Page 1
S8232
Version 1.2
Copyright
Copyright © 2011 MiTAC International Corporation. All rights reserved. No part of
this manual may be reproduced or translated without prior written consent from
MiTAC International Corporation.
Trademark
All registered and unregistered trademarks and company names contained in this
manual are property of their respective owners including, but not limited to the
following.
TYAN® is a trademark of MiTAC International Corporation.
AMD
®
is a trademark of AMD® Corporation.
Intel
®
is a trademark of Intel® Corporation.
AMI, AMI BIOS are trademarks of AMI Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
Winbond
®
is a trademark of Winbond Electronics Corporation.
Notice
Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN
®
products including liability or
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to product descriptions and/or specifications at
any time, without notice. In no event will MiTAC be held liable for any direct or
indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.
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Page 3
Contents
Before you begin….................................................................................... 4
Chapter 1: Instruction ................................................................................5
1.1 Congratulations .................................................................................5
1.2 Hardware Specifications ..................................................................5
1.3 Software Specifications ................................................................... 12
Chapter 2: Board Installation................................................................... 13
2.1 Board Image ....................................................................................14
2.2 Block Diagram ................................................................................. 15
2.3 Board Parts, Jumpers and Connectors ........................................... 16
2.4 Installing the Processor and Heat sink............................................28
2.5 Thermal Interface Material ..............................................................31
2.6 Tips on Installing Motherboard in Chassis ...................................... 32
2.7 Installing the Memory ...................................................................... 34
2.8 Attaching Drive Cables ....................................................................37
2.9 Installing Add-In Cards .................................................................... 38
2.10 Connecting External Devices ........................................................ 39
2.11 Installing the Power Supply ........................................................... 40
2.12 Finishing Up................................................................................... 42
Chapter 3: BIOS Setup ............................................................................. 43
3.1 About the BIOS................................................................................ 43
3.2 Main Menu....................................................................................... 45
3.3 Advanced Menu............................................................................... 46
3.4 PCI/PnP Menu................................................................................. 69
3.5 Boot Menu ....................................................................................... 71
3.6 Security Menu.................................................................................. 73
3.7 Chipset Menu ..................................................................................75
3.8 Exit Menu......................................................................................... 82
Chapter 4: Diagnostics............................................................................. 83
4.1 Beep Codes..................................................................................... 83
4.2 Flash Utility ......................................................................................83
4.3 AMIBIOS Post Code........................................................................ 84
Glossary..................................................................................................... 87
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Before you begin…
Check the box contents!
The retail motherboard package should contain the following:
1x S8232 Motherboard
6 x Serial ATA Cable
1 x USB2.0 cable
1 x S8232 User’s manual
1 x S8232 Quick reference guide
1 x TYAN® Driver CD
1 x I/O shield
2 x mini SAS Cable
(for S8232WGM4NR/S8232WAG2NRF-LE only)
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Chapter 1: Instruction
1.1 Congratulations
You have purchased the powerful TYAN® S8232 motherboard, based on the
AMD
®
SP5100 chipset. The S8232 is designed to support dual AMD® 45nm 8Core/12-Core Opteron 6100 Series Processors and up to 256GB RDIMM or
64GB UDIMM of 800, 1066 and 1333MHz DDR3 memory, as well as low-voltage
DDR3 memory modules. Leveraging advanced technology from AMD
®
, the
S8232 is capable of offering scalable 32 and 64-bit computing, high-bandwidth
memory design, and lightning-fast PCI-E bus implementation.
The S8232 not only empowers you in today’s demanding IT environment but also
offers a smooth path for future application upgradeability. All of these rich feature
sets provides the S8232 with the power and flexibility to meet demanding
requirements for today’s IT environments.
Remember to visit the TYAN® website at http://www.tyan.com. There you can
find all the information on all TYAN® products as well as all the supporting
documentation, FAQs, Drivers and BIOS upgrades.
1.2 Hardware Specifications
TYAN S8232 (S8232WGM4NR)
Supported CPU
Series
AMD 45nm 8-Core/12-Core Opteron 6100 Series
Processors (Magny-Cours) / HT3.0 support ; 12MB L3
per socket
Socket Type / Q'ty G34 / (2)
Average CPU Power
(ACP) wattage
Up to 105W
Processor
System Bus Up to 6.4 GT/s Hyper-Transport link support
Chipset AMD (2)SR5690 + SP5100
Chipset
Super I/O Winbond W83627
Supported DIMM Qty (12)+(12) DIMM slots
DIMM Type / Speed U/RDDR3 & LV RDDR3, 800/1066/1333 MHz
Capacity Up to 256GB RDIMM/ 64GB UDIMM
Memory channel 4 Channels per CPU
Memory
Memory voltage 1.5V or 1.35V
PCI-E
(2) PCI-E Gen.2 x8 slots (x4 link) / (4) PCI-E Gen.2
x16 slots
Expansion
Slots
PCI (1) PCI 32-bit slot
Port Q'ty (4)
LAN
Controller Intel 82576EB
Storage SAS
Connector (2) Mini-SAS connectors (2x (4-in-1) connectors)
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Controller LSI SAS2008
Speed 6.0 Gb/s
RAID RAID 0/1/1E/10 (LSI Integrated RAID)
Connector (6) SATA
Controller AMD SP5100
Speed 3.0 Gb/s
SATA
RAID RAID 0/1/10/5 (Promise Integrated Software RAID)
Connector type D-Sub 15-pin
Resolution 1600x1200@60Hz
Graphic
Chipset Aspeed AST2050
Chipset Infineon SLB9635
TPM
Version TPM v1.2
USB
(9) USB2.0 ports (4 at rear, 4 via cable, 1 type A
onboard)
COM (2) ports (1 at rear, 1 via cable)
SAS (2) Mini-SAS (4-in-1) connectors
VGA (1) D-Sub 15-pin VGA port
RJ-45 (4) GbE ports
Power
Universal 24-pin + 8-pin + 8-pin + 4-pin power
connectors / SSI EEB Spec V.96
Front Panel (1) 2x12-pin SSI front panel header
Input /Output
SATA (6) SATA-II connectors
Chipset Winbond W83795G
Voltage
Monitors voltage for CPU, memory, chipset & power
supply
Fan Total (8) 4-pin headers
Temperature Monitors temperature for CPU & system environment
LED
Fan fail LED indicator / Over temperature warning
indicator / Fan & PSU fail LED indicator
System
Monitoring
Others Watchdog timer support
Onboard Chipset Onboard Aspeed AST2050
AST2050 IPMI
Feature
IPMI 2.0 compliant baseboard management controller
(BMC) / USB 2.0 virtual hub / BIOS update
Server
Management
AST2050 iKVM
Feature
24-bit high quality video compression / Dual 10/100
Mb/s MAC interfaces
Brand / ROM size AMI / 4MB
BIOS
Feature
Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power on
mode after power recovery / User-configurable H/W
monitoring
Form Factor MEB
Physical
Dimension
Board Dimension 13" x 16" (330 x 406mm)
Operating
System
OS supported list Please visit our Web site for the latest update.
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FCC (DoC) Class A
Regulation
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating
Temp.
- 40° C ~ 70° C (-40° F ~ 158° F)
Operating
Environment
In/Non-operating
Humidity
90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint Yes
Motherboard (1) S8232 Motherboard
Manual (1) User's manual / (1) Quick Ref. Guide
Installation CD (1) TYAN installation CD
I/O Shield (1) I/O Shield
SATA (6) SATA signal cables
Package
Contains
Cable
SAS (2) Mini-SAS cables (2x (4-in-1) connectors)
TYAN S8232 (S8232GM4NR)
Supported CPU
Series
AMD 45nm 8-Core/12-Core Opteron 6100 Series
Processors (Magny-Cours) / HT3.0 support ; 12MB L3
per socket
Socket Type / Q'ty G34 / (2)
Average CPU Power
(ACP) wattage
Up to 105W
Processor
System Bus Up to 6.4 GT/s Hyper-Transport link support
Chipset AMD (2)SR5690 + SP5100
Chipset
Super I/O Winbond W83627
Supported DIMM Qty (12)+(12) DIMM slots
DIMM Type / Speed U/RDDR3 & LV RDDR3, 800/1066/1333 MHz
Capacity Up to 256GB RDIMM/ 64GB UDIMM
Memory channel 4 Channels per CPU
Memory
Memory voltage 1.5V or 1.35V
PCI-E
(2) PCI-E Gen.2 x8 slots (x4 link) / (4) PCI-E Gen.2
x16 slots
Expansion
Slots
PCI (1) PCI 32-bit slot
Port Q'ty (4)
LAN
Controller Intel 82576EB
Connector (6) SATA
Controller AMD SP5100
Speed 3.0 Gb/s
Storage SATA
RAID RAID 0/1/10/5 (Promise Integrated Software RAID)
Connector type D-Sub 15-pin
Resolution 1600x1200@60Hz
Graphic
Chipset Aspeed AST2050
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Chipset Infineon SLB9635
TPM
Version TPM v1.2
USB
(9) USB2.0 ports (4 at rear, 4 via cable, 1 type A
onboard)
COM (2) ports (1 at rear, 1 via cable)
VGA (1) D-Sub 15-pin VGA port
RJ-45 (4) GbE ports
Power
Universal 24-pin + 8-pin + 8-pin + 4-pin power
connectors / SSI EEB Spec V.96
Front Panel (1) 2x12-pin SSI front panel header
Input /Output
SATA (6) SATA-II connectors
Chipset Winbond W83795G
Voltage
Monitors voltage for CPU, memory, chipset & power
supply
Fan Total (8) 4-pin headers
Temperature Monitors temperature for CPU & system environment
LED
Fan fail LED indicator / Over temperature warning
indicator / Fan & PSU fail LED indicator
System
Monitoring
Others Watchdog timer support
Onboard Chipset Onboard Aspeed AST2050
AST2050 IPMI
Feature
IPMI 2.0 compliant baseboard management controller
(BMC) / USB 2.0 virtual hub / BIOS update
Server
Management
AST2050 iKVM
Feature
24-bit high quality video compression / Dual 10/100
Mb/s MAC interfaces
Brand / ROM size AMI / 4MB
BIOS
Feature
Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power on
mode after power recovery / User-configurable H/W
monitoring
Form Factor MEB
Physical
Dimension
Board Dimension 13" x 16" (330 x 406mm)
Operating
System
OS supported list Please visit our Web site for the latest update.
FCC (DoC) Class A
Regulation
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating
Temp.
- 40° C ~ 70° C (-40° F ~ 158° F)
Operating
Environment
In/Non-operating
Humidity
90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint Yes
Motherboard (1) S8232 Motherboard
Manual (1) User's manual / (1) Quick Ref. Guide
Package
Contains
Installation CD (1) TYAN installation CD
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I/O Shield (1) I/O Shield
Cable SATA (6) SATA signal cables
TYAN S8232 (S8232WAG2NRF-LE)
Supported CPU
Series
AMD 45nm 8-Core/12-Core Opteron 6100 Series
Processors (Magny-Cours) / HT3.0 support ; 12MB L3
per socket
Socket Type / Q'ty G34 / (2)
Average CPU Power
(ACP) wattage
Up to 105W
Processor
System Bus Up to 6.4 GT/s Hyper-Transport link support
Chipset AMD SR5690 + SP5100
Chipset
Super I/O Winbond W83627
Supported DIMM Qty (12)+(12) DIMM slots
DIMM Type / Speed U/RDDR3 & LV RDDR3, 800/1066/1333 MHz
Capacity Up to 256GB RDIMM/ 64GB UDIMM
Memory channel 4 Channels per CPU
Memory
Memory voltage 1.5V or 1.35V
PCI-E (2) PCI-E Gen.2 x16 slots
Expansion
Slots
PCI (1) PCI 32-bit slot
Port Q'ty (2)
LAN
Controller Intel 82576EB
Connector (2) Mini-SAS connectors (2x (4-in-1) connectors)
Controller LSI SAS2008
Speed 6.0 Gb/s
SAS
RAID RAID 0/1/1E/10 (LSI Integrated RAID)
Connector (6) SATA
Controller AMD SP5100
Speed 3.0 Gb/s
Storage
SATA
RAID RAID 0/1/10/5 (Promise Integrated Software RAID)
Connector type D-Sub 15-pin
Resolution 1600x1200@60Hz
Graphic
Chipset Aspeed AST1100
Chipset Realtek ALC262
Audio
Feature High Definition Audio
Port Q'ty (2)
FireWire
Chipset VIA VT6308
USB
(9) USB2.0 ports (4 at rear, 4 via cable, 1 type A
onboard)
COM (2) ports (1 at rear, 1 via cable)
SAS (2) Mini-SAS (2x (4-in-1) connectors)
Input /Output
VGA (1) D-Sub 15-pin VGA port
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Audio
(1) 2x5-pin front panel audio header / (1) 2x6-pin rear
audio jack header
RJ-45 (2) GbE ports
Firewire (1) 2x5-pin header
Power
Universal 24-pin + 8-pin + 8-pin + 4-pin power
connectors / SSI EEB Spec V.96
Front Panel (1) 2x12-pin SSI front panel header
SATA (6) SATA-II connectors
Chipset Winbond W83795G
Voltage
Monitors voltage for CPU, memory, chipset & power
supply
Fan Total (8) 4-pin headers
Temperature Monitors temperature for CPU & system environment
LED
Fan fail LED indicator / Over temperature warning
indicator / Fan & PSU fail LED indicator
System
Monitoring
Others Watchdog timer support
Brand / ROM size AMI / 4MB
BIOS
Feature
Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power on
mode after power recovery / User-configurable H/W
monitoring
Form Factor MEB
Physical
Dimension
Board Dimension 13" x 16" (330 x 406mm)
Operating
System
OS supported list Please visit our Web site for the latest update.
FCC (DoC) Class A
Regulation
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating
Temp.
- 40° C ~ 70° C (-40° F ~ 158° F)
Operating
Environment
In/Non-operating
Humidity
90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint Yes
Motherboard (1) S8232 Motherboard
Manual (1) User's manual / (1) Quick Ref. Guide
Installation CD (1) TYAN installation CD
I/O Shield (1) I/O Shield
SATA (6) SATA signal cables
SAS (2) Mini-SAS cables
IEEE1394 (1) CCBL-1030, 2-port IEEE 1394a bracket cable
Package
Contains
Cable
Audio (1) CCBL-0613, 3-POS audio bracket cable
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TYAN S8232 (S8232AG2NRF-LE)
Supported CPU
Series
AMD 45nm 8-Core/12-Core Opteron 6100 Series
Processors (Magny-Cours) / HT3.0 support ; 12MB L3
per socket
Socket Type / Q'ty G34 / (2)
Average CPU Power
(ACP) wattage
Up to 105W
Processor
System Bus Up to 6.4 GT/s Hyper-Transport link support
Chipset AMD SR5690 + SP5100
Chipset
Super I/O Winbond W83627
Supported DIMM Qty (12)+(12) DIMM slots
DIMM Type / Speed U/RDDR3 & LV RDDR3, 800/1066/1333 MHz
Capacity Up to 256GB RDIMM/ 64GB UDIMM
Memory channel 4 Channels per CPU
Memory
Memory voltage 1.5V or 1.35V
PCI-E (2) PCI-E Gen.2 x16 slots
Expansion
Slots
PCI (1) PCI 32-bit slot
Port Q'ty (2)
LAN
Controller Intel 82576EB
Connector (6) SATA
Controller AMD SP5100
Speed 3.0 Gb/s
Storage SATA
RAID RAID 0/1/10/5 (Promise Integrated Software RAID)
Connector type D-Sub 15-pin
Resolution 1600x1200@60Hz
Graphic
Chipset Aspeed AST1100
Chipset Realtek ALC262
Audio
Feature High Definition Audio
Port Q'ty (2)
FireWire
Chipset VIA VT6308
USB
(9) USB2.0 ports (4 at rear, 4 via cable, 1 type A
onboard)
COM (2) ports (1 at rear, 1 via cable)
VGA (1) D-Sub 15-pin VGA port
Audio
(1) 2x5-pin front panel audio header / (1) 2x6-pin rear
audio jack header
RJ-45 (2) GbE ports
Firewire (1) 2x5-pin header
Power
Universal 24-pin + 8-pin + 8-pin + 4-pin power
connectors / SSI EEB Spec V.96
Input /Output
Front Panel (1) 2x12-pin SSI front panel header
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SATA (6) SATA-II connectors
Chipset Winbond W83795G
Voltage
Monitors voltage for CPU, memory, chipset & power
supply
Fan Total (8) 4-pin headers
Temperature Monitors temperature for CPU & system environment
LED
Fan fail LED indicator / Over temperature warning
indicator / Fan & PSU fail LED indicator
System
Monitoring
Others Watchdog timer support
Brand / ROM size AMI / 4MB
BIOS
Feature
Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power on
mode after power recovery / User-configurable H/W
monitoring
Form Factor MEB
Physical
Dimension
Board Dimension 13" x 16" (330 x 406mm)
Operating
System
OS supported list Please visit our Web site for the latest update.
FCC (DoC) Class A
Regulation
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating
Temp.
- 40° C ~ 70° C (-40° F ~ 158° F)
Operating
Environment
In/Non-operating
Humidity
90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint Yes
Motherboard (1) S8232 Motherboard
Manual (1) User's manual / (1) Quick Ref. Guide
Installation CD (1) TYAN installation CD
I/O Shield (1) I/O Shield
SATA (6) SATA signal cables
IEEE1394 (1) CCBL-1030, 2-port IEEE 1394a bracket cable
Package
Contains
Cable
Audio (1) CCBL-0613, 3-POS audio bracket cable
1.3 Software Specifications
For OS (operation system) support, please check with TYAN® support for latest
information.
Remember to visit our Web site at http://www.tyan.com
for the latest AST2050
User’s Guide.
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Chapter 2: Board Installation
You are now ready to install your motherboard.
How to install our products right… the first time
The first thing you should do is reading this user’s manual. It contains important
information that will make configuration and setup much easier. Here are some
precautions you should take when installing your motherboard:
(1) Ground yourself properly before removing your motherboard from the
antistatic bag. Unplug the power from your computer power supply and
then touch a safely grounded object to release static charge (i.e. power
supply case). For the safest conditions, MiTAC recommends wearing a
static safety wrist strap.
(2) Hold the motherboard by its edges and do not touch the bottom of the
board, or flex the board in any way.
(3) Avoid touching the motherboard components, IC chips, connectors,
memory modules, and leads.
(4) Place the motherboard on a grounded antistatic surface or on the antistatic
bag that the board was shipped in.
(5) Inspect the board for damage.
The following pages include details on how to install your motherboard into your
chassis, as well as installing the processor, memory, disk drives and cables.
NOTE: Do not apply power to the board if it has been damaged.
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2.1 Board Image
This picture is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above picture.
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2.2 Block Diagram
S8232 Block Diagram
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2.3 Board Parts, Jumpers and Connectors
This diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram. But
for the DIMM number please refer to the above placement for memory installation.
For the latest board revision, please visit our web site at http://www.tyan.com
.
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Jumpers & Connectors
Jumper/Connector Function
J26 IPMB Connector
J42 (COM2) COM2 Header
J43/J44/J45/J46/J47/J48 Serial ATA Connector Ports
J49/J50 Mini-SAS Connector Ports
J52/J54/J55/J56/
J57/J58/J59/J60
4-pin Fan Connectors
J63 SAS Fault LED Header
J64 PSMI Connector
J65 Front Panel Header
J71 2x10 pin Fan Connector (Barebones use only)
J72 Clear CMOS Jumper
J75 SAS Enable/Disable Jumper
J78 VGA Enable/Disable Jumper
J81/J82 LAN3/LAN4 FP LED Headers
J83 Chassis Intrusion Header
J84 ID LED Header
J85 FP Audio Header
J87/J88 IEEE 1394 Headers
J89 Audio Header
J90 SP5100 SGPIO Header
J91 Onboard ID LED Header
J92/J93 USB Front Panel Headers
USB3 Vertical (Type-A) USB Connector
Jumper Legend
OPEN - Jumper OFF
Without jumper cover
CLOSED - Jumper ON
With jumper cover
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USB3J43/J44/J45/J46/J47/J48
J56
J52
J59
J57
J55
J58
J60
J54
J42
J26
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J26: IPMB Connector
Signal Pin Pin Signal
IPMB_SDA 1 2 GND
IPMB_SCLK 3 4 NC
J42: COM2 Connector
Signal Pin Pin Signal
DCD 1 2 DSR
RXD 3 4 RTS
TXD 5 6 CTS
DTR 7 8 RI
GND 9 10 KEY
J43/J44/J45/J46/J47/J48/J49/J50: Serial ATA Connector
7 GND
6 RXP
5 RXN
4 GND
3 TXN
2 TXP
7
1
1 GND
Connects to the Serial ATA ready
drives via the Serial ATA cable.
J52/J54/J55/J56/J57/J58/J59/J60: 4-Pin FAN Connectors
Pin 1 2 3 4
Signal GND P12V TACH PWM
Use this header to connect the cooling fan to your motherboard to keep the
system stable and reliable.
USB3: Vertical (Type A) USB Connectors
Pin 1 2 3 4
Signal P5V DATA- DATA+ GND
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J64
J71J65
J63
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J63: SAS Fault LED Header
Use this header to connect to the CPLD firmware update tool
Signal Pin Pin Signal
LED0_L 1 2 LED1_L
LED2_L 3 4 LED3_L
LED4_L 5 6 LED5_L
KEY 7 8 LED7_L
LED6_L
9 10 GND
J64: PSMI Connector
Pin 1 2 3 4 5
Signal SMCLK SMDAT ALERT_L- GND VCC3
J65: Front Panel Header
Signal Pin Pin Signal
Power LED+ 1 2 PWR
KEY 3 4 System ID LED+
Power LED - 5 6 System ID LEDHD LED+ 7 8 Fault LED
HD LED - 9 10 PSU Fault LED
Power SW 11 12 LAN1 LED +
GND 13 14 LAN1 LED Reset SW 15 16 SMB Host Data
GND 17 18 SMB Host CLK
ID SW 19 20 INTRU#
TEMP Sensor 21 22 LAN3 LED +
NMI 23 24 LAN3 LED -
J71: 2x10-Pin FAN connector for TYAN (Barebones use only)
Signal Pin Pin Signal
TACH1 1 2 TACH6
TACH2 3 4 TACH7
TACH3 5 6 TACH8
TACH4 7 8 TACH9
TACH5 9 10 TACH10
GND 11 12 KEY
PWM4 13 14 PWM3
TACH11 15 16 N/A
TACH12 17 18 N/A
N/A 19 20 PWM5
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LED1
J84
J81 J82
J83
J85
J87/J88
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J81/J82: LAN3/LAN4 Front Panel LED Header
Pin Signal
1 LED+
1
2 LED-
J83: Chassis Intrusion Header
Pin Signal
1
Open: Use this jumper to disable the system
chassis intrusion alarm.
1 INTRUDER_L
Closed: Use this jumper to trigger the system
chassis intrusion alarm. (Default)
2 GND
J84: ID LED Header
Pin Signal
1 IDLEDBTN_N
1
2 GND
J85: FP Audio Header
Signal Pin Pin Signal
MIC_L 1 2 GND_AUDIO
MIC_R 3 4 FP_FRNT_L
LINE_IN_R 5 6 FP_IO_SNS
GND_AUDIO 7 8 KEY
1
0
9
2
1
LINE_IN_L 9 10 FP_IO_SNS
J87/J88: IEEE 1394 Header
Signal Pin Pin Signal
XTPA_P 1 2 XTPA_M
GND 3 4 GND
XTPB_P 5 6 XTPB_M
FWAPWR 7 8 FWAPWR
10
9
2
1
KEY 9 10 GND
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J89
J91
J90
J92
J93
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J89: Audio Header
Signal Pin Pin Signal
MIC_L 1 2 MIC_R
GND_AUDIO 3 4 MIC_JD
LINE_IN_R 5 6 LINE_IN_R
KEY 7 8 LINE_IN_JD
LINE_OUT_L 9 10 LINE_OUT_R
1
1
2112
N/A 11 12 FRONT_JD
J90: SP5100 SGPIO Header
Signal Pin Pin Signal
SB700_SCLK0 1 2 SP5100_SIO_DIN
SB700_SDAT0 3 4 SP5100_SIO_DOUT
GND 5 6 SP5100_SIO_END
KEY 7 8 SP5100_SIO_CLK
10
9
2
1
N/A 9 10 SATA_ERROR_LED
J91: Onboard ID LED Header
Pin Signal
1 ID LED+
1
2 ID LED-
J92/J93: USB Front Panel Connector
Signal Pin Pin Signal
P5V 1 2 P5V
DATA1- 3 4 DATA2DATA1+ 5 6 DATA2+
GND 7 8 GND
KEY 9 10 GND
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J72
J75
J78
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J72: Clear CMOS Jumper
3
1
Normal (Default)
3
1
Clear CMOS
You can reset CMOS by using this jumper if you have
forgotten your system/setup password or need to clear BIOS
setting.
1. Power off system and disconnect both power connectors
from the motherboard.
2. Use jumper cap to close Pin_2 and Pin_3 for seconds to
Clear CMOS.
3. Put jumper cap back to Pin_1 and Pin_2 (default setting).
4. Reconnect power & power on system.
J75: SAS Enable/Disable Jumper
3
1
Pin 1-2 Closed: Normal (Default)
1
3
Pin 2-3 Closed: Disable on-board SAS function
J78: VGA Enable/Disable Jumper
3
1
Pin 1-2 Closed: Normal (Default)
1
3
Pin 2-3 Closed: Disable Video from BMC AST2050
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2.4 Installing the Processor and Heat sink
The S8232 supported AMD® processors are listed in section Hardware
Specifications on page 4. Check our website at http://www.tyan.com
for latest
processor support.
NOTE: MiTAC is not liable for damage as a result of operating an
unsupported configuration.
Processor Installation (G34 1944-pin Socket for AMD CPU)
Follow the steps below to install the processors and heat sinks. Please note that the
illustrations are based on a G34 1944-pin Socket which may not look exactly like
the motherboard you purchased. Therefore, the illustrations should be held for your
reference only.
NOTE: If only one processor is installed, start with CPU0 first.
1. Locate the CPU socket.
2. Pull the CPU lever slightly away from the socket and then push it to a fully
open position.
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3. Lift the socket cover to a fully open position.
4. Take off the CPU protection cap.
5. Place the CPU in the CPU socket.
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6. Close the socket cover and press the CPU socket lever down to lock the CPU
in place.
7. Repeat the same procedures to install the second CPU.
Heat sink Installation
After installing the processor, you should proceed to install the heat sink. The CPU
heat sink will ensure that the processor do not overheat and continue to operate at
maximum performance for as long as you own them. The overheated processor is
dangerous to the motherboard.
For the safest method of installation and information on choosing the appropriate
heat sink, using heat sinks validated by AMD
®
. Please refer to the AMD® website:
http://www.amd.com
The following diagram illustrates how to install heat sink onto the CPU of S8232.
8. Place the heat sink on top of the CPU and secure it to the motherboard with 2
screws.
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2.5 Thermal Interface Material
There are two types of
thermal interface materials
designed for use with the
processors.
The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat
sink on the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).
NOTE: Always check with the manufacturer of the heat sink & processor to
ensure that the thermal interface material is compatible with the processor
and meets the manufacturer’s warranty requirements.
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2.6 Tips on Installing Motherboard in Chassis
Before installing your motherboard, make sure your chassis has the necessary
motherboard support studs installed. These studs are usually metal and are gold in
color. Usually, the chassis manufacturer will pre-install the support studs. If you are
unsure of stud placement, simply lay the motherboard inside the chassis and align
the screw holes of the motherboard to the studs inside the case. If there are any
studs missing, you will know right away since the motherboard will not be able to be
securely installed.
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Some chassis include plastic studs instead of metal. Although the plastic studs are
usable, MiTAC recommends using metal studs with screws that will fasten the
motherboard more securely in place.
Below is a chart detailing what the most common motherboard studs look like and
how they should be installed.
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2.7 Installing the Memory
Before installing memory, ensure that the memory you have is compatible with the
motherboard and processor. Check the TYAN Web site at: www.tyan.com
for
details of the type of memory recommended for your motherboard.
The following diagram shows common types of DDR3 memory modules.
Supports up to 256GB total of U/RDDR3 and LV RDDR3 at 800,1066 or 1333MHz
speeds
All installed memory will automatically be detected and no jumpers or settings need
changing
All memory must be of the same type and density
Always populate the memory starting from CPU0_DIMMA2/B2/C2/D2 first
Recommended Memory Population Table
Table-1: Per channel populations options for S8232
DIMM0 DIMM1 DIMM2 Max Memory Speed
A0,B0,C0,D0 A1,B1,C1,D1 A2,B2,C2,D2 1.5V 1.35V
Max
Capacity
/Channel
U-DIMM
Empty, SR or
DR
SR or DR 1333MHz 1333MHz 8GB
Empty, SR or
DR
Empty SR or DR 1333MHz 1333MHz 16GB
SR SR SR 1066MHz 1066MHz 12GB
Empty QR Empty 1066MHz 1066MHz 16GB
SR or DR SR or DR DR 1066MHz 800MHz 24GB
Empty QR SR or DR 800MHz 800MHz 32GB
R-DIMM
SR or DR QR SR or DR 800MHz 667MHz 32GB
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Table-2: Recommended memory population guide for Optimal performance
CPU0 CPU0 and CPU1
Quantity of
memory installed
4 8 12 8 16 24
CPU0_Channel A_A0
√ √
√ √
CPU0_Channel A_A1
√
√
CPU0_Channel A_A2
√ √ √ √ √ √
CPU0_Channel B_B0
√ √
√ √
CPU0_Channel B_B1
√
√
CPU0_Channel B_B2
√ √ √ √ √ √
CPU0_Channel C_C0
√ √
√ √
CPU0_Channel C_C1
√
√
CPU0_Channel C_C2
√ √ √ √ √ √
CPU0_Channel D_D0
√ √
√ √
CPU0_Channel D_D1
√
√
CPU0_Channel D_D2
√ √ √ √ √ √
CPU1_Channel A_A0
√ √
CPU1_Channel A_A1
√
CPU1_Channel A_A2
√ √ √
CPU1_Channel B_B0
√ √
CPU1_Channel B_B1
√
CPU1_Channel B_B2
√ √ √
CPU1_Channel C_C0
√ √
CPU1_Channel C_C1
√
CPU1_Channel C_C2
√ √ √
CPU1_Channel D_D0
√ √
CPU1_Channel D_D1
√
CPU1_Channel D_D2
√ √ √
NOTE: S8232 Memory Configuration Guidelines For Optimal Memory Performance
1. √ indicates a populated DIMM slot.
2. Paired memory installation for Max performance.
3. Populate the same DIMM type in each channel, specifically
- Use the same DIMM size
- Use the same # of ranks per DIMM
4. Dual-rank DIMMs are recommended over single-rank DIMMs.
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Memory Installation Procedure
Follow these instructions to install memory modules into the S8232.
1. Press the locking levers in the direction shown in the following illustration.
2. Align the memory module with the socket. The memory module is keyed to fit
only one way in the socket.
3. Seat the module firmly into the socket by gently pressing down until it sits
flush with the socket. The locking levers pop up into place.
KEY SLOT
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2.8 Attaching Drive Cables
Attaching Serial ATA Cables
S8232 is equipped with (6) SATA ports. Connections for the drives are very simple.
There is no need to set Master/Slave jumpers on SATA drives.
If you are in need of SATA/SAS cables or power adapters please contact your place
of purchase.
The following pictures illustrate how to connect an SATA drive.
1. SATA drive cable
connection
2. SATA drive power connection
3. SATA cable motherboard
connector
4. SATA drive power adapter
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2.9 Installing Add-In Cards
Before installing add-in cards, it’s helpful to know if they are fully compatible with
your motherboard. For this reason, we’ve provided the diagrams below, showing
the slots that may appear on your motherboard.
PCI-E Gen. 2 x 16 slot (x16 link)
PCI-E Gen. 2 x8 slot (x4 link)
PCI 32/33MHz slot
Simply find the appropriate slot for your add-in card and insert the card firmly. Do
not force any add-in cards into any slots if they do not seat in place. It is better to try
another slot or return the faulty card rather than damaging both the motherboard
and the add-in card.
TIP: It’s a good practice to install add-in cards in a staggered manner rather than
making them directly adjacent to each other. Doing so allows air to circulate within
the chassis more easily, thus improving cooling for all installed devices.
NOTE: You must always unplug the power connector to the motherboard
before performing system hardware changes to avoid damaging the board
or expansion device.
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2.10 Connecting External Devices
Connecting external devices to the motherboard is an easy task. The motherboard
supports a number of different interfaces through connecting peripherals. See the
following diagrams for the details.
NOTE: Peripheral devices can be plugged straight into any of these
ports but software may be required to complete the installation.
Onboard LAN LED Color Definition
The two onboard Ethernet ports have green and yellow LEDs to indicate LAN status.
The chart below illustrates the different LED states.
10/100/1000 Mbps LAN Link/Activity LED Scheme
Left LED Right LED
Link Green Off
10 Mbps
Active Blinking Green Off
Link Green Green
100 Mbps
Active Blinking Green Green
Link Green Yellow
1000 Mbps
Active Blinking Green Yellow
No Link Off Off
USB x 2
VGA
LAN2
(Intel
82576
)
LAN4
(Intel
COM
LAN3 (Intel 82576)
LAN1 (Intel 82576)
Share with IPMI
USB x 2
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2.11 Installing the Power Supply
There are three power connectors on your S8232. It is required that you have an
EPS12V power supply which has one 24-pin, two 8-pin and one 4-pin connectors.
24-pin (PW1)
Signal Pin Pin Signal
+3.3V 1 13 +3.3V
+3.3V 2 14 -12V
GND 3 15 GND
+5V 4 16 PS_ON
GND 5 17 GND
+5V 6 18 GND
GND 7 19 GND
PS_GD 8 20 N/C
5VSB 9 21 +5V
+12V 10 22 +5V
+12V 11 23 +5V
+3.3V 12 24 GND
8-pin (PW2, PW3)
Signal Pin Pin Signal
GND 1 5 +12V
GND 2 6 +12V
GND 3 7 +12V
GND 4 8 +12V
4-pin (PW4)
Signal Pin Pin Signal
GND 1 2 GND
+12V 3 4 +12V
NOTE: Please be aware that ATX 2.x, ATX12V and ATXGES power
supplies may not
be compatible with the board and can damage the
motherboard and/or CPU(s).
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Applying power to the board:
Connect the EPS/12V 24-pin power connector.
Connect the EPS12V 8-pin power connectors. Both PW2 and PW3 are for
CPU loading.
Connect the EPS/12V 4-pin power connector.
Connect power cable to power supply and power outlet.
NOTE: You must unplug the power supply before plugging the power
cables to motherboard connectors.
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2.12 Finishing Up
Congratulations on making it this far! You have finished setting up the hardware
aspect of your computer. Before closing up your chassis, make sure that all cables
and wires are connected properly, especially IDE cables and most importantly,
jumpers. You may have difficulty powering on your system if the motherboard
jumpers are not set correctly.
In the rare circumstance that you have experienced difficulty, you can find help by
asking your vendor for assistance. If they are not available for assistance, please
find setup information and documentation online at our website or by calling your
vendor’s support line.
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Chapter 3: BIOS Setup
3.1 About the BIOS
The BIOS is the basic input/output system, the firmware on the motherboard that
enables your hardware to interface with your software. The BIOS determines what a
computer can do without accessing programs from a disk. The BIOS contains all
the code required to control the keyboard, display screen, disk drives, serial
communications, and a number of miscellaneous functions. This chapter describes
the various BIOS settings that can be used to configure your system.
The BIOS section of this manual is subject to change without notice and is provided
for reference purposes only. The settings and configurations of the BIOS are
current at the time of print and are subject to change, and therefore may not match
exactly what is displayed on screen.
This section describes the BIOS setup program. The setup program lets you modify
basic configuration settings. The settings are then stored in a dedicated, batterybacked memory (called NVRAM) that retains the information even when the power
is turned off.
To start the BIOS setup utility:
1. Turn on or reboot your system.
2. Press <Del> during POST (F4 on remote console) to start the BIOS setup
utility.
3.1.1 Setup Basics
The table below shows how to navigate in the setup program using the keyboard.
Key Function
Tab Moves from one selection to the next
Left/Right Arrow Keys Changes from one menu to the next
Up/Down Arrow Keys Moves between selections
Enter Opens highlighted section
PgUp/PgDn Keys Changes settings.
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3.1.2 Getting Help
Pressing [F1] will display a small help window that describes the appropriate
keys to use and the possible selections for the highlighted item. To exit the Help
Window, press [ESC] or the [F1] key again.
3.1.3 In Case of Problems
If you have trouble booting your computer after making and saving the changes with
the BIOS setup program, you can restart the computer by holding the power button
down until the computer shuts off (usually within 4 seconds); resetting by pressing
CTRL-ALT-DEL; or clearing the CMOS.
The best advice is to only alter settings that you thoroughly understand. In particular,
do not change settings in the Chipset section unless you are absolutely sure of
what you are doing. The Chipset defaults have been carefully chosen either by
MiTAC or your system manufacturer for best performance and reliability. Even a
seemingly small change to the Chipset setup options may cause the system to
become unstable or unusable.
3.1.4 Setup Variations
Not all systems have the same BIOS setup layout or options. While the basic look
and function of the BIOS setup remains more or less the same for most systems,
the appearance of your Setup screen may differ from the charts shown in this
section. Each system design and chipset combination requires a custom
configuration. In addition, the final appearance of the Setup program depends on
the system designer. Your system designer may decide that certain items should
not be available for user configuration, and remove them from the BIOS setup
program.
NOTE: The following pages provide the details of BIOS menu. Please be
noticed that the BIOS menu are continually changing due to the BIOS
updating. The BIOS menu provided are the most updated ones when this
manual is written. Please visit TYAN’s website at http://www.tyan.com for
the information of BIOS updating.
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3.2 Main Menu
In this section, you can alter general features such as the date and time.
Note that the options listed below are for options that can directly be changed within
the Main Setup screen.
AMIBIOS
It displays the core number, date of BIOS build and the version of BIOS.
Processor
This displays the CPU information.
System Memory
This displays the amount of system memory present on the system.
System Time / Date setup
System Time: Adjusts the system clock.
HH (24 hours format): MM (Minutes): SS (Seconds)
System Date: Adjusts the system date.
MM (Months): DD (Days): YYYY (Years)
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3.3 Advanced Menu
This section facilitates configuring advanced BIOS options for your system.
CPU Configuration
Configure CPU.
IDE Configuration
Configure the IDE devices.
Super IO Configuration
Configure the Super IO.
ACPI Configuration
Selection for Advanced ACPI Configuration.
Hardware Health Configuration
Configure / monitor the Hardware Health.
IPMI 2.0 Configuration
IPMI configuration including server monitoring and event log.
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MPS Configuration
Configure the Multi-Processor Table.
PCI Express Configuration
Configure PCI Express Support.
Remote Access Configuration
Configure Remote Access.
USB Configuration
Configure the USB support.
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3.3.1 Advanced CPU Configuration
This section allows you to fine-tune the processor options.
GART Error Reporting
This option should remain disabled for normal operation. The driver developer may
enable it for the purpose of testing.
Disabled / Enabled
Microcode Update
Disabled / Enabled
Secure Virtual Machine Mode
Disabled / Enabled
PowerNow
Enable/disable the generation of ACPI_PPC, _PSS, and _PCT objects.
Disabled / Enabled
PowerCap
The option can decide the highest performance P-state in OS.
P-state 0 / P-state 1 / P-state 2 / P-state 3 / P-state 4
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ACPI SRAT Table
Enable or disable the building of ACPI SRAT Table.
Disabled / Enabled
CPU Prefetching
Enable or disable CPU prefetching.
Disabled / Enabled
IO Prefetching
Enable or disable IO prefetching.
Disabled / Enabled
Probe Filter
Initialization mode for Probe Filter.
Auto / Disable / MP Mode
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3.3.2 Advanced IDE Configuration
Onboard PCI IDE Controller
Disabled: disables the integrated IDE Controller
Primary: enables only the Primary IDE Controller
Secondary: enables only the Secondary IDE Controller
Both: enables both IDE Controller
Disabled / Primary / Secondary / Both
Primary/Secondary/Third/Fourth IDE Master
While entering setup, BIOS auto detects the presence of IDE devices. This
displays the status of auto detection of IDE devices.
Hard Disk Write Protect
Disable/Enable device write protection. This will be effective only if device is
accessed through BIOS.
Disabled / Enabled
IDE Detect Time Out (Sec)
Select the time out value for detecting ATA/ATAPI device(s).
0~35 (at 5 interval)
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ATA(PI) 80Pin Detection
Select the mechanism for detecting 80Pin ATA(PI) Cable.
Host & Device / Host / Device
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3.3.3 Super I/O Configuration
Serial Port1 Address
Allows BIOS to configure Serial Port1 Base Address.
Disabled / 3F8/IRQ4 / 2E8/IRQ3
Serial Port2 Address
Allows BIOS to configure Serial Port2 Base Address.
Disabled / 2F8/IRQ3 / 2E8/IRQ3
Serial Port2 Mode
Allows BIOS to select mode for Serial Port2.
Normal / IrDA / Ask IR
Parallel Port Address
Allows BIOS to select Parallel Port Base Address.
Disabled / 378 / 278 / 3BC
Parallel Port Mode
Allows BIOS to select mode for Parallel Port.
Normal / IrDA / Ask IR
Parallel Port IRQ
Allows BIOS to select Parallel Port IRQ
IRQ7 / IRQ5
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3.3.4 ACPI Configuration
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3.3.4.1 Advanced ACPI Configuration
ACPI Version Features
Set this value to allow or prevent the system to be complaint with the ACPI 2.0
specification.
ACPI 3.0 / ACPI 2.0 / ACPI 1.0
ACPI APIC Support
This option allows you to define whether or not to enable APIC features.
Enabled / Disabled
AMI OEMB Table
Set this value to allow the ACPI BIOS to add a pointer to an OEMB table in the Root
System Description Table (RSDT) table.
Enabled / Disabled
NOTE: OEMB table is used to pass POST data to the AMI code
during ACPI O/S operations.
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Headless Mode
Enable or disable Headless operation mode through ACPI.
Disabled / Enabled
C1E Support
Enhanced C1 state support.
Disabled / Enabled
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3.3.5 Hardware Health Configuration
Smart FAN Configuration
Select Smart FAN mode:
- Disable:
- Smart Fan: fan speed up as temperature goes up
Smart Fan / Disabled
Sensor Data Register Monitoring
Sensor Monitoring for BMC
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3.3.5.1 Sensor Data Register Monitoring
Read only. It can not be modified in user mode.
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3.3.6 IPMI 2.0 Configuration
View BMC System Event Log
View all events in the BMC Event Log. It will take a max. of 15 seconds to read all
BMC SEL records.
Clear BMC System Event Log
Clear all events in BMC System Event Log.
Set LAN Configuration
Set LAN Configuration Parameters Command.
Set PEF Configuration
Set PEF Configuration Parameters Command.
BMC Watch Dog Timer Action
Allows the BMC to reset or power down the system if the operating system crashes
or hangs.
Disabled / Enabled
BMC Alert LED and Beep
BMC Alert LED and Beep.
OFF / ON
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FW Key
Enter IPMI FW Key upgrade to IPMI or iKVM function.
[0000000]
3.2.6.1 View BMC System Event Log
Read only. It can not be modified in user mode.
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3.2.6.2 LAN Configuration
Read only. It can not be modified in user mode.
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3.2.6.2.1 Setup LAN Configuration
IP Address Source
Select IPMI IP Address Source.
STATIC / DHCP
NOTE:
IP Address and Subnet Mask appear when IP Address Source is
set to [STATIC].
IP Address / Subnet Mask
Read only. It can not be modified in user mode.
Save LAN Configuration
After setup LAN Configuration, select Save LAN Configuration and click [OK] to
enable changes.
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3.2.6.3 Set PEF Configuration
PEF Support
Enable or disable PEF support.
Enabled / Disabled
PEF Action Global Control
Select action for PEF Action Global Control.
Alert / Power Down / Reset System / Power Cycle / OEM Action /
Diagnostic. Int.
Alert Startup Delay
Enable/disable Alert Startup Delay.
Disabled / Enabled
Startup Delay
Enable/disable Startup Delay.
Disabled / Enabled
Event Message For PEF Action
Enable/disable Event Message for PEF Action.
Disabled / Enabled
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3.3.7 MPS Configuration
MPS Revision
Select MPS Revision.
1.4 / 1.1
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3.3.8 PCI-Express Configuration
Relax Ordering
Enables / Disables PCI Express Device Relaxed Ordering.
Auto / Disabled / Enabled
Maximum Payload Size
Set Maximum Payload of PCI Express Device or allow System BIOS select the
value.
Auto / Disabled
Extended Tag Field
If Enabled, allows Device to use 8-bit Tag field as a requester.
Auto / Disabled
No Snoop
Enables/Disables PCI Express Device No Snoop option.
Auto / Disabled
Maximum Read Request Size
Set Maximum Read Request Size of PCI Express Device or allow System BIOS
select the value.
Auto / Disabled
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Active State Power Management
Enable/disable PCI Express L0s AND L1 link power states.
Disabled / Enabled
Extended Synch
If enabled, allows generation of Extended Synchronization patterns.
Auto / Disabled
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3.3.9 Remote Access Configuration
Remote Access
Enables remote access to system through serial port.
Disabled / Enabled
NOTE:
The following BIOS items are available only when Remove Access is set
to [Enabled].
Serial Port Number
Select Serial Port for cosole redirection. Make sure the selected port is enabled.
COM1 / COM2 / COM3 (virtual for BMC)
Serial Port Mode
Select Serial Port settings.
Flow Control
Select Flow Control for console redirection.
None / Hardware / Software
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Redirection After BIOS POST
Disabled: Turns off the redirection after POST Boot Loader.
Boot Loader: Redirection is active during POST and during Boot Loader.
Always: Redirection is always active. (Some Oss may not work if set to Always)
Always / Disabled / Boot Loader
Terminal Type
Select the target terminal type.
ANSI / VT100 / VT-UTF8
VT-UTF8 Combo Key Support
Enable VT-UFT8 Combination Key Support for ANSI/VT100 terminals.
Enabled / Disabled
Sredir Memory Display Delay
Gives the delay in seconds to display memory information.
No Delay / Delay 1 Sec / Delay 2 Sec / Delay 4 Sec
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3.3.10 USB Configuration
Legacy USB Support
Enables support for legacy USB. AUTO option disables legacy support if no USB
devices are connected.
Enabled / Disabled / Auto
USB 2.0 Controller Mode
Configure the USB 2.0 controller in Hi Speed (480 Mbps) or Full Speed (12Mbps).
Hi Speed / Full Speed
BIOS EHCI Hand-OFF
This is a work around for OSes without EHCI hand-off support. The EHCI
ownership change should claim by EHCI driver.
Enabled / Disabled
Legacy USB1.1 HC Support
Enables support for legacy USB. Auto option disables legacy support if no USB
devices are connected.
Enabled / Disabled
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3.4 PCI/PnP Menu
Clear NVRAM
Clear NVRAM during system Boot.
No / Yes
Plug & Play O/S
No: lets the BIOS configure all the devices in the system.
Yes: lets the operating system configure Plug and Play (PnP) devices not required
for boot if your system has a Plug and Play operating system.
No / Yes
PCI Latency Timer
This setting controls how many PCI clocks each PCI device can hold the bus before
another PCI device takes over. When set to higher values, every PCI device can
conduct transactions for a longer time and thus improve the effective PCI bandwidth.
Values in units of PCI clocks for PCI device latency timer register
64 / 32 / 96 / 128 / 160 / 192 / 224 / 248
Allocate IRQ to PCI VGA
Yes: assigns IRQ to PCI VGA card if card requests IRQ.
Yes / No
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Palette Snooping
This is the default setting and should not be changed unless the VGA card
manufacturer requires Palette Snooping to be Enabled.
Enabled: informs the PCI devices that an ISA graphics device is installed in the
system so the card will function correctly.
Disabled / Enabled
PCI IDE Bus Master
Enabled: BIOS uses PCI bus mastering for reading / writing to IDE drives.
Enabled / Disabled
Offboard PCI/ISA IDE Card
Some PCI IDE cards may require this to be set to the PCI slot number that is
holding the card.
Auto: Works for most PCI IDE cards.
Auto / PCI Slot 1 / PCI Slot 2 / PCI Slot 3 / PCI Slot 4/ PCI Slot 5 /
PCI Slot 6
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3.5 Boot Menu
Quick Boot
This option allows user bypass BIOS self test during POST.
Enabled / Disabled
Quiet Boot
Disabled: displays normal POST messages.
Enabled: displays OEM log instead of POST messages.
Disabled / Enabled
Add On ROM Display Mode
Allows user to force BIOS/Option ROM of add-on cards to be displayed during quiet
boot.
Force BIOS / Keep Current
Boot Up Num-Lock
Selects Power-on state for Numlock.
On / Off
PS/2 Mouse Support
Select support for PS/2 Mouse.
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Auto / Enabled / Disabled
Wait for ‘F1’ If Error
Waits for F1 key to be present if error occurs.
Enabled / Disabled
Hit ‘DEL’ Message Display
Displays “Press DEL to run Setup in POST”.
Enabled / Disabled
Interrupt 19 Capture
Enabled: allows option ROMs to trap interrupt 19.
Enabled / Disabled
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3.6 Security Menu
Supervisor Password/User Password
Read only.
Change Supervisor Password
Install or change the password.
Change User Password
Install or change the password.
Boot Sector Virus Protection
When it is set to [Enabled], BIOS will issue a virus warning message and beep if a
write to the boot sector or the partition table of the HDD is attempted.
Disabled / Enabled
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3.6.1 Trusted Computing
TCG/TPM Support
Enable / Disable TPM TCG (TPM 1.1/1.2) support in BIOS.
No / Yes
Execute TPM Command
Enable (Activate) / Disable (Deactivate) Command to TPM.
Don’t change / Disable / Enable
Clearing the TPM
Clear TPM state to manufacture state.
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3.7 Chipset Menu
This menu allows you to change the NorthBridge, SouthBridge and RD890
Configuration.
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3.7.1 North Bridge Configuration
Memory Timing Parameters
To select which node’s timing parameters to display.
CPU Node 0 / CPU Node 1
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3.7.1.1 Memory Configuration
Bank Interleaving
Bank Interleave setting has to do with the actual RAM chip properties, most good
quality RAM chips have "4-bank interleaving" and work best at this setting. Interleaving controls how actual hits to memory takes place.
Enable Bank Memory Interleaving.
Auto / Disabled
Node Interleaving
Enable Node Memory Interleaving.
Disabled / Enabled
Channel Interleaving
Enable Channel Memory Interleaving.
Auto / Disabled
CS Sparing Enable
Reserve a spare memory rank in each node.
Disabled / Enabled
Bank Swizzle Mode
Enable or disable bank swizzle mode.
Enabled / Disabled
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3.7.1.2 ECC Configuration
ECC Mode
Select the level of ECC protection. Note: The “Super” ECC mode dynamically sets
the DRAM scrub rate so all of memory is scrubbed in 8 hours.
Basic / Super / Disabled / Good / Max / User
DRAM ECC Enable
DRAM ECC allows hardware to report and correct memory errors automatically
maintaining system integrity.
Enabled / Disabled
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3.7.1.3 DRAM Timing Configuration
DRAM Timing Config
Select the DRAM Frequency programming method. If Auto, the DRAM speed will
be based on SPDs. If Limit, the DRAM speed will not exceed the specified value. If
Manual, the DRAM speed specified will be programmed by users.
Auto / Manual / Limit
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3.7.2 South Bridge Configuration
OnChip SATA Channel
Enable or disable OnChip SATA channel.
Enabled / Disabled
OnChip SATA Type
Select OnChip SATA type.
Native IDE / RAID / AHCI
SATA IDE Combined Mode
Disabled / Enabled
PATA Channel Config
SATA as primary / SATA as seondary
Power Saving Features
Enable/Disable power saving features in SB. As general rule, this feature should be
disabled for desktop and enabled for mobile. See AMD SB700 Power Saving
document for more details.
Enabled / Disabled
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3.7.3 RD890 Configuration
IOMMU
Disable or Enable IOMMU function.
Disabled / Enabled
Primary Video Controller
PCIE GFX-PCI GFX: Video card scan from PCIE bus to PCI bus.
PCI GFX-PCIE GFX: Video card scan from PCI bus (onboard VGA) to PCIE bus.
PCIE GFX-PCI GFX / PCI GFX-PCIE GFX
Select PCI-E slot1/2 mode
Auto: auto detect by BIOS
1x16: Slot1 – x16, Slot2 – not work
2x8: Slot1 – x8, Slot2 – x8
Auto / 1x16 / 2x8
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3.8 Exit Menu
Save Changes and Exit
Use this option to exit setup utility and re-boot.
All new selections you have made are stored into CMOS.
System will use the new settings to boot up.
Discard Changes and Exit
Use this option to exit setup utility and re-boot.
All new selections you have made are not stored into CMOS.
System will use the old settings to boot up.
Discard Changes
Use this option to restore all new setup values that you have made but not saved
into CMOS.
Load Optimal Defaults
Use this option to load default performance setup values.
Use this option when system CMOS values have been corrupted or modified
incorrectly.
Load Failsafe Defaults
Use this option to load all default failsafe setup values.
Use this option when troubleshooting.
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Chapter 4: Diagnostics
NOTE: if you experience problems with setting up your system, always check the
following things in the following order:
Memory, Video, CPU
By checking these items, you will most likely find out what the problem might have
been when setting up your system. For more information on troubleshooting, check
the TYAN website at http://www.tyan.com
.
4.1 Beep Codes
Fatal errors, which halt the boot process, are communicated through two kinds of
audible beeps.
Eight short beeps: It indicates that a video error has occurred.
A single long beep repeatedly: It indicates that a DRAM error has occurred.
The most common type of error is a memory error.
Before contacting your vendor or TYAN Technical Support, be sure that you note as
much as you can about the beep code length and order that you experience. Also,
be ready with information regarding add-in cards, drives and O/S to speed the
support process and come to a quicker solution.
4.2 Flash Utility
Every BIOS file is unique for the motherboard it was designed for. For Flash
Utilities, BIOS downloads, and information on how to properly use the Flash Utility
with your motherboard, please check the TYAN web site at http://www.tyan.com
NOTE: Please be aware that by flashing your BIOS, you agree that in the
event of a BIOS flash failure, you must contact your dealer for a replacement
BIOS. There are no exceptions. TYAN does not have a policy for replacing
BIOS chips directly with end users. In no event will TYAN be held responsible
for damages done by the end user.
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4.3 AMIBIOS Post Code
The POST code checkpoints are the largest set of checkpoints during the BIOS preboot process. The following table describes the type of checkpoints that may occur
during the POST portion of the BIOS:
Checkpoint Description
03 Disable NMI, Parity, video for EGA, and DMA controllers. Initialize
BIOS, POST, Runtime data area. Also initialize BIOS modules on
POST entry and GPNV area. Initialized CMOS as mentioned in the
Kernel Variable "wCMOSFlags."
04 Check CMOS diagnostic byte to determine if battery power is OK and
CMOS checksum is OK. Verify CMOS checksum manually by
reading storage area. If the CMOS checksum is bad, update CMOS
with power-on default values and clear passwords. Initialize status
register A.
Initializes data variables that are based on CMOS setup questions.
Initializes both the 8259 compatible PICs in the system
05 Initializes the interrupt controlling hardware (generally PIC) and
interrupt vector table.
06 Do R/W test to CH-2 count reg. Initialize CH-0 as system timer.Install
the POSTINT1Ch handler. Enable IRQ-0 in PIC for system timer
interrupt.
Traps INT1Ch vector to "POSTINT1ChHandlerBlock."
08 Initializes the CPU. The BAT test is being done on KBC. Program
the keyboard controller command byte is being done after Auto
detection of KB/MS using AMI KB-5.
0A Initializes the 8042 compatible Key Board Controller.
0B Detects the presence of PS/2 mouse.
0C Detects the presence of Keyboard in KBC port.
0E Testing and initialization of different Input Devices. Also, update the
Kernel Variables.
Traps the INT09h vector, so that the POST INT09h handler gets
control for IRQ1. Uncompress all available language, BIOS logo, and
Silent logo modules.
13 Early POST initialization of chipset registers.
24 Uncompress and initialize any platform specific BIOS modules.
30 Initialize System Management Interrupt.
2A Initializes different devices through DIM.
See DIM Code Checkpoints section of document for more information.
2C Initializes different devices. Detects and initializes the video adapter
installed in the system that have optional ROMs.
2E Initializes all the output devices.
31 Allocate memory for ADM module and uncompress it. Give control to
ADM module for initialization. Initialize language and font modules for
ADM. Activate ADM module.
33 Initializes the silent boot module. Set the window for displaying text
information.
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Checkpoint Description
37 Displaying sign-on message, CPU information, setup key message,
and any OEM specific information.
38 Initializes different devices through DIM. See DIM Code Checkpoints
section of document for more information.
39 Initializes DMAC-1 & DMAC-2.
3A Initialize RTC date/time.
3B Test for total memory installed in the system. Also, Check for DEL or
ESC keys to limit memory test. Display total memory in the system.
3C Mid POST initialization of chipset registers.
40 Detect different devices (Parallel ports, serial ports, and coprocessor
in CPU, … etc.) successfully installed in the system and update the
BDA, EBDA…etc.
50 Programming the memory hole or any kind of implementation that
needs an adjustment in system RAM size if needed.
52 Updates CMOS memory size from memory found in memory test.
Allocates memory for Extended BIOS Data Area from base memory.
60 Initializes NUM-LOCK status and programs the KBD typematic rate.
75 Initialize Int-13 and prepare for IPL detection.
78 Initializes IPL devices controlled by BIOS and option ROMs.
7A Initializes remaining option ROMs.
7C Generate and write contents of ESCD in NVRam.
84 Log errors encountered during POST.
85 Display errors to the user and gets the user response for error.
87 Execute BIOS setup if needed / requested.
8C Late POST initialization of chipset registers.
8E Program the peripheral parameters. Enable/Disable NMI as selected
90 Late POST initialization of system management interrupt.
A0 Check boot password if installed.
A1 Clean-up work needed before booting to OS.
A2 Takes care of runtime image preparation for different BIOS modules.
Fill the free area in F000h segment with 0FFh. Initializes the
Microsoft IRQ Routing Table. Prepares the runtime language module.
Disables the system configuration display if needed.
A4 Initialize runtime language module.
A7 Displays the system configuration screen if enabled. Initialize the
CPU’s before boot, which includes the programming of the MTRR’s.
A8 Prepare CPU for OS boot including final MTRR values.
A9 Wait for user input at config display if needed.
AA Uninstall POST INT1Ch vector and INT09h vector. Deinitializes the
ADM module.
AB Prepare BBS for Int 19 boot.
AC End of POST initialization of chipset registers.
B1 Save system context for ACPI.
00 Passes control to OS Loader (typically INT19h).
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NOTE
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Glossary
ACPI (Advanced Configuration and Power Interface): a power management
specification that allows the operating system to control the amount of power
distributed to the computer’s devices. Devices not in use can be turned off, reducing
unnecessary power expenditure.
AGP (Accelerated Graphics Port): a PCI-based interface which was designed
specifically for demands of 3D graphics applications. The 32-bit AGP channel
directly links the graphics controller to the main memory. While the channel runs
only at 66 MHz, it supports data transmission during both the rising and falling ends
of the clock cycle, yielding an effective speed of 133 MHz.
ATAPI (AT Attachment Packet Interface): also known as IDE or ATA; a drive
implementation that includes the disk controller on the device itself. It allows CDROMs and tape drives to be configured as master or slave devices, just like HDDs.
ATX: the form factor designed to replace the AT form factor. It improves on the AT
design by rotating the board 90 degrees, so that the IDE connectors are closer to
the drive bays, and the CPU is closer to the power supply and cooling fan. The
keyboard, mouse, USB, serial, and parallel ports are built-in.
Bandwidth: refers to carrying capacity. The greater the bandwidth, the more data
the bus, phone line, or other electrical path can carry. Greater bandwidth results in
greater speed.
BBS (BIOS Boot Specification): a feature within the BIOS that creates, prioritizes,
and maintains a list of all Initial Program Load (IPL) devices, and then stores that
list in NVRAM. IPL devices have the ability to load and execute an OS, as well as
provide the ability to return to the BIOS if the OS load process fails. At that point,
the next IPL device is called upon to attempt loading of the OS.
BIOS (Basic Input/Output System): the program that resides in the ROM chip,
which provides the basic instructions for controlling your computer’s hardware. Both
the operating system and application software use BIOS routines to ensure
compatibility.
Buffer: a portion of RAM which is used to temporarily store data; usually from an
application though it is also used when printing and in most keyboard drivers. The
CPU can manipulate data in a buffer before copying it to a disk drive. While this
improves system performance (reading to or writing from a disk drive a single time
is much faster than doing so repeatedly) there is the possibility of losing your data
should the system crash. Information in a buffer is temporarily stored, not
permanently saved.
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Bus: a data pathway. The term is used especially to refer to the connection
between the processor and system memory, and between the processor and PCI or
ISA local buses.
Bus mastering: allows peripheral devices and IDEs to access the system memory
without going through the CPU (similar to DMA channels).
Cache: a temporary storage area for data that will be needed often by an
application. Using a cache lowers data access times since the information is stored
in SRAM instead of slower DRAM. Note that the cache is also much smaller than
your regular memory: a typical cache size is 512KB, while you may have as much
as 4GB of regular memory.
Closed and open jumpers: jumpers and jumper pins are active when they are “on”
or “closed”, and inactive when they are “off” or “open”.
CMOS (Complementary Metal-Oxide Semiconductors): chips that hold the basic
startup information for the BIOS.
COM port: another name for the serial port, which is called as such because it
transmits the eight bits of a byte of data along one wire, and receives data on
another single wire (that is, the data is transmitted in serial form, one bit after
another). Parallel ports transmit the bits of a byte on eight different wires at the
same time (that is, in parallel form, eight bits at the same time).
DDR (Double Data Rate): a technology designed to double the clock speed of the
memory. It activates output on both the rising and falling edge of the system clock
rather than on just the rising edge, potentially doubling output.
DIMM (Dual In-line Memory Module): faster and more capacious form of RAM
than SIMMs, and do not need to be installed in pairs.
DIMM bank: sometimes called DIMM socket because the physical slot and the
logical unit are the same. That is, one DIMM module fits into one DIMM socket,
which is capable of acting as a memory bank.
DMA (Direct Memory Access): channels that are similar to IRQs. DMA channels
allow hardware devices (like soundcards or keyboards) to access the main memory
without involving the CPU. This frees up CPU resources for other tasks. As with
IRQs, it is vital that you do not double up devices on a single line. Plug-n-Play
devices will take care of this for you.
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DRAM (Dynamic RAM): widely available, very affordable form of RAM which
looses data if it is not recharged regularly (every few milliseconds). This refresh
requirement makes DRAM three to ten times slower than non-recharged RAM such
as SRAM.
ECC (Error Correction Code or Error Checking and Correcting): allows data to
be checked for errors during run-time. Errors can subsequently be corrected at the
same time that they’re found.
EEPROM (Electrically Erasable Programmable ROM): also called Flash BIOS, it
is a ROM chip which can, unlike normal ROM, be updated. This allows you to keep
up with changes in the BIOS programs without having to buy a new chip. TYAN
®
’s
BIOS updates can be found at http://www.tyan.com
ESCD (Extended System Configuration Data): a format for storing information
about Plug-n-Play devices in the system BIOS. This information helps properly
configure the system each time it boots.
Firmware: low-level software that controls the system hardware.
Form factor: an industry term for the size, shape, power supply type, and external
connector type of the Personal Computer Board (PCB) or motherboard. The
standard form factors are the AT and ATX.
Global timer: onboard hardware timer, such as the Real-Time Clock (RTC).
HDD: stands for Hard Disk Drive, a type of fixed drive.
H-SYNC: controls the horizontal synchronization/properties of the monitor.
HyperTransport
TM
: a high speed, low latency, scalable point-to-point link for
interconnecting ICs on boards. It can be significantly faster than a PCI bus for an
equivalent number of pins. It provides the bandwidth and flexibility critical for today's
networking and computing platforms while retaining the fundamental programming
model of PCI.
IC (Integrated Circuit): the formal name for the computer chip.
IDE (Integrated Device/Drive Electronics): a simple, self-contained HDD interface.
It can handle drives up to 8.4 GB in size. Almost all IDEs sold now are in fact
Enhanced IDEs (EIDEs), with maximum capacity determined by the hardware
controller.
IDE INT (IDE Interrupt): Hardware interrupt signal that goes to the IDE.
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I/O (Input/Output): the connection between your computer and another piece of
hardware (mouse, keyboard, etc.)
IRQ (Interrupt Request): an electronic request that runs from a hardware device to
the CPU. The interrupt controller assigns priorities to incoming requests and
delivers them to the CPU. It is important that there is only one device hooked up to
each IRQ line; doubling up devices on IRQ lines can lock up your system. Plug-nPlay operating systems can take care of these details for you.
Latency: the amount of time that one part of a system spends waiting for another
part to catch up. This occurs most commonly when the system sends data out to a
peripheral device and has to wait for the peripheral to spread (peripherals tend to
be slower than onboard system components).
NVRAM: ROM and EEPROM are both examples of Non-Volatile RAM, memory that
holds its data without power. DRAM, in contrast, is volatile.
Parallel port: transmits the bits of a byte on eight different wires at the same time.
PCI (Peripheral Component Interconnect): a 32 or 64-bit local bus (data pathway)
which is faster than the ISA bus. Local buses are those which operate within a
single system (as opposed to a network bus, which connects multiple systems).
PCI PIO (PCI Programmable Input/Output) modes: the data transfer modes used
by IDE drives. These modes use the CPU for data transfer (in contrast, DMA
channels do not). PCI refers to the type of bus used by these modes to
communicate with the CPU.
PCI-to-PCI Bridge: allows you to connect multiple PCI devices onto one PCI slot.
Pipeline burst SRAM: a fast secondary cache. It is used as a secondary cache
because SRAM is slower than SDRAM, but usually larger. Data is cached first to
the faster primary cache, and then, when the primary cache is full, to the slower
secondary cache.
PnP (Plug-n-Play): a design standard that has become ascendant in the industry.
Plug-n-Play devices require little set-up to use. Devices and operating systems that
are not Plug-n-Play require you to reconfigure your system each time you add or
change any part of your hardware.
PXE (Preboot Execution Environment): one of four components that together
make up the Wired for Management 2.0 baseline specification. PXE was
designed to define a standard set of preboot protocol services within a client with
the goal of allowing networked-based booting to boot using industry standard
protocols.
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RAID (Redundant Array of Independent Disks): a way for the same data to be
stored in different places on many hard drives. By using this method, the data is
stored redundantly and multiple hard drives will appear as a single drive to the
operating system. RAID level 0 is known as striping, where data is striped (or
overlapped) across multiple hard drives, but offers no fault-tolerance. RAID level 1
is known as mirroring, which stores the data within at least two hard drives, but
does not stripe. RAID level 1 also allows for faster access time and fault-tolerance,
since either hard drive can be read at the same time. RAID level 0+1 is striping and
mirroring, providing fault-tolerance, striping, and faster access all at the same time.
RAIDIOS: RAID I/O Steering (Intel)
RAM (Random Access Memory): technically refers to a type of memory where
any byte can be accessed without touching the adjacent data and is often referred
to the system’s main memory. This memory is available to any program running on
the computer.
ROM (Read-Only Memory): a storage chip which contains the BIOS; the basic
instructions required to boot the computer and start up the operating system.
SDRAM (Synchronous Dynamic RAM): called as such because it can keep two
sets of memory addresses open simultaneously. By transferring data alternately
from one set of addresses and then the other, SDRAM cuts down on the delays
associated with non-synchronous RAM, which must close one address bank before
opening the next.
Serial port: called as such because it transmits the eight bits of a byte of data
along one wire, and receives data on another single wire (that is, the data is
transmitted in serial form, one bit after another).
SCSI Interrupt Steering Logic (SISL): Architecture that allows a RAID controller,
such as AcceleRAID 150, 200 or 250, to implement RAID on a system boardembedded SCSI bus or a set of SCSI busses. SISL: SCSI Interrupt Steering Logic
(LSI) (only on LSI SCSI boards)
Sleep/Suspend mode: in this mode, all devices except the CPU shut down.
SDRAM (Static RAM): unlike DRAM, this type of RAM does not need to be
refreshed in order to prevent data loss. Thus, it is faster and more expensive.
SLI (Scalable Link Interface): NVIDIA SLI
technology links two graphics cards
together to provide scalability and increased performance. NVIDIA SLI takes
advantage of the increased
bandwidth of the PCI Express bus architecture, and
features
hardware and software innovations within NVIDIA GPUs (graphics
processing units) and NVIDIA MCPs (media and communications processors).
Depending on the application, NVIDIA SLI can deliver as much as two times the
performance of a single GPU configuration.
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Standby mode: in this mode, the video and hard drives shut down; all other
devices continue to operate normally.
UltraDMA-33/66/100: a fast version of the old DMA channel. UltraDMA is also
called UltraATA. Without a proper UltraDMA controller, your system cannot take
advantage of higher data transfer rates of the new UltraDMA/UltraATA hard drives.
USB (Universal Serial Bus): a versatile port. This one port type can function as a
serial, parallel, mouse, keyboard or joystick port. It is fast enough to support video
transfer, and is capable of supporting up to 127 daisy-chained peripheral devices.
VGA (Video Graphics Array): the PC video display standard
V-SYNC: controls the vertical scanning properties of the monitor.
ZCR (Zero Channel RAID): PCI card that allows a RAID card to use the onboard
SCSI chip, thus lowering cost of RAID solution
ZIF Socket (Zero Insertion Force socket): these sockets make it possible to insert
CPUs without damaging the sensitive CPU pins. The CPU is lightly placed in an
open ZIF socket, and a lever is pulled down. This shifts the processor over and
down, guiding it into the board and locking it into place.
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Technical Support
If a problem arises with your system, you should first turn to your dealer for direct
support. Your system has most likely been configured or designed by them and
they should have the best idea of what hardware and software your system
contains. Hence, they should be of the most assistance for you. Furthermore, if you
purchased your system from a dealer near you, take the system to them directly to
have it serviced instead of attempting to do so yourself (which can have expensive
consequences).
If these options are not available for you then TYAN® Computer Corporation can
help. Besides designing innovative and quality products for over a decade, TYAN
has continuously offered customers service beyond their expectations. TYAN®'s
website (www.tyan.com) provides easy-to-access FAQ searches and online
Trouble Ticket creation as well as Instant Chat capabilities with our Support Agents.
TYAN
®
also provides easy-to-access resources such as in-depth Linux Online
Support sections with downloadable Linux drivers and comprehensive compatibility
reports for chassis, memory and much more. With all these convenient resources
just a few keystrokes away, users can easily find the latest software and operating
system components to keep their systems running as powerful and productive as
possible. TYAN
®
also ranks high for its commitment to fast and friendly customer
support through email. By offering plenty of options for users, TYAN
®
serves
multiple market segments with the industry's most competitive services to support
them.
"TYAN's tech support is some of the most impressive we've seen, with great
response time and exceptional organization in general" - Anandtech.com
Help Resources:
1. See the beep codes section of this manual.
2. See the TYAN
®
website for FAQ’s, bulletins, driver updates,
and other information: http://www.tyan.com
3. Contact your dealer for help BEFORE calling TYAN
®
.
4. Check the TYAN
®
user group:
alt.comp.periphs.mainboard.TYAN
Returning Merchandise for Service
During the warranty period, contact your distributor or system vendor FIRST for any
product problems. This warranty only covers normal customer use and does not
cover damages incurred during shipping or failure due to the alteration, misuse,
abuse, or improper maintenance of products.
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NOTE:
A receipt or copy of your invoice marked with the date of purchase is
required before any warranty service can be rendered. You may obtain
service by calling the manufacturer for a Return Merchandise Authorization
(RMA) number. The RMA number Should be prominently displayed on the
outside of the shipping carton and the package should be mailed prepaid.
TYAN
®
will pay to have the board shipped back to you.
Notice for the USA
Compliance Information Statement (Declaration of
Conformity Procedure) DoC
FCC Part 15: This device complies with part 15 of the FCC
Rules
Operation is subject to the following conditions:
This device may not cause harmful interference, and this device must accept any
interference received including interference that may cause undesired operation. If
this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is
encouraged to try one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Plug the equipment into an outlet on a circuit different from that of the receiver.
Consult the dealer on an experienced radio/television technician for help.
Notice for Canada
This apparatus complies with the Class B limits for radio interference as specified in
the Canadian Department of Communications Radio Interference Regulations. (Cet
appareil est conforme aux norms de Classe B d’interference radio tel que specifie
par le Ministere Canadien des Communications dans les reglements d’ineteference
radio.)
CAUTION: Lithium battery included with this board. Do not puncture, mutilate, or
dispose of battery in fire. There is danger of an explosion if the battery is incorrectly
replaced. Replace only with the same or equivalent type recommended by
manufacturer. Dispose of used battery according to manufacturer instructions and
in accordance with your local regulations.
Document #: D2131-120
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