TYAN GT24B-B7076 Service Engineer's Manual

GT24B-B7076

Service Engineer’s Manual

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PREFACE

Copyright

This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.

Copyright 2015 MiTAC International Corporation. All rights reserved. TYAN® is
a registered trademark of MiTAC International Corporation.

Version 1.0

Disclaimer

Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied

warranty, relating to sale and/or use of TYAN® products including liability or
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to produce descriptions and/or specifications
at any time, without notice. In no event will MiTAC be held liable for any direct
or indirect, incidental or consequential damage, loss of use, loss of data or
other malady resulting from errors or inaccuracies of information contained in
this document.

Trademark Recognition

All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.

TYAN® is a trademark of MiTAC International Corporation.
Intel® is a trademark of Intel® Corporation.
AMD® is a trademark of AMD® Corporation.
AMI®, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
IBM®, PC®, AT® and PS/2® are trademarks of IBM Corporation.
Winbond® is a trademark of Winbond Electronics Corporation.

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FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject to
the following conditions:

 This device must not cause harmful interference.
 This device must accept any interference received, including

interference that may cause undesirable operation.

This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norme NMB-003 du
Canada.

Notice for Europe (CE Mark)

This product is in conformity with the Council
Directive 2004/108/EC.

CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according to
manufacturer instructions and in accordance with your local regulations.

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About this Manual

This manual provides you with instructions on installing your TYAN
GT24B-B7076.This manual is intended for trained service technician/
personnel with hardware knowledge of computers..

This manual consists of the following parts:

1. Chapter1: Product Introduction

Provides an introduction to the TYAN GT24B-B7076 barebones,
standard parts list, describes the external components, gives a table
of key components, and provides block diagram of the system.

2. Chapter2: Hardware Setup

Covers procedures on installing the CPU, memory modules and
hard drives.

3. Chapter3: Installation Options

Covers removal and replacement procedures for pre-installed components.

4. Appendix:

List the cable connection and FRU part tables for reference of
system setup, and technical support in case a problem arises with
your system.

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Safety and Compliance Information

Before installing and using TYAN GT24B-B7076, take note of the following
precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.

·Do not block the slots and opening on the unit, which are provided for

ventilation.

· Only use the power source indicated on the marking label. If you are not

sure, contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third pin to

ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.

·Do not place anything on the power cord. Place the power cord where it will

not be in the way of foot traffic.

·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high voltage

components and result in shock and damage to the components.

· When replacing parts, ensure that you use parts specified by the

manufacturer.

·When service or repairs have been done, perform routine safety checks

to verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating

device.

·Cover the unit when not in use.

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Safety Information

Retain and follow all product safety and operating instructions provided
with your equipment. In the event of a conflict between the instructions in
this guide and the instructions in equipment documentation, follow the
guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the
equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide before
you install, operate, or service TYAN products.

Symbols on Equipment

Caution. This symbol indicates a potential hazard.

The potential for injury exists if cautions are not
observed. Consult equipment documentation for
specific details.

Warning. This symbol indicates the presence of
hazardous energy circuits or electric shock hazards.
Refer all servicing to qualified personnel.

Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.
To reduce risk of injury from a hot component, allow
the surface to cool before touching.

Warning. This symbol indicates hazardous moving
parts. Keep away from moving fan blades.

Caution. Slide-mounted equipment is not to be
used as a shelf or a work space.

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General Precautions

· Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.



Machine Room Environment

 · Make sure that the area in which you install the system is properly

ventilated and climate-controlled.

· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.

· Do not install the system in or near a plenum, air duct, radiator, or heat
register.

· Never use the product in a wet location.

Equipment Chassis

· Do not block or cover the openings to the system.

· Never push objects of any kind through openings in the equipment.

Dangerous voltages might be present.

· Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.

· Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

· Observe local occupational health and safety requirements and guidelines
for manual materials handling.

· Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.

· Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.

· Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.

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· Make sure the rack is properly secured to the floor or ceiling.

· Make sure the stabilizing feet are attached to the rack if it is a single-rack

installation.

· Make sure racks are coupled together if it is a multiple-rack installation.

· Make sure the rack is level and stable before installing an appliance in the

rack.

· Make sure the leveling jacks are extended to the floor.

· Make sure the full weight of the rack rests on the leveling jacks.

· Always load the rack from the bottom up. Load the heaviest component in

the rack first.

· Make sure the rack is level and stable before pulling a component out of the
rack.

· Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and cable
management.

· Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.

· The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.

· If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.

· Make sure the product is properly matted with the rails. Products that are

improperly matted with the rails might be unstable.

· Verify that the AC power supply branch circuit that provides power to the

rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.

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Equipment Power Cords

· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.

· Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.

· In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can

cause an electrical shock due to high leakage currents.

· Do not place objects on AC power cords or cables. Arrange them so that no

one might accidentally step on or trip over them.

· Do not pull on a cord or cable. When unplugging from the electrical outlet,

grasp the cord by the plug.

· To reduce the risk of electrical shock, disconnect all power cords before

servicing the appliance.

Equipment Batteries

· The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.

· Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.

· Do not expose the battery to temperatures higher than 60°C (140°F).

· The system battery is not replaceable. If the battery is replaced by an

incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.

· Do not attempt to recharge the battery.

· Dispose of used batteries according to the instructions of the manufacturer.

Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.

Equipment Modifications

· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has been

modified.

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Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service of
this product should be performed by trained service technicians/personnel

who are knowledgeable about the procedures, precautions, and hazards
associated with equipment containing hazardous energy levels.

· Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.

· Allow the product to cool before removing covers and touching internal
components.

· Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.

· Do not use conductive tools that could bridge live parts.

· Use gloves when you remove or replace system components; they can

become hot to the touch.

· If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:

– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the

product.

– The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating

instructions.

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Table of Contents

Chapter 1: Overview ........................................................................ 13

1.1 About the TYAN GT24B-B7076 ............................................. 13

1.2 Product Model ........................................................................ 13

1.3 Features ................................................................................. 14

1.4 Standard Parts List ................................................................. 19

1.4.1 Box Contents ................................................................... 19

1.6 About the Product ................................................................... 20

1.6.1 System Front View .......................................................... 20

1.6.2 System Rear View ........................................................... 21

1.6.3 LED Definitions ................................................................ 22

1.6.4 Motherboard (S7076) Layout .......................................... 24

1.6.5 Jumpers & Connectors .................................................... 25

1.6.6 System Block Diagram ..................................................... 27

1.6.7 Internal View .................................................................... 28

Chapter 2: Setting Up ...................................................................... 30

2.0.1 Before you Begin ............................................................. 30

2.0.2 Work Area ........................................................................ 30

2.0.3 Tools ................................................................................ 30

2.0.4 Precautions ...................................................................... 31

2.1 Installing Motherboard Components ...................................... 32

2.1.1 Removing the Chassis Cover .......................................... 32

2.1.2 Installing the CPU and Heatsink ...................................... 33

2.1.3 Installing the PCI-E Cards ............................................... 36

2.1.4 Installing the Memory ...................................................... 40

2.1.5 Installing Hard Drives ...................................................... 44

2.2 Rack Mounting ........................................................................ 49

2.2.1 Installing the Server in a Rack ......................................... 49

Chapter 3: Replacing Pre-Installed Components ......................... 55

3.1 Introduction ............................................................................. 55

3.2 Disassembly Flowchart ........................................................... 55

3.3 Removing the Cover ............................................................... 56

3.4 Replacing Motherboard Components ..................................... 56

3.4.1 Replacing Expansion Card .............................................. 56

3.4.2 PCI-E Riser Cards Specification ..................................... 57

3.4.3 Disconnecting All Motherboard Cables ........................... 58

3.4.4 Removing the Motherboard ............................................. 59

3.6 Replacing the LED Control Board ........................................ 60

3.6.1 M1008-G2024 LED Control Board Features ................... 62

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3.6.2 M1008-G2024 LCB Connector Pin Definition.................. 62

3.7 Replacing the System Fan.................................................... 64

3.8 Installing the System Fan ..................................................... 65

3.9 Replacing the HDD Backplane Board .................................. 66

3.9.1 M1277 HDD Backplane Board Features ............................. 68

3.9.2 Pin Definition ....................................................................... 69

3.10 Replacing the Power Supply ................................................ 70

3.10.1 Replacing the M7016-B7066 Power Distribution Board 73

3.10.2 M7016-B7066 Power Distribution Board Feature ......... 75

3.10.3 M7016-B7066 Power Distribution Board Pin Definitions 75

3.11 Replacing the Redundant Power Supply .............................. 77

Appendix I: Fan and Temp Sensors ............................................... 79

Appendix II: Cable Connection Tables .......................................... 83

Appendix III: FRU Parts Table ......................................................... 85

Appendix IV: Technical Support ..................................................... 86

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Chapter 1: Overview

1.1 About the TYAN GT24B-B7076

Congratulations on your purchase of the TYAN® GT24B-B7076, a highly optimized
rack-mountable barebone system. The GT24B-B7076 is designed to support dual
Intel

®

Xeon E5-2600v3 series processors, and up to 2048GB LRDIMM 3DS/ 1024GB

LRDIMM/512GB RDIMM DDR4 memory. Leveraging advanced technology from Intel®,

GT24B-B7076 server system is capable of offering scalable 32 and 64-bit computing,
high bandwidth memory design, providing a rich feature set and incredible
performance. and lightning-fast PCI-E bus implementation. The GT24B-B7076 not
only empowers your company in nowadays IT demand but also offers a smooth path
for future application usage.

TYAN® also offers the GT24B-B7076 in a version that can support up to to four
hot-swap hard drives. The GT24B-B7076 uses TYAN®’s latest chassis, featuring a
robust structure and a solid mechanical enclosure. All of this provides GT24B
–B7076 the power and flexibility to meet the needs of nowadays server application.

1.2 Product Model

Model

Config

HDD Bays

Power supply

GT24B-B7076

B7076G24BV4HR

Hot-swap, 4

HDDs

3Y YM2451G

(1+1) Redundant

PSU

B7076G24BV4H

Hot-swap, 4

HDDs

Delta DPS-500AB-

5 C*1 Single PSU

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1.3 Features

TYAN GT24B7076 (B7076G24BV4HR)

System

Form Factor

1U Rackmount

Gross Weight

16 kg

Chassis Model

GT24B

Dimension (D x W x
H)

25.4" x 17.2" x 1.72" (645 x 436 x 43.6mm)

Motherboard

S7076GM2NR

Board Dimension

EATX, 12"x13" (305x330mm)

Front Panel

Buttons

(1) PWR / (1) RST / (1) NMI / (1) ID

LEDs

(1) PWR / (1) HDD / (1) ID / (1) Warning / (3) LAN

I/O Ports

(2) 2.0 USB ports

External Drive
Bay

Type / Q'ty

2.5"/3.5" Hot-Swap / (4)

HDD backplane
support

SATA 6.0Gb/s;

System
Cooling
Configuration

FAN

(6) 4cm fans

Power Supply

Type

RPSU

Efficiency

PFC / 80 plus gold

Redundancy

1+1

Input Range

100-240V~ /8-4A

Frequency

50 - 60 Hz

Output Watts

450 Watts

Processor

Supported CPU
Series

Intel Xeon Processor E5-2600 v3 series processors

Socket Type / Q'ty

LGA2011 / (2)

Thermal Design
Power (TDP)
wattage

Max up to 135W

System Bus

Up to 9.6/ 8.0/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset

PCH

Intel C612

Memory

Supported DIMM
Qty

(8)+(8) DIMM slots

DIMM Type / Speed

RDIMM DDR4 2133/1866/1600 / LRDIMM DDR4
2133/1600 / LRDIMM 3DS DDR4 2133/1600

Capacity

Up to 512GB RDIMM/ 1,024GB LRDIMM/ 2,048GB
LRDIMM 3DS *Follow latest Intel DDR4 Memory POR

Memory channel

4 Channels per CPU

Memory voltage

1.2V

Expansion

PCI-E

(2) PCI-E Gen3 x16 slots (w/ x8 link) total maximum

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Slots

20W load

Note:

(1) OCP slot for OCP Mezz card

Recommended
TYAN OCP Card

M7062-B811-1T, PCI-E Gen3 x8, Broadcom 10GbE
Mezz Card / M7062-B810-2T, PCI-E Gen3 x8,
Broadcom 10GbE Mezz Card / M7076-X540-2T, PCI-E
Gen3 x8, Intel 10GbE Mezz Card / M7076-I350, PCI-E
Gen3 x8, Intel (2)GbE Mezz Card / M7062-I599-1T,
PCI-E Gen3 x8, Intel 10GbE Mezz Card /
M7062-I599-2T, PCI-E Gen3 x8, Intel 10GbE Mezz
Card

Pre-install TYAN
Riser Card

M2091-R, PCI-E x16 1U riser card (right) / M2091,
PCI-E x16 1U riser card (left) (*Need with tall bracket)

LAN

Port Q'ty

(2) GbE ports (1 port shared with IPMI)

Controller

Intel I350-AM2

Storage

SATA

Connector

(1) Mini-SAS (4-ports) + (2) SATA (totally support 6
ports)

Controller

Intel C612

Speed

6.0 Gb/s

RAID

RAID 0/1/10/5 (Intel RST)

SSATA

Connector

(1) Mini-SAS (4-ports)

Controller

Intel C612

Speed

6.0 Gb/s

RAID

RAID 0/1/10/5 (Intel RST) only for 4 SATA devices

Graphic

Connector type

D-Sub 15-pin

Resolution

Up to 1920x1200

Chipset

Aspeed AST2400

I/O Ports

USB

(2) USB3.0 ports (2 at rear)/ (3) USB2.0 ports (2 at
front)+1 in the middle of MB

COM

(1) DB-9 COM port

VGA

(1) D-Sub 15-pin port

RJ-45

(2) GbE ports (1 port shared with IPMI)

System
Monitoring

Chipset

Aspeed AST2400

Voltage

Monitors voltage for CPU, memory, chipset & power
supply

Temperature

Monitors temperature for CPU & memory & system
environment

LED

Over temperature warning indicator / Fan & PSU fail
LED indicator

Others

Watchdog timer support

Server
Management

Onboard Chipset

Onboard Aspeed AST2400

AST2400 IPMI
Feature

IPMI 2.0 compliant baseboard management controller
(BMC) / Supports storage over IP and remote
platform-flash / USB 2.0 virtual hub

AST2400 iKVM

24-bit high quality video compression / 10/100 Mb/s

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Feature

MAC interface

BIOS

Brand / ROM size

AMI / 16MB

Feature

User-configurable H/W monitoring / SMBIOS

2.7/PnP/Wake on LAN / ACPI 3.0/ACPI sleeping states
S1,S4,S5

Operating
System

OS supported list

Please refer to our Intel OS supported list.

Regulation

FCC (DoC)

Class A

CE (DoC)

Yes

Operating
Environment

Operating Temp.

10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS

RoHS 6/6 Compliant

Yes

Package
Contains

Barebone

(1) GT24B-B7076

Manual

(1) Quick Installation Guide

Installation CD

(1) TYAN installation CD

TYAN GT24B7076 (B7076G24BV4H)

System

Form Factor

1U Rackmount

Gross Weight

16 kg

Chassis Model

GT24B

Dimension (D x W x
H)

25.4" x 17.2" x 1.72" (645 x 436 x 43.6mm)

Motherboard

S7076GM2NR

Board Dimension

EATX, 12"x13" (305x330mm)

Front Panel

Buttons

(1) PWR / (1) RST / (1) NMI / (1) ID

LEDs

(1) PWR / (1) HDD / (1) ID / (1) Warning / (3) LAN

I/O Ports

(2) 2.0 USB ports

External Drive
Bay

Type / Q'ty

2.5"/3.5" Hot-Swap / (4)

HDD backplane
support

SATA 6.0Gb/s; SAS 6.0Gb/s and
SAS 12.0Gb/s with optional mezz
card

System
Cooling
Configuration

FAN

(6) 4cm fans

Power Supply

Type

EPS1U

Efficiency

PFC / 80 plus Platinum

Input Range

100-127V AC/8A / 200-240V AC/4A

Frequency

50 /60 Hz

Output Watts

500 Watts

Processor

Supported CPU

Intel Xeon Processor E5-2600 v3 series processors

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Series

Socket Type / Q'ty

LGA2011 / (2)

Thermal Design
Power (TDP)
wattage

Max up to 135W

System Bus

Up to 9.6/ 8.0/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset

PCH

Intel C612

Memory

Supported DIMM
Qty

(8)+(8) DIMM slots

DIMM Type / Speed

RDIMM DDR4 2133/1866/1600 / LRDIMM DDR4
2133/1600 / LRDIMM 3DS DDR4 2133/1600

Capacity

Up to 512GB RDIMM/ 1,024GB LRDIMM/ 2,048GB
LRDIMM 3DS *Follow latest Intel DDR4 Memory POR

Memory channel

4 Channels per CPU

Memory voltage

1.2V

Expansion
Slots

PCI-E

(2) PCI-E Gen3 x16 slots (w/ x8 link)

Note:

(1) OCP slot for OCP Mezz card/ (1) Proprietary slot for
SAS Mezz card

Recommended
TYAN OCP Card

M7062-B811-1T, PCI-E Gen3 x8, Broadcom 10GbE
Mezz Card / M7062-B810-2T, PCI-E Gen3 x8,
Broadcom 10GbE Mezz Card / M7076-X540-2T, PCI-E
Gen3 x8, Intel 10GbE Mezz Card / M7076-3108-8I,
PCI-E Gen3 x8, LSI SAS 12G Mezz Card /
M7094-2308G-8I, PCI-E Gen3 x8, LSI SAS 6G Mezz
Card / M7076-3008-8I, PCI-E Gen3 x8, LSI SAS 12G
Mezz Card / M7076-I350, PCI-E Gen3 x8, Intel (2)GbE
Mezz Card / M7062-I599-1T, PCI-E Gen3 x8, Intel
10GbE Mezz Card / M7062-I599-2T, PCI-E Gen3 x8,
Intel 10GbE Mezz Card

Pre-install TYAN
Riser Card

M2091-R, PCI-E x16 1U riser card (right) / M2091,
PCI-E x16 1U riser card (left) (*Need with tall bracket)

LAN

Port Q'ty

(2) GbE ports (1 port shared with IPMI)

Controller

Intel I350-AM2

Storage

SATA

Connector

(1) Mini-SAS (4-ports) + (2) SATA (totally support 6
ports)

Controller

Intel C612

Speed

6.0 Gb/s

RAID

RAID 0/1/10/5 (Intel RST)

SSATA

Connector

(1) Mini-SAS (4-ports)

Controller

Intel C612

Speed

6.0 Gb/s

RAID

RAID 0/1/10/5 (Intel RST) only for 4 SATA devices

Graphic

Connector type

D-Sub 15-pin

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Resolution

Up to 1920x1200

Chipset

Aspeed AST2400

I/O Ports

USB

(2) USB3.0 ports (2 at rear)/ (3) USB2.0 ports (2 at
front)+1 in the middle of MB

COM

(1) DB-9 COM port

VGA

(1) D-Sub 15-pin port

RJ-45

(2) GbE ports (1 port shared with IPMI)

System
Monitoring

Chipset

Aspeed AST2400

Voltage

Monitors voltage for CPU, memory, chipset & power
supply

Temperature

Monitors temperature for CPU & memory & system
environment

LED

Over temperature warning indicator / Fan & PSU fail
LED indicator

Others

Watchdog timer support

Server
Management

Onboard Chipset

Onboard Aspeed AST2400

AST2400 IPMI
Feature

IPMI 2.0 compliant baseboard management controller
(BMC) / Supports storage over IP and remote
platform-flash / USB 2.0 virtual hub

AST2400 iKVM
Feature

24-bit high quality video compression / 10/100 Mb/s
MAC interface

BIOS

Brand / ROM size

AMI / 16MB

Feature

User-configurable H/W monitoring / SMBIOS

2.7/PnP/Wake on LAN / ACPI 3.0/ACPI sleeping states
S1,S4,S5

Operating
System

OS supported list

Please refer to our Intel OS supported list.

Regulation

FCC (DoC)

Class A

CE (DoC)

Yes

Operating
Environment

Operating Temp.

10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS

RoHS 6/6
Compliant

Yes

Package
Contains

Barebone

(1) GT24B-B7076

Manual

(1) Quick Installation Guide

Installation CD

(1) TYAN installation CD

19

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1.4 Standard Parts List

This section describes GT24B-B7076 package contents and accessories. Open the
box carefully and ensure that all components are present and undamaged. The
product should arrive packaged as illustrated below.

1.4.1 Box Contents

GT24B-B7076 Box Content

 (1) 1U chassis
 (1) S7076 pre-installed
 (6) Fan modules
 Power supply module for B7076G24BV4H: Flex ATX 500W, DELTA,

DPS-500AB-5 C, Platinum

 (2) Power supply modules for B7076G24BV4HR: 450W, YM-2451G,3Y
 (1) Hard Drive Backplane(M1277 G24-BP12-4 pre-installed)
 (2) Riser Cards (M2091 & M2091R pre-installed)
 (1) Front Panel Board (M1008-G2024-FPB pre-installed)
 (1) Power Distribution Board for B7076G24BV4HR (M7016-B7066,R1.0

pre-installed)

GT24B-B7076 Accessories

 (2) US Power Cord
 (2) EU Power Cord
 (1) Rack Mounting Kit
 (1) Driver CD

 (1) Quick Installation Guide
 (2) HDD Screws
 (2) Heatsink

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1.6 About the Product

The following views show you the product.

1.6.1 System Front View

M1008-G2024 FPB

21

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1.6.2 System Rear View

B7076G24BV4H

B7076G24BV4HR

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22

1.6.3 LED Definitions

Front Panel

LED

State

LED Color

Behavior

NOTE

Power

Power On

Green

Solid On

Power Off

Green

Off

Warning

System
normal

Amber

Off

BMC & HWM
alert even

System alert

Amber

Solid On

HDD

HDD Ready

Green

Off

HDD Access

Green

Blinking

If one of HDD
access then LED
blinking

ID

ID located

Blue

Solid On

ID free

Blue

Off

LAN1

Access

Green

Blinking

Link

Green

Solid On

Off Link

Green

Off

LAN2

Access

Green

Blinking

Link

Green

Solid On

Off Link

Green

Off

LAN LED

10/100/1000 Mbps LAN Link/Activity LED Scheme

Left LED

Right LED

10 Mbps

Link

Green

Off

Active

Blinking Green

Off

100 Mbps

Link

Green

Solid Green

Active

Blinking Green

Solid Green

1000 Mbps

Link

Green

Solid Yellow

Active

Blinking Green

Solid Yellow

No Link

Off

Off

NOTE: “Left” and “Right” are viewed from the rear panel.

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23

ID LED

LED

State

Color

Description

ID LED

On

Blue

System identified

Off

Off

System not identified

HDD LED

HDD Status

Status LED
Color: Orange

Activity LED
Color: Green

No Driver Present or power disconnected

OFF

OFF

Driver Present

No Activity

OFF

On Solid

Access Activity

OFF

Blinking

HDD Fail

On Solid

Don’t care

Identify (Locate the HDD)

Blinking(1Hz)

Don’t care

Rebuild

Blinking(4Hz)

Don’t care

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24

1.6.4 Motherboard (S7076) Layout

The diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram.

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25

1.6.5 Jumpers & Connectors

Connector/Jumper

1 LAN2 + USB 3.0 x 2

22 PCH PWROK LED (LED2)

2 VGA / COM1

23 CAT Error LED (LED3)

3 ID LED Button (SW3)

24 ID LED Button Header (J56)

4 LAN1

25 Chassis Intrusion Header (J57)

5 COM2 Header (J68)

26 CPU0 FAN (J28)

6 SYS_FAN_4 (J31)

27 SSI 8-pin CPU0 Power Connector
(PW1)

7 BMC LED (LED1)

28 SYS_FAN_3 (J35)

8 PSU Alert LED (LED10)

29 SYS_FAN_2 (J34)

9 Clear CMOS Button (SW4)

30 CPU0 PWOK LED (LED8)

10 Rear ID LED (LED7)

31 CPU0 Socket (U1)

11 SYS_FAN_5 (J32)

32 CPU1 PWOK LED (LED9)

12 7-pin Vertical SATA3.0 Connector (SATA5,
J46)

33 CPU1 FAN (J30)

13 Reset Button (SW2)

34 SYS_FAN_1 (J33)

14 Power Button (SW1)

35 SSI 8-pin CPU1 Power Connector
(PW3)

15 SATA0~SATA3 (J41)

36 CPU1 Socket (U2)

16 sSATA0~sSATA3 (J42)

37 Vertical Type-A USB2.0 Connector
(J40)

17 USB2.0 Header (J37)

38 IPMB Pin Header (J51)

18 Front Panel Header (J50)

39 Mini-SAS HD Connector
(J20/J21/J22/J23)

19 PCH SATA SGPIO Header for BB HD
Board (J43)

40 ATX 24-pin Main Power Connector
(PW2)

20 USB3.0 Header (J36)

41 TYAN Module Header (J48)

21 7-pin Vertical SATA3.0 Connector
(SATA4, J45)

42 FAN Header for BB FAN Board (J29)
43 PSMI Pin Header (J49)

Jumpers

Slots

a COM2 or COM5 Selected Jumper (J64)

A OCP Slot for OCP Mezz Card (J26)

b COM2 or COM5 Selected Jumper (J63)

B PCI-E 3.0x8 Slot (x8 link, open-end

type, #PCIe-6.5)

c BMC Reset Header (J55)

C PCI-E 3.0x8 Slot (x8 link, open-end

type, #PCIe-6)

e NMI Jumper (J67)

D Proprietary Slot for SAS Mezz Card

(J27) for B7076G24BV4H SKU only

f ME Recovery Mode Jumper (J62)

E CPU0_DIMM_C0/C1

g ME Security Override Jumper (J60)

F CPU0_DIMM_D0/D1

26

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G CPU0_DIMM_B0/B1

H CPU0_DIMM_A0/A1

I CPU1_DIMM_G0/G1

J CPU1_DIMM_H0/H1

K CPU1_DIMM_F0/F1

L CPU1_DIMM_E0/E1

Jumper Legend

OPEN - Jumper OFF

Without jumper cover

CLOSED - Jumper ON

With jumper cover

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27

1.6.6 System Block Diagram