S5502
Version 1.0
Copyright
Copyright © 2009 MiTAC International Corporation. All rights reserved. No part of
this manual may be reproduced or translated without prior written consent from
MiTAC International Corporation.
Trademark
All registered and unregistered trademarks and company names contained in this
manual are property of their respective owners including, but not limited to the
following.
TYAN® is a trademark of MiTAC International Corporation.
®
Intel
is a trademark of Intel® Corporation.
AMI, AMI BIOS are trademarks of AMI Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
Winbond
®
is a trademark of Winbond Electronics Corporation.
Notice
Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to product descriptions and/or specifications at
any time, without notice. In no event will MiTAC be held liable for any direct or
indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.
®
products including liability or
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Contents
Before you begin…....................................................................................5
Chapter 1: Instruction ................................................................................7
1.1 Congratulations .................................................................................7
1.2 Hardware Specifications....................................................................7
1.3 Software Specifications.....................................................................9
Chapter 2: Board Installation...................................................................11
2.1 Board Image....................................................................................12
2.2 Block Diagram.................................................................................13
2.3 Board Parts, Jumpers and Connectors...........................................14
2.4 Installing the Processor...................................................................24
2.5 Heat sink Installation .......................................................................26
Finishing Installing the Heat sink.............................................................26
2.6 Thermal Interface Material ..............................................................27
2.7 Tips on Installing Motherboard in Chassis ......................................28
2.8 Installing the Memory ......................................................................30
2.9 Attaching Drive Cables....................................................................33
2.10 Installing Add-In Cards..................................................................34
2.11 Connecting External Devices ........................................................35
2.12 Installing the Power Supply...........................................................36
2.13 Finishing Up...................................................................................38
Chapter 3: BIOS Setup .............................................................................39
3.1 About the BIOS................................................................................39
3.2 BIOS Main Menu.............................................................................41
3.3 BIOS Advanced Menu.....................................................................42
3.4 PCI/PnP...........................................................................................54
3.5 Boot .................................................................................................55
3.6 Security............................................................................................58
3.7 Chipset ............................................................................................59
3.8 Exit...................................................................................................63
Chapter 4: Diagnostics.............................................................................65
4.1 Beep Codes.....................................................................................65
4.2 Flash Utility......................................................................................65
4.3 AMIBIOS Post Code........................................................................66
Appendix: How to Make a Driver Diskette..............................................69
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Glossary.....................................................................................................71
Technical Support ....................................................................................77
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Before you begin…
Check the box contents!
The retail motherboard package should contain the following:
1x S5502 Motherboard
1 x SAS cable (S5502WGM3NR only)
6 x Serial ATA Cable
1 x USB2.0 cable
1 x S5502 User’s manual
1 x S5502 Quick reference guide
1 x TYAN® Driver CD
1 x I/O shield
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NOTE
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Chapter 1: Instruction
1.1 Congratulations
You have purchased one of the most powerful TYAN® S5502 motherboard.
Based on Intel
offers a compact design and superior performance at a lower cost compared to
previous generation products.
The TYAN S5502 offers the full functionality that is required in a standard UP server
platform. The S5502 supports (1) Intel Xeon processor 3400 series, (6) DDR-III
DIMM slots, and (2) GbE ports in an ATX form factor. This design can be easily
installed into a standard pedestal chassis for most entry level applications in
Workgroups, SMB and Education environments.
The S5502 not only empowers you in today’s demanding IT environment but also
offers a smooth path for future application usage. All of this provides S5 502 the
power and flexibility to meet the needs of nowadays application.
Remember to visit TYAN®’s Website at http://www.tyan.com. There you can find
information on all of TYAN
upgrades.
1.2 Hardware Specifications
Processor
Chipset
Memory
Expansion
Slots
®
3420 chipsets, the TYAN S5502 single-socket server platform
®
’s products with FAQs, online manuals and BIOS
Supported CPU
Series
Socket Type / Q'ty
Thermal Design
Power (TDP) wattage
PCH / PCI-E Switch
Super I/O
Supported DIMM Qty
DIMM Type / Speed
Capacity
Memory channel
Memory voltage
PCI-E
Recommended
TYAN® Riser Card
PCI
Intel® Xeon® processors 3400 series
LGA1156 / (1)
95W/ 82W/ 45W
Intel® 3420 / IDT 89HIO524G2PS
Winbond W83627DHG
(6) DIMM sockets
DDR3 800/1066/1333 RDIMM/UDIMM
Up to 32GB RDIMM / 16GB UDIMM
2 Channels
1.5V
(1) PCI-E Gen.2 x16 slot (w/ x8 link)
(1) PCI-E Gen.2 x8 slot (w/ x8 link)
(1) PCI-E Gen.2 x8 slot (w/x4 link)
(1) PCI-E x8 slot (w/ x4 link)
M2083-RS, PCI-E x16 1U riser card (left)
M2091, PCI-E x16 1U riser card (left)
(1) PCI 32/33MHz slot
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LAN
Storage
Graphic
Input /Output
System
Monitoring
Port Q'ty
Controller
Connector
Controller
SAS
(opt.)
Speed
RAID
Connector
Controller
SATA
Speed
RAID
Connector type
Resolution
Chipset
USB
COM
PS/2
SAS
(opt.)
VGA
RJ-45
Power
Front Panel
SATA
Chipset
Voltage
Fan
Temperature
Others
Onboard Chipset
(3)
Intel® 82574L
(4)
Marvell 88SE6440 (S5502WGM3NR only)
3.0 Gb/s
RAID 0/1/1E (Marvell Integrated RAID)
(3) 2-port
Intel® 3420
3.0 Gb/s
RAID 0/1/10/5 (Intel® RST)
D-Sub 15-pin
1600x1200@60Hz
Aspeed AST2050
(10) USB2.0 ports (4 at rear, 4 via cable, 2 type A onboard)
(2) ports (1 at rear, 1 via cable)
(1) PS/2 connector
(4) SAS connectors
(S5502WGM3NR only)
(1) D-Sub 15-pin VGA port
(3) GbE ports
SSI 24-pin + 8-pin + 8-pin power connectors / EPS12V
(1) 2x12 pin SSI front panel header
(3) stacked 2-port SATA-II connectors
Winbond W83793G
Monitors voltage for CPU, memory, chipset & power supply
Total (5) 4-pin headers
Total (5) 8-pin headers (for Barebone)
Monitors temperature for CPU & system environment
Chassis intrusion detection
Watchdog timer support
Onboard Aspeed AST2050
Server
Management
AST2050 IPMI
Feature
AST2050 iKVM
Feature
BIOS Brand / ROM size
IPMI 2.0 compliant baseboard management controller (BMC)
BIOS update
USB 2.0 virtual hub
24-bit high quality video compression
Dual 10/100 Mb/s MAC interfaces
AMI / 4MB
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Feature
Plug and Play (PnP)/ PCI 2.3
WfM2.0 / SMBIOS2.3 / PXE boot
ACPI 2.0 power management
Power on mode after power recovery
User-configurable H/W monitoring
Auto-configurable of hard disk types
Multiple boot options
Form Factor
Operating
System
Regulation
Environment
RoHS
Form Factor
Board Dimension
OS supported list
FCC (DoC)
CE (DoC)
Operating Temp.
Non-operating Temp.
In/Non-operating
Humidity
RoHS 6/6 Complaint
ATX
12"x9.6" (305x244mm)
Please refer to our OS supported list.
Class B
Yes
5° C ~ 35° C (41° F~ 95° F)
- 40° C ~ 70° C (-40° F ~ 158° F) Operating
90%, non-condensing at 35° C
Yes
1.3 Software Specifications
For OS (operation system) support, please check with TYAN® support for latest
information.
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NOTE
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Chapter 2: Board Installation
You are now ready to install your motherboard.
How to install our products right… the first time
The first thing you should do is reading this user’s manual. It contains important
information that will make configuration and setup much easier. Here are some
precautions you should take when installing your motherboard:
(1) Ground yourself properly before removing your motherboard from the
antistatic bag. Unplug the power from your computer power supply and
then touch a safely grounded object to release static charge (i.e. power
supply case). For the safest conditions, MiTAC recommends wearing a
static safety wrist strap.
(2) Hold the motherboard by its edges and do not touch the bottom of the
board, or flex the board in any way.
(3) Avoid touching the motherboard components, IC chips, connectors,
memory modules, and leads.
(4) Place the motherboard on a grounded antistatic surface or on the antist ati c
bag that the board was shipped in.
(5) Inspect the board for damage.
The following pages include details on how to install your motherboard into your
chassis, as well as installing the processor, memory, disk drives and cables.
NOTE
Do not apply power to the board if it has been damaged.
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2.1 Board Image
This picture is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above picture.
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2.2 Block Diagram
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2.3 Board Parts, Jumpers and Connectors
This diagram is representative of the latest board revision available at th e time of
publishing. The board you receive may not look exactl y like the above diagram. But
for the DIMM number please refer to the above placement for memory
installation. For the latest board revision, please visit our web site at
www.tyan.com
.
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Jumpers & Connectors
Jumper/Connector Function
J8/J9/J30/J32/J33 4-pin Fan connector
J37/J38/J39/J40/J42 8-pin 4096 fan header
J19/J20 USB Front Panel Header
USB3/USB4 Type-A USB Connectors
J22 TYFP1 Header
J15 COM2 Header
JP4 Clear CMOS Jumper
J41 Chassis Intrusion Jumper
JP1/JP2 COM switch
J2 IPMB Connector
J6 Enable/Disable BMC jumper
J25 PSMI Connector
JP5 Speaker Header
J16 Port80 Header
J21 LAN3 LED Header
J23 SAS GPIO to Backplane
J36 PCH SGPIO
J35 2X10_pin FAN connector
J7 LCM Header
Jumper Legend
OPEN - Jumper OFF
CLOSED - Jumper ON
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Without jumper cover
With jumper cover
J40
Rear Fan1
Rear Fan2
CPUFAN0
FrontFAN1
FrontFAN2
J39
J38
J37
J42
J19
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J20
J8/J9/J30/J32/J33: 4-Pin FAN Connector
J32: CPUFAN0
J9: RearFAN1
J8: RearFAN2
J33: FrontFAN1
Pin_1
J30: Front FAN2
Use these headers to connect the cooling fans to the
motherboard to keep the system stable and reliable.
Pin 1 Pin 2 Pin 3 Pin 4
GND +12V Tachometer
J37/J38/J39/J40/J42: 8-Pin 4096 fan header
These headers are reserved for Barebone
Pin Signal Pin Signal
1 PWM1 2 +12V
3 TACH1 4 GND
5 GND 6 TACH2
7 +12V 8 PWM2
Fan PWM (speed)
Control
J19/J20: USB Front Panel Header
Signal Pin Pin Signal
PWR_5V 1 2 PWR-5V
USB_N1 3 4 USB_N2
USB_P1 5 6 USB_P2
GND 7 8 GND
KEY 9 10 N/C
USB3/USB4: Type-A USB Connector
Pin 1 2 3 4
Signal +5V USB D- USB D+ GND
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JP4
J15 J22
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J41
J22: TYFP1 Header
Signal Pin Pin Signal
Power LED+ 1 2 3.3V
Key 3 4 ID LED+
Power LED- 5 6 ID LEDHD LED+ 7 8 Fault_LED1-
HD LED- 9 10 Fault_LED2-
Power SW# 11 12 LAN1 ACTLED+
GND1 13 14 LAN1 ACTLEDReset SW# 15 16 SMBUS SDA
GND2 17 18 SMBUS SCL
ID SW 19 20 INTRU#
Temp Sensor 21 22 LAN2 ACTLED+
NMI_SW# 23 24 LAN2 ACTLED-
J15: COM2 Connector
Signal Pin Pin Signal
DCD 1 2 DSR
RXD 3 4 RTS
TXD 5 6 CTS
DTR 7 8 RI
GND 9 10 KEY
JP4: Clear CMOS Jumper
Use this jumper when you forgot your system/setup
password or need to clear system BIOS setting.
1
Normal (Default)
1
Clear CMOS
How to clear the CMOS data
- Power off system and disconnect power
- Use jumper cap to close Pin_2 and 3 for
- Replace jumper cap to close Pin_1 and 2
Power on system
J41: Chassis Intrusion Jumper
1
(Default)
Use this jumper to disable the system chassis
intrusion alarm.
Use this jumper to trigger the system chassis
intrusion alarm.
supply from AC source
several seconds to Clear CMOS
Reconnect power supply to AC source
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JP1
J25
JP5
JP2
J6
J2
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J16
20
JP1/JP2: COM Switch
Pin_1
Pin 1-2 Closed: COM2 (Default)
Pin_1
Pin 2-3 Closed: BMC UART2 to COM2
J2: IPMB Connector
Signal Pin Pin Signal
J6: Enable/Disable BMC jumper
IPMB_DATA 1 2 GND
IPMB_CLK 3 4 N/C
J25: PSMI Connector
JP5: Speaker Header
4
1
J16: Port 80 Header
Pin1-2 Closed: Disable BMC
Signal Pin Pin Signal
SMB_CLK 1 2 SMB_DAT
SMBALERT 3 4 GND
V3P3 5
Pin 1 2 3 4
Signal 5V NC NC SPKR
Signal Pin Pin Signal
SMBUS_3V3_CLK 1 2 P3V3
SMBUS_3V3_DATA 3 4 FRAME
CLK-33M_P80 5 6 GND
GND 7 8 LAD3
PLTRST 9 10 LAD2
NC 11 12 LAD1
NC 13 14 LAD0
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J7
J36
J35
J23
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J21
J21: LAN3 LED Header (Reserved for Barebone)
Signal Pin Pin Signal
LAN3 LED- 1 2 LAN3 LED+
J23: SAS GPIO to Backplane
Signal Pin Pin Signal
SMBCLK 1 2 SDATAIN
SMBDAT 3 4 SDATAOUT
GND 5 6 SLOAD
KEY 7 8 SCLOCK
N/C 9 10 HD_ERR_LED
J36: PCH SGPIO
Signal Pin Pin Signal
SMBCLK 1 2 SDATAOUT0
SMBDAT 3 4 SDATAOUT1
GND 5 6 SLOAD
KEY 7 8 SCLOCK
N/C 9 10 HD_ERR_LED
J35: 2X10_pin fan connector for Barebone Backplane
Signal Pin Pin Signal
FANIN1 1 2 FANIN6
FANIN2 3 4 FANIN7
FANIN3 5 6 FANIN8
FANIN4 7 8 FANIN9
FANIN5 9 10 FANIN10
GND 11 12 KEY
FANCTL5 13 14 FANCTL4
FANIN11 15 16 N/C
FANIN12 17 18 N/C
N/C
19 20 FANCTL7
J7: LCM Header for Barebone
Signal Pin Pin Signal
P5V 1 2 SINB
KEY 3 4 GND
P5V_AUX 5 6 SOUTB
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2.4 Installing the Processor
The S5502 supported Intel® processors are listed in section 1.2 Hardware
Specifications on page 5. Check our website at http://www.tyan.com for latest
processor support.
MiTAC is not liable for damage as a result of operating an unsupported
configuration.
The diagram is provided as a visual guide to help you to install the sock et p rocessor
and may not be an exact representation of the processor you have.
Locate the processor socket
Step1:
and open the socket lever
Step 2: Open the load plate
Step3: Remove the socket protective
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Step4:
Align the processor cutouts to
match the two socket pins, and insert
the processor into the socket
Step5: Close the load plate (see letter
“A”), close the socket lever, and
ensure the load plate tab engages
under the socket lever when fully
closed (see letter “B” and “C”).
Notes
Make sure the alignment triangle mark and the alignment triangle
cutout align correctly.
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2.5 Heat sink Installation
After installing the processor, you should proceed to install the heat sink. The CPU
heat sink will ensure that the processor do not overheat and continue to o perate at
maximum performance for as long as you own them. The overheated processor is
dangerous to the motherboard.
For the safest method of installation and information on c hoosing the appropriate
heat sink, using heat sinks validated by Intel®.
Please refer to Intel’
The following diagram illustrates how to install heat sink onto the CPU of S5502.
2U Reference Heatsink Assembly 8. Replace the server's cover and reconnect the
Finishing Installing the Heat sink
After you have finished installing the heat sink onto the processor and socket,
attach the end wire of the fan (which should already be attached to the heat sink) to
the motherboard. The following diagram illustrates how to connect fans onto the
motherboard.
®
s website at www.Intel.com.
1. If a protective film covers the thermal interface
material (TIM) on the underside of the heatsink,
remove the protective film.
2. Align heatsink fins to the front and back of the
chassis for correct airflow. Airflow goes from frontto-back of chassis.
3. Each heatsink has four captive fasteners and
should be tightened as shown
4. Using a #2 Phillips* screwdriver, finger-tighten
each fastener diagonally, according to the whitecircled numbers.
5. Securely re-tighten each fastener again in the
same order as performed in Step 4.
6. Attach fan power cable to server board as
shown.
7. Reinstall and reconnect any parts you removed
or disconnected to reach the processor sockets.
AC power cord. Refer to the documentation that
came with your server chassis for instructions on
installing the server's cover.
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Once you have finished installing all the fans you can connect your drives (hard
drives, CD-ROM drives, etc.) to your motherboard.
Adequate system airflow is required to ensure SAS controller
NOTE
and attached drives work properly. It is the responsibility of the
system builder to ensure adequate system airflow by choosing
the correct chassis and system components.
2.6 Thermal Interface Material
There are two types of
thermal interface materials
designed for use with the
processors.
The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat
sink on the processor.
The second type of interface
material is usually packaged
separately. It is commonly
referred to as ‘thermal
compound’. Simply apply a
thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).
NOTE
Always check with the manufacturer of the heat sink & processor
to ensure that the thermal interface material is compatible with the
processor and meets the manufacturer’s warranty requirements.
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2.7 Tips on Installing Motherboard in Chassis
Before installing your motherboard, make sure your chassis has the necessary
motherboard support studs installed. These studs are usually metal and are gold in
color. Usually, the chassis manufacturer will pre-install the support studs. If you are
unsure of stud placement, simply lay the motherboard inside the chassis and align
the screw holes of the motherboard to the studs inside the case. If there are any
studs missing, you will know right away since the motherboard will not be able to be
securely installed.
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Some chassis’ include plastic studs instead of metal. Although the plastic studs are
usable, MiTAC recommends using metal studs with screws that will fasten the
motherboard more securely in place.
Below is a chart detailing what the most common motherboard studs look like and
how they should be installed.
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2.8 Installing the Memory
Before installing memory, ensure that the memory you have is compatible with the
motherboard and processor. Check the TYAN® web site at www.tyan.com for
details of the type of memory recommended for your motherboard.
The following diagram shows common memory modules:
The TYAN® Server Board S5502 supports
Six DDR3 memory channels
DIMM sizes of 1 GB, 2 GB, 4 GB, and 8 GB*
(* 8GB support on 2 DIMMs per channel.)
DIMMs composed of DRAM using 2 Gb technology.
DRAMs organized as single rank, dual rank, or quad rank DIMMs
DIMM speeds of 800, 1066, or 1333 MT/s
Registered or Unregistered (unbuffered) DIMMs (RDIMMs or UDIMMs)
All installed memory will automatically be detected and no jumpers or
settings need changing.
Note:
The following configurations are not validated, supported, or
recommended:
Mixing of RDIMMs and UDIMMs
Mixing memory type, size, speed, and/or rank
Mixing memory vendors
Non-ECC memory
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For a complete list of supported memory, remember to visit TYAN
http://www.tyan.com.
Refer to the following table for channel slot configuration.
S5502 Memory Configuration
Channel A Channel B
A1 A2 A3 B1 B2 B3
X
X X
X X X
X X
RDIMM
X X X
X X X X
X X X X
X X X X X
X X X X X X
X
X X
UDIMM
X X
X X X
X X X X
Note:
For the DIMM number, please refer to the motherboard layout in
section 2.3 Board Parts, Jumpers and Connectors on page
14 for memory installation.
®
’s Website at
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Memory Installation Procedure
Follow these instructions to install memory modules into the S5502.
1. Press the locking levers in the direction shown in the following illustration.
2. Align the memory module with the socket. The memory module is keyed to fit
only one way in the socket.
KEY SLOT
3. Seat the module firmly into the socket by gently pressing do wn until it sits
flush with the socket. The locking levers pop up into place.
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2.9 Attaching Drive Cables
Attaching Serial ATA Cables
S5502 is equipped with 6 Serial ATA (SATA) channels. Connections for the driv es
are very simple. There is no need to set Master/Slave jumpers on SATA drives.
If you are in need of SATA/SAS cables or power adapters please contact your place
of purchase.
The following pictures illustrate how to connect an SATA drive.
1. SATA drive cable
connection
2. SATA drive power connection
3. SATA cable motherboard
connector
4. SATA drive power adapter
Attaching SAS Cables (S5502WGM3NR only)
P0 Mini-SAS backplane connector
P1, P2, P3, P4 SAS cable motherboard connector
P5 SAS SGPIO connector (reserved)
Adequate system airflow is required to ensure SAS controller
NOTE
and attached drives work properly. It is the responsibility of the
system builder to ensure adequate system airflow by choosing
the correct chassis and system components.
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2.10 Installing Add-In Cards
Before installing add-in cards, it’s helpful to know if they are fully compatible with
your motherboard. For this reason, we’ve provided the diagrams below, showing
the slots that may appear on your motherboard.
PCI-E Gen. 2 x 16 slot (x16 signal)
PCI-E x8 slot
PCI 32 bit Slot
Simply find the appropriate slot for your add-in card and insert the card firmly. Do
not force any add-in cards into any slots if they do not seat in place. It is better to try
another slot or return the faulty card rather than damaging both the motherboard
and the add-in card.
TIP: It’s a good practice to install add-in cards in a staggered manner rather than
making them directly adjacent to each other. Doing so allows air to circulate within
the chassis more easily, thus improving cooling for all installed devices.
You must always unplug the power connector to the motherboard
NOTE
before performing system hardware changes to avoid damaging
the board or expansion device.
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2.11 Connecting External Devices
Your motherboard supports a number of different interfaces through connecting
peripherals. See the following diagrams for the details.
PS/2 Port
VGA Port
LAN3
LAN2
Share with BMC
LAN1
Onboard LAN LED Color Definition
The two onboard Ethernet ports have green and yell o w LEDs to indicate LAN status.
The chart below illustrates the different LED states.
2XUSBports
NOTE: Peripheral devices can be plugged straight into any of these
ports but software may be required to complete the installation.
10/100/1000 Mbps LAN Link/Activity LED Scheme
10 Mbps
100 Mbps
1000 Mbps
No Link Off Off
COM Port
Link Green Off
Active Blinking Green Off
Link Green Green
Active Blinking Green Green
Link Green Yellow
Active Blinking Green Yellow
2XUSB ports
Left LED Right LED
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2.12 Installing the Power Supply
There are two power connectors on your S5502. The S5502 requires 2 power
inputs:
PW2
PW1
PW1: 8-pin EPS 12V PWR connector
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Signal Pin Pin Signal
GND 1 5 +12V
GND 2 6 +12V
GND 3 7 +12V
GND 4 8 +12V
PW2: 24-pin EPS 12V PWR main connector
Signal Pin Pin Signal
+3.3V 1 13 +3.3V
+3.3V 2 14 -12V
GND 3 15 GND
+5V 4 16 PS_ON
GND 5 17 GND
+5V 6 18 GND
GND 7 19 GND
PS_GD 8 20 Reset
5VSB 9 21 +5V
+12V 10 22 +5V
+12V 11 23 +5V
+3.3V 12 24 GND
Applying power to the board:
1. Connect the 12V 8-pin power connector.
2. Connect the EPS/12V 24-pin power connector.
3. Connect power cable to power supply and power outlet.
You must always unplug the power connector to the motherboard
NOTE
before performing system hardware changes to avoid damaging
the board or expansion device.
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2.13 Finishing Up
Congratulations on making it this far! You have finished setting up the hardware
aspect of your computer. Before closing up your chassis, make sure that all cables
and wires are connected properly, especially IDE cables and most importantly,
jumpers. You may have difficulty powering on your system if the motherboard
jumpers are not set correctly. In the rare circumstance that you have experienced
difficulty, you can find help by asking your vendor for assistance. If they are not
available for assistance, please find setup information and documentation online at
our website or by calling your vendor’s support line.
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Chapter 3: BIOS Setup
3.1 About the BIOS
The BIOS is the basic input/output system, the firmware on the motherboard that
enables your hardware to interface with your software. The BIOS determines what a
computer can do without accessing programs from a disk. The BIOS contains all
the code required to control the keyboard, display screen, disk drives, serial
communications, and a number of miscellaneous functions. This chapter describes
the various BIOS settings that can be used to configure your system.
The BIOS section of this manual is subject to change without notice and is provided
for reference purposes only. The settings and configurations of the BIOS are
current at the time of print and are subject to change, and therefore may not match
exactly what is displayed on screen.
This section describes the BIOS setup program. The setup program lets you modify
basic configuration settings. The settings are then stored in a dedicated, batterybacked memory (called NVRAM) that retains the information even when the power
is turned off.
To start the BIOS setup utility:
1. Turn on or reboot your system.
2. Press <Del> during POST (F4 on remote c onsole) to start the BIOS setup
utility.
3.1.1 Setup Basics
The table below shows how to navigate in the setup program using the keyboard.
Key Function
Tab Moves from one selection to the next
Left/Right Arrow Keys Changes from one menu to the next
Up/Down Arrow Keys Moves between selections
Enter Opens highlighted section
PgUp/PgDn Keys Changes settings.
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3.1.2 Getting Help
Pressing [F1] will display a small help window that describes the appropriate
keys to use and the possible selections for the highlighted item. To exit the Help
Window, press [ESC] or the [F1] key again.
3.1.3 In Case of Problems
If you have trouble booting your computer after making and saving the changes with
the BIOS setup program, you can restart the computer by holding the power button
down until the computer shuts off (usually within 4 seconds); resetting by pressing
CTRL-ALT-DEL; or clearing the CMOS.
The best advice is to only alter settings that you thoroughly understan d. In particu lar,
do not change settings in the Chipset section unless you are absolutely sure of
what you are doing. The Chipset defaults have been carefully chosen either by
MiTAC or your system manufacturer for best performance and reliability. Even a
seemingly small change to the Chipset setup options may cause the system to
become unstable or unusable.
3.1.4 Setup Variations
Not all systems have the same BIOS setup layout or options. While the basic look
and function of the BIOS setup remains more or less the same for most systems,
the appearance of your Setup screen may differ from the charts shown in this
section. Each system design and chipset combination requires a custom
configuration. In addition, the final appearance of the Setup program depends on
the system designer. Your system designer may decide that certain items should
not be available for user configuration, and remove them from the BIOS setup
program.
NOTE: The following pages provide the details of BIOS menu. Please be
noticed that the BIOS menu are continually changing due to the BIOS
updating. The BIOS menu provided are the most updated ones when this
manual is written. Please visit TYAN’s website at http://www.tyan.com
the information of BIOS updating.
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for
3.2 BIOS Main Menu
In this section, you can alter general features such as the date and time.
Note that the options listed below are for options that can directly be changed within
the Main Setup screen.
BIOS Version
This displays the version of BIOS.
Processor
This displays the CPU model and frequency.
System Memory
This displays the Memory volume.
BIOS Build Date
This displays the date of BIOS build.
System Time / Date setup
System Time: Adjusts the system clock.
HH: Hours (24hr. format)
MM: Minutes
SS: Seconds
System Date: Adjusts the system date.
MM: Months
DD: Days
YYYY: Years
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3.3 BIOS Advanced Menu
This section facilitates configuring advanced BIOS options for your system.
3.3.1 Advanced CPU Configuration
This section allows you to fine-tune the processor options.
Ratio CMOS Setting [Auto]
This feature is used to set the ratio between CPU core Clock and FSB frequency.
Hardware Prefecther / Adjacent Cache Line Prefetch
For UP platforms, leave it enabled.
For DP/MP servers, it may use to tine performance to the specific application.
Disabled / Enabled
MPS and ACPI MADT ordering [Modern Ordering]
Modern ordering for Windows XP or later OSes;
Legacy ordering for Windows 2000 or earlier OSes.
Modern Ordering / Legacy Ordering
Max CPUID Value Limit
Disabled for Windows XP
Disabled / Enabled
Intel Virtualization Tech
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When enabled, a VMM can utilize the additional HW caps. Provided by Intel
Virtualization Tech. Note: A full reset is required to change the setting.
Disabled / Enabled
Execute-Disable Bit Capability
When disabled, force the XD feature flag to always return 0
Disabled / Enabled
Intel® HT technology
When Disabled, only one thread per enabled core is enable d.
Disabled / Enabled
Active Processor Cores [A11/1/2]
Number of cores to enable in each processor package.
A20M
Legacy OSes and APs may need A20M enabled..
Disabled / Enabled
Intel® SpeedStep tech
Enabled: CPU speed controlled by operating system.
Disabled: Default CPU speed.
Intel® C-STATE tech
CState: CPU idle is set to C2/C3/C4.
Disabled / Enabled
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3.3.2 Advanced SATA Configuration
Configure SATA as
Select legacy IDE or RAID or AHCI as the SATA interface.
SATA #1 IDE Configuration
This feature is used to select SATA controller mode. In “compatible mode”, SATA
and PATA drives are auto-detected and placed in Legacy mode. In “Enhan ced
(non-AHCI) mode”, SATA and PATA drives are auto-detected and placed in Native
IDE mode.
Disabled / Compatible/ Enhanced
SATA #2 IDE Configuration
This feature is used to select SATA controller mode. In “Enhanced (non-AHCI)
mode”, SATA and PATA drives are auto-detected and placed in Native IDE mode.
Disabled / Enhanced
Hard Disk Write Protect
This feature is used to Disable/Enable device write protection. This will be effective
only if device is accessed through BIOS.
Disabled / Enabled
IDE Detect Time Out (Sec)
Select the time out value for detecting ATA/ATAPI device(s). 0~35 (at 5 interval)
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3.3.3 Super I/O Configuration
This setting allows you to configure Serial Port1 Base Addresses.
Disabled / 3F8/IRQ4 /3E8/IRQ4 / 2E8/IRQ3
This setting allows you to configure Serial Port2 Base Addresses.
Disabled / 2F8/IRQ3 /3E8/IRQ4 / 2E8/IRQ3
This setting allows you to configure Serial Port2 Mode.
Normal / IrDA/ ASK IR
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3.3.4 ACPI Configuration
3.3.4.1General ACPI Configuration
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Suspend Mode
Select the ACPI state used for System Suspend.
Auto / S1(POS) / S3(STR)
Repost Video on S3 Resume
Determine whether to invoke VGA BIOS post on S3/STR resume.
No / Yes
3.3.4.2 Advanced ACPI Configuration
ACPI Version Features
Set this value to allow or prevent the system to be complaint with the ACPI 2.0
specification.
ACPI 3.0 / ACPI 2.0 / ACPI 1.0
ACPI APIC Support
This option allows you to define whether or not to enable APIC features.
Enabled / Disabled
AMI OEMB Table
Set this value to allow the ACPI BIOS to add a pointer to an OEMB table in the Root
System Description Table (RSDT) table.
Enabled / Disabled
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NOTE: OEMB table is used to pass POST data to the AMI code
during ACPI O/S operations.
Headless Mode
Enable or disable Headless operation mode through ACPI.
Disabled / Enabled
3.3.4.3 Chipset ACPI Configuration
ACPI APIC SCI IRQ
Enable / Disable ACPI APIC SCI IRQ.
Disabled / Enabled
USB Device Wakeup From S3/S4
Enable/disable the USB device to wake up from S3/S4 state.
Disabled / Enabled
High Performance Event Timer
Enable/disable High Performance Event Timer.
Enabled / Disabled
Headless Mode
Choose HPET Memory Address.
FED0000h / FED01000h / FED02000h / FED03000h
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3.3.5 AHCI Configuration
AHCI BIOS Support
Enable for supporting AHCI.
Enabled / Disabled
AHCI CD/DVD Boot Time out
Some SATA CD/DVD in AHCI mode need to wait ready longer.
0~35 (at 5 interval)
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3.3.6 W83793 Hardware Health Configuration
Auto Fan Control
FAN power duty cycle is auto dynamic programmed in selected temperature range.
Disabled: Fan Power On.
Enabled: Fan Power Duty Cycle=50% (32
O
C)—100% (0OC), see max (CPUs, SIO)
temperature
Enabled / Disabled
PWM Cycle
Duty Cycle control range:
60%-100%
45%-100%
30%-100%
3.3.7 IPMI 2.0 Configuration
BMC Watch Dog Timer Action
Set PEF Configuration Parameters Command. (Parameter #1 to 4)
Disabled / Enabled
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3.3.8 Intel VT-d Configuration
Intel VT-d
Enable or disable Intel® Virtualization Technology for Directed I/O (VT-d) support.
VT-d support on Intel platforms provides the capability to ensure improved isolation
of I/O resources for greater reliability, security, and availability.
Enabled / Disabled
3.3.9 Intel PCI-Express Configuration
Active State Power Management
Enable/disable PCI Express L0s AND L1 link power states.
Disabled / Enabled
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3.3.10 Remote Access Configuration
Remote Access
Enables remote access to system through serial port.
Disabled / Enabled
3.3.11 USB Configuration
Legacy USB Support
Enables support for legacy USB. AUTO option disables legacy support if no USB
devices are connected.
Enabled / Disabled / Auto
USB 2.0 Controller Mode
Configure the USB 2.0 controller in Hi Speed (480 Mbps) or Full Speed (12Mbps).
Hi Speed / Full Speed
BIOS EHCI Hand-OFF
This is a work around for OSes without EHCI hand-off support. The EHCI
ownership change should claim by EHCI driver.
Enabled / Disabled
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3.4 PCI/PnP
Clear NVRAM
Clear NVRAM during system Boot.
No / Yes
Plug & Play O/S
No: lets the BIOS configure all the devices in the system.
Yes: lets the operating system configure Plug and Play (PnP) devices not required
for boot if your system has a Plug and Play operating system.
No / Yes
PCI Latency Timer
This setting controls how many PCI clocks each PCI device can hold the bus before
another PCI device takes over. When set to higher values, every PCI device can
conduct transactions for a longer time and thus improve the effective PCI band width.
Values in units of PCI clocks for PCI device latency timer register
64 / 32 / 96 / 128 / 160 / 192 / 224 / 248
PCI IDE Bus Master
Enabled: BIOS uses PCI bus mastering for reading / writing to IDE drives.
Enabled / Disabled
OffBoard PCI/ISA IDE Card
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Some PCI IDE cards may require this to be set to the PCI slot number that is
holding the card.
Auto / PCI Slot1/ PCI Slot2/ PCI Slot3/ PCI Slot4/ PCI Slot5/ PCI Slot6
3.5 Boot
3.5.1 Boot Settings Configuration
Quick Boot
This option allows user bypass BIOS self test during POST.
Enabled / Disabled
Quiet Boot
Disabled: displays normal POST messages.
Enabled: displays OEM log instead of POST messages.
Disabled / Enabled
Boot Up Num-Lock
Selects Power-on state for Numlock.
On / Off
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PS/2 Mouse Support
Select support for PS/2 Mouse.
Auto / Enabled / Disabled
Wait for ‘F1’ If Error
Waits for F1 key to be present if error occurs.
Enabled / Disabled
Hit DEL Message Display
Displays “Press DEL to run Setup” in POST.
Enabled / Disabled
Interrupt 19 Capture
Enabled: allows option ROMs to trap interrupt 19.
Enabled / Disabled
IPMI Support
Allows user to Enable/Disable IPMI function
Enabled / Disabled
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3.5.2 Boot Device Priority
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3.6 Security
Boot Sector Virus Protection
When it is set to [Enabled], BIOS will issue a virus warning message and beep if a
write to the boot sector or the partition table of the HDD is attempted.
Disabled / Enabled
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3.7 Chipset
3.7.1 North Bridge Configuration
Memory Remap Feature
[Enable]: Allow remapping of overlapped PCI memory above the total physical
memory.
[Disable]: Don’t allow remapping of memory.
Enabled / Disabled
Fast MRC
[Enable]: While cold booting, MRC directly restores memory data from valid NVRAM
without hardware training.
[Disable]: The cold booting with memory detection and hardware training.
Enabled / Disabled
DRAM Frequency
This setting allows you to select DRAM frequency.
Auto / 800MHz/1067MHz/1333MHz
Configure DRAM Timing by SPD
This setting allows you to configure DRAM Timing manually.
Enabled/ Disabled
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Memory Hole
This setting allows you to enable or disable the 1MB of memory required by some
ISA expansion cards.
Disabled / 15MB-16MB
DRAM Margin Ranks
Disabled / Enabled
Initiate Graphic Adapter
This setting allows you to select which graphics controller to use as the primary
boot device.
PCIE/ PCI
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3.7.2 South Bridge Configuration
Restore On AC Power Loss
Configure how the system board responds to a power failure.
Power Off / Power On / Last State
3.7.3 ME Subsystem Configuration
BootBlock HECI Message
Enabled / Disabled
HECI Message
Enabled / Disabled
End of Post S5 HECI Message
Enabled / Disabled
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3.7.4 Onboard Peripherals Configuration
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3.8 Exit
Save Changes and Exit
Use this option to exit setup utility and re-boot.
All new selections you have made are stored into CMOS.
System will use the new settings to boot up.
Discard Changes and Exit
Use this option to exit setup utility and re-boot.
All new selections you have made are not stored into CMOS.
System will use the old settings to boot up.
Discard Changes
Use this option to restore all new setup values that you have made but not
saved into CMOS.
Load Optimal Defaults
Use this option to load default performance setup values.
Use this option when system CMOS values have been corrupted or modified
incorrectly.
Load Failsafe Defaults
Use this option to load all default failsafe setup values.
Use this option when troubleshooting.
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NOTE
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Chapter 4: Diagnostics
NOTE: if you experience problems with setting up your system, always check the
following things in the following order:
Memory, Video, CPU
By checking these items, you will most likely find out what the problem might have
been when setting up your system. For more information on troubleshooting, check
the TYAN website at http://www.tyan.com
4.1 Beep Codes
Fatal errors, which halt the boot process, are communicated through two kinds of
audible beeps.
Eight short beeps: It indicates that a video error has occurred.
A single long beep repeatedly: It indicates that a DRAM error has occurred.
The most common type of error is a memory error.
Before contacting your vendor or TYAN Technical Support, be sure that you note as
much as you can about the beep code length and order that you experience. Also,
be ready with information regarding add-in cards, drives and O/S to speed the
support process and come to a quicker solution.
4.2 Flash Utility
Every BIOS file is unique for the motherboard it was designed for. For Flash
Utilities, BIOS downloads, and information on how to properly use the Flash Utility
with your motherboard, please check the TYAN web site at http://www.tyan.com
.
NOTE: Please be aware that by flashing your BIOS, you agree that in the
event of a BIOS flash failure, you must contact your dealer for a replacement
BIOS. There are no exceptions. TYAN does not have a policy for replacing
BIOS chips directly with end users. In no event will TYAN be held responsible
for damages done by the end user.
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4.3 AMIBIOS Post Code
The POST code checkpoints are the largest set of checkpoints during the BIOS preboot process. The following table describes the type of checkpoints that may occur
during the POST portion of the BIOS:
Checkpoint Description
03 Disable NMI, Parity, video for EGA, and DMA controllers. Initialize
04 Check CMOS diagnostic byte to determine if battery power is OK and
05 Initializes the interrupt controlling hardware (generally PIC) and
06 Do R/W test to CH-2 count reg. Initialize CH-0 as system timer.Install
08 Initializes the CPU. The BAT test is being done on KBC. Program
0A Initializes the 8042 compatible Key Board Controller.
0B Detects the presence of PS/2 mouse.
0C Detects the presence of Keyboard in KBC port.
0E Testing and initialization of different Input Devices. Also, update the
13 Early POST initialization of chipset registers.
24 Uncompress and initialize any platform specific BIOS modules.
30 Initialize System Management Interrupt.
2A Initializes different devices through DIM.
2C Initializes different devices. Detects and initializes the video adapter
2E Initializes all the output devices.
31 Allocate memory for ADM module and uncompress it. Give control to
33 Initializes the silent boot module. Set the window for displaying text
BIOS, POST, Runtime data area. Also initialize BIOS modules on
POST entry and GPNV area. Initialized CMOS as mentioned in the
Kernel Variable "wCMOSFlags."
CMOS checksum is OK. Verify CMOS checksum manually by
reading storage area. If the CMOS checksum is bad, update CMOS
with power-on default values and clear passwords. Initialize status
register A.
Initializes data variables that are based on CMOS setup questions.
Initializes both the 8259 compatible PICs in the system
interrupt vector table.
the POSTINT1Ch handler. Enable IRQ-0 in PIC for system timer
interrupt.
Traps INT1Ch vector to "POSTINT1ChHandlerBlock."
the keyboard controller command byte is being done after Auto
detection of KB/MS using AMI KB-5.
Kernel Variables.
Traps the INT09h vector, so that the POST INT09h handler gets
control for IRQ1. Uncompress all available language, BIOS logo, and
Silent logo modules.
See DIM Code Checkpoints section of document for more information.
installed in the system that have optional ROMs.
ADM module for initialization. Initialize language and font modules for
ADM. Activate ADM module.
information.
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Checkpoint Description
37 Displaying sign-on message, CPU information, setup key message,
38 Initializes different devices through DIM. See DIM Code Checkpoints
39 Initializes DMAC-1 & DMAC-2.
3A Initialize RTC date/time.
3B Test for total memory installed in the system. Also, Check for DEL or
3C Mid POST initialization of chipset registers.
40 Detect different devices (Parallel ports, serial ports, and coprocessor
and any OEM specific information.
section of document for more information.
ESC keys to limit memory test. Display total memory in the system.
in CPU, … etc.) successfully installed in the system and update the
BDA, EBDA…etc.
50 Programming the memory hole or any kind of implementation that
52 Updates CMOS memory size from memory found in memory test.
60 Initializes NUM-LOCK status and programs the KBD typematic rate.
75 Initialize Int-13 and prepare for IPL detection.
78 Initializes IPL devices controlled by BIOS and option ROMs.
7A Initializes remaining option ROMs.
7C Generate and write contents of ESCD in NVRam.
84 Log errors encountered during POST.
85 Display errors to the user and gets the user response for error.
87 Execute BIOS setup if needed / requested.
8C Late POS T initialization of chipset registers.
8E Program the peripheral parameters. Enable/Disable NMI as selected
90 Late POST initialization of system management interrupt.
A0 Check boot password if installed.
A1 Clean-up work needed before booting to OS.
A2 Takes care of runtime image preparation for different BIOS modules.
A4 Initialize runtime language module.
A7 Displays the system configuration screen if enabled. Initialize the
A8 Prepare CPU for OS boot including final MTRR values.
A9 Wait for user input at config display if needed.
AA Uninstall POST INT1Ch vector and INT09h vector. Deinitializes the
AB Prepare BBS for Int 19 boot.
AC End of POST initialization of chipset registers.
B1 Save system context for ACPI.
00 Passes control to OS Loader (typically INT19h).
needs an adjustment in system RAM size if needed.
Allocates memory for Extended BIOS Data Area from base memory.
Fill the free area in F000h segment with 0FFh. Initializes the
Microsoft IRQ Routing Table. Prepares the runtime language module.
Disables the system configuration display if needed.
CPU’s before boot, which includes the programming of the MTRR’s.
ADM module.
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NOTE
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Appendix: How to Make a Driver Diskette
Follow the steps below to make a driver diskette from the TYAN® driver CD
provided.
1. Start the system and insert the TYAN
CD. You will see the following menu. Then press [1] and [Enter] to boot the
system to TYAN® diskette maker. (If you would like to boot from hard
disk, press 0 and Enter or just wait for 10 seconds to boot automatically from
hard disk.).
Boot from CD:
ISOLINUX 2.00 2002-10-25 Copyright (C) 1994-2002 H. Peter Anvin
0) Boot from first hard drive
1) Boot to TYAN diskette maker
boot: 1_
2. Choose the chipset vender which you need from the main menu.
TYAN Driver Diskette Maker V1.0
®
CD into the CD-ROM drive to boot from
====Choose Chipset Vendor====
01 Adaptec
02 Intel
03 LSI
04 nVidia
05 Promise
06 Silicon Image
07 VIA
EXIT
** Main Menu**
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3. The following picture pops up after selecting the chipset model.
01 nVidia NVRAID
EXIT
TYAN Driver Diskette Maker
** nVidia **
====Choose Chipset Model====
4. After selecting the chipset model, select the OS to start the diskette making.
TYAN Driver Diskette Maker
====Example Chipset Driver====
Diskette =01= Microsoft Windows 2000 32-bit
Diskette =02= Microsoft Windows XP 32-bit
Diskette =03= Microsoft Windows XP 64bit
Diskette =04= Microsoft Windows 2003 64-bit
Back
5. Follow the instruction on menu to insert a diskette and press [ENTER].
\Please insert a formatted diskette into A:/ and press [ENTER]
Writing image to drive A:
Track: 36 Hoad: 8 Sector: 1
6. Using "ESC" key to quit the TYAN
®
diskette maker. The system will
automatically restart.
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Glossary
ACPI (Advanced Configuration and Power Interface): a power management
specification that allows the operating system to control the amount of power
distributed to the computer’s devices. Devices not in use can be turned off, reducing
unnecessary power expenditure.
AGP (Accelerated Graphics Port): a PCI-based interface which was designed
specifically for demands of 3D graphics applications. The 32-bit AGP channel
directly links the graphics controller to the main memory. While the c hannel runs
only at 66 MHz, it supports data transmission during both the rising and falling ends
of the clock cycle, yielding an effective speed of 133 MHz.
ATAPI (AT Attachment Packet Interface): also known as IDE or ATA; a drive
implementation that includes the disk controller on the device itself. It allows CDROMs and tape drives to be configured as master or slave devices, just like HDDs.
ATX: the form factor designed to replace the AT form factor. It improves on the AT
design by rotating the board 90 degrees, so that the IDE connectors are closer to
the drive bays, and the CPU is closer to the power supply and cooling fan. The
keyboard, mouse, USB, serial, and parallel ports are built-in.
Bandwidth: refers to carrying capacity. The greater the bandwidth, the more data
the bus, phone line, or other electrical path can carry. Greater bandwidth results in
greater speed.
BBS (BIOS Boot Specification): a feature within the BIOS that creates, prioritizes,
and maintains a list of all Initial Program Load (IPL) devices, and then stores that
list in NVRAM. IPL devices have the ability to load and execute an OS, as well as
provide the ability to return to the BIOS if the OS load process fails. At that point,
the next IPL device is called upon to attempt loading of the OS.
BIOS (Basic Input/Output System): the program that resides in the ROM chip,
which provides the basic instructions for controlling yo ur computer’s hardware. Both
the operating system and application software use BIOS routines to ensure
compatibility.
Buffer: a portion of RAM which is used to temporarily store data; usually from an
application though it is also used when printing and in most keyboard drivers. The
CPU can manipulate data in a buffer before copying it to a disk drive. While this
improves system performance (reading to or writing from a disk driv e a single time
is much faster than doing so repeatedly) there is the possibility of losing yo ur data
should the system crash. Information in a buffer is temporarily stored, not
permanently saved.
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Bus: a data pathway. The term is used especially to refer to the connection
between the processor and system memory, and between the pr ocessor a nd PCI or
ISA local buses.
Bus mastering: allows peripheral devices and IDEs to access the system memor y
without going through the CPU (similar to DMA channels).
Cache: a temporary storage area for data that will be needed often by an
application. Using a cache lowers data access times since t he information is stored
in SRAM instead of slower DRAM. Note that the cache is also much smaller tha n
your regular memory: a typical cache size is 512KB, while you may have as much
as 4GB of regular memory.
Closed and open jumpers: jumpers and jumper pins are active when they are “on”
or “closed”, and inactive when they are “off” or “open”.
CMOS (Complementary Metal-Oxide Semiconductors): chips that hold the basic
startup information for the BIOS.
COM port: another name for the serial port, which is called as such because it
transmits the eight bits of a byte of data along one wire, and receives data on
another single wire (that is, the data is transmitted in serial form, one bit after
another). Parallel ports transmit the bits of a byte on eight different wires at the
same time (that is, in parallel form, eight bits at the same time).
DDR (Double Data Rate): a technology designed to double the clock speed of the
memory. It activates output on both the rising and falling edge of the system clock
rather than on just the rising edge, potentially doubling output.
DIMM (Dual In-line Memory Module): faster and more capacious form of RAM
than SIMMs, and do not need to be installed in pairs.
DIMM bank: sometimes called DIMM socket because the physical slot and the
logical unit are the same. That is, one DIMM module fits into one DIMM socket,
which is capable of acting as a memory bank.
DMA (Direct Memory Access): channels that are similar to IRQs. DMA channels
allow hardware devices (like soundcards or keyboards) to access the main memory
without involving the CPU. This frees up CPU resources for other tasks. As with
IRQs, it is vital that you do not double up devices on a single line. Plug-n-Play
devices will take care of this for you.
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DRAM (Dynamic RAM): widely available, very affordable form of RAM which
looses data if it is not recharged regularly (every few milliseconds). This refresh
requirement makes DRAM three to ten times slower than non-recharged RAM such
as SRAM.
ECC (Error Correction Code or Error Checking and Correcting): allo ws data to
be checked for errors during run-time. Errors can subsequently be corrected at the
same time that they’re found.
EEPROM (Electrically Erasable Programmable ROM): also called Flash BIOS, it
is a ROM chip which can, unlike normal ROM, be updated. This allows you to keep
up with changes in the BIOS programs without having to buy a new chip. TYAN
®
’s
BIOS updates can be found at http://www.tyan.com
ESCD (Extended System Configuration Data): a format for storing information
about Plug-n-Play devices in the system BIOS. This information helps properly
configure the system each time it boots.
Firmware: low-level software that controls the system hardware.
Form factor: an industry term for the size, shape, power supply type, and external
connector type of the Personal Computer Board (PCB) or motherboard. The
standard form factors are the AT and ATX.
Global timer: onboard hardware timer, such as the Real-Time Clock (RTC).
HDD: stands for Hard Disk Drive, a type of fixed drive.
H-SYNC: controls the horizontal synchronization/properties of the monitor.
HyperTransport
TM
: a high speed, low latency, scalable point-to-point link for
interconnecting ICs on boards. It can be significantly faster than a PCI bus for an
equivalent number of pins. It provides the bandwidth and flexibility critical f or today' s
networking and computing platforms while retaining the fundamental programming
model of PCI.
IC (Integrated Circuit): the formal name for the computer chip.
IDE (Integrated Device/Drive Electronics): a simple, self-contained HDD interface.
It can handle drives up to 8.4 GB in size. Almost all IDEs sold now are in fact
Enhanced IDEs (EIDEs), with maximum capacity determined by the hardware
controller.
IDE INT (IDE Interrupt): Hardware interrupt signal that goes to the IDE.
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I/O (Input/Output): the connection between your computer and another piece of
hardware (mouse, keyboard, etc.)
IRQ (Interrupt Request): an electronic request that runs from a hardware device to
the CPU. The interrupt controller assigns priorities to incoming requests and
delivers them to the CPU. It is important that there is only one device hooked up to
each IRQ line; doubling up devices on IRQ lines can lock up your system. Plug-nPlay operating systems can take care of these details for you.
Latency: the amount of time that one part of a system spends waiting for another
part to catch up. This occurs most commonly when the system sends data out to a
peripheral device and has to wait for the peripheral to spread (peripherals tend to
be slower than onboard system components).
NVRAM: ROM and EEPROM are both examples of Non-Volatile RAM, memory that
holds its data without power. DRAM, in contrast, is volatile.
Parallel port: transmits the bits of a byte on eight different wires at the same time.
PCI (Peripheral Component Interconnect): a 32 or 64-bit local bus (data pathway)
which is faster than the ISA bus. Local buses are those which operate within a
single system (as opposed to a network bus, which connects multiple systems).
PCI PIO (PCI Programmable Input/Output) modes: the data transfer modes used
by IDE drives. These modes use the CPU for data transfer (in contrast, DMA
channels do not). PCI refers to the type of bus used by these modes to
communicate with the CPU.
PCI-to-PCI Bridge: allows you to connect multiple PCI devices onto one PCI slot.
Pipeline burst SRAM: a fast secondary cache. It is used as a secondary cache
because SRAM is slower than SDRAM, but usually larger. Data is cached first to
the faster primary cache, and then, when the primary cache is full, to the slower
secondary cache.
PnP (Plug-n-Play): a design standard that has become ascendant in the industry.
Plug-n-Play devices require little set-up to use. Devices and operating systems that
are not Plug-n-Play require you to reconfigure your system each time you add or
change any part of your hardware.
PXE (Preboot Execution Environment): one of four components that together
make up the Wired for Management 2.0 baseline specification. PXE was
designed to define a standard set of preboot protocol services within a client with
the goal of allowing networked-based booting to boot using industry standard
protocols.
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RAID (Redundant Array of Independent Disks): a way for the same data to be
stored in different places on many hard drives. By using this method, the data is
stored redundantly and multiple hard drives will appear as a single drive to the
operating system. RAID level 0 is known as striping, where data is striped (or
overlapped) across multiple hard drives, but offers no fault-tolerance. RAID leve l 1
is known as mirroring, which stores the data within at least two hard drives, but
does not stripe. RAID level 1 also allows for faster access time and fault-tolerance,
since either hard drive can be read at the same time. RAID level 0+1 is striping and
mirroring, providing fault-tolerance, striping, and faster access all at the same time.
RAIDIOS: RAID I/O Steering (Intel)
RAM (Random Access Memory): technically refers to a type of memory where
any byte can be accessed without touching the adjacent data and is often referred
to the system’s main memory. This memory is available to any program running o n
the computer.
ROM (Read-Only Memory): a storage chip which contains the BIOS; the basic
instructions required to boot the computer and start up the operating system.
SDRAM (Synchronous Dynamic RAM): called as such because it can keep two
sets of memory addresses open simultaneously. By transferring data alternately
from one set of addresses and then the other, SDRAM cuts down on the delays
associated with non-synchronous RAM, which must close one address bank before
opening the next.
Serial port: called as such because it transmits the eight bits of a byte of data
along one wire, and receives data on another single wire (that is, the data is
transmitted in serial form, one bit after another).
SCSI Interrupt Steering Logic (SISL): Architecture that allows a RAID controller,
such as AcceleRAID 150, 200 or 250, to implement RAID on a system boardembedded SCSI bus or a set of SCSI busses. SISL: SCSI Interrupt Steering Logic
(LSI) (only on LSI SCSI boards)
Sleep/Suspend mode: in this mode, all devices except the CPU shut down.
SDRAM (Static RAM): unlike DRAM, this type of RAM does not need to be
refreshed in order to prevent data loss. Thus, it is faster and more expensive.
SLI (Scalable Link Interface): NVIDIA SLI technology links two graphics cards
together to provide scalability and increased performance. NVIDIA SLI takes
advantage of the increased
features hardware and software innovations within NVIDIA GPUs (graphics
processing units) and NVIDIA MCPs (media and communications processors).
bandwidth of the PCI Express bus architecture, and
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Depending on the
performance of a single GPU configuration.
Standby mode: in this mode, the video and hard drives shut down; all other
devices continue to operate normally.
UltraDMA-33/66/100: a fast version of the old DMA channel. UltraDMA is also
called UltraATA. Without a proper UltraDMA controller, your system cannot take
advantage of higher data transfer rates of the new UltraDMA/UltraATA hard drives.
USB (Universal Serial Bus): a versatile port. This one port type can function as a
serial, parallel, mouse, keyboard or joystick port. It is fast enough to support video
transfer, and is capable of supporting up to 127 daisy-chained peripheral devices.
VGA (Video Graphics Array): the PC video display standard
V-SYNC: controls the vertical scanning properties of the monitor.
ZCR (Zero Channel RAID): PCI card that allows a RAID card to use the onboard
SCSI chip, thus lowering cost of RAID solution
ZIF Socket (Zero Insertion Force socket): these sockets make it possible to insert
CPUs without damaging the sensitive CPU pins. The CPU is lightly placed in an
open ZIF socket, and a lever is pulled down. This shifts the processor over and
down, guiding it into the board and locking it into place.
application, NVIDIA SLI can deliver as much as two times the
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Technical Support
If a problem arises with your system, you should first turn to your dealer for direct
support. Your system has most likely been configured or designed by them and
they should have the best idea of what hardware and software your system
contains. Hence, they should be of the most assistance for you. Furthermor e, if
you purchased your system from a dealer near you, take the system to them
directly to have it serviced instead of attempting to do so yourself (which can have
expensive consequences).
If these options are not available for you then TYAN® Computer Corporation can
help. Besides designing innovative and quality products for over a dec ade, TYAN
has continuously offered customers service beyond their expectations. TYAN
website (www.tyan.com) provides easy-to-access resources such as in-depth
Linux Online Support sections with downloadable Linu x drivers and comprehensive
compatibility reports for chassis, memory and much more. With all these convenie nt
resources just a few keystrokes away, users can easily find the latest software and
operating system components to keep their systems running as powerful and
productive as possible. TYAN® also ranks high for its commitment to fast and
friendly customer support through email. By offering plenty of options for users,
TYAN® serves multiple market segments with the industry's most competitive
services to support them.
“TYAN®'s tech support is some of the most impressive we've seen, with great
response time and exceptional organization in general"
----Anandtech.com
Help Resources:
1. See the beep codes section of this manual.
2. See the TYAN
information: http://www.tyan.com
3. Contact your dealer for help BEFORE calling TYAN
4. Check the TYAN
Returning Merchandise for Service
During the warranty period, contact your dis tributor or system vendor F IRST for any
product problems. This warranty only covers normal customer use and does not
cover damages incurred during shipping or failure due to the alteration, misuse,
abuse, or improper maintenance of products.
®
website for FAQ’s, bulletins, driver updates, and other
®
user group:
alt.comp.periphs.mainboard.TYAN
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®
.
®
®
's
Note:
A receipt or copy of your invoice marked with the
date of purchase is required before any warranty
service can be rendered. You may obtain service by
calling the manufacturer for a Return Merchandise
Authorization (RMA) number. The RMA number
Should be prominently displayed on the outside of
the shipping carton and the package should be
mailed prepaid. TYAN
shipped back to you.
Notice for the USA
Compliance Information Statement (Declaration of
Conformity Procedure) DoC
FCC Part 15: This device complies with part 15 of the FCC
Rules
Operation is subject to the following conditions:
This device may not cause harmful interference, and this device must accept an y
interference received including interference that may cause undesired operation. If
this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is
encouraged to try one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Plug the equipment into an outlet on a circuit different from that of the receiver.
Consult the dealer on an experienced radio/television technician for help.
Notice for Canada
This apparatus complies with the Class B limits for radio interference as specified in
the Canadian Department of Communications Radio Interference Regul ations. (Cet
appareil est conforme aux norms de Classe B d’interference radio tel que specifie
par le Ministere Canadien des Communications dans les r eglements d’ineteference
radio.)
CAUTION: Lithium battery included with this board. Do not puncture, mutilate, or
dispose of battery in fire. Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by manufacturer.
Dispose of used battery according to manufacturer instructions and in accordance
with your local regulations.
Document #: D2009-100
®
will pay to have the board
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