TYAN GT86C-B5630 Service Engineer's Manual

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GT86C-B5630

Service Engineer’s Manual

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PREFACE

This publication, including all photographs, illustrations, and software, is protected under international copyright laws, with all rights reserved. Neither this manual, nor any material contained herein, may be reproduced without written consent of manufacturer.

Version 1.0

Disclaimer

Information contained in this document is furnished by MiTAC COMPUTING TECHNOLOGY CORPORATION and has been reviewed for accuracy and

reliability prior to printing. TYAN® assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TYAN® products

including liability or warranties relating to fitness for a particular purpose or merchantability. TYAN® retains the right to make changes to produce descriptions and/or specifications at any time, without notice. In no event will TYAN® be held liable for any direct or indirect, incidental or consequential damage, loss of use, loss

of data or other malady resulting from errors or inaccuracies of information contained in this document.

Trademark Recognition

All registered and unregistered trademarks and company names contained in this manual are property of their respective owners including, but not limited to the following.

TYAN® is a trademark of MiTAC COMPUTING TECHNOLOGY CORPORATION. Intel® is a trademark of Intel Corporation. AMI®, AMIBIOS® and combinations thereof are trademarks of AMI Technologies. Microsoft®, Windows® are trademarks of Microsoft Corporation. IBM®, PC®, AT

and PS/2® are trademarks of IBM Corporation.

Winbond® is a trademark of Winbond Electronics Corporation.

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 FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of Conformity Procedure) DoC FCC Part 15: This device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject to the following conditions:

·This device may not cause harmful interference.

·This device must accept any interference received, including interference that may

cause undesirable operation. This equipment has been tested and found to comply with the limits for a Class A

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet appareil numérique de la Classe A est conforme à la norme NMB-003 du Canada.

 Notice for Europe (CE Mark)

This product is in conformity with the Council Directive 2014/30/EU.

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Warning This equipment is compliant with Class A of CISPR 32. In a residential environment

this equipment may cause radio interference.

CAUTION Lithium battery included with this board. Do not puncture, mutilate, or dispose of

battery in fire. There will be danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by manufacturer. Dispose of used battery according to manufacturer instructions and in accordance with your local regulations.

● VCCI-A

この装置は、クラスＡ情報技術装置です。この装置を家庭環境で使用すると電波妨害を引き起こすことがあります。この場合には使用者が適切な対策を講ずるよう

要求されることがあります。

● Safety: EN/IEC 60950-1

This equipment is compliant with CB/LVD of Safety: EN/IEC 60950-1.

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About this Manual

This Manual is intended for experienced users and integrators with hardware knowledge of personal computers. It is aimed to provide you with instructions on

installing your TYAN® GT86C-B5630.

How this guide is organized

This guide contains the following parts: Chapter 1: Overview

This chapter give an introduction to the GT86C-B5630 barebones, standard parts list, and accessories. describes the external components, gives a table of key

Chapter2: Setting Up

This chapter Covers procedures on installing the CPU, memory modules, add on card and hard drives. Give an overview about theGT86C-B5630 barebone from an overall angle.

Chapter 3: Replacing the Pre-installed Components

This chapter covers the removal and replacement procedures for pre-installed components.

Appendix: This chapter provides the cable connection table, the FRU parts list for reference of system setup, and technical support in case a problem arises with your system.

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Safety and Compliance Information

Before installing and using TYAN® GT86C-B5630, take note of the following precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.

·Do not block the slots and opening on the unit, which are provided for

ventilation.

· Only use the power source indicated on the marking label. If you are not sure,

contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third pin to ground the unit and prevent electric shock. Do not defeat the purpose of this

pin. If your outlet does not support this kind of plug, contact your electrician to replace your obsolete outlet.

·Do not place anything on the power cord. Place the power cord where it will not be in the way of foot traffic.

·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high voltage

components and result in shock and damage to the components.

·When replacing parts, ensure that you use parts specified by the

manufacturer.

·When service or repairs have been done, perform routine safety checks to verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating device.

·Cover the unit when not in use.

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Safety Information

Retain and follow all product safety and operating instructions provided with your equipment. In the event of a conflict between the instructions in this guide and the instructions in equipment documentation, follow the guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions. To reduce the risk of bodily injury, electric shock, fire and damage to the equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide before you install, operate, or service TYAN products.

Symbols on Equipment

Caution. This symbol indicates a potential hazard.

The potential for injury exists if cautions are not observed. Consult equipment documentation for specific details.

Caution. Slide-mounted equipment is not to be used as a shelf or a work space.

Warning. This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.

Warning. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. To reduce risk of injury from a hot component, allow the surface to cool before touching.

Warning. Hazardous moving parts keep away

from moving fan blades.

General Precautions

· Follow all caution and warning instructions marked on the equipment and explained in the accompanying equipment documentation.

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Machine Room Environment

· This device is for use only in a machine room or IT room.

 · Make sure that the area in which you install the system is properly

ventilated and climate-controlled.

· Ensure that the voltage and frequency of your power source match the voltage and frequency inscribed on the electrical rating label of the equipment.

· Do not install the system in or near a plenum, air duct, radiator, or heat register.

· Never use the product in a wet location.

Equipment Chassis

· Do not block or cover the openings to the system.

· Never push objects of any kind through openings in the equipment.

Dangerous voltages might be present.

· Conductive foreign objects can produce a short circuit and cause fire, electric shock, or damage to your equipment.

· Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

· Observe local occupational health and safety requirements and guidelines for manual materials handling.

· Do not attempt to move a rack by yourself; a minimum of two people are needed to move a rack.

· Do not attempt to move a fully loaded rack. Remove equipment from the rack before moving it.

· Do not attempt to move a rack on an incline that is greater than 10 degrees from the horizontal.

· Make sure the rack is properly secured to the floor or ceiling.

· Make sure the stabilizing feet are attached to the rack if it is a single-rack

installation.

· Make sure racks are coupled together if it is a multiple-rack installation.

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· Make sure the rack is level and stable before installing an appliance in the rack.

· Make sure the leveling jacks are extended to the floor.

· Make sure the full weight of the rack rests on the leveling jacks.

· Always load the rack from the bottom up. Load the heaviest component in

the rack first.

· Make sure the rack is level and stable before pulling a component out of the rack.

· Make sure only one component is extended at a time. A rack might become unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and cable management.

· Ensure that there is adequate airflow in the rack. Improper installation or restricted airflow can damage the equipment.

· The rack cannot have solid or restricted airflow doors. You must use a mesh door on the front and back of the rack or remove the doors to ensure adequate

air flow to the system.

· If you install the Model in a rack, do not place equipment on top of the unit. It will cause restricted airflow and might cause damage to the equipment.

· Make sure the product is properly matted with the rails. Products that are

improperly matted with the rails might be unstable.

· Verify that the AC power supply branch circuit that provides power to the rack is

not overloaded. This will reduce the risk of personal injury, fire, or damage to the equipment. The total rack load should not exceed 80 percent of the branch circuit rating. Consult the electrical authority having jurisdiction over your facility wiring and installation requirements.

· Verify that the AC power supply branch circuit that provides power to the rack is

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· When use 100V-127VAC input: The system does not support redundant PSU operation if the total system load exceeds 20A.

Equipment Power Cords

· Use only the power cords and power supply units provided with your system. The system might have one or more power cords.

· Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times.

· In all European electrical environments, you must ground the Green/Yellow tab on the power cord. If you do not ground the Green/Yellow tab, it can cause an

electrical shock due to high leakage currents.

· Do not place objects on AC power cords or cables. Arrange them so that no one

might accidentally step on or trip over them.

· Do not pull on a cord or cable. When unplugging from the electrical outlet, grasp the cord by the plug.

· To reduce the risk of electrical shock, disconnect all power cords before servicing the appliance.

Equipment Batteries

· The system battery contains lithium manganese dioxide. If the battery pack is not handled properly, there is risk of fire and burns.

· Do not disassemble, crush, puncture, short external contacts, or dispose of the battery in fire or water.

· Do not expose the battery to temperatures higher than 60°C (140°F).

· The system battery is not replaceable. If the battery is replaced by an incorrect

type, there is danger of explosion. Replace the battery only with a spare designated for your product.

· Do not attempt to recharge the battery.

· Dispose of used batteries according to the instructions of the manufacturer. Do

not dispose of batteries with the general household waste. To forward them to recycling or proper disposal, use the public collection system or return them to TYAN, your authorized TYAN partner, or their agents.

Equipment Modifications

· Do not make mechanical modifications to the system. TYAN is not responsible

for the regulatory compliance of TYAN equipment that has been modified.

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Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service of this

product should be performed by trained service technician/personnel who are knowledgeable about the procedures, precautions, and hazards associated with equipment containing hazardous energy levels.

· Do not exceed the level of repair specified in the procedures in the product

documentation. Improper repairs can create a safety hazard.

· Allow the product to cool before removing covers and touching internal

components.

· Remove all watches, rings, or loose jewelry when working before removing

covers and touching internal components.

· Do not use conductive tools that could bridge live parts.

· Use gloves when you remove or replace system components; they can become

hot to the touch.

· If the product sustains damage requiring service, disconnect the product from

the AC electrical outlet and refer servicing to an authorized service provider. Examples of damage requiring service include:

– The power cord, extension cord, or plug has been damaged. – Liquid has been spilled on the product or an object has fallen into the product. – The product has been exposed to rain or water. – The product has been dropped or damaged. – The product does not operate normally when you follow the operating

instructions.

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Table of Contents

Chapter 1: Overview ..................................................................... 14

1.1 About the TYAN GT86C-B5630 .......................................... 14

1.2 Standard Parts List .............................................................. 21

1.2.1 Box Contents ................................................................ 21

1.2.2 Accessories .................................................................. 21

1.3 About the Product ................................................................ 22

1.3.1 System Front View ....................................................... 22

1.3.2 System Rear View ........................................................ 22

1.3.3 LED Definitions ............................................................. 23

1.3.4 Motherboard (S5630) Layout ....................................... 24

1.3.5 Internal View ................................................................. 25

Chapter 2: Setting Up ................................................................... 27

2.0.1 Before you Begin .......................................................... 27

2.0.2 Work Area ..................................................................... 27

2.0.3 Tools ............................................................................. 27

2.0.4 Precautions ................................................................... 28

2.1 Installing Motherboard Components ................................... 29

2.1.1 Removing the Chassis Cover ....................................... 29

2.1.2 Installing the CPU and Heat sink .................................. 31

2.1.3 Installing the Memory ................................................... 33

2.1.4 Installing Hard Drives ................................................... 36

2.1.5 Installing the Add-On Card ........................................... 41

Chapter 3: Replacing Pre-Installed Components ...................... 47

3.1 Introduction .......................................................................... 47

3.2 Disassembly Flowchart ........................................................ 47

3.3 Removing the Cover ............................................................ 48

3.4 Replacing the Riser Card .................................................... 48

3.5 Replacing the System Fan .................................................. 49

3.6 Replacing the HDD Backplane ............................................ 50

3.6.1 HDD Backplane Features ............................................. 51

3.6.2 Connector Definition ..................................................... 51

3.7 Replacing the Power Supply ............................................... 52

3.8 Replacing the Motherboard ............................................. 56

Chapter 4: BIOS Setup .................................................................. 57

4.1 About the BIOS .................................................................. 57

4.2 Main Menu .......................................................................... 59

4.3 Advanced Menu ................................................................. 61

4.4 Platform Configuration ..................................................... 90

4.5 Socket Configuration ...................................................... 102

4.6 Server Management ........................................................ 129

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4.7 Security............................................................................. 134

4.8 Boot ................................................................................... 139

4.9 Save & Exit ....................................................................... 142

Chapter 5: Diagnostics ............................................................... 144

5.1 Flash Utility ...................................................................... 144

5.2 AMIBIOS Post Code (Aptio) ............................................ 145

Appendix I: Installing IO Plate for OCP Card ........................... 153

Appendix II: Cable Connection Tables ..................................... 157

Appendix III: FRU Parts Table .................................................... 159

Appendix IV: Technical Support ................................................ 161

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Chapter 1: Overview

1.1 About the TYAN GT86C-B5630

Congratulations on your purchase of the TYAN®GT86C-B5630, a highly optimized rack-mountable 1U barebone system.GT86C-B5630 is designed to support single

Intel® Xeon® Scalable Processor Families and Up to 384GB RDIMM/ 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS DDR4 Memory, providing a rich

feature set and incredible performance. Leveraging advanced technology from Intel®,GT86C-B5630 server system is capable of offering scalable 32 and 64-bit computing, high-bandwidth memory design, and lightning-fast PCI-E bus

implementation.GT86C-B5630 not only empowers your company in today’s demanding IT environment but also offers a smooth path for future application usage.

TYAN® also offers theGT86C-B5630 in a version that can support up to twelve

3.5”/2.5” Easy-Swap SSDs/HDDs and two 2.5” fixed SSDs/HDDs.GT86C-B5630

uses rack-mountable 1U chassis featuring a robust structure and a solid mechanical enclosure. All of this provides GT86C-B5630 the power and flexibility to meet the needs of nearly any server application.

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1.2 Features

B5630G86CV12 Specifications

System

Form Factor

1U Rackmount

Chassis Model

GT86C

Dimension (D x W x H)

33.86" x 17.32" x 1.72" (860 x 440 x

43.6mm)

Motherboard

S5630GMR

Gross Weight

20 kg (44 lbs)

Net weight

10.5kg (23.5 lbs)

Front Panel

Buttons

(1) PWR, (1) RST

Internal Drive Bay

Type / Q'ty

3.5"/2.5" Easy-Swap SSD/HDD, (12)

HDD backplane support

SATA 6.0Gb/s

Supported HDD Interface

(12) SATA 6Gb/s

Internal Drive Bay

Type / Q'ty

(2) 2.5" easy-swap HDD/SSD

Supported HDD Interface

(2) SATA 6Gb/s

System Cooling Configuration

FAN

(5) 4cm fans

Power Supply

Type

PSU (single)

Input Range

AC 100-127V/8A, AC 200-240V/4A

Frequency

50/60Hz

Output Watts

500 Watts

Efficiency

PFC, 80 plus gold

Redundancy

N/A

Processor

Socket Type / Q'ty

LGA3647/ (1)

Supported CPU Series

Intel Xeon Scalable Processor

Thermal Design Power (TDP) wattage

Max up to 205W

Chipset

PCH

Intel C621

Memory

Supported DIMM Qty

(12) DIMM slots

DIMM Type / Speed

DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2666

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Capacity

Up to 384GB RDIMM/ 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS *Follow latest Intel DDR4 Memory POR

Memory channel

6 Channels

Memory voltage

1.2V

Expansion Slots

PCI-E

(1) PCI-E Gen3 x16 slot

Others:

(1) PCI-E Gen3 x16 OCP slots (conn.A+conn.B)

LAN

Port Q'ty

(1) PHY

PHY

Realtek RTL8211E

Storage

SATA

Connector

(2) Mini-SAS HD (8-ports)

Controller

Intel C621

Speed

6.0 Gb/s

RAID

RAID 0/1/10/5 (Intel RSTe)

sSATA

Connector

(2) SATA/SATA-DOM, (1) Mini-SAS HD (4-ports)

Controller

Intel C621

Speed

6.0 Gb/s

RAID

RAID 0/1/10/5 (Intel RSTe)

Graphic

Connector type

D-Sub 15-pin

Resolution

Up to 1920x1200

Chipset

Aspeed AST2500

I/O Ports

USB

(2) USB3.0 ports (at rear), (1) USB3.0 TYPE-A

COM

(1) DB-9 COM port

VGA

(1) D-Sub 15-pin port

RJ-45

(1) GbE port dedicated for IPMI

TPM (Optional)

TPM Support

Please refer to our TPM supported list.

System Monitoring

Chipset

Aspeed AST2500

Temperature

Monitors temperature for CPU & memory & system environment

Voltage

Monitors voltage for CPU, memory, chipset & power supply

LED

Over temperature warning indicator, Fan & PSU fail LED indicator

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Others

Watchdog timer support

Server Management

Onboard Chipset

Onboard Aspeed AST2500

AST2500 iKVM Feature

IPMI 2.0 compliant baseboard management controller (BMC), Supports storage over IP and remote platform-flash, USB 2.0 virtual hub

AST2500 IPMI Feature

24-bit high quality video compression, 10/100/1000 Mb/s MAC interface

BIOS

Brand / ROM size

AMI, 32MB

Feature

Hardware Monitor, ACPI 5.0, SMBIOS 3.0/PnP/Wake on LAN, Boot from USB device/PXE via LAN/Storage, User Configurable FAN PWM Duty Cycle, Console Redirection, ACPI sleeping states S4,S5

Operating System

OS supported list

Please refer to our AVL support lists., SuSE Linux/ SLES, VMware ESX, Windows Server 2008, 2008 R2, Red Hat Enterprise Linux Server

Regulation

CE (DoC)

Class A

VCCI

Class A

CB/LVD

Yes

RCM

Class A

FCC (DoC)

Class A

Operating Environment

Operating Temp.

10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

In/Non-operating Humidity

90%, non-condensing at 35° C, 5%~95%, non-condensing

RoHS

RoHS 6/6 Compliant

Yes

Package Contains

Manual

(1) Quick Installation Guide

Installation CD

(1) TYAN Device Driver CD

Barebone

(1) GT86C-B5630 Barebone

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B5630G86CV12R Specifications

System

Form Factor

1U Rackmount

Chassis Model

GT86C

Dimension (D x W x H)

33.86" x 17.32" x 1.72" (860 x 440 x

43.6mm)

Motherboard

S5630GMR

Gross Weight

20 kg (44 lbs)

Net weight

10.5kg (23.5 lbs)

Front Panel

Buttons

(1) PWR, (1) RST

Internal Drive Bay

Type / Q'ty

3.5"/2.5" Easy-Swap SSD/HDD, (12)

HDD backplane support

SATA 6.0Gb/s

Supported HDD Interface

(12) SATA 6Gb/s

System Cooling Configuration

FAN

(5) 4cm fans

Power Supply

Type

RPSU

Input Range

AC 110-240V/8-4A

Frequency

47-63 Hz

Output Watts

500 Watts

Efficiency

PFC, 80 plus gold

Redundancy

1+1

Processor

Socket Type / Q'ty

LGA3647/ (1)

Supported CPU Series

Intel Xeon Scalable Processor

Thermal Design Power (TDP) wattage

Max up to 205W

Chipset

PCH

Intel C621

Memory

Supported DIMM Qty

(12) DIMM slots

DIMM Type / Speed

DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2666

Capacity

Up to 384GB RDIMM/ 768GB LRDIMM/ 1,536GB RDIMM 3DS/LRDIMM 3DS *Follow latest Intel DDR4 Memory POR

Memory channel

6 Channels

Memory voltage

1.2V

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Expansion Slots

PCI-E

(1) PCI-E Gen3 x16 slot

Others:

(1) PCI-E Gen3 x16 OCP slots (conn.A+conn.B)

LAN

Port Q'ty

(1) PHY

PHY

Realtek RTL8211E

Storage

SATA

Connector

(2) Mini-SAS HD (8-ports)

Controller

Intel C621

Speed

6.0 Gb/s

RAID

RAID 0/1/10/5 (Intel RSTe)

sSATA

Connector

(2) SATA/SATA-DOM, (1) Mini-SAS HD (4-ports)

Controller

Intel C621

Speed

6.0 Gb/s

RAID

RAID 0/1/10/5 (Intel RSTe)

Graphic

Connector type

D-Sub 15-pin

Resolution

Up to 1920x1200

Chipset

Aspeed AST2500

I/O Ports

USB

(2) USB3.0 ports (at rear), (1) USB3.0 TYPE-A

COM

(1) DB-9 COM port

VGA

(1) D-Sub 15-pin port

RJ-45

(1) GbE port dedicated for IPMI

TPM (Optional)

TPM Support

Please refer to our TPM supported list.

System Monitoring

Chipset

Aspeed AST2500

Temperature

Monitors temperature for CPU & memory & system environment

Voltage

Monitors voltage for CPU, memory, chipset & power supply

LED

Over temperature warning indicator, Fan & PSU fail LED indicator

Others

Watchdog timer support

Server Management

Onboard Chipset

Onboard Aspeed AST2500

AST2500 iKVM Feature

IPMI 2.0 compliant baseboard management controller (BMC), Supports storage over IP and remote platform-flash, USB 2.0

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virtual hub

AST2500 IPMI Feature

24-bit high quality video compression, 10/100/1000 Mb/s MAC interface

BIOS

Brand / ROM size

AMI, 32MB

Feature

Hardware Monitor, ACPI 5.0, SMBIOS 3.0/PnP/Wake on LAN, Boot from USB device/PXE via LAN/Storage, User Configurable FAN PWM Duty Cycle, Console Redirection, ACPI sleeping states S4,S5

Operating System

OS supported list

Please refer to our AVL support lists., SuSE Linux/ SLES, VMware ESX, Windows Server 2008, 2008 R2, Red Hat Enterprise Linux Server

Regulation

CE (DoC)

Class A

VCCI

Class A

CB/LVD

Yes

RCM

Class A

FCC (DoC)

Class A

Operating Environment

Operating Temp.

10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

In/Non-operating Humidity

90%, non-condensing at 35° C

RoHS

RoHS 6/6 Compliant

Yes

Package Contains

Manual

(1) Quick Installation Guide

Installation CD

(1) TYAN Device Driver CD

Barebone

(1) GT86C-B5630 Barebone

NOTE:

1. The specifications are subject to change without prior notice.

2. Please visit our website for the latest specifications.

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1.2 Standard Parts List

This section describes GT86C-B5630 package contents and accessories. Open the box carefully and ensure that all components are present and undamaged. The product should arrive packaged as illustrated below.

1.2.1 Box Contents

GT86C-B5630 (B5630G86CV12R) Box Content

 (1) 1U barebone with (12) easy-swap HDD bays  (1) 500W PSU (1+1 redundant)  (1) S5630GMR system Board (pre-installed)  (5) System Fans  (3) M7051G86-BP6-4 HDD Backplane (pre-installed)  (1) M2091/Riser Board(pre-installed)

GT86C-B5630 (B5630G86CV12) Box Content

 (1) 1U barebone with (12) easy-swap HDD bays  (1) 2.5’ easy-swap HDD/SSD HDD bays  (1) 500W PSU  (1) S5630GMR system Board (pre-installed)  (5) System Fans  (3) M7051G86-BP6-4 HDD Backplane (pre-installed)  (1) M2091/Riser Board(pre-installed)

1.2.2 Accessories

If any items are missing or appear damaged, contract your retailer or browse to TYAN®’s website for service: http://www.tyan.com.

GT86C-B5630 Accessory Kit

 (1) CPU Clip Narrow Non-Fabric CPU Carrier+COVER  (1) Rail kit  (1) QIG  (1) CPU heatsink  (2) US power cord(B5630G86CV12R)/(1) US power cord (B5630G86CV12)  (2) EU power cord(B5630G86CV12R)/(1) EU power cord (B5630G86CV12)  (3) SCREW KIT

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1.3 About the Product

The following views show you the product.

1.3.1 System Front View

1.3.2 System Rear View

B5630G86CV12

B5630G86CV12R

No.

Description

500W Power Supply

ID LED Button

Serial Port

Type-A USB 3.0 Ports

Optional OCP LAN card location

D-sub VGA Port

1Gb RJ45 LAN from Realtek RLT8211 (dedicated for BMC/IPMI)

Expansion Slots for PCI-E add on card

500W PSU (1+1 redundant)

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1.3.3 LED Definitions

1Gbps LAN Port LAN Indication

10/100/1000 Mbps LAN Link/Activity LED Scheme

Left LED

(Link/Activity)

Right LED

(Speed)

No Link

OFF

10 Mbps

Link

Solid Green

OFF

Active

Blinking Green

OFF

100 Mbps

Link

Solid Green

Active

Blinking Green

Solid Green

1000 Mbps

(1Gbps)

Link

Solid Green

Solid Amber

Active

Blinking Green

Solid Amber

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1.3.4 Motherboard (S5630) Layout

This diagram is representative of the latest board revision available at the time of publishing. The board you receive may not look exactly like the above diagram. The DIMM slot numbers shown above can be used as a reference when reviewing the DIMM population guidelines shown later in the manual. For the latest board revision, please visit our web site at http://www.tyan.com.

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1.3.5 Internal View

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NO.

Description

NO.

Description

(12) 3.5”/2.5” easy-swap HDD/SSD Hard Disk tray

(3) M7051G86-BP6-4 HDD Backplane

(5) System fans

PCIE 3.0 Slot x16

Riser Card bracket

OCP A Slot (J36)

500W PSU

10.

OCP B Slot (J37)

CPU socket

11.

(1) Internal 2.5” HDD/SSD Hard Disk tray (can be install 2 facilities)

Memory Slots

12.

500W PSU (1+1) redundant

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Chapter 2: Setting Up

2.0.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks, memory modules, and hard drives. Instructions on inserting add on cards are also given.

2.0.2 Work Area

Make sure you have a stable, clean working environment. Dust and dirt can get into components and cause malfunctions. Use containers to keep small components separated. Putting all small components in separate containers prevents them from becoming lost. Adequate lighting and proper tools can prevent you from accidentally damaging the internal components.

2.0.3 Tools

The following procedures require only a few tools, including the following:

 A cross head (Phillips) screwdriver  A grounding strap or an anti-static pad

Most of the electrical and mechanical connections can be disconnected using your fingers. It is recommended that you do not use needle-nosed pliers to remove connectors as these can damage the soft metal or plastic parts of the connectors.

Caution!

1. To avoid damaging the motherboard and associated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

2. Do not apply power to the board if it has been damaged.

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2.0.4 Precautions

Components and electronic circuit boards can be damaged by discharges of static electricity. Working on a system that is connected to a power supply can be extremely dangerous. Follow the guidelines below to avoid damage to GT86C-B5630 or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then touch a safely grounded object to release static charge (i.e. power supply case). If available, wear a grounded wrist strap. Alternatively, discharge any static electricity by touching the bare metal chassis of the unit case, or the bare metal body of any other grounded appliance.

 Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When removing

the motherboard, always place it on a grounded anti-static surface until you are ready to reinstall it.

 Hold electronic circuit boards by the edges only. Do not touch the

components on the board unless it is necessary to do so. Do not flex or stress circuit boards.

 Leave all components inside the static-proof packaging that they

ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs, or

other small parts are in place and are not left loose inside the case. Metallic parts or metal flakes can cause electrical shorts.

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2.1 Installing Motherboard Components

This section describes how to install components on to the motherboard, including CPUs, memory modules and Add-on cards.

2.1.1 Removing the Chassis Cover

Follow these instructions to remove GT86C-B5630 chassis cover.

1. Remove the side screw on the chassis cover as in the small diagram.

Loosen the Thumb screw on the back side of the chassis as in the small diagram in a counterclockwise direction.

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2. Push the cover in the direction of the arrow, and take out the top cover from

chassis kit.

+ 132 hidden pages

TYAN GT86C-B5630 Service Engineer's Manual

Specifications and Main Features

Frequently Asked Questions

User Manual