TYAN GA80-B7061 Service Engineer's Manual

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GA80-B7061

Service Engineer’s Manual

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PREFACE

Copyright

This publication, including all photographs, illustrations, and software, is
protected under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced
without written consent of manufacturer.

Copyright 2014 MiTAC International Corporation. All rights reserved.
TYAN® is a registered trademark of MiTAC International Corporation.

Version 1.0b

Disclaimer

Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to
printing. MiTAC assumes no liability whatsoever, and disclaims any

express or implied warranty, relating to sale and/or use of TYAN® products
including liability or warranties relating to fitness for a particular purpose or
merchantability. MiTAC retains the right to make changes to produce
descriptions and/or specifications at any time, without notice. In no event
will MiTAC be held liable for any direct or indirect, incidental or
consequential damage, loss of use, loss of data or other malady resulting
from errors or inaccuracies of information contained in this document.

Trademark Recognition

All registered and unregistered trademarks and company names
contained in this manual are property of their respective owners including,
but not limited to the following.

TYAN® is a trademark of MiTAC International Corporation.
Intel

®

is a trademark of Intel® Corporation.

AMI

®

, AMIBIOS® and combinations thereof are trademarks of AMI
Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
IBM

®

, PC®, AT® and PS/2® are trademarks of IBM Corporation.
Winbond

®

is a trademark of Winbond Electronics Corporation.

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FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of
Conformity Procedure) DoC FCC Part 15: This
device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject
to the following conditions:

 This device must not cause harmful interference.
 This device must accept any interference received, including

interference that may cause undesirable operation.

This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These
limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is
likely to cause harmful interference in which case the user will be
required to correct the interference at his own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet
appareil numérique de la Classe A est conforme à la norme NMB-003
du Canada.

Notice for Europe (CE Mark)

This product is in conformity with the Council
Directive 2004/108/EC.

CAUTION: Lithium battery included with this board. Do not puncture,
mutilate, or dispose of battery in fire. There will be danger of explosion if
battery is incorrectly replaced. Replace only with the same or equivalent
type recommended by manufacturer. Dispose of used battery according
to manufacturer instructions and in accordance with your local
regulations.

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About this Manual

This manual provides you with instructions on installing your TYAN
GA80-B7061. This Manual is intended for experienced users and integrators
with hardware knowledge of personal computers.

This manual consists of the following parts:

Chapter 1: Overview
Provides an introduction to the TYAN GA80-B7061 barebones, standard parts
list, describes the external components, gives a table of key components, and
provides block diagram of the system.

Chapter 2: Setting Up
This chapter covers procedures on installing the processors, memory modules,
hard drivers and other optional parts.

Chapter 3: Replacing the Pre-installed Components

This chapter covers removal and replacement procedures for pre-installed
components.

Chapter 4: Installing the GPU cards
This chapter covers procedures on installing the GPU cards.

Chapter 5: Motherboard Information
This chapter lists the hardware setup procedures that you need to abide by
when installing system components. It includes description of the jumpers and
connectors on the motherboard.

Chapter 6: BIOS Setup

This chapter tells how to change system settings through the BIOS setup menu.
Detailed descriptions of the BIOS parameters are also provided.

Chapter 7: Diagnostics

This chapter introduces some BIOS codes and technical terms to provide better
service for the customers.

Appendix:

This chapter provides the cable connection table, the FRU parts list for reference
of system setup, and technical support in case a problem arises with your system.

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Safety and Compliance Information

Before installing and using TYAN GA80-B7061, take note of the following
precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.

·Do not block the slots and opening on the unit, which are provided for

ventilation.

·Only use the power source indicated on the marking label. If you are not

sure, contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third

pin to ground the unit and prevent electric shock. Do not defeat the
purpose of this pin. If your outlet does not support this kind of plug,
contact your electrician to replace your obsolete outlet.

·Do not place anything on the power cord. Place the power cord where it

will not be in the way of foot traffic.

·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high

voltage components and result in shock and damage to the
components.

·When replacing parts, ensure that you use parts specified by the

manufacturer.

·When service or repairs have been done, perform routine safety checks

to verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating

device.

·Cover the unit when not in use.

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Safety Information

Retain and follow all product safety and operating instructions
provided with your equipment. In the event of a conflict between the
instructions in this guide and the instructions in equipment
documentation, follow the guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions.
To reduce the risk of bodily injury, electric shock, fire and damage to
the equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide
before you install, operate, or service TYAN products.

Symbols on Equipment

Warning. This symbol indicates the presence

of hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified
personnel.

Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.To reduce
risk of injury from a hot component, allow the
surface to cool before touching.

Caution. This symbol indicates a potential
hazard. The potential for injury exists if
cautions are not observed. Consult equipment
documentation for specific details.

Caution. Slide-mounted equipment is not to be
used as a shelf or a work space.

General Precautions

· Follow all caution and warning instructions marked on the equipment
and explained in the accompanying equipment documentation.

 Machine Room Environment

 · Make sure that the area in which you install the system is properly

ventilated and climate-controlled.

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· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.

· Do not install the system in or near a plenum, air duct, radiator, or heat
register.

· Never use the product in a wet location.

Equipment Chassis

· Do not block or cover the openings to the system.

· Never push objects of any kind through openings in the equipment.

Dangerous voltages might be present.

· Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.

· Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

· Observe local occupational health and safety requirements and
guidelines for manual materials handling.

· Do not attempt to move a rack by yourself; a minimum of two people
are needed to move a rack.

· Do not attempt to move a fully loaded rack. Remove equipment from
the rack before moving it.

· Do not attempt to move a rack on an incline that is greater than 10
degrees from the horizontal.

· Make sure the rack is properly secured to the floor or ceiling.

· Make sure the stabilizing feet are attached to the rack if it is a

single-rack installation.

· Make sure racks are coupled together if it is a multiple-rack installation.

· Make sure the rack is level and stable before installing an appliance in

the rack.

· Make sure the leveling jacks are extended to the floor.

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· Make sure the full weight of the rack rests on the leveling jacks.

· Always load the rack from the bottom up. Load the heaviest component

in the rack first.

· Make sure the rack is level and stable before pulling a component out
of the rack.

· Make sure only one component is extended at a time. A rack might
become unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and cable
management.

· Ensure that there is adequate airflow in the rack. Improper installation
or restricted airflow can damage the equipment.

· The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to
ensure adequate air flow to the system.

· If you install the Model in a rack, do not place equipment on top of the
unit. It will cause restricted airflow and might cause damage to the
equipment.

·

Make sure the product is properly matted with the rails. Products that

are improperly matted with the rails might be unstable.

·

Verify that the AC power supply branch circuit that provides power to

the rack is not overloaded. This will reduce the risk of personal injury, fire,
or damage to the equipment. The total rack load should not exceed 80
percent of the branch circuit rating. Consult the electrical authority having
jurisdiction over your facility wiring and installation requirements.

Equipment Power Cords

· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.

· Plug the power cord into a grounded (earthed) electrical outlet that is
easily accessible at all times.

· In all European electrical environments, you must ground the
Green/Yellow tab on the power cord. If you do not ground the

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Green/Yellow tab, it can cause an electrical shock due to high leakage
currents.

· Do not place objects on AC power cords or cables. Arrange them so

that no one might accidentally step on or trip over them.

· Do not pull on a cord or cable. When unplugging from the electrical
outlet, grasp the cord by the plug.

· To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.

Equipment Batteries

· The system battery contains lithium manganese dioxide. If the battery
pack is not handled properly, there is risk of fire and burns.

· Do not disassemble, crush, puncture, short external contacts, or
dispose of the battery in fire or water.

· Do not expose the battery to temperatures higher than 60°C (140°F).

· The system battery is not replaceable. If the battery is replaced by an

incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.

· Do not attempt to recharge the battery.

· Dispose of used batteries according to the instructions of the

manufacturer. Do not dispose of batteries with the general household
waste. To forward them to recycling or proper disposal, use the public
collection system or return them to TYAN, your authorized TYAN partner,
or their agents.

Equipment Modifications

· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has
been modified.

Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service
of this product should be performed by individuals who are knowledgeable
about the procedures, precautions, and hazards associated with

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equipment containing hazardous energy levels.

· Do not exceed the level of repair specified in the procedures in the
product documentation. Improper repairs can create a safety hazard.

· Allow the product to cool before removing covers and touching internal
components.

· Remove all watches, rings, or loose jewelry when working before
removing covers and touching internal components.

· Do not use conductive tools that could bridge live parts.

· Use gloves when you remove or replace system components; they can

become hot to the touch.

· If the product sustains damage requiring service, disconnect the

product from the AC electrical outlet and refer servicing to an authorized
service provider. Examples of damage requiring service include:

– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the

product.
– The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating

instructions.

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Table of Contents

Chapter 1: Overview....................................................................... 13

1.1 About the TYAN GA80-B7061................................................ 13

1.2 Product Model......................................................................... 13

1.3 Features.................................................................................. 14

1.4 Standard Parts List ................................................................. 23

1.4.1 Box Contents ................................................................... 23

1.4.2 Accessories ..................................................................... 25

1.5 About the Product ................................................................... 26

1.5.1 System Front View .......................................................... 26

1.5.2 LED control and HDD LED Definitions ............................ 26

1.5.3 System Rear View ........................................................... 28

1.5.4 LAN and ID LED Definitions ............................................ 29

1.5.5 System top view............................................................... 30

Chapter 2: Setting Up..................................................................... 32

2.0.1 Before you Begin ............................................................. 32

2.0.2 Work Area........................................................................ 32

2.0.3 Tools ................................................................................ 32

2.0.4 Precautions...................................................................... 33

2.1 Installing Motherboard Components....................................... 34

2.1.1 Removing the Chassis Cover .......................................... 34

2.1.2 Removing the Air Duct..................................................... 36

2.1.3 Installing the CPU and Heatsink...................................... 37

2.1.4 Installing the Memory....................................................... 40

2.1.5 Installing Hard Drives....................................................... 45

2.1.6 Installing the Add-On Card .............................................. 47

2.2 Rack Mounting.......................................................................... 49

2.2.1 Installing the Server in a Rack......................................... 49

2.2.2 Installing the Outer Rails to the Rack .............................. 50

2.2.3 Installing the inner Rails to the Chassis........................... 51

2.2.4 Rack mounting the Server ............................................... 52

2.2.5 Removing the Server from a Rack .................................. 53

Chapter 3: Replacing Pre-Installed Components ........................55

3.0.1 Introduction .......................................................................... 55

3.0.2 Disassembly Flowchart........................................................ 55

3.1 Removing the Cover ............................................................... 56

3.2 Replacing the Front Panel Board ........................................... 56

3.2.1 M1706G62 Front Panel Board Features ......................... 58

3.2.2 Front Panel Board Connector Pin Definition ................... 58

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3.3 Replacing the System Fan ..................................................... 60

3.4 Replacing the HDD Backplane ............................................... 63

3.4.1 M7018-BP-SG HDD Backplane Features ....................... 65

3.4.2 M7018-BP-SG HDD Connector Pin Definitions............... 66

3.5 Replacing PCI-E Riser Cards ................................................. 68

3.5.1 PCIE Riser card Features................................................ 71

3.6 Replacing Power Distribution Board....................................... 72

3.6.1 M1618G80-D-Power Distribution Board Features........... 73

3.6.2 M1618G80-D-PDB Connector Pin Definitions................. 74

3.7 Replacing the Power Supply .................................................. 76

3.8 Removing Motherboard Procedures....................................... 77

3.8.1 Disconnecting All Motherboard Cables ........................... 77

3.8.2 Removing the Motherboard ............................................. 78

Chapter 4: Installing GPU Cards ................................................... 80

4.1 Installing the NVIDIA® K10 GPU card .................................... 80

4.2 Installing the Intel® 5110P GPU card...................................... 83

Chapter 5: Motherboard Information ............................................ 85

5.1 Board Image ........................................................................... 86

5.2 Block Diagram ........................................................................ 87

5.3 Motherboard Mechanical Drawing.......................................... 88

5.4 Board parts, jumpers and connectors..................................... 89

Chapter 6: BIOS Setup ................................................................... 99

6.1 About the BIOS....................................................................... 99

6.2 Main Menu ............................................................................ 101

6.3 Advanced Menu.................................................................... 102

6.4 Chipset Menu........................................................................ 128

6.5 Server Management ............................................................. 138

6.6 Boot ...................................................................................... 141

6.7 Security................................................................................. 144

6.8 Save & Exit ........................................................................... 145

6.9 Event Logs............................................................................ 147

Chapter 7: Diagnostics ................................................................ 148

7.1 Flash Utility ........................................................................... 148

7.2 AMIBIOS Post Code (Aptio) ................................................. 149

Appendix I: Fan and Temp Sensors............................................ 158

Appendix II: Cable Connection Tables ....................................... 162

Appendix III: FRU Parts Table ..................................................... 164

Appendix IV: Technical Support ................................................. 166

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Chapter 1: Overview

1.1 About the TYAN GA80-B7061

Congratulations on your purchase of the TYAN

®

GA80-B7061, a highly
optimized rack-mountable barebone system. The GA80-B7061 is designed to
support dual Intel

®

Xeon E5-2600 (Sandy Bridge-EP) and E5-2600 V2 (Ivy

Bridge-EP) Series processors with up to 512GB of LRDIMM / 256GB of RDIMM /
128GB of UDIMM DDR3 memory. Leveraging advanced technology from Intel

®

,
GA80-B7061 server system is capable of offering scalable 32 and 64-bit
computing, high bandwidth memory design, and lightning-fast PCI-E bus
implementation.

The GA80-B7061 not only empowers your company in nowadays IT demand but
also offers a smooth path for future application usage.

TYAN

®

is also proud to deliver the GA80-B7061 in a version that can support up

to four 2.5” hot-swap hard drives. The GA80-B7061 uses TYAN®’s latest chassis
featuring a robust structure and a solid mechanical enclosure. All of this provides
GA80-B7061 the power and flexibility to meet the needs of nowadays server
application.

1.2 Product Model

The system board within the TYAN® Barebone contains different SKUs, which are
defined by the following models:

● B7061G80W4H: standard platform

● B7061G80W4H-N2K2X: bundle with two NVIDIA

®

Tesla K20X GPU platform

● B7061G80W4H-X: Intel

®

Xeon Phi™ GPU platform

● B7061G80W4H-N: NVIDIA® Tesla GPU platform

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1.3 Features

TYAN GA80B7061 (B7061G80W4H)

Form Factor 1U Rackmount

Gross Weight 8 kg

Chassis Model GA80

Dimension (D x W x
H)

31.50" x 17.32" x 1.73" (800 x 440 x 43.9mm)

System

Motherboard S7061WGM2NR

Buttons (1) PWR / (1) RST / (1) ID

LEDs (1) PWR / (2) LAN / (1) ID / (1) IPMI/Warning

Front Panel

I/O Ports (2) USB ports

Type / Q'ty 2.5" Hot-Swap / (4)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (7) 4cm fans

Type ERP1U

Efficiency PFC / 80 plus Platinum

Input Range AC 100-127V/8A / AC 200-240V/4A

Power Supply

Output Watts 1000atts/1,200 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600/E5-2600 v2 series
processors

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP)
wattage

Max up to 130W / *Temperature support to 30
degree w/6C/8C Sandy Bridge 130W CPU

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset PCH Intel C602

Supported DIMM
Qty

(8)+(8) DIMM slots

DIMM Type / Speed

RDIMM ECC 1866/1600/1333/1066 /
UDIMM/LRDIMM ECC 1866/1600/1333/1066

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel 4 Channels per CPU

Memory

Memory voltage 1.5V or 1.35V

PCI-E (1) PCI-E x8 Gen.3 slot / (2) PCI-E Gen3 x16 slots

Expansion
Slots

Pre-install TYAN
Riser Card

M2091-R, PCI-E x16 1U riser card (right) /

M1201-L16-1F / M1202-L16-1F

LAN

Port Q'ty (2) GbE ports + (1) dedicated for IPMI

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Controller Intel I350-AM2

PHY Realtek RTL 8201EL

Connector (2) Mini-SAS connectors (totally support 8 ports)

Controller LSI SAS2308

Speed 6.0 Gb/s

SAS

RAID RAID 0/1/1E/10 (LSI Integrated RAID)

Connector (2) SATA

Controller Intel C602

Speed 6.0 Gb/s

Storage

SATA

RAID RAID 0/1/10/5 (Intel RST)

Connector type D-Sub 15-pin

Graphic

Chipset Aspeed AST2300

USB

(7) USB2.0 ports (2 at rear, 2 at front, 2 via header,
1 type A onboard)

COM (1) COM port header

VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports (1 port dedicated for IPMI)

Chipset Aspeed AST2300

Voltage

Monitors voltage for CPU, memory, chipset &
power supply

Temperature Monitors temperature for CPU & memory

System
Monitoring

LED Fan fail / Over temperature warning / PSU fail

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100
Mb/s MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power
on mode after power recovery / User-configurable
H/W monitoring / Auto-configurable of hard disk
types / S0,S1,S4,S5 states supported

Operating
System

OS supported list Please refer to our Intel OS supported list.

FCC (DoC) Class A

Regulation

CE (DoC) Yes

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating 90%, non-condensing at 35° C

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Humidity

RoHS

RoHS 6/6
Compliant

Yes

Barebone (1) GA80B7061 Barebone

Manual (1) Quick Installation Guide

Package
Contains

Installation CD (1) TYAN installation CD

TYAN GA80B7061 (B7061G80W4H-X)

Form Factor 1U Rackmount

Gross Weight 8 kg

Chassis Model GA80

Dimension (D x W x
H)

31.50" x 17.32" x 1.73" (800 x 440 x 43.9mm)

System

Motherboard S7061WGM2NR

Buttons (1) PWR / (1) RST / (1) ID

LEDs (1) PWR / (2) LAN / (1) ID / (1) IPMI/Warning

Front Panel

I/O Ports (2) USB ports

Type / Q'ty 2.5" Hot-Swap / (4)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (7) 4cm fans

Type ERP1U

Efficiency PFC / 80 plus Platinum

Input Range AC 100-127V/8A / AC 200-240V/4A

Power Supply

Output Watts 1,200 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600/E5-2600 v2 series
processors

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP)
wattage

Max up to 130W / *Temperature support to 30
degree w/6C/8C Sandy Bridge 130W CPU

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset PCH Intel C602

Supported DIMM
Qty

(8)+(8) DIMM slots

DIMM Type / Speed

RDIMM ECC 1866/1600/1333/1066 /
UDIMM/LRDIMM ECC 1866/1600/1333/1066

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory

Memory channel 4 Channels per CPU

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Memory voltage 1.5V or 1.35V

PCI-E (1) PCI-E x8 Gen.3 slot / (2) PCI-E Gen3 x16 slots

Expansion
Slots

Pre-install TYAN
Riser Card

M2091-R, PCI-E x16 1U riser card (right) /

M1201-L16-1F / M1202-L16-1F

Port Q'ty (2) GbE ports + (1) dedicated for IPMI

Controller Intel I350-AM2

LAN

PHY Realtek RTL 8201EL

Connector (2) Mini-SAS connectors (totally support 8 ports)

Controller LSI SAS2308

Speed 6.0 Gb/s

SAS

RAID RAID 0/1/1E/10 (LSI Integrated RAID)

Connector (2) SATA

Controller Intel C602

Speed 6.0 Gb/s

Storage

SATA

RAID RAID 0/1/10/5 (Intel RST)

Connector type D-Sub 15-pin

Graphic

Chipset Aspeed AST2300

USB

(7) USB2.0 ports (2 at rear, 2 at front, 2 via header,
1 type A onboard)

COM (2) DB-9 COM port headers

VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports (1 port dedicated for IPMI)

Chipset Aspeed AST2300

Voltage

Monitors voltage for CPU, memory, chipset &
power supply

Temperature Monitors temperature for CPU & memory

System
Monitoring

LED

Fan fail LED indicator / Over temperature warning
indicator / Fan & PSU fail LED indicator

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100
Mb/s MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3
/PXE boot / ACPI 2.0 power management /Power
on mode after power recovery / User-configurable
H/W monitoring / Auto-configurable of hard disk
types / S0,S1,S4,S5 states supported

Operating
System

OS supported list Please refer to our Intel OS supported list.

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FCC (DoC) Class A

Regulation

CE (DoC) Yes

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS

RoHS 6/6
Compliant

Yes

Barebone

(1) GA80B7061 w/ Intel Xeon Phi-aware FW
Barebone

Manual (1) Quick Installation Guide

Installation CD (1) TYAN installation CD

Package
Contains

Others (2) supported Intel Xeon Phi card brackets

TYAN GA80B7061 (B7061G80W4H-N2K2X)

Form Factor 1U Rackmount

Gross Weight 8 kg

Chassis Model GA80

Dimension (D x W x
H)

31.50" x 17.32" x 1.73" (800 x 440 x 43.9mm)

System

Motherboard S7061WGM2NR

Buttons (1) PWR / (1) RST / (1) ID

LEDs (1) PWR / (2) LAN / (1) ID / (1) IPMI/Warning

Front Panel

I/O Ports (2) USB ports

Type / Q'ty 2.5" Hot-Swap / (4)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (7) 4cm fans

Type ERP1U

Efficiency PFC / 80 plus Platinum

Input Range AC 100-127V/8A / AC 200-240V/4A

Power Supply

Output Watts 1,200 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600/E5-2600 v2
series processors

Socket Type / Q'ty LGA2011 / (2)

Thermal Design
Power (TDP) wattage

Max up to 130W / *Temperature support to 30
degree w/6C/8C Sandy Bridge 130W CPU

Processor

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset PCH Intel C602

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Supported DIMM Qty (8)+(8) DIMM slots

DIMM Type / Speed

RDIMM ECC 1866/1600/1333/1066 /
UDIMM/LRDIMM ECC 1866/1600/1333/1066

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel 4 Channels per CPU

Memory

Memory voltage 1.5V or 1.35V

PCI-E

(1) PCI-E x8 Gen.3 slot / (2) PCI-E Gen3 x16
slots

Expansion Slots

Pre-install TYAN
Riser Card

M2091-R, PCI-E x16 1U riser card (right) /

M1201-L16-1F / M1202-L16-1F

Port Q'ty (2) GbE ports + (1) dedicated for IPMI

Controller Intel I350-AM2

LAN

PHY Realtek RTL 8201EL

Connector

(2) Mini-SAS connectors (totally support 8
ports)

Controller LSI SAS2308

Speed 6.0 Gb/s

SAS

RAID RAID 0/1/1E/10 (LSI Integrated RAID)

Connector (2) SATA

Controller Intel C602

Speed 6.0 Gb/s

Storage

SATA

RAID RAID 0/1/10/5 (Intel RST)

Connector type D-Sub 15-pin

Graphic

Chipset Aspeed AST2300

USB

(7) USB2.0 ports (2 at rear, 2 at front, 2 via
header, 1 type A onboard)

COM (1)COM port headers

VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports (1 port dedicated for IPMI)

Chipset Aspeed AST2300

Voltage

Monitors voltage for CPU, memory, chipset &
power supply

Temperature Monitors temperature for CPU & memory

System
Monitoring

LED

Fan fail / Over temperature warning i/ Fan &
PSU fail LED

Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP
and remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100
Mb/s MAC interface

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Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0
/SMBIOS2.3 /PXE boot / ACPI 2.0 power
management. User-configurable
H/W monitoring / Auto-configurable of hard
disk types / S0,S1,S4,S5 states supported

Operating
System

OS supported list Please refer to our Intel OS supported list.

FCC (DoC) Class A

Regulation

CE (DoC) Yes

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS RoHS 6/6 Compliant Yes

Barebone

(1) GA80B7061 Barebone w/(2) NV K20X GPU
Cards

Manual (1) Quick Installation Guide

Package
Contains

Installation CD (1) TYAN installation CD

TYAN GA80B7061 (B7061G80W4H-N)

Form Factor 1U Rackmount

Gross Weight 8 kg

Chassis Model GA80

Dimension (D x W x
H)

31.50" x 17.32" x 1.73" (800 x 440 x 43.9mm)

System

Motherboard S7061WGM2NR

Buttons (1) PWR / (1) RST / (1) ID

LEDs (1) PWR / (2) LAN / (1) ID / (1) IPMI/Warning

Front Panel

I/O Ports (2) USB ports

Type / Q'ty 2.5" Hot-Swap / (4)

External Drive
Bay

HDD backplane
support

SAS / SATA 6.0Gb/s

System Cooling
Configuration

FAN (7) 4cm fans

Type ERP1U

Efficiency PFC / 80 plus Platinum

Input Range AC 100-127V/8A / AC 200-240V/4A

Power Supply

Output Watts 1,200 Watts

Supported CPU
Series

Intel Xeon Processor E5-2600/E5-2600 v2 series
processors

Processor

Socket Type / Q'ty LGA2011 / (2)

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Thermal Design
Power (TDP)
wattage

Max up to 130W / *Temperature support to 30
degree w/6C/8C Sandy Bridge 130W CPU

System Bus

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support

Chipset PCH Intel C602

Supported DIMM
Qty

(8)+(8) DIMM slots

DIMM Type / Speed

RDIMM ECC 1866/1600/1333/1066 /
UDIMM/LRDIMM ECC 1866/1600/1333/1066

Capacity

up to 128GB UDIMM / 256GB RDIMM / 512GB
LRDIMM

Memory channel 4 Channels per CPU

Memory

Memory voltage 1.5V or 1.35V

PCI-E

(1) PCI-E x8 Gen.3 slot / (2) PCI-E Gen3 x16
slots

Expansion Slots

Pre-install TYAN
Riser Card

M2091-R, PCI-E x16 1U riser card (right) /

M1201-L16-1F / M1202-L16-1F

Port Q'ty (2) GbE ports + (1) dedicated for IPMI

Controller Intel I350-AM2

LAN

PHY Realtek RTL 8201EL

Connector (2) Mini-SAS connectors (totally support 8 ports)

Controller LSI SAS2308

Speed 6.0 Gb/s

SAS

RAID RAID 0/1/1E/10 (LSI Integrated RAID)

Connector (2) SATA

Controller Intel C602

Speed 6.0 Gb/s

Storage

SATA

RAID RAID 0/1/10/5 (Intel RST)

Connector type D-Sub 15-pin

Graphic

Chipset Aspeed AST2300

USB

(7) USB2.0 ports (2 at rear, 2 at front, 2 via
header, 1 type A onboard)

COM (1)COM port headers

VGA (1) D-Sub 15-pin port

I/O Ports

RJ-45 (3) ports (1 port dedicated for IPMI)

Chipset Aspeed AST2300

Voltage

Monitors voltage for CPU, memory, chipset &
power supply

Temperature Monitors temperature for CPU & memory

System
Monitoring

LED

Fan fail LED / Over temperature warning / Fan &
PSU fail

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Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI
Feature

IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub

Server
Management

AST2300 iKVM
Feature

24-bit high quality video compression / 10/100
Mb/s MAC interface

Brand / ROM size AMI / 8MB

BIOS

Feature

Plug and Play (PnP) /PCI2.3 /WfM2.0
/SMBIOS2.3 /PXE boot / ACPI 2.0 power
management User-configurable H/W monitoring /
Auto-configurable of hard disk types /
S0,S1,S4,S5 states supported

Operating
System

OS supported list Please refer to our Intel OS supported list.

FCC (DoC) Class A

Regulation

CE (DoC) Yes

Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating
Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

Operating
Environment

In/Non-operating
Humidity

90%, non-condensing at 35° C

RoHS RoHS 6/6 Compliant Yes

Barebone (1) GA80B7061 w/ NV Tesla-aware FW Barebone

Manual (1) Quick Installation Guide

Package
Contains

Installation CD (1) TYAN installation CD

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1.4 Standard Parts List

This section describes the GA80-B7061 package contents and accessories.
Open the box carefully and ensure that all components are present and
undamaged. The product should arrive packaged as illustrated below.

1.4.1 Box Contents

Component Description

1U chassis,
(4) hot swap HDD bays

TYAN

®

S7061 system board

(pre-installed)

(1) 1,200W (80+ Platinum)
Power Supply (pre-installed)

(7) 40x40x56mm
System FANs (pre-installed)

(1) M1618G80-D-PDB
(pre-installed)

(1) M1201-L16-1F Riser card
(pre-installed)

(1) M1202-L16-1F Riser card
(pre-installed)

(1) M7018-BP-SG HDD
Backplane (pre-installed)

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(1) M2091-R PCI-E riser card
(pre-installed)

(1) M1706G62-FPB
Front Panel Board
(pre-installed)

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1.4.2 Accessories

If any items are missing or appear damaged, contact your retailer or browse to
TYAN

®

’s website for service: http://www.tyan.com

The web site also provides information of other TYAN

®

products, as well as

FAQs, compatibility lists, BIOS settings, etc.

TYAN® Motherboard Drive CD

Quick Installation Guide x 1

AC Power Cord 125V (US) x 1 AC Power Cord 250V (EU) x 1

Heatsink x 1

Heatsink x 1

Screw Pack x 3 Air Duct x 1

Rail Kit & Screw Pack x 1 Mounting ear x 2

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1.5 About the Product

The following views show you the product.

1.5.1 System Front View

1.5.2 LED control and HDD LED Definitions

M1706G62 Front Panel Board

LED State Color Description

On Green System is turned on

Blinking Green System is under S1 or S3 state

Power On/Off
LED

Off Off Power off
On Green Link

LAN1/LAN2

Blinking Green active

Solid On Amber

Fan fail / Over temperature / Over
Voltage / PSU fail

Warning
(IPMI) LED

On Green BMC Ready

On Blue

When ID S/W On，Power LED Off，
ID LED On

ID LED

Off Off System not identified

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2.5” HDD LED Definition

Activity LED
Color: Green

Status LED
Color: Red

Description

Solid On Off Drive present, no activity

Green (Blinking) Off Drive present, with activity

Do not care Solid On HDD Fail
Do not care Blinking @1Hz Drive Locate Identify
Do not care Blinking @4Hz Rebuilding

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1.5.3 System Rear View

NO. Description

1 1,200W (80+ Platinum) Power Supply

2 LAN3 (shared with IPMI)+2 USB2.0 ports

3 ID LED Button

4 ID LED

5 VGA Port

6 LAN2 and LAN1 (from left to right)

7 Expansion Slots

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1.5.4 LAN and ID LED Definitions

Rear I/O: Onboard LAN LED Color Definition

10/100/1000 Mbps LAN Link/Activity LED Scheme

Left LED

(Link/Activity)

Right LED

(Speed)

No Link OFF OFF

Link Solid Green

OFF

10 Mbps

Active Blinking Green

OFF

Link Solid Green Solid Green

100 Mbps

Active Blinking Green Solid Green

Link Solid Green Solid Yellow

1000 Mbps

(1Gbps)

Active Blinking Green Solid Yellow

NOTE: “Left” and “Right” are viewed from the rear panel.

ID LED

LED Status LED Color Behavior Remark

Normal Off

ID LED

Located

Blue

Solid on

Local and
remote

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1.5.5 System top view

B7061G80W4H-N2K2X:

NO. Description Description

1 GPU card assembly #2 5 HDD cage

2 GPU card assembly #1 6 Power Distribution Board

3 System Fans 7 Power Supply

4 HDD Backplane Board 8 Front Panel Board

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NOTE

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Chapter 2: Setting Up

2.0.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks,
memory modules, and hard drives. Instructions on inserting add-on
cards are also given.

2.0.2 Work Area

Make sure you have a stable, clean working environment. Dust and
dirt can get into components and cause malfunctions. Use
containers to keep small components separated. Putting all small
components in separate containers prevents them from becoming
lost. Adequate lighting and proper tools can prevent you from
accidentally damaging the internal components.

2.0.3 Tools

The following procedures require only a few tools, including the
following:

 A cross head (Phillips) screwdriver

 A grounding strap or an anti-static pad

Most of the electrical and mechanical connections can be
disconnected with your hands. It is recommended that you do not
use pliers to remove connectors as it may damage the soft metal or
plastic parts of the connectors.

Caution!

1. To avoid damaging the motherboard and associated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

2. Do not apply power to the board if it has been

damaged.

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2.0.4 Precautions

Components and electronic circuit boards can be damaged by
discharges of static electricity. Working on a system that is connected
to a power supply can be extremely dangerous. Follow the guidelines
below to avoid damage to GA80-B7061 or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then
touch a safely grounded object to release static charge (i.e.
power supply case). If available, wear a grounded wrist strap.
Alternatively, discharge any static electricity by touching the
bare metal chassis of the unit case, or the bare metal body of
any other grounded appliance.

 Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When

removing the motherboard, always place it on a grounded
anti-static surface until you are ready to reinstall it.

 Hold electronic circuit boards by the edges only. Do not touch

the components on the board unless it is necessary to do so.
Do not flex or stress circuit boards.

 Leave all components inside the static-proof packaging that

they ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs,

or other small parts are in place and are not left loose inside
the case. Metallic parts or metal flakes can cause electrical
shorts.

Note:

All connectors are keyed to only attach one way.

All use the correct screw size as indicated in the procedures.

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2.1 Installing Motherboard Components

This section describes how to install components on to the serverboard,
including CPUs, memory modules, HDD and Add-On cards.

2.1.1 Removing the Chassis Cover

Follow these instructions to remove the GA80-B7061 chassis cover.

1. Remove the top screw on the chassis cover and slide the chassis cover in

the direction of arrow.

2. Release the two screws on the rear side and slides the cover out in the

direction of the arrows.

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3. Lift up the chassis cover so to remove the top cover.

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2.1.2 Removing the Air Duct

Follow these instructions to remove the GA80-B7061 Air Duct.

1. The GA80-B7061 include with an air duct in the chassis.

2. Remove the air duct from the chassis as shown in the picture.

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2.1.3 Installing the CPU and Heatsink

Follow the steps below to install the processor and heatsink.

Install the CPU

1. Locate the CPU socket.

2. Pull the CPU lever up to unlock the CPU socket.

3. Open the socket to a fully open position.

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4. Take off the CPU Socket protection cap.

5. Place the CPU in the CPU socket. Make sure the gold arrow is located in
the right direction.

6. Close the socket and press the CPU socket lever down to secure the CPU.

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Install the heatsink

1. Place the heatsink on top of the CPU and secure it with 4 screws.
There are two kinds of heatsink include in the GA80-B7061 barebone,
please installed the heatsink correctly as the picture shown.

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2.1.4 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Press the memory slot locking levers in the direction of the arrows
as shown in the following illustration.

2. Align the memory module with the slot. When inserted properly, the
memory slot locking levers lock automatically onto the indentations
at the ends of the module.

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Recommended Memory Population Table

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42

Recommended Memory Population Table

To achieve the best performance, TYAN® strongly recommended memory installation
configuration as listed below:

Single CPU

Installed

(CPU0 only)

Dual CPU

installed

(CPU0 and CPU1)

Quantity of

memory installed

12346823 4567810121416

CPU0_DIMM(1)D0 √ √ √ √ √ √ √ √ √

CPU0_DIMM(2)D1 √ √ √ √

CPU0_DIMM(3)C0 √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM(4)C1 √ √ √ √

CPU0_DIMM(5)B0 √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM(6)B1 √ √ √ √ √ √

CPU0_DIMM(7)A0 √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √

CPU0_DIMM(8)A1 √ √ √ √ √ √

CPU1_DIMM(9)H0 √ √ √ √ √

CPU1_DIMM(10)H1 √

CPU1_DIMM(11)G0 √ √ √ √ √ √ √

CPU1_DIMM(12)G1 √

CPU1_DIMM(13)F0 √ √ √ √ √ √ √ √ √

CPU1_DIMM(14)F1 √ √

CPU1_DIMM(15)E0 √ √ √ √ √ √ √ √ √ √ √

CPU1_DIMM(16)E1 √ √

1. √ indicates a populated DIMM slot.

2. Paired memory installation for Max performance.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs

5. Un-buffered DIMM can offer slightly better performance than registerd DIMM if populating only a

single DIMM per channel

6. We don't suggest other memory installation

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Intel®Xeon®processor E5-2600/4600 product families UDIMM Support

1.35V 1.50V

Ranks Per DIMM &
Data Width

Memory Capacity per DIMM

1DPC 2DPC 1DPC 2DPC

SRx8 Non-ECC 1 GB 2GB 4GB N/A N/A

1066,

1333

1066,

1333

DRx8 Non-ECC 2GB 4GB 8GB N/A N/A

1066,

1333

1066,

1333

SRx16 Non-ECC 512 MB 1GB 2GB N/A N/A

1066,

1333

1066,

1333

SRx8 ECC 1GB 2GB 4GB 1066 1066

1066,

1333

1066,

1333

DRx8 ECC 2GB 4GB 8GB 1066 1066

1066,

1333

1066,

1333

NOTE 1: The blue blocks indicate that the DRAM Densities are supported but not validated.

NOTE 2: The grey blocks indicate that the DRAM Densities are supported and validated.

NOTE 3: 1DPC => One dimm per channel

NOTE 4: 2DPC => Two dimm per channel

 Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated by

Intel.

 Command Address Timing is 1N for 1DPC and 2N for 2DPC.

 Romley-EP/EX platform does not support 3DPC when using UDIMMs.

Intel

®

Xeon®processor E5-2600/4600 product families LRDIMM Support

1.35V 1.50V

Ranks Per DIMM &
Data Width

Memory Capacity per

DIMM

1DPC 2DPC 1DPC 2DPC

QRx4 (DDP) 16GB 32GB 1066 1066

1066,

1333

1066,

1333

QRx8 (P) 8GB 16GB 1066 1066

1066,

1333

1066,

1333

NOTE: The blue blocks indicate that the DRAM Densities are supported and not

validated.

 Physical Rank is used to calculate DIMM Capacity.

 Supported and validated DRAM Densities are 2Gb and 4Gb.

 Command Address Timing is 1N.

 The speeds are estimated targets and will be verified through simulation.

 For 3SPC/3DPC -Rank Multiplication (RM) >= 2.

 DDP -Dual Die Package DRAM stacking. P –Planer monolithic DRAM Die.

 Romley-EP/EX platform does not support 3DPC when using E5-2400 LRDIMMs.

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Intel®Xeon®processor E5-2600/4600 product families RDIMM Support

1.35V 1.50V

Ranks
Per
DIMM &
Data
Width

Memory Capacity
per DIMM

1DPC 2DPC 1DPC 2DPC

SRx8 1GB 2GB 4GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

DRx8 2GB 4GB 8GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

SRx4 2GB 4GB 8GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

DRx4 4GB 8GB 16GB

1066,
1333

1066,
1333

1066,
1333,
1600

1066,
1333,
1600

QRx4 8GB 16GB 32GB 800 800 1066 800
QRx8 4GB 8GB 16GB 800 800 1066 800

NOTE 1: The blue blocks indicate that the DRAM Densities are supported but not

validated.

NOTE 2: The grey blocks indicate that the DRAM Densities are supported and

validated.

NOTE 3: The yellow blocks indicate that the DRAM Densities are supported with

limited validated.

 Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are

validated by Intel.

 Command Address Timing is 1N.

 QR RDIMM are supported but not validated by Intel/PMO in a homogenous

environment. The coverage will have limited system level testing, no signal

integrity testing, and no interoperability testing. The passing QR RDIMMs will be

web posted.

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2.1.5 Installing Hard Drives

The GA80-B7061 barebone supports (4) 2.5” hard drives. Follow these
instructions to install a hard drive.

Warning!!!

Always install the hard disk drive to the chassis after the chassis is
secured on the rack.

1. Press the locking lever latch in the direction of arrow.

2. Pull the locking lever open.

3. Slide the drive tray out.

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4. Remove the 4 screws to detach HDD tray bracket.

5. Place a hard drive into the drive tray. Use four screws to secure
the HDD.

6. Reinsert the HDD tray into the chassis.

7. Press the locking lever to secure the hard drive. Repeat the same
procedures to install other HDD trays.

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2.1.6 Installing the Add-On Card

The GA80-B7061 has one preinstalled M2091-R riser card.

You can install an Add-On card into the expansion slot which is available with
riser card. The following instructions are for Add-On card installation. You may
refer to the procedures below for the installation.

1. Push the tab of PCI-E slot on the rear panel in the direction as
shown to release the bracket.

2. Remove the bracket to the left as shown.

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3. Insert the Add-On card to the M2091 riser card.

4. Push the tab of PCI slot in the direction as shown to fix the Add-On
card.

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2.2 Rack Mounting

After installing the necessary components, the TYAN GA80-B7061 can be
mounted in a rack using the supplied rack mounting kit.

Rack mounting kit

No. Item Description Quantity

A

Sliding rails 2

B

Screw kit 2

C

Mounting ear 2

2.2.1 Installing the Server in a Rack

Follow these instructions to mount the TYAN GA80-B7061 into an industry
standard 19” rack.

NOTE: Before mounting the TYAN GA80-B7061 in a rack, ensure that all

internal components have been installed and that the unit has been fully tested.
However, to make the installation easier, we suggest that you remove all HDD
trays before you insert the chassis to the rack.

Screw Kit List

No. Screw Size Quantity

A

M5 8

B

Washer 8

Total:
A+B

M5 and Washer Total: 8 sets

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2.2.2 Installing the Outer Rails to the Rack

1. Install the rail to the rack. Repeat the same procedures for the other rail.

2. Secure the outer rail to the rack using 4 M5 screws and 4 washers (2 sets front /
2 sets rear) for each side. Secure the rails to the rack as shown.

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2.2.3 Installing the inner Rails to the Chassis

1. Press the button to pull out the inner rail from the outer rail of the GA80-B7061

sliding rails.

2. Align the inner sliding rail (1) on the side of the server, and pull towards the

arrow (2) to secure the six hooks.

3. Screw the mounting ears to each side of TYAN GA80-B7061 as shown

using 2 screws from the supplied screws kit.

4. To make the installation easier, we suggest that you remove all nodes

before you insert the chassis to the rack.

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2.2.4 Rack mounting the Server

To install the chassis to the rack

5. Then press the button to push the whole system into the rack.

6. Push the chassis back into the rack.

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2.2.5 Removing the Server from a Rack

Follow these instructions to remove the TYAN GA80-B7061 from an industry
standard 19” rack.

1. Hold the mounting ears to pull out the chassis from the rack.

2. Press the button to unlock the chassis from the rails.

3. Pull out the chassis from the rails.

4. Follow the steps described earlier in reverse to remove the chassis from the
rack.

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NOTE

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Chapter 3: Replacing Pre-Installed

Components

3.0.1 Introduction

This chapter explains how to replace the pre-installed components, including the
Motherboard, M1706G62 Front panel board, M7018-BP-SG SATA HDD
backplane, M1201-L16-1F and M1202-L16-1F PCI-E Riser card, System fans,

M1618G80 Power Distribution board and Power supply unit etc.

3.0.2 Disassembly Flowchart

The following flowchart outlines the disassembly procedure.

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3.1 Removing the Cover

Before replacing any parts you must remove the chassis cover. Follow Section

2.1.1 Removing the Chassis Cover (page 34, 35) to remove the cover of the

GA80-B7061.

3.2 Replacing the Front Panel Board

Follow these instructions to replace the M1706G62-FPB Front Panel Board.

1 Disconnect the Front Panel Board cables.

2 Unscrew to release the Front Panel tray.

3 Free the Front Panel tray.

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4 Unscrew to take out the front panel board.

5 Replace a new front panel board and screw it to the front panel tray.

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3.2.1 M1706G62 Front Panel Board Features

Front

Rear

NOTE: 1.5.1 System Front View (Per Node) for details on Front Panel LEDs and buttons.

3.2.2 Front Panel Board Connector Pin Definition

J6: FPIO Connector

Signal Pin Pin Signal

PW_ LED+

1 2

VCC-

NC

3 4

IDLED+

PW_LED-

5 6

IDLED-

HD_LED+

7 8

FAULT_LED1-

HD_LED-

9 10

FAULT_LED2-

PWR_SW#

11 12

LAN1_LED+

GND

13 14

LAN_LED-

RESET#

15 16

NC

GND

17 18

NC

ID_SW#

19 20

NC

TEMP_SENSOR

21 22

LAN2_LED+

HD_FAIL_LED-

23 24

LAN_LED-

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J3: USB Connector

Pin Net Name Function Pin Net Name Function

1 VCC_USB0 Power connect to 5V (for USB)6 USB_P1_P USB_P1 +

2 VCC_USB1 Power connect to 5V (for USB)7 GND Ground

3 USB_P0_N USB_P0 - 8 GND Ground

4 USB_P1_N USB_P1 - 9 NC

5 USB_P0_P USB_P0 + 10 NC

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3.3 Replacing the System Fan

There are totally seven system fans in the GA80-B7061.Two at front, three in the
middle, and two at back. Follow these instructions to replace the cooling fans in
the system.

1. Locate the cooling fans in your system.

2. Unplug the fan cables connected to the mother board.

3. Then lift the fan up from the chassis.

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4. Follow Step A & B to unlock the fans and to replace a new one.

40*40*56mm
Fan

Step A

1. Press the button to unlock the system fan.

Step B

2. Press the fan and make the system fan separated from the
plastic holder.

Result

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5. After replacing the new fans, follow Step A & B in reverse order to lock the fans.
Reinstall the fans into the chassis.

6. Connect the fan cables to the motherboard fan connectors.

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3.4 Replacing the HDD Backplane

1. Disconnect all the cables connected to the HDD Backplane.

2. Remove the two screws securing the bracket to the chassis base.

3. Unlock the plastic cable locker and lift the bracket up from the chassis.

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4. Unscrew the HDD Backplane from the bracket.

5. Replace a new HDD Backplane and reinstall it into the chassis following the
steps mentioned earlier in reverse.

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3.4.1 M7018-BP-SG HDD Backplane Features

Front View

Rear View

Connector Description

SATA0~SATA3 SATA Connector

J1~J4 HDD Connector

PW1 Power Connector

JTAG CPLD Connector

SGPIO SGPIO Connector

J11 Platform Select Jumper

J12 (reserved)

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3.4.2 M7018-BP-SG HDD Connector Pin Definitions

SATA Connector: SATA0/SATA1/SATA2/SATA3

Pin NO Pin Name Description

1 GND GND

2 SAS_TX+ Transmit pair

3 SAS_TX- Transmit pair

4 GND GND

5 SAS_RX- Receive pair

6 SAS_RX+ Receive pair

7 GND GND

HDD Connector: J1/J2/J3/J4

Pin NO Pin name Pin NO Pin name

S1 GND P1 NC

S2 SAS_TX+ P2 NC

S3 SAS_TX- P3 NC

S4 GND P4 GND

S5 SAS_RX- P5 GND

S6 SAS_RX+ P6 GND

S7 GND P7 VDD_5_RUN

S8 SAS_Present_L P8 VDD_5_RUN

S9 NC P9 VDD_5_RUN

S10 NC P10 HD_PRS_L

S11 GND P11 SAS_LED

S12 NC P12 GND

S13 NC P13 VDD_12_RUN

S14 GND P14 VDD_12_RUN

P15 VDD_12_RUN

Power Connector: PW1

Pin No. Net Name Description

1 VDD_12_RUN 12V
2 GND Power Ground
3 GND Power Ground
4 VDD_5_RUN 5V

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CPLD Connector: JTAG

SGPIO Connector: SGPIO

J11

3

1

Pin 1-2 closed: Intel platform

1

3

Pin 2-3 closed: AMD and LSI platform (default)

J12 (reserved)

3

1

Pin 1-2 closed: beforehand jumper (default)

1

3

Pin 2-3 closed: beforehand jumper

Pin No. Net Name Description Pin No. Net Name Description

1 CPLD_JTAG_TCK JTAC_TCK DataOut 6 NC

2 GND Ground 7 NC

3 CPLD_JTAG_TDO JTAC_TDO DataOut 8 NC

4 VDD_3P3_RUN 3.3V 9 CPLD_JTAG_TDI

5 CPLD_JTAG_TMS JTAC_TMS DataOut 10 GND Ground

Pin
No.

Net Name Description

Pin
No.

Net Name Description

1 SMBUS_3V3_CLK_CPLD SMBus CLK 6 SAS_GPIO2 SGPIO SLOAD

2 SAS_GPIO0 SGPIO DataIN 7 NC

3 SMBUS_3V3_DATA_CPLD SMBus Data 8 SAS_GPIO3

SGPIO
SCLOCK

4 SAS_GPIO1

SGPIO
DataOUT

9 NC

5 GND Ground 10 HD_ERR_LED

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3.5 Replacing PCI-E Riser Cards

The GA80-B7061 has three pre-installed PCI-E riser cards.
Follow the instructions below to disassemble the M1201-L16-1F, M1202-L16-1F and
M2091-R PCI-E riser cards.

Uninstalling the M1201-L16-1F riser card

1 There are two PCI bracket in the GA80-B7061 chassis.

2 Remove the 6 screws secure the PCI bracket and lift the bracket up.

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3 Turn over the bracket and unscrew the M1201-L16-1F riser card to replace a new

one if necessary.

Uninstalling the M1202-L16-1F riser card

1 Follow the same procedure to detach the other PCI bracket.

2 Unscrew the M1202-L16-1F riser card to replace a new one if necessary.

3 Follow the steps described earlier in reverse to reinstall the M1202-L16-1F riser

card.

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Uninstalling the M2091-R riser card

1 Remove one screw secure the M2091-R riser card and pull the riser card

bracket out.

2 Unscrew the M2091-R riser card to replace a new one if necessary.

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3.5.1 PCIE Riser card Features

M1201-L16-1F riser card

M1202-L16-1F riser card

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3.6 Replacing Power Distribution Board

The GA80-B7061 has one pre-installed power distribution board.
Follow these instructions to replace the M1618G80-D-Power Distribution Board.

1 Disconnect the power cables attached to the Power Distribution Board.

2 Unscrew the power distribution board.

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3.6.1 M1618G80-D-Power Distribution Board Features

Front View

Form Factor

 98*80.5MM,T=2 mm, 6-Layer PCB

Input

 DC12V 100A, 1200W

Integrated I/O

 1. 2x4 pin PW Connector1
 2. 2x4 pin PW Connector2
 3. 2x4 pin PW Connector3
 4. 2x12 pin PW Connector4
 5. Power Inlet Connector(J1)
 6. Signal Connector(J2)

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3.6.2 M1618G80-D-PDB Connector Pin Definitions

PW1/PW2/PW3:8-pin Power Connector

Definition Pin Pin Definition

GND

1 2

GND

GND

3 4

GND

+12V

5 6

+12V

+12V

7 8

+12V

PW4:24-pin Power Connector

Definition Pin Pin Definition

+12V

1 2

+12V

+12V

3 4

+12V

+12V

5 6

+12V

+12V

7 8

+12V

+12V

9 10

+12V

+12V

11 12

+12V

GND

13 14

GND

GND

15 16

GND

GND

17 18

GND

GND

19 20

GND

GND

21 22

GND

GND

23 24

GND

J2：Signal Connector

Definition Pin Pin Definition

+12V

1 2

+12V

+12V

3 4

+12V

MB_PSON_N

5 6

3V3SB

PSU_PWOK

7 8

GND

PSU_SMBALERT

9 10

GND

PSMI_SCL

11 12

NC

PSMI_SDA

13 14

GND

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J1: Power Inlet Connector

Definition Pin Pin Definition

GND

1 50

GND

GND

2 49

GND

GND

3 48

GND

GND

4 47

GND

GND

5 46

GND

GND

6 45

GND

GND

7 44

GND

GND

8 43

GND

GND

9 42

GND

+12V

10 41

+12V

+12V

11 40

+12V

+12V

12 39

+12V

+12V

13 38

+12V

+12V

14 37

+12V

+12V

15 36

+12V

+12V

16 35

+12V

+12V

17 34

+12V

+12V

18 33

+12V

A0

19 32

SDA

A1

20 31

SCL

12VSB

21 30

PSON_N

SMART_ON

22 29

SMB_ALERT

12LS

23 28

RETRUN_S

PRESENT_N

24 27

+12VRS

NC

25 26

PWOK

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3.7 Replacing the Power Supply

The system has one pre-installed 1,200W (80+ Platinum) Power Supply Units.
Follow these instructions to replace the power supply units.

1 Press and hold the latch to pull the power supply out.

2 After replacing a new power supply, press and hold the latch to push the power

supply back into the chassis.

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3.8 Removing Motherboard Procedures

Follow these instructions to replace the motherboard.

3.8.1 Disconnecting All Motherboard Cables

Before replacing the motherboard or certain components, remove the middle
iron bar first so that the motherboard can be easily take out and then disconnect
cables connected to the motherboard. Follow these instructions to remove all
motherboard cables.

1. Disconnect the 24-pin power cable, 8-pin power cables, mini SAS cable and
Front Panel cable.

2. Disconnect the system fan cables and USB cable.

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3.8.2 Removing the Motherboard

After removing all of the aforementioned cables, follow the instructions below to
remove the motherboard from the chassis.

1. Remove the heatsink and processor if installed.

2. Remove the eleven screws securing the motherboard to the chassis.

3. Carefully lift the motherboard from the chassis.

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NOTE

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Chapter 4: Installing GPU Cards

The GA80-B7061 supports several kinds of GPU cards which are listed below. In
this chapter we will introduce you how to install the NVIDIA® K10 GPU card.

Intel

®

Xeon Phi™ NVIDIA® Tesla NVIDIA

®

Quadro

3120P(300W) K10(225W) double‐width
5110P(225W) K20(225W)
7120P(300W) K20C(225W+)

K20X(235W)
K40(235W)

4.1 Installing the NVIDIA® K10 GPU card

The GA80-B7061 supports two PCI-E Riser Card Brackets. A power cable (2x4p) is
required for GPU cards. Follow these instructions to install NVIDIA

®

K10 GPU card

in your system.

1. Remove the 3 screws secure the PCI bracket and lift the bracket up.

2. Remove the 2 screws secure the PCI Riser expansion slot.

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3. Pull the two PCI bracket out. The NVIDIA

®

K10 GPU card needs two bracket’s

space.

4. Unscrew the 3 screws to remove the bracket.

5. Insert the NVIDIA® K10 GPU card onto the M1201-L16-1F riser card and

secure with 2 screws on the expansion slot.

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6. Connect the GPU cable to the NVIDIA GPU card and the other side to the

motherboard.

7. Reinstall the Intel® GPU bracket and secure with 3 M3 screws on both sides.

8. Put the PCI bracket back to the chassis and secure with 3 screws.

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4.2 Installing the Intel® 5110P GPU card

The (1~4) step is the same as in Chapter 4.1 installing the NVIDIA® K10 GPU card.

1. Connect the GPU cable to the Intel

®

5110P GPU card.

2. Install the Intel

®

GPU bracket to the Intel® 5110P GPU card and secure

with 4 M3 screws.

3. Insert the Intel® P5110 GPU card onto the M1201-L16-1F riser card
and secure with 2 screws on the expansion slot.

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4. Reinstall the GPU bracket and secure with 2 M3 screws on one side.

5. Install the GPU bracket and secure with 3 M3 screws on other side.

6. Put the PCI bracket back to the chassis and secure with 3 screws.

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Chapter 5: Motherboard Information

You are now ready to install your motherboard.

How to install our products right… the first time

The first thing you should do is read this user’s manual. It contains important
information that will make configuration and setup much easier. Here are some
precautions you should take when installing your motherboard:

(1) Ground yourself properly before removing your motherboard from the

antistatic bag. Unplug the power from your computer power supply and
then touch a safely grounded object to release static charge (i.e. power
supply case). For the safest conditions, MiTAC recommends wearing a
static safety wrist strap.

(2) Hold the motherboard by its edges and do not touch the bottom of the

board, or flex the board in any way.

(3) Avoid touching the motherboard components, IC chips, connectors,

memory modules, and leads.

(4) Place the motherboard on a grounded antistatic surface or on the antistatic

bag that the board was shipped in.

(5) Inspect the board for damage.

The following pages include details on how to install your motherboard into your
chassis, as well as installing the processor, memory, disk drives and cables.

Caution!

1. To avoid damaging the motherboard and associated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

2. Do not apply power to the board if it has been

damaged.

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5.1 Board Image

This picture is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above picture.

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5.2 Block Diagram

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5.3 Motherboard Mechanical Drawing

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5.4 Board parts, jumpers and connectors

NOTES: "▲" indicates the location of "Pin 1". Jumpers not indicated are for testing

only.

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Jumpers & Connectors

Jumper/Connector Function

CPU0_FAN/CPU1_FAN
SYS_FAN1/2/3/4

4-pin Fan Connector

J2004 Port 80 TPM Header
J2006 PDB to MB connector
J2008/J2009/J2011/J2010/J2012/J2013/J2014 8-pin Fan Connector
J3 COM1 Header
J25/J27 Mini SAS Connector
J205 SMBUS HOST Pin Header
A_USB1 Vertical Type-A USB Connector
USB1 USB Front Panel Connector
FPIO1 Front Panel Connector
2PHD_1 Chassis Intrusion Header
3PHD_2/3PHD_3 CPU XDP bypass Jumper
3PHD_4 ME Recovery Mode Jumper
3PHD_5 BIOS Recovery Mode Jumper
3PHD6/3PHD7 COM Port Select Jumper
3PHD_8 Security Override Mode Jumper
3PHD_10 SAS2308 Reset Jumper
3PHD_11 BMC Reset Jumper
ID LED BTN1 ID LED Switch Button
ID LED ID LED
Clear_BTN Clear CMOS Reset Button
Power_BTN Power On Button
SATA1/SATA2 SATA3.0 Connector

Jumper Legend

OPEN - Jumper OFF

Without jumper cover

CLOSED - Jumper ON

With jumper cover

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CPU0_FAN/CPU1_FAN//SYS_FAN1/2/3/4: 4-Pin Fan Connector

Pin 1 2 3 4

Signal GND +12V Sensor Control

Use this header to connect the cooling fan to your motherboard to
keep the system stable and reliable.

Note: A 4-pin fan is required for fan speed control.

J2004: Port 80 TPM Header

Signal Pin Pin Signal

P3V3 1 2 FRAME_N

LAD0 3 4 KEY

LAD1 5 6 PLT_RST_N

LAD2 7 8 GND

LAD3 9 10 CLK

SIRQ 11 12 GND

PRSNT 13 14 VCC3_AUX

NC 15 16 NC

CPU0_FAN

CPU1_FAN

SYS_FAN3

SYS_FAN1

SYS_FAN2

SYS_FAN4

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J2006: PDB to MB Connector

Signal Pin Pin Signal

VCC12SB 1 2 VCC12SB

VCC12SB 3 4 VCC12SB

PS_ON_N 5 6 VCC3_STBY

VCC3_STBY 7 8 GND

SMB_ALERT 9 10 GND

SMB_SCL 11 12 Guide Pin

SMB_SDA 13 14 GND

J2008/J2009/J2011/J2010/J2012/J2013/J2014: 8-pin Fan Connector

Pin Signal

1 PWM1

2 VCC1

3 Tachometer1

4 GND1

5 GND2

6 Tachometer2

7 VCC2

8 PWM2

NOTE:

Do not mix 8-pin Fan headers with 4-pin Fan headers. Mixing
these fan headers will cause problems to the system. These
connectors are only for the barebone.

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J3:COM2 Header

Signal Pin Pin Signal

DCD 1 2 DSR

RXD 3 4 RTS

TXD 5 6 CTS

DTR 7 8 NRI

GND 9 10 KEY

FPIO1: Front Panel Connector

Signal Pin Pin Signal

PW_LED+ 1 2 FP_PWER(3.3V)
KEY 3 4 IDLED+
PWRLED- 5 6 IDLED­HD_LED+ 7 8 HWM_FAULT_LED­HD_LED- 9 10 SYS_FAULT_LED­PWR_SW# 11 12 LAN1_ACTLE+
GND 13 14 LAN1LED­RST_SW# 15 16 SDA
GND 17 18 SCL
SYS_ID_SW# 19 20 INTRUSION#
GND 21 22 LAN2LED+
NMI_SW#

23 24 LAN2LED-

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USB1: USB Front Panel Header (blue)

Signal Pin Pin Signal

VCC 1 2 VCC
USBD- 3 4 USBD­USBD+ 5 6 USBD+
GND 7 8 GND
KEY

9 10 NC

A_USB1: Vertical (Type A) USB Connectors

Pin 1 2 3 4

Signal VCC USBD- USBD+ GND

J205: SMBUS HOST Pin Header

Signal Pin Pin Signal

VCC3_AUX 1 2 SMB_CLK

GND 3 4 SMB_DATA
KEY

5 6 HDD_FAULT

A_USB1

J205

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2PHD_1: Chassis Intrusion Header

Pin 1 2

Open

Signal INTRUSION# GND

Short (Default)

Open: Use this header to trigger the system chassis
intrusion alarm.
Short: Use this header to disable the system chassis
intrusion alarm.

3PHD_2: CPU XDP bypass Jumper

Pin 1 2 3

Signal CPU0_TDO XDP_TDO CPU1_TDO

3PHD_3: CPU XDP bypass Jumper

Pin 1 2 3

Signal NC CPU0_TDO CPU1_TDI

Default: Only CPU0 3PHD_2 3PHD_3

Only CPU0 Installed 1-2 1-2

Both CPU Installed 2-3 2-3

3PHD_3

3PHD_43PHD_5

2PHD_1

3PHD_2

3PHD_6

3PHD_7

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3PHD_4: ME Recovery Pin Header

Pin 1-2 Closed: Normal Mode (Default)

Pin 2-3 Closed: Recovery Mode

3PHD_5: BIOS Recovery Pin Header

Pin Signal Pin Signal

1 NC 2 BIOS_RCVR #
3 GND

Pin 1-2 Closed: Normal Mode (Default)

Pin 2-3 Closed: Recovery Mode

3PHD_6/3PHD_7: COM Select

Pin 1 2 3

Signal RXD1 COM_RX RXD5

NOTE： 1-2: BMC COM PORT(DEFAULT) 2-3: BMC CONSOLE PORT

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3PHD_8: Security Override Mode Jumper

Pin Signal Pin Signal

1 NC 2 FM_MFG_MODE
3 GND

Pin 1-2 Closed: Normal Mode (Default)

Pin 2-3 Closed: Security Override

3PHD_10: SAS2308 Reset Jumper

Pin Signal Pin Signal

1 NC 2 Reset
3 GND

Pin 1-2 Closed: Normal Mode (Default)

Pin 2-3 Closed: Reset

3PHD_8

3PHD_11

3PHD_10

SATA1
SATA2

IDLED_BTN

ID_LED

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3PHD_11: BMC Reset Jumper

Pin Signal Pin Signal

1 NC 2 Reset
3 GND

Pin 1-2 Closed: Normal Mode (Default)

Pin 2-3 Closed: Reset

SATA0/SATA1: SATA3.0 Connector

1 GND
2 TXP
3 TXN
4 GND
5 RXN
6 RXP

7

1

7 GND

Connects to the Serial ATA ready
drives via the Serial ATA cable.

ID_LED / IDLED_BTN: ID LED and Button

Pin Signal

+ P3V3_AUX

- ID_SW_L

State Color Description

On Blue System identified
Off Off System not identified

NOTE: The ID LED can be activated remotely using IPMI.

Please visit the TYAN Web Site at http://www.tyan.com

to download the

latest IPMI Configuration Guide for more details.

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Chapter 6: BIOS Setup

6.1 About the BIOS

The BIOS is the basic input/output system, the firmware on the motherboard that
enables your hardware to interface with your software. The BIOS determines what a
computer can do without accessing programs from a disk. The BIOS contains all the
code required to control the keyboard, display screen, disk drives, serial
communications, and a number of miscellaneous functions. This chapter describes
the various BIOS settings that can be used to configure your system.

The BIOS section of this manual is subject to change without notice and is provided
for reference purposes only. The settings and configurations of the BIOS are current
at the time of print and are subject to change, and therefore may not match exactly
what is displayed on screen.

This section describes the BIOS setup program. The setup program lets you modify
basic configuration settings. The settings are then stored in a dedicated,
battery-backed memory (called NVRAM) that retains the information even when the
power is turned off.

To start the BIOS setup utility:

1. Turn on or reboot your system.

2. Press <F2> or <Del> during POST (<Tab> on remote console) to start the

BIOS setup utility.

6.1.1 Setup Basics

The table below shows how to navigate in the setup program using the keyboard.

Key Function

<F1> General help window
<ESC> Exit current menu
arrow  keys Select a different menu
↑or↓ arrow keys

Move cursor up/down

<Tab> / <Shift-Tab> Cycle cursor up/down
<Home> / <End> Move cursor to top/bottom of the window
<PgUp> / <PgDn> Move cursor to next/previous page
<-> Select the previous value/setting of the field
<+> Select the next value/setting of the field
<F8> Load Fail Safe default configuration values of the menu
<F3> Load the Optimal default configuration values of the menu
<F4> Save and exit
<Enter> Execute command or select submenu

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6.1.2 Getting Help

Pressing [F1] will display a small help window that describes the appropriate
keys to use and the possible selections for the highlighted item. To exit the Help
Window, press [ESC] or the [Enter] key again.

6.1.3 In Case of Problems

If you have trouble booting your computer after making and saving the changes with
the BIOS setup program, you can restart the computer by holding the power button
down until the computer shuts off (usually within 4 seconds); resetting by pressing
CTRL-ALT-DEL; or clearing the CMOS.
The best advice is to only alter settings that you thoroughly understand. In particular,
do not change settings in the Chipset section unless you are absolutely sure of what
you are doing. The Chipset defaults have been carefully chosen either by MiTAC or
your system manufacturer for best performance and reliability. Even a seemingly
small change to the Chipset setup options may cause the system to become
unstable or unusable.

6.1.4 Setup Variations

Not all systems have the same BIOS setup layout or options. While the basic look
and function of the BIOS setup remains more or less the same for most systems, the
appearance of your Setup screen may differ from the charts shown in this section.
Each system design and chipset combination requires a custom configuration. In
addition, the final appearance of the Setup program depends on the system
designer. Your system designer may decide that certain items should not be
available for user configuration, and remove them from the BIOS setup program.

NOTE: The following pages provide the details of BIOS menu. Please be aware that

the BIOS menus are continually changing due to continual BIOS updates over the
product lifespan of the motherboard. The BIOS menus provided are current as of the
date when this manual was written. Please visit TYAN’s website at

http://www.tyan.com

for information on BIOS updates available for this specific

motherboard.