TYAN GN70-B7056 Service Engineer's Manual

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GN70-B7056

Service Engineer’s Manual

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PREFACE

Copyright

This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.

Copyright 2012 MiTAC International Corporation. All rights reserved. TYAN

®

is

a registered trademark of MiTAC International Corporation.

Version 1.0

Disclaimer

Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied

warranty, relating to sale and/or use of TYAN

®

products including liability or
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to produce descriptions and/or specifications
at any time, without notice. In no event will MiTAC be held liable for any direct
or indirect, incidental or consequential damage, loss of use, loss of data or
other malady resulting from errors or inaccuracies of information contained in
this document.

Trademark Recognition

All registered and unregistered trademarks and company names contained in
this manual are property of their respective owners including, but not limited to
the following.

TYAN® is a trademark of MiTAC International Corporation.
Intel® is a trademark of Intel® Corporation.
AMI

®

, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
IBM®, PC®, AT® and PS/2® are trademarks of IBM Corporation.
Winbond® is a trademark of Winbond Electronics Corporation.

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FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject to
the following conditions:

z This device must not cause harmful interference.
z This device must accept any interference received, including

interference that may cause undesirable operation.

This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norme NMB-003 du
Canada.

Notice for Europe (CE Mark)

This product is in conformity with the Council
Directive 2004/108/EC.

CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according to
manufacturer instructions and in accordance with your local regulations.

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About this Manual

This manual provides you with instructions on installing your TYAN
GN70-B7056. This Manual is intended for experienced users and
integrators with hardware knowledge of personal computers.

This manual consists of the following parts:

Chapter1:

Provides an introduction to the TYAN GN70-B7056
barebones, standard parts list, describes the external
components, gives a table of key components, and
provides block diagram of the system.

Chapter2:

Covers procedures on installing the processor, memory
modules and hard drives.

Chapter3:

Covers the removal and replacement procedures for
pre-installed components.

Appendix:

List the cable connection and FRU part tables for reference
of system setup, and technical support in case a problem
arises with your system.

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Safety and Compliance Information

Before installing and using TYAN GN70-B7056, take note of the following
precautions:



gRead all instructions carefully.

gDo not place the unit on an unstable surface, cart, or stand.

gDo not block the slots and opening on the unit, which are provided for

ventilation.

g Only use the power source indicated on the marking label. If you are not

sure, contact the power company.

gThe unit uses a three-wire ground cable, which is equipped with a third pin to

ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.

gDo not place anything on the power cord. Place the power cord where it will

not be in the way of foot traffic.

gFollow all warnings and cautions in this manual and on the unit case.

gDo not push objects in the ventilation slots as they may touch high voltage

components and result in shock and damage to the components.

g When replacing parts, ensure that you use parts specified by the

manufacturer.

gWhen service or repairs have been done, perform routine safety checks

to verify that the system is operating correctly.

gAvoid using the system near water, in direct sunlight, or near a heating

device.

gCover the unit when not in use.

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Safety Information

Retain and follow all product safety and operating instructions provided
with your equipment. In the event of a conflict between the instructions in
this guide and the instructions in equipment documentation, follow the
guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the
equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide before
you install, operate, or service TYAN products.

Symbols on Equipment

Caution. This symbol indicates a potential

hazard. The potential for injury exists if
cautions are not observed. Consult equipment
documentation for specific details.

Warning. This symbol indicates the presence
of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified
personnel.

Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.

To reduce risk of injury from a hot component,
allow the surface to cool before touching.

General Precautions

gFollow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.



Machine Room Environment

 gMake sure that the area in which you install the system is properly

ventilated and climate-controlled.

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gEnsure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.

g Do not install the system in or near a plenum, air duct, radiator, or heat
register.

g Never use the product in a wet location.

Equipment Chassis

gDo not block or cover the openings to the system.

g Never push objects of any kind through openings in the equipment.

Dangerous voltages might be present.

g Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.

g Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

g Observe local occupational health and safety requirements and guidelines
for manual materials handling.

g Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.

g Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.

g Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.

g Make sure the rack is properly secured to the floor or ceiling.

g Make sure the stabilizing feet are attached to the rack if it is a single-rack

installation.

g Make sure racks are coupled together if it is a multiple-rack installation.

g Make sure the rack is level and stable before installing an appliance in the

rack.

g Make sure the leveling jacks are extended to the floor.

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g Make sure the full weight of the rack rests on the leveling jacks.

g Always load the rack from the bottom up. Load the heaviest component in

the rack first.

g Make sure the rack is level and stable before pulling a component out of the
rack.

g Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.

To avoid damage to the equipment:

gThe rack width and depth must allow for proper serviceability and cable
management.

gEnsure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.

g The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.

g If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.

g

Make sure the product is properly matted with the rails. Products that are

improperly matted with the rails might be unstable.

g Verify that the AC power supply branch circuit that provides power to the

rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.

Equipment Power Cords

gUse only the power cords and power supply units provided with your
system. The system might have one or more power cords.

g Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.

g In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.

g

Do not place objects on AC power cords or cables. Arrange them so that no

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one might accidentally step on or trip over them.

g Do not pull on a cord or cable. When unplugging from the electrical outlet,
grasp the cord by the plug.

gҏ To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.

Equipment Batteries

gThe system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.

g Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.

g Do not expose the battery to temperatures higher than 60°C (140°F).

g The system battery is not replaceable. If the battery is replaced by an

incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.

g Do not attempt to recharge the battery.

g Dispose of used batteries according to the instructions of the manufacturer.

Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.

Equipment Modifications

gDo not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has been
modified.

Equipment Repairs and Servicing

gThe installation of internal options and routine maintenance and service of
this product should be performed by individuals who are knowledgeable about
the procedures, precautions, and hazards associated with equipment
containing hazardous energy levels.

g Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.

g Allow the product to cool before removing covers and touching internal

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components.

g Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.

g Do not use conductive tools that could bridge live parts.

g Use gloves when you remove or replace system components; they can

become hot to the touch.

g If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:

– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the

product.
– The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating

instructions.

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Table of Contents

Chapter 1: Overview....................................................................... 15

1.1 About the TYAN GN70-B7056 ............................................... 15

1.2 Product Models....................................................................... 15

1.3 Features ............................................................................ 16

1.4 Standard Parts List................................................................. 23

1.4.1 Box Contents................................................................... 23

1.4.2 Accessories ..................................................................... 24

1.5 About the Product................................................................... 26

1.5.1 System Front View .......................................................... 26

1.5.2 System Rear View........................................................... 29

1.5.3 Motherboard (S7056) Layout .......................................... 31

1.5.4 Jumpers & Connectors.................................................... 32

1.5.5 System Block Diagram (S7056) ...................................... 33

1.5.6 Internal View.................................................................... 34

Chapter 2: Setting Up..................................................................... 37

2.0.1 Before you Begin............................................................. 37

2.0.2 Work Area........................................................................ 37

2.0.3 Tools................................................................................ 37

2.0.4 Precautions...................................................................... 38

2.1 Installing Motherboard Components ...................................... 39

2.1.1 Removing the Chassis Cover.......................................... 39

2.1.2 Removing the Riser Card Brackets ................................. 41

2.1.3 Installing the CPU and Heatsink...................................... 42

2.1.4 Installing the Memory ...................................................... 45

2.1.4 Installing Hard Drives ...................................................... 51

2.1.5 Installing the PCI-E Cards ............................................... 54

2.2 Rack Mounting........................................................................ 56

2.2.1 Installing the Server in a Rack......................................... 56

2.2.2 Removing the Server from a Rack .................................. 60

Chapter 3: Replacing Pre-Installed Components ........................ 61

3.1 Introduction............................................................................. 61

3.2 Disassembly Flowchart........................................................... 61

3.3 Removing the Cover............................................................... 62

3.4 Replacing Motherboard Components..................................... 62

3.4.1 Replacing the PCH Upgrade ROM Kit ............................ 62

3.4.2 Replacing PCI-E Riser Card Cards ................................. 64

3.4.3 Disconnecting All Motherboard Cables ........................... 66

3.4.4 Removing the Motherboard............................................. 67

3.5 Replacing the Power Distribution Board................................. 68

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3.6 Replacing the Front Panel Board ........................................... 69

3.6.1 Front Panel Board Specifications.................................... 71

3.6.2 Connector Pin Definition.................................................. 72

3.7 Replacing the System Fan ..................................................... 73

3.8 Replacing the Fan Backplane Board...................................... 75

3.8.1 Fan BP Board Specifications........................................... 78

3.8.2 Fan BP Board LED Definitions........................................ 78

3.8.3 Connector Pin Definitions................................................ 79

3.9 Replacing the HDD Backplane Board .................................... 80

3.9.1 HDD BP Board Specifications......................................... 81

Appendix I: Cable Connection Tables .......................................... 83

Appendix II: FRU Parts Table ........................................................ 85

Appendix III: Fan and Temp Sensors ........................................... 87

Appendix IV: Technical Support ................................................... 91

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Chapter 1: Overview

1.1 About the TYAN GN70-B7056

Congratulations on your purchase of the TYAN

®

GN70-B7056, a highlyʳ optimized

rack-mountable barebone system. The GN70-B7056 is designed to support

dual

Intel

®

Xeon Processor E5-2600 Series Processors and up to 128GB UDIMM /

256GB RDIMM / 512GB LRDIMM

of DDR3 memory, providing a rich feature set and
incredible performance. Leveraging advanced technology from Intel®, the
GN70-B7056 server system is capable of offering scalable 32 and 64-bit computing,
high bandwidth memory design, and lightning-fast PCI-E bus implementation. The
GN70-B7056 not only empowers your company in nowadays IT demand but also
offers a smooth path for future application usage.

TYAN

®

also offers the GN70-B7056 in a version that can support up to eight 3.5” or

2.5” hot-swap hard drives. The GN70-B7056 uses TYAN’s latest chassis featuring a
robust structure and a solid mechanical enclosure. All of this provides GN70-B7056
the power and flexibility to meet the needs of nowadays server application.

1.2 Product Models

Model HDD Bays Power supply

B7056G70W8HR-2T Hot-swap, 8HDDs (1+1) 770W

B7056G70W8HR Hot-swap, 8HDDs (1+1) 770W

B7056G70V8HR Hot-swap, 8HDDs (1+1) 770W

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1.3 Features

TYAN GN70-B7056 (B7056G70V8HR) ʳ

Form Factor 2U Rackmount

Gross Weight 25 kg

Chassis Model GN70

Dimension (D x W x
H)

27.56" x 17.72" x 3.43" (700 x 450 x 87mm)

Motherboard S7056GM3NR

System

Board Dimension EATX, 12"x13" (305x330mm)

Buttons (1) RST / (1) ID / (1) PWR w/ LED

LEDs (1) PWR / (1) ID / (1) Warning / (3) LAN

Front Panel

I/O Ports (2) USB ports

Type / Q'ty 2.5" or 3.5" Hot-Swap / (8)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (4) 6cm fans

Type ERP1U

Efficiency PFC / 80 plus gold

Redundancy 1+1

Serviceability Hot-swap

Input Range Full-range AC(100-240V)

Frequency 50/60 Hertz

Power Supply

Output Watts 770 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600 Series

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP)
wattage

Max up to 130W

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

PCH Intel C602

Chipset

Super I/O Nuvoton 83773G

Supported DIMM
Qty

(8)+(8) DIMM slots

DIMM Type / Speed

DDR3/DDR3L 800 / 1066 / 1333 / 1600 RDIMM, 800
/ 1066 / 1333 UDIMM / LRDIMM

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel

4 Channels per CPU / Support 2 R/LR-DIMMs or 2
UDIMMs per channel

Memory

Memory voltage 1.5V or 1.35V

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PCI-E

(2) sets of the following expansion combination: / (1)
PCI-E x16 slot (w/x16 or x8 link) + (1) PCI-E x8 slot
(w/x0 or x8 link) + (1) PCI-E x8 slot

Expansion Slots

Recommended
TYAN Riser Card

M7056-L24-3F, PCI-E x16 2U riser card (left) /
M7056-R24-3F, PCI-E x16 2U riser card (right)

Port Q'ty (3) GbE ports

LAN

Controller Intel 82574L / Intel I350-BT2

Connector type D-Sub 15-pin

Resolution Up to 1920x1024

Graphic

Chipset Aspeed AST2300

USB (4) ports (2 at front, 2 at rear)

COM (1) DB-9 COM port

VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports

Chipset Nuvoton 83773G

Voltage

Monitors voltage for CPU, memory, chipset & power
supply

Temperature Monitors temperature for CPU & system environment

LED

Over temperature warning indicator / Fan & PSU fail
LED indicator

System
Monitoring

Others Chassis intrusion detection / Watchdog timer support

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100 Mb/s
MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3

/

PXE boot / ACPI 2.0 power management /Power on
mode after power recovery / User-configurable H/W
monitoring / Auto-configurable of hard disk types

Operating
System

OS supported list Please visit our web site for the latest update.

FCC (DoC) Class A

Regulation

CE (DoC) Yes

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS RoHS 6/6 Compliant Yes

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Barebone (1) GN70B7056 Barebone

Heatsink / Cooler (2) LGA2011 CPU heatsinks

Rail kit (1) sliding rail kit

Manual (1) MB User's manual + (1) BB User's manual

Installation CD (1) TYAN installation CD

Package
Contains

Cable Power Cord

(2) CCBL-0317, US type power cord / (2)
CCBL-0300, EU type power cord

ʳ

TYAN GN70-B7056 (B7056G70W8HR)

ʳ

Form Factor 2U Rackmount

Gross Weight 25 kg

Chassis Model GN70

Dimension (D x W x
H)

27.56" x 17.72" x 3.43" (700 x 450 x 87mm)

Motherboard S7056WGM3NR

System

Board Dimension EATX, 12"x13" (305x330mm)

Buttons (1) RST / (1) ID / (1) PWR w/ LED

LEDs (1) PWR / (1) ID / (1) Warning / (3) LAN

Front Panel

I/O Ports (2) USB ports

Type / Q'ty 2.5" or 3.5" Hot-Swap / (8)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (4) 6cm fans

Type ERP1U

Efficiency PFC / 80 plus gold

Redundancy 1+1

Serviceability Hot-swap

Input Range Full-range AC(100-240V)

Frequency 50/60 Hertz

Power Supply

Output Watts 770 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600 Series

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP)
wattage

Max up to 130W

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

PCH Intel C602 with TRK-5 upgrade ROM module

Chipset

Super I/O Nuvoton 83773G

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Supported DIMM
Qty

(8)+(8) DIMM slots

DIMM Type / Speed

DDR3/DDR3L 800 / 1066 / 1333 / 1600 RDIMM, 800
/ 1066 / 1333 UDIMM / LRDIMM

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel

4 Channels per CPU / Support 2 R/LR-DIMMs or 2
UDIMMs per channel

Memory

Memory voltage 1.5V or 1.35V

PCI-E

(2) sets of the following expansion combination: / (1)
PCI-E x16 slot (w/x16 or x8 link) + (1) PCI-E x8 slot
(w/x0 or x8 link) + (1) PCI-E x8 slot

Expansion Slots

Recommended
TYAN Riser Card

M7056-L24-3F, PCI-E x16 2U riser card (left) /
M7056-R24-3F, PCI-E x16 2U riser card (right)

Port Q'ty (3) GbE ports

LAN

Controller Intel 82574L / Intel I350-BT2

Connector type D-Sub 15-pin

Resolution Up to 1920x1024

Graphic

Chipset Aspeed AST2300

USB (4) ports (2 at front, 2 at rear)

COM (1) DB-9 COM port

VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports

Chipset Nuvoton 83773G

Voltage

Monitors voltage for CPU, memory, chipset & power
supply

Temperature Monitors temperature for CPU & system environment

LED

Over temperature warning indicator / Fan & PSU fail
LED indicator

System
Monitoring

Others Chassis intrusion detection / Watchdog timer support

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100 Mb/s
MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3

/

PXE boot / ACPI 2.0 power management /Power on
mode after power recovery / User-configurable H/W
monitoring / Auto-configurable of hard disk types

Operating
System

OS supported list Please visit our web site for the latest update.

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FCC (DoC) Class A

Regulation

CE (DoC) Yes

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS RoHS 6/6 Compliant Yes

Barebone (1) GN70B7056 Barebone

Heatsink / Cooler (2) LGA2011 CPU heatsinks

Rail kit (1) sliding rail kit

Manual (1) MB User's manual + (1) BB User's manual

Installation CD (1) TYAN installation CD

Package
Contains

Cable Power Cord

(2) CCBL-0317, US type power cord / (2)
CCBL-0300, EU type power cord

ʳ

TYAN GN70-B7056 (B7056G70W8HR-2T)

ʳ

Form Factor 2U Rackmount

Gross Weight 25 kg

Chassis Model GN70

Dimension (D x W x
H)

27.56" x 17.72" x 3.43" (700 x 450 x 87mm)

Motherboard S7056WGM3NR-2T

System

Board Dimension EATX, 12"x13" (305x330mm)

Buttons (1) RST / (1) ID / (1) PWR w/ LED

LEDs (1) PWR / (1) ID / (1) Warning / (3) LAN

Front Panel

I/O Ports (2) USB ports

Type / Q'ty 2.5" or 3.5" Hot-Swap / (8)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (4) 6cm fans

Type ERP1U

Efficiency PFC / 80 plus gold

Redundancy 1+1

Serviceability Hot-swap

Input Range Full-range AC(100-240V)

Frequency 50/60 Hertz

Power Supply

Output Watts 770 Watts

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21

Supported CPU
Series

Intel Xeon Processor E5-2600 Series

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP)
wattage

Max up to 130W

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

PCH Intel C602 with TRK-5 upgrade ROM module

Chipset

Super I/O Nuvoton 83773G

Supported DIMM
Qty

(8)+(8) DIMM slots

DIMM Type / Speed

DDR3/DDR3L 800 / 1066 / 1333 / 1600 RDIMM, 800
/ 1066 / 1333 UDIMM / LRDIMM

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel

4 Channels per CPU / Support 2 R/LR-DIMMs or 2
UDIMMs per channel

Memory

Memory voltage 1.5V or 1.35V

PCI-E

(2) sets of the following expansion combination: / (1)
PCI-E x16 slot (w/x16 or x8 link) + (1) PCI-E x8 slot
(w/x0 or x8 link) + (1) PCI-E x8 slot

Expansion Slots

Recommended
TYAN Riser Card

M7056-L24-3F, PCI-E x16 2U riser card (left) /
M7056-R24-3F, PCI-E x16 2U riser card (right)

Port Q'ty (1) GbE port, (2) 10 GbE ports

LAN

Controller Intel 82574L / Intel X540-AT2

Connector type D-Sub 15-pin

Resolution Up to 1920x1024

Graphic

Chipset Aspeed AST2300

USB (4) ports (2 at front, 2 at rear)

COM (1) DB-9 COM port

VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports

Chipset Nuvoton 83773G

Voltage

Monitors voltage for CPU, memory, chipset & power
supply

Temperature

Monitors temperature for CPU & system environment

LED

Over temperature warning indicator / Fan & PSU fail
LED indicator

System
Monitoring

Others

Chassis intrusion detection / Watchdog timer support

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22

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100 Mb/s
MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power on
mode after power recovery / User-configurable H/W
monitoring / Auto-configurable of hard disk types

Operating
System

OS supported list Please visit our web site for the latest update.

FCC (DoC) Class A

Regulation

CE (DoC) Yes

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS RoHS 6/6 Compliant Yes

Barebone (1) GN70B7056 Barebone

Heatsink / Cooler (2) LGA2011 CPU heatsinks

Rail kit (1) sliding rail kit

Manual (1) MB User's manual + (1) BB User's manual

Installation CD (1) TYAN installation CD

Package
Contains

Cable Power Cord

(2) CCBL-0317, US type power cord / (2)
CCBL-0300, EU type power cord

ʳ

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1.4 Standard Parts List

This section describes GN70-B7056 package contents and accessories. Open the
box carefully and ensure that all components are present and undamaged. The
product should arrive packaged as illustrated below.

1.4.1 Box Contents

Component Description

2U chassis, (8) hot swap HDD bays

TYAN

®

S7056 system board

(pre-installed)

(2) ERP1U 770W power supply unit

(4) System fan

M1601T70-D-PDB Power Distribution

Board (pre-installed)

M1245G70-BP6-8 SATA/SAS HDD

Backplane Board (pre-installed)

M1709G70-FPB (pre-installed)

M7056-L24-3F riser card (pre-installed)

M7056-R24-3F riser card (pre-installed)

M1806G70-FB (pre-installed)

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1.4.2 Accessories

If any items are missing or appear damaged, contact your retailer or browse to
TYAN

®

’s website for service:

http://www.tyan.com

The web site also provides information of other TYAN® products, as well as FAQs,
compatibility lists, BIOS settings, etc.

TYAN® Motherboard

Drive CD

Heatsink x 2

Screw Pack x 3 Rail Kit

DVD Bracket Kit DVD Cable Kit

AC Power Cord 125V

(US) x 2

AC Power Cord 250V

(Europe) x 2

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Barebone Manual Mainboard Manual

Addendum for China

Use Only

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1.5 About the Product

The following views show you the product.

1.5.1 System Front View

1 Ears

2 3.5” /2.5” HDD bays

3 USB Ports

4 ID Button

5 NMI Button

6 RESET Button

7 LAN1/LAN2/LAN3

8 ID LED

9 System Fan Fail LED

10 System Warning LED

11 Power On/OFF Button with LED

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LED Definitions

LED Status

LED
Color

Behavior Remark

Power on Solid on

Power LED

Power off

Green

Off

Normal Off
System
Warning LED

Warning

Amber

Solid on

All BMC
warning PSU
alert, PSU fail

Normal Off
System Fan

Fail

System Fan Fail

Red

Solid on

System Fan
fail warning

Normal Off
ID LED

Located

Blue

Solid on

Local and
remote

Off line Off

Link Solid on

LAN1
LAN2
LAN3

Activity

Green

Blinking

PSU Redundancy 1+1 System Warning LED Indication

Status System Warning LED

2 PSU and 2 PSU AC cords are
connected.

Off

1 PSU and 1 PSU AC cord are
connected.

Amber solid on

2 PSU and 2 PSU AC cords are
connected. After system is powered on,
disconnect 1 PSU AC cord.

Amber solid on

2 PSU and 2 PSU AC cords are
connected. After system is powered
on, disconnect 1 PSU.

Amber solid on

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HDD LED

HDD Status Status LED

Color: Amber

Activity LED
Color: Green

No Driver Present or power disconnected OFF OFF

No Activity OFF Solid ONDriver Present

Access Activity OFF Blinking
HDD Fail Solid ON OFF
Rebuild Blinking @4Hz OFF
Identify (Locate the HDD) Blinking @1Hz OFF





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1.5.2 System Rear View

1 Power Supply

2 LAN3 (shared with IPMI) + 2 USB

3 COM Port

4 LAN2 (left) + LAN1 (right)

5 ID LED

6 VGA Port

7 PCI-E Slots

10/100/1000 Mbps LAN Link/Activity LED Scheme

Left LED

(Link/Activity)

Right LED

(Speed)

No Link OFF OFF

Link Solid Green OFF

10 Mbps

Active Blinking Green OFF

Link Solid Green Solid Green

100 Mbps

Active Blinking Green Solid Green

Link Solid Green Solid Yellow

1000 Mbps

(1Gbps)

Active Blinking Green Solid Yellow

Link Solid Yellow Solid Yellow

10 Gbps

Active Blinking Yellow Solid Yellow

NOTE: “Left” and “Right” are viewed from the rear panel.

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NOTE:

1. When i350 LAN chip is on, LAN1 and LAN2 can support 10Mbps~1Gbps.

2. When X540 LAN chip is on, LAN1 and LAN2 can support up to
100Mbps~10Gbps.

3. Peripheral devices can be plugged straight into any of these ports but
software may be required to complete the installation.

ID LED

LED Status

LED

Color

Behavior

Remark

Normal Off

ID LED

Located

Blue

Solid on

Local and
remote

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1.5.3 Motherboard (S7056) Layout

This diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram. The
DIMM slot numbers shown above can be used as a reference when reviewing the
DIMM population guidelines shown later in the manual. For the latest board
revision, please visit our web site at

http://www.tyan.com

.

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32

1.5.4 Jumpers & Connectors

Jumper/Connector Function

J1/J26 USB Front Panel Header (blue)

J3 Clear CMOS Jumper

J4 Chassis Intrusion Header

J5 PCH SKU Upgrade ROM Module Header

J14 Front Fan Connector

J21 (ID_SW) ID LED SW Connector

J22 PCH Software SAS RAID Key Header

J24 Type-A USB Connector

J25 (COM2) COM2 Header

J27 (PWR1) ATX 24-pin Power Connector

J28 Port 80 Header

J29 IPMB Connector

J30 (SATA_SGPIO) SATA SGPIO Pin Header

J33 SAS SMB Pin Header

J34 PSMI Connector

J39 (SSI_FP) Front Panel Connector

J43 (PWR2) SSI 8-pin CPU Power Connector

J44 (LAN_LED) LAN3 LED Header

J62 (PWR3) SSI 8-pin DIMM Power Connector

J68 Flash Security Override Pin Header

J69 ME Firmware Update Header

IDLED_BTN ID LED Button

ID_LED ID LED

SATA0/SATA1 Serial ATA Connector

J19/J20/J64/J65/J66 4-pin Fan Power Connector

J45/J63 4-pin CPU1/CPU0 Fan Power Connector

Jumper Legend

OPEN - Jumper OFF Without jumper cover

CLOSED - Jumper ON With jumper cover

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1.5.5 System Block Diagram (S7056)

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1.5.6 Internal View

With Riser Card Brackets

1 3.5”/2.5” HDD cage (underneath)
2 SAS/SATA HDD Backplane Board
3 System Fan Unit
4 Power Distribution Board
5 PCI-E Riser Card Bracket
6 Power Supply (underneath)

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Without Riser Card Brackets

1 3.5”/2.5” HDD cage (underneath)
2 SAS/SATA HDD Backplane Board
3 System Fan Unit
4 Power Distribution Board
5 Power Supply (underneath)

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NOTE

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37

Chapter 2: Setting Up

2.0.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks, memory
modules, and hard drives. Instructions on inserting add on
cards are also given.

2.0.2 Work Area

Make sure you have a stable, clean working environment. Dust and dirt
can get into components and cause malfunctions. Use containers to
keep small components separated. Putting all small components in
separate containers prevents them from becoming lost. Adequate
lighting and proper tools can prevent you from accidentally damaging
the internal components.

2.0.3 Tools

The following procedures require only a few tools, including the
following:

z A cross head (Phillips) screwdriver

z A grounding strap or an anti-static pad

Most of the electrical and mechanical connections can be disconnected
with your hands. It is recommended that you do not use pliers to remove
connectors as it may damage the soft metal or plastic parts of the
connectors.

Caution!

1. To avoid damaging the motherboard and associated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

2. Do not apply power to the board if it has been

damaged.

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38

2.0.4 Precautions

Components and electronic circuit boards can be damaged by
discharges of static electricity. Working on a system that is connected to
a power supply can be extremely dangerous. Follow the guidelines below
to avoid damage to GN70-B7056 or injury to yourself.

z Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then touch a
safely grounded object to release static charge (i.e. power supply
case). If available, wear a grounded wrist strap. Alternatively,
discharge any static electricity by touching the bare metal chassis
of the unit case, or the bare metal body of any other grounded
appliance.

z Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

z The motherboard is pre-installed in the system. When removing

the motherboard, always place it on a grounded anti-static surface
until you are ready to reinstall it.

z Hold electronic circuit boards by the edges only. Do not touch the

components on the board unless it is necessary to do so. Do not
flex or stress circuit boards.

z Leave all components inside the static-proof packaging that they

ship with until they are ready for installation.

z After replacing optional devices, make sure all screws, springs, or

other small parts are in place and are not left loose inside the case.
Metallic parts or metal flakes can cause electrical shorts.

CAUTION: Please note that the following illustrations may not look

exactly like the rackmount server you purchased. Therefore, the
illustrations should be held for your reference only.

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39

2.1 Installing Motherboard Components

This section describes how to install components on to the motherboard, including
CPUs, memory modules, HDD and PCI-E cards.

2.1.1 Removing the Chassis Cover

Follow these instructions to remove the GN70-B7056 chassis cover.

1. Unscrew the rear top cover on the back side.

2. Unscrew the front top cover and pull the latches aside to lift up the top cover.

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40

3. Slide the rear top cover out.

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41

2.1.2 Removing the Riser Card Brackets

Follow these instructions to remove the PCI-E Riser Card Brackets.

1. Loose three thumb screws to release the PCI-E Riser Card Brackets.

2. Lift up the Riser Card Brackets.

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2.1.3 Installing the CPU and Heatsink

Follow the steps below on installing CPUs and CPU heatsinks.

1. Locate the CPU sockets. Always start with CPU0 first.

2. Pull the first and second levers slightly away from the socket and then push
them to a fully open position.

3. Push the CPU socket cover to a fully open position. Take out the protection
cap

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43

4. Place the CPU into the socket and make sure that the gold arrow is located in
the right direction.

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44

5. Close the CPU socket cover and press the levers down to secure the CPU.

6. Position the heatsink on top of the CPU and secure it with 4 screws.

7. Repeat the procedures mentioned earlier to install the second CPU and
heatsink.

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2.1.4 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Locate the memory slots on the motherboard.

2. Press the memory slot locking levers in the direction of the arrows as shown in
the following illustration.

3. Align the memory module with the slot. When inserted properly, the memory
slot locking levers lock automatically onto the indentations at the ends of the
module. Follow the recommended memory population table to install the
other memory modules.

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46

Memory Population Option Table

The following pictures show common types of DDR3 memory modules.

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47

Recommended Memory Population Table

Single CPU Installed

(CPU0 only)

Quantity of

memory installed

1 2 3 4 5 6 7 8

CPU0_DIMM_A0 ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥

CPU0_DIMM_A1 ¥ ¥ ¥ ¥

CPU0_DIMM_B0 ¥ ¥ ¥ ¥ ¥ ¥ ¥

CPU0_DIMM_B1 ¥ ¥ ¥

CPU0_DIMM_C0 ¥ ¥ ¥ ¥ ¥ ¥

CPU0_DIMM_C1 ¥ ¥

CPU0_DIMM_D0 ¥ ¥ ¥ ¥ ¥

CPU0_DIMM_D1 ¥

NOTE:

1. ¥ indicates a populated DIMM slot.

2. Install memory in sets of fours for maximum performance. This ensures that all four

memory channels are properly utilized, providing maximum memory bandwidth.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs.

5. Unbuffered DIMMs can offer slightly better performance than Registered DIMMs if

populating only a single DIMM per channel.

6. Always install with DIMM_A0 Slot first, following the alphabetical order (starting with

DIMM_A0, DIMM_B0, DIMM_C0, DIMM_D0), and then the numerical order (starting

with DIMM_A1, DIMM_B1, DIMM_C1, DIMM_D1, DIMM_A2, DIMM_B2, DIMM_C2,

DIMM_D2).

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Dual CPU installed (CPU0 and CPU1)

Quantity of

memory

installed

2 3 4 5 6 7 8 10 12 14 16

CPU0_DIMM_A0 ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥

CPU0_DIMM_A1 ¥ ¥ ¥ ¥

CPU0_DIMM_B0 ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥

CPU0_DIMM_B1 ¥ ¥ ¥

CPU0_DIMM_C0 ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥

CPU0_DIMM_C1 ¥ ¥ ¥

CPU0_DIMM_D0 ¥ ¥ ¥ ¥ ¥ ¥

CPU0_DIMM_D1 ¥

CPU1_DIMM_A0 ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥

CPU1_DIMM_A1 ¥ ¥ ¥ ¥

CPU1_DIMM_B0 ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥ ¥

CPU1_DIMM_B1 ¥ ¥

CPU1_DIMM_C0 ¥ ¥ ¥ ¥ ¥ ¥ ¥

CPU1_DIMM_C1 ¥ ¥

CPU1_DIMM_D0 ¥ ¥ ¥ ¥ ¥

CPU1_DIMM_D1 ¥

NOTE:

1. ¥ indicates a populated DIMM slot.

2. Install memory in sets of fours for maximum performance. This ensures that all four

memory channels are properly utilized, providing maximum memory bandwidth.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs.

5. Unbuffered DIMMs can offer slightly better performance than Registered DIMMs if

populating only a single DIMM per channel.

6. Always install with DIMM_A0 Slot first, following the alphabetical order (starting with

DIMM_A0, DIMM_B0, DIMM_C0, DIMM_D0), and then the numerical order (starting with

DIMM_A1, DIMM_B1, DIMM_C1, DIMM_D1, DIMM_A2, DIMM_B2, DIMM_C2,

DIMM_D2).

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Intel® Xeon® processor E5-2600/4600 product families UDIMM Support

1.35V 1.50V

Ranks Per DIMM &
Data Width

Memory Capacity per DIMM

1DPC 2DPC 1DPC 2DPC

SRx8 Non-ECC 1 GB 2GB 4GB N/A N/A

1066,

1333

1066,

1333

DRx8 Non-ECC 2GB 4GB 8GB N/A N/A

1066,

1333

1066,

1333

SRx16 Non-ECC 512 MB 1GB 2GB N/A N/A

1066,

1333

1066,

1333

SRx8 ECC 1GB 2GB 4GB

1066,

1333

1066

1066,

1333

1066,

1333

DRx8 ECC 2GB 4GB 8GB

1066,

1333

1066

1066,

1333

1066,

1333

NOTE 1:

The blue blocks indicate that the DRAM Densities are supported but not validated.

NOTE 2: The grey blocks indicate that the DRAM Densities are supported and validated.

NOTE 3: 1DPC => One dimm per channel

NOTE 4: 2DPC => Two dimm per channel

z Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated by

Intel.

z Command Address Timing is 1N for 1DPC and 2N for 2DPC.

Intel® Xeon® processor E5-2600/4600 product families LRDIMM Support

1.35V 1.50V

Ranks Per DIMM &
Data Width

Memory Capacity per

DIMM

1DPC 2DPC 1DPC 2DPC

QRx4 (DDP) 16GB 32GB 1066 1066

1066,

1333

1066,

1333

QRx8 (P) 8GB 16GB 1066 1066

1066,

1333

1066,

1333

NOTE: The grey blocks indicate that the DRAM Densities are supported and validated.

z Physical Ranks are used to calculate DIMM Capacity.

z Supported and validated DRAM Densities are 2Gb and 4Gb.

z Command Address Timing is 1N.

z The speeds are estimated targets and will be verified through simulation.

z DDP -Dual Die Package DRAM stacking. P –Planer monolithic DRAM Die.

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Intel® Xeon® processor E5-2600/4600 product families RDIMM Support

1.35V 1.50V

Ranks
Per
DIMM &
Data
Width

Memory Capacity
per DIMM

1DPC 2DPC 1DPC 2DPC

SRx8 1GB 2GB 4GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

DRx8 2GB 4GB 8GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

SRx4 2GB 4GB 8GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

DRx4 4GB 8GB 16GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

QRx4 8GB 16GB 32GB 800 800 1066 800
QRx8 4GB 8GB 16GB 800 800 1066 800

NOTE 1: The blue blocks indicate that the DRAM Densities are supported but not

validated.

NOTE 2: The grey blocks indicate that the DRAM Densities are supported and

validated.

NOTE 3: The yellow blocks indicate that the DRAM Densities are supported with limited

validated.

z Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated by

Intel.

z Command Address Timing is 1N.

z QR RDIMM are supported but have not been validated by Intel/PMO in a homogenous

environment. The coverage will have limited system level testing, no signal integrity

testing, and no interoperability testing. All quad rank DIMMs that pass internal validation

testing will be posted on

http://www.tyan.com

.

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51

2.1.4 Installing Hard Drives

The GN70-B7056 can support up to eight (8) 3.5” or 2.5” hard drives. Follow these
instructions to install a hard drive.

Warning!!! Always install the hard disk drive to the chassis after the chassis is

secured on the rack.

1. Press and hold the locking lever latch to pull the locking lever open.

2. Slide the HDD tray out.

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52

Option A: for 2.5” hard drives

3. Place a 2.5” hard drive into the HDD tray and use 4 screws to secure the HDD.

Option B: for 3.5” hard drives

4. Unscrew the drive bracket from the HDD tray.

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53

5. Place a 3.5” hard drive into the drive tray and use 6 screws to secure the HDD.

6. Reinsert the HDD tray into the chassis and press the locking lever to secure
the tray.

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54

2.1.5 Installing the PCI-E Cards

The GN70-B7056 supports

two PCI-E Riser Card Brackets. A power cable

(2x3p/2x4p) is required for GPU cards. Follow these instructions to install PCI-E
cards.

1. Unscrew the PCI-E slot to take out the PCI bracket.

2. Insert the PCI-E card and securely screw as shown.

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55

3. Repeat the same procedures for the second Riser Card Bracket.

56

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2.2 Rack Mounting

After installing the necessary components, the TYAN GN70-B7056 can be mounted
in a rack using the supplied rack mounting kit.

Rear view CRAL-0190 Rail Kit Front view

2.2.1 Installing the Server in a Rack

Follow these instructions to mount the TYAN GN70-B7056 into an industry standard

19” rack.

NOTE: Before mounting the TYAN GN70-B7056 in a rack, ensure that all internal

components have been installed and that the unit has been fully tested. However, to
make the installation easier, we suggest that you remove all HDD trays before you
insert the chassis to the rack.

1. Position the rear of the sliding rail to the rear side of the rack. Make sure the
mid-point of the rail align with the anchor point marked in red.

Rear

57

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2. Repeat the same procedures for the front end of the rail.

Front

3. Push the locking latch to secure the rail to the rack. Repeat the same
procedures for the other rail.

Left

Right

58

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4. Slide the inner rail to its full length. Note that to slide to its full length, push
the locking tab of the rail upward and then the rail can slide freely. There are
three holes on each rail which are used to hook and secure the chassis.

5. Align the studs on the chassis with the holes on the rails and make sure the
chassis is securely hooked.

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59

6. Push the chassis back into the rack.

7. The installation is now complete.

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2.2.2 Removing the Server from a Rack

Follow these instructions to remove the TYAN GN70-B7056 from an industry

standard 19” rack.

1. Push the ears to pull the chassis forward.

2. Push forward the locking tabs on both rails to unhook the chassis from the
rails.

3. Follow the steps described earlier in reverse to remove the chassis from the
rack.

NOTE:

To avoid injury, it is strongly recommended that at least two people lift the
TYAN GN70-B7056 to hook on or unhook from the rails.

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61

Chapter 3: Replacing Pre-Installed Components

3.1 Introduction

This chapter explains how to replace the pre-installed components, including the

S7056 Motherboard, M1709G70-FPB Front Panel Board, PCI-E Riser Card,
M1245G70-BP6-8 SATA/SAS HDD Board, System Fan and Power Supply Unit etc.

3.2 Disassembly Flowchart

The following flowchart outlines the disassembly procedure.

62

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3.3 Removing the Cover

Before replacing any parts you must remove the chassis cover. Follow Section 2.1.1
Removing the Chassis Cover (page 39) to remove the cover of the GN70-B7056.

3.4 Replacing Motherboard Components

Follow these instructions to replace motherboard components, including the
motherboard.

3.4.1 Replacing the PCH Upgrade ROM Kit

WARNING: The PCH Upgrade ROM Kit is pre-installed in the system. We strongly

recommend that users do not remove the Kit. Please handle with care when you
remove or install the Kit. Follow these instructions to replace the PCH Upgrade
ROM Kit on the motherboard.

1. Remove the PCH Upgrade ROM Kit with care.

2. Take out the new PCH Upgrade ROM Kit.

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3. Locate the PCH Upgrade ROM Header on your motherboard.

4. Insert the Upgrade ROM Kit in the direction as the arrow shows.

5. You have completed the PCH Upgrade ROM Kit installation.

64

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3.4.2 Replacing PCI-E Riser Card Cards

The GN70-B7056 has

two pre-installed PCI-E×16 riser cards.

Follow the instructions below to disassemble the M7056-L24-3F and M7056-R24-3F
PCI-E riser cards.

1. Unscrew to take out the PCI-E card.

2. Unscrew the M7056-R24-3F riser card to replace a new one if necessary.

65

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3. Repeat the same procedures for the second Riser Card Bracket.

4. Unscrew the M7056-L24-3F riser card to replace a new one if necessary.

66

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3.4.3 Disconnecting All Motherboard Cables

Before replacing the motherboard or certain components, remove cables connected
to the motherboard. Follow these instructions to remove all cables.

1. Disconnect the Fan control, PSMI and power cables.

2. Disconnect the Mini SAS, USB and front panel cables.

3. Disconnect the 2x4pin power cable.

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3.4.4 Removing the Motherboard

After removing all of the aforementioned cables, follow the instructions below to
remove the motherboard from the chassis.

1. Remove the heatsinks and processors if installed.

2. Remove the nine screws securing the motherboard to the chassis.

3. Carefully lift the motherboard from the chassis.

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3.5 Replacing the Power Distribution Board

Follow these instructions to replace the M1601T70-D-PDB power distribution board.

1. Disconnect all cables.

2. Unscrew to replace a new power distribution board.

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3.6 Replacing the Front Panel Board

Follow these instructions to replace the M1709G70-FPB Front Panel Board.

1. Unscrew to release the Front Panel Board Module.

2. Push the Front Panel Board Module forward.

3. Disconnect the Front Panel Control and USB cables.

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4. Unscrew the Front Panel Board to replace a new one.

5. Follow the steps described earlier in reverse to reinstall the Front Panel Board.

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3.6.1 Front Panel Board Specifications

Here shows the M1709G70-FPB Front Panel Board in details.

Form Factor

¾ 18.5MMx44.2MM, 4-Layer PCB

Connectors

¾ One 2x15 pin header for front panel connector of

motherboard and HDD backplane board

LEDs

¾ Power On/Off Button with LED: Green
¾ ID LED Color: Blue
¾ System Warning LED: Amber
¾ System Fan Fail LED: Red
¾ LAN1/LAN2/LAN3: Green

Push buttons

¾ RESET button
¾ ID button
¾ Power On/Off button with LED
¾ NMI Button

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3.6.2 Connector Pin Definition

Front Panel Connector (J3)

Definition Pin Pin Definition

PW_LED+

1 2

VCC

Key

3 4

ID_LED+

PW_LED-

5 6

ID_LED-

HD/LAN3_LED+

7 8

SYS_FAULT1-

HD/LAN3_LED-

9 10

SYS_FAULT2-

PWR_SW+

11 12

LAN1_LED+

PWR_SW-

13 14

LAN1_LED-

RESET+

15 16

ICH_SMBDAT

RESET-

17 18

ICH_SMBCLK

ID_SW+

19 20

INTRU#

Temp_sensor

21 22

LAN2_LED+

EXT_INT

23 24

LAN2_LED-

USB Connector (J1)

Definition Pin Pin Definition

VCC

1 2

VCC

USB1-

3 4

USB2-

USB1+

5 6

USB2+

GND

7 8

GND

KEY

9 10

GND

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3.7 Replacing the System Fan

Follow these instructions to replace the system fan.

1. Press the latch in the direction as shown to lift up the fan from cage.

2. Take out the fan unit.

3. Loose the screws on both sides.

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4. Push the latch in the direction as the arrow shown to release the fan from the
iron holder.

5. Remove the iron holder to replace a new fan.

6. After replacing a new one, put the fan unit back into the cage.

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3.8 Replacing the Fan Backplane Board

Follow these instructions to replace the M1806G70-FB Fan Backplane Board in your
system.

1. Press the latch in the direction as shown to lift up the fan from cage.

2. Remove all four fans from the chassis.

3. Disconnect all cables attached to the Fan Backplane Board.

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4. Use a screw driver to unscrew the Fan Module.

5. Disconnect the power and fan cables.

6. Lift up the Fan Module.

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7. Release the 14 screws on the Fan Backplane Board to replace a new one.

8. Follow the steps described in reverse order to reinstall the fan cage.

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3.8.1 Fan BP Board Specifications

Here shows the M1806G70-FB Fan Backplane Board in details.

Form Factor

¾ 254 mm x 82 mm, 4-layer PCB

Integrated I/O

¾ (2) 1x4pin R/A Power Connector
¾ (8) 2x2pin Fan Connectors
¾ (1) 2x10pin Barebone Fan Connector
¾ (1) 2x2pin Connector for S7015

3.8.2 Fan BP Board LED Definitions

FAN Status Green LED Red LED

With Fan On Off

Without Fan Off On

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3.8.3 Connector Pin Definitions

Power Connector (PW1/PW2)

Definition Pin Pin Definition

+12V

1 2

GND

GND

3 4

+5V

Barebone Fan Connector (J9)

Definition Pin Pin Definition

FANIN1

1 2

FANIN6

FANIN2

3 4

FANIN7

FANIN3

5 6

FANIN8

FANIN4

7 8

SIO_FANIN1

FANIN5

9 10

SIO_ FANIN2

GND

11 12

Key

MB_PWM2

13 14

MB_PWM1

SIO_ FANIN3

15 16

SMBUS_3V3_DATA

SIO_ FANIN4

17 18

SMBUS_3V3_CLK

VDD_3.3_AUX

19 20

MB_PWM3

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3.9 Replacing the HDD Backplane Board

Follow these instructions to replace the M1245G70-BP6-8 SATA/SAS HDD
Backplane Board.

1. Refer to Section 3.8 Replacing the Fan Backplane Board for how to remove
the Fan Module. Disconnect the power cables attached to the HDD BP Board.

2. Unscrew the HDD BP Board. Remove the HDD BP Board from the hook.

3. Replace a new HDD BP Board and reinstall it into the chassis following the
steps in reverse.

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3.9.1 HDD BP Board Specifications

Here shows the M1245G70-BP6-8 Fan Backplane Board in details.

Front View

Rear View (with mylar)

Form Factor

¾ 81.8 x 436 mm, 4-layer PCB

Integrated I/O

¾ (8) SAS HDD Connectors
¾ (2) Mini SAS Connectors to MB and RAID Card
¾ (1) 2 x 4-pin Power Connector

LEDs

¾ 8 HDD active LEDs
¾ 8 HDD fault LEDs

PW3 Pin definition

Definition Pin Pin Definition

GND 1 5 +12V
GND 2 6 +12V
GND 3 7 +12V
GND 4 8 +12V

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3.10 Replacing the Power Supply

The system has two pre-installed CPSU-0470 ERP1U 770W Power Supply Units.
Follow these instructions to replace the power supply units.

1. Press and hold the latch to pull the power supply out.

2. After replacing a new power supply, press and hold the latch to push the
power supply back into the chassis.

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Appendix I: Cable Connection Tables

1. Mini-SAS Cables

SAS/SATA Backplane
M1245G70-BP6-8

Connects to Motherboard

J9 (SAS_1)

Æ

J12

J4 (SAS_2)

Æ

J17

2. FAN Control Cable

FAN Board
M1806G70-FB

Connects to Motherboard

J8

Æ

J14

3. Front Panel Control Cable

Front Panel Board
M1709G70-FPB

Connects to Motherboard

J3

Æ

J39

4. USB Cable

Front Panel Board
M1709G70-FPB

Connects to Motherboard

J1

Æ

J26

5. Power Cables

Power Board
M1601T70-D-PDB

Connects to Motherboard

PW1 (MB)

Æ

PW1

PATX1 (MB1)

Æ

PW2

PATX2 (MB2)

Æ

PW3

J7 (PSMI)

Æ

J34

Power Board
M1601T70-D-PDB

Connects to

FAN Board
M1806G70-FB

PW4 (FAN BD1)

Æ

PW2

PW5 (FAN BD2)

Æ

PW1

Power Board
M1601T70-D-PDB

Connects to

SAS/SATA Backplane
M1245G70-BP6-8

PATX6 (HDD BP1)

Æ

PW3

PATX7 (HDD BP2)

Æ

PW4

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Appendix II: FRU Parts Table

Item Model Number Part Number Picture Description

Power
Supply

CPSU-0470

471100000089

DELTA, DPS-770CB,1U

FAN CFAN-0330 336252012309

12000RPM,60*60*38mm,4pin

Heatsink CHSK-0590 343T43900001

CPU-1U-Passive heatsink

M7056-R24-3F 412100000214

PCI-E x16 2U Riser Card

PCBA

M7056-L24-3F 412100000213

PCI-E x16 2U Riser Card

Rack

Mounting

CRAL-0190 452T44600001

Slide Rail Kit

CCBL-0300 332810000281

A

/C power cord, L=1830mm, EU

type

CCBL-0317 332810000397

Power cord; US, 125V, 18AWGX3C,
L:1800mm

Cable

CCBL-0689 422797800004

Mini-SAS to Mini-SAS, L=500mm

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Appendix III: Fan and Temp Sensors

This section aims to help readers identify the locations of some specific FAN and Temp
Sensors on the motherboard. A table of BIOS Temp sensor name explanation is also

included for readers’ reference.

NOTE: The red dot indicates the sensor.

Fan and Temp Sensor Location:

1. Fan Sensor:

SYS_FAN_1, SYS_FAN_2, SYS_FAN_3 and SYS_FAN_4. They detect

the fan speed (rpm)

2. Temp Sensor:

PCH_Area_Temp, LAN_Temp and M/B_Inlet_Temp. They detect the

system temperature around.

NOTE: The system temperature is measured in a scale defined by Intel, not in

Fahrenheit or Celsius.

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BIOS Temp Sensor Name Explanation:

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BIOS Temp Sensor Name Explanation

CPU0_DTS_Temp Temperature of the CPU0 Digital Temperature Sensor

CPU1_DTS_Temp Temperature of the CPU1 Digital Temperature Sensor

CPU0_PECI_Temp Temperature of the CPU0 Platform Environment Control Interface

CPU1_PECI_Temp Temperature of the CPU1 Platform Environment Control Interface

PCH_Area_Temp Temperature of the PCH Area

M/B_Inlet_Temp Temperature of the M/B Air Inlet Area

LAN_Temp Temperature of the LAN Chip Area

GPU0_Temp Temperature of GPU0

GPU1_Temp Temperature of GPU1

PSU1_Temp Temperature of PSU1

PSU2_Temp Temperature of PSU2

CPU0_DIMM_A0 Temperature of CPU0 DIMM A0 Slot

CPU0_DIMM_A1 Temperature of CPU0 DIMM A1 Slot

CPU0_DIMM_B0 Temperature of CPU0 DIMM B0 Slot

CPU0_DIMM_B1 Temperature of CPU0 DIMM B1 Slot

CPU0_DIMM_C0 Temperature of CPU0 DIMM C0 Slot

CPU0_DIMM_C1 Temperature of CPU0 DIMM C1 Slot

CPU0_DIMM_D0 Temperature of CPU0 DIMM D0 Slot

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CPU0_DIMM_D1 Temperature of CPU0 DIMM D1 Slot

CPU1_DIMM_A0 Temperature of CPU1 DIMM A0 Slot

CPU1_DIMM_A1 Temperature of CPU1 DIMM A1 Slot

CPU1_DIMM_B0 Temperature of CPU1 DIMM B0 Slot

CPU1_DIMM_B1 Temperature of CPU1 DIMM B1 Slot

CPU1_DIMM_C0 Temperature of CPU1 DIMM C0 Slot

CPU1_DIMM_C1 Temperature of CPU1 DIMM C1 Slot

CPU1_DIMM_D0 Temperature of CPU1 DIMM D0 Slot

CPU1_DIMM_D1 Temperature of CPU1 DIMM D1 Slot

BIOS FAN Sensor Name Explanation

SYS_FAN_1 Fan speed of SYS_FAN_1

SYS_FAN_2 Fan speed of SYS_FAN_2

SYS_FAN_3 Fan speed of SYS_FAN_3

SYS_FAN_4 Fan speed of SYS_FAN_4

SYS_FAN_5 Fan speed of SYS_FAN_5

SYS_FAN_6 Fan speed of SYS_FAN_6

SYS_FAN_7 Fan speed of SYS_FAN_7

SYS_FAN_8 Fan speed of SYS_FAN_8

PSU1_Fan Fan speed of PSU1

PSU2_Fan Fan speed of PSU2

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Appendix IV: Technical Support

If a problem arises with your system, you should first turn to your dealer for direct
support. Your system has most likely been configured or designed by them and they
should have the best idea of what hardware and software your system contains.
Hence, they should be of the most assistance for you. Furthermore, if you purchased
your system from a dealer near you, take the system to them directly to have it
serviced instead of attempting to do so yourself (which can have expensive
consequence).

If these options are not available for you then MiTAC International Corporation can
help. Besides designing innovative and quality products for over a decade, MiTAC
has continuously offered customers service beyond their expectations. TYAN’s

website (http://www.tyan.com) provides easy-to-access resources such as in-depth
Linux Online Support sections with downloadable Linux drivers and comprehensive
compatibility reports for chassis, memory and much more. With all these convenient
resources just a few keystrokes away, users can easily find their latest software and
operating system components to keep their systems running as powerful and
productive as possible. MiTAC also ranks high for its commitment to fast and friendly
customer support through email. By offering plenty of options for users, MiTAC
serves multiple market segments with the industry’s most competitive services to
support them.

Please feel free to contact us directly for this service at [e-mail]

Help Resources:

1. See the beep codes section of this manual.

2. See the TYAN’s website for FAQ’s, bulletins, driver updates, and other

information:

http://www.tyan.com

3. Contact your dealer for help before calling TYAN.

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Returning Merchandise for Service

During the warranty period, contact your distributor or system vendor FIRST for any
product problems. This warranty only covers normal customer use and does not
cover damages incurred during shipping or failure due to the alteration, misuse,
abuse, or improper maintenance of products.

NOTE:

A receipt or copy of your invoice marked with the date of
purchase is required before any warranty service can be
rendered. You may obtain service by calling the
manufacturer for a Return Merchandise Authorization
(RMA) number. The RMA number should be prominently
displayed on the outside of the shipping carton and the
package should be mailed prepaid.
TYAN will pay to have the board shipped back to you.

TYAN® GN70-B7056 Service Engineer’s Manual V1.0

Document No.: D2159-100