TYAN GT24-B7066 Service Engineer's Manual

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GT24-B7066

Service Engineer’s Manual

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PREFACE

Copyright

This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.

Copyright 2013 MiTAC International Corporation. All rights reserved. TYAN® is
a registered trademark of MiTAC International Corporation.

Version 1.0

Disclaimer

Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliabil it y prior to print ing.
MiTAC assumes no liability whatsoever, and disclaims an y express or implied

warranty, relating to sale and/or use of TYAN

®

products including liability or
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to produce descriptions and/or specificat ions
at any time, without notice. In no event will MiTAC be held liable for any direct
or indirect, incidental or consequential damage, loss of use, loss of data or
other malady resulting from errors or inaccuracies of infor mation contained in
this document.

Trademark Recognition

All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.

TYAN® is a trademark of MiTAC International Corporation.
Intel

®

is a trademark of Intel® Corporation.

AMI

®

, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
IBM

®

, PC®, AT® and PS/2® are trademarks of IBM Corporation.
Winbond

®

is a trademark of Winbond Electronics Corporation.

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FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject to
the following conditions:

 This device must not cause harmful interference.
 This device must accept any interference received, including

interference that may cause undesirable operation.

This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norm e NMB-003 du
Canada.

Notice for Europe (CE Mark)

This product is in conformity with the Council
Directive 2004/108/EC.

CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according to
manufacturer instructions and in accordance with your local regulatio ns.

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About this Manual

This manual provides you with instructions on installing your TYAN
GT24-B7066. This Manual is intended for experienced users and
integrators with hardware knowledge of personal computers.

This manual consists of the following parts:

Chapter1:

Provides an introduction to the TYAN GT24-B7066
barebones, standard parts list, describes the external
components, gives a table of key components, and
provides the block diagram of the system.

Chapter2:

Covers procedures on installing the processor, memory
modules and hard drives.

Chapter3:

Covers the removal and replacement procedures for
pre-installed components.

Appendix:

List the cable connection and FRU part tables for reference
of system setup, and technical support in case a problem
arises with your system.

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Safety and Compliance Information

Before installing and using TYAN GT24-B7066, take note of the following
precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.

·Do not block the slots and opening on the unit, which are provided for

ventilation.

·

Only use the power source indicated on the marking label. If you are not

sure, contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third pin to
ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.

·Do not place anything on the power cord. Place the p ower cord where it will
not be in the way of foot traffic.

·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high voltage

components and result in shock and damage to the components.

· When replacing parts, ensure that you use parts specified by the

manufacturer.

·When service or repairs have been done, perform routine safety checks to
verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating
device.

·Cover the unit when not in use.

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Safety Information

Retain and follow all product safety and operating instructions provided
with your equipment. In the event of a conflict bet ween the instructions in
this guide and the instructions in equipment documentation, follow the
guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the
equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide before
you install, operate, or service TYAN products.

Symbols on Equipment

Caution. This symbol indicates a potential

hazard. The potential for injury exists if cautions
are not observed. Consult equipment
documentation for specific details.

Warning. This symbol indicates the presence
of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified
personnel.

Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.

To reduce risk of injury from a hot component,
allow the surface to cool before touching.

General Precautions

· Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.

Machine Room Environment

· This device is for use only in a machine room or IT room.

· Make sure that the area in which you install the system is properly

ventilated and climate-controlled.

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· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating la bel of the
equipment.

· Do not install the system in or near a plenum, air duct, radiator, or heat
register.

· Never use the product in a wet location.

Equipment Chassis

· Do not block or cover the openings to the system.

· Never push objects of any kind through openings i n the equipment.

Dangerous voltages might be present.

· Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.

· Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

· Observe local occupational health and safety requirements and guidelines
for manual materials handling.

· Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.

· Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.

· Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.

· Make sure the rack is properly secured to the floor or ceiling.

· Make sure the stabilizing feet are attached to the rack if it is a single-rack

installation.

· Make sure racks are coupled together if it is a multiple-rack installation.

· Make sure the rack is level and stable before installing a n appliance in the

rack.

· Make sure the leveling jacks are extended to the floor.

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· Make sure the full weight of the rack rests on the leveling jacks.

· Always load the rack from the bottom up. Load the heaviest component in

the rack first.

· Make sure the rack is level and stable before pulling a component out of the
rack.

· Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and c able
management.

· Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.

· The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.

· If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.

·

Make sure the product is properly matted with the rails. Products that are

improperly matted with the rails might be unstable.

·

Verify that the AC power supply branch circuit that provides power to the

rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.

Equipment Power Cords

· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.

· Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.

· In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.

·

Do not place objects on AC power cords or cables. Arrange them so that no

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one might accidentally step on or trip over them.

· Do not pull on a cord or cable. When unplugg ing from the electrical outlet,
grasp the cord by the plug.

· To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.

Equipment Batteries

· The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.

· Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.

· Do not expose the battery to temperatures higher than 60°C (140°F).

· The system battery is not replaceable. If the battery is replaced by an

incorrect type, there is danger of explosion. Replace the ba ttery only with a
spare designated for your product.

· Do not attempt to recharge the battery.

· Dispose of used batteries according to the instructions of the manufacturer.

Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.

Equipment Modifications

· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compli ance of TYAN equipment that has been
modified.

Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service of
this product should be performed by individuals who are knowledgeable about
the procedures, precautions, and hazards associated with equipment
containing hazardous energy levels.

· Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.

· Allow the product to cool before removing covers and touching internal

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components.

· Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.

· Do not use conductive tools that could bridge live parts.

· Use gloves when you remove or replace system components; the y can

become hot to the touch.

· If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service includ e:

– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into th e

product.
– The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating

instructions.

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Table of Contents

Chapter 1: Overview....................................................................... 15

1.1 About the TYAN GT24-B7066................................................ 15

1.2 Product Models....................................................................... 15

1.3 Features............................................................................ 16

1.4 Standard Parts List................................................................. 22

1.4.1 Box Contents...................................................................22

1.4.2 Accessories ..................................................................... 24

1.5 About the Product................................................................... 25

1.5.1 System Front View .......................................................... 25

1.5.2 System Rear View........................................................... 26

1.5.3 LED Definitions................................................................ 27

1.5.4 Motherboard (S7066) Layout .......................................... 29

1.5.5 Jumpers & Connectors.................................................... 30

1.5.6 System Block Diagram (S7066) ...................................... 31

1.5.7 System Top View............................................................. 32

Chapter 2: Setting Up..................................................................... 33

2.1 Before you Begin.................................................................... 33

2.1.1 Work Area........................................................................33

2.1.2 Tools................................................................................ 33

2.1.3 Precautions......................................................................34

2.2 Removing and Installing the Chassis Cover....................... 35

2.3 Installing Motherboard Components ...................................... 36

2.3.1 Installing the CPU and Heatsink...................................... 36

2.3.2 Installing the Expansion Cards........................................39

2.3.3 Installing the Memory ......................................................42

2.3.4 Installing Hard Drives ......................................................46

2.4 Rack Mounting........................................................................ 51

2.4.1 Installing the Server in a Rack......................................... 51

Chapter 3: Replacing Pre-Installed Components ........................ 57

3.1 Disassembly Flowchart........................................................... 57

3.1 Replacing the System Fan ..................................................... 58

3.1.1 Removing the System Fan..............................................58

3.2.2 Installing the System Fan................................................60

3.3 Replacing the Front Panel Board.................................. 61

3.3.1 Removing the Front Panel Board....................................61

3.3.2 Installing the Front Control Board.................................... 63

3.3.3 Front Panel Board Features............................................65

3.3.4 Pin Definitions..................................................................66

3.4 Replacing the HDD Backplane Board .................................... 67

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3.4.1 Removing the HDD Backplane Board............................. 67

3.4.2 Installing the HDD Backplane Board............................... 69

3.4.1 HDD BP Board Features................................................. 70

3.4.2 Connector Pin Definitions................................................ 71

3.5 Replacing the Power Supply Unit........................................... 72

3.5.1 Removing the Power Supply Unit....................................72

3.5.2 Installing the Power Supply Unit...................................... 75

3.6 Replacing the Motherboard....................................................77

Appendix I: Cable Connection Tables.......................................... 81

Appendix II: Fan and Temp Sensors ............................................ 83

Appendix III: FRU Parts Table ....................................................... 87

Appendix IV: Technical Support ................................................... 89

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Chapter 1: Overview

1.1 About the TYAN GT24-B7066

Congratulations on your purchase of the TYAN

®

GT24-B7066, a highly optimized
rack-mountable barebone system. The GT24-B7066 is designed to support dual
Intel

®

E5-2600 Series processors and up to 256GB RDIMM / 64GB UDIMM of DDR3

memory, providing a rich feature set and incredible performance. Leveraging
advanced technology from Intel®, the GT24-B7066 server system is capable of
offering scalable 32 and 64-bit computing, high bandwidth memory design, and
lightning-fast PCI-E bus implementation. The GT24-B706 6 not only empowers your
company in nowadays IT demand but also offers a smooth path for future application
usage.

TYAN

®

also offers the GT24-B7066 in a version that can support up to four 2.5” or

3.5” hot-swap hard drives. The GT24-B7066 uses TYAN’s latest chassis featuring a
robust structure and a solid mechanical enclosure. All of this provides GT24-B7066
the power and flexibility to meet the needs of nowadays server application.

1.2 Product Models

The system board within the Tyan Barebone contains different processors and
chipsets, which are defined by the following models:

 B7066G24W4H: Intel-based platform
 B7066G24V4H: Intel-based platform
 B7066G24W4HR[BTO]: Intel-based platform

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1.3 Features

TYAN GT24B7066 (B7066G24W4H)

Form Factor 1U Rackmount
Gross Weight 17 kg
Chassis Model GT24

Dimension (D x W x
H)

25.4" x 17.2" x 1.72" (645 x 436 x 43.6mm)

System

Motherboard S7066WGM3NR
Buttons (1) RST / (1) NMI / (1) ID / (1) PWR w/ LED
LEDs (1) HDD / (1) ID / (1) Warning / (3) LAN

Front Panel

I/O Ports (2) USB ports
Type / Q'ty 2.5" or 3.5" Hot-Swap / (4)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (6) 4cm fans
Type EPS1U

Efficiency 80 plus gold
Input Range 100-127V AC/8A / 200-240V AC/4A

Power Supply

Output Watts 500 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600 Series

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP) wattage

Max up to 130W

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset PCH Intel C602

Supported DIMM Qty (8)+(8) DIMM slots

DIMM Type / Speed

RDIMM ECC 1600/1333/1066 / UDIMM/LRDIMM
ECC 1333/1066

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel 4 Channels per CPU

Memory

Memory voltage 1.5V or 1.35V
PCI-E (2) PCI-E Gen3 x16 slots

Expansion Slots

Pre-install TYAN
Riser Card

M2091, PCI-E x16 1U riser card (left) / M2091-R,
PCI-E x16 1U riser card (right)

Port Q'ty Total (3) ports, (1) shared with IPMI

LAN

Controller Intel 82574L / Intel I350-AM2

Connector (4) SAS

Storage SAS

Controller LSI SAS2308

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Speed 6.0 Gb/s
RAID RAID 0/1/1E/10 (LSI Integrated RAID)

Connector type D-Sub 15-pin

Graphic

Chipset Aspeed AST2300
USB (4) ports (2 at front, 2 at rear)
COM (1) DB-9 COM port
VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports (1 port shared with IPMI)
Chipset Aspeed AST2300

Voltage

Monitors voltage for CPU, memory, chipset &
power supply

Temperature Monitors temperature for CPU & memory

LED

Fan fail LED indicator / Over temperature warning
indicator / Fan & PSU fail LED indicator

System
Monitoring

Others

Chassis intrusion detection / Watchdog timer
support

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100 Mb/s
MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power
on mode after power recovery / User-configurable
H/W monitoring

Operating
System

OS supported list Please visit our Web site for the latest update.
FCC (DoC) Class A

Regulation

CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS RoHS 6/6 Compliant Yes

Barebone (1) GT24B7066 Barebone
Manual (1) Quick Installation Guide

Package
Contains

Installation CD (1) TYAN installation CD

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TYAN GT24B7066 (B7066G24V4H)

Form Factor 1U Rackmount
Gross Weight 17 kg
Chassis Model GT24

Dimension (D x W x
H)

25.4" x 17.2" x 1.72" (645 x 436 x 43.6mm)

System

Motherboard S7066GM3NR
Buttons (1) RST / (1) NMI / (1) ID / (1) PWR w/ LED
LEDs (1) HDD / (1) ID / (1) Warning / (3) LAN

Front Panel

I/O Ports (2) USB ports
Type / Q'ty 2.5" or 3.5" Hot-Swap / (4)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (6) 4cm fans
Type EPS1U

Efficiency 80 plus gold
Input Range 100-127V AC/8A / 200-240V AC/4A

Power Supply

Output Watts 500 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600 Series

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP) wattage

Max up to 130W

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset PCH Intel C602

Supported DIMM Qty (8)+(8) DIMM slots

DIMM Type / Speed

RDIMM ECC 1600/1333/1066 / UDIMM/LRDIMM
ECC 1333/1066

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel 4 Channels per CPU

Memory

Memory voltage 1.5V or 1.35V
PCI-E (2) PCI-E Gen3 x16 slots

Expansion Slots

Pre-install TYAN
Riser Card

M2091, PCI-E x16 1U riser card (left) / M2091-R,
PCI-E x16 1U riser card (right)

Port Q'ty Total (3) ports, (1) shared with IPMI

LAN

Controller Intel 82574L / Intel I350-AM2

Connector (4) SATA
Controller Intel C602

Storage SATA

Speed 3.0 Gb/s

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RAID RAID 0/1/10/5 (Intel RST)

Connector type D-Sub 15-pin

Graphic

Chipset Aspeed AST2300
USB (4) ports (2 at front, 2 at rear)
COM (1) DB-9 COM port
VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports (1 port shared with IPMI)
Chipset Aspeed AST2300

Voltage

Monitors voltage for CPU, memory, chipset &
power supply

Temperature Monitors temperature fo r CPU & memory

LED

Fan fail LED indicator / Over temperature warning
indicator / Fan & PSU fail LED indicator

System
Monitoring

Others

Chassis intrusion detection / Watchdog timer
support

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100 Mb/s
MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power
on mode after power recovery / User-configurable
H/W monitoring

Operating
System

OS supported list Please visit our Web site for the latest update.
FCC (DoC) Class A

Regulation

CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS RoHS 6/6 Compliant Yes

Barebone (1) GT24B7066 Barebone
Manual (1) Quick Installation Guide

Package
Contains

Installation CD (1) TYAN installation CD

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TYAN GT24B7066 (B7066G24W4HR【BTO】)

Form Factor 1U Rackmount
Gross Weight 17 kg
Chassis Model GT24

Dimension (D x W x
H)

25.4" x 17.2" x 1.72" (645 x 436 x 43.6mm)

System

Motherboard S7066WGM3NR
Buttons (1) RST / (1) NMI / (1) ID / (1) PWR w/ LED
LEDs (1) HDD / (1) ID / (1) Warning / (3) LAN

Front Panel

I/O Ports (2) USB ports
Type / Q'ty 2.5" or 3.5" Hot-Swap / (4)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (6) 4cm fans
Type ERP1U

Efficiency 80 plus silver
Redundancy 1+1
Input Range 100-127V AC/8A / 200-240V AC/4A

Power Supply

Output Watts 450 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600 Series

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP) wattage

Max up to 130W

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset PCH Intel C602

Supported DIMM Qty (8)+(8) DIMM slots

DIMM Type / Speed

RDIMM ECC 1600/1333/1066 / UDIMM/LRDIMM
ECC 1333/1066

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel 4 Channels per CPU

Memory

Memory voltage 1.5V or 1.35V
PCI-E (2) PCI-E Gen3 x16 slots

Expansion Slots

Pre-install TYAN
Riser Card

M2091, PCI-E x16 1U riser card (left) / M2091-R,
PCI-E x16 1U riser card (right)

Port Q'ty Total (3) ports, (1) shared with IPMI

LAN

Controller Intel 82574L / Intel I350-AM2

Connector (4) SAS

Storage SAS

Controller LSI SAS2308

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Speed 6.0 Gb/s
RAID RAID 0/1/1E/10 (LSI Integrated RAID)

Connector type D-Sub 15-pin

Graphic

Chipset Aspeed AST2300
USB (4) ports (2 at front, 2 at rear)
COM (1) DB-9 COM port
VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports (1 port shared with IPMI)
Chipset Aspeed AST2300

Voltage

Monitors voltage for CPU, memory, chipset &
power supply

Temperature Monitors temperature for CPU & memory

LED

Fan fail LED indicator / Over temperature warning
indicator / Fan & PSU fail LED indicator

System
Monitoring

Others

Chassis intrusion detection / Watchdog timer
support

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100 Mb/s
MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power
on mode after power recovery / User-configurable
H/W monitoring

Operating
System

OS supported list Please visit our Web site for the latest update.
FCC (DoC) Class A

Regulation

CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS RoHS 6/6 Compliant Yes

Barebone (1) GT24B7066 Barebone
Manual (1) Quick Installation Guide

Package
Contains

Installation CD (1) TYAN installation CD

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1.4 Standard Parts List

This section describes GT24-B7066 package contents an d accessories. Open the
box carefully and ensure that all components are present and undamaged. The
product should arrive packaged as illustrated below.

1.4.1 Box Contents

Component Description

(1) 1U Barebone, (4) hot swap HDD

bays

TYAN® S7066 System Board
(pre-installed)

(1) 500W Power Supply Unit

(B7066G24W4H / B7066G24V4H)

(1) M1008-FPB Front Panel Board

(pre-installed)

(6) System Fans

(1) M2091 Riser Card (pre-installed)

(1) M2091-R Riser Card (pre-installed)

(1) M1235 HDD Backplane Board

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(1) M7016-PDB Power Distribution
Board (B7066G24W4HR only)

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1.4.2 Accessories

If any items are missing or appear damaged, contact your retailer or browse to
TYAN

®

’s website for service: http://www.tyan.com

The web site also provides information of other TYAN

®

products, as well as FAQs,

compatibility lists, BIOS settings, etc.

CPU Heatsink x 2

Sliding Rail x 1 and

Screw Pack x 1

Quick Installation Guide x 1 Drivers and Utility CD x 1

AC Power Cord (US) x 1 AC Power Cord (EU) x 1

Screw Packs x 3

Mounting Ears Kit x 1

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1.5 About the Product

The following views show you the product.

1.5.1 System Front View

LED Control Panel

Hot-swap HDD Bays

1

2

3

4

M1008 FPB (Front Panel LED Control Board)

1

5

9

6

7

2 3 4 8

10 11

1 USB Ports
2 ID Button
3 NMI Button
4 Reset Button
5 ID LED
6 HDD LED
7 Warning LED
8 LAN1 LED
9 LAN2 LED
10 LAN3 LED
11 Power on/off Button with LED

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1.5.2 System Rear View

1

7 6 8 10 11

3

4

5

2

9

1 Power Supply
2 Thumb Screw for Top Cover
3 LAN3 (shared with IPMI)
4 VGA Port
5 Expansion Slot
6 Expansion Slot
7 USB Ports
8 Serial Port
9 ID LED Button
10 LAN1
11 LAN2

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1.5.3 LED Definitions

M1008 Front Panel LED Control Board

Item State Color Description Note

Located Solid On Local and Remote

5. ID

Free

Blue

Off

Access Blinking

6. HDD

Ready

Green

Off

Normal Off

7. Warning

Alert

Amber

Solid On

＊H/W monitor &
BMC alert event

＊PSU alert event

Access Blinking

8. LAN1

Link

Green

Solid On

Access Blinking

9. LAN2

Link

Green

Solid On

Access Blinking

10. LAN3

Link

Green

Solid On

Power On Solid On

11. Power on/off

Power Off

Green

Off

＊H/W monitor & BMC alert event: system fan fails, system OTP
＊PSU alert event: OTP, OCP, AC lose, PSU fan fail

ID LED

LED State Color Description

On Blue System identified

ID LED

Off Off System not identified

NOTE: Press the ID button when the system AC (Alternating Current) is on,

then the ID LED will light blue if the system is identified. Us ers from remote
sites can also activate the ID LED by entering a few commands in IPMI. For
detailed software support, please visit http://www.tyan.com

for the latest

AST2300 user guide.

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HDD LED

Status LED

Activity LED

LED State Color Description

Solid On Drive present, no activity

Activity LED

Blinking

Green

Drive present, with activity

Solid On HDD Failed
Blinking

@1Hz

Identify

Status LED

Blinking
@4Hz

Red

Rebuild

Rear I/O: Onboard LAN LED Color Definition

The three (3) onboard Ethernet ports have green and yellow LEDs to indicate LAN
status. The chart below illustrates the different LED states.

10Gbps LAN Link/Activity LED Scheme

Left LED

(Link/Activity)

LED Color: Green

Right LED

(Speed)

LED Color: Yellow

No Link OFF OFF

Link Green Solid On Green Solid On

100 Mbps

Active Green Blinking Green Solid On

Link Green Solid On Yellow Solid On

1000 Mbps

(1Gbps)

Active Green Blinking Yellow Solid On

Link Yello w Solid On Yellow Solid On

10 Gbps

Active Yellow Blinking Yellow Solid On

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1.5.4 Motherboard (S7066) Layout

This diagram represents the latest board revision available at the time of publishing
this manual. The board you have received may not look e xac tly like the above
diagram. The DIMM slot numbers shown above can be used as a reference when
reviewing the DIMM population guidelines shown later in the manual. For the latest
board revision, please visit our web site at http://www.tyan.com

.

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1.5.5 Jumpers & Connectors

Jumper/Connector Function

J1/J26 USB Front Panel Header (blue)
J2 BIOS Recovery Jumper
J3 Clear CMOS Jumper
J4 Chassis Intrusion Header
J6 ID LED Button
J14 Front Fan Connector reserved for Barebone
J24 Vertical Type-A USB Connector
J25 (COM2) COM2 Header
J27 (PWR1) 24-pin Power Connector
J28 Port 80 Header
J29 IPMB Connector
J30 (SATA_SGPIO) SATA SGPIO Header
J33 SAS SMB Connector
J34 PSMI Connector
J38 SPI Write Protect Jumper
J39 (SSI_FP) Front Panel Header
J43 (PWR2) 8-pin Power Connector
J44 (LAN_LED) LAN3 LED Header
J62 (PWR3) 8-pin Power Connector
J68 Flash Security Override Header
J69 ME Recovery Jumper
J70 HOST SMB Connector
J75 LSI 2308 Enable/Disable jumper
2PHD_1 LSI IMR KEY (Optional)
ID_LED ID LED
SATA0/SATA1 Serial ATA Connector
J19/J20/J64/J65/J66 Fan Connector (SYS_FAN1/2/3/4/5)
J45/J63 CPU1/CPU0 Fan Power Connector

Jumper Legend

OPEN - Jumper OFF Without jumper cover

CLOSED - Jumper ON With jumper cover

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1.5.6 System Block Diagram (S7066)

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1.5.7 System Top View

1

2

3

4

5

1 (4) HDD trays

(1) M1235 HDD Backplane Board (pre-installed)

(1) M1008-FPB Front Panel Board (pre-installed)
2 (6) 12038 hot-swap system fans (pre-installed)
3 (1) M2091 Riser Card (pre-installed)

(1) M2091-R Riser Card (pre-installed)

(2) Expansion slots
4 System Main Board
5 Power Supply Module

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Chapter 2: Setting Up

2.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks, memory
modules, and hard drives. Instructions on inserting add on
cards are also given.

2.1.1 Work Area

Make sure you have a stable, clean working environment. Dust and dirt
can get into components and cause malfunctions. Use containers to
keep small components separated. Putting all small components in
separate containers prevents them from becoming lost. Adequate
lighting and proper tools can prevent you from accidentally damaging
the internal components.

2.1.2 Tools

The following procedures require only a few tools, including the
following:

 A cross head (Phillips) screwdriver
 A grounding strap or an anti-static pad

Most of the electrical and mechanical connections can be disconn ected
with your hands. It is recommended that you do not use pliers to remove
connectors as it may damage the soft metal or plastic parts of the
connectors.

Caution!

1. To avoid damaging the motherboard and the

associated components, do not use torque force
greater than 7kgf/cm (6.09 lb/in) on each mounting
screw for motherboard installation.

2. Do not apply power to the board if it has been

damaged.

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2.1.3 Precautions

Components and electronic circuit boards can be damaged by
discharges of static electricity. Working on a s ystem that is connected to
a power supply can be extremely dangerous. Follow the guidelines below
to avoid damage to GT24-B7066 or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then touch a
safely grounded object to release static charge (i.e. power supply
case). If available, wear a grounded wrist strap. Alternatively,
discharge any static electricity by touching the bar e metal chassis
of the unit case, or the bare metal body of any other grounded
appliance.

 Avoid touching motherboard c omponents, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When removing

the motherboard, always place it on a groun ded anti-static surface
until you are ready to reinstall it.

 Hold electronic circuit boards by the edges o nl y. Do not touch the

components on the board unless it is necessary to do so. Do not
flex or stress circuit boards.

 Leave all components insi de the static-proof packaging that they

ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs, or

other small parts are in place and are not left loose inside the case.
Metallic parts or metal flakes can cause electrical shorts.

CAUTION: Please note that the following illustrations may not look

exactly like the rackmount server you purchased. Therefore, the
illustrations should be used for your reference only.

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2.2 Removing and Installing the Chassis Cover

Follow these instructions to remove the GT24-B7066 chassis cover.

1. Unless you are installing a hot-swappable component, be sure to turn off the
system, disconnect all attached peripherals and disconnect the system from the
electrical source.

2. Unscrew the thumb screw and remove the side screw securing the top cover.

3. From the front side, slide the top cover off.

4. To install the chassis cover, follow the above steps in reverse order.

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2.3 Installing Motherboard Components

This section describes how to install components on to the motherboard, including
CPUs, memory modules, HDD and PCI-E cards.

Before you begin, refer to 2.2 Removing and Installing the Chassis Cover on
page 35 for instructions on how to remove and reinstall the chassis cover.

2.3.1 Installing the CPU and Heatsink

Follow the steps below to install CPUs and CPU heatsinks.

1. Locate the CPU sockets. Always start with CPU0 first.

2. Push down the lever (1) and slightly pull away from the socket (2) to release the

latch, and then lift up the lever to a fully open position (3). Do the same
procedures to release the other lever.

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37

3. Lift the CPU socket cover to a fully open position.

4. Remove the protection cap from the CPU socket.

5. Place the CPU into the socket making sure that the gold arrow is located in the

right direction.

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6. Close the CPU socket cover.

7. Pull down the lever (1), press down (2) and hook towards the latch (3). Repeat

the same procedures to hook the other lever.

8. Position the heatsink on top of the CPU and secure it with 4 screws.

9. Repeat steps 2 to 8 to install the second CPU and heatsink .

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2.3.2 Installing the Expansion Cards

GT24-B7066 comes with a PCI-E riser bracket with two pre-installed PCI-E x16 riser
cards. The two PCI-E riser cards connect to the two PCI-E slots on the mainboard.

(2) PCI-E x16 slot direction (x16 link)

Follow these instructions to install expansion cards.

1. Unscrew the 2 screws securing the riser bracket to the chassis.

2. Lift the riser bracket up.

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3. Unscrew the PCI dummy bracket.

4. Slide to remove the PCI dummy bracket.

5. Insert the expansion card to the riser bracket. Make sure the expansion card is

connected to the PCI-E slot on the riser card and properly latched onto the
riser bracket.

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6. Attach the screw to secure the expansion card to the riser bracket.

7. Insert the riser cards to the PCI-E slots on the main board as you align the

riser bracket onto the chassis.

8. Attach the 2 screws to secure the riser bracket to the chassis.

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2.3.3 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Locate the memory slots on the motherboard.

2. Press the memory slot locking levers in the direction of the arrows as shown in

the following illustration.

3. Align and insert the memory module down onto the slot. When inserted

properly, the memory slot locking levers lock automatically on the indentations
at the ends of the module. Follow the recommended memory population
table to install the other memory modules.

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Memory Population Option Table

The following pictures show common types of DDR3 memory modules.

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Recommended Memory Population Table

Single CPU installed (CPU0 only)

Quantity of

memory installed

1 2 3 4 5 6 7 8

CPU0_DIMM_A0

√ √ √ √ √ √ √ √

CPU0_DIMM_A1

√ √ √ √ √ √ √

CPU0_DIMM_B0

√ √ √ √ √ √

CPU0_DIMM_B1

√ √ √ √ √

CPU0_DIMM_C0

√ √ √ √

CPU0_DIMM_C1

√ √ √

CPU0_DIMM_D0

√ √

CPU0_DIMM_D1

√

NOTE:

1. √ indicates a populated DIMM slot.

2. Use paired memory installation for max performance.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs.

5. Un-buffered DIMM can offer slightly better performance than registerd DIMM if
populating only a single DIMM per channel.

6. Always install with CPU0 Socket and DIMM_0 Slot first, following the alphabetical order.

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Dual CPU installed (CPU0 and CPU1)

Quantity of

memory

installed

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

CPU0_DIMM_A0

√ √ √ √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM_A1

√ √ √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM_B0

√ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM_B1

√ √ √ √ √ √ √ √ √ √

CPU0_DIMM_C0

√ √ √ √ √ √ √ √

CPU0_DIMM_C1

√ √ √ √ √ √

CPU0_DIMM_D0

√ √ √ √

CPU0_DIMM_D1

√ √

CPU1_DIMM_A0

√ √ √ √ √ √ √ √ √ √ √ √ √ √ √

CPU1_DIMM_A1

√ √ √ √ √ √ √ √ √ √ √ √ √

CPU1_DIMM_B0

√ √ √ √ √ √ √ √ √ √ √

CPU1_DIMM_B1

√ √ √ √ √ √ √ √ √

CPU1_DIMM_C0

√ √ √ √ √ √ √

CPU1_DIMM_C1

√ √ √ √ √

CPU1_DIMM_D0

√ √ √

CPU1_DIMM_D1

√

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2.3.4 Installing Hard Drives

The GT24-B7066 can support up to four (4) 3.5” / 2.5” hard drives.

Installing 3.5” Hard Drives

Follow these instructions to install a 3.5” HDD.

Warning!!! Always install the hard disk drive to the chassis after the chassis has

been secured on the rack.

1. Press the locking lever latch and pull the locking lever open.

2. Slide the HDD tray out.

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3. Unscrew the 5 screws securing the HDD bracket to the HDD tray.

4. Place the 3.5” hard disk drive into the HDD tray and secure the HDD to the
HDD tray using 4 screws.

5. Reinsert the HDD tray into the chassis.

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6. Push to secure the locking lever until it clicks into place.

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Installing 2.5” Hard Drives

Follow these instructions to install a 2.5” HDD.

Warning!!! Always install the hard disk drive to the chassis after the chassis has

been secured on the rack.

1. Press the locking lever latch and pull the locking lever open.

2. Slide the HDD tray out.

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3. Turn the HDD tray over and place the 2.5” HDD on its bay. Secure the HDD to
the tray using 4 screws.

4. Reinsert the HDD tray into the chassis.

5. Push to secure the locking lever until it clicks into place.

51

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2.4 Rack Mounting

After installing the necessary components, the TYAN GT24-B7066 can b e mounted
in a rack using the supplied rack mounting kits:

Sliding Rail Kit

 Sliding Rails x 2
 Rail Screw Pack x 1

A B C

M5 x 20L screw

(2 pcs)

M5 screw + Washer

(8 pairs)

M4 x 4L screw

(2 pcs)

Mounting Ears Kit

 Mounting Ears x 2
 Mounting Ears Screw Pack x 1

2.4.1 Installing the Server in a Rack

Follow these instructions to mount the TYAN GT24-B7066 into an industry standard
19” rack.

NOTE: Before mounting the TYAN GT24-B7066 in a rack, ensure that all internal

components have been installed and that the unit has been fully tested. However, to
make the installation easier, we suggest that you remove all HDD trays before you
insert the chassis into the rack.

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Installing the Inner Rails to the Unit

1. Screw the mounting ears to each side of the GT24-B7066 as shown using four
screws from the supplied mounting ears screw pack.

2. Draw out the inner rail from the rail assembl y. When the rail comes to a stop,
pull the tab to release the latch and completely draw the inner rail out.

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3. Align the inner sliding rail (1) on the side of the server, and pull towards the
arrow (2) to secure the three hooks.

4. Secure the inner sliding rail to the server using one M4 x 4L screw (C).

5. Repeat steps 2 to 4 to secure the sliding rail to the other side of the server.

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Installing the Outer Rails to the Unit

Secure the outer rails to the rack using four M5 screws and four washers (B) on each
side.

Rack Mounting the Server

1. Pull out the middle rail to the l atch position.

2. Lift the unit and then insert the inn er slid e rails into the middle rails.

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3. When the inner rails come to a stop, pull the tab to release the latch and p ush

the whole system in.

4. Secure the mounting ears of the unit to the rack using two M5 x 20L

screws (A).

56

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NOTE

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Chapter 3: Replacing Pre-Installed Components

This chapter explains how to replace the pre-installed components, including the
S7066 Motherboard, M1008-FPB Front Panel Board, M1235-HDD BP HDD
Backplane Board, PCI-E Riser Card, System Fan and Power Supply Unit etc.

3.1 Disassembly Flowchart

The following flowchart outlines the disassembly procedures.

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3.1 Replacing the System Fan

3.1.1 Removing the System Fan

Follow these instructions to remove the system fan.

1. Remove the chassis cover (see 2.2 Removing and Installing the Chassis

Cover on page 35).

2. Disconnect all fan cab les from the HDD backplane board.

3. Lift the system fans from the chassis.

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4. Press the tab towards the direction of the ar row (1) and pull the fan (2) to

detach it from the group.

5. While holding the fan with two hands, push the fan downwards with both

thumbs to release it from the fan cage.

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3.2.2 Installing the System Fan

1.

Replace the fan with a new one.

2. Install the fan into the fan cage and connect the fan cage to the group.

3. Align the system fans into the chassis.

4. Connect the fan cabl es to the HDD backplane board.

5. Install the chassis cover (see 2.2 Removing and Installing the

Chassis Cover on page 35).

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3.3 Replacing the Front Panel Board

3.3.1 Removing the Front Panel Board

Follow these instructions to remove the front panel board.

1. Turn off the system, disconnect all attached peripherals and disconnect the

system from the electrical source.

2.

Remove the two screws securing the front panel board to the chassis.

3. Carefully pu ll out the front panel board.

4. Disconnect the cables from the connectors on the front panel board.

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5. Remove the three scre ws securing the front panel board to the bracket.

6. Slightly pull the front panel board away from the front panel connectors slot

and then lift it to remove from the bracket.

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3.3.2 Installing the Front Control Board

1.

Replace with a new front panel board and secure it to the bracket with three
screws.

2. Connect the cable connectors to the front panel board connectors.

3. Insert the front panel board inside the chassis.

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4. Secure the front panel board to the chassis using two screws.

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3.3.3 Front Panel Board Features

1

2

3 4

5

6

7

8

9 10

11

1 2x5-pin USB Header (J1) Top: ID LED (blue)
2 2x15-pin SSI Header (J3)

8

Bottom: LAN1 LED (green)
3 USB 1 Top: HDD LED (green)
4 USB 2

9

Bottom: LAN2 LED (green)
5 ID Switch (SW1) Top: Warning LED (amber)
6 NMI Switch (SW2)

10

Bottom: LAN3 LED (green)
7 Reset Switch (SW3) 11 Power Button (J6)

Form Factor: TBD

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3.3.4 Pin Definitions

J1: 2x5-pin USB Header

Definition Pin Pin Definition

VCC 1 2 VCC

USB1- 3 4 USB2-

USB1+ 5 6 USB2+

GND 7 8 GND
KEY 9 10 GND

J3: 2x15-pin SSI Front Panel Header

Definition Pin Pin Definition

PWD_LED+ 1 2 VCC

KEY 3 4 ID_LED+

PW_LED- 5 6 ID_LED-

HDD LED+ 7 8 SYS_FAULT1-

HDD LED- 9 10 SYS_FAULT2-

PWR_SW- 11 12 LAN1_LED+

GND 13 14 LAN1_LED-

RESET- 15 16 ICH_SMBDAT

GND 17 18 ICH_SMBCLK

ID_SW- 19 20 INTRU#

TEMP_SENSOR 21 22 LAN2_LED+

NMI_SW 23 24 LAN2_LED-

- 25 26 -

LAN3_LED+ 27 28 LAN3_LED-

- 29 30 -

67

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3.4 Replacing the HDD Backplane Board

3.4.1 Removing the HDD Backplane Board

Follow these instructions to remove the HDD Backplane Board.

1. Remove the chassis cover (see 2.2 Removing and Installing the Chassis
Cover on page 35).

2. Disconnect all the system fan cables attached to the HDD backplane board.

3. Disconnect the power cables, SAS cable, and fan header cable.

4. Remove the three screws securing the HDD backplane board bracket to the
chassis.

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5. Lift the HDD backplane bracket to remove it from the chassis.

6. Remove the ten (10) screws securing the HDD backplane board to the HDD
backplane board bracket.

7. Lift the HDD backplane board to remove it from the HDD backplane board
bracket.

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3.4.2 Installing the HDD Backplane Board

1. Replace and secure the new HDD backplane board to the HDD backplane
bracket using ten (10) screws.

2. Align the HDD backplane board bracket to the chassis and secure it with three
screws.

3. Connect the power cables, SAS cable, and fan header cable to the connectors
on the HDD backplane board.

4. Connect all the system fan cables to the connectors on the HDD backplane
board.

5. Install the chassis cover (see 2.2 Removing and Installing the Chassis
Cover on page 35).

70

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3.4.1 HDD BP Board Features

Front view:

2 3

4

5

1

1 1

1

Rear view:

18

20

22

6

7

8

19

9 11 12

14

17

10

13

21

15 16

1 HDD LED (LED1~LED8) 12 F an Connector (FAN5)
2 SAS HDD Connector (J10) 13 (J45)
3 SAS HDD Connector (J11) 14 Fan Connector (FAN6)
4 SAS HDD Connector (J13) 15 SGPIO JTAG (J15)
5 SAS HDD Connector (J14) 16 Fan Header (J7)
6 Fan Connector (FAN7) 17 2x2P Power Connector (PW2)
7 Fan Connector (FAN1) 18 4-P Power Connector (PW1)
8 Fan Connector (FAN2) 19 (J43)

9 Fan Connector (FAN3) 20 (J42)
10 (J40) 21 SGPIO For IOH (J41)
11 Fan Connector (FAN4) 22 Mini SAS Connector (J39)

Form Factor

422.4 (L) mm x 38.7 (H) mm, 6-layer PCB

71

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3.4.2 Connector Pin Definitions

J15: SGPIO JTAG

Definition Pin Pin Definition

CPLD_JTAG_TCK 1 2 GND
CPLD_JTAG_TDO 3 4 3.3V
CPLD_JTAG_TMS 5 6 NI

NI 7 8 KEY Pin

CPLD_JTAG_TDI 9 10 GND

J41: SGPIO For IOH

Definition Pin Pin Definition

SM_CLK 1 2 SGPIO_0

SM_DATA 3 4 SGPIO_1

GND 5 6 SGPIO_2

KEY Pin 7 8 SGPIO_3

NI 9 10 HD_ERR_LED

PW1: Big 4-pin Power Connector

Definition Pin Pin Definition

+12V 1 2 GND
GND 3 4 +5V

PW2: 2X2-pin Power Connector

Definition Pin Pin Definition

GND 1 2 GND
+12V 3 4 +12V

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3.5 Replacing the Power Supply Unit

3.5.1 Removing the Power Supply Unit

Follow these instructions to remove the power supply unit.

1. Remove the chassis cover (see 2.2 Removing and Installing the

Chassis

Cover

on page 35).

2. Disconnect the power cables from the HDD backplane board.

3. Disconnect the power cable from the mainboard connector.

4. Disconnect the power cables from the mainboard connectors.

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5. Remove the two screws securing the power supply to the chassis.

6. Remove the five screws securing the power supply to the chassis.

7. Slide the power supply out from the chassis.

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8. Remove the two screws securing the power supply panel bracket to the power
supply unit.

9. Detach the power supply panel bracket from the power supply unit.

10. Remove the two screws to detach the bracket from the power supply unit.

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3.5.2 Installing the Power Supply Unit

1. On the back of the new power supply unit, attach the bracket using two
screws.

2. Align and attach the power supply panel bracket to the front of the power
supply unit using two screws.

3. Slide the power supply unit into the chassis b ay and secure it using five
screws.

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4. Attach the two screws to secure the power supply unit to the chassis.

5. Connect the power connectors to the motherboard.

6. Connect the power connectors to the HDD backplane board.

7. Install the chassis cover (see 2.2 Removing and Installing the Chassis
Cover on page 35).

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3.6 Replacing the Motherboard

Follow these instructions to replace the S7066 Motherboard.

1. Remove the chassis cover (see 2.2 Removing and Installing the

Chassis

Cover

on page 35).

2. Unscrew the 2 screws securing the riser bracket to the chassis.

3. Lift the riser bracket up.

4. Disconnect all the cables connected to the motherboard.

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5. Unscrew the motherboard, see screw placement on the image below.

6. Carefully lift the motherboard from the tray.

7. Prepare a new motherboard.

8. Set the necessary jumpers (see 1.5.5 Jumpers & Connectors on page 30
for jumper placement).

9. Secure the motherboard to the chassis using nine screws (see marked image
above).

10. Connect the cable connectors (see 1.5.5 Jumpers & Connectors on page
30 for connector placement).

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11. Insert the riser cards to the PCI-E slots on the motherboard as you align the
riser bracket onto the chassis.

12. Attach the two screws to secure the riser bracket to the chassis.

13. Install the the chassis cover (see 2.2 Removing and Installing the
Chassis Cover on page 35).

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Appendix I: Cable Connection Tables

1. System Fan Connector

System Fan to M1235 Backplane (BP) Board

System Fan Connect to M1235

Fan1

→

FAN1

Fan2

→

FAN2

Fan3

→

FAN3

Fan4

→

FAN4

Fan5

→

FAN5

Fan6

→

FAN6

2. SATA HDD Cable

M1235 SATA/SAS Backplane (BP) Board to S7066 MB

Cable M1235 Connect to S7066GM3NR

Mini-SAS Cable J39

→

PCH_SATA

Fan cable J7

→

J14

SGPIO J41

J30

Cable M1235 Connect to S7066WGM3NR

Mini-SAS Cable J39

→

LS1_SAS_CON1

Fan cable J7

→

J14

3. Control Cable and USB Cable

M1008-G2024 LED Control Board to S7066 MB

M1008-G2024 Connect to S7066

Control Cable J3

→

J39 & J44

USB Cable J1

→

J26

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4. Power Supply Cables

PSU to S7066 MB

500W PSU Connect to S7066

2x12P P1

→

PWR1

2x4P P2

→

PWR3

2x4P P7

→

PWR2

PSMI P8

→

J29

PSU to M1235 BP BD

500W PSU Connect to M1235

2x2P P3

→

PW2

B4P P4

→

PW1

5. Chassis Intrusion Cable

Chassis Intrusion Cable

Chassis Connect to S7066

Intrusion Cable

→

J4

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Appendix II: Fan and Temp Sensors

This section aims to help readers identify the locations of some specific FAN and
Temp Sensors on the motherboard. A table of BIOS Temp sensor name
explanation is also included for readers’ reference.

NOTE: The red dot indicates the sensor.

Fan and Temp Sensor Location:

1. Fan Sensor: It is located in the third pin of the fan connector, which detects the
fan speed (rpm)

2. Temp Sensor: PCH Area Temp, SAS Area Temp and M/B Inlet Temp.
They detect the system temperature around.

NOTE: The system temperature is measured in a scale defined by Intel, not in

Fahrenheit or Celsius.

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BIOS Temp Sensor Name Explanation:

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BIOS Temp Sensor Name Explanation

CPU0_DTS_Temp Temperature of the CPU0 Digital Temperature Sensor
CPU1_DTS_Temp Temperature of the CPU1 Digital Temperature Sensor
CPU0_PECI_Temp Temperature of the CPU0 Platform Environment Control Interface
CPU1_PECI_Temp Temperature of the CPU1 Platform Environment Control Interface
PCH_Area_Temp. Temperature of the PCH Area
M/B_Inlet_Temp Temperature of the Motherboard Inlet Area
SAS2308_Area Temperature of the SAS Area
CPU0_DIMM_A0 Temperature of CPU0 DIMM A0 Slot
CPU0_DIMM_A1 Temperature of CPU0 DIMM A1 Slot
CPU0_DIMM_B0 Temperature of CPU0 DIMM B0 Slot
CPU0_DIMM_B1 Temperature of CPU0 DIMM B1 Slot
CPU0_DIMM_C0 Temperature of CPU0 DIMM C0 Slot
CPU0_DIMM_C1 Temperature of CPU0 DIMM C1 Slot
CPU0_DIMM_D0 Temperature of CPU0 DIMM D0 Slot
CPU0_DIMM_D1 Temperature of CPU0 DIMM D1 Slot
CPU1_DIMM_A0 Temperature of CPU1 DIMM A0 Slot
CPU1_DIMM_A1 Temperature of CPU1 DIMM A1 Slot
CPU1_DIMM_B0 Temperature of CPU1 DIMM B0 Slot
CPU1_DIMM_B1 Temperature of CPU1 DIMM B1 Slot
CPU1_DIMM_C0 Temperature of CPU1 DIMM C0 Slot
CPU1_DIMM_C1 Temperature of CPU1 DIMM C1 Slot
CPU1_DIMM_D0 Temperature of CPU1 DIMM D0 Slot
CPU1_DIMM_D1 Temperature of CPU1 DIMM D1 Slot

BIOS FAN Sensor Name Explanation

CPU0_FAN Fan speed of CPU0_FAN
CPU1_FAN Fan speed of CPU1_FAN
SYS_FAN_1 Fan speed of SYS_FAN_1
SYS_FAN_2 Fan speed of SYS_FAN_2
SYS_FAN_3 Fan speed of SYS_FAN_3
SYS_FAN_4 Fan speed of SYS_FAN_4
SYS_FAN_5 Fan speed of SYS_FAN_5

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Appendix III: FRU Parts Table

GT24-B7066 FRU Parts

Item Model Number Part Number Picture Description

M2091 411739100498

PCI-E X16 1U Riser Card (Left)

Riser
Card

M2091-R 411790500004

PCI-E X16 1U Riser Card (Right)

CCBL-0689 422797800004

Mini-SAS cable, 500m

CCBL-0317 332810000397

A

/C Power Cord, L=1800mm, US type

Cable

CCBL-0300 332810000281

A

/C Power Cord, L=1830mm, EU type

DPS-500VB B

CPSU-0522

Delta, DPS-500VB, 500W, Single Power
Supply (B7066G24W4H & B7066G24V4H)

Power

Supply

YM-2451CE01R CPSU-0430

3Y, YM-2451CE01R, 450W, Redundant
Power Supply (B7066G24W4HR)

FAN

CFAN-0241 336252012294

14700RPM,40*40*28MM

CRAL-0034 452T15200001

Slide Rail Kit

Rack

Mounting

Kit

CEAR-0050 340740900010

Mounting Ear Kit

Heatsink FRU-TH-0090 343T48700001

GT24-B7066 Heatsink

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NOTE

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Appendix IV: Technical Support

If a problem arises with your system, you should first turn to your dealer for direct
support. Your system has most likely been configured or designed by them and they
should have the best idea of what hardware and software your system contains.
Hence, they should be of the most assistance for you. Furthermore, if you purchased
your system from a dealer near you, take the system to them directly to have it
serviced instead of attempting to do so yourself (which can have expensive
consequences).

If these options are not available for you then MiTAC International Corporation can
help. Besides designing innovative and quality products for over a decade, MiTAC
has continuously offered customers service beyond their expectations. TYAN’s
website (http://www.tyan.com) provides easy-to-access resources such as in-depth
Linux Online Support sections with downloadable Linux drivers and comprehensive
compatibility reports for chassis, memory and much more. With all these convenient
resources just a few keystrokes away, users can easily find their latest software and
operating system components to keep their systems running as powerful and
productive as possible. MiTAC also ranks high for its commitment to fast and friendly
customer support through email. By offering plenty of options for users, MiTAC
serves multiple market segments with the industry’s most competitive services to
support them.

Please feel free to contact us directly for this service at [e-mail]

Help Resources:

1. See the beep codes section of this manual.

2. See the TYAN’s website for FAQ’s, bulletins, driver updates, and other

information: http://www.tyan.com

3. Contact your dealer for help before calling TYAN.

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Returning Merchandise for Service

During the warranty period, contact your distributor or system vendor FIRST for any
product problems. This warranty only covers normal customer use and does not
cover damages incurred during shipping or failure due to the alteration, misuse,
abuse, or improper maintenance of products.

NOTE:

A receipt or copy of your invoice marked with the date of
purchase is required before any warranty service can be
rendered. You may obtain service by calling the
manufacturer for a Return Merchandise Authorization
(RMA) number. The RMA number should be prominently
displayed on the outside of the shipping carton and the
package should be mailed prepaid.
TYAN will pay to have the board shipped back to you.

TYAN® GT24-B7066 Service Engineer’s Manual V1.0
Document No.: D2230-100