the following.
360KB, 5 ¼”
Floppy A
Floppy B
1.2MB, 5 ¼”
720KB, 3 ½”
1.44MB, 3 ½”
2.88MB, 3 ½”
Defines the floppy drive type.
Disabled
3.5 – Boot Settings Configuration
Options related to startup settings can be altered through the following.
Quick Boot
Quiet Boot
Add- On Rom
Display Mode
Boot up Num -Lock
PS/2 Mouse
Support
Typematic Rate
System Keyboard
Enabled
Disabled
Enabled
Disabled
Force BIOS
Keep Current
On
Off
Enabled
Disabled
Fast
Slow
Present
Unavailable
When set to Enabled, some self-tests will be skipped
during POST.
If set to Enabled, OEM logo will be displayed instead
of POST messages.
Leave as Default. This setting toggles the Add-On
ROM video display mode.
Specifies whether Num-Lock will be on or off during
bootup.
Toggles the use of the PS/2 mouse port.
Changes speed of key repeat rate.
Will allow continual boot even if the keyboard is not
attached.
Parity Check
Wait for F1 if “error”
Hit “Del” Message
Enabled
Disabled
Enabled
Disabled
Enabled
Disabled
Toggles checking of system memory for corruption.
If Enabled, you will have to press F1 for the system to
continue booting if an error is detected during POST.
Toggles display of pressing DEL key to enter BIOS.
3.6 – Super IO Configuration
Options related to the IO interface can be altered through the following.
Serial Port 1, 2
Address
Enabled
Disabled
Disabled
Parallel Port Address
3F8, 2F8
3E8, 2E8
Output Only
Bi-directional Two-way protocol
Parallel Port Mode
EPP
ECP
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Toggles use of serial ports 1 and or 2. Enabling
ports also requires you to enter the I/O address
These options are dependent on the IRQ and vice
versa.
Standard one-way protocol for parallel devices.
Enhanced Parallel Port may provide higher
bandwidth if an EPP compliant device is
Enhanced Compatibility Port may provide higher
bandwidth if an ECP compliant device is used).
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3.7 – Onboard Device Configuration
Options related to onboard devices can be altered through the following.
Onboard ATI RageXL
Video
Onboard 82551
Onboard 82546 #1
Onboard 82546 #2
Onboard SCSI
Enabled
Disabled
Enabled
Disabled
Enabled
Disabled
Enabled
Disabled
Enabled
Disabled
Toggles the onboard ATI video graphics.
Toggles 100Mbit LAN port.
Toggles the dual 1Gbit LAN ports.
Toggles the dual 1Gbit LAN ports.
Toggles the onboard SCSI controller.
3.8– USB Configuration
Options related to USB can be altered through the following.
USB Function
Enabled
Disabled
Toggles the onboard USB ports.
Enabled
Legacy USB Support
Disabled
Toggles the use of onboard USB ports in DOS.
Auto
USB Zip Emulation Type
USB Beep Message
Enabled
Disabled
Auto
Enabled
Disabled
Toggles Zip drive emulation on USB ports
when in use.
Toggles USB beep error messaging.
3.9 – PCIPnP
Options related to the Plug and Play PCI settings interface can be altered through the following.
Toggles the option of letting the OS take
care of IRQ routing or the BIOS. Select
Yes to let the OS manage IRQ settings.
Resets BIOS area where IRQ and DMA
settings are stored.
Leave on 64 for best combination of
performance and stability.
Assigns an IRQ to PCI video card.
Palette Snooping can fix color problems
associated with non-standard video cards
Plug & Play OS
Reset Config Data
PCI Latency Timer
Allocate IRQ to PCI VGA
Palette Snooping
Yes
No
Yes
No
32, 64, 96, 128,
160, 192, 224, 248
Yes
No
Enabled
Disabled
such as MPEG decoders.
PCI IDE BusMaster
Offboard PCI/ISA IDE Card
IRQ 3, 4, 5, 7, 9, 10, 11,
14, 15
DMA Channel
0, 1, 3, 5, 6, 7
Enabled
Disabled
Auto
Enabled
Disabled
These settings enable you to set which IRQs will be reserved for
other devices other than the ones that use them by default.
These settings enable DMA channel 0 and 1 to be enabled or
disabled.
Toggles the onboard IDE controllers to
operate in BusMaster mode.
Enables the system to recognize and boot
from an add-in IDE controller card.
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3.10 – Chipset
Options related to the chipset can be altered through the following.
CPU Configuration
North Bridge
ICH3 South Bridge
All settings discussed in following sections.
Intel PCI-64 Hub 2
3.11 – CPU Configuration
Options related to the CPU chipset settings can be altered through the following.
CPU Ratio Status
Unlocked
CPU Ratio Actual Value 20
CPU Ratio CMOS Setting
255
Auto detects CPU
speed. It is
recommended to
leave as default
(255), because
changing CPU
Sets the ratio between CPU
Core Clock and the FSB
Frequency. If an invalid ratio
is set in CMOS then actual and
setpoint values may differ. To
modify, hit backspace and type
new ratio.
ratios may render
your system
inoperable.
This setting allows you to take advantage of Hyper-Threading
enabled Xeon processors. Enabling Hyper -Threading allows a
Hyper-Threading Enable
compatible Xeon processor to process applications that are
written for a multi-processor system even if you are using only
one Xeon processor.
3.12 – ICH3 Chipset Configuration
Please leave all options in this section at their default setting because they are crucial to the
stability of the system.
ICH3 Dev31 Func1, IDE
ICH3 Dev31 Func3, SMBUS
ICH3 Dev29 Func0, USB#1
ICH3 Dev29 Func1, USB#2
ICH3 Dev29 Func2, USB#3
LPC 2Eh-2Fh Decode
[Enabled]
[Disabled]
[Enabled]
[Disabled]
[Enabled]
[Disabled]
[ Enabled]
[Disabled]
[ Enabled]
[Disabled]
[Enabled]
Controls IDE On/Off
Controls SMBUS On/Off
Enables external USB 1
Enables internal USB 2
Enables internal USB 3
[Disabled]
LPC 2Eh-2Fh Decode
[Enabled]
[Disabled]
Super I/O address.
(This is a fixed option)
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IOAPIC
[Enabled]
[Disabled]
IOAPIC
[Enabled]
[Disabled]
(ICH3 Chipset Configuration continued)
DMA-0 Type
DMA-1 Type
DMA-2 Type
DMA-3 Type
DMA-4 Type
DMA-5 Type
DMA-6 Type
DMA-7 Type
[LPC DMA]
[LPC DMA]
[LPC DMA]
[LPC DMA]
[LPC DMA]
[LPC DMA]
[LPC DMA]
[LPC DMA]
3.13 – Intel PCI- 64 Hub 2 Chipset Configuration
Options related to the Intel PCI -64 hub and its settings can be altered through the following.
I/O Port Decode This option allows you to adjust the decode size of the I/O ports.
RAS Sticky Error Handling
IOAPIC Support in MP
Table
This option allows you to define how RAS errors are handled and
whether they are corrected or left as is.
This option allows you to adjust settings for IOAPIC functions that
relate to multi-processor handling.
VGA Decode Please leave this option at its default setting.
3.14 – ACPI
Options related to power management settings can be altered through the following options.
ACPI APIC Support
BIOS à AML ACPI Stable
This option allows you to define whether or not to enable ACPI
management features.
Please leave this option at its default setting. This setting toggles
BIOS control of ACPI power features.
Headless Mode
Enable
After Power Fail
Disable
Previous
Allows system to reboot after a power failure.
State
Power button instant off
Watchdog Timer
WOL S1 & S5
ACPI APIC Support
Enabled
Disabled
Enable
Disable
Enabled
Disabled
Choose between instant on/off or a 4 second delay.
Do not enable unless you are familiar with this
feature
Enables Wake On Lan support. (Only on 82551
NIC.)
This option allows you to define whether or not to enable ACPI
management features.
3.15 – ACPI Advanced
Options related to advanced power management settings interface can be altered through the
following options.
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ACPI APIC Support
This option allows you to define whether or not to enable ACPI
management features.
BIOS à AML ACPI Stable
Please leave this option at its default setting. This setting toggles
BIOS control of ACPI power features.
3.16 – Boot
Options related to boot devices can be altered through the following.
Boot Device Priority
Hard Disk Drives
Removable Devices
ATAPI CDROM Drives
1st Boot Device
2nd Boot Device
3rd Boot Device
Settings for boot priority. These can be
customized depending on your
preference.
Specifies the boot sequence for hard drive booting. This option
will show all storage devices.
Specifies the boot sequence for removable drive booting. This
option will show all removable devices.
Specifies the boot sequence for CD- ROM drive booting. This
option will show all CD-ROM devices.
This option allows removabl e devices to act as non-removable
Interrupt 19 Capture
devices. Some SCSI RAID cards will need this one enabled.
Please refer to your SCSI card’s manual.
3.17 – Security
Options related system security can be altered through the following.
Change Supervisor
Password
Changes system password.
Change User Password Changes boot password.
Clear User Password Clears boot password.
Boot Sector Virus
Protection
Enabled
Disabled
Toggles protection of boot sector on the hard drive
from being modified.
3.18 – Exit
Options related exiting and saving can be done using the following.
Exit Saving Changes Exit and save options.
Exist Discarding Changes Exit but don’t save options.
Load Setup Defaults Load the BIOS setup default settings.
Discard Changes Discard any changes made.
S ave Changes Save changes.
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Chapter 4: Diagnostics
4.1 – Hardware Monitor Information
ICH3 SMBus base address = EC80h
Winbond83782D hardware Monitor Information
Hardware Monitor Chip 1: Winbond83782D
Slave Address: 0x29h
Chip Clock: 14.318MHz
Sensor Name Bank Register Other
CPU1 Fan 0 0x28h controlled by PWM1
CPU2 Fan 0 0x29h controlled by PWM3
Chassis Fan 3 0 0x2Ah controlled by PWM4
System Volt 3.3V 0 0x22h
System Volt 5V 0 0x23h
System Volt 12V 0 0x24h R1 = 28K, R2 = 10K
Battery Voltage 5 0x51h
System(VRM) temp 0 0x27h 2N3904 diode
CPU1 533FSB temp 1 0x50h PII compatible diode
CPU2 533FSB temp 2 0x50h PII compatible diode
W83627HF Super IO hardware Monitor Information
Hardware Monitor Chip 2: WinbondW83627HF (Super IO)
Slave Address: 0x2ah
Chip Clock: 48.000MHz
Sensor Name Bank Register
Chassis Fan 4 0 0x28h
Chassis Fan 5 0 0x29h
Chassis Fan 6 0 0x2Ah
On chip Xeon Thermal Sensor for 400Mhz FSB Xeon
Hardware Monitor Chip 3: Intel Xeon Thermal Sensor
Slave Address: 0x18h
Sensor Name Bank Register
CPU1 temperature 0 0x01h
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On chip Xeon Thermal Sensor for 400Mhz FSB Xeon
Hardware Monitor Chip 4: Intel Xeon Thermal Sensor
Slave Address: 0x19h
Sensor Name Bank Register
CPU2 temperature 0 0x01h
Programming CPU thermal sensors for custom Hardware Monitoring
requirements (the GPIO pins are on ICH3)
GPIO27 GPIO28 CHANNEL# DEVICES
X X X Winbond 83782D (Always on)
1 1 3 DIMM SPD (6 devices), and CK408B clock chip
0 1 2 CPU1 and CPU2 Thermal sensor, Super IO
W83627HF
1 0 1 Reserved
0 0 0 Reserved
Note: if you experience problems with setting up your system, always check the following things in
the following order:
Memory, Video, CPU
By checking these items, you will most likely find out what the problem might have been when
setting up your system. For more information on troubleshooting, check the Tyan website at:
http://www.tyan.com.
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4.2 Beep Codes
Number of Beeps
Description
Number of Beeps
Trouble shooting action
Fatal errors, which halt the boot process, are communicated through a series of audible beeps.
For example, if the BIOS POST can initialize the video but an error occurs, an error message will
be displayed. If it cannot display the message, it will report the error as a series of beeps.
Beep codes that are used by AMIBIOS:
1 Memory refresh timer error
2 Parity error
3 Main memory read / write test error
4 Motherboard timer not operational
5 Processor error
6 Keyboard controller BAT test error
7 General exception error
8 Display memory error
9 ROM checksum error
10 CMOS shutdown register read/write error
11 Cache memory bad
Troubleshooting BIOS Beep Codes
1, 2 or 3 Reseat the memory, or replace with known good modules.
Make sure they are Registered ECC.
4-7, 9- 11 Fatal error indicating a serious problem with the system.
Consult your system manufacturer. Before declaring the
motherboard beyond all hope, eliminate the possibility of
interference by a malfunctioning add-in card. Remove all
expansion cards except the video adapter.
• If the beep codes are generated even when all other
expansion cards are absent, the motherboard has a serious
problem. Consult your system manufacturer.
• If the beep codes are not generated when all other expansion
cards are absent, one of the add-in cards is causing the
malfunction. Insert the cards back into the system one at a time
until the problem happens again. This will reveal the
malfunctioning add- in card.
8 If the system video adapter is an add-in card, replace or reseat
the video adapter. If the video adapter is an integrated part of
the system board, the board may be faulty.
Tyan Reference for troubleshooting:
6 B eeps = No memory inserted.
7 Beeps = Non Reg/ECC DIMMs inserted.
9 Beeps = Only one DIMM inserted.
Before contacting your vendor or Tyan Technical Support, be sure that you note as much as you
can about the beep code length and order that you experience. Also, be ready with information
regarding add-in cards, drives and O/S to speed the support process and come to a quicker
solution.
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4.3 Flash Utility
Every BIOS file is unique for the motherboard it was designed for. For Flash Utilities, BIOS
downloads, and information on how to properly use the Flash Utility with your motherboard, please
check the Tyan web site: http://www.tyan.com/
The suggested method to update your BIOS is:
1. Download the latest BIOS from Tyan’s website at:
http://www.tyan.com/support/html/bios_support.html#Socket604
2. Copy the .rom file to a bootable floppy disk.
3. Copy the Amiflash.exe program to the floppy disk. You can find the latest approved
version on our website: http://www.tyan.com/support/html/flash_utilities.html
4. Boot to the floppy disk and flash the bios.
The correct way to flash the BI OS on this board is as follows:
AMIFLASH 2726v100.rom /a /b /c
Where 2726v100.rom is the bios version you downloaded from our website ( this is an example).
The space between the characters /a /b /c are very important. If you leave out the spaces only the
first parameter will be used.
Please note that you must use ALL the parameters to successfully update the BIOS!
For your reference:
/a = auto reboot after flash
/b= Program boot block
/c= Clear the CMOS
Please be aware that by flashing your BIOS, you agree that in the event of a BIOS
NOTE
flash failure, you must contact your dealer for a replacement BIOS. There are no
exceptions. Tyan does not have a policy for replacing BIOS chips directly with end
users. In no event will Tyan be held responsible for damages done by the end user.
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Appendix I: Onboard LAN LED Color Definition
LAN2, 3, 4 & 5 10/100/1000 Mbps, Intel 82546(x2), RJ45 Connectors =J35+J65 (stacked)
Network link not established Off Off
Linked at 10 Mbps (10 BaseT)
Activity at 10 Mbps
Linked at 100 Mbps (100 BaseTX)
Activity at 100 Mbps
Linked at 1000 Mbps (1000 BaseT)
Activity at 1000 Mbps
Left LED Right LED
Off
Off
Yellow
Blink Yellow
Yellow
Blink Yellow
Green
Blink Green
Green
Blink Green
LAN1 Port, 10/100 Mbps, Intel 82551, RJ-45 Connector = J54.
Network link not established Off Off
Linked at 10 Mbps (10 BaseT)
Activity at 10 Mbps
Linked at 100 Mbps (100 BaseTX)
Activity at 100 Mbps
Left LED Right LED
Off
Off
Yellow
Blink Yellow
Green
Blink Green
Off
Off
Off
Off
NOTE: Bottom LANs are inverted.
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Appendix II: Glossary
ACPI (Advanced Configuration and Power Interface): a power management specification that
allows the operating system to control the amount of power distributed to the computer’s devices.
Devices not in use can be turned off, reducing unnecessary power expenditure.
AGP (Accelerated Graphics Port): a PCI -based interface which was designed specifically for
demands of 3D graphics applications. The 32-bit AGP channel directly links the graphics controller
to the main memory. While the channel runs at only 66 MHz, it supports data transmission during
both the rising and falling ends of the clock cycle, yielding an effective speed of 133 MHz.
ATAPI (AT Attachment Packet Interface): also known as IDE or ATA; a drive implementation
that includes the disk controller on the device itself. It allows CD- ROMs and tape drives to be
configured as master or slave devices, just like HDDs.
ATX: the form factor designed to replace the AT form factor. It improves on the AT design by
rotating the board 90 degrees, so that the IDE connectors are closer to the drive bays, and the
CPU is closer to the power supply and cooling fan. The keyboard, mouse, USB, serial, and
parallel ports are built-in.
Bandwidth: refers to carrying capacity. The greater the bandwidth, the more data the bus, phone
line, or other electrical path, can carry. Greater bandwidth, then, also results in greater speed.
BBS (BIOS Boot Specification): is a feature within the BIOS that creates, prioritizes, and
maintains a list of all Initial Program Load (IPL) devices, and then stores that list in NVRAM. IPL
devices have the ability to load and execute an OS, as well as provide the ability to return to the
BIOS if the OS load process fails for some reason. At that point, the next IPL device is called upon
to attempt loading of the OS.
BIOS (Basic Input/Output System): the program that resides in the ROM chip, and provides the
basic instructions for controlling your com puter’s hardware. Both the operating system and
application software use BIOS routines to ensure compatibility.
Buffer: a portion of RAM which is used to temporarily store data, usually from an application,
though it is also used when printing, and in most keyboard drivers. The CPU can manipulate data
in a buffer before copying it, all at once, to a disk drive. While this improves system performance --
- reading to or writing from a disk drive a single time is much faster than doing so repeatedly --there is also the possibility of losing your data should the system crash. Information stored in a
buffer is temporarily stored, not permanently saved.
Bus: a data pathway. The term is used especially to refer to the connection between the
processor and system memory, and between the processor and PCI or ISA local buses.
Bus mastering: allows peripheral devices and IDEs to access the system memory without going
through the CPU (similar to DMA channels).
Cache: a temporary storage area for data that will be needed often by an application. Using a
cache lowers data access times, since the needed information is stored in the SRAM instead of in
the slow DRAM. Note that the cache is also much smaller than your regular memory: a typical
cache size is 512KB, while you may have as much as 4GB of regular memory.
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Cache size : refers to the physical size of the cache onboard. This should not be confused with
the cacheable area, which is the total amount of memory which can be scanned by the system in
search of data to put into the cache. A typical setup would be a cache size of 512KB, and a
cacheable area of 512MB. In this case, up to 512KB of the main memory onboard is capable of
being cached. However, only 512KB of this memory will be in the cache at any given moment.
Any main memory above 512MB could never be cached.
Closed and open jumpers: jumpers and jumper pins are active when they are “on” or “closed”,
and inactive when they are “off” or “open”.
CMOS (Complementary Metal-Oxide Semiconductors): chips that hold the basic startup
information for the BIOS.
COM port: another name for the serial port, which is called as such because it transmits the eight
bits of a byte of data along one wire, and receives data on another single wire (that is, the data is
transmitted in serial form, one bit after another). Parallel ports transmit the bits of a byte on eight
different wires at the same time (that is, in parallel form, eight bits at the same time).
DDR (Double Data Rate): is a technology designed to double the clock speed of the memory. It
activates output on both the rising and falling edge of the system clock rather than on just the
rising edge, potentially doubling output.
DIMM (Dual In-line Memory Module): faster and more capacious form of RAM than SIMMs, and
do not need to be installed in pairs.
DIMM bank: sometimes called DIMM sockets, because the physical slot and the logical unit are
the same. That is, one DIMM module fits into one DIMM socket, which is capable of acting as a
memory bank.
DMA (Direct Memory Access): channels that are similar to IRQs. DMA channels allow hardware
devices (like soundcards or keyboards) to access the main memory without involving the CPU.
This frees up CPU resources for other tasks. As with IRQs, it is vital that you do not double up
devices on a single line. Plug-n-Play devices will take care of this for you.
Doze mode: in this mode, only the CPU’s speed is slowed.
DRAM (Dynamic RAM): widely available, very affordable form of RAM which has the unfortunate
tendency to lose data if it is not recharged regularly (every few milliseconds). This refresh
requirement makes DRAM three to ten times slower than non-recharged RAM such as SRAM.
ECC (Error Correction Code or Error Checking and Correcting): allows data to be checked for
errors during run- time. Errors can subsequently be corrected at the same time that they’re found.
EEPROM (Electrically Erasable Programmable ROM): also called Flash BIOS, is a ROM chip
which can, unlike normal ROM, be updated. This allows you to keep up with changes in the BIOS
programs without having to buy a new chip. TYAN’s BIOS updates can be found at
http://www.TYAN.com
EMRL: Embedded RAID Logic. An Adaptec specific RAID technology.
ESCD (Extended System Configuration Data): a format for storing information about Plug-n-
Play devices in the system BIOS. This information helps properly configure the system each time
it boots.
Fault -tolerance: a term describing a system where one component can quickly be replaced
without causing a loss of service, such as in a RA ID system.
Firmware: low-level software that controls the system hardware.
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Form factor: an industry term for the size, shape, power supply type, and external connector type
of the Personal Computer Board (PCB) or motherboard. The standard form factors are the AT and
ATX, although TYAN also makes some Baby-AT and ATX Footprint boards.
Global timer: onboard hardware timer, such as the Real -Time Clock (RTC).
Handshaking: a form of encryption. One system, typically the server, sends an encryption
scheme to another agent, typically a client. Thus, the client’s data is protected during transmittal to
the server.
HDD: stands for Hard Disk Drive, a type of fixed drive.
H-SYNC: controls the horizontal synchronization/properties of the monitor.
IC (Integrated Circuit): the formal name for the computer chip.
IDE (Integrated Device/Drive Electronics): a simple, self-contained HDD interface. It can handle
drives up to 8.4 GB in size. Almost all IDEs sold now are in fact Enhanced IDEs (EIDEs), with
maximum capacity determined by the hardware controller.
IDE INT (IDE Interrupt): a hardware interrupt signal that goes to the IDE.
I/O (Input/Output): the connection between your computer and another piece of hardware
(mouse, keyboard, etc.)
Initial Program Load (IPL): a feature built into BBS-compliant devices, describing those devices
as capable of loading and executing an OS, as well as being able to provide control back to the
BIOS if the loading attempt fails.
IPL: see Initial Program Load.
IRQ (Interrupt Request): an electronic request that runs from a hardware device to the CPU. The
interrupt controller assigns priorities to incoming requests and delivers them to the CPU. It is
important that there is only one device hooked up to each IRQ line; doubling up devices on IRQ
lines can lock up your system. Plug-n-Play operating systems can take care of these details for
you.
ISA (Industry Standard Architecture): a slower 8- or 16-bit bus (data pathway).
Latency: the amount of time that one part of a system spends wai ting for another part to catch up.
This is most common when the system sends data out to a peripheral device, and it waiting for the
peripheral to send some data back (peripherals tend to be slower than onboard system
components).
Mirroring: see RAID.
NVRAM: ROM and EEPROM are both examples of Non -Volatile RAM, memory that holds its data
without power. DRAM, in contrast, is volatile.
OEMs (Original Equipment Manufacturers): Compaq or IBM package other companies’
motherboards and hardware inside their case and sell them.
Parallel port: transmits the bits of a byte on eight different wires at the same time (that is, in
parallel form, eight bits at the same time).
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PCI (Peripheral Component Interconnect): a 32 or 64-bit local bus (data pathway) which is
faster than the ISA bus. Local buses are those which operate within a single system (as opposed
to a network bus, which connects multiple systems).
PCI PIO (PCI Programmable Input/Output) modes: the data transfer modes used by IDE drives.
These modes use the CPU for data transfer (in contrast, DMA channels do not). PCI refers to the
type of bus used by these modes to communicate with the CPU.
PCI-to-PCI bridge: allows you to connect multiple PCI devices onto one PCI slot.
Pipeline burst SRAM: a fast secondary cache. It is used as a secondary cache because SRAM
is slower than SDRAM, but usually larger. Data is cached first to the faster primary cache, and
then, when the primary cache is full, to the slower secondary cache.
Pipelining: improves system performa nce by allowing the CPU to begin executing a second
instruction before the first is completed. A pipeline can be likened to an assembly line, with a given
part of the pipeline repeatedly executing a set part of an operation on a series of instructions.
PM timers (Power Management timers): software timers that count down the number of
seconds or minutes until the system times out and enters sleep, suspend, or doze mode.
PnP (Plug-n-Play): a design standard that has become ascendant in the industry. Plug- n-Play
devices require little set- up to use. Novice end users can simply plug them into a computer that is
running on a Plug-n-Play aware operating system (such as Windows 98), and go to work. Devices
and operating systems that are not Plug-n-Play require you to reconfigure your system each time
you add or change any part of your hardware.
PXE (Preboot Execution Environment): one of four components that together make up the
Wired for Management 2.0 baseline specification. PXE was designed to define a standard set of
preboot protocol services within a client, towards the goal of allowing networked-based booting to
boot using industry standard protocols.
RAID (Redundant Array of Independent Disks): a way for the same data to be stored in
different places on ma ny hard drives. By using this method, the data is stored redundantly, also
the multiple hard drives will appear as a single drive to the operating system. RAID level 0 is
known as striping, where data is striped (or overlapped) across multiple hard drives, but offers no
fault-tolerance. RAID level 1 is known as mirroring, which stores the data within at least two hard
drives, but does not stripe. RAID level 1 also allows for faster access time and fault- tolerance,
since either hard drive can be read at the same time. RAID level 0+1 is both striping and
mirroring, providing fault-tolerance, striping, and faster access all at the same time.
RAIDIOS: RAID I/O Steering (Intel)
RAM (Random Access Memory): technically refers to a type of memory where any byte can be
accessed without touching the adjacent data, is often used to refer to the system’s main memory.
This memory is available to any program running on the computer.
ROM (Read-Only Memory): a storage chip which contains the BIOS; the basic instructions
required to boot the computer and start up the operating system.
SDRAM (Synchronous Dynamic RAM): called as such because it can keep two sets of memory
addresses open simultaneously. By transferring data alternately from one set of addresses and
then the other, SDRAM cuts down on the delays associated with non-synchronous RAM, which
must close one address bank before opening the next.
Serial port: called as such because it transmits the eight bits of a byte of data along one wire, and
receives data on another single wire (that is, the data is transmitted in serial form, one bit after
another).
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SCSI Interrupt Steering Logic (SISL): Architecture that allows a RAID controller, such as
AcceleRAID 150, 200 or 250, to implement RAID on a system board- embedded SCSI bus or a set
of SCSI busses. SISL: SCSI Interrupt Steering Logic ( LSI ) (only on LSI SCSI boards)
SIMM (Single In -line Memory Module): formally the most common form of RAM for
motherboards. They must be installed in pairs, and do not have the carrying capacity or the speed
of DIMM modules.
Sleep/Suspend mode: in this mode, all devices except the CPU shut down.
SDRAM (Static RAM): unlike DRAM, this type of RAM does not need to be refreshed in order to
prevent data loss. Thus, it is faster and more expensive.
Standby mode: in this mode, the video and hard drives shut down; all other devices continue to
operate normally.
Striping: see RAID
UltraDMA- 33/66/100: a fast version of the old DMA channel. UltraDMA is also called UltraATA.
Without proper UltraDMA controller, your system cannot take advantage of higher data transfer
rates of the new UltraDMA/UltraATA hard drives.
USB (Universal Serial Bus): a versatile port. This one port type can function as a serial, parallel,
mouse, keyboard or joystick port. It is fast enough to support video transfer, and is capable of
supporting up to 127 daisy -chained peripheral devices.
VGA (Video Graphics Array): the PC video display standard
V- SYNC: controls the vertical scanning properties of the monitor.
Wake O n LAN (WOL): A remote wake- up technology that enables you to remotely power
systems "on" for off -hours maintenance. A result of the Intel-IBM Advanced Manageability Alliance
and part of the Wired for Management Baseline Specification, this technology helps save time on
automated software installations, upgrades, disk backups and virus scans. Equally important, it
increases end- user productivity by moving such planned disruptions to off-hours.
Watch Dogtimer (WDT): A device that performs a specific operation after a certain period of time
if something goes wrong with an electronic system and the system doesn't recover on its own.
The WDT contains a digital counter that counts down to zero at a constant speed from a preset
number. The counter speed is kept constant by a clock circuit. If the counter reaches zero before
the computer recovers, a signal is sent to designated circuits to perform the desired action, e.g.
reset the system. A normally functioning system must re- load the WDT occasionally, to prevent
the counter from reaching zero.
ZCR: Zero Channel RAID. PCI card that allows a RAID card to use the onboard SCSI chip, thus
lowering cost of RAID solution
ZIF Socket (Zero Insertion Force socket): these sockets make it possible to insert CPUs without
damaging the sensitive CPU pins. The CPU is lightly placed in an open ZIF socket, and a lever is
pulled down. This shift the processor over and down, guiding into the board and locking it into
place.
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Appendix III : SMDC Information
Tyan Server Management Daughter Card (SMDC) is a powerful yet cost-efficient solution for
high-end server management hardware packages. Tyan’s goal is to provide remote system
monitoring and control even when the operating system is absence or simply fails. This
empowers Tyan’s server board with advanced industrial-standard features.
Tyan SMDC is a snap -in card that provides essential server management solution. It enables
any IT Manager by providing multi-interfaces to access the hardware remotely and perform
monitor, control and diagnose activities effectively.
Tyan SMDC is powered by an intelligent controller known as Baseboard Management Control
(BMC). BMC is a standalone mini-CPU and runs on its own Real Time Operating System
(RTOS) to complete all different kinds of tasks. Backed by QLogic’s ARM7 technology, IT
manager can rest assure his server machines are always taken care.
Tyan SMDC is not a peripheral card. Unlike regular peripheral card such as AGP card,
Network card or SCSI card, SMDC does not require any hardware specific driver. As long as
a standby power comes into the system, SMDC will begin looking after the system.
Tyan SMDC provides diversified methods to communicate with the hardware. IT manager has
the flexibility to choose among Keyboard Controll er Style (KCS), Block Transfer (BT) style,
Intelligent Chassis Management Bus (ICMB), Intelligent Platform Management Bus (IPMB),
Emergency Management Port (EMP) and standard IPMI-Over-LAN communication as defined
in latest IPMI 1.5 specification.
Tyan SMDC is compatible with all IPMI -compliance software as well as Tyan System
Operator™ (TSO) software package.
By adding SMDC, Tyan’s server board becomes a highly manageable and IPMI compatible
system with all the advanced features suggesting in IPMI Spec.
More detailed information on Tyan’s SMDC card can be found on our website:
Http://www.Tyan.com
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Appendix IV: Riser Cards
Please check with your distributor for these riser cards or check http://www.etyan.com to purchase
the desired card(s).
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J22 Speaker header
Appendix V: Pinouts of onboard jumpers/headers
Pinouts for the following jumpers/headers are listed: j22, j34, j42, j50, j51, j53, j55, j58
J22……………… Onboard 4 pin speaker header
Pin 1 = VCC*
Pin 2 = No Connect
Pin3 = No Connect
Pin4 = SPK
* pin one is identified on the
motherboard and also on page 8
J34…………………Serial port header (com2)
Signal DB9 PIN#(j33) 10 PIN header(j34)
DCD 1 1**
RX 2 3
TX 3 5
DTR 4 7
GND 5 9
DSR 6 2
RTS 7 4
CTS 8 6
RI 9 8
NC/KEY NC/KEY 10
** pin one is identified on the motherboard and also on page 8
J34 header as appears on
motherboard
J53, j58, J67 & J68...….Intel 82546 4 pin external activity
J55……………………....Intel 82551 4 pin external activity
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NIC four pin Header ‘Pin Out’ j53, J55, J58, J67 & J68
J50 & j51 (labeled onboard as USB3 & USB4)
Pin 1 = VCC ****
Pin 1 = Link <> Yellow + ***
Pin 2 = Link <> Yellow Pin3 = Speed <> Green +
Pin4 = Speed <> Green -
*** pin one is identified on the motherboard and
also on page 8
J50 & J51……………..Internal USB headers
Pin 2 = USBD(2&3)RPin3 = USBD(2&3) R+
Pin4 = Gnd
Pin5 = Gnd
**** pin one is identified on the motherboard
and also on page 8.
J42 ……………………SMDC ( Server Management daughter card)
Odd pin Signal Even Pin Signal
1***** LAD0 2 LAD1
3 LAD2 4 LAD3
5 GND1 6 LFRAME#
7 GND2 8 PCI_CLK
9 GND3 10 PCIRST#
11 GND4 12 I2C1CLK
13 I2C1DA 14 GND5
15 IC24CLK 16 I2C4DA
17 GND6 18 I2C3CLK
19 I2C3DA 20 5VSB1
21 I2C2CLK 22 I2C2DA
23 5VSB2 24 GND7
25 PWRBTN# 26 PCIPME#
27 RSTBTN# 28 SVM_IRQ#
29 SLPBTN# 30 SVM_WOL#
31 EXTSMI# 32 SVM_THERM#
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33 CPUNMI 34 GND8
35 GPIO1 36 GPIO2
37 GND9 38 GPIO4
39 GPIO5/KEY 40 PS_PWRGD
41 GND10 42 RSVD2
43 RSVD3 44 GND11
45 RSVD5 46 BMC_RST#
47 GND12 48 SMALERTA#
49 SMALERTB# 50 GND13
***** pin one is identified on the motherboard and also on page 8
Technical Support
If a problem arises with your system, you should turn to your dealer for help first. Your system has
most likely been configured by them, and they should have the best idea of what hardware and
software your system contains. Hence, they should be of the most assistance. Furthermore, if you
purchased your system from a dealer near you, you can actually bring your system to them to
have it serviced, instead of attempting to do so yourself (which can have expensive
consequences).
Help Resources:
1. See the beep codes section of this manual.
2. See the TYAN website for FAQ’s, bulletins, driver updates, and
other information: http://www.TYAN.com
3. Contact your dealer for help BEFORE calling TYAN.
4. Check the TYAN user group: alt.comp.periphs.mainboard.TYAN
Returning Merchandise for Servic e
During the warranty period, contact your distributor or system vendor FIRST for any product
problems. This warranty only covers normal customer use and does not cover damages incurred
during shipping or failure due to the alteration, misuse, abuse, or i mproper maintenance of
products.
NOTE: A receipt or copy of your invoice marked with the date of purchase is required
before any warranty service can be rendered. You may obtain service by calling the
manufacturer for a Return Merchandise Authorization (RMA) number. The RMA number
should be prominently displayed on the outside of the shipping carton and the package
should be mailed prepaid. TYAN will pay to have the board shipped back to you.
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Notice for the USA
Compliance Information Statement (Declaration of Conformity Procedure) DoC
FCC Part 15: This device complies with part 15 of the FCC Rules
Operation is subject to the following conditions:
1) This device may not cause harmful interference, and
2) This device must accept any interference received including interference that may
cause undesired operation. If this equipment does cause harmful interference to radio
or television reception, which can be determined by turning the equipment off and on,
the user is encouraged to try one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Plug the equipment into an outlet on a circuit different from that of the
receiver.
• Consult the dealer on an experienced radio/television technician for help.
Notice for Canada
This apparatus complies with the Class B limits for radio interference as specified in the Canadian
Department of Communications Radio Interference Regulations. (Cet appareil est conforme aux
norms de Classe B d’interference radio tel que specifie par le Ministere Canadien des
Communications dans les reglements d’ineteference radio.)
Notice for Europe (CE Mark)
This product is in conformity with the Council Directive 89/336/EEC,
CAUTION: Lithium battery included with this board. Do not puncture, mutilate, or dispose of
battery in fire. Danger of explosion if battery is incorrectly replaced. Replace only with the same or
equivalent type recommended by manufacturer. Dispose of used battery according to
manufacturer instructions and in accordance with your local regulations.
92/31/EEC (EMC).
Document #: D1518 - 101
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