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S8028
Version 1.00
Copyright
Copyright © MiTAC Computer Corporation, 2010. All rights reserved. No part of
this manual may be reproduced or translated without prior written consent from
MiTAC Computer Corp.
Trademark
All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.
TYAN® is a trademark of MiTAC Computer Corporation
®
, Opteron®, and combinations thereof are trademarks of AMD Corporation.
AMD
®
AMI
, AMIBIOS® and combinations thereof are trademarks of AMI Technologies.
®
Microsoft
Aspeed
, Windows® are trademarks of Microsoft Corporation.
®
is a trademark of Aspeed Technology Inc.
Notice
Information contained in this document is furnished by MiTAC Computer
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to product descriptions and/or specifications
at any time, without notice. In no event will MiTAC be held liable for any direct
or indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.
®
products including liability or
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Contents
Before you begin… .................................................................4
Chapter 1: Instruction ............................................................. 5
1.1 - Congratulations............................................................................... 5
1.2 - Hardware Specifications ................................................................. 5
1.3 - Software Specifications................................................................... 7
1.4 - AST2050 User Guide...................................................................... 7
Chapter 2: Board Installation ................................................. 9
2.1 - Board Image ................................................................................. 10
2.2 - Block Diagram .............................................................................. 11
2.3 - Board Parts, Jumpers and Connectors ......................................... 12
2.4 - Installing the Processor................................................................. 17
2.5 - Thermal Interface Material ............................................................ 22
2.6 - Tips on Installing Motherboard in Chassis ....................................23
2.7 - Installing the Memory.................................................................... 25
2.8 - Attaching Drive Cables ................................................................. 30
2.9 - Installing Add-In Cards.................................................................. 31
2.10 - Connecting External Devices...................................................... 32
2.11 - Installing the Power Supply......................................................... 33
2.12 - Finishing Up................................................................................ 34
Chapter 3: BIOS Setup .......................................................... 35
3.1 - About the BIOS............................................................................. 35
3.2 - BIOS Main Menu........................................................................... 37
3.3 - BIOS Advanced Menu .................................................................. 38
3.4 - PCI/PnP Menu .............................................................................. 57
3.5 - Boot Menu .................................................................................... 58
3.6 - Security Menu............................................................................... 61
3.7 - Chipset Menu................................................................................ 63
3.8 - Exit Menu...................................................................................... 70
Chapter 4: Diagnostics ......................................................... 71
4.1 - Beep Codes .................................................................................. 71
4.2 - Flash Utility ...................................................................................71
4.3 - AMIBIOS Post Code ..................................................................... 72
Glossary ................................................................................. 75
Technical Support ................................................................. 81
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Before you begin…
Check the box contents!
The retail motherboard package should contain the following:
1x S8028 Motherboard
1 x S8028 User’s manual
1 x S8028 Quick reference guide
1 x TYAN® Driver CD
http://www.TYAN.com
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Chapter 1: Instruction
1.1 - Congratulations
You have purchased one of the most powerful server solutions. Based on
the AMD® 45nm 8-Core/12-Core Opteron 6100 Series Processors, The
®
TYAN
S8028 series motherboard is designed to support one AMD®
Opteron™ 6100 series processor and up to 96GB RDDRIII and 64GB U
DDRIII of 800/1066/1333 MHz memory. There are also 4 channels with 12
DDRIII DIMMs, providing a rich feature set and incredible performance.
Leveraging the advanced technology from AMD®, the TYAN® S8028
series is capable of offering a scalable 32 and 64-bit computing
environment with high-bandwidth memory design and lightning-fast PCI-E
Gen2 bus implementation.
The S8028 not only empowers you in today’s demanding IT environment
but also offers a smooth path for future application upgradeability. All of
these rich feature sets provides the S8028 with the power and flexibility to
meet demanding requirements for today’s IT environments.
The TYAN S8028 series is designed around several different
configurations which are detailed in the following 1.2 Hardware
Specification section:
1.2 - Hardware Specifications
TYAN S8028 (S8028GM3NR)
AMD 45nm 8-Core/12-Core Opteron
6100 Series Processors (MagnyCours)
Up to 80W
Up to 6.4 GT/s Hyper-Transport link
support
U/RDDR3 & LV RDDR3,
800/1066/1333 MHz
Processor
Chipset
Memory
Supported CPU
Series
Socket Type / Qty G34 / (1)
Average CPU Power
(ACP) wattage
System Bus
Chipset AMD SR5650 + SP5100
Super I/O Winbond W83627DHG
Supported DIMM Qty (12) DIMM slots
DIMM Type / Speed
Capacity Up to 96GB RDIMM/ 64GB UDIMM
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Memory channel 4 Channels per CPU
Memory voltage 1.5V or 1.35V
Expansion Slots
Recommended
Barebone / Chassis
LAN
Storage SATA
Graphic
Input /Output
System Monitoring
PCI-E (1) PCI-E Gen.2 x16 slot
Recommended TYAN
Riser Card
1U Barebone YR190-B8028
Port Qty (3)
Controller Intel 82574L / Intel 82576EB
Connector (6) SATA
Controller AMD SP5100
Speed 3.0 Gb/s
RAID
Connector type D-Sub 15-pin
Resolution 1600x1200@60Hz
Chipset Aspeed AST2050
USB
COM (1) port (rear)
VGA (1) D-Sub 15-pin VGA port
RJ-45
Power
Front Panel (1) 2x12-pin SSI front panel header
PSMI (1) 1x5-pin header
SATA (6) SATA-II connectors
Chipset Winbond W83795G
Voltage
Fan Total (3) 8-pin headers
Temperature
LED
Others
Onboard Chipset Onboard Aspeed AST2050 Server Management
AST2050 IPMI
Feature
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M7018-R16-1L, 1U PCI-E x16 riser
card (right)
RAID 0/1/10/5 (Promise Integrated
Software RAID)
(5) USB2.0 ports (2 at rear, 2 via
cable, 1 type A onboard)
Total (3) GbE ports, (1) shared with
IPMI
Proprietary 20-pin (12V single input)
power connector
Monitors voltage for CPU, memory,
chipset & power supply
Monitors temperature for CPU &
system environment
Fan fail LED indicator / Over
temperature warning indicator / Fan
& PSU fail LED indicator
Chassis intrusion detection /
Watchdog timer support
IPMI 2.0 compliant baseboard
management controller (BMC) /
USB 2.0 virtual hub / BIOS update
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AST2050 iKVM
Feature
24-bit high quality video
compression / Dual 10/100 Mb/s
MAC interfaces
Brand / ROM size AMI / 4MB
Plug and Play (PnP) /PCI2.3
/WfM2.0 /SMBIOS2.3 /PXE boot /
BIOS
Feature
ACPI 2.0 power management
/Power on mode after power
recovery / User-configurable H/W
monitoring / Auto-configurable of
hard disk types
Physical Dimension
Form Factor Proprietary
Board Dimension 6.3"x16.4" (160.02x416.56mm)
Operating System OS supported list Coming soon
Regulation
FCC (DoC) Class B
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Operating
Environment
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
In/Non-operating
Humidity
90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint Yes
Motherboard (1) S8028 Motherboard
Package Contains
Manual
Installation CD
(1) Quick Ref. Guide in bulk packing
carton
(1) TYAN installation CD in bulk
packing carton
Instructions and images within this manual are represented S8028.
For different SKUs some variations in detail are possible.
Remember to visit TYAN
There you can find information on all of TYAN
®
’s Website at http://www.TYAN.com.
®
’s products with FAQs,
online manuals and BIOS upgrades and more.
1.3 - Software Specifications
For OS (operation system) support, please check the TYAN® website
for the latest information.
1.4 - AST2050 User Guide
Remember to visit TYAN®’s Website at http://www.TYAN.com for
AST2050 updated user guide.
http://www.TYAN.com
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Chapter 2: Board Installation
You are now ready to install your motherboard.
How to install our products right… the first time
The first thing you should do is reading this user’s manual. It contains
important information that will make configuration and setup much easier.
Here are some precautions you should take when installing your
motherboard:
(1) Ground yourself properly before removing your motherboard from
the antistatic bag. Unplug the power from your computer power
supply and then touch a safely grounded object to release static
charge (i.e. power supply case). For the safest conditions, TYAN®
recommends wearing a static safety wrist strap.
(2) Hold the motherboard by its edges and do not touch the bottom of
the board, or flex the board in any way.
(3) Avoid touching the motherboard components, IC chips,
connectors, memory modules, and leads.
(4) Place the motherboard on a grounded antistatic surface or on the
antistatic bag that the board was shipped in.
(5) Inspect the board for damage.
The following pages include details on how to install your motherboard into
your chassis, as well as installing the processor, memory, disk drives and
cables.
DO NOT APPLY POWER TO THE BOARD IF IT HAS BEEN
DAMAGED.
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2.1 - Board Image
This diagram is representative of the latest motherboard (S8028
GM3NR) revision available at the time of publishing. The board you
receive may not look exactly like the above diagram.
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2.2 - Block Diagram
S8028GM3NR Block Diagram (Represents all SKUs)
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2.3 - Board Parts, Jumpers and Connectors
This diagram is representative of the latest board revision available at the
time of publishing. The board you receive may not look exactly like the
above diagram. But for the DIMM number please refer to the above
placement for memory installation. For the latest board revision, please
visit our web site at http://www.tyan.com
http://www.TYAN.com
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Jumpers & Connectors
Jumper/Connector Function
J24/J28/J31 Fan Pin Header
J8 PSMI Connector
J9 Intruder Switch
J17 Power Button Header
J18 LCM Pin Header
J19 Front Panel Pin Header
J21 USB Pin Header
J25 Clear CMOS
J29 BMC front panel lock Switch
J33 IPMB Pin Header
J35 LAN3 LED Active Header
J41 TPM Configuration Header
J46
J63 SATA SGPIO Header
JP10 BMC Reset Switch
JP13 TPM Reset Switch
Jumper Legend
OPEN - Jumper OFF
CLOSED - Jumper ON
SPI BIOS programming
Header
Without jumper cover
With jumper cover
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Jumper Placement
J28
J31
J8
J24
J17
J24/J28/J31: 8-Pin FAN Connector
Pin1
⑴PWM/⑵+12V/⑶TACH/⑷GND/
⑸GND/⑹TACH/⑺+12V/⑻PWM
J8: 5-PIN PSMI Connector
⑴SMBUSCL/⑵SMBUSDA/⑶
ALERT/⑷GND/⑸VDD_3P3_DUAL
J9: 2-PIN INTRUDER Switch
⑴INTRUDER_L/⑵GND
J17: 2-PIN Power Button Header
Pin1
⑴FP_PWR_SW_N/⑵GND
J18: 3PIN x2 _ NP3 LCM Pin Header
⑴VDD_5_RUN /⑵RXD/⑶Key /⑷
GND/⑸VDD_5_ALW/⑹TXD
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J9
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J25
J35
J19
J19: Front Panel Pin Header (12PIN x2 _ NP3)
⑴PW_LED+/⑵FP_PWR/⑶ KEY/
⑷ID_LED+/⑸PW_LED-/⑹IDLED-/
⑺HD-LED+/⑻WARN_LED+/⑼HD-
LED-/⑽WARN_LED-/⑾PWR_SW/ ⑿
LAN1_LED+/⒀GND/⒁LAN1_LED-/⒂
RST_SW/⒃SDA/⒄GND/⒅SCL/⒆
ID_SW/⒇INTRUDER_L /(21) TEMP
/(22) LAN2_LED+/(23)NMI_SW/
LAN2_LED-
(24)
J21: USB Pin Header(5PIN x2 _ NP9)
⑴+5VPWR /⑵+5VPWR /⑶ USB2-/
⑷USB3-/⑸USB2+/⑹USB3+/
⑺GND/⑻GND/⑼Key/⑽NC
J25 CMOS Clear Switch
Pin_3 Pin_1
Pin_3 Pin_1
⑴VBAT/⑵SB700_VBAT/⑶GND
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J21
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You can reset the CMOS settings by
using this jumper if you have forgotten
Pin_3 Pin_1
Normal
(Default)
your system/setup password or need
to clear system BIOS setting.
1.Power off system and disconnect
both power connectors from the
motherboard
2.Put jumper cap back to Pin_1 and
Pin_2 (default setting)
Pin_3 Pin_1
Clear CMOS
3.Use jumper cap to close Pin_2 and
Pin_3 for several seconds to Clear
CMOS
4.Reconnect power & power on system
J33: 4-PIN BMC IPMB Pin Header
J35：2-PIN LAN3 LED active header
⑴IPMB DATA/⑵GND/⑶IPMB
CLK/
⑷NC
Pin_1 Pin_2
J41：TPM Configuration Header
Pin_1
JP10：BMC Reset Switch
⑴LAN3_LED1_ACT/
⑵VDD_3P3_DUAL
⑴BMC_SRST_N/⑵GND
Pin_1
⑴BMC_SRST_N/⑵GND
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Onboard ID LED
Pin Signal
+ P3V3_AUX
- ID_SW_L
State Color Description
NOTE: IPMI can activate ID LED from remote site.
Please visit the TYAN Web Site at http://www.tyan.com
latest AST2050 Software Configuration Guide for IPMI settings.
On Blue System identified
Off Off System not identified
to download the
2.4 - Installing the Processor
Your brand new S8028, Only AMD
are certified and supported with this motherboard.
Check our website for latest processor support. http://www.TYAN.com
®
TYAN
is not liable for damage as a result of operating an unsupported
configuration.
MiTAC is not liable for damage as a result of operating an unsupported
configuration.
Processor Installation (G34 1944-pin Socket for AMD CPU)
Follow the steps below to install the processors and heatsinks
Please note that the illustrations are based on a G34 1944-pin Socket
which may be look exactly like the motherboard you purchased.Therefore,
the illustrations should be held for your reference only.
®
“Opteron™ 6100 series” processors
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Step 1: Locate the CPU socket.
Step 2: Press the load lever with
your thumb, and then move it to
the right until it released from the
retention tab.
Step 3: Move the load lever to a
fully open position .
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Step 4: Lift the load plate to a fully
open position .
Step 5: Remove the PnP cap
from the CPU socket.
The CPU Socket is illustrated in
the image right.
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Step 6: Position the CPU over the
socket, ensuring that the gold
triangle is on the bottom-left
corner of the socket.
The CPU fits in only one
correct orientation. DO
NOT force the CPU into
the socket to prevent
bending the connectors on
the socket and damaging
the CPU.
Step 7: Close the load lever of the
socket and press the CPU socket
lever down to lock the CPU in
place.
Step 8: Insert the load lever under
the retention tab. Repeat the
same procedures to install the
other CPU.
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Heat sink Installation
After installing the processor,you should proceed to install the heat
sink.The CPU heat sink will ensure that the processor do not
overheated and continue to operate at maximum performance for as
long as you own them.The overheated processors is dangerous to the
motherboard.
For the safest method of installation and information on choosing the
appropriate heat sink, using heat sinks validated by AMD website :
http:// www,amd.com
The following diagram illustrates how to install heat sink onto the CPU of
S8028.
Step 9: Place the heat sink on top
of the CPU and secure it to the
motherboard with 2 screws.
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2.5 - Thermal Interface Material
There are two types of
thermal interface materials
designed for use with the
processors.
The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat
sink on the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).
Always check with the manufacturer of the heat sink & processor
to ensure the thermal Interface material is compatible with the
processor and meets the manufacturer’s warranty requirements.
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2.6 - Tips on Installing Motherboard in Chassis
Before installing your motherboard, make sure your chassis has the
necessary motherboard support studs installed. These studs are usually
metal and are gold in color. Usually, the chassis manufacturer will preinstall the support studs. If you are unsure of stud placement, simply lay
the motherboard inside the chassis and align the screw holes of the
motherboard to the studs inside the case. If there are any studs missing,
you will know right away since the motherboard will not be able to be
securely installed.
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Some chassis’ include plastic studs instead of metal. Although the plastic
studs are usable, TYAN
®
recommends using metal studs with screws that
will fasten the motherboard more securely in place.
Below is a chart detailing what the most common motherboard studs look
like and how they should be installed.
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2.7 - Installing the Memory
Before installing memory, ensure that the memory you have is
compatible with the motherboard and processor.
Overview
The motherboard comes with twelve Double Data Rate 3（DDR3）Dual
Inline
Memory Modules （DIMM）sockets.
The figure illustrate the location of the DDR3 DIMM socket.
Check the TYAN
®
Web site at: www.TYAN.com for details of the type of
memory recommended for your motherboard.
The following diagram shows common types of DDR3 memory modules.
TYAN® S8028 series support up to 96GB Registered and
64GB unbuffered DDR-3 memory.
DDR3 RDIMM, UDIMM are supported up to maximum of
1333MHz
All installed memory will automatically be detected and no
jumpers or settings need changing.
All memory must be of the same type and density.
Always populate the memory starting from P0_DIMMA1
first.
1). For the DIMM number please refer to the motherboard
placement in “2.3 - Board Parts, Jumpers and Connectors” for
memory installation.
2). Refer to the memory population option table for recommended
memory installation instruction.
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Recommended Memory Population Table
Single CPU Installed
Quantity of
memory installed
DIMM(1)A0 √ √ √ √ √ √ √ √
DIMM(2)A1 √ √ √ √
DIMM(3)A2 √ √ √ √ √ √ √ √ √ √ √ √ √ √
DIMM(4)B0 √ √ √ √ √ √ √
DIMM(5)B1 √ √ √
DIMM(6)B2 √ √ √ √ √ √ √ √ √ √ √ √ √ √ √
DIMM(7)C0 √ √ √ √ √ √
DIMM(8)C1 √ √
DIMM(9)C2 √ √ √ √ √ √ √ √ √ √ √ √ √ √
DIMM(10)D0 √ √ √ √ √
DIMM(11)D1 √
DIMM(12)D2 √ √ √ √ √ √ √ √ √ √ √ √ √ √
1 1 1 1 2 2 2 2 3 3 3 4 5 6 7 8 9 10 11 12
NOTE:
1. √ indicates a populated DIMM slot.
2. Paired memory installation for Max performance.
3. Populate the same DIMM type in each channel, specifically
- Use the same DIMM size
- Use the same # of ranks per DIMM
4. Dual-rank DIMMs are recommended over single-rank DIMMs
5. Un-buffered DIMM can offer slightly better performance than registerd
DIMM if populating only a single DIMM per channel
6. We don't suggest other memory installation.
7. AMD 6100 series CPU doesn't support Quad-ranks U-DIMM
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U-DIMM Module Support
DDR3 Speed/Voltage DDR3 Rank Configuration
1.35v 1.5v
800MHz 800MHz SR or DR
800MHz 800MHz SR or DR
800MHz 800MHz SR or DR SR or DR
1066MHz 1066MHz SR or DR
1066MHz 1066MHz SR or DR
1066MHz 1066MHz SR or DR SR or DR
N/A 1333MHz SR or DR
N/A 1333MHz SR or DR
N/A 1333MHz SR or DR SR or DR
DIMM0
(A0, B0, C0,
D0)
DIMM1
(A1, B1, C1,
D1)
(A2, B2, C2,
NOTE:
UDIMM theoretically can support up to 8GB sized DIMM’s
Maximum of 16GB per channel theoretically.
SR and DR UDDR3 module support only
SR: Single-rank, DR: Dual-rank
DIMM2
D2)
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R-DIMM Module Support
DDR3 Speed/Voltage
1.35v 1.5v
667MHz 667MHz 1 SR or DR
667MHz 667MHz 2 SR or DR SR or DR
667MHz 667MHz 3 SR or DR SR, DR or QR SR or DR
800MHz 800MHz 1 SR or DR
800MHz 800MHz 1 QR
800MHz 800MHz 2 SR or DR SR or DR
800MHz 800MHz 2 QR SR or DR
800MHz 800MHz 3 SR or DR SR, DR SR or DR
N/A 800MHz 3 SR or DR QR SR or DR
1066MHz 1066MHz 1 SR or DR
1066MHz 1066MHz 1 QR
1066MHz 1066MHz 2 SR or DR SR or DR
1066MHz 1066MHz 3 SR SR SR
N/A 1066MHz 3 SR or DR SR or DR DR
N/A 1066MHz 3 SR or DR DR SR or DR
DIMMs
number
DDR3 Rank Configuration
DIMM0
(A0, B0, C0,
D0)
DIMM1
(A1, B1, C1,
D1)
DIMM2
(A2, B2, C2,
D2)
N/A 1066MHz 3 DR SR, DR SR or DR
1333MHz 1333MHz 1 SR or DR
1333MHz 1333MHz 2 SR or DR SR or DR
N/A 1333MHz 3 SR SR SR
NOTE:
RDIMM can support up to 8GB sized DIMM’s
SR: Single-rank, DR: Dual-rank, QR: Quad-rank
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g
p
Memory Installation Procedure
Ensure to unplug the power supply before adding or removing DIMMs or
other system components, Failure to do so may cause severe damage to
both the motherboard and the components.
Follow these instructions to install memory modules into the S8028.
1. Unlock a DIMM socket by Press the retaining clip outwardly in the following
illustration.
Unlocked
retaining
clip
Unlocked
retainin
2. Align the memory module with the socket. The memory module is keyed to fit
only one way in the socket.
cli
DIMM NOTCH
3. Hold the DIMM by both of its ends . Insert the module vertically into the
socket . Apply force to both ends of the DIMM simultaneously until the retaining
clip pop up into place. And the DIMM cannot be pushed in any further to ensure
proper sitting of the DIMM。
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KEY SLOT
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2.8 - Attaching Drive Cables
Attaching Serial ATA Cables
S8028 is equipped with 4 Serial ATA (SATA) channels. Connections for the
drives are very simple.
There is no need to set Master/Slave jumpers on SATA drives.
If you are in need of SATA/SAS cables or power adapters please contact your
place of purchase.
The following pictures illustrate how to connect an SATA drive
1. SATA drive cable
connection
2. SATA drive power
connection
3. SATA cable motherboard
connector
4. SATA drive power
adapter
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2.9 - Installing Add-In Cards
Before installing add-in cards, it’s helpful to know if they are fully compatible
with your motherboard. For this reason, we’ve provided the diagrams below,
showing the slots that may appear on your motherboard.
PCI-E x 16 slot
Simply find the appropriate slot for your add-in card and insert the card firmly.
Do not force any add-in cards into any slots if they do not seat in place. It is
better to try another slot or return the faulty card rather than damaging both the
motherboard and the add-in card.
TIP: It’s good practice to install add-in cards in a staggered manner rather
than making them directly adjacent to each other. Doing so allows air to
circulate within the chassis more easily, thus improving cooling for all
installed devices.
YOU MUST ALWAYS unplug the power connector to the motherboard
before performing system hardware changes to avoid damaging the
board or expansion device.
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2.10 - Connecting External Devices
Your motherboard supports a number of different interfaces through connecting
peripherals. See the following diagrams for the details.
LAN 1
（82576 EB）
LAN 3
(82574L)
LAN 2
（82576EB）
2xUSB ports
VGA port
COM port
Note:
Peripheral devices can be plugged straight into any of
these ports but software may be required to complete
the installation.
Onboard LAN LED Color Definition
The three onboard Ethernet ports have green and yellow LEDs to indicate LAN
status. The chart below illustrates the different LED states.
10/100/1000 Mbps LAN Link/Activity LED Scheme
Left LED Right LED
10 Mbps
100 Mbps
1000 Mbps
No Link/10Mb
mode(Right)
Link Green Amber
Active Blinking Green Green
Link Green Amber
Active Blinking Green Green
Link Green Amber
Active Blinking Green Green
Off Off
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2.11 - Installing the Power Supply
There are two power connectors on your S8028.The S8028 supports 12V power
supplies.
PW2
PW1
PWR1: J16 20-Pin 12V PWR main Connector (Input)
⑴GND/⑵GND/⑶GND/⑷GND/⑸
GND⑹NC/⑺+12V/⑻+12V/⑼+12V/
⑽+12V/⑾PSON / ⑿5VSB/⒀GND/
PWR2: J34 4-Pin 12V PWR Connector (Output for HDD backplane)
⒁GND/⒂GND/⒃NC/⒄+12V/⒅
+12V/⒆+12V/⒇+12V
⑴+12V/⑵GND/⑶GND/⑷+5V
We suggest using a 300W per node supply.
3Y POWER TECHNOLOGY power supply
Model：YM-2301D(300W)/YM-2451C(450W)
A 300W is sufficient for most common system configurations, however a higher
wattage solution may be needed if the system is fully loaded. Look to the
www.TYAN.com
website for further information.
YOU MUST unplug the power supply before plugging the power cables
to motherboard connectors.
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2.12 - Finishing Up
Congratulations on making it this far! You have finished setting up the hardware
aspect of your computer. Before closing up your chassis, make sure that all cables
and wires are connected properly, especially IDE cables and most importantly,
jumpers. You may have difficulty powering on your system if the motherboard
jumpers are not set correctly.
In the rare circumstance that you have experienced difficulty, you can find help by
asking your vendor for assistance. If they are not available for assistance, please
find setup information and documentation online at our website or by calling your
vendor’s support line.
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Chapter 3: BIOS Setup
3.1 - About the BIOS
The BIOS is the basic input/output system, the firmware on the motherboard
that enables your hardware to interface with your software. The BIOS
determines what a computer can do without accessing programs from a disk.
The BIOS contains all the code required to control the keyboard, display
screen, disk drives, serial communications, and a number of miscellaneous
functions. This chapter describes the various BIOS settings that can be
used to configure your system.
The BIOS section of this manual is subject to change without notice and is
provided for reference purposes only. The settings and configurations of the
BIOS are current at the time of print and are subject to change, and
therefore may not match exactly what is displayed on screen.
This section describes the BIOS setup program. The setup program lets you
modify basic configuration settings. The settings are then stored in a
dedicated, battery-backed memory (called NVRAM) that retains the
information even when the power is turned off.
To start the BIOS setup utility:
1. Turn on or reboot your system.
2. Press <Del> during POST (<Tab> on remote console) to start the BIOS
setup utility.
3.1.1 Manual Bars
The menu bar at the top of the windows lists these selections:
Main For changing the basic system configuration
Advanced For changing the advanced system settings
PCI PnP For changing the advanced PCI/PnP settings
Boot For changing the system boot configuration
Security For setting the Supervisor and User passwords
Chipset For customize the AMD chipset function
Exit
For selecting the exit options and loading default
settings
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3.1.2 Setup Basics
The table below shows how to navigate in the setup program using the
keyboard.
Tab Moves from one selection to the next
Left/Right Arrow Keys Changes from one menu to the next
Up/Down Arrow Keys Moves between selections
Enter Opens highlighted section
PgUp/PgDn Keys Changes settings.
3.1.3 - Getting Help
Pressing [F1] will display a small help window that describes the appropriate
keys to use and the possible selections for the highlighted item. To exit the Help
Window, press [ESC].
3.1.4 - In Case of Problems
If you have trouble booting your computer after making and saving the changes
with the BIOS setup program, you can restart the computer by holding the power
button down until the computer shuts off (usually within 4 seconds); resetting by
pressing CTRL-ALT-DEL; or clearing the CMOS.The best advice is to only alter
settings that you thoroughly understand. In particular, do not change settings in
the Chipset section unless you are absolutely sure of what you are doing. The
Chipset defaults have been carefully chosen either by TYAN® or your system
manufacturer for best performance and reliability. Even a seemingly small
change to the Chipset setup options may cause the system to become unstable
or unusable.
3.1.5 Setup Variations
Not all systems have the same BIOS setup layout or options. While the basic
look and function of the BIOS setup remains more or less the same for most
systems, the appearance of your Setup screen may differ from the charts shown
in this section. Each system design and chipset combination requires a custom
configuration. In addition, the final appearance of the Setup program depends on
the system designer. Your system designer may decide that certain items should
not be available for user configuration, and remove them from the BIOS setup
program.
The following pages provide the details of BIOS menu. Please be noticed
that the BIOS menu are continually changing due to the BIOS updating.
The BIOS menu provided are the most updated when this manual is
written. Please visit TYAN®’s website at http://www.TYAN.com for the
information of BIOS updating.
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3.2 - BIOS Main Menu
Manual Bar
Specification
General help
Sub-menu items
Configuration fields
Navigation keys
AMIBIOS
It displays the core number, date of BIOS build and the version of BIOS.
Processor
This displays the CPU information.
System Memory
This displays the amount of system memory present on the system.
System Time / Date setup
System Time: Adjusts the system clock.
HH (24 hours format): MM (Minutes): SS (Seconds)
System Date: Adjusts the system date.
MM (Months): DD (Days): YYYY (Years)
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3.3 - BIOS Advanced Menu
IDE Configuration
Configure the IDE devices.
Super IO Configuration
Configures Super IO
ACPI Configuration
Selection for Advanced ACPI Configuration.
Event Log Configuration
Configure the Event Log
Hardware Health Configuration
Configure / monitor the Hardware Health.
IPMI 2.0 Configuration
IPMI configuration including server monitoring and event log.
MPS Configuration
Configure the Multi-Processor Table.
Remote Access Configuration
Configure Remote Access.
USB Configuration
Configure the USB support.
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Onboard Devices Configuration
Onboard Devices and PCI Add-On cards Enable/Disable.
Hyper Transport Configuration
Configure the HT link.
3.3.1 - CPU Configuration
GART Error Reporting
This option should remain disabled for normal operation. The driver developer may
enable it for the purpose of testing.
Disabled / Enabled
Microcode Update
Enable/disable the CPU Microcode update.
Disabled / Enabled
Secure Virtual Machine Mode
Enable/disable the CPU secure virtual machine mode (SVM).
Disabled / Enabled
PowerNow
Enable/disable the generation of ACPI_PPC, _PSS, and _PCT objects.
Disabled / Enabled
PowerCap
The option can decide the highest performance P-state in OS.
P-state 0 / P-state 1 / P-state 2 / P-state 3 / P-state 4
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ACPI SRAT Table
Enable or disable the building of ACPI SRAT Table.
Disabled / Enabled
CPU Prefetching
Enable or disable CPU prefetching.
Disabled / Enabled
IO Prefetching
Enable or disable IO prefetching.
Disabled / Enabled
Probe Filter
Initialization mode for Probe Filter.
Auto / Disable / MP Mode
Power Cap is hidden and will appear when Power Now is
set to [Enabled].
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3.3.2 - IDE Configuration
Onboard PCI IDE Controller
Disabled: disables the integrated IDE Controller
Primary: enables only the Primary IDE Controller
Secondary: enables only the Secondary IDE Controller
Both: enables both IDE Controller
Disabled / Primary / Secondary / Both
Hard Disk Write Protect
Disable/Enable device write protection. This will be effective only if device is
accessed through BIOS.
Disabled / Enabled
IDE Detect Time Out (Sec)
Select the time out value for detecting ATA/ATAPI device(s).
0~35 (at 5 interval)
ATA(PI) 80Pin Cable Detection
Select the mechanism for detecting 80Pin ATA(PI) Cable.
Host & Device / Host / Device
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3.3.3 - Super I/O Configuration Sub- Menu
Serial Port1 Address
Allow BIOS to configure Serial Port1 Base Address.
Disabled / 3F8/IRQ4 / 3E8/IRQ4
Parallel Port Address
Allow BIOS to configure Parallel Port Address
Disabled / 378 / 3E8/IRQ4
Parallel Port Mode
Allow BIOS to configure Parallel Port Mode
Normal/ Bi-Directional / ECP/EPP/ECP&EPP
Parallel Port IRQ
Allow BIOS to configure Parallel Port IRQ
IRQ5 / IRQ7
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3.3.4 - ACPI Configuration Sub-Menu
ACPI Version Features
Set this value to allow or prevent the system to be complaint with the ACPI 2.0
specification.
ACPI 3.0 / ACPI 2.0 / ACPI 1.0
ACPI APIC Support
This option allows you to define whether or not to enable APIC features.
Enabled / Disabled
AMI OEMB Table
Set this value to allow the ACPI BIOS to add a pointer to an OEMB table in the Root
System Description Table (RSDT) table.
Enabled / Disabled
OEMB table is used to pass POST data to the AMI code
during ACPI O/S operations.
Headless Mode
Enable or disable Headless operation mode through ACPI.
Disabled / Enabled
C1E Support
Enhanced C1 state support.
Disabled / Enabled
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3.3.5 – Event Log Configuration
View Event Log
View all unread events on the Event Log.
Mark all events as read
Mark all unread events as read.
Clear Event Log
Discard all events in the Event Log.
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3.3.6 - Hardware Health Configuration Sub-Menu
Auto Fan Control
Select Smart FAN mode:
- Disabled:
- Enabled: fan speed up as temperature goes up
Disabled / Enabled
CPU FAN Min Duty Cycle
This item allows you to set minimum PWM Duty Cycle.
30% Duty Cycle / 45% / 60%
CPU FAN Min Duty Cycle is hidden and will appear when Auto
FAN Power Control is set to [Enabled].
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3.3.6.1 - Sensor Data Configuration Sub-Menu
Read only. It can not be modified in user mode.
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3.3.7 IPMI 2.0 Configuration Sub-Menu
Status of BMC
Read only.
Clear BMC System Event Log
Clear all events in BMC System Event Log.
Set LAN Configuration
Set LAN Configuration Parameters Command.
Set PEF Configuration
Set PEF Configuration Parameters Command.
BMC Watch Dog Timer Action
Allows the BMC to reset or power down the system if the operating system crashes
or hangs.
Disabled / Enabled
BMC Alert Beep
BMC Alert LED and Beep.
OFF / ON
FW Key
Enter IPMI FW Key upgrade to IPMI or iKVM function.
[0000000]
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3.3.7.1 View BMC System Event Log Sub-Menu
Read only. It can not be modified in user mode.
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3.3.7.2 LAN Configuration Sub-Menu
Read only. It can not be modified in user mode.
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3.3.7.3 Set PEF Configuration Sub-Menu
PEF Support
Enable or disable PEF support.
Enabled / Disabled
PEF Action Global Control
Select action for PEF Action Global Control.
Alert / Power Down / Reset System / Power Cycle / OEM Action /
Diagnostic. Int.
Alert Startup Delay
Enable/disable Alert Startup Delay.
Disabled / Enabled
Startup Delay
Enable/disable Startup Delay.
Disabled / Enabled
Event Message For PEF Action
Enable/disable Event Message for PEF Action.
Disabled / Enabled
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3.3.8 MPS Configuration
MPS Revision
Set the multi processor specification
1.1 / 1.4
3.3.9 PCI-Express Configuration
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Relax Ordering
Enables / Disables PCI Express Device Relaxed Ordering.
Auto / Disabled / Enabled
Maximum Payload Size
Set Maximum Payload of PCI Express Device or allow System BIOS select the
value.
Auto / Disabled
Extended Tag Field
If Enabled, allows Device to use 8-bit Tag field as a requester.
Auto / Disabled
No Snoop
Enables/Disables PCI Express Device No Snoop option.
Auto / Disabled
Maximum Read Request Size
Set Maximum Read Request Size of PCI Express Device or allow System BIOS
select the value.
Auto / Disabled
Active State Power Management
Enable/disable PCI Express L0s AND L1 link power states.
Disabled / Enabled
Extended Synch
If enabled, allows generation of Extended Synchronization patterns.
Auto / Disabled
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3.3.10- Remote Access Configuration Sub-Menu
Remote Access
Enables remote access to system through serial port.
Disabled / Enabled
The following BIOS items are available only when Remote
Access is set to [Enabled].
Serial Port Number
Select Serial Port for cosole redirection. Make sure the selected port is enabled.
COM1 / BMC VUR
Serial Port Mode
Select Serial Port settings.
Flow Control
Select Flow Control for console redirection.
None / Hardware / Software
Redirection After BIOS POST
Disabled: Turns off the redirection after POST Boot Loader.
Boot Loader: Redirection is active during POST and during Boot Loader.
Always: Redirection is always active. (Some Oss may not work if set to Always)
Always / Disabled / Boot Loader
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Terminal Type
Select the target terminal type.
ANSI / VT100 / VT-UTF8
VT-UTF8 Combo Key Support
Enable VT-UFT8 Combination Key Support for ANSI/VT100 terminals.
Enabled / Disabled
Sredir Memory Display Delay
Gives the delay in seconds to display memory information.
No Delay / Delay 1 Sec / Delay 2 Sec / Delay 4 Sec
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3.3.11 - USB Configuration Sub- Menu
Legacy USB Support
Enables support for legacy USB. AUTO option disables legacy support if no
USB devices are connected.
Enabled / Disabled / Auto
USB 2.0 Controller Mode
Configure the USB 2.0 controller in Hi Speed (480 Mbps) or Full Speed
(12Mbps).
Hi Speed / Full Speed
BIOS EHCI Hand-OFF
This is a work around for OSes without EHCI hand-off support. The EHCI
ownership change should claim by EHCI driver.
Enabled / Disabled
Legacy USB1.1 HC Support
Enables support for legacy USB. Auto option disables legacy support if no USB
devices are connected.
Enabled / Disabled
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3.3.12 - Hyper Transport Configuration Sub-Menu
Coherent HT Link Speed
Configure Coherent HT frequency.
Auto / 400MHz / 600MHz / 800MHz / 1GHz / 1.2GHz / 1.4GHz / 1.6 GHz
1.8GHz / 2.0GHz / 2.2GHz / 2.4GHz / 2.6GHz / 2.8GHz / 3.0GHz / 3.2GHz
Coherent HT Link Width
Configure Coherent HT Width
8bit / 16bit
NonCoherent HT Link Speed
Configure NonCoherent HT frequency.
Auto / 400MHz / 600MHz / 800MHz / 1GHz / 1.2GHz / 1.4GHz / 1.6 GHz
1.8GHz / 2.0GHz / 2.2GHz / 2.4GHz / 2.6GHz
NonCoherent HT Link Width
Configure NonCoherent HT Width
8bit / 16bit
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3.4 - PCI/PnP Menu
Clear NVRAM
Clear NVRAM during system Boot.
No / Yes
Plug & Play O/S
No: lets the BIOS configure all the devices in the system.
Yes: lets the operating system configure Plug and Play (PnP) devices not
required for boot if your system has a Plug and Play operating system.
No / Yes
PCI Latency Timer
This setting controls how many PCI clocks each PCI device can hold the bus
before another PCI device takes over. When set to higher values, every PCI
device can conduct transactions for a longer time and thus improve the effective
PCI bandwidth.
Values in units of PCI clocks for PCI device latency timer register
64 / 32 / 96 / 128 / 160 / 192 / 224 / 248
Allocate IRQ to PCI VGA
Yes: assigns IRQ to PCI VGA card if card requests IRQ.
Yes / No
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Palette Snooping
This is the default setting and should not be changed unless the VGA card
manufacturer requires Palette Snooping to be Enabled.
Enabled: informs the PCI devices that an ISA graphics device is installed in the
system so the card will function correctly.
Disabled / Enabled
PCI IDE Bus Master
Enabled: BIOS uses PCI bus mastering for reading / writing to IDE drives.
Enabled / Disabled
Offboard PCI/ISA IDE Card
Some PCI IDE cards may require this to be set to the PCI slot number that is
holding the card.
Auto: Works for most PCI IDE cards.
Auto / PCI Slot 1 / PCI Slot 2 / PCI Slot 3 / PCI Slot 4/ PCI Slot 5 /
PCI Slot 6
3.5 - Boot Menu
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3.5.1 - Boot Settings Configuration Sub-Menu
Quick Boot
This option allows user bypass BIOS self test during POST.
Enabled / Disabled
Endless Boot
Enable/Disable endless loop boot from BBS table.
Enabled / Disabled
Quiet Boot
Disabled: displays normal POST messages.
Enabled: displays OEM log instead of POST messages.
Disabled / Enabled
Add On ROM Display Mode
Allows user to force BIOS/Option ROM of add-on cards to be displayed during
quiet boot.
Force BIOS / Keep Current
Boot Up Num-Lock
Selects Power-on state for Numlock.
On / Off
Wait for ‘F1’ If Error
Waits for F1 key to be present if error occurs.
Enabled / Disabled
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Hit ‘DEL’ Message Display
Displays “Press DEL to run Setup in POST”.
Enabled / Disabled
Interrupt 19 Capture
Enabled: allows option ROMs to trap interrupt 19.
Enabled / Disabled
3.5.2 - Boot Device Priority
Boot Device Priority
Specifies the boot sequence from the available devices.
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3.6 - Security Menu
Supervisor Password/User Password
Read only.
Change Supervisor Password
Install or change the password.
Change User Password
Install or change the password.
Boot Sector Virus Protection
When it is set to [Enabled], BIOS will issue a virus warning message and beep if
a write to the boot sector or the partition table of the HDD is attempted.
Disabled / Enabled
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3.6.1 - Trusted Computing
TCG/TPM Support
Enable / Disable TPM TCG (TPM 1.1/1.2) support in BIOS.
No / Yes
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3.7 - Chipset Menu
Allow you to change NorthBridge, SouthBridge, SR5650 and Onboard
Peripherals Configuration.
3.7.1 – NorthBridge Chipset Configuration Sub- Menu
Memory Timing Parameters
To select which node’s timing parameters to display.
CPU Node 0 / CPU Node 1
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3.7.1.1 – Memory Configuration Sub- Menu
Bank Interleaving
Bank Interleave setting has to do with the actual RAM chip properties, most
good quality RAM chips have "4-bank interleaving" and work best at this setting.
Inter-leaving controls how actual hits to memory takes place.
Enable Bank Memory Interleaving.
Auto / Disabled
Node Interleaving
Enable Node Memory Interleaving.
Disabled / Enabled
Channel Interleaving
Enable Channel Memory Interleaving.
Auto / Disabled
CS Sparing Enable
Reserve a spare memory rank in each node.
Disabled / Enabled
Bank Swizzle Mode
Enable or disable bank swizzle mode.
Enabled / Disabled
Ungang DCT
Always / Disabled
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3.7.1.2 - ECC Configuration Sub-Menu
ECC Mode
Select the level of ECC protection. Note: The “Super” ECC mode dynamically
sets the DRAM scrub rate so all of memory is scrubbed in 8 hours.
Basic / Super / Disabled / Good / Max / User
DRAM ECC Enable
DRAM ECC allows hardware to report and correct memory errors automatically
maintaining system integrity.
Enabled / Disabled
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3.7.1.3 DRAM Timing Configuration
DRAM Timing Config
Select the DRAM Frequency programming method. If Auto, the DRAM speed
will be based on SPDs. If Limit, the DRAM speed will not exceed the specified
value. If Manual, the DRAM speed specified will be programmed by users.
Auto / Manual / Limit
Memory Clock Speed
Select the Memory Clock Speed
Auto / 200MHz / 266MHz / 333MHz / 400MHz / 533MHz / 667MHz / 800MHz /
933MHz
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3.7.2 - Southbridge Configuration Sub-Menu
OnChip SATA Channel
Enable or disable OnChip SATA channel.
Enabled / Disabled
OnChip SATA Type
Select OnChip SATA type.
Native IDE / RAID / AHCI
SATA IDE Combined Mode
Disabled / Enabled
PATA Channel Config
SATA as primary / SATA as seondary
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3.7.3 SR5650 Configuration
IOMMU
Disable or Enable IOMMU function.
Disabled / Enabled
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3.7.4 Onboard Peripherals Configuration
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3.8 - Exit Menu
Save Changes and Exit
Use this option to exit setup utility and re-boot.
All new selections you have made are stored into CMOS.
System will use the new settings to boot up.
Discard Changes and Exit
Use this option to exit setup utility and re-boot.
All new selections you have made are not stored into CMOS.
System will use the old settings to boot up.
Discard Changes
Use this option to restore all new setup values that you have made but
not saved into CMOS.
Load Optimal Defaults
Use this option to load default performance setup values.
Use this option when system CMOS values have been corrupted or
modified incorrectly.
Load Failsafe Defaults
Use this option to load all default failsafe setup values.
Use this option when troubleshooting.
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Chapter 4: Diagnostics
If you experience problems with setting up your system, always check the
following things in the following order:
Memory, Video, CPU
By checking these items, you will most likely find out what the problem might
have been when setting up your system. For more information on
troubleshooting, check the TYAN
®
website at: http://www.TYAN.com.
4.1 - Beep Codes
Fatal errors, which halt the boot process, are communicated through two
kinds of audible beeps.
A single long beep followed by two short beeps: It indicates that a
Video error has occurred.
A single long beep repeatedly: It indicates that a DRAM error has
occurred.The most common type of error is a memory error.
Before contacting your vendor or TYAN
®
Technical Support, be sure that you
note as much as you can about the beep code length and order that you
experience. Also, be ready with information regarding add-in cards, drives
and O/S to speed the support process and come to a quicker solution.
4.2 - Flash Utility
Every BIOS file is unique for the motherboard it was designed for. For Flash
Utilities, BIOS downloads, and information on how to properly use the Flash
Utility with your motherboard, please check the TYAN
http://www.TYAN.com/
Please be aware that by flashing your BIOS, you agree that in the
event of a BIOS flash failure, you must contact your dealer for a
replacement BIOS. There are no exceptions. TYAN® does not have a
policy for replacing BIOS chips directly with end users. In no event will
TYAN® be held responsible for damages done by the end user.
®
web site:
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4.3 - AMIBIOS Post Code
The POST code checkpoints are the largest set of checkpoints during the
BIOS pre-boot process. The following table describes the type of checkpoints
that may occur during the POST portion of the BIOS:
Checkpoint Description
03 Disable NMI, Parity, video for EGA, and DMA controllers. Initialize
04 Check CMOS diagnostic byte to determine if battery power is OK and
05 Initializes the interrupt controlling hardware (generally PIC) and
06 Do R/W test to CH-2 count reg. Initialize CH-0 as system timer.Install
08 Initializes the CPU. The BAT test is being done on KBC. Program
0A Initializes the 8042 compatible Key Board Controller.
0B Detects the presence of PS/2 mouse.
0C Detects the presence of Keyboard in KBC port.
0E Testing and initialization of different Input Devices. Also, update the
13 Early POST initialization of chipset registers.
24 Uncompress and initialize any platform specific BIOS modules.
30 Initialize System Management Interrupt.
2A Initializes different devices through DIM.
2C Initializes different devices. Detects and initializes the video adapter
2E Initializes all the output devices.
31 Allocate memory for ADM module and uncompress it. Give control to
33 Initializes the silent boot module. Set the window for displaying text
37 Displaying sign-on message, CPU information, setup key message,
BIOS, POST, Runtime data area. Also initialize BIOS modules on
POST entry and GPNV area. Initialized CMOS as mentioned in the
Kernel Variable "wCMOSFlags."
CMOS checksum is OK. Verify CMOS checksum manually by
reading storage area. If the CMOS checksum is bad, update CMOS
with power-on default values and clear passwords. Initialize status
register A.
Initializes data variables that are based on CMOS setup questions.
Initializes both the 8259 compatible PICs in the system
interrupt vector table.
the POSTINT1Ch handler. Enable IRQ-0 in PIC for system timer
interrupt.
Traps INT1Ch vector to "POSTINT1ChHandlerBlock."
the keyboard controller command byte is being done after Auto
detection of KB/MS using AMI KB-5.
Kernel Variables.
Traps the INT09h vector, so that the POST INT09h handler gets
control for IRQ1. Uncompress all available language, BIOS logo, and
Silent logo modules.
See DIM Code Checkpoints section of document for more information.
installed in the system that have optional ROMs.
ADM module for initialization. Initialize language and font modules for
ADM. Activate ADM module.
information.
and any OEM specific information.
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Checkpoint Description
38 Initializes different devices through DIM. See DIM Code Checkpoints
39 Initializes DMAC-1 & DMAC-2.
3A Initialize RTC date/time.
3B Test for total memory installed in the system. Also, Check for DEL or
3C Mid POST initialization of chipset registers.
40 Detect different devices (Parallel ports, serial ports, and coprocessor
section of document for more information.
ESC keys to limit memory test. Display total memory in the system.
in CPU, … etc.) successfully installed in the system and update the
BDA, EBDA…etc.
50 Programming the memory hole or any kind of implementation that
52 Updates CMOS memory size from memory found in memory test.
60 Initializes NUM-LOCK status and programs the KBD typematic rate.
75 Initialize Int-13 and prepare for IPL detection.
78 Initializes IPL devices controlled by BIOS and option ROMs.
7A Initializes remaining option ROMs.
7C Generate and write contents of ESCD in NVRam.
84 Log errors encountered during POST.
85 Display errors to the user and gets the user response for error.
87 Execute BIOS setup if needed / requested.
8C Late POST initialization of chipset registers.
8E Program the peripheral parameters. Enable/Disable NMI as selected
90 Late POST initialization of system management interrupt.
A0 Check boot password if installed.
A1 Clean-up work needed before booting to OS.
A2 Takes care of runtime image preparation for different BIOS modules.
A4 Initialize runtime language module.
A7 Displays the system configuration screen if enabled. Initialize the
A8 Prepare CPU for OS boot including final MTRR values.
A9 Wait for user input at config display if needed.
AA Uninstall POST INT1Ch vector and INT09h vector. Deinitializes the
AB Prepare BBS for Int 19 boot.
AC End of POST initialization of chipset registers.
B1 Save system context for ACPI.
00 Passes control to OS Loader (typically INT19h).
needs an adjustment in system RAM size if needed.
Allocates memory for Extended BIOS Data Area from base memory.
Fill the free area in F000h segment with 0FFh. Initializes the
Microsoft IRQ Routing Table. Prepares the runtime language module.
Disables the system configuration display if needed.
CPU’s before boot, which includes the programming of the MTRR’s.
ADM module.
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NOTE
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Glossary
ACPI (Advanced Configuration and Power Interface): a power management
specification that allows the operating system to control the amount of power
distributed to the computer’s devices. Devices not in use can be turned off,
reducing unnecessary power expenditure.
AGP (Accelerated Graphics Port): a PCI-based interface which was designed
specifically for demands of 3D graphics applications. The 32-bit AGP channel
directly links the graphics controller to the main memory. While the channel runs
only at 66 MHz, it supports data transmission during both the rising and falling
ends of the clock cycle, yielding an effective speed of 133 MHz.
ATAPI (AT Attachment Packet Interface): also known as IDE or ATA; a drive
implementation that includes the disk controller on the device itself. It allows
CD-ROMs and tape drives to be configured as master or slave devices, just like
HDDs.
ATX: the form factor designed to replace the AT form factor. It improves on the
AT design by rotating the board 90 degrees, so that the IDE connectors are
closer to the drive bays, and the CPU is closer to the power supply and cooling
fan. The keyboard, mouse, USB, serial, and parallel ports are built-in.
Bandwidth: refers to carrying capacity. The greater the bandwidth, the more
data the bus, phone line, or other electrical path can carry. Greater bandwidth
results in greater speed.
BBS (BIOS Boot Specification): a feature within the BIOS that creates,
prioritizes, and maintains a list of all Initial Program Load (IPL) devices, and
then stores that list in NVRAM. IPL devices have the ability to load and execute
an OS, as well as provide the ability to return to the BIOS if the OS load process
fails. At that point, the next IPL device is called upon to attempt loading of the
OS.
BIOS (Basic Input/Output System): the program that resides in the ROM chip,
which provides the basic instructions for controlling your computer’s hardware.
Both the operating system and application software use BIOS routines to
ensure compatibility.
Buffer: a portion of RAM which is used to temporarily store data; usually from
an application though it is also used when printing and in most keyboard drivers.
The CPU can manipulate data in a buffer before copying it to a disk drive. While
this improves system performance (reading to or writing from a disk drive a
single time is much faster than doing so repeatedly) there is the possibility of
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losing your data should the system crash. Information in a buffer is temporarily
stored, not permanently saved.
Bus: a data pathway. The term is used especially to refer to the connection
between the processor and system memory, and between the processor and
PCI or ISA local buses.
Bus mastering: allows peripheral devices and IDEs to access the system
memory without going through the CPU (similar to DMA channels).
Cache: a temporary storage area for data that will be needed often by an
application. Using a cache lowers data access times since the information is
stored in SRAM instead of slower DRAM. Note that the cache is also much
smaller than your regular memory: a typical cache size is 512KB, while you may
have as much as 4GB of regular memory.
Closed and open jumpers: jumpers and jumper pins are active when they are
“on” or “closed”, and inactive when they are “off” or “open”.
CMOS (Complementary Metal-Oxide Semiconductors): chips that hold the
basic startup information for the BIOS.
COM port: another name for the serial port, which is called as such because it
transmits the eight bits of a byte of data along one wire, and receives data on
another single wire (that is, the data is transmitted in serial form, one bit after
another). Parallel ports transmit the bits of a byte on eight different wires at the
same time (that is, in parallel form, eight bits at the same time).
DDR (Double Data Rate): a technology designed to double the clock speed of
the memory. It activates output on both the rising and falling edge of the system
clock rather than on just the rising edge, potentially doubling output.
DIMM (Dual In-line Memory Module): faster and more capacious form of RAM
than SIMMs, and do not need to be installed in pairs.
DIMM bank: sometimes called DIMM socket because the physical slot and the
logical unit are the same. That is, one DIMM module fits into one DIMM socket,
which is capable of acting as a memory bank.
DMA (Direct Memory Access): channels that are similar to IRQs. DMA
channels allow hardware devices (like soundcards or keyboards) to access the
main memory without involving the CPU. This frees up CPU resources for other
tasks. As with IRQs, it is vital that you do not double up devices on a single line.
Plug-n-Play devices will take care of this for you.
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DRAM (Dynamic RAM): widely available, very affordable form of RAM which
looses data if it is not recharged regularly (every few milliseconds). This refresh
requirement makes DRAM three to ten times slower than non-recharged RAM
such as SRAM.
ECC (Error Correction Code or Error Checking and Correcting): allows data
to be checked for errors during run-time. Errors can subsequently be corrected
at the same time that they’re found.
EEPROM (Electrically Erasable Programmable ROM): also called Flash
BIOS, it is a ROM chip which can, unlike normal ROM, be updated. This allows
you to keep up with changes in the BIOS programs without having to buy a new
chip. TYAN
®
’s BIOS updates can be found at http://www.TYAN.com
ESCD (Extended System Configuration Data): a format for storing
information about Plug-n-Play devices in the system BIOS. This information
helps properly configure the system each time it boots.
Firmware: low-level software that controls the system hardware.
Form factor: an industry term for the size, shape, power supply type, and
external connector type of the Personal Computer Board (PCB) or motherboard.
The standard form factors are the AT and ATX.
Global timer: onboard hardware timer, such as the Real-Time Clock (RTC).
HDD: stands for Hard Disk Drive, a type of fixed drive.
H-SYNC: controls the horizontal synchronization/properties of the monitor.
HyperTransport
TM
: a high speed, low latency, scalable point-to-point link for
interconnecting ICs on boards. It can be significantly faster than a PCI bus for
an equivalent number of pins. It provides the bandwidth and flexibility critical for
today's networking and computing platforms while retaining the fundamental
programming model of PCI.
IC (Integrated Circuit): the formal name for the computer chip.
IDE (Integrated Device/Drive Electronics): a simple, self-contained HDD
interface. It can handle drives up to 8.4 GB in size. Almost all IDEs sold now are
in fact Enhanced IDEs (EIDEs), with maximum capacity determined by the
hardware controller.
IDE INT (IDE Interrupt): a hardware interrupt signal that goes to the IDE.
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I/O (Input/Output): the connection between your computer and another piece
of hardware (mouse, keyboard, etc.)
IRQ (Interrupt Request): an electronic request that runs from a hardware
device to the CPU. The interrupt controller assigns priorities to incoming
requests and delivers them to the CPU. It is important that there is only one
device hooked up to each IRQ line; doubling up devices on IRQ lines can lock
up your system. Plug-n-Play operating systems can take care of these details
for you.
Latency: the amount of time that one part of a system spends waiting for
another part to catch up. This occurs most commonly when the system sends
data out to a peripheral device and has to wait for the peripheral to spread
(peripherals tend to be slower than onboard system components).
NVRAM: ROM and EEPROM are both examples of Non-Volatile RAM, memory
that holds its data without power. DRAM, in contrast, is volatile.
Parallel port: transmits the bits of a byte on eight different wires at the same
time.
PCI (Peripheral Component Interconnect): a 32 or 64-bit local bus (data
pathway) which is faster than the ISA bus. Local buses are those which operate
within a single system (as opposed to a network bus, which connects multiple
systems).
PCI PIO (PCI Programmable Input/Output) modes: the data transfer modes
used by IDE drives. These modes use the CPU for data transfer (in contrast,
DMA channels do not). PCI refers to the type of bus used by these modes to
communicate with the CPU.
PCI-to-PCI Bridge: allows you to connect multiple PCI devices onto one PCI
slot.
Pipeline burst SRAM: a fast secondary cache. It is used as a secondary cache
because SRAM is slower than SDRAM, but usually larger. Data is cached first
to the faster primary cache, and then, when the primary cache is full, to the
slower secondary cache.
PnP (Plug-n-Play): a design standard that has become ascendant in the
industry. Plug-n-Play devices require little set-up to use. Devices and operating
systems that are not Plug-n-Play require you to reconfigure your system each
time you add or change any part of your hardware.
PXE (Preboot Execution Environment): one of four components that together
make up the Wired for Management 2.0 baseline specification. PXE was
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designed to define a standard set of preboot protocol services within a client
with the goal of allowing networked-based booting to boot using industry
standard protocols.
RAID (Redundant Array of Independent Disks): a way for the same data to
be stored in different places on many hard drives. By using this method, the
data is stored redundantly and multiple hard drives will appear as a single drive
to the operating system. RAID level 0 is known as striping, where data is striped
(or overlapped) across multiple hard drives, but offers no fault-tolerance. RAID
level 1 is known as mirroring, which stores the data within at least two hard
drives, but does not stripe. RAID level 1 also allows for faster access time and
fault-tolerance, since either hard drive can be read at the same time. RAID level
0+1 is both striping and mirroring, providing fault-tolerance, striping, and faster
access all at the same time.
RAIDIOS: RAID I/O Steering (Intel)
RAM (Random Access Memory): technically refers to a type of memory where
any byte can be accessed without touching the adjacent data and is often
referred to the system’s main memory. This memory is available to any program
running on the computer.
ROM (Read-Only Memory): a storage chip which contains the BIOS; the basic
instructions required to boot the computer and start up the operating system.
SDRAM (Synchronous Dynamic RAM): called as such because it can keep
two sets of memory addresses open simultaneously. By transferring data
alternately from one set of addresses and then the other, SDRAM cuts down on
the delays associated with non-synchronous RAM, which must close one
address bank before opening the next.
Serial port: called as such because it transmits the eight bits of a byte of data
along one wire, and receives data on another single wire (that is, the data is
transmitted in serial form, one bit after another).
SCSI Interrupt Steering Logic (SISL): Architecture that allows a RAID
controller, such as AcceleRAID 150, 200 or 250, to implement RAID on a
system board-embedded SCSI bus or a set of SCSI busses. SISL: SCSI
Interrupt Steering Logic (LSI) (only on LSI SCSI boards)
Sleep/Suspend mode: in this mode, all devices except the CPU shut down.
SDRAM (Static RAM): unlike DRAM, this type of RAM does not need to be
refreshed in order to prevent data loss. Thus, it is faster and more expensive.
SLI (Scalable Link Interface): NVIDIA SLI technology links two graphics cards
together to provide scalability and increased performance. NVIDIA SLI takes
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advantage of the increased bandwidth of the PCI Express bus architecture, and
features hardware
processing units) and NVIDIA MCPs (media and communications
Depending on the application
performance of a single GPU configuration.
Standby mode: in this mode, the video and hard drives shut down; all other
devices continue to operate normally.
UltraDMA-33/66/100: a fast version of the old DMA channel. UltraDMA is also
called UltraATA. Without a proper UltraDMA controller, your system cannot take
advantage of higher data transfer rates of the new UltraDMA/UltraATA hard
drives.
USB (Universal Serial Bus): a versatile port. This one port type can function
as a serial, parallel, mouse, keyboard or joystick port. It is fast enough to
support video transfer, and is capable of supporting up to 127 daisy-chained
peripheral devices.
VGA (Video Graphics Array): the PC video display standard
V-SYNC: controls the vertical scanning properties of the monitor.
ZCR (Zero Channel RAID): PCI card that allows a RAID card to use the
onboard SCSI chip, thus lowering cost of RAID solution
ZIF Socket (Zero Insertion Force socket): these sockets make it possible to
insert CPUs without damaging the sensitive CPU pins. The CPU is lightly
placed in an open ZIF socket, and a lever is pulled down. This shifts the
processor over and down, guiding it into the board and locking it into place.
and software innovations within NVIDIA GPUs (graphics
processors).
, NVIDIA SLI can deliver as much as two times the
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Technical Support
If a problem arises with your system, you should first turn to your dealer for
direct support. Your system has most likely been configured or designed by
them and they should have the best idea of what hardware and software your
system contains. Hence, they should be of the most assistance for you.
Furthermore, if you purchased your system from a dealer near you, take the
system to them directly to have it serviced instead of attempting to do so
yourself (which can have expensive consequences).
If these options are not available for you then TYAN® Computer Corporation
can help. Besides designing innovative and quality products for over a decade,
®
has continuously offered customers service beyond their expectations.
TYAN
®
's website (www.TYAN.com) provides easy-to-access resources such
TYAN
as in-depth Linux Online Support sections with downloadable Linux drivers and
comprehensive compatibility reports for chassis, memory and much more. With
all these convenient resources just a few keystrokes away, users can easily find
the latest software and operating system components to keep their systems
running as powerful and productive as possible. TYAN
®
also ranks high for its
commitment to fast and friendly customer support through email. By offering
plenty of options for users, TYAN® serves multiple market segments with the
industry's most competitive services to support them.
"TYAN's tech support is some of the most impressive we've seen, with
great response time and exceptional organization in general"
----Anandtech.com
Help Resources:
1. See the beep codes section of this manual.
2. See the TYAN
®
website for FAQ’s, bulletins, driver updates, and other
information: http://www.TYAN.com
3. Contact your dealer for help BEFORE calling TYAN®.
4. Check the TYAN
®
user group:
alt.comp.periphs.mainboard.TYAN
Returning Merchandise for Service
During the warranty period, contact your distributor or system vendor FIRST for
any product problems. This warranty only covers normal customer use and
does not cover damages incurred during shipping or failure due to the alteration,
misuse, abuse, or improper maintenance of products.
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A receipt or copy of your invoice marked with the date of purchase is
required before any warranty service can be rendered. You may obtain
service by calling the manufacturer for a Return Merchandise
Authorization (RMA) number.The RMA number Should be prominently
displayed on the outside of the shipping carton and the package should
be mailed prepaid. TYAN® will pay to have the board shipped back to you.
Notice for the USA
Compliance Information Statement (Declaration of
Conformity Procedure) DoC
FCC Part 15: This device complies with part 15 of the FCC
Rules
Operation is subject to the following conditions:
·This device must not cause harmful interference.
·This device must accept any interference received, including
interference that may cause undesirable operation.
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is
likely to cause harmful interference in which case the user will be
required to correct the interference at his own expense.
Notice for Canada
This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norme NMB-003 du
Canada.
Notice for Europe (CE Mark)
This product is in conformity with the Council
Directive 2004/108/EC.
CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according to
manufacturer instructions and in accordance with your local regulations.
Document #:
D2093 - 100
82
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