TYAN TA77-B7061 Service Engineer's Manual

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TA77-B7061

Service Engineer’s Manual

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PREFACE

Copyright

This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.

Copyright 2013 MiTAC International Corporation. All rights reserved.

TYAN® is a registered trademark of MiTAC International Corporation.

Version 1.0

Disclaimer

Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to
printing. MiTAC assumes no liability whatsoever, and disclaims any

express or implied warranty, relating to sale and/or use of TYAN® products
including liability or warranties relating to fitness for a particular purpose or
merchantability. MiTAC retains the right to make changes to produce
descriptions and/or specifications at any time, without notice. In no event
will MiTAC be held liable for any direct or indirect, incidental or
consequential damage, loss of use, loss of data or other malady resulting
from errors or inaccuracies of information contained in this document.

Trademark Recognition

All registered and unregistered trademarks and company names
contained in this manual are property of their respective owners including,
but not limited to the following.

TYAN® is a trademark of MiTAC International Corporation.
Intel

®

is a trademark of Intel® Corporation.

AMI

®

, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
IBM

®

, PC®, AT® and PS/2® are trademarks of IBM Corporation.
Winbond

®

is a trademark of Winbond Electronics Corporation.

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FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject
to the following conditions:

 This device must not cause harmful interference.
 This device must accept any interference received, including

interference that may cause undesirable operation.

This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is
likely to cause harmful interference in which case the user will be
required to correct the interference at his own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norme NMB-003
du Canada.

Notice for Europe (CE Mark)

This product is in conformity with the Council
Directive 2004/108/EC.

CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according
to manufacturer instructions and in accordance with your local
regulations.

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About this Manual

This manual provides you with instructions on installing your TYAN
TA77-B7061. This Manual is intended for experienced users and
integrators with hardware knowledge of personal computers.

This manual consists of the following parts:

Chapter 1:

Provides an introduction to the TYAN TA77-B7061
barebones, standard parts list, describes the external
components, gives a table of key components, and provides
block diagram of the system.

Chapter 2:

Covers procedures on installing the CPU, memory modules
and hard drives.

Chapter 3:

Covers removal and replacement procedures for
pre-installed components.

Chapter 4:

Covers procedures on installing the GPU cards.

Appendix:

List the Fan and Temp Sensors, Cable Connection Table
and FRU Parts List for reference of system setup, and
technical support in case a problem arises with your system.

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Safety and Compliance Information

Before installing and using TYAN TA77-B7061, take note of the following
precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.

·Do not block the slots and opening on the unit, which are provided for

ventilation.

·Only use the power source indicated on the marking label. If you are not

sure, contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third

pin to ground the unit and prevent electric shock. Do not defeat the
purpose of this pin. If your outlet does not support this kind of plug,
contact your electrician to replace your obsolete outlet.

·Do not place anything on the power cord. Place the power cord where it

will not be in the way of foot traffic.

·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high

voltage components and result in shock and damage to the
components.

· When replacing parts, ensure that you use parts specified by the

manufacturer.

·When service or repairs have been done, perform routine safety checks

to verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating

device.

·Cover the unit when not in use.

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Safety Information

Retain and follow all product safety and operating instructions
provided with your equipment. In the event of a conflict between the
instructions in this guide and the instructions in equipment
documentation, follow the guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions.
To reduce the risk of bodily injury, electric shock, fire and damage to
the equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide
before you install, operate, or service TYAN products.

Symbols on Equipment

Caution. This symbol indicates a potential

hazard. The potential for injury exists if
cautions are not observed. Consult equipment
documentation for specific details.

Warning. This symbol indicates the presence
of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified
personnel.

Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.

To reduce risk of injury from a hot component,
allow the surface to cool before touching.

General Precautions

· Follow all caution and warning instructions marked on the equipment
and explained in the accompanying equipment documentation.



Machine Room Environment

 · Make sure that the area in which you install the system is properly

ventilated and climate-controlled.

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· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.

· Do not install the system in or near a plenum, air duct, radiator, or heat
register.

· Never use the product in a wet location.

Equipment Chassis

· Do not block or cover the openings to the system.

· Never push objects of any kind through openings in the equipment.

Dangerous voltages might be present.

· Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.

· Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

· Observe local occupational health and safety requirements and
guidelines for manual materials handling.

· Do not attempt to move a rack by yourself; a minimum of two people
are needed to move a rack.

· Do not attempt to move a fully loaded rack. Remove equipment from
the rack before moving it.

· Do not attempt to move a rack on an incline that is greater than 10
degrees from the horizontal.

· Make sure the rack is properly secured to the floor or ceiling.

· Make sure the stabilizing feet are attached to the rack if it is a

single-rack installation.

· Make sure racks are coupled together if it is a multiple-rack installation.

· Make sure the rack is level and stable before installing an appliance in

the rack.

· Make sure the leveling jacks are extended to the floor.

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· Make sure the full weight of the rack rests on the leveling jacks.

· Always load the rack from the bottom up. Load the heaviest component

in the rack first.

· Make sure the rack is level and stable before pulling a component out
of the rack.

· Make sure only one component is extended at a time. A rack might
become unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and cable
management.

· Ensure that there is adequate airflow in the rack. Improper installation
or restricted airflow can damage the equipment.

· The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to
ensure adequate air flow to the system.

· If you install the Model in a rack, do not place equipment on top of the
unit. It will cause restricted airflow and might cause damage to the
equipment.

·

Make sure the product is properly matted with the rails. Products that

are improperly matted with the rails might be unstable.

·

Verify that the AC power supply branch circuit that provides power to

the rack is not overloaded. This will reduce the risk of personal injury, fire,
or damage to the equipment. The total rack load should not exceed 80
percent of the branch circuit rating. Consult the electrical authority having
jurisdiction over your facility wiring and installation requirements.

Equipment Power Cords

· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.

· Plug the power cord into a grounded (earthed) electrical outlet that is
easily accessible at all times.

· In all European electrical environments, you must ground the
Green/Yellow tab on the power cord. If you do not ground the

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Green/Yellow tab, it can cause an electrical shock due to high leakage
currents.

· Do not place objects on AC power cords or cables. Arrange them so

that no one might accidentally step on or trip over them.

· Do not pull on a cord or cable. When unplugging from the electrical
outlet, grasp the cord by the plug.

· To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.

Equipment Batteries

· The system battery contains lithium manganese dioxide. If the battery
pack is not handled properly, there is risk of fire and burns.

· Do not disassemble, crush, puncture, short external contacts, or
dispose of the battery in fire or water.

· Do not expose the battery to temperatures higher than 60°C (140°F).

· The system battery is not replaceable. If the battery is replaced by an

incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.

· Do not attempt to recharge the battery.

· Dispose of used batteries according to the instructions of the

manufacturer. Do not dispose of batteries with the general household
waste. To forward them to recycling or proper disposal, use the public
collection system or return them to TYAN, your authorized TYAN partner,
or their agents.

Equipment Modifications

· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has
been modified.

Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service
of this product should be performed by individuals who are knowledgeable
about the procedures, precautions, and hazards associated with

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equipment containing hazardous energy levels.

· Do not exceed the level of repair specified in the procedures in the
product documentation. Improper repairs can create a safety hazard.

· Allow the product to cool before removing covers and touching internal
components.

· Remove all watches, rings, or loose jewelry when working before
removing covers and touching internal components.

· Do not use conductive tools that could bridge live parts.

· Use gloves when you remove or replace system components; they can

become hot to the touch.

· If the product sustains damage requiring service, disconnect the

product from the AC electrical outlet and refer servicing to an authorized
service provider. Examples of damage requiring service include:

– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the

product.

– The product has been exposed to rain or water.

– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating

instructions.

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Table of Contents

Chapter 1: Overview....................................................................... 15

1.1 About the TYAN TA77-B7061 ................................................ 15

1.2 Product Model......................................................................... 15

1.3 Features.................................................................................. 16

1.4 Standard Parts List ................................................................. 19

1.4.1 Box Contents ................................................................... 19

1.4.2 Accessories ..................................................................... 21

1.5 About the Product ................................................................... 22

1.5.1 System Front View .......................................................... 22

1.5.2 LED control and HDD LED Definitions ............................ 23

1.5.3 System Rear View ........................................................... 24

1.5.4 LAN and ID LED Definitions ............................................ 25

1.5.5 Motherboard (S7061) layout............................................ 26

1.5.6 System top view............................................................... 28

1.5.7 Block Diagram ................................................................. 29

Chapter 2: Setting Up..................................................................... 31

2.0.1 Before you Begin ............................................................. 31

2.0.2 Work Area........................................................................ 31

2.0.3 Tools ................................................................................ 31

2.0.4 Precautions...................................................................... 32

2.1 Installing Motherboard Components....................................... 33

2.1.1 Removing the Chassis Cover .......................................... 33

2.1.2 Installing Hard Drives....................................................... 35

2.1.3 Installing the CPU and Heatsink...................................... 38

2.1.4 Installing the Memory....................................................... 42

2.1.5 Installing the Add-On Card .............................................. 47

2.2 Rack Mounting.......................................................................... 49

2.2.1 Installing the Server in a Rack......................................... 49

2.2.2 Removing the Server from a Rack .................................. 52

Chapter 3: Replacing Pre-Installed Components ........................55

3.0.1 Introduction .......................................................................... 55

3.0.2 Disassembly Flowchart........................................................ 55

3.1 Removing the Cover ............................................................... 57

3.2 Replacing the Front Panel Board ........................................... 57

3.2.1 Front Panel Board Specifications .................................... 59

3.2.2 FPB Connector Pin Definition.......................................... 60

3.3 Replacing the USB Board....................................................... 61

3.3.1 USB Board Specifications ............................................... 63

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3.3.2 USB Board Connector Pin Definition............................... 63

3.4 Replacing the System Fan ..................................................... 64

3.5 Replacing the M1244G70-BP6-8 HDD Backplane................. 68

3.5.1 M1244G70-BP6-8 HDD Backplane Features.................. 70

3.5.2 M1244G70-BP6-8 Connector Pin Definitions .................. 72

3.6 Replacing PCI-E Riser Cards ................................................. 73

3.7 Replacing M7061T77-D-Power Distribution Board ................ 76

3.7.1 M7061T77-D-Power Distribution Board. Features .......... 77

3.7.2 M7061T77-D-PDB Connector Pin Definitions ................. 78

3.8 Replacing M7061T77-D-PBP ................................................. 79

3.8.1 M7061T77-D-Power BackPlane. Features...................... 80

3.8.2 M7061T77-D- PBP Connector Pin Definitions ................ 81

3.9 Replacing the Power Supply .................................................. 82

3.10 Removing Motherboard Procedures..................................... 84

3.10.1 Disconnecting All Motherboard Cables ......................... 84

3.10.2 Removing the Motherboard ........................................... 87

Chapter 4: Installing GPU Cards ................................................... 89

4.1 Installing the NVIDIA M2090 GPU card.................................. 89

4.2 Installing the Full Length GPU card........................................ 92

Appendix I: Fan and Temp Sensors.............................................. 95

Appendix II: Cable Connection Tables ......................................... 99

Appendix III: FRU Parts Table ..................................................... 101

Appendix IV: Technical Support .................................................103

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Chapter 1: Overview

1.1 About the TYAN TA77-B7061

Congratulations on your purchase of the TYAN

®

TA77-B7061, a highly
optimized rack-mountable barebone system. The TA77-B7061 is designed to
support dual Intel

®

Xeon E5-2600 Series processors and up to 512GB of

LRDIMM / 256GB of RDIMM / 128GB of UDIMM DDR3 memory. Leveraging
advanced technology from Intel

®

, TA77-B7061 server system is capable of
offering scalable 32 and 64-bit computing, high bandwidth memory design, and
lightning-fast PCI-E bus implementation.

The TA77-B7061 not only empowers your company in nowadays IT demand but
also offers a smooth path for future application usage.

TYAN

®

is also proud to deliver the TA77-B7061 in a version that can support up

to eight 2.5” hot-swap hard drives. The TA77-B7061 uses TYAN®’s latest
chassis featuring a robust structure and a solid mechanical enclosure. All of this
provides TA77-B7061 the power and flexibility to meet the needs of nowadays
server application.

1.2 Product Model

Model HDD Bays Power supply

TA77-B7061 Hot-swap, 8 HDDs

(1+1)1600 Watts

(80+ Platinum)

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1.3 Features

TYAN TA77B7061 (B7061T77W8HR)

Form Factor 2U Rackmount

Gross Weight 17 kg

Chassis Model TA77

Dimension (D x W x
H)

30.31" x 17.32" x 3.43" (770 x 440 x 87mm)

System

Motherboard S7061WGM2NR

Buttons (1) RST / (1) ID / (1) PWR w/ LED

LEDs (1) ID / (1) IPMI/Warning

Front Panel

I/O Ports (2) USB ports

Type / Q'ty 2.5" Hot-Swap / (8)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (4) 8cm fans

Type ERP1U

Efficiency PFC / 80 plus Platinum

Redundancy 1+1

Input Range 200-240V AC/9.5A

Power Supply

Output Watts 1600 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600 Series

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP)
wattage

Max up to 130W

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset PCH Intel C602

Supported DIMM
Qty

(8)+(8) DIMM slots

DIMM Type / Speed

RDIMM ECC 1600/1333/1066 / UDIMM/LRDIMM
ECC 1333/1066

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel 4 Channels per CPU

Memory

Memory voltage 1.5V or 1.35V

PCI-E

(1) PCI-E x8 Gen.3 slot / (4) PCI-E Gen3 x16
slots

Expansion Slots

Pre-install TYAN M2091-R, PCI-E x16 1U riser card (right) /

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Riser Card M2207-R32-2F, PCI-E x16 riser card (right) /

M2208-L32-2F, PCI-E x16 riser card (left)

Port Q'ty (2) GbE ports + (1) dedicated for IPMI

Controller Intel I350-AM2

LAN

PHY Realtek RTL 8201EL

Connector (8) SAS

Controller LSI SAS2308

Speed 6.0 Gb/s

Storage SAS

RAID RAID 0/1/1E/10 (LSI Integrated RAID)

Connector type D-Sub 15-pin

Graphic

Chipset Aspeed AST2300

USB (4) ports (2 at front, 2 at rear)

VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports (1 port shared with IPMI)

Chipset Aspeed AST2300

Voltage

Monitors voltage for CPU, memory, chipset &
power supply

Temperature Monitors temperature for CPU & memory

System
Monitoring

LED

Fan fail LED indicator / Over temperature
warning indicator / Fan & PSU fail LED indicator

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100
Mb/s MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0
/SMBIOS2.3 /PXE boot / ACPI 2.0 power
management /Power on mode after power
recovery / User-configurable H/W monitoring /
Auto-configurable of hard disk types

Operating
System

OS supported list Please refer to our Intel OS supported list.

FCC (DoC) Class A

Regulation

CE (DoC) Yes

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS RoHS 6/6 Compliant Yes

Package

Barebone (1) TA77B7061 Barebone

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Manual (1) Quick Installation Guide Contains

Installation CD (1) TYAN installation CD

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1.4 Standard Parts List

This section describes the TA77-B7061 package contents and accessories.
Open the box carefully and ensure that all components are present and
undamaged. The product should arrive packaged as illustrated below.

1.4.1 Box Contents

Component Description

2U chassis,
(8) hot swap HDD bays

TYAN

®

S7061 system board

(pre-installed)

(1+1)1600 Watts Power Supply
(pre-installed)

(4) System Fans
(pre-installed)

(1) M7061T77-D-PBP
(pre-installed)

(1) M7061T77-D-PDB
(pre-installed)

(1) M2207-R32-2F Riser card
(pre-installed)

(1) M2208-L32-2F Riser card
(pre-installed)

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M1244G70-BP6-8 HDD BackPlane
(pre-installed)

M2091-R PCI-E riser card
(pre-installed)

M1702T70-USB Board
(pre-installed)

M1701T70-FPB Front Panel Board
(pre-installed)

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1.4.2 Accessories

If any items are missing or appear damaged, contact your retailer or browse to
TYAN

®

’s website for service: http://www.tyan.com

The web site also provides information of other TYAN

®

products, as well as

FAQs, compatibility lists, BIOS settings, etc.

TYAN® Motherboard Drive CD

Heatsink x 2

AC Power Cord 125V (US) x 2 AC Power Cord 250V (EU) x 2

Screw Pack x 3 Addendum for China Use Only

Air Duct Rail Kit & Screw Pack x 1

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1.5 About the Product

The following views show you the product.

1.5.1 System Front View

Image-1

1 USB Ports

2 2.5” HDD bays

3 Power On/OFF Button with Power On/Off LED

4 IPMI LED

5 ID LED

6 RESET Button

7 ID Button

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1.5.2 LED control and HDD LED Definitions

Table-1

LED State Color Description

On Green System is turned on

Blinking Green System is under S1 or S3 state

Power On/Off
LED

Off Off Power off

Solid On Amber

Fan fail / Over temperature / Over
Voltage / PSU fail

Warning
(IPMI) LED

On Green BMC Ready

On Blue

System identified remotely on the
server, by clicking the Chassis Locate
LED key.

ID LED

Off Off System not identified

Table-2

State

Activity LED
Color: Green

Status LED
Color: Red

Description

Solid On Off Drive present,no activity

Green
(Blinking)

Off

Drive present,with
activity

Do not care Solid On HDD Fail

Do not care

Blinking
@1Hz

Drive Locate Identify

Do not care

Blinking
@4Hz

Rebuilding

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1.5.3 System Rear View

Image-2

NO. Description

1 (1+1) 1600W Power Supply

2 LAN3 (shared with IPMI)+2 USB2.0 ports

3 ID LED Button

4 ID LED

5 VGA Port

6 LAN1 and LAN2

7 PCI bracket

8 Expansion Slots

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1.5.4 LAN and ID LED Definitions

Table-3

10/100/1000 Mbps LAN Link/Activity LED Scheme

Left LED

(Link/Activity)

Right LED

(Speed)

No Link OFF OFF

Link Solid Green

OFF

10 Mbps

Active Blinking Green

OFF

Link Solid Green Solid Green

100 Mbps

Active Blinking Green Solid Green

Link Solid Green Solid Yellow

1000 Mbps

(1Gbps)

Active Blinking Green Solid Yellow

NOTE: “Left” and “Right” are viewed from the rear panel.

ID LED

LED Status

LED

Color

Behavior Remark

Normal Off

ID LED

Located

Blue

Solid on

Local and
remote

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1.5.5 Motherboard (S7061) layout

NOTES: "▲" indicates the location of "Pin 1". Jumpers not indicated are for

testing only.

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Jumpers & Connectors

Jumper/Connector Function

CPU0_FAN/CPU1_FAN
SYS_FAN1/2/3

4-pin Fan Power Connector

J2004 Port 80 TPM Header
J2006 PDB to MB connector
J2008/J2009/J2011/J2010/J2012/J2013/J2014 8-pin Fan Power Connector
J3 COM2 Header
ID_LED BTN ID_LED Button
J205 SMBUS HOST Pin Header
A_USB1 Vertical Type-A USB Connector
USB1 USB Front Panel Connector
FPIO1 Front Panel Connector
2PHD_1 Chassis Intrusion Header
3PHD_4 ME Recovery Mode Jumper
3PHD_5 BIOS Recovery Mode Jumper
3PHD6/3PHD7 COM Port Select Jumper
3PHD_8 Security Override Mode Jumper
3PHD_11 BMC Reset Jumper
ID LED BTN1 ID LED Switch Button
ID LED ID LED
CLEAR_BTN1 Clear CMOS Reset Button
SATA1/SATA2 SATA3.0 Connector

Jumper Legend

OPEN - Jumper OFF

Without jumper cover

CLOSED - Jumper ON

With jumper cover

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1.5.6 System top view

Number Description

1 LED Control Board

2 HDD Cage

3 HDD backplane Board

4 System Fan

5 Power Supply

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1.5.7 Block Diagram

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Chapter 2: Setting Up

2.0.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks,
memory modules, and hard drives. Instructions on inserting add-on
cards are also given.

2.0.2 Work Area

Make sure you have a stable, clean working environment. Dust and
dirt can get into components and cause malfunctions. Use
containers to keep small components separated. Putting all small
components in separate containers prevents them from becoming
lost. Adequate lighting and proper tools can prevent you from
accidentally damaging the internal components.

2.0.3 Tools

The following procedures require only a few tools, including the
following:

 A cross head (Phillips) screwdriver

 A grounding strap or an anti-static pad

Most of the electrical and mechanical connections can be
disconnected with your hands. It is recommended that you do not
use pliers to remove connectors as it may damage the soft metal or
plastic parts of the connectors.

Caution!

1. To avoid damaging the motherboard and associated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

2. Do not apply power to the board if it has been

damaged.

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2.0.4 Precautions

Components and electronic circuit boards can be damaged by
discharges of static electricity. Working on a system that is connected
to a power supply can be extremely dangerous. Follow the guidelines
below to avoid damage to TA77-B7061 or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then
touch a safely grounded object to release static charge (i.e.
power supply case). If available, wear a grounded wrist strap.
Alternatively, discharge any static electricity by touching the
bare metal chassis of the unit case, or the bare metal body of
any other grounded appliance.

 Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When

removing the motherboard, always place it on a grounded
anti-static surface until you are ready to reinstall it.

 Hold electronic circuit boards by the edges only. Do not touch

the components on the board unless it is necessary to do so.
Do not flex or stress circuit boards.

 Leave all components inside the static-proof packaging that

they ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs,

or other small parts are in place and are not left loose inside
the case. Metallic parts or metal flakes can cause electrical
shorts.

Note:

All connectors are keyed to only attach one way.

All use the correct screw size as indicated in the procedures.

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2.1 Installing Motherboard Components

This section describes how to install components on to the mainboard, including
CPUs, memory modules, HDD and Add On cards.

2.1.1 Removing the Chassis Cover

Follow these instructions to remove the TA77-B7061 chassis cover.

1. Release the screw on the back side.

2. Remove the top screw on the chassis cover and slide the chassis cover in

the direction of arrow.

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3. After slide the chassis cover while the chassis was look like below.

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2.1.2 Installing Hard Drives

The TA77-B7061 supports (8) 2.5” hard drives. Follow these instructions to
install a hard drive.

Warning!!!

Always install the hard disk drive to the chassis after the chassis is
secured on the rack.

1. Press the locking lever latch in the direction of arrow.

2. Pull the locking lever open.

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3. Slide the drive tray out.

4. Remove the 4 screws to detach HDD tray bracket.

5. Place a hard drive into the drive tray. Use four screws to secure
the HDD.

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6. Reinsert the HDD tray into the chassis.

7. Press the locking lever to secure the hard drive. Repeat the same
procedures to install other HDD trays.

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2.1.3 Installing the CPU and Heatsink

Follow the steps below to install the processor and heatsink.

Install the CPU

1. Locate the CPU socket.

2. Pull the CPU lever up to unlock the CPU socket.

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3. Open the socket to a fully open position.

4. Take off the CPU Socket protection cap.

5. Place the CPU in the CPU socket. Make sure the gold arrow is located in
the right direction.

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6. Close the socket and press the CPU socket lever down to secure the CPU.

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Install the heatsink

1. Place the heatsink on top of the CPU and secure it with 4 screws.

2. Secure the heatsink in the direction of the picture shown.

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2.1.4 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Press the memory slot locking levers in the direction of the arrows
as shown in the following illustration.

2. Align the memory module with the slot. When inserted properly, the
memory slot locking levers lock automatically onto the indentations
at the ends of the module.

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Recommended Memory Population Table

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Recommended Memory Population Table

To achieve the best performance, TYAN® strongly recommended memory installation
configuration as listed below:

Single CPU

Installed

(CPU0 only)

Dual CPU

installed

(CPU0 and CPU1)

Quantity of

memory installed

12346823 4567810121416

CPU0_DIMM(1)D0 √ √ √ √ √ √ √ √ √

CPU0_DIMM(2)D1 √ √ √ √

CPU0_DIMM(3)C0 √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM(4)C1 √ √ √ √

CPU0_DIMM(5)B0 √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM(6)B1 √ √ √ √ √ √

CPU0_DIMM(7)A0 √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM(8)A1 √ √ √ √ √ √

CPU1_DIMM(9)H0 √ √ √ √ √

CPU1_DIMM(10)H1 √

CPU1_DIMM(11)G0 √ √ √ √ √ √ √

CPU1_DIMM(12)G1 √

CPU1_DIMM(13)F0 √ √ √ √ √ √ √ √ √

CPU1_DIMM(14)F1 √ √

CPU1_DIMM(15)E0 √ √ √ √ √ √ √ √ √ √ √

CPU1_DIMM(16)E1 √ √

1. √ indicates a populated DIMM slot.

2. Paired memory installation for Max performance.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs

5. Un-buffered DIMM can offer slightly better performance than registerd DIMM if populating only a

single DIMM per channel

6. We don't suggest other memory installation

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Intel®Xeon®processor E5-2600/4600 product families UDIMM Support

1.35V 1.50V

Ranks Per DIMM &
Data Width

Memory Capacity per DIMM

1DPC 2DPC 1DPC 2DPC

SRx8 Non-ECC 1 GB 2GB 4GB N/A N/A

1066,

1333

1066,

1333

DRx8 Non-ECC 2GB 4GB 8GB N/A N/A

1066,

1333

1066,

1333

SRx16 Non-ECC 512 MB 1GB 2GB N/A N/A

1066,

1333

1066,

1333

SRx8 ECC 1GB 2GB 4GB 1066 1066

1066,

1333

1066,

1333

DRx8 ECC 2GB 4GB 8GB 1066 1066

1066,

1333

1066,

1333

NOTE 1: The blue blocks indicate that the DRAM Densities are supported but not validated.

NOTE 2: The grey blocks indicate that the DRAM Densities are supported and validated.

NOTE 3: 1DPC => One dimm per channel

NOTE 4: 2DPC => Two dimm per channel

 Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated by

Intel.

 Command Address Timing is 1N for 1DPC and 2N for 2DPC.

 Romley-EP/EX platform does not support 3DPC when using UDIMMs.

Intel

®

Xeon®processor E5-2600/4600 product families LRDIMM Support

1.35V 1.50V

Ranks Per DIMM &
Data Width

Memory Capacity per

DIMM

1DPC 2DPC 1DPC 2DPC

QRx4 (DDP) 16GB 32GB 1066 1066

1066,

1333

1066,

1333

QRx8 (P) 8GB 16GB 1066 1066

1066,

1333

1066,

1333

NOTE: The blue blocks indicate that the DRAM Densities are supported and not

validated.

 Physical Rank is used to calculate DIMM Capacity.

 Supported and validated DRAM Densities are 2Gb and 4Gb.

 Command Address Timing is 1N.

 The speeds are estimated targets and will be verified through simulation.

 For 3SPC/3DPC -Rank Multiplication (RM) >= 2.

 DDP -Dual Die Package DRAM stacking. P –Planer monolithic DRAM Die.

 Romley-EP/EX platform does not support 3DPC when using E5-2400 LRDIMMs.

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Intel®Xeon®processor E5-2600/4600 product families RDIMM Support

1.35V 1.50V

Ranks
Per
DIMM &
Data
Width

Memory Capacity
per DIMM

1DPC 2DPC 1DPC 2DPC

SRx8 1GB 2GB 4GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

DRx8 2GB 4GB 8GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

SRx4 2GB 4GB 8GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

DRx4 4GB 8GB 16GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

QRx4 8GB 16GB 32GB 800 800 1066 800
QRx8 4GB 8GB 16GB 800 800 1066 800

NOTE 1: The blue blocks indicate that the DRAM Densities are supported but not

validated.

NOTE 2: The grey blocks indicate that the DRAM Densities are supported and

validated.

NOTE 3: The yellow blocks indicate that the DRAM Densities are supported with

limited validated.

 Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are

validated by Intel.

 Command Address Timing is 1N.

 QR RDIMM are supported but not validated by Intel/PMO in a homogenous

environment. The coverage will have limited system level testing, no signal

integrity testing, and no interoperability testing. The passing QR RDIMMs will be

web posted.

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2.1.5 Installing the Add-On Card

The TA77-B7061 has one preinstalled M2091-R riser card,

You can install an Add-On card into the expansion slot which is available with
riser card. The following instructions are for Add-On card installation. You may
refer to the procedures below for the installation.

1. Push the tab of PCI-E slot on the rear panel in the direction as
shown to release the bracket.

2. Remove the bracket to the left as shown.

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3. Insert the Add-On card as shown.

4. Push the tab of PCI slot in the direction as shown to fix the Add-On
card.

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2.2 Rack Mounting

After installing the necessary components, the TYAN TA77-B7061 can be
mounted in a rack using the supplied rack mounting kit.

CRAL-0170 Rail Kit Screws

2.2.1 Installing the Server in a Rack

Follow these instructions to mount the TYAN TA77-B7061 into an industry
standard 19” rack.

NOTE: Before mounting the TYAN TA77-B7061 in a rack, ensure that all internal

components have been installed and that the unit has been fully tested.
However, to make the installation easier, we suggest that you remove all HDD
trays before you insert the chassis to the rack.

1. Install the rail to the rack. Repeat the same procedures for the other rail.

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2. Use two screws to secure the rail onto the rack. Repeat the same
procedures for the other rail.

3. Draw out the inner rails from rail assembly. Install inner rails to left and right

sides of chassis.

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4. Then push the whole system into the rack.

5. Push the chassis back into the rack.

6. Secure the mounting ears of chassis to the rack with 2 M5-15L screws.

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2.2.2 Removing the Server from a Rack

Follow these instructions to remove the TYAN TA77-B7061 from an industry
standard 19” rack.

1. Remove the two screws from the chassis.

2. Push forward the locking tabs on both rails to unhook the chassis from the

rails.

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3. Follow the steps described earlier in reverse to remove the chassis from the
rack.

To avoid injury, it is strongly recommended that two people
lift the TYAN TA77-B7061 into the place while a third
person screws it to the rack.

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NOTE

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Chapter 3: Replacing Pre-Installed

Components

3.0.1 Introduction

This chapter explains how to replace the pre-installed components, including the
Motherboard, Front panel board, USB board, SATA HDD backplane,
M2207-R32-2F and M2208-L32-2F PCI-E Riser card, System fans, Power
Distribution board and Power supply unit etc.

3.0.2 Disassembly Flowchart

The following flowchart outlines the disassembly procedure.

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NOTE

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3.1 Removing the Cover

Before replacing any parts you must remove the chassis cover. Follow Section

2.1.1 Removing the Chassis Cover (page 33) to remove the cover of the

TA77-B7061.

3.2 Replacing the Front Panel Board

Follow these instructions to replace the M1701T70-FP Front Panel Board.

1 Unscrew to release the Front Panel Board cover.

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2 Remove the Front Panel Board cover.

3 Unscrew the Front Panel Board to replace a new one.

4 Follow the steps described earlier in reverse to reinstall the USB Board.

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3.2.1 Front Panel Board Specifications

Form Factor

 18.5MMx44.2MM, 4-Layer PCB

Connectors

 One 2x15 pin header for front panel connector of

motherboard and HDD backplane board

LEDs

 Power On/Off LED Color: Green (after power on)
 ID LED Color: Blue
 Warning (IPMI) LED Dual Color:

Yellow (Warning) / Green(Normal)

Push buttons

 RESET button
 ID button
 Power On/Off button with Power On/Off LED

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3.2.2 FPB Connector Pin Definition

J1: FPIO connector

Definition Pin Pin Definition

PW_LED+

1 2

+5VSB

Key

3 4

ID_LED+

PW_LED-

5 6

ID_LED-

HD_LED+

7 8

LED_FAULT1-

HD_LED-

9 10

LED_FAULT2-

PWR_SW+

11 12

LAN_ACT

PWR_SW-

13 14

LAN_LINK#

RESET+

15 16

SMB_DAT

RESET-

17 18

SMB_CLK

ID_SW-

19 20

NC

Temp_sensor

21 22

NC

NC

23 24

NC

SMB_ALR

25 26

FPB_HDD_ACTIVITY_G-

SMB_CLK

27 28

FPB_HDD_FAULT_R-

SMB_DAT

29 30

GND

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3.3 Replacing the USB Board

Follow these instructions to replace the M1702T70-USB Board.

1 Unscrew to release the USB front cover.

2 Remove the USB front cover.

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3 Unscrew the USB Board.

4 Disconnect the USB Board to replace a new one.

5 Follow the steps described earlier in reverse to reinstall the USB Board.

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3.3.1 USB Board Specifications

Form Factor

 35 mmx17 mm, 4-Layer PCB

Connectors

 One 2x5 pin header for front panel connector of

motherboard

 2 USB ports

3.3.2 USB Board Connector Pin Definition

J2: 2x5-pin Connector for FP Connector of Motherboard

Pin Definition Description Pin Definition Description

1 VCC_USB USB power 2 VCC_USB USB power

3 USB_P0_N Port1(J1) USB- 4 USB_P1_N Port2(J3) USB-

5 USB_P0_P Port1(J1) USB+ 6 USB_P1_P Port2(J3) USB+

7 GND1 Ground 8 GND2 Ground

9 NP 10 NC No connect

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3.4 Replacing the System Fan

Follow these instructions to replace the cooling fans in your system.

1. Locate the cooling fans in your system.

2. Unplug the cables connected to the mainboard and lift the fan up from the

chassis.

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3. Follow Step A & B to unlock the fans and to replace a new one.

40x28mm Fan

Step A

Step B

Step C

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4. After replacing the new fans, follow Step A & B in reverse order to lock the fans.
Reinstall the fans into the chassis.

5. Connect the fan cables to the mainbone fan connectors.

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3.5 Replacing the M1244G70-BP6-8 HDD Backplane

1. Disconnect the power cables and Mini SAS cable connected to the HDD

Backplane.

2. Remove the two screws securing the bracket to the chassis base.

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3. Unlock the plastic cable locker and lift the bracket up from the chassis.

4. Unscrew the HDD Backplane from the bracket.

5. Replace a new HDD Backplane and reinstall it into the chassis following

the steps mentioned earlier in reverse.

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3.5.1 M1244G70-BP6-8 HDD Backplane Features

Front View

Form Factor

 8-Layer PCB

Integrated I/O

 (1) To S7027GM3NR-LNV mini-SAS connector
 (1) To add-on card mini-SAS connector
 (1) 4x2 pin Power connector
 (1) 5x2 K8 pin JTAG connector

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Rear View

Form Factor

 8-Layer PCB

Integrated I/O

 (8) SAS HDD Connectors

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3.5.2 M1244G70-BP6-8 Connector Pin Definitions

PW2

Definition Pin Pin Definition

GND

1 2

GND

GND

3 4

GND

+12V

5 6

+12V

+12V

7 8

+12V

J11 (CN8)

Definition Pin Pin Definition

CPLD_JTAG_TCK

1 2

GND

CPLD_JTAG_TDO

3 4

VDD_3P3_RUN

CPLD_JTAG_TMS

5 6

NC

NC

7 8

KEY

CPLD_JTAG_TDI

9 10

GND

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3.6 Replacing PCI-E Riser Cards

The TA77-B7061 has three pre-installed PCI-E riser cards.
Follow the instructions below to disassemble the M2207-R32-2F, M2208-L32-2F and
M2091-R PCI-E riser cards.

1 There are two PCI bracket in the TA77-B7061 chassis. Remove the 8 screws to

take out the PCI brackets.

2 Lift the PCI bracket up as show in the image.

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3 Unscrew the M2208-L32-2F riser card to replace a new one if necessary.

4 Unscrew the M2091-R riser card to replace a new one if necessary.

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5 Follow the same procedure to detach the other PCI bracket.

6 Unscrew the M2207-R32-2F riser card to replace a new one if necessary.

7 Follow the steps described earlier in reverse to reinstall the M2207-R32-2F
riser card.

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3.7 Replacing M7061T77-D-Power Distribution Board

The TA77-B7061 has one pre-installed power distribution board.
Follow Follow these instructions to replace the M7061T77-D-Power Distribution
Board.

1. Disconnect the power cables attached to the Power Distribution Board.

2. Unscrew the power distribution board.

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3.7.1 M7061T77-D-Power Distribution Board. Features

Front View

Form Factor

 130*76MM,T=2 mm, 6-Layer PCB

Integrated I/O

 (1) 2x4 pin PW connector1
 (1) 2x4 pin PW connector2
 (1) 2x4 pin PW connector3
 (1) 2x4 pin PW connector4
 (1) 2x12 pin PW connector5

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3.7.2 M7061T77-D-PDB Connector Pin Definitions

PW1/PW2/PW3/PW4

Definition Pin Pin Definition

GND

1 2

GND

GND

3 4

GND

+12V

5 6

+12V

+12V

7 8

+12V

PW5

Definition Pin Pin Definition

+12V

1 2

+12V

+12V

3 4

+12V

+12V

5 6

+12V

+12V

7 8

+12V

+12V

9 10

+12V

+12V

11 12

+12V

GND

13 14

GND

GND

15 16

GND

GND

17 18

GND

GND

19 20

GND

GND

21 22

GND

GND

23 24

GND

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3.8 Replacing M7061T77-D-PBP

The TA77-B7061 has one pre-installed Power Backplane.
Follow Follow these instructions to replace the M7061T77-D-Power Distribution
Board.

1. Disconnect the power cables attached to the Power backplane.

3. Remove the 4 screws from the power distribution board and lift it from the
chassis.

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3.8.1 M7061T77-D-Power BackPlane. Features

Front view

Rear view

Form Factor

 81*76MM,T=2 mm, 10-Layer PCB

Integrated I/O

 (1) Power inlet connector <J1>
 (1) Power inlet connector <J2>
 (1) Signal connector <J3>

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3.8.2 M7061T77-D- PBP Connector Pin Definitions

J1/J2

Definition Pin Pin Definition

GND

1 2

GND

GND

3 4

GND

GND

5 6

GND

GND

7 8

GND

GND

9 10

+12V

+12V

11 12

+12V

+12V

13 14

+12V

+12V

15 16

+12V

+12V

17 18

+12V

A0

19 20

A1

12VSB

21 22

SMART_ON

12LS

23 24

PRESENT_N

NC

25 26

PWOK

+12VRS

27 28

RETRUN_S

SMB_ALERT

29 30

PSON_N

SCL

31 32

SDA

+12V

33 34

+12V

+12V

35 36

+12V

+12V

37 38

+12V

+12V

39 40

+12V

+12V

41 42

GND

GND

43 44

GND

GND

45 46

GND

GND

47 48

GND

GND

49 50

GND

J3

Definition Pin Pin Definition

12VSB

1 2

12VSB

12VSB

3 4

12VSB

MB_PSON_N

5 6

3V3SB

PSU_PWOK

7 8

GND

PSU_SMBALERT

9 10

NC

PSMI_SCL

11 12

GND

PSMI_SDA

13 14

GND

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3.9 Replacing the Power Supply

The system has two pre-installed 1,600W (80+ Platinum) Power Supply Units. Follow
these instructions to replace the power supply units.

1. Press and hold the latch to pull the power supply out.

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2. After replacing a new power supply, press and hold the latch to push the power
supply back into the chassis.

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3.10 Removing Motherboard Procedures

Follow these instructions to replace the motherboard.

3.10.1 Disconnecting All Motherboard Cables

Before replacing the motherboard or certain components, remove the middle
iron bar first so that the motherboard can be easily take out and then disconnect
cables connected to the motherboard. Follow these instructions to remove all
motherboard cables.

1. Remove the two screws on the left side.

2. Remove the two screws on the other side.

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3. Remove the four screws on the iron bar.

4. Lift the iron bar and located at the S7061 motherboard.

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5. Disconnect the 24-pin power cable, 8-pin power cables, mini SAS cable
and PSMI cable.

6. Disconnect the 4 system fan cables.

7. Disconnect the GPU power cables.

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3.10.2 Removing the Motherboard

After removing all of the aforementioned cables, follow the instructions below to
remove the motherboard from the chassis.

1. Remove the heatsink and processor if installed.

2. Remove the eleven screws securing the motherboard to the chassis.

3. Carefully lift the motherboard from the chassis.

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NOTE

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Chapter 4: Installing GPU Cards

The TA77-B7061 supports Five kinds of Add-On cards. They are NVIDIA M2090
GPU card, NVIDIA K10/K20 GPU card, INTEL MIC GPU card and full length
GPU card. In this chapter we will introduce you how to install the NVIDIA M2090
GPU card and the full length card.

4.1 Installing the NVIDIA M2090 GPU card

The TA77-B7061 supports two PCI-E Riser Card Brackets. A power cable (2x4p)
is required for GPU cards. Follow these instructions to install Add-On cards.
Follow these instructions to install M2090 Nvidia GPU card in your system.

1. Put the NVIDIA GPU bracket on the PCI bracket. Then overturn the
bracket. Secure the two screws in the M2090 hole.

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2. Insert the M2090 NVIDIA GPU card onto the M2207-R32-2F riser
card.

3. Secure the M2090 NVIDIA GPU card with 3 screws.

4. Before install the PCI bracket back to the chassis, push the iron piece
lock to the M2090 location.

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5. Connect the GPU cable to the NVIDIA GPU card.

6. Put the PCI bracket back to the chassis.

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4.2 Installing the Full Length GPU card

Follow these instructions to install Intel full length GPU card in your system.

1. Put the Intel full length bracket on the PCI bracket. Then overturn
the bracket. Secure the two screws in the Full length hole.

2. Insert the Intel full length card onto the M2208-L32-2F riser card.

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3. Secure the Intel full length card with 2 screws.

4. Before install the PCI bracket back to the chassis, push the iron
piece lock to the Full length location.

NOTE:

1. The Intel full length card is not a real card, it is only a model. The real
one is thicker than the model.

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NOTE

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Appendix I: Fan and Temp Sensors

This section aims to help readers identify the locations of some specific FAN and
Temp Sensors on the motherboard. A table of BIOS Temp sensor name
explanation is also included for readers’ reference.

NOTE: The red dot indicates the location of the sensors.

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Fan and Temp Sensor Location:

1. Fan Sensor: It is located in the third pin of the fan connector, which detects
the fan speed (rpm)

2. Temp Sensor: PCH_Area Temp (Q111) and M/B_Inlet Temp (Q110).
They detect the system temperature around.

NOTE: The system temperature is measured in a scale defined by Intel,

not in Fahrenheit or Celsius.

BIOS Temp Sensor Name Explanation:

BIOS Temp Sensor Name Explanation

CPU0_DTS_Temp Temperature of the CPU0 Digital Temperature Sensor

CPU0_PECI_Temp Temperature of the CPU0 Platform Environment Control Interface

CPU1_DTS_Temp Temperature of the CPU1 Digital Temperature Sensor

CPU1_PECI_Temp Temperature of the CPU1 Platform Environment Control Interface

PCH_Area Temperature of the PCH Area

PCIE_Air_Inlet Temperature of the PCIE Air Inlet Area

CPU0_DIMM_A0 Temperature of CPU0 DIMM A0 Slot

CPU0_DIMM_A1 Temperature of CPU0 DIMM A1 Slot

CPU0_DIMM_B0 Temperature of CPU0 DIMM B0 Slot

CPU0_DIMM_B1 Temperature of CPU0 DIMM B1 Slot

CPU0_DIMM_C0 Temperature of CPU0 DIMM C0 Slot

CPU0_DIMM_C1 Temperature of CPU0 DIMM C1 Slot

CPU1_DIMM_D0 Temperature of CPU1 DIMM D0 Slot

CPU1_DIMM_E0 Temperature of CPU1 DIMM E0 Slot

CPU1_DIMM_F0 Temperature of CPU1 DIMM F0 Slot

BIOS Fan Sensor Name Explanation

CPU0_FAN Fan speed of CPU0_FAN

CPU1_FAN Fan speed of CPU1_FAN

SYS_FAN_1 Fan speed of SYS_FAN_1

SYS_FAN_2 Fan speed of SYS_FAN_2

SYS_FAN_3 Fan speed of SYS_FAN_3

SYS_FAN_4 Fan speed of SYS_FAN_4

SYS_FAN_5 Fan speed of SYS_FAN_5

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Appendix II: Cable Connection Tables

1. System Fan Connector

System Fan to S7061 MB

System Fan Connect to S7061 MB

Fan1

→

Sys Fan1

Fan2

→

Sys Fan2

Fan3

→

Sys Fan3

Fan4

→

Sys Fan4

2. Mini-SAS & 2X4P HDD PWR Cable

SATA/SAS Backplane (BP) Board to S7061 MB

SATA/SAS BP

Board

Connect to S7061 MB

Mini-SAS

Cable-1

J9

→

J25

Mini-SAS

Cable-2

J10

→

J27

2X4P HDD PWR

Cable

PW3

→

PW6

3. FP Ctrl and USB Cable

Front Panel Board (FPB) to S7061 MB

FPB Connect to S7061 MB

Control Cable J1(FPB)

→

FPIO1

USB Cable J2(USB BP)

→

USB1

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4. PSMI Cable

PBP Board to S7061 MB

PBP Board Connect to S7061 MB

PSMI Cable

J3

→

J2006

5. 2X12P PWR & 2X4P PWR Cable

PDB Board to S7061 MB

PDB Board Connect to S7061 MB

2X12P PWR

Cable

PW5

→

PW8

2X4P PWR

Cable-1

PW1

→

PW4

2X4P PWR

Cable-2

PW3

→

PW5

6. 2X4P GPU PWR Cable

PDB Board to GPU Card

PDB Board Connect to GPU Card

2X4P GPU

PWR Cable-1

PW2

→

GPU card

2X4P GPU

PWR Cable-2

PW4

→

GPU card

7. 2X4P GPU PWR Cable

S7061 MB to GPU Card

S7061 MB Connect to GPU Card

2X4P GPU

PWR Cable-1

PW2

→

GPU card

2X4P GPU

PWR Cable-2

PW3

→

GPU card