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S8212
Version 1.01
Copyright
Copyright © 2009 MiTAC International Corporation. All rights reserved. No part
of this manual may be reproduced or translated without prior written consent
from MiTAC International Corporation.
Trademark
All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.
®
is a trademark of MiTAC International Corporation.
TYAN
®
is a trademark of Intel® Corporation.
Intel
AMI, AMI BIOS are trademarks of AMI Technologies.
Microsoft
Winbond
®
, Windows® are trademarks of Microsoft Corporation.
®
is a trademark of Winbond Electronics Corporation.
Notice
Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to product descriptions and/or specifications
at any time, without notice. In no event will MiTAC be held liable for any direct
or indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.
®
products including liability or
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Contents
Before you begin… ............................................................................................. 3
Chapter 1: Instructions ........................................................................................ 4
1.1 Congratulations ....................................................................................... 4
1.2 Hardware Specifications ......................................................................... 4
1.3 AST2050 Application .............................................................................. 6
Chapter 2: Board Installation .............................................................................. 7
2.1 Board Image ........................................................................................... 8
2.2 Block Diagram ........................................................................................ 9
2.3 Board Parts, Jumpers and Connectors ................................................. 10
2.4 Installing the Processor ........................................................................ 18
2.5 Heat sink Installation ............................................................................. 24
2.6 Thermal Interface Material .................................................................... 26
2.7 Finishing Installing the Heat sink .......................................................... 27
2.8 Tips on Installing Motherboard in Chassis ............................................ 28
2.9 Installing the Memory ............................................................................ 30
2.10 Attaching Drive Cables ......................................................................... 33
2.11 Installin g Add-In Cards ......................................................................... 35
2.12 Installing I/O Shield ............................................................................... 36
2.13 Installing the Power Supply................................................................... 37
2.14 Finishing Up .......................................................................................... 38
Chapter 3: BIOS ............................................................................................... 39
3.1 About the BIOS ..................................................................................... 39
3.2 BIOS Main Menu .................................................................................. 41
3.3 BIOS Advanced Menu .......................................................................... 42
3.4 PCI/PnP Menu ...................................................................................... 59
3.5 Boot Menu ............................................................................................ 61
3.6 Security Menu ....................................................................................... 64
3.7 Chipset Menu ........................................................................................ 65
3.8 Power Menu .......................................................................................... 73
3.9 Exit Menu .............................................................................................. 74
Chapter 4: Diagnostics ..................................................................................... 75
4.1 Beep Codes .......................................................................................... 75
4.2 Flash Utility ........................................................................................... 75
4.3 AMIBIOS Post Code ............................................................................. 76
Glossary ........................................................................................................... 78
Technical Support ............................................................................................. 84
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Before you begin…
Check the box contents!
The retail motherboard package should contain the following:
S8212 motherboard
6 x SATA cable
2 x SAS cable (for S8212WGM3NR only)
USB2.0 cable
S8212 user’s manual
S8212 Quick Reference guide
TYAN® driver CD
I/O shield
2 x CPU Mounting Kit
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AMD 45nm Opteron™ 2300/2400 series
Socket Type / Q'ty
Average CPU
wattage
Quad-Core HT3 @ (17.6GB/s) 4.4GT/s
Six-Core HT3 @ (19.2GB/s) 4.8GT/s
IOH / SB
AMD SR5690(SR5670)/ SP5100
Super I/O
Winbond W83627DHG-P
Supported DIMM
Qty
DIMM Type /
Speed
Capacity
Up to 128GB
Memory channel
Dual Channel
Memory voltage
1.8V
Supports only up to 64GB of 800MHz
CPU)
(1) PCI-E x16 slot (w/ x16 or x8 link)
(1) PCI-E x8 slot (w/ x8 link)
Recommended
TYAN® Riser
PCI
(2) PCI 32-bit slots
Recommended
Barebones /
Chapter 1: Instructions
1.1 Congratulations
You have now purchased an ideal solution for your rack mount server needs.
The TYAN
and up to 128GB REG/ECC memory. The TYAN
GbE LAN ports, one IDE connector, 6 SATA-II connectors, 8 SAS connectors
and 8 USB ports. The S8212 offers exceptional performance for your server
platform needs.
Remember to visit TYAN®’s Website at http://www.tyan.com. There you can find
information on all of TYAN
and much, much more..
1.2 Hardware Specifications
Processor
®
S8212 supports Dual AMD Opteron 2300/2400 series processors
®
’s products including FAQs, Drivers, BIOS upgrades
Supported CPU
Series
Power (ACP)
System Bus
Quad-Core/Six-Core Processors/ Support
AMD HyperTransport (HT3) Technology
(2x) LGA 1207-pin socket
55W / 75W / 105W
®
S8212 is configured with 3
Chipset
Memory
Note:
Expansion
Slots
PCI-E
1U Barebones
(8+8) DIMM slots
Registered ECC DDR2 533/667/800
REG/ECC DDR2 memory (4 DIMMs per
(1) PCI-E x8 slot (w/ x0 or x8 link)
(1) PCI-E x8 slot (w/ x4 link)
M2083-RS, PCI-E x16 1U riser card (left)
GT24-B8212
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