TYAN TA70-B8237 Service Engineer's Manual

1

http://www.tyan.com

TA70-B8237

Service Engineer’s Manual

2

http://www.tyan.com

3

http://www.tyan.com

PREFACE

Copyright

This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.

Copyright 2013 MiTAC International Corporation. All rights reserved. TYAN® is
a registered trademark of MiTAC International Corporation.

Version 1.0

Disclaimer

Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliabil it y prior to print ing.
MiTAC assumes no liability whatsoever, and disclaims an y express or implied

warranty, relating to sale and/or use of TYAN

®

products including liability or
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to produce descriptions and/or specificat ions
at any time, without notice. In no event will MiTAC be held liable for any direct
or indirect, incidental or consequential damage, loss of use, loss of data or
other malady resulting from errors or inaccuracies of infor mation contained in
this document.

Trademark Recognition

All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.

TYAN® is a trademark of MiTAC International Corporation.
Intel

®

is a trademark of Intel® Corporation.

AMI

®

, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
IBM

®

, PC®, AT® and PS/2® are trademarks of IBM Corporation.
Winbond

®

is a trademark of Winbond Electronics Corporation.

4

http://www.tyan.com

FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject to
the following conditions:

 This device must not cause harmful interference.
 This device must accept any interference received, including

interference that may cause undesirable operation.

This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when
the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instruction manual, ma y cause harmful
interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference in which case the user
will be required to correct the interference at his own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norm e NMB-003 du
Canada.

Notice for Europe (CE Mark)

This product is in conformity with the Council
Directive 2004/108/EC.

CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according to
manufacturer instructions and in accordance with your local regulatio ns.

5

http://www.tyan.com

About this Manual

This manual provides you with instructions on installing your TYAN
TA70-B8237. This Manual is intended for experienced users and
integrators with hardware knowledge of personal computers.

This manual consists of the following parts:

Chapter 1:

Provides an introduction to the TYAN TA70-B8237
barebones, standard parts list, describes the external
components, and gives a table of key components

Chapter 2:

Covers procedures on installing the processor, memory
modules and hard drives.

Chapter 3:

Chapter 4

Chapter 5:

Chapter 6:

Covers the removal and replacement procedures for
pre-installed components.

This chapter includes the description of the jumpers and
connectors on the motherboard and provides the block
diagram of the system.

This chapter tells how to change system settings through
the BIOS setup menu. Detailed descriptions of the BIOS
parameters are also provided.

This chapter introduces some BIOS codes and technical
terms to provide better service for the customers.

Appendix:

List the cable connection and FRU part tables for reference
of system setup, and technical support in case a problem
arises with your system.

6

http://www.tyan.com

Safety and Compliance Information

Before installing and using TYAN TA70-B8237, take note of the following
precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.

·Do not block the slots and opening on the unit, which are provided for

ventilation.

·

Only use the power source indicated on the marking label. If you are not sure,

contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third pin to
ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.

·Do not place anything on the power cord. Place the p ower cord where it will
not be in the way of foot traffic.

·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high voltage

components and result in shock and damage to the components.

· When replacing parts, ensure that you use parts specified by the

manufacturer.

·When service or repairs have been done, perform ro utine safety checks to
verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating
device.

·Cover the unit when not in use.

7

http://www.tyan.com

Safety Information

Retain and follow all product safety and operating instructions provided
with your equipment. In the event of a conflict between the instructions in
this guide and the instructions in equipment documentation, follow the
guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the
equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide before
you install, operate, or service TYAN products.

Symbols on Equipment

Caution. This symbol indicates a potential

hazard. The potential for injury exists if cautions
are not observed. Consult equipment
documentation for specific details.

Warning. This symbol indicates the presence
of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified
personnel.

Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.

To reduce risk of injury from a hot component,
allow the surface to cool before touching.

General Precautions

· Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.



Machine Room Environment

· This device is for use only in a machine room or IT room.

　 · Make sure that the area in which you install the system is properly

ventilated and climate-controlled.

8

http://www.tyan.com

· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating la bel of the
equipment.

· Do not install the system in or near a plenum, air duct, radiator, or heat
register.

· Never use the product in a wet location.

Equipment Chassis

· Do not block or cover the openings to the system.

· Never push objects of any kind through openings in the equipment.

Dangerous voltages might be present.

· Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.

· Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

· Observe local occupational health and safety requirements and guidelines
for manual materials handling.

· Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.

· Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.

· Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.

· Make sure the rack is properly secured to the floor or ceiling.

· Make sure the stabilizing feet are attached to the rack if it is a single-rack

installation.

· Make sure racks are coupled together if it is a multiple-rack installation.

· Make sure the rack is level and stable before installing an appliance in the

rack.

· Make sure the leveling jacks are extended to the floor.

9

http://www.tyan.com

· Make sure the full weight of the rack rests on the leveling jacks.

· Always load the rack from the bottom up. Load the heaviest component in

the rack first.

· Make sure the rack is level and stable before pulling a component out of the
rack.

· Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and c able
management.

· Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.

· The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.

· If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.

·

Make sure the product is properly matted with the rails. Products that are

improperly matted with the rails might be unstable.

·

Verify that the AC power supply branch circuit that provi des power to the

rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.

Equipment Power Cords

· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.

· Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.

· In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.

·

Do not place objects on AC power cords or cables. Arrange them so that no

10

http://www.tyan.com

one might accidentally step on or trip over them.

· Do not pull on a cord or cable. When unplugging from the electrical outlet,
grasp the cord by the plug.

· To reduce the risk of electrical shock, disconnect all po wer cords before
servicing the appliance.

Equipment Batteries

· The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.

· Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.

· Do not expose the battery to temperatures higher than 60°C (140°F).

· The system battery is not replaceable. If the battery is replaced by an

incorrect type, there is danger of explosion. Replace the ba ttery only with a
spare designated for your product.

· Do not attempt to recharge the battery.

· Dispose of used batteries according to the instructions of the manufacturer.

Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.

Equipment Modifications

· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compli ance of TYAN equipment that has been
modified.

Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service of
this product should be performed by individuals who are knowledgeable about
the procedures, precautions, and hazards associated with equipment
containing hazardous energy levels.

· Do not exceed the level of repair specified in the procedu r es in the product
documentation. Improper repairs can create a safety hazard.

· Allow the product to cool before removing covers and touching interna l

11

http://www.tyan.com

components.

· Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.

· Do not use conductive tools that could bridge live parts.

· Use gloves when you remove or replace system components; they can

become hot to the touch.

· If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service includ e:

– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into th e

product.
– The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating

instructions.

http://www.tyan.com

12

http://www.tyan.com

13

Table of Contents

Chapter 1: Overview....................................................................... 17

1.1 About the TYAN TA70-B8237 ................................................ 17

1.2 Product Models....................................................................... 17

1.3 Features.................................................................................. 18

1.4 Standard Part s List.................................................................20

1.4.1 Box Contents...................................................................20

1.4.2 Accessories ..................................................................... 22

1.5 About the Product................................................................... 23

1.5.1 System Front View .......................................................... 23

1.5.2 System Rear View........................................................... 24

1.5.3 LED Definitions................................................................ 25

1.5.4 System Top View............................................................. 28

Chapter 2: Setting Up..................................................................... 29

2.1 Before you Begin.................................................................... 29

2.1.1 Work Area........................................................................29

2.1.2 Tools................................................................................29

2.1.3 Precautions......................................................................30

2.2 Removing and Installing the Chassis Cover........................... 31

2.3 Installing Motherboard Components...................................... 33

2.3.1 Installing the CPU and Heatsink...................................... 33

2.3.2 Installing the Expansion Cards........................................36

2.3.3 Installing the Memory ......................................................40

2.3.4 Installing IMC Card..........................................................45

2.3.5 Installing Mezz Card........................................................47

2.3.6 Installing Hard Drives ......................................................49

2.4 Rack Mounting........................................................................54

2.4.1 Installing the Server in a Rack......................................... 54

Chapter 3: Replacing Pre-Installed Components ........................ 59

3.1 Disassembly Flowchart........................................................... 59

3.2 Replacing the System Fan..................................................... 60

3.3 Replacing the Fan B oard........................................................ 61

3.3.1 Fan Board Features.........................................................62

3.3.2 Pin Definitions.................................................................. 62

3.4 Replacing the Front Panel Board ........................................... 64

3.4.1 Front Panel Board Features............................................66

3.4.2 Pin Definitions.................................................................. 67

3.5 Replacing the USB Board.......................................................68

3.5.1 USB Board Features....................................................... 70

3.5.2 Pin Definitions.................................................................. 70

http://www.tyan.com

14

3.6 Replacing the HDD Backplane Board.................................... 71

3.6.1 HDD BP Board Features................................................. 73

3.6.2 Connector Pin Definitions................................................ 74

3.7 Replacing the Power Supply Unit...........................................75

3.8 Replacing the Motherboard....................................................76

Chapter 4: Mainboard Information................................................ 79

4.1 Board Image (S8237)............................................................. 80

4.1.1 Pin Definitions.................................................................. 81

4.2 System Block Diagram (S8237) ............................................. 95

4.3 Mainboard Mechanical Drawing............................................. 96

4.4 Board Parts, Jumpers and Connectors.................................. 97

4.4.1 Jumpers & Connectors.................................................... 98

4.5 Thermal Interface Material....................................................100

4.6 Tips on Installing the Motherboard in the Chassis............... 101

Chapter 5: BIOS............................................................................ 103

5.1 About the BIOS.....................................................................103

5.1.1 Setup Basics..................................................................103

5.1.2 Getting Help...................................................................104

5.1.3 In Case of Problems...................................................... 104

5.1.4 Setup Variations............................................................ 104

5.2 Main Menu............................................................................ 105

5.3 Advanced Menu.................................................................... 106

5.3.1 PCI Subsystem Settings................................................ 108

5.3.2 WHEA Configuration .....................................................109

5.3.3 ACPI Settings ................................................................ 110

5.3.4 CPU Configuration.........................................................111

5.3.5 Runtime Error Log ging.................................................. 113

5.3.6 IPMI H/W Monitor.......................................................... 114

5.3.7 IDE Configuration.......................................................... 115

5.3.8 USB Configuration......................................................... 117

5.3.9 WatchDOG Timer Configuration ................................... 119

5.3.10 Super IO Configuration.................................................. 120

5.3.11 Serial Port Console Redirection.................................... 121

5.4 Chipset Menu ....................................................................... 122

5.4.1 North Bridge .................................................................. 123

5.4.2 South Bridge.................................................................. 124

5.4.3 OnBoard Device Configuration......................................126

5.5 Boot ......................................................................................127

5.6 Security................................................................................. 129

5.7 Server Management............................................................. 130

5.8 Save & Exit........................................................................... 132

http://www.tyan.com

15

Chapter 6: Diagnostics ................................................................ 135

6.1 Flash Utility........................................................................... 135

6.2 AMIBIOS Post Code (Aptio).................................................136

Appendix I: Cable Connection Tables........................................ 145

Appendix II: Temp Sensors......................................................... 147

Appendix III: FRU Parts Table ..................................................... 149

Appendix IV: Technical Support ................................................. 151

http://www.tyan.com

16

NOTE

http://www.tyan.com

17

Chapter 1: Overview

1.1 About the TYAN TA70-B8237

Congratulations on your purchase of the TYAN

®

TA70-B8237, a highly optimized
rack-mountable barebone system. The TA70-B8237 is designed to support dual
AMD

®

G34 6100/6200/6300 Series processors and up to 768GB memory with

32GB RDIMMs 800/1066/1333/1600/1866 memory, provi ding a rich feature set and
incredible performance. Leveraging advanced technology from AMD®, the
TA70-B8237 server system is capable of offering scal able 32 and 64-b it computing,
high bandwidth memory design, and lightning-fast PCI-E bus implementation. The
TA70-B8237 not only empowers your company in nowadays IT demand but also
offers a smooth path for future application usage.

TYAN

®

also offers the TA70-B8237 in a version that can support up to (24) 2.5”
hot-swap hard drives and two 2.5” internal hard drives. The TA70-B8237 uses
TYAN’s latest chassis featuring a robust structure and a solid mechanical enclosure.
All of this provides TA70-B8237 the power and flexibility to meet the needs of
nowadays server application.

1.2 Product Models

Model HDD Bays Power Supply

TA70-B8237

2.5" Hot-Swap HDD bays,
24 HDDs

Internal, 2 HDDs

(1+1) 750 Watts

(80+ Gold)

http://www.tyan.com

18

1.3 Features

TYAN TA70B8237 (B8237T70V24HR)

Form Factor 2U Rackmount
Gross Weight 31 kg
Chassis Model TA70

Dimension (D x W x
H)

27.56" x 17.17" x 3.43" (700 x 436 x 87mm)

System

Motherboard S8237PN
Buttons (1) PWR / (1) RST / (1) ID
LEDs (1) PWR / (1) ID / (1) Warning

Front Panel

I/O Ports (2) USB ports

Type / Q'ty

2.5" Hot-Swap / (24) *Need a discrete HBA/RAID adapter
to enable

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

Type / Q'ty 2.5" fixed / (2)

Internal Drive
Bay

Supported HDD
Interface

SATA-II 3.0Gb/s

System Cooling
Configuration

FAN (3) 6056 fans + (2) 6038 fans
Type ERP1U

Efficiency 80 plus gold
Redundancy 1+1
Input Range AC100V ~ AC240V/ 9.5A~5A

Power Supply

Output Watts 750 Watts

Supported CPU
Series

AMD 45nm 8-Core/12-Core Opteron 6100 Series
Processors (Magny-Cours) / AMD 32nm
8-Core/12-Core/16-Core Opteron 6200 Series Processors
(Interlagos) / AMD 32nm 8-Core/12-Core/16-Core
Opteron 6300 Series Processors (Abu Dhabi)

Socket Type / Q'ty G34 / (2)

Average CPU
Power (ACP)
wattage

Up to 140W / *No fan redundancy when 140W CPUs are
deployed

Processor

System Bus Up to 6.4 GT/s Hyper-Transport link support

Chipset Chipset AMD SR5670 + SP5100

Supported DIMM
Qty

(12)+(12) DIMM slots

DIMM Type / Speed RDIMM 1866/1600/1333/1066/800
Capacity Up to 768GB RDIMMs

Memory

Memory channel 4 Channels per CPU
PCI-E (2) PCI-E Gen.2 x16 slots (w/ x8 link) Expansion

Slots

Pre-install TYAN M2212-R16-2F/ (2)

http://www.tyan.com

19

Riser Card

Note:

(1) Mezzanine slot (w/ x8 link) for selective network I/O
adapters

Port Q'ty (1)

LAN

Controller Broadcom BCM5725

Connector (24) SAS
Speed 6.0 Gb/s

SAS

RAID From discrete HBA/RAID adatper
Connector (2) SATA
Controller AMD SP5100
Speed 3.0 Gb/s

Storage

SATA

RAID RAID 0/1/10

USB (4) ports (2 at front, 2 at rear)

I/O Ports

RJ-45 (1) port
Chipset NCT6681D
Temperature Monitors temperature for CPU

LED

Over temperature warning indicator / Fan & PSU fail LED
indicator

System
Monitoring

Others Watchdog timer support

Server
Management

Onboard Chipset Onboard Broadcom BCM 5725
Brand / ROM size 4MB

BIOS

Feature

User-configurable H/W monitoring / PXE boot support /
SMBIOS 2.5/PnP/Wake on LAN / ACPI 3.0/ACPI sleeping
states S1,S4,S5

Operating
System

OS supported list Please refer to our AMD OS supported list.
FCC (DoC) Class A

Regulation

CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS

RoHS 6/6
Compliant

Yes

Barebone (1) TA70B8237 Barebone
Heatsink / Cooler (2) FRU-TH-0070, CPU PASSIVE-HEATSINK
Rail kit (1) sliding rail kit
Manual (1) Quick Installation Guide
Installation CD (1) TYAN installation CD

Package
Contains

Cable Power Cord

(2) CCBL-0300, EU type power cord / (2) CCBL-0317, US
type power cords

http://www.tyan.com

20

1.4 Standard Parts List

This section describes TA70-B8237 package contents and accessories. Open the
box carefully and ensure that all components are present and undamaged. The
product should arrive packaged as illustrated below.

1.4.1 Box Contents

Component Description

(1) 2U Barebone
(24) 2.5” Hot-Swap HDD bays

TYAN

®

S8237 System Board

(pre-installed)

(1+1) 750W Power Supply Unit

(1) M1701T70-FPB Front Panel Board

(pre-installed)

(3) 6056 System Fans

http://www.tyan.com

21

(2) 6038 System Fans

(2) M2212-R16-2F Riser Card

(pre-installed)

(1) M1807TA7-FB Fan Board

(pre-installed)

(3) M1256T70-BP6-8 HDD Backplane

Board

(1) M1702T70-USB USB Board

http://www.tyan.com

22

1.4.2 Accessories

If any items are missing or appear damaged, contact your retailer or browse to
TYAN

®

’s website for service: http://www.tyan.com

The web site also provides information of other TYAN

®

products, as well as FAQs,

compatibility lists, BIOS settings, etc.

CPU Heatsink x 2

Air Duct x 1

Quick Installation Guide x 1 Drivers and Utility CD x 1

AC Power Cord (US) x 2 AC Power Cord (EU) x 2

Screw Packs x 2 Sliding Rail x 1

http://www.tyan.com

23

1.5 About the Product

The following views show you the product.

1.5.1 System Front View

USB Connectors

2.5” Hot-Swap HDD Bays

Front Control Panel

M1701T70-FPB (Front Control Panel)

1

2

3

4

5

1 Power On/Off Button with LED
2 IPMI LED
3 ID LED
4 Reset Button
5 ID Button

http://www.tyan.com

24

1.5.2 System Rear View

1

1

2

5 5 4 6 2 3

1 PCI Expansion Slot
2 750W Power Supply
3 Debug Header
4 ID LED
5 USB Port
6 LAN3 (shared with IPMI)

http://www.tyan.com

25

1.5.3 LED Definitions

M1701T70-FPB Front Control Panel

Item State Color Description

On Green System on

1. Power LED
Off Off Power off

On Orange

Fan fail / Over temperature /
Over voltage / PSU fail

2. Warning (IPMI)
On Green No failure

On Blue System identified

3. ID
Off Off System not identified

NOTE: Press the ID button when the system AC (Alternating Current) is on,

then the ID LED will light blue if the system is identified. Users from remote
sites can also activate the ID LED by entering a few commands in IPMI. For
detailed software support, please visit the Broadcom website for the latest
Broadcom 5725 user guide.

http://www.tyan.com

26

HDD LED

Status LED Activity LED

LED State Color Description

Solid On Drive present, no activity

Activity LED

Blinking

Green

Drive present, with activity

Solid On HDD Failed
Blinking

@1Hz

Identify

Status LED

Blinking
@4Hz

Red

Rebuild

NOTE: HDD LED behavior may vary with different SAS RAID cards.

http://www.tyan.com

27

Rear I/O: Onboard LAN LED Color Definition

The onboard Ethernet port has green and yellow LEDs to indicate LAN status. The
chart below illustrates the different LED states.

10/100/1000 Mbps LAN Link/Activity LED Scheme

Left LED

(Speed)

Right LED

(Link/Activity)

Link Off Green Solid On

10 Mbps

Active Off Blinking Green

Link Solid Green Green Solid On

100 Mbps

Active Solid Green Blinking Green

Link Solid Yellow Green Solid On

1000 Mbps

Active Solid Yellow Blinking Green

No Link Off Off

http://www.tyan.com

28

1.5.4 System Top View

1

2

5

6

3

4

5

1 (24) 2.5” Hot-Swap HDD bays

(1) M1701T70-FPB Front Panel Board (pre-installed)
(1) M1702T70-USB USB Board (pre-installed)
(3) M1257T70-BP6-8 HDD Board (pre-installed)

2 (3) 6056 System Fans + (2) 6038 System Fans

(1) M1807TA7-FB Fan Board (pre-installed)
3 System Main Board
4 (1) Power Supply Module

(1) Internal 2.5” HDD bay for 2 pcs. 2.5” HDD
5 (2) M2212-R16-2F Riser card
6 (1) Power Supply Module

http://www.tyan.com

29

Chapter 2: Setting Up

2.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks, memory
modules, and hard drives. Instructions on inserting add on
cards are also given.

2.1.1 Work Area

Make sure you have a stable, clean working environment. Dust and dirt
can get into components and cause malfunctions. Use containers to
keep small components separated. Putting all small components in
separate containers prevents them from becoming lost. Adequate
lighting and proper tools can prevent you from accidentally damaging
the internal components.

2.1.2 Tools

The following procedures require only a few tools, including the
following:

 A cross head (Phillips) screwdriver
 A grounding strap or an anti-static pad

Most of the electrical and mechanical connections can be disconn ected
with your hands. It is recommended that you do not use pliers to remove
connectors as it may damage the soft metal or plastic parts of the
connectors.

Caution!

1. To avoid damaging the motherboard and the

associated components, do not use torque force
greater than 7kgf/cm (6.09 lb/in) on each mounting
screw for motherboard installation.

2. Do not apply power to the board if it has been

damaged.

http://www.tyan.com

30

2.1.3 Precautions

Components and electronic circuit boards can be damaged by
discharges of static electricity. Working on a s ystem that is connected to
a power supply can be extremely dangerous. Follow the guidelines below
to avoid damage to TA70-B8237 or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then touch a
safely grounded object to release static charge (i.e. power supply
case). If available, wear a grounded wrist strap. Alternatively,
discharge any static electricity by touching the bar e metal chassis
of the unit case, or the bare metal body of any other grounded
appliance.

 Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When removing

the motherboard, always place it on a groun ded anti-static surface
until you are ready to reinstall it.

 Hold electronic circuit boards by the edges only. Do not touch the

components on the board unless it is necessary to do so. Do not
flex or stress circuit boards.

 Leave all components inside the static-proof packaging that they

ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs, or

other small parts are in place and are not left loose inside the case.
Metallic parts or metal flakes can cause electrical shorts.

CAUTION: Please note that the following illustrations may not look

exactly like the rackmount server you purchased. Therefore, the
illustrations should be used for your reference only.

http://www.tyan.com

31

2.2 Removing and Installing the Chassis Cover

Follow these instructions to remove the TA70-B8237 chassis cover.

1. Unless you are installing a hot-swappable component, be sure to turn off the
system, disconnect all attached peripherals and disconnect the system from the
electrical source.

2. Unscrew the 2 thumb screws securing the top cover.

3. From the front side, slide the top cover off.

http://www.tyan.com

32

4. Lift to remove the air duct.

5. To install the chassis cover, follow the above steps in reverse order.

http://www.tyan.com

33

2.3 Installing Motherboard Components

This section describes how to install components on to the motherboard, including
CPUs, memory modules, HDD and PCI-E cards.

Before you begin, refer to 2.2 Removing and Installing the Chassis Cover on
page 31 for instructions on how to remove and reinstall the chassis cover.

2.3.1 Installing the CPU and Heatsink

Follow the steps below to install CPUs and CPU heatsinks.

1. Locate the CPU sockets. Always start with CPU0 first.

2. Push down the lever (1) and slightly pull away from the socket (2) to release the

latch, and then lift up the lever to a fully open position (3). Do the same
procedures to release the other lever.

http://www.tyan.com

34

3. Lift the CPU socket cover to a fully open position.

4. Remove the protection cap from the CPU socket.

5. Place the CPU into the socket making sure that the gold arrow is located in the

right direction.

http://www.tyan.com

35

6. Close the CPU socket cover.

7. Pull down the lever (1), press down (2) and hook towards the latch (3). Repeat

the same procedures to hook the other lever.

8. Position the heatsink on top of the CPU and secure it with 2 screws.

9. Repeat steps 2 to 8 to install the second CPU and heatsink.

http://www.tyan.com

36

2.3.2 Installing the Expansion Cards

TA70-B8237 comes with two PCI-E riser brackets with two pre-installed PCI-E x16
riser cards. The two PCI-E riser cards connect to the two PCI-E slots on the
mainboard.

(2) PCI-E x16 slot direction (x8 link)

Follow these instructions to install expansion cards.

1. Unscrew the 2 thumb screws securing the riser bracket to the chassis.

2. Lift the riser bracket up.

http://www.tyan.com

37

3. Unscrew the PCI dummy bracket.

4. Slide to remove the PCI dummy bracket.

5. Insert the expansion card to the riser bracket. Make sure the expansion card is

connected to the PCI-E slot on the riser card and properly latched onto the
riser bracket.

http://www.tyan.com

38

6. Attach the screw to secure the expansion card to the riser bracket.

7. Insert the riser cards to the PCI-E slots on the main board as you align the

riser bracket onto the chassis.

8. Attach the 2 screws to secure the riser bracket to the chassis.

9. Repeat the above procedures to install another expansion card.

http://www.tyan.com

39

Note: The bottom slot only has power and no signal. The label will be placed over
the PCI-E slot.

http://www.tyan.com

40

2.3.3 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Locate the memory slots on the motherboard.

2. Press the memory slot locking levers in the direction of the arrows as shown in

the following illustration.

3. Align and insert the memory module down onto the slot. When inserted

properly, the memory slot locking levers lock automatically on the indentations
at the ends of the module. Follow the recommended memory population table
to install the other memory modules.

http://www.tyan.com

41

Memory Population Option Table

The following pictures show common types of DDR3 memory modules.

http://www.tyan.com

42

Recommended Memory Population Table

Single CPU Installed

(CPU0 only)

Quantity of

memory installed

1 2 3 4 8 12

CPU0_DIMM_A0 √ √
CPU0_DIMM_A1 √
CPU0_DIMM_A2 √ √ √ √ √ √
CPU0_DIMM_B0 √ √
CPU0_DIMM_B1 √

CPU0_DIMM_B2 √ √ √ √
CPU0_DIMM_C0 √ √
CPU0_DIMM_C1 √
CPU0_DIMM_C2 √ √ √ √ √
CPU0_DIMM_D0 √ √
CPU0_DIMM_D1 √
CPU0_DIMM_D2 √ √ √

NOTE:

1. √ indicates a populated DIMM slot.

2. Use paired memory installation for max performance.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs.

5. Un-buffered DIMM can offer slightly better performance than registerd DIMM if
populating only a single DIMM per channel.

6. Always install with CPU0 Socket and DIMM_2 Slot first, following the alphabetical order.

http://www.tyan.com

43

Dual CPU installed (CPU0 and CPU1)

Quantity of

memory installed

2 3 4 5 6 7 8 10 18 24

CPU0_DIMM_A0 √ √ √
CPU0_DIMM_A1 √ √
CPU0_DIMM_A2 √ √ √ √ √ √ √ √ √ √
CPU0_DIMM_B0 √ √
CPU0_DIMM_B1 √
CPU0_DIMM_B2 √ √ √ √ √ √ √
CPU0_DIMM_C0 √ √
CPU0_DIMM_C1 √
CPU0_DIMM_C2 √ √ √ √ √ √ √ √ √
CPU0_DIMM_D0 √ √
CPU0_DIMM_D1 √
CPU0_DIMM_D2 √ √ √ √ √
CPU1_DIMM_A0 √ √ √
CPU1_DIMM_A1 √ √
CPU1_DIMM_A2 √ √ √ √ √ √ √ √ √ √
CPU1_DIMM_B0 √ √
CPU1_DIMM_B1 √
CPU1_DIMM_B2 √ √ √ √ √ √
CPU1_DIMM_C0 √ √
CPU1_DIMM_C1 √
CPU1_DIMM_C2 √ √ √ √ √ √ √ √
CPU1_DIMM_D0 √ √
CPU1_DIMM_D1 √
CPU1_DIMM_D2 √ √ √ √

http://www.tyan.com

44

Table 2 lists valid DIMM configurations. SR is Single Rank, DR is Dual Rank, and QR is Quad

Rank.

For DIMM speed limitations of different configurations.

http://www.tyan.com

45

2.3.4 Installing IMC Card

Follow these instructions to install the IMC card onto the motherboard.

1. Locate the IMC card slot on the motherboard.

2. Insert the IMC card into the slot in the direction of the arrow as shown in the
following illustration, and press down to lock it in place.

3. Attach the screw to secure the IMC card onto the motherboard.

http://www.tyan.com

46

IMC Card Features

Top Side

Bottom Side

http://www.tyan.com

47

2.3.5 Installing Mezz Card

Follow these instructions to install the Mezz card onto the motherboard.

1. Locate the Mezz card slot on the motherboard.

2. Align the IO connector of the Mezz card to the IO connector slot of the chassis
and then press the Mezz card down to install it on the motherboard.

3. Attach the four (4) screws to secure the Mezz card onto the motherboard.

http://www.tyan.com

48

Mezz Card Features

Top Side

Bottom Side

http://www.tyan.com

49

2.3.6 Installing Hard Drives

The TA70-B8237 can support up to (26) 2.5” hard drives.

Installing 2.5” Hot-Swap Hard Drives

Follow these instructions to install a 2.5” hot-swap HDD.

Warning!!! Always install the hard disk drive to the chassis after the chassis has been

secured on the rack.

1. Press the locking lever latch and pull the locking lever open.

2. Slide the HDD tray out.

http://www.tyan.com

50

3. Unscrew the 4 screws securing the HDD bracket to the HDD tray.

4. Place the 2.5” hard disk drive into the HDD tray and secure the HDD to the
HDD tray using 4 screws.

5. Reinsert the HDD tray into the chassis.

http://www.tyan.com

51

6. Push to secure the locking lever until it clicks into place.

http://www.tyan.com

52

Installing 2.5” Internal Hard Drives

Follow these instructions to install a 2.5” internal HDD.
Prepare the following materials to install the internal HDD:

HDD Rubber Kit HDD Screw Kit

Warning!!! Be sure to turn off the system, disconnect all attached peripherals and

disconnect the system from the electrical source.
Before you begin, refer to 2.2 Removing and Installing the Chassis Cover on

page 31 for instructions on how to remove and reinstall the chassis cover.

1. Remove scre w securing the H DD bracket on top of the power supply unit.

2. Slide to remove the HDD bracket.

http://www.tyan.com

53

3. Secure the HDD rubber to each of the HDD screw holes.

4. Align the HDD to the HDD bracket screw holes and secure the 4 screws.

5. Slide the HDD bracket and secure the screw.

http://www.tyan.com

54

2.4 Rack Mounting

After installing the necessary components, the TYAN TA70-B8237 can b e mounted
in a rack using the supplied rack mounting kits:

Sliding Rail Kit

 Sliding Rails x 2
 Rail Screw Pack x 1

A B C

M5 x 20L screw

(2 pcs)

M5 screw + Washer

(8 pairs)

M4 x 4L screw

(2 pcs)

Mounting Ears Kit

 Mounting Ears x 2
 Mounting Ears Screw Pack x 1

2.4.1 Installing the Server in a Rack

Follow these instructions to mount the TYAN TA70-B8237 into an industry standard
19” rack.

NOTE: Before mounting the TYAN TA70-B8237 in a rack, ensure that all internal

components have been installed and that the unit has been fully tested. However, to
make the installation easier, we suggest that you remove all HDD trays before you
insert the chassis into the rack.

http://www.tyan.com

55

Installing the Inner Rails to the Unit

1. Draw out the inner rail from the rail assembly. When the ra il comes to a stop,
pull the tab to release the latch and completely draw the inner rail out.

2. Align the inner sliding rail (1) on the side of the server, and pull towards the
arrow (2) to secure the three hooks.

3. Secure the inner sliding rail to the server.

4. Repeat steps 2 to 3 to secure the sliding rail to the other side of the server.

http://www.tyan.com

56

Installing the Outer Rails to the Unit

Secure the outer rails to the rack using four M5 screws and four washers (B) on each
side.

Rack Mounting the Server

1. Pull out the middle rail to the l atch position.

2. Lift the unit and then insert the inn er slid e rails into the middle rails.

http://www.tyan.com

57

3. When the inner rails come to a stop, pull the tab to release the latch and p ush

the whole system in.

4. Secure the mounting ears of the unit to the rack using two M5 x 20L

screws (A).

http://www.tyan.com

58

NOTE

http://www.tyan.com

59

Chapter 3: Replacing Pre-Installed Components

This chapter explains how to replace the pre-installed components, including the
S8237 Motherboard, M1701T70-FPB Front Panel Board, M1702T70-USB USB
Board, M1256T70-BP6-8 HDD Backplane Board, M1807-FB Fan Board, PCI-E Riser
Card, System Fan and Power Supply Unit etc.

3.1 Disassembly Flowchart

The following flowchart outlines the disassembly procedures.

http://www.tyan.com

60

3.2 Replacing the System Fan

Follow these instructions to remove the system fan.

1. Remove the chassis cover (see 2.2 Removing and Installing the Chassis
Cover on page 31).

2. Lift the fan handle.

3. Lift the system fan from the chassis.

4. Follow the above procedures in reverse order to replace the system fans.

http://www.tyan.com

61

3.3 Replacing the Fan Board

1. Remove the chassis cover (see 2.2 Removing and Installing the Chassis
Cover on page 31).

2. Remove all the system fans (see 3.2 Replacing the System Fan on page

60).

3. Disconnect the fan board connectors.

4. Unscrew the 9 screws and lift to remove the fan board.

5. Replace the fan board and follow the above procedures in reverse order
reinstall the fan board.

http://www.tyan.com

62

3.3.1 Fan Board Features

6

1 2

3 4

5

7

3.3.2 Pin Definitions

PW1: Power Inlet Connector

Definition Pin Pin Definition

GND 1 8 VCC
GND 2 7 VCC
GND 3 6 VCC
GND 4 5 VCC

1 Fan Connector (J1)
2 Fan Connector (J2)
3 Fan Connector (J3)
4 Fan Connector (J4)
5 Fan Connector (J5)
6 Signal Connector (J6)
7 Power Connector (PW1)

http://www.tyan.com

63

J6: Signal Connector

Definition Pin Pin Definition

Tach 1 1 2 Tach 5
Tach 2 3 4 Tach 6
Tach 3 5 6 Tach 7
Tach 4 7 8 Tach 8
Tach 9 9 10 Tach 10

GND 11 12

PWM 2 13 14 PWM 1
Tach 11 15 16 SDA
Tach 12 17 18 SCL

V3AUX 19 20 PWM 3

J1~J5: Fan Connector

Pin Definition

1 PWM1
2 VCC12
3 TACH1
4 GND
5 GND
6 TACH2
7 VCC12
8 PWM2

http://www.tyan.com

64

3.4 Replacing the Front Panel Board

Follow these instructions to replace the front panel board.

1. Turn off the system, disconnect all attached peripherals and disconnect the

system from the electrical source.

2.

Remove the three screws securing the front panel board to the chassis.

3. Pull to remove the front panel bracket and cover.

4. Remove the scre w securing the front panel board.

http://www.tyan.com

65

5. Slightly pull the front panel board away from the chassis and then lift to

remove the front panel board.

6. Disconnect the front panel c onnector.

7. Replace the front panel board and follow the above procedures in reverse

order to reinstall the front panel board.

http://www.tyan.com

66

3.4.1 Front Panel Board Features

1

2

3

4

5

6

1 2x15-pin Header (J1)
2 Power On/Off Button/LED (green)
3 IPMI LED (amber)
4 ID LED (blue)
5 Reset Button (SW3)
6 ID Button (SW2)

http://www.tyan.com

67

3.4.2 Pin Definitions

J1: 2x15-pin Front Panel Header

Definition Pin Pin Definition

PWD_LED+ 1 2 +5VSB

KEY 3 4 ID_LED+

PW_LED- 5 6 ID_LED-

HDD LED+ 7 8 LED_FAULT1-

HDD LED- 9 10 SYS_FAULT2-

PWR_SW+ 11 12 LAN_ACT

PWR_SW- 13 14 LAN_LINK#

RESET+ 15 16 SMB_DAT

RESET- 17 18 SMB_CLK
ID_SW- 19 20 NC

TEMP_SENSOR 21 22 NC

NC 23 24 NC
SMB_ALR 25 26 FPB_HDD_ACTIVITY_G­SMB_CLK 27 28 FPB_HDD_FAULT_R­SMB_DAT 29 30 GND

http://www.tyan.com

68

3.5 Replacing the USB Board

Follow these instructions to replace the USB board.

1. Turn off the system, disconnect all attached peripherals and disconnect the

system from the electrical source.

2.

Remove the three screws securing the USB panel to the chassis.

3. Pull to remove the USB panel bracket and cover.

4. Remove the screw securing the USB board.

http://www.tyan.com

69

5. Slightly pull the USB board away from the chassis.

6. Disconnect the USB board connector.

7. Replace the USB board a nd follow the above procedures in reverse order to

reinstall the USB board.

http://www.tyan.com

70

3.5.1 USB Board Features

1

2

3

3.5.2 Pin Definitions

J2: 2x5-Pin Header

Definition Pin Pin Definition

VCC_USB 1 2 VCC_USB

USB_P0_N 3 4 USB_P1_N
USB_P0_P 5 6 USB_P1_P

GND1 7 8 GND2

NP 9 10 NC

1 USB Port (J3)
2 2x5-Pin Header (J2)
3 USB Port (J1)

71

http://www.tyan.com

3.6 Replacing the HDD Backplane Board

Follow these instructions to remove the HDD Backplane Board.

1. Remove the chassis cover (see 2.2 Removing and Installing the Chassis
Cover on page 31).

2. Remove all the hot-swap HDD bays.

3. Disconnect the power and SAS cables.

4. Remove the 9 screws securing the HDD backplane board bracket to the
chassis.

http://www.tyan.com

72

5. Lift the HDD backplane bracket to remove it from the chassis.

6. Remove the 18 screws securing the HDD backplane board to the HDD
backplane board bracket.

7. Lift the HDD backplane board to remove it from the HDD backplane board
bracket.

8. Replace the HDD backplane board and follow the above procedures in reverse
order to reinstall the HDD backplane board.

http://www.tyan.com

73

3.6.1 HDD BP Board Features

Front view:

1

Rear view:

2

3

4

5

6

7

1

SAS HDD Connector
(J1, J2, J4, J9, J6, J7, J10,J12)

2 2x4 Power Connector (PW3)
3 Mini SAS Connector (SAS_1)
4 Mini SAS Connector (SAS_0)
5 HDD LED Connector (LED4~LED7) (J15)
6 HDD LED Connector (LED4~LED7) (J14)
7 JTAG (J13) FW Burning Connector

Form Factor: 134.4 x 76.8 mm

http://www.tyan.com

74

3.6.2 Connector Pin Definitions

J13: JTAG

Definition Pin Pin Definition

JTAG_TCK 1 2 GND
JTAG_TD0 3 4 VCC3_3

JTAG_TMS 5 6 NC

NC 7 8

JTAG_TD1 9 10 GND

J14: HDD LED Connector

Definition Pin Pin Definition

HD0_GREENLED 1 2 HD0_REDLED
HD1_GREENLED 3 4 HD1_REDLED
HD2_GREENLED 5 6 HD2_REDLED
HD3_GREENLED 7 8 HD3_REDLED

J15: HDD LED Connector

Definition Pin Pin Definition

HD4_GREENLED 1 2 HD4_REDLED
HD5_GREENLED 3 4 HD5_REDLED
HD6_GREENLED 5 6 HD6_REDLED
HD7_GREENLED 7 8 HD7_REDLED

75

http://www.tyan.com

3.7 Replacing the Power Supply Unit

Follow these instructions to remove the power supply unit.

1. Position the power supply unit handle.

2. To remove the power supply, press the lever as you pull by the handle.

3. Pull the power supply unit completely out from its bay.

4. Follow the above procedures in reverse order to replace the power supply unit.

76

http://www.tyan.com

3.8 Replacing the Motherboard

Follow these instructions to replace the S8237 Motherboard.

1. Remove the chassis cover (see 2.2 Removing and Installing the

Chassis

Cover

on page 31).

2. Remove the two power supply units from the chassis (see 3.7 Replacing
the Power Supply Unit on page 75).

3. Remove the two riser brackets (see 2.3.2 Installing the Expansion Cards
on page 36).

4. Disconnect all the cables connected to the motherboard.

http://www.tyan.com

77

5. Unscrew the two thumb screws securing the motherboard to the chassis.

6. Slide the motherboard towards the front, then lift to remove the motherboard

from the chassis.

7. Prepare a new motherboard.

8. Set the necessary jumpers.

78

http://www.tyan.com

NOTE

http://www.tyan.com

79

Chapter 4: Mainboard Information

You are now ready to install your motherboard.

How to install our products right… the first time

The first thing you should do is read this user’s manual. It contains important
information that will make configuration and setup much easier. Here are some
precautions you should take when installing your motherboard:

(1) Ground yourself properly before removing your motherboard from the

antistatic bag. Unplug the power from your computer power supply and
then touch a safely grounded object to release static charge (i.e. power
supply case). For the safest conditions, MiTAC recommends wearing a
static safety wrist strap.

(2) Hold the motherboard by its edges and do not touch the bottom of the

board, or flex the board in any way.

(3) Avoid touching the motherboard components, IC chips, connectors,

memory modules, and leads.

(4) Place the motherboard on a grounded antistatic surface or on the antistatic

bag that the board was shipped in.

(5) Inspect the board for damage.

The following pages include details on how to install your motherboard into your
chassis, as well as installing the processor, memory, disk drives and cables.

Caution!

1. To avoid damaging the motherboar d and associated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

2. Do not apply power to the board if it has been
damaged.

80

http://www.tyan.com

4.1 Board Image (S8237)

S8237

This picture represents the latest board revision available at the time of publishing
this manual. The board you have received may not look e xac tly like the above
picture.

http://www.tyan.com

81

4.1.1 Pin Definitions

PSU: J1 & J2 (2 x 32 Pin)

PCB Top Side

Pin Definition

53~64 +12V
41~52 RTN

40 Remote Sense+
39 12v_SB
38 PS_AO
37 POK
36 Return
35 SCL
34 -PS_Present
33 SDA

PCB Bottom Side

Pin Definition

1~12 +12V

13~24 RTN

25 Tach
26 Remote Sense
27 Vin_Good
28 Cshare
29 -PS_On
30 PS_Kill
31 Reset
32 Alert

Note:

1. J2 Pin definition is the same as J1.

2. The time gap between AC off and AC on must be long enough to make the PSU 12VSB
discharge completely, or the system may not boot up normally with AC cycle test.

3. To make sure the BMC can work normally in Sleep 5 state, PSU 12VSB should be able
to provide MB with around 1.5A continuously current in Sleep 5.

4. To avoid PSU 12VSB over current protection, PSU 12VSB should be able to endure at
least 5A (2ms) inrush current when AC on.

http://www.tyan.com

82

PW1 (1 x 4 Pin)

Definition Pin Pin Definition

+12V 1 2 GND

GND 3 4 +5V

PW2 (1 x 4 Pin)

Definition Pin Pin Definition

+12V 1 2 GND

GND 3 4 +5V

PW3 (2 x 8 Pin)

Definition Pin Pin Definition

GND 1 2 GND
GND 3 4 GND
GND 5 6 GND
GND 7 8 GND

+5V 9 10 +5V
+5V 11 12 +5V
+5V 13 14 +5V
+5V 15 16 +5V

PW4 (2 x 2 Pin)

Definition Pin Pin Definition

GND 1 2 GND

+3V 3 4 +3V

http://www.tyan.com

83

PWR2, PWR3, PWR4, PWR5 (2 x 4 Pin)

Definition Pin Pin Definition

GND 1 2 GND

GND 3 4 GND
+12V 5 6 +12V
+12V 7 8 +12V

J50, J51, J52, J53, J54, J56 Serial ATA Connector

Definition Pin Pin Definition

GND 1 2 SATA_TXP0

SATA_TXN0 3 4 GND

SATA_RXN0 5 6 SATA_RXP0

GND 7

J97 242 Pin IMC Connector

Definition Pin Pin Definition

5V_RUN 1 2 3V3_RUN

5V_RUN 3 4 3V3_RUN
3V3_DUAL 5 6 3V3_RUN
3V3_DUAL 7 8 GND

GND 9 10 GND
GND 11 12 GND
GND 13 14 GND

GND 15 16 GND
3V3_DUAL 17 18 5V_DUAL
3V3_DUAL 19 20 5V_DUAL
3V3_DUAL 21 22 5V_DUAL
3V3_DUAL 23 24 5V_DUAL

KEY 25 26 KEY

KEY 27 28 KEY

KEY 29 30 KEY

http://www.tyan.com

84

KEY 31 32 KEY

KEY 33 34 KEY

KEY 35 36 KEY

KEY 37 38 PCIE_WAKE_L
PCIE_RXN 39 40 PCIE_TXN
PCIE_RXP 41 42 PCIE_TXP

PCIE_REFCLKN 43 44 GND
PCIE_REFCLKP 45 46 PCIE_RST_L

GND 47 48 RSVD

LPC_DRQ_L 49 50 PCIE_PRSNT1_L

LPC_LFRAME_L 51 52 PCIE_PRSNT2_L

LPC_LAD0 53 54 GND
LPC_LAD1 55 56 LPC_CLKRUN_L

GND 57 58 LPC_PME_L
LPC_LAD2 59 60 LPC_SERIRQ
LPC_LAD3 61 62 LPC_CLK

LPC_RST_L 63 64 GND

LPC_SMI_L 65 66 RSVD

RSVD 67 68 RSVD
RSVD 69 70 UART0_TXD

GND 71 72 UART0_RXD

DV1_TX0_H 73 74 UART0_DSR_L

DV1_TX0_L 75 76 UART0_CTS_L

GND 77 78 GND

DVI_TX1_H 79 80 UART0_DCD_L
DVI_TX1_L 81 82 UART0_DTR_L

GND 83 84 UART0_RTS_L

DVI_TX2_H 85 86 UART0_RI_L
DVI_TX2_L 87 88 GND

GND 89 90 UART0_TXD(SoL)

DVI_TX_CLK_H 91 92 UART0_RXD(SoL)
DVI_TX_CLK_L 93 94 RSVD/UART1_DSR_L

GND 95 96 RSVD/UART1_CTS_L

http://www.tyan.com

85

DVI_DDC_DATA 97 98 GND

DVI_DDC_CLK 99 100 RSVD/UART1_DCD_L

GND

101 102

RSVD/UART1_DTR_L

12C_SCL0(Private0)

103 104

RSVD/UART1_RTS_L

12C_SDA0(Private0)

105 106

RSVD/UART1_R1_L

GND

107 108

GND

12C_SCL3(IPMB)

109 110

12C_SCL2 (APML)

12C_SDA3(IPMB)

111 112

12C_SDA2 (APML)

12C_ALERT3_L(IPMB)

113 114

12C_ALERT2_L (APML)

GND

115 116

GND

12C_SCL1(Private1)

117 118

12C_SCL4 (Shared)

12C_SDA1(Private1)

119 120

12C_SDA4 (Shared)

GND

121 122

MCARD_AUX_SOL_CTRL_L

USB0_P

123 124

GND

USB0_N

125 126

USB1_P

GND

127 128

USB1_N

USB_CLK

129 130

GND

GND

131 132

RSVD

TAN_TACH0

133 134

FAN_TACH5

TAN_TACH1

135 136

FAN_TACH6

TAN_TACH2

137 138

FAN_TACH7

TAN_TACH3

139 140

FAN_PWM_CPU

TAN_TACH4

141 142

FAN_PWM_SYS_ZONE0

RSVD

143 144

FAN_PWM_SYS_ZONE1

RGMII_TX_CLK

145 146

FAN_PWM_PS

GND

147 148

GND

RMII_TXD0/RGMII_TXD0

149 150

FAN_SEL0_L

RMII_TXD1/RGMII_TXD1

151 152

FAN_SEL1_L

RGMII_TXD2

153 154

FAN_SEL2_L

RGMII_TXD3

155 156

FAN_SEL3_L

RMII_TX_EN/RGMII_TX_CTL

157 158

GND

GND

159 160

CARD_ID0

RMII_RX_DV/RGMII_RX_CTL

161 162

CARD_ID1

http://www.tyan.com

86

RMII_RXD0/RGMII_RXD0

163 164

CARD_ID2

RMII_RXD1/RGMII_RXD1

165 166

IMC_CARD_PRES_L

RGMII_RXD2

167 168

RSVD_CARD_PRES_L

RMII_RX_ER/RGMII_RXD3

169 170

RMII

_

REF_CLK/RGMII_REF_CLK

GND

171 172

GND

RGMII_RX_CLK

173 174

RMII_MDIO

RGMII_MODE

175 176

RMII_MDC

PS2_KBD_CLK

177 178

ACOMP_ADC0

PS2_KBD_DATA

179 180

ACOMP_ADC1

PS2_KBD_RST_L

181 182

ACOMP_ADC2

PS2_KBD_GATE_A20_L

183 184

ACOMP_ADC3

PS2_MSE_CLK

185 186

ACOMP_ADC4

PS2_MSE_DATA

187 188

ACOMP_ADC5

GND

189 190

GND

LAN_MCARD_TX_H

191 192

LAN_MCARD_RX_H

LAN_MCARD_TX_L

193 194

LAN_MCARD_RX_L

GND

195 196

LAN_LINK_LED_L

CLK_32768

197 198

LAN_BUSY_LED_L

SYS_ACPI_STATE0

199 200

GND

SYS_ACPI_STATE1

201 202

SYS_TERMTRIP_L

SYS_ACPI_STATE2

203 204

SYS_INTRUDER_L

VGA_HSYNC

205 206

SYS_LINE_AC_L

VGA_VSYNC

207 208

SYS_PWRBTN_L

VGA_RED

209 210

SYS_RSTBTN_L

GND

211 212

SYS_NMIBTN_L

VGA_GRN

213 214

SYS_SMI_L

GND

215 216

SYS_ALL_PWROK

VGA_BLU

217 218

GND

GND

219 220

SYS_PCI_RST_L

VGA_DDC_CLK

221 222

SYS_IO_EXP_INT_L

VGA_DDC_DATA

223 224

MCARD_PWRBTN_L

NCSI_TXD0

225 226

MCARD_RSTBTN_L

NCSI_TXD1

227 228

MCARD_NMIBTN_L

http://www.tyan.com

87

NCSI_TX_EN

229 230

MCARD_LOCAL_LOCK_L

NCSI_RX_DV

231 232

MCARD_SYS_SPKR_DATA

GND

233 234

MCARD_CLR_CMOS_L

NCSI_RSD0

235 236

MCARD_SCI_INT_L

NCSI_RSD1

237 238

GND

NCSI_RX_ER

239 240

FAULT_LED_L

NCSI_REFCLK

241 242

CHASSIS_ID_L

J9, J10, J14, J15, J21, J23, J24, J55 4Pin Fan Connector

Definition Pin Pin Definition

GND 1 2 +12V

FAN_TACH 3 4 FAN_PWM

USB0, USB4, USB5 4Pin USB Connector

Definition Pin Pin Definition

VCC (5V) 1 2 USB_P-

USB_P+ 3 4 GND

J68 (2 x 10 pin HDT Header)

PIN 1 PIN 3 PIN 5 PIN 7 PIN 9

P0_VDDIO_RUN GND GND GND PX_TRST_L

PIN 2 PIN 4 PIN 6 PIN 8 PIN 10

PX_TCK PX_TMS P0_TDI CPUX_TDO HDT_PWROK

PIN 11 PIN 13 PIN15 PIN 17 PIN 19

NC NC P1_DBRDY GND P0_VDDIO_RUN

PIN 12 PIN 14 PIN 16 PIN 18 PIN 20

HDT_RST_L P0_DBRDY CPU_DBREQ_L PX_TEST19 PX_TEST18

http://www.tyan.com

88

J63 (2 x 5 pin SATA SGPIO Header)

PIN1 PIN2 PIN3 PIN4 PIN5

SMBUS_CLK SDATAIN SMBUS_DAT SDATAOUT GND

PIN6 PIN7 PIN8 PIN9 PIN10

SLOAD KEY SCLOCK NC NC

J3 (2 x 3 pin SIO JTAG Header)

PIN 1 PIN 2 PIN 3

GND JTAG_TCK JTAG_TDO

PIN 4 PIN 5 PIN 6

JTAG_TMS JTAG_TDI KEY

J6 1*4 pin IMC IPMB Pin Header

PIN 1 PIN 2 PIN 3 PIN4

IMC_IPMB_SDA GND IMC_IPMB_SCL IMC_IPMB_ALERT_L

J16 2*3 pin BCM5725 Debug Header

PIN 1 PIN 2 PIN 3

V3DU Serial_DO KEY

PIN 4 PIN 5 PIN 6

Serial_DI GND GND

J11 2*3 pin BCM5720 Debug Header

PIN 1 PIN 2 PIN 3

V3DU Serial_DO KEY

PIN 4 PIN 5 PIN 6

Serial_DI GND GND

http://www.tyan.com

89

J7& J18 & J19 & J20 & J22 & J25. 1*4 pin Memory power test Header

J7& J20

PIN1 PIN2 PIN3 PIN4

VREF_DQ VREF_DQ GND GND

J18& J22

PIN1 PIN2 PIN3 PIN4

VREF_CA VREF_CA GND GND

J19& J25

PIN1 PIN2 PIN3 PIN4

VREF VREF GND GND

J98 AMD 2*7 pin Debug Header

PIN1 PIN2 PIN3 PIN4 PIN5

VCC GND

Serial console

select

SYS_RESET_D

EBUG

DEBUG_COM_

RX

PIN6 PIN7 PIN8 PIN9 PIN10

DEBUG_COM_

TX

HIGH_HEX_3 HIGH_HEX_2 HIGH_HEX_1 HIGH_HEX_0

PIN11 PIN12 PIN13 PIN14

LOW_HEX_3 LOW_HEX_2 LOW_HEX_1 LOW_HEX_0

J96 TPM&80port 2*8PIN header.

PIN 1 PIN2 PIN3 PIN4 PIN5 PIN6 PIN7 PIN8

VCC3

FRAM

E

LPC_LAD0 KEY

LPC_LAD1 RESET LPC_LAD

2

GND

PIN9 PIN10 PIN11

PIN1

2

PIN13 PIN14 PIN15

PIN1

6

LPC_LAD

3

33MHZ

LPC_SERIR

Q

GND PRESENT V3DU NC NC

http://www.tyan.com

90

J35 2*4PIN BIOS debug header

PIN 2 PIN 4 PIN 6 PIN 8

V3DU SPI_HOLD SPI_CLK SPI_ROMDI

PIN 1 PIN 3 PIN 5 PIN 7

SPI_CS SPI_SBDI SPI_WE GND

J27 2*8PIN VGA PIN header

PIN1 PIN2 PIN3 PIN4 PIN5 PIN6 PIN7 PIN8

RED GREEN BLUE NC GND GND GND GND

PIN9 PIN10 PIN11 PIN12 PIN13 PIN14 PIN15 PIN16

VCC_VGA GND NC DDCDAT HYSNC VSYNC DDCCLK GND

J8 COM Header （2*5pin）

PIN 2 PIN 4 PIN 6 PIN 8 PIN 10

DSR_L_SER RTS_L_SER CTS_L_SER RI_L_SER NC

PIN 1 PIN 3 PIN 5 PIN 7 PIN 9

DCD_L_SER RXD_SER TXD_SER DTR_L_SER GND

J90&J91 USB Pin Header (5PIN x2 _ NP9) For Front panel

PIN 1 PIN 3 PIN 5 PIN 7 PIN 9

+5VPWR USB_P- USB_P+ GND Key

PIN 2 PIN 4 PIN 6 PIN 8 PIN 10

+5VPWR USB_P- USB_P+ GND NC

J4 2*10 pin NCSI header

PIN 2 PIN 4 PIN 6 PIN 8 PIN 10 PIN 12 PIN14 PIN16 PIN18 PIN20

NC KEY GND GND GND GND NC GND GND GND

PIN 1 PIN 3 PIN 5 PIN 7 PIN 9 PIN11 PIN13 PIN15 PIN17 PIN19

ARBOU

T

ARBIN RXD1 RXD0 CRS_DV

50M_CL

K

RXER TXEN TXD0 TXD1

http://www.tyan.com

91

J64 2*12 pin Front Panel Header

PIN 2 PIN 4 PIN 6 PIN 8 PIN 10 PIN 12

V3DU IDLED+ GND

FAULT_LED

1_L

FAULT_LED

2_L

V3DU

PIN 1 PIN 3 PIN 5 PIN 7 PIN 9 PIN 11

PWR_LED+ KEY PWR_LED- HD_LED+ HD_LED- PWRBTN-

PIN 14 PIN 16 PIN 18 PIN 20 PIN 22 PIN 24

LAN1_ACTL

ED-

SDA SCL

INTRUDER_

L

V3DU

LAN2_ACTL

ED-

PIN 13 PIN 15 PIN 17 PIN 19 PIN 21 PIN 23

GND RSTBTN- GND IDLEDBTN-

AMBIENT_T

IN

NMIBTN-

J99 2*10PIN system FAN Pin Header

PIN 1 PIN2 PIN3 PIN4 PIN5 PIN6 PIN7 PIN8 PIN9 PIN10

TACH TACH TACH TACH TACH TACH TACH TACH TACH TACH

PIN11 PIN12 PIN13 PIN14 PIN15 PIN16 PIN17 PIN18 PIN19 PIN20

GND KEY PWM PWM PWM SDAT PWM SCLK V3DU PWM

System Header

JP28 2PIN Power BTN pin header

PIN1 PIN2

PWR_BTN- GND

JP29 2PIN cold reset pin header

PIN1 PIN2

RESET_BTN- GND

JP30 2PIN warm reset pin header

PIN1 PIN2

WARM_REST_HEADER_L GND

http://www.tyan.com

92

JP31 2PIN Power Good pin header

PIN1 PIN2

SB700_ALL_PWRGD GND

JP27 2PIN IDLED pin header

PIN1 PIN2

LED_IDLED GND

JP19 2PIN TRAFFICLED_L pin header

PIN1 PIN2

V3DU TRAFFICLED_L

JP16 Intruder Header

PIN1 PIN2

INTRUDER_L GND

JP17 TPM&80port Debug Header

PIN1 PIN2

TPM_RST_L GND

J28 /J29/J30 BCM5720 FUNC_MODE Select Header

PIN1 PIN2

FUNC_MOE V3DU

J95 & J100 CPU Power Saving Header

PIN1 PIN2

VDD_PSI_L PHASE2_PSI_L

http://www.tyan.com

93

JP21 & JP22 MEM Power select Header

PIN1 PIN2

DDRIII_VID0 GND

JP13 HDT Header Jumper:

Default:1-2

PIN 1 PIN 2 PIN 3

P0_TDO_P1_TDI P0_TDO P0_TDO_HDT_TDO

JP15 HDT Header Jumper:

Default:1-2

PIN 1 PIN 2 PIN 3

P0_TDO_P1_TDI P1_TDI P0_TDI

JP18 HDT Header Jumper

Default:1-2

PIN 1 PIN 2 PIN 3

P1_TDO CPUX_TDO P0_TDO_HDT_TDO

JP20 Enable/Disable the second NB Jumper

Default:2-3

PIN 1 PIN 2 PIN 3

GND SECOND_SR5690_SYSRESET_L SR5690_SYSRESET_L

JP8 Clear CMOS Jumper

Default:1-2

Clear CMOS

PIN 1 PIN 2 PIN 3

VBAT SB700_VBAT GND

http://www.tyan.com

94

JP9&JP10 Chassis configuration Jumper

Default:1-2

PIN 1 PIN 2 PIN 3

V3DU Chassis configuration GND

JP11&JP12&JP14 COM Debug Jumper

JP11 Default:1-2

PIN 1 PIN 2 PIN 3

TXD_SIO TXD IMC_TXD

JP12 Default:1-2

PIN 1 PIN 2 PIN 3

RXD_SIO RXD IMC_RXD

JP14 Default:1-2

PIN 1 PIN 2 PIN 3

VCC VCC_COM V5SB

95

http://www.tyan.com

4.2 System Block Diagram (S8237)

96

http://www.tyan.com

4.3 Mainboard Mechanical Drawing

97

http://www.tyan.com

4.4 Board Parts, Jumpers and Connectors

This diagram represents the latest board revision available at the time of publishing
this manual. The board you have received may not look e xac tly like the above
diagram. The DIMM slot numbers shown above can be used as a reference when
reviewing the DIMM population guidelines shown later in the manual. For the latest
board revision, please visit our web site at http://www.tyan.com

.

http://www.tyan.com

98

4.4.1 Jumpers & Connectors

Connectors Connector Function

J98 Debug Header
J63 SATA SGPIO Header

J6 IMC IPMB Header

J27 VGA Header

J8 COM Header

J4 NCSI header
J64 Front Panel Header
J99 Front FAN Header

J90/J91 USB Header

J96 TPM/PORT 80 Header

JP16 Chassis Intrusion Header

XU1 CPU0
XU2 CPU1

U60 SR5670(First North Bridge)
U64 South Bridge

U245 BCM5725

U1 Super I/O

LED1 IDLED
LAN3 BCM5725 RJ45 Connector

J50/J51/J52/J53/J54/J56 SATA Connector(0~5)

USB0/USB4/USB5 USB Connector

J9/J10/J14/J15/J21/J23/J24/J55 System Fan Connector

J1/J2 PSU Connector

PW1/ PW2 12V and 5V For HDD Power Connector

PW3 5V for HDD backplane
PW4 3.3V for a back-plane or other system use

PWR2/PWR3/PWR4 12V for HDD backplane

PWR5 12V for FAN board

U108 System BIOS
U118 Super I/O ROM

U93 System Clock chip

http://www.tyan.com

99

Jumpers Function

JP8 Clear CMOS Jumper

JP9/JP10 Chassis Config Jumper

JP11/JP12/JP14

COM Debug Jumper

1-2: SIO to COM(Default)

2-3: IMC UART2 to COM

Slots Function

J12 PCIE Slots (x 8)
J26 PCIE Slots (x8)
J94 PCI-E X 8 MEZZ Card
J97 PCI-E X 1 IMC Card

P0_MA[2 0] / P0_MB[2 0] CPU0 DIMM Slots (Channel A/B)
P0_MC[2 0] / P0_MD[2 0] CPU0 DIMM Slots (Channel C/D)
P1_MA[2 0] / P1_MB[2 0] CPU1 DIMM Slots (Channel A/B)
P1_MC[2 0] / P1_MD[2 0] CPU1 DIMM Slots (Channel C/D)

Note:

1. P0_MA[2 0] = P0_MA0 , P0_MA1 and P0_MA2.

Jumper Legend

OPEN - Jumper OFF Without jumper cover

CLOSED - Jumper ON With jumper cover

http://www.tyan.com

100

4.5 Thermal Interface Material

There are two types of
thermal interface materials
designed for use with the
processors.

The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat sink
on the processor.

The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).

NOTE: Always check with the manufacturer of the heat sink & processor to

ensure that the thermal interface material is compatible with the processor and
meets the manufacturer’s warranty requirements.