TYAN GN70-B8236-HE Service Engineer's Manual

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GN70-B8236-HE

Service Engineer’s Manual

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PREFACE

Copyright

This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.

Copyright 2011 MiTAC International Corporation. All rights reserved.
TYAN® is a registered trademark of MiTAC International Corporation.

Version 1.0

Disclaimer

Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to
printing. MiTAC assumes no liability whatsoever, and disclaims any

express or implied warranty, relating to sale and/or use of TYAN® products
including liability or warranties relating to fitness for a particular purpose or
merchantability. MiTAC retains the right to make changes to produce
descriptions and/or specifications at any time, without notice. In no event
will MiTAC be held liable for any direct or indirect, incidental or
consequential damage, loss of use, loss of data or other malady resulting
from errors or inaccuracies of information contained in this document.

Trademark Recognition

All registered and unregistered trademarks and company names
contained in this manual are property of their respective owners including,
but not limited to the following.

TYAN® is a trademark of MiTAC International Corporation.
Intel

®

is a trademark of Intel® Corporation.

AMI

®

, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
IBM

®

, PC®, AT® and PS/2® are trademarks of IBM Corporation.
Winbond

®

is a trademark of Winbond Electronics Corporation.

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FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject
to the following conditions:

 This device must not cause harmful interference.
 This device must accept any interference received, including

interference that may cause undesirable operation.

This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is
likely to cause harmful interference in which case the user will be
required to correct the interference at his own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norme NMB-003
du Canada.

Notice for Europe (CE Mark)

This product is in conformity with the Council
Directive 2004/108/EC.

CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according
to manufacturer instructions and in accordance with your local
regulations.

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About this Manual

This manual provides you with instructions on installing your TYAN
GN70-B8236-HE. This Manual is intended for experienced users and
integrators with hardware knowledge of personal computers.

This manual consists of the following parts:

Chapter1:

Provides an introduction to the TYAN GN70-B8236-HE
barebones, standard parts list, describes the external
components, gives a table of key components, and
provides block diagram of the system.

Chapter2:

Covers procedures on installing the CPU, memory
modules and hard drives.

Chapter3:

Covers removal and replacement procedures for
pre-installed components.

Appendix:

List the cable connection and FRU part tables for
reference of system setup, and technical support in
case a problem arises with your system.

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Safety and Compliance Information

Before installing and using TYAN GN70-B8236-HE, take note of the
following precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.

·Do not block the slots and opening on the unit, which are provided for

ventilation.

·Only use the power source indicated on the marking label. If you are not
sure, contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third
pin to ground the unit and prevent electric shock. Do not defeat the
purpose of this pin. If your outlet does not support this kind of plug,
contact your electrician to replace your obsolete outlet.

·Do not place anything on the power cord. Place the power cord where it
will not be in the way of foot traffic.

·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high

voltage components and result in shock and damage to the
components.

· When replacing parts, ensure that you use parts specified by the

manufacturer.

·When service or repairs have been done, perform routine safety checks
to verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating
device.

·Cover the unit when not in use.

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Safety Information

Retain and follow all product safety and operating instructions
provided with your equipment. In the event of a conflict between the
instructions in this guide and the instructions in equipment
documentation, follow the guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions.
To reduce the risk of bodily injury, electric shock, fire and damage to
the equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide
before you install, operate, or service TYAN products.

Symbols on Equipment

Caution. This symbol indicates a potential

hazard. The potential for injury exists if
cautions are not observed. Consult equipment
documentation for specific details.

Warning. This symbol indicates the presence
of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified
personnel.

Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.

To reduce risk of injury from a hot component,
allow the surface to cool before touching.

General Precautions

· Follow all caution and warning instructions marked on the equipment
and explained in the accompanying equipment documentation.



Machine Room Environment

 · Make sure that the area in which you install the system is properly

ventilated and climate-controlled.

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· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.

· Do not install the system in or near a plenum, air duct, radiator, or heat
register.

· Never use the product in a wet location.

Equipment Chassis

· Do not block or cover the openings to the system.

· Never push objects of any kind through openings in the equipment.

Dangerous voltages might be present.

· Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.

· Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

· Observe local occupational health and safety requirements and
guidelines for manual materials handling.

· Do not attempt to move a rack by yourself; a minimum of two people
are needed to move a rack.

· Do not attempt to move a fully loaded rack. Remove equipment from
the rack before moving it.

· Do not attempt to move a rack on an incline that is greater than 10
degrees from the horizontal.

· Make sure the rack is properly secured to the floor or ceiling.

· Make sure the stabilizing feet are attached to the rack if it is a

single-rack installation.

· Make sure racks are coupled together if it is a multiple-rack installation.

· Make sure the rack is level and stable before installing an appliance in

the rack.

· Make sure the leveling jacks are extended to the floor.

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· Make sure the full weight of the rack rests on the leveling jacks.

· Always load the rack from the bottom up. Load the heaviest component

in the rack first.

· Make sure the rack is level and stable before pulling a component out
of the rack.

· Make sure only one component is extended at a time. A rack might
become unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and cable
management.

· Ensure that there is adequate airflow in the rack. Improper installation
or restricted airflow can damage the equipment.

· The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to
ensure adequate air flow to the system.

· If you install the Model in a rack, do not place equipment on top of the
unit. It will cause restricted airflow and might cause damage to the
equipment.

·

Make sure the product is properly matted with the rails. Products that

are improperly matted with the rails might be unstable.

·

Verify that the AC power supply branch circuit that provides power to

the rack is not overloaded. This will reduce the risk of personal injury, fire,
or damage to the equipment. The total rack load should not exceed 80
percent of the branch circuit rating. Consult the electrical authority having
jurisdiction over your facility wiring and installation requirements.

Equipment Power Cords

· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.

· Plug the power cord into a grounded (earthed) electrical outlet that is
easily accessible at all times.

· In all European electrical environments, you must ground the
Green/Yellow tab on the power cord. If you do not ground the

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Green/Yellow tab, it can cause an electrical shock due to high leakage
currents.

· Do not place objects on AC power cords or cables. Arrange them so

that no one might accidentally step on or trip over them.

· Do not pull on a cord or cable. When unplugging from the electrical
outlet, grasp the cord by the plug.

· To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.

Equipment Batteries

· The system battery contains lithium manganese dioxide. If the battery
pack is not handled properly, there is risk of fire and burns.

· Do not disassemble, crush, puncture, short external contacts, or
dispose of the battery in fire or water.

· Do not expose the battery to temperatures higher than 60°C (140°F).

· The system battery is not replaceable. If the battery is replaced by an

incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.

· Do not attempt to recharge the battery.

· Dispose of used batteries according to the instructions of the

manufacturer. Do not dispose of batteries with the general household
waste. To forward them to recycling or proper disposal, use the public

collection system or return them to TYAN, your authorized TYAN partner,
or their agents.

Equipment Modifications

· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has
been modified.

Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service
of this product should be performed by individuals who are knowledgeable

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about the procedures, precautions, and hazards associated with
equipment containing hazardous energy levels.

· Do not exceed the level of repair specified in the procedures in the
product documentation. Improper repairs can create a safety hazard.

· Allow the product to cool before removing covers and touching internal
components.

· Remove all watches, rings, or loose jewelry when working before
removing covers and touching internal components.

· Do not use conductive tools that could bridge live parts.

· Use gloves when you remove or replace system components; they can

become hot to the touch.

· If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:

– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the

product.
– The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating

instructions.

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Table of Contents

Chapter 1: Overview....................................................................... 15

1.1 About the TYAN GN70-B8236-HE ......................................... 15

1.2 Product Models....................................................................... 15

1.3 Features ............................................................................ 16

1.4 Standard Parts List ................................................................. 20

1.4.1 Box Contents ................................................................... 20

1.4.2 Accessories ..................................................................... 22

1.5 About the Product ................................................................... 24

1.5.1 System Front View........................................................... 24

1.5.2 System Rear View ........................................................... 27

1.5.3 Motherboard (S8236) Layout........................................... 28

1.5.4 Jumpers & Connectors .................................................... 29

1.5.5 System Block Diagram (S8236) ...................................... 30

1.5.6 Internal View .................................................................... 31

Chapter 2: Setting Up..................................................................... 33

2.0.1 Before you Begin ............................................................. 33

2.0.2 Work Area........................................................................ 33

2.0.3 Tools ................................................................................ 33

2.0.4 Precautions...................................................................... 34

2.1 Installing Motherboard Components....................................... 35

2.1.1 Removing the Chassis Cover .......................................... 35

2.1.2 Removing the Riser Card Brackets ................................. 37

2.1.3 Installing the CPU and Heatsink...................................... 38

2.1.4 Installing the Memory....................................................... 41

2.1.4 Installing Hard Drives....................................................... 46

2.1.5 Installing the PCI-E Cards ............................................... 49

2.2 Rack Mounting........................................................................ 50

2.2.1 Installing the Server in a Rack......................................... 50

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2.2.2 Removing the Server from a Rack................................ 54

Chapter 3: Replacing Pre-Installed Components ........................57

3.1 Introduction ............................................................................. 57

3.2 Disassembly Flowchart........................................................... 57

3.3 Removing the Cover ............................................................... 58

3.4 Replacing Motherboard Components..................................... 58

3.4.1 Replacing PCI-E Riser Card Cards ................................. 58

3.4.2 Disconnecting All Motherboard Cables ........................... 60

3.4.3 Removing the Motherboard ............................................. 61

3.5 Replacing the Power Distribution Board................................. 62

3.6 Replacing the Front Panel Board ........................................... 63

3.6.1 Front Panel Board Specifications .................................... 65

3.6.2 FPB LED and Connector Pin Definition........................... 66

3.7 Replacing the System Fan ..................................................... 68

3.8 Replacing the Fan Backplane Board...................................... 70

3.8.1 Fan BP Board Specifications........................................... 73

3.8.2 Fan BP Board LED Definitions ........................................ 73

3.9 Replacing the HDD Backplane Board .................................... 74

3.9.1 HDD BP Board Specifications ......................................... 75

3.9.2 HDD BP Board LED Definitions....................................... 76

Appendix I: Cable Connection Tables .......................................... 79

Appendix II: Technical Support.....................................................81

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Chapter 1: Overview

1.1 About the TYAN GN70-B8236-HE

Congratulations on your purchase of the TYAN® GN70-B8236-HE, a highly
optimized rack-mountable barebone system. The GN70-B8236-HE is designed
to support dual AMD

®

45nm 8-Core/12-Core Opteron 6100 Series processors

and up to 128GB RDIMM and 64GB UDIMM of DDR3 memory, providing a rich
feature set and incredible performance. Leveraging advanced technology from

AMD

®

, the GN70-B8236-HE server system is capable of offering scalable 32
and 64-bit computing, high bandwidth memory design, and lightning-fast PCI-E
bus implementtation. The GN70-B8236-HE not only empowers your company in
nowadays IT demand but also offers a smooth path for future application usage.

TYAN

®

also offers the GN70-B8236-HE in a version that can support up to eight

3.5” hot-swap hard drives. The GN70-B8236-HE uses TYAN’s latest chassis
featuring a robust structure and a solid mechanical enclosure. All of this provides
GN70-B8236-HE the power and flexibility to meet the needs of nowadays server
application.

1.2 Product Models

Model HDD Bays Power supply

B8236G70W8HR Hot-swap, 8HDDs (1+1) hot-swap 770W

B8236G70W8HR-SE Hot-swap, 8HDDs (1+1) hot-swap 700W

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1.3 Features

TYAN GN70B8236 (B8236G70W8HR-HE)

Form Factor

2U Rackmount

Chassis Model

GN70

Dimension (D x W x

H)

27.56" x 17.72" x 3.43" (700 x 450 x 87mm)

Motherboard

S8236WGM3NR-HE

Board Dimension

EEB, 12"x13" (305x330mm)

System

Gross Weight

25 kg

Buttons

(1) RST / (1) ID / (1) PWR w/ LED

LEDs

(1) PWR / (1) ID / (1) Warning / (3) LAN

Front Panel

I/O Ports

(2) USB ports

Type / Q'ty

2.5" or 3.5" Hot-Swap / (8)

External Drive

Bay

Supported HDD

Interface

SATA-II 3.0Gb/s / SAS 6.0Gb/s

System Cooling

Configuration

FAN

(8) 6cm fans

Type

EPS1U

Efficiency

PFC / 80 plus gold

Redundancy

1+1

Input Range

Full-range AC(100-240V)

Frequency

60 Hertz

Power Supply

Output Watts

770W or 700W

Processor

Supported CPU

Series

AMD 45nm 8-Core/12-Core Opteron 6100 Series

Processors (Magny-Cours) / (3) HT3.0 support ;

12MB L3 per socket

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Socket Type / Q'ty

G34 / (2)

Average CPU

Power (ACP)

wattage

Up to 80W

System Bus

Up to 6.4 GT/s Hyper-Transport link support

Chipset

AMD SR5690 + SR5650 + SP5100

Chipset

Super I/O

Winbond W83627DHG-P

Supported DIMM

Qty

(16) DIMM slots

DIMM Type / Speed

U/RDDR3 & LV RDDR3, 800/1066/1333 MHz

Capacity

Up to 128GB RDIMM/ 64GB UDIMM

Memory channel

4 Channels per CPU

Memory

Memory voltage

1.5V or 1.35V

PCI-E

(3) PCI-E Gen.2 x16 slots

Pre-install TYAN

Riser Card

(1) M2201-L16-2F, PCI-E x16 2U riser card (left) /

(2) M2202-R16-2F, PCI-E x16 2U riser card (right)

Expansion Slots

Max. HBA

Dimension (H x L)

(6) 111.15mm x 167.65mm (FH/HL)

Port Q'ty

(3)

LAN

Controller

Intel 82574L / Intel 82576EB

Connector type

D-Sub 15-pin

Resolution

1600x1200@60Hz

Graphic

Chipset

Aspeed AST2050

USB

(4) ports (2 at front, 2 at rear)

COM

(1) DB-9 COM port

I/O Ports

VGA

(1) D-Sub 15-pin port

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RJ-45

(3) ports

Chipset

Winbond W83795G

Voltage

Monitors voltage for CPU, memory, chipset &

power supply

Temperature

Monitors temperature for CPU & system

environment

LED

Over temperature warning indicator / Fan & PSU

fail LED indicator

System

Monitoring

Others

Chassis intrusion detection / Watchdog timer

support

Onboard Chipset

Onboard Aspeed AST2050

AST2050 IPMI

Feature

IPMI 2.0 compliant baseboard management

controller (BMC) / Supports storage over IP and

remote platform-flash / BIOS update

Server

Management

AST2050 iKVM

Feature

24-bit high quality video compression / Dual

10/100 Mb/s MAC interfaces

Brand / ROM size

AMI / 4MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0

/SMBIOS2.3 /PXE boot / ACPI 2.0 power

management /Power on mode after power

recovery / User-configurable H/W monitoring /

Auto-configurable of hard disk types

Operating

System

OS supported list

Please refer to our OS supported list.

FCC (DoC)

Class A

Regulation

CE (DoC)

Yes

Operating

Operating Temp.

10° C ~ 35° C (50° F~ 95° F)

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Non-operating

Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

Environment

In/Non-operating

Humidity

90%, non-condensing at 35° C

RoHS

RoHS 6/6

Complaint

Yes

Barebone

(1) GN70B8236 Barebone

Manual

(1) MB User's manual + (1) BB User's manual

Installation CD

(1) TYAN installation CD

Heatsink / Cooler

(2) G34 CPU heatsinks

Rail kit

(1) CRAL-0031, sliding rail kit for KGT24/ KGT62

Mounting Ear

(1) mounting ear kit

Package

Contains

Cable Power Cord

(2) CCBL-0310, US type power cord / (2)

CCBL-0300, EU type power cord

Optional

accessories

Peripheral

(1) CDVD-0060, slim type DVD-ROM

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1.4 Standard Parts List

This section describes GN70-B8236-HE package contents and
accessories. Open the box carefully and ensure that all components are
present and undamaged. The product should arrive packaged as
illustrated below.

1.4.1 Box Contents

Component Description

2U chassis, (8) hot swap HDD bays

TYAN® S8236 system board
(pre-installed)

(1+1) ERP1U hot-swap 770W RPSU

or

(1+1) ERP1U hot-swap 700W RPSU

(8) System fan

M1601T70-D-PDB Power
Distribution Board (pre-installed)

M1245G70-BP6-8 SATA/SAS HDD
Backplane Board (pre-installed)

M1709G70-FPB (pre-installed)

M2201-L16-2F riser card

(pre-installed)

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M2202-R8-2F riser card
(pre-installed)

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1.4.2 Accessories

If any items are missing or appear damaged, contact your retailer or browse to
TYAN

®

’s website for service: http://www.tyan.com

The web site also provides information of other TYAN

®

products, as well as

FAQs, compatibility lists, BIOS settings, etc.

TYAN® Motherboard

Drive CD

Heatsink x 2

HDD Screw Pack

(12 pcs)

Rail x 2

DVD Bracket Kit DVD Cable Kit

Ventilation Bracket GPU Cable

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SGCC Bracket_L SGCC Bracket_R

AC Power Cord 125V

(US)

AC Power Cord 250V

(Europe)

Barebone Manual Mainboard Manual

Addendum for China

Use Only

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1.5 About the Product

The following views show you the product.

1.5.1 System Front View

1 Ears

2 3.5” HDD bays

3 USB Ports

4 ID Button

5 NMI Button

6 RESET Button

7 NIC1/NIC2/NIC3

8 ID LED

9 Warning LED

10 BMC LED (reserved)

11 Power On/OFF Button with LED

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LED Definitions

LED State Color Description

On Green System is turned on

Blinking Green System is under S1 or S3 state

Power LED

Off Off Power off
Blinking Green LAN active
On Green LAN linked

NIC1

off off LAN not linked
Blinking Green LAN active
On Green LAN linked

NIC2

off off LAN not linked

Blinking Green LAN active

On Green LAN linked

NIC3

off off LAN not linked

On Red

Fan fail /Over temperature
/Over voltage

Warning
LED

Off Off No failure
On Blue System identified

ID LED

Off Off System not identified

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HDD LED

HDD Status Status LED

Color: Amber

Activity LED

Color: Green

No Driver Present or power disconnected OFF OFF

No Activity OFF ONDriver Present

Access Activity OFF Blinking

HDD Fail On Solid OFF

Identify (Locate the HDD) Blinking(1Hz) x

SAS/SATA RAID Building Blinking(4Hz) x



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1.5.2 System Rear View

1 Power Supply

2 LAN3 (shared with IPMI) + 2 USB

3 COM Port

4 LAN1 + LAN2

5 ID LED

6 VGA Port

7 PCI-E Slots

LAN LED

LED State Color Description

On Green

10Mb/100Mb/1000Mb
linked

Blinking Green

10Mb/100Mb/1000Mb
activity

RJ-45
Activity(left)

Disabled

Flash
Green

No LAN linked

On Amber 1000Mb linked

On Green 100Mb linked

RJ-45
Linkage(Right)

Disabled Off

10Mb mode or No LAN
linked

NOTE: “Left” and “Right” are viewed from the rear panel.

ID LED

LED State Color Description

On Blue System identified

ID LED

Off Off System not identified

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1.5.3 Motherboard (S8236) Layout

The diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram.

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1.5.4 Jumpers & Connectors

Jumper/Connector Function

J4 COM2 Header
J5/J12/J30/J34/J54/J55/J56 4-pin Fan Connectors
J23 Front Panel Header
J24 Reset Switch
J25 Power Switch
J28 Fan TACH Connector
J29/J33 USB Front Panel Header
J31 PSMI Connector
J32 LAN3 Active LED Header
J53 HDD Fault Header
J59 IPMB Header
JP1/JP2 COM2 Function Select Jumper
JP3 Clear CMOS Jumper
JP6 Front Panel ID LED Button
JP7 Chassis Intrusion Header
LED1 ID LED
LED2 SAS Flash Ready (Amber)
LED3 SAS HD Fault LED (Amber)
LED4 Power On LED (Green)
LED5 Standby LED (Green)
LED6 SAS Error LED (Amber)
LED7 SAS Heart Beat LED (Green)
LED8 BMC Heart Beat LED (Green)

Jumper Legend

OPEN - Jumper OFF Without jumper cover

CLOSED - Jumper ON With jumper cover

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1.5.5 System Block Diagram (S8236)

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1.5.6 Internal View

With Riser Card Brackets

1 3.5” HDD cage (underneath)
2 SAS/SATA HDD Backplane Board
3 System Fan Unit
4 Power Distribution Board
5 PCI-E Riser Card Bracket
6 Power Supply (underneath)

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Without Riser Card Brackets

1 3.5” HDD cage (underneath)
2 SAS/SATA HDD Backplane Board
3 System Fan Unit
4 Power Distribution Board
5 Power Supply (underneath)

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Chapter 2: Setting Up

2.0.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks,
memory modules, and hard drives. Instructions on inserting add on
cards are also given.

2.0.2 Work Area

Make sure you have a stable, clean working environment. Dust and
dirt can get into components and cause malfunctions. Use
containers to keep small components separated. Putting all small
components in separate containers prevents them from becoming
lost. Adequate lighting and proper tools can prevent you from
accidentally damaging the internal components.

2.0.3 Tools

The following procedures require only a few tools, including the
following:

 A cross head (Phillips) screwdriver

 A grounding strap or an anti-static pad

Most of the electrical and mechanical connections can be
disconnected with your hands. It is recommended that you do not
use pliers to remove connectors as it may damage the soft metal or
plastic parts of the connectors.

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2.0.4 Precautions

Components and electronic circuit boards can be damaged by
discharges of static electricity. Working on a system that is connected
to a power supply can be extremely dangerous. Follow the guidelines
below to avoid damage to GN70-B8236-HE or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then
touch a safely grounded object to release static charge (i.e.
power supply case). If available, wear a grounded wrist strap.
Alternatively, discharge any static electricity by touching the
bare metal chassis of the unit case, or the bare metal body of
any other grounded appliance.

 Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When

removing the motherboard, always place it on a grounded
anti-static surface until you are ready to reinstall it.

 Hold electronic circuit boards by the edges only. Do not touch

the components on the board unless it is necessary to do so.
Do not flex or stress circuit boards.

 Leave all components inside the static-proof packaging that

they ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs,

or other small parts are in place and are not left loose inside
the case. Metallic parts or metal flakes can cause electrical
shorts.

CAUTION: Please note that the following illustrations may not look

exactly like the rackmount server you purchased. Therefore, the
illustrations should be held for your reference only.

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2.1 Installing Motherboard Components

This section describes how to install components on to the motherboard,
including CPUs, memory modules, HDD and PCI-E cards.

2.1.1 Removing the Chassis Cover

Follow these instructions to remove the GN70-B8236-HE chassis cover.

1 Unscrew the rear top cover on the back side.

2 Unscrew the front top cover and pull the latches aside to lift up the top

cover.

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3 Slide the rear top cover out.

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2.1.2 Removing the Riser Card Brackets

Follow these instructions to remove the PCI-E Riser Card Brackets.

1 Loose four thumb screws to release the PCI-E Riser Card Brackets.

2 Lift up the Riser Card Brackets.

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2.1.3 Installing the CPU and Heatsink

Follow the steps below on installing CPUs and CPU heatsinks.

1. Locate the CPU sockets.

2. Pull the lever slightly away from the socket and then push it to a fully
open position.

3. Push the CPU socket cover to a fully open position.

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4. Take out the protection cap.

5. Place the CPU into the socket and make sure that the gold arrow is
located in the right direction.

6. Close the CPU socket cover and press the lever down to secure the
CPU.

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7. Position the heatsink on top of the CPU and secure it with 2 screws.

8. Repeat the procedures mentioned earlier to install the second CPU
and heatsink.

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2.1.4 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Locate the memory slots on the motherboard.

2. Press the memory slot locking levers in the direction of the arrows as shown in

the following illustration.

3. Align the memory module with the slot. When inserted properly, the memory
slot locking levers lock automatically onto the indentations at the ends of the module.
Follow the recommended memory population table to install the other memory
modules.

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Memory Population Option Table

The following pictures show common types of DDR3 memory modules.

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Recommended Memory Population Table

Single CPU

Installed

(CPU0 only)

Dual CPU

installed

(CPU0 and CPU1)

Quantity of

memory installed

12346823 4567810121416

CPU0_DIMM(1)D0 √ √ √ √

CPU0_DIMM(2)D1 √ √ √ √ √ √ √ √ √

CPU0_DIMM(3)C0 √ √ √ √

CPU0_DIMM(4)C1 √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM(5)B0 √ √ √ √ √ √

CPU0_DIMM(6)B1 √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM(7)A0 √ √ √ √ √ √

CPU0_DIMM(8)A1 √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

CPU1_DIMM(9)D0 √

CPU1_DIMM(10)D1 √ √ √ √ √

CPU1_DIMM(11)C0 √

CPU1_DIMM(12)C1 √ √ √ √ √ √ √

CPU1_DIMM(13)B0 √ √

CPU1_DIMM(14)B1 √ √ √ √ √ √ √ √ √

CPU1_DIMM(15)A0 √ √

CPU1_DIMM(16)A1 √ √ √ √ √ √ √ √ √ √ √

NOTE:

1. √ indicates a populated DIMM slot.

2. Paired memory installation for Max performance.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs

5. Un-buffered DIMM can offer slightly better performance than registerd DIMM if

populating only a single DIMM per channel

6. We don't suggest other memory installation.

7. AMD 6100 series CPU doesn't support Quad-ranks U-DIMM

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U-DIMM Module Support

DDR3 Speed/Voltage

DDR3 Rank

Configuration

1.35v 1.5v

DIMM1

(A1, B1,

C1, D1)

DIMM0
(A0, B0,
C0, D0)

800MHz 800MHz

SR and

DR

n/a

800MHz 800MHz

SR and

DR

SR and

DR

1066MHz 1066MHz

SR and

DR

n/a

1066MHz 1066MHz

SR and

DR

SR and

DR

1066MHz 1333MHz

SR and

DR

n/a

1066MHz 1333MHz

SR and

DR

SR and

DR

Notes:

 U-DIMM can support up to 4GB sized DIMM’s
 Maximum of 8GB per channel
 SR and DR UDDR3 module support only
 x8 DRAM module support only
 SR and DR 1.35v Memory MAX speed of 1066MHz in a dual channel configuration
 SR and DR 1.5v Memory MAX speed of 1333MHz in a dual channel configuration

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R-DIMM Module Support

DDR3 Speed/Voltage DDR3 Rank Configuration

1.35v 1.5v

DIMM1 (A1,

B1, C1, D1)

DIMM0 (A0,

B0, C0, D0)

800MHz 800MHz SR and DR n/a

800MHz 800MHz QR n/a

800MHz 800MHz

SR, DR and

QR

SR, DR and

QR

1066MHz 1066MHz SR and DR n/a

1066MHz 1066MHz QR n/a

1066MHz 1066MHz SR and DR SR and DR

n/a 1066MHz QR

SR, DR and

QR

n/a 1333MHz SR and DR n/a

n/a 1333MHz QR n/a

Notes:

 RDIMM can support up to 16GB sized DIMM’s
 SR and DR Memory has a MAX amount of 16GB per channel
 SR and DR 1.35v Memory MAX speed of 1066MHz in a dual channel

configuration

 SR and DR 1.5v Memory MAX speed of 1333MHz in a dual channel

configuration

 QR Memory has a MAX amount of 32GB per channel
 QR 1.35v Memory MAX speed of 800MHz in a dual channel configuration
 QR 1.5v Memory MAX speed of 1066MHz in a dual channel configuration

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2.1.4 Installing Hard Drives

The GN70-B8236-HE can support up to eight (8) 3.5” hard drives. Follow these
instructions to install a hard drive.

Warning!!! Always install the hard disk drive to the chassis after the chassis is

secured on the rack.

1 Press the locking lever latch and pull the locking lever open.

2 Slide the HDD tray out.

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3 Remove the 6 screws.

4 Place a hard drive into the drive tray.

5 Use 6 HDD screws to secure the HDD.

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6 Reinsert the HDD tray into the chassis and press the locking lever to

secure the tray.

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2.1.5 Installing the PCI-E Cards

The GN70-B8236-HE supports three PCI-E Riser Card Brackets. Follow these
instructions to install PCI-E cards.

1 Unscrew the PCI-E slots to take out the PCI brackets.

2 Insert the PCI-E cards and securely screw as shown.

3 Repeat the same procedures for the second and third Riser Card Brackets.

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2.2 Rack Mounting

After installing the necessary components, the TYAN GN70-B8236-HE can be
mounted in a rack using the supplied rack mounting kit.

Rear view Sliding Rail x 2 Front view

2.2.1 Installing the Server in a Rack

Follow these instructions to mount the TYAN GN70-B8236-HE into an industry
standard 19” rack.

NOTE: Before mounting the TYAN GN70-B8236-HE in a rack, ensure that all

internal components have been installed and that the unit has been fully tested.
However, to make the installation easier, we suggest that you remove all HDD
trays before you insert the chassis to the rack.

1. Position the rear of the sliding rail to the rear side of the rack. Make sure the
mid-point of the rail align with the anchor point marked in red.

Rear

51

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2. Repeat the same procedures for the front end of the rail.

Front

3. Push the locking latch to secure the rail to the rack. Repeat the same
procedures for the other rail.

Left Right

52

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4. Slide the inner rail to its full length. Note that to slide to its full length, push
the locking tab of the rail upward and then the rail can slide freely. There are
three holes on each rail which are used to hook and secure the chassis.

5. Align the studs on the chassis with the holes on the rails and make sure the
chassis is securely hooked.

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6. Push the chassis back into the rack.

7. The installation is now complete.

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2.2.2 Removing the Server from a Rack

Follow these instructions to remove the TYAN GN70-B8236-HE from an industry
standard 19” rack.

1. Push the ears to pull the chassis forward.

2. Push forward the locking tabs on both rails to unhook the chassis from the
rails.

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3. Follow the steps described earlier in reverse to remove the chassis from the
rack.

NOTE:

To avoid injury, it is strongly recommended that at least two people lift the
TYAN GN70-B8236-HE to hook on or unhook from the rails.

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NOTE

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Chapter 3: Replacing Pre-Installed

Components

3.1 Introduction

This chapter explains how to replace the pre-installed components, including
the S8236 Motherboard, M1709G70-FPB Front Panel Board, PCI-E Riser
Card, M1245G70-BP6-8 SATA/SAS HDD Board, System Fan and Power
Supply Unit etc.

3.2 Disassembly Flowchart

The following flowchart outlines the disassembly procedure.

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3.3 Removing the Cover

Before replacing any parts you must remove the chassis cover. Follow Section

2.1.1 Removing the Chassis Cover (page 35) to remove the cover of the
GN70-B8236-HE.

3.4 Replacing Motherboard Components

Follow these instructions to replace motherboard components, including the
motherboard.

3.4.1 Replacing PCI-E Riser Card Cards

The GN70-B8236-HE has three pre-installed PCI-E×16 riser cards.
Follow the instructions below to disassemble the M2201-L16-2F and
M2202-F16-2F PCI-E riser cards.

1 Unscrew to take out the PCI-E cards.

2 Unscrew the M2201-L16-2F riser card to replace a new one if necessary.

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3 Repeat the same procedures for the second and third Riser Card Brackets.

4 Unscrew the M2202-F16-2F riser card to replace a new one if necessary.

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3.4.2 Disconnecting All Motherboard Cables

Before replacing the motherboard or certain components, remove cables
connected to the motherboard. Follow these instructions to remove all cables.

1 Disconnect the power and PSMI cables.

2 Disconnect the Mini SAS, USB, fan control and front panel cables.

3 Disconnect the power cable.

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3.4.3 Removing the Motherboard

After removing all of the aforementioned cables, follow the instructions below
to remove the motherboard from the chassis.

1 Remove the heatsinks and processors if installed.
2 Remove the nine screws securing the motherboard to the chassis.

3 Carefully lift the motherboard from the chassis.

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3.5 Replacing the Power Distribution Board

Follow these instructions to replace the M1601T70-D-PDB power distribution
board.

1 Disconnect all cables.

2 Unscrew to replace a new power distribution board.

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3.6 Replacing the Front Panel Board

Follow these instructions to replace the M1709G70-FPB Front Panel Board.

1 Unscrew to release the Front Panel Board Module.

2 Push the Front Panel Board Module forward.

3 Disconnect the Front Panel Control and USB cables.

4 Unscrew the Front Panel Board to replace a new one.

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5 Follow the steps described earlier in reverse to reinstall the Front Panel

Board.

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3.6.1 Front Panel Board Specifications

Form Factor

 18.5MMx44.2MM, 4-Layer PCB

Connectors

 One 2x15 pin header for front panel connector of

motherboard and HDD backplane board

LEDs

 Power On/Off LED Color: Green (after power on)
 ID LED Color: Blue
 Warning (IPMI) LED Dual Color:

Yellow (Warning) / Green(Normal)

Push buttons

 RESET button
 ID button
 Power On/Off button with Power On/Off LED

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3.6.2 FPB LED and Connector Pin Definition

LED State Color Description

On Green System is turned on

Blinking Green System is under S1 or S3 state

Power
On/Off LED

Off Off Power off

On Orange

Fan fail / Over temperature / Over Voltage /
PSU fail

Warning
(IPMI) LED

On Green No failure

On Blue

System identified remotely on the server,
by clicking the Chassis Locate LED key.*

ID LED

Off Off System not identified

*: For more information on the Chassis Locate LED, please visit our Web site
for the latest Pilot II Software Configuration Guide.

Front Panel Connector (J3)

Definition Pin Pin Definition

PW_LED+

1 2

VCC

Key

3 4

ID_LED+

PW_LED-

5 6

ID_LED-

HD/LAN3_LED+

7 8

SYS_FAULT1-

HD/LAN3_LED-

9 10

SYS_FAULT2-

PWR_SW+

11 12

LAN1_LED+

PWR_SW-

13 14

LAN1_LED-

RESET+

15 16

ICH_SMBDAT

RESET-

17 18

ICH_SMBCLK

ID_SW+

19 20

INTRU#

Temp_sensor

21 22

LAN2_LED+

EXT_INT

23 24

LAN2_LED-

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USB Connector (J1)

Definition Pin Pin Definition

VCC

1 2

VCC

USB1-

3 4

USB2-

USB1+

5 6

USB2+

GND

7 8

GND

KEY

9 10

GND

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3.7 Replacing the System Fan

Follow these instructions to replace the system fan.

1 Press the latch in the direction as shown to lift up the fan from cage.

2 Take out the fan unit.

3 Loose the screws on both sides.

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4 Push the latch in the direction as the arrow shown to release the fan from
the iron holder.

5 Remove the iron holder to replace a new fan.

6 After replacing a new one, put the fan unit back into the cage.

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3.8 Replacing the Fan Backplane Board

Follow these instructions to replace the Fan Backplane Board in your system.

1 Press the latch in the direction as shown to lift up the fan from cage.

2 Remove all eight fans from the chassis.

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3 Disconnect all cables attached to the Fan Backplane Board.

4 Use a screw driver to unscrew the Fan Module.

5 Disconnect the power and fan cables.

6 Lift up the Fan Module.

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7 Release the 14 screws on the Fan Backplane Board to replace a new

one.

8 Follow the steps described in reverse order to reinstall the fan cage.

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3.8.1 Fan BP Board Specifications

Form Factor

 254 mm x 82 mm, 4-layer PCB

Integrated I/O

 (2) 1x4pin R/A Power Connector
 (8) 2x2pin Fan Connectors
 (1) 2 x10pin Barebone Fan Connector
 (1) 2x2pin Connector for S7015

3.8.2 Fan BP Board LED Definitions

FAN Status Green LED Red LED

With Fan On Off

Without Fan Off On

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3.9 Replacing the HDD Backplane Board

Follow these instructions to replace the SATA/SAS HDD Backplane Board.

1 Refer to Section 3.8 Replacing the Fan Backplane Board for how to
remove the Fan Module. Disconnect the power cables attached to the HDD BP
Board.

2 Unscrew the HDD BP Board. Remove the HDD BP Board from the
hook.

3 Replace a new HDD BP Board and reinstall it into the chassis following
the steps in reverse.

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3.9.1 HDD BP Board Specifications

Front View

Rear View (with mylar)

Form Factor

 81.8 x 436 mm, 4-layer PCB

Integrated I/O

 8 SAS HDD Connectors
 2 Mini SAS Connectors to MB and RAID Card
 1 2 x 4-pin Power Connector

LEDs

 8 HDD active LEDs
 8 HDD fault LEDs

PW3 Pin definition

Definition Pin Pin Definition

GND 1 5 +12V
GND 2 6 +12V
GND 3 7 +12V
GND 4 8 +12V

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3.9.2 HDD BP Board LED Definitions

HDD Status Status LED

2/4/6/8 

Color: Amber

Activity LED

1/3/5/7

Color: Green

No Driver Present or power disconnected OFF OFF

No Activity OFF ONDriver Present

Access Activity OFF Blinking

HDD Fail On Solid OFF

Identify (Locate the HDD) Blinking(4Hz) x

SAS/SATA RAID Building Blinking(1Hz) x

NOTE: If the LSI 9280-l6i4e or 9260-l6i storage cards is installed, the LED status

will change as below:

Identify (Locate the HDD) Blinking(4Hz) ON

SAS/SATA RAID Building Blinking Blinking

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3.10 Replacing the Power Supply

1 Press and hold the latch to pull the power supply out.

2 After replacing a new power supply, press and hold the latch to push the

power supply back into the chassis.

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NOTE

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Appendix I: Cable Connection Tables

1. Mini-SAS Cables

SAS/SATA Backplane

M1245G70-BP6

Connects to Motherboard

SAS_1



J17

SAS_2



J11

2. FAN Control Cable

FAN Board

M1806G70-FB

Connects to Motherboard

J8



J28

3. Front Panel Control Cable

Front Panel Board

M1709G70-FPB

Connects to Motherboard

J3



J23

4. USB Cable

Front Panel Board

M1709G70-FPB

Connects to Motherboard

J1



J33

5. Power Cables

Power Board

M1601T70-D-PDB

Connects to Motherboard

PW1 (MB)



PW1

PATX1 (MB1)



PW2

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PATX2 (MB2)



PW3

J7 (PSMI)



J31

Power Board

M1601T70-D-PDB

Connects to

FAN Board

M1806G70-FB

PW4 (FAN BD1)



PW2

PW5 (FAN BD2)



PW1

Power Board

M1601T70-D-PDB

Connects to

SAS/SATA Backplane

M1245G70-BP6

PATX8 (HDD BP3)



PW1

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Appendix II: Technical Support

If a problem arises with your system, you should first turn to your dealer for direct
support. Your system has most likely been configured or designed by them and
they should have the best idea of what hardware and software your system
contains. Hence, they should be of the most assistance for you. Furthermore, if
you purchased your system from a dealer near you, take the system to them
directly to have it serviced instead of attempting to do so yourself (which can
have expensive consequence).

If these options are not available for you then MiTAC International Corporation
can help. Besides designing innovative and quality products for over a decade,
MiTAC has continuously offered customers service beyond their expectations.
TYAN’s website (http://www.tyan.com) provides easy-to-access resources such
as in-depth Linux Online Support sections with downloadable Linux drivers and
comprehensive compatibility reports for chassis, memory and much more. With
all these convenient resources just a few keystrokes away, users can easily find
their latest software and operating system components to keep their systems
running as powerful and productive as possible. MiTAC also ranks high for its
commitment to fast and friendly customer support through email. By offering
plenty of options for users, MiTAC serves multiple market segments with the
industry’s most competitive services to support them.

Please feel free to contact us directly for this service at [e-mail]

Help Resources:

1. See the beep codes section of this manual.

2. See the TYAN’s website for FAQ’s, bulletins, driver updates, and other
information: http://www.tyan.com

3. Contact your dealer for help before calling TYAN.

4. Check the TYAN user group: alt.comp.periphs.mainboard.TYAN

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Returning Merchandise for Service

During the warranty period, contact your distributor or system vendor FIRST for
any product problems. This warranty only covers normal customer use and does
not cover damages incurred during shipping or failure due to the alteration,
misuse, abuse, or improper maintenance of products.

NOTE:

A receipt or copy of your invoice marked with the date of
purchase is required before any warranty service can be
rendered. You may obtain service by calling the manufa-

-cturer for a Return Merchandise Authorization (RMA) nu-

-mber. The RMA number should be prominently displayed
on the outside of the shipping carton and the package
should be mailed prepaid.
TYAN will pay to have the board shipped back to you.

TYAN® GN70-B8236-HE Service Engineer’s Manual V1.00

Document No.: D2124-100