TYAN FT83-B7119 Service Engineer's Manual

FT83-B7119

Service Engineer’s Manual

PREFACE

Copyright

This publication, including all photographs, illustrations, and software, is protected
under international copyright laws, with all rights reserved. Neither this manual, nor
any material contained herein, may be reproduced without written consent of
manufacturer.

Copyright 2019 MITAC COMPUTING TECHNOLOGY CORPORATION. All rights
reserved. TYAN® is a registered trademark of MITAC COMPUTING
TECHNOLOGY CORPORATION.

Version 1.0

Disclaimer

Information contained in this document is furnished by MiTAC Computer
Corporation and has been reviewed for accuracy and reliability prior to printing.

TYAN® assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN® products including liability or
warranties relating to fitness for a particular purpose or merchantability. TYAN®

retains the right to make changes to produce descriptions and/or specifications at
any time, without notice. In no event will TYAN® be held liable for any direct or
indirect, incidental or consequential damage, loss of use, loss of data or other

malady resulting from errors or inaccuracies of information contained in this
document.

Trademark Recognition

All registered and unregistered trademarks and company names contain- -ed in
this manual are property of their respective owners including, but not limited to the
following.

TYAN® is a trademark of MITAC COMPUTING TECHNOLOGY CORPORATION.
Intel® is a trademark of Intel® Corporation.
AMI®, AMIBIOS® and combinations thereof are trademarks of AMI Technologies.
Microsoft®, Windows® are trademarks of Microsoft Corporation.
IBM®, PC®, AT® and PS/2® are trademarks of IBM Corporation.
Winbond® is a trademark of Winbond Electronics Corporation.

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FCC Declaration

Notice for the USA

Compliance Information Statement (Declaration of Conformity Procedure) DoC FCC
Part 15: This device complies with part 15 of the FCC Rules.

This device complies with Part 15 of the FCC Rules. Operation is subject to the
following conditions:

‧This device may not cause harmful interference.
‧This device must accept any interference received, including interference that may

cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class A

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his
own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet appareil
numérique de la Classe A est conforme à la norme NMB-003 du Canada.

● Notice for Europe (CE Mark)

This product is in conformity with the Council Directive 2014/30/EU.

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Warning

This equipment is compliant with Class A of CISPR 32. In a residential environment
this equipment may cause radio interference.

This equipment is not suitable for use in locations where children are likely to be
present.

CAUTION

Lithium battery included with this board. Do not puncture, mutilate, or dispose of
battery in fire. There will be danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by manufacturer.
Dispose of used battery according to manufacturer instructions and in accordance
with your local regulations.

The elements of the instructional safeguard shall be as follows:

-element 1a: IEC 60417-6056 (2011-05) for moving fan blades or
IEC 60417-6057 (2011-05) for other moving parts

-element 2:”Moving parts” or “Moving fan blade” as applicable, or equivalent text

-element 3: optional

-element 4: Keep body parts away from moving parts” or “Keep body parts away
from fan blades” or “Keep body parts out of the motion path” as applicable, or
equivalent text

● VCCI-A

この装置は、クラスＡ情報技術装置です。この装置を家庭環境で使用すると電波妨
害を引き起こすことがあります。この場合には使用者が適切な対策を講ずるよう要
求されることがあります。 VCCI-A

● Safety: IEC/EN 62368-1

This equipment is compliant with CB/LVD of Safety: IEC/EN 62368-1.

Warning

keep new and used batteries away from children.
If the battery compartment does not close securely, stop using the product and
keep it away from children.

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If you think batteries might have been swallowed or placed inside any part of the
body, seek immediate medical attention.

About this Manual

This Manual is intended for trained service technician/personnel with hardware
knowledge of personal computers. It is aimed to provide you with instructions on
installing your TYAN FT83-B7119.

How this guide is organized

This guide contains the following parts:
Chapter 1: Overview

This chapter give an introduction to the FT83-B7119 barebones, standard parts
list, and accessories. describes the external components, gives a table of key

Chapter2: Setting Up

This chapter Covers procedures on installing the CPU, memory modules, add
on card and hard drives. Give an overview about the FT83-B7119 barebone
from an overall angle.

Chapter 3: Replacing the Pre-installed Components

This chapter covers the removal and replacement procedures for pre-installed
components.

Chapter 4: Motherboard Information

This chapter lists the hardware setup procedures that you need to abide by when
installing system components. It includes description of the jumpers and connectors
on the motherboard.

Chapter5: BIOS Setup

This chapter tells how to change system settings through the BIOS setup menu.
Detailed descriptions of the BIOS parameters are also provided.

Chapter 6: Diagnostics

This chapter introduces some BIOS codes and technical terms to provide better
service for the customers.

Appendix:

This Chapter Describes the Fan and Temp sensors location; list the cable

connection and FRU part tables for reference of system setup and technical
support in case a problem arises with your system.

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Safety and Compliance Information

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.

·Do not block the slots and opening on the unit, which are provided for

ventilation.

· Only use the power source indicated on the marking label. If you are not
sure, contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third pin to

ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.

·Do not place anything on the power cord. Place the power cord where it will

not be in the way of foot traffic.

·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high voltage

components and result in shock and damage to the components.

· When replacing parts, ensure that you use parts specified by the

manufacturer.

·When service or repairs have been done, perform routine safety checks

to verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating

device.

·Cover the unit when not in use.

Before installing and using TYAN FT83-B7119, take note of the following
precautions:

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Safety Information

Caution. This symbol indicates a potential hazard.

The potential for injury exists if cautions are not
observed. Consult equipment documentation for
specific details.

Warning. This symbol indicates the presence of
hazardous energy circuits or electric shock hazards.
Refer all servicing to qualified personnel.

Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.
To reduce risk of injury from a hot component, allow
the surface to cool before touching.

Warning. This symbol indicates hazardous moving
parts. Keep away from moving fan blades.

Caution. Slide-mounted equipment is not to be
used as a shelf or a work space.

Retain and follow all product safety and operating instructions provided
with your equipment. In the event of a conflict between the instructions in
this guide and the instructions in equipment documentation, follow the
guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions. To
reduce the risk of bodily injury, electric shock, fire and damage to the
equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide before
you install, operate, or service TYAN products.

Symbols on Equipment

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General Precautions

· Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.



Machine Room Environment

 · Make sure that the area in which you install the system is properly

ventilated and climate-controlled.

· Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.

· Do not install the system in or near a plenum, air duct, radiator, or heat
register.

· Never use the product in a wet location.

Equipment Chassis

· Do not block or cover the openings to the system.

· Never push objects of any kind through openings in the equipment.

Dangerous voltages might be present.

· Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.

· Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

· Observe local occupational health and safety requirements and guidelines
for manual materials handling.

· Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.

· Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.

· Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.

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· Make sure the rack is properly secured to the floor or ceiling.

· Make sure the stabilizing feet are attached to the rack if it is a single-rack

installation.

· Make sure racks are coupled together if it is a multiple-rack installation.

· Make sure the rack is level and stable before installing an appliance in the

rack.

· Make sure the leveling jacks are extended to the floor.

· Make sure the full weight of the rack rests on the leveling jacks.

· Always load the rack from the bottom up. Load the heaviest component in

the rack first.

· Make sure the rack is level and stable before pulling a component out of the
rack.

· Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and cable
management.

· Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.

· The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.

· If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.

· Make sure the product is properly matted with the rails. Products that are

improperly matted with the rails might be unstable.

· Verify that the AC power supply branch circuit that provides power to the

rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.

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Equipment Power Cords

· Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.

· Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.

· In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.

· Do not place objects on AC power cords or cables. Arrange them so that no

one might accidentally step on or trip over them.

· Do not pull on a cord or cable. When unplugging from the electrical outlet,
grasp the cord by the plug.

· To reduce the risk of electrical shock, disconnect all power cords before

servicing the appliance.

Equipment Batteries

· The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.

· Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.

· Do not expose the battery to temperatures higher than 60°C (140°F).

· The system battery is not replaceable. If the battery is replaced by an

incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.

· Do not attempt to recharge the battery.

· Dispose of used batteries according to the instructions of the manufacturer.

Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.

Equipment Modifications

· Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has been
modified.

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Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service of
this product should be performed by trained service technicians/personnel
who are knowledgeable about the procedures, precautions, and hazards
associated with equipment containing hazardous energy levels.

· Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.

· Allow the product to cool before removing covers and touching internal
components.

· Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.

· Do not use conductive tools that could bridge live parts.

· Use gloves when you remove or replace system components; they can

become hot to the touch.

· If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:

– The power cord, extension cord, or plug has been damaged.
– Liquid has been spilled on the product or an object has fallen into the

product.

– The product has been exposed to rain or water.
– The product has been dropped or damaged.
– The product does not operate normally when you follow the operating

instructions.

Instructional safeguard requirement

An instructional safeguard shall be provided to reduced the likelihood of
unintentional contact with a moving part in accordance with Clause F.5 except
that element 3 is optional.

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Table of Contents

Chapter 1: Overview ..................................................................... 14

1.1 About the TYAN FT83-B7119.............................................. 14

1.2 Product Models .................................................................... 14

1.3 Features............................................................................... 15

1.4 Standard Parts List .............................................................. 23

1.4.1 Box Contents ................................................................ 23

1.4.2 Accessories .................................................................. 23

1.5 About the Product ................................................................ 24

1.5.1 System Front View ....................................................... 24

1.5.2 System Rear View ........................................................ 26

1.5.3 LED Definitions ............................................................. 27

1.5.4 Internal View ................................................................. 29

Chapter 2: Setting Up ................................................................... 30

2.0.1 Before you Begin .......................................................... 30

2.0.2 Work Area ..................................................................... 30

2.0.3 Tools ............................................................................. 30

2.0.4 Precautions ................................................................... 31

2.1 Installing Motherboard Components ..................................... 32

2.1.1 Removing the Chassis Cover ....................................... 32

2.1.2 Installing the CPU, Heat sink and Air Duct ................... 34

2.1.3 Installing the Memory ................................................... 37

2.1.4 Installing the Expansion Card (PCIE Board) ................ 40

2.1.5 Installing the Expansion Card (OCP Riser Card) ......... 48

2.1.6 Installing Hard Drives ................................................... 49

2.2 Rack Mounting ..................................................................... 51

2.2.1 Installing the Server in a Rack ...................................... 53

Chapter 3: Replacing Pre-Installed Components ...................... 55

3.1 Introduction .......................................................................... 55

3.2 Disassembly Flowchart ........................................................ 55

3.3 Removing the Cover ............................................................ 56

3.4 Replacing the Power Supply ............................................... 56

3.5 Replacing the Front Panel Board ........................................ 57

3.5.1 Front Panel Board Features ............................................. 58

3.6 Replacing the USB Board .................................................... 59

3.6.1 Front Panel Board Features ............................................. 60

3.7 Replacing the Fan Board ..................................................... 61

3.7.1 Fan Board Features .......................................................... 63

3.8 Replacing the HDD Backplane Board ................................. 64

3.8.1 HDD Backplane Board Features ...................................... 65

3.8.2 Connector Definition ......................................................... 66

3.9 Replacing PCIE Board ......................................................... 67

3.9.1 PCIE Board Features ....................................................... 68

3.10 Replacing the IO Bridge Board .......................................... 70

3.10.1 IO Bridge Board Features............................................... 71

3.11 Replacing the Rear IO Board .............................................. 72

3.11.1 Rear IO Board Features ................................................. 74

3.12 Replacing the OCP Riser Card ......................................... 75

3.12.1 OCP Riser Card Features .............................................. 76

3.13 Replacing the Motherboard ................................................. 77

Chapter 4: Motherboard Information .......................................... 80

4.1 Board Image ........................................................................ 81

4.2 Block Diagram ..................................................................... 82

4.3 Motherboard Mechanical Drawing ....................................... 83

4.4 Board Parts, Jumpers and Connectors ............................... 84

4.5 Thermal Interface Material................................................... 91

4.6 Tips on Installing Motherboard in Chassis .......................... 92

4.7 Installing the Memory .......................................................... 94

4.8 Finishing Up ......................................................................... 98

Chapter 5: BIOS Setup .................................................................. 99

5.1 About the BIOS .................................................................. 99

5.2 Main Menu ........................................................................ 101

5.3 Advanced Menu ............................................................... 102

5.4 Platform Configuration ................................................... 140

5.5 Socket Configuration ...................................................... 150

5.6 Server Management .......................................................... 177

5.7 Security .............................................................................. 181

5.8 Boot ................................................................................... 186

5.9 Save & Exit ........................................................................ 189

Read only ..................................................................................... 190

Chapter 6: Diagnostics ............................................................... 191

6.1 Flash Utility ........................................................................ 191

6.2 AMIBIOS Post Code (Aptio) .............................................. 192

Appendix I: How to recover UEFI BIOS .................................... 202

Appendix IV: Fan and Temp Sensors ....................................... 204

Appendix V: Cable Connection Tables ..................................... 209

Appendix VI: FRU Parts Table ................................................... 212

Appendix VII: Glossary ............................................................... 214

Appendix VII: Technical Support ............................................... 220

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Chapter 1: Overview

1.1 About the TYAN FT83-B7119

Congratulations on your purchase of the TYAN® FT83-B7119, a highly optimized
rack-mountable 4U barebone system. FT83-B7119 is designed to support dual
Intel® Xeon® Scalable Processor Families and up to 768GB RDIMM / 1536GB
LRDIMM / 3072GB RDIMM 3DS / LRDIMM 3DS, providing a rich feature set and
incredible performance. Leveraging advanced technology from Intel®,
FT83-B7119 server system is capable of offering scalable 32 and 64-bit computing,
high-bandwidth memory design, and lightning-fast PCI-E bus
implementation.FT83-B7119 not only enpowers your company in today’s
demanding IT environment but also offers a smooth path for future application
usage.

TYAN® also offers the FT83-B7119 in a version that can support up to twelve (12)
or twenty-four (24) 2.5”/3.5” hot-swap SATA 6G HDDs. FT83-B7119 uses
rack-mountable 4U chassis featuring a robust structure and a solid mechanical
enclosure. All of this provides FT83-B7119 the power and flexibility to meet the
needs of nearly any server application.

1.2 Product Models

The system board within the Tyan Barebone is defined by the following models:

 B7119F83V12HR-2T-N: Intel-based platform
B7119F83V24HR-2T-N: Intel-based platform

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1.3 Features

B7119F83V12HR-2T-N Specifications

System

Form Factor

4U Rackmount

Chassis Model

FT83

Dimension (D x W x H)

32.68" x 17.25" x 6.93" (830 x 438.4
x 176mm)

Motherboard Name

S7119GMRE #

Motherboard
Notification

# The motherboard not sold
separately

Gross Weight

43.5 kg (95.9 lbs)

Net weight

27.5 kg (60.6 lbs)

Front Panel

Buttons

(1) RST, (1) PWR w/ LED, (1) UID

LEDs

(1) ID, (3) LAN, (1) System Event

I/O Ports

(1) VGA port, (2) USB 3.0 ports, (1)
COM Port

External Drive Bay

Q'ty / Type

(12) 3.5"/2.5" Hot-Swap SSD/HDD

HDD Backplane
Support

SAS 12Gb/s, SATA 6Gb/s, NVMe

Supported HDD
Interface

(12) SATA 6Gb/s

System Cooling
Configuration

Redundancy

Yes

FAN

(5+1) hot-swap 12cm fans

Power Supply

Type

RPSU

Input Range

AC 100-127V/13A ,
AC 200-240V/9.5A

Frequency

50-60 Hz

Output Watts

4,000 Watts (100-127Vac input),
4,800Watts (200-240Vac input)

Efficiency

PFC, 80 plus Platinum

Redundancy

3+1

NOTE: When use 100-127V AC

input, the system does not support
redundant PSU operation.

Altitude 5000m

Processor

Q'ty / Socket Type

(2) LGA3647

Supported CPU
Series

Intel Xeon Scalable Processor, 2nd
Gen Intel Xeon Scalable Processor

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Thermal Design
Power (TDP) Wattage

Max up to 205W

System Bus

Up to 10.4/9.6 GT/s with Intel
UltraPath Interconnect (UPI)
support

Chipset

PCH

Intel C621

Switch IC

(2) PLX PEX8796

Memory

Supported DIMM
Qty

(12)+(12) DIMM slots

DIMM Type / Speed

DDR4 RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS
2933/2666, DDR4 JEDEC NVDIMM
2666, Intel Optane DC Persistent
Memory Module (DCPMM)

Capacity

Up to 768GB RDIMM/ 1,536GB
LRDIMM/ 3,072GB RDIMM
3DS/LRDIMM 3DS *Follow latest
Intel DDR4 Memory POR

Memory channel

6 Channels per CPU

Memory voltage

1.2V

Notification

DDR4-2933 speed only supported
with 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake) and in a 1 DIMM per channel
configuration., Intel Optane DC
Persistent Memory Module
(DCPMM) only supported with
specific 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake). Please contact Tyan
Technical Support for more detail.

Expansion Slots

PCI-E

(1) PCI-E Gen3 x16 slot (FH, FL,
SW), (10) PCI-E Gen3 x16 slots (FH,
FL, DW)

Pre-install TYAN
Riser Card
(PCI-E Gen3)

(1) M2217-L16-IO # riser card for (1)
storage mezz. slot

Pre-install TYAN
Mezz. Card
(PCI-E Gen3)

(1) M7108-X550-2T LAN mezz. card
w/ (2) 10GbE ports (deployed on (1)
PCI-E Gen3 x16 OCP 2.0 slot)

Others

(1) PCI-E Gen3 x16 OCP 2.0 slot
(conn.A+conn.B), (1) PCI-E Gen3
x16 storage mezz. slot

Notification

# The item not sold separately

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LAN

Q'ty / Port

(2) 10GbE ports, (1) GbE port
dedicated for IPMI

Controller

Intel X550-BT2

PHY

Realtek RTL8211E

Storage

SATA

Connector

(2) Mini-SAS HD (8-ports)

Controller

Intel C621

Speed

6Gb/s

RAID

RAID 0/1/10/5 (Intel RSTe)

sSATA

Connector

(2) SATA-III, (1) Mini-SAS HD
(4-ports)

Controller

Intel C621

Speed

6Gb/s

RAID

RAID 0/1/10/5 (Intel RSTe)

Graphic

Connector type

D-Sub 15-pin

Resolution

Up to 1920x1200

Chipset

Aspeed AST2500

I/O Ports

USB

(2) USB3.0 ports (@ rear), (2)
USB3.0 ports (@ front)

COM

(1) DB-9 COM port (at front)

VGA

(1) D-Sub 15-pin port (at front)

RJ-45

(2) 10GbE ports, (1) dedicated
GbE for IPMI

TPM (Optional)

TPM Support

Please refer to our TPM
supported list.

System Monitoring

Chipset

Aspeed AST2500

Temperature

Monitors temperature for CPU &
memory & system environment

Voltage

Monitors voltage for CPU,
memory, chipset & power supply

LED

Over temperature warning
indicator, Fan & PSU fail LED
indicator

Others

Watchdog timer support

Server Management

Onboard Chipset

Onboard Aspeed AST2500

AST2500 iKVM
Feature

24-bit high quality video
compression, Supports storage
over IP and remote platform-flash,
USB 2.0 virtual hub

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AST2500 IPMI
Feature

IPMI 2.0 compliant baseboard
management controller (BMC),
10/100/1000 Mb/s MAC interface

BIOS

Brand / ROM size

AMI, 32MB

Feature

Hardware Monitor, SMBIOS

3.0/PnP/Wake on LAN, Boot from
USB device/PXE via LAN/Storage,
User Configurable FAN PWM Duty
Cycle, Console Redirection, ACPI
sleeping states S4,S5, ACPI 6.1

Operating System

OS supported list

Please refer to our AVL support
lists.

Regulation

FCC (SDoC)

Class A

CE (DoC)

Class A

CB/LVD

Yes

RCM

Class A

VCCI

Class A

Operating Environment

Operating Temp.

10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

In/Non-operating
Humidity

90%, non-condensing at 35° C

Note

Please refer to the TYAN NVIDIA
Compatibility List for the operating
temperature while GPGPU
deployed

RoHS

RoHS 6/6 Compliant

Yes

Package Contains

Barebone

(1) FT83-B7119 w/NV Tesla-aware
FW Barebone

Manual

(1) Quick Installation Guide

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B7119F83V24HR-2T-N Specifications

System

Form Factor

4U Rackmount

Chassis Model

FT83

Dimension (D x W x H)

32.68" x 17.25" x 6.93" (830 x 438.4
x 176mm)

Motherboard Name

S7119GMRE #

Motherboard
Notification

# The motherboard not sold
separately

Gross Weight

43.5 kg (95.9 lbs)

Net weight

27.5 kg (60.6 lbs)

Front Panel

Buttons

(1) RST, (1) PWR w/ LED, (1) UID

LEDs

(1) ID, (3) LAN, (1) System Event

I/O Ports

(1) VGA port, (2) USB 3.0 ports, (1)
COM Port

External Drive Bay

Q'ty / Type

(24) 3.5"/2.5" Hot-Swap SSD/HDD

HDD Backplane
Support

SAS 12Gb/s, SATA 6Gb/s, NVMe

Supported HDD
Interface

(24) SATA 6Gb/s

Notification

The SAS/SATA HDD backplane is
connected to onboard SATA
connection by default. Please
contact Tyan technical support if a
discrete SAS HBA/RAID adapter
installed is required.

System Cooling
Configuration

Redundancy

Yes

FAN

(5+1) hot-swap 12cm fans

Power Supply

Type

RPSU

Input Range

AC 100-127V/13A ,
AC 200-240V/9.5A

Frequency

50-60 Hz

Output Watts

4,000 Watts (100-127Vac input),
4,800Watts (200-240Vac input)

Efficiency

PFC, 80 plus Platinum

Redundancy

3+1

NOTE: When use 100-127V AC

input, the system does not support
redundant PSU operation.

Altitude

5000m

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Processor

Q'ty / Socket Type

(2) LGA3647

Supported CPU
Series

Intel Xeon Scalable Processor, 2nd

Gen Intel Xeon Scalable Processor

Thermal Design
Power (TDP) Wattage

Max up to 205W

System Bus

Up to 10.4/9.6 GT/s with Intel
UltraPath Interconnect (UPI)
support

Chipset

PCH

Intel C621

Switch IC

(2) PLX PEX8796

Memory

Supported DIMM
Qty

(12)+(12) DIMM slots

DIMM Type / Speed

DDR4 RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS
2933/2666, DDR4 JEDEC NVDIMM
2666, Intel Optane DC Persistent
Memory Module (DCPMM)

Capacity

Up to 768GB RDIMM/ 1,536GB
LRDIMM/ 3,072GB RDIMM
3DS/LRDIMM 3DS *Follow latest
Intel DDR4 Memory POR

Memory channel

6 Channels per CPU

Memory voltage

1.2V

Notification

DDR4-2933 speed only supported
with 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake) and in a 1 DIMM per channel
configuration., Intel Optane DC
Persistent Memory Module
(DCPMM) only supported with
specific 2nd Gen Intel Xeon Scalable
Processor (codename: Cascade
Lake). Please contact Tyan
Technical Support for more detail.

Expansion Slots

PCI-E

(1) PCI-E Gen3 x16 slot (FH, FL,
SW), (10) PCI-E Gen3 x16 slots (FH,
FL, DW)

Pre-install TYAN
Riser Card
(PCI-E Gen3)

(1) M2217-L16-IO # riser card for (1)
storage mezz. slot

Pre-install TYAN
Mezz. Card
(PCI-E Gen3)

(1) M7108-X550-2T LAN mezz. card
w/ (2) 10GbE ports (deployed on (1)
PCI-E Gen3 x16 OCP 2.0 slot)

Others

(1) PCI-E Gen3 x16 OCP 2.0 slot

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(conn.A+conn.B), (1) PCI-E Gen3
x16 storage mezz. slot

Notification

# The item not sold separately

LAN

Q'ty / Port

(2) 10GbE ports, (1) GbE port
dedicated for IPMI

Controller

Intel X550-BT2

PHY

Realtek RTL8211E

Storage

SATA

Connector

(2) Mini-SAS HD (8-ports)

Controller

Intel C621

Speed

6Gb/s

RAID

RAID 0/1/10/5 (Intel RSTe)

sSATA

Connector

(1) Mini-SAS (4-ports)
(2) SATA-III

Controller

Intel C621

Speed

6Gb/s

RAID

RAID 0/1/10/5 (Intel RSTe)

Graphic

Connector type

D-Sub 15-pin

Resolution

Up to 1920x1200

Chipset

Aspeed AST2500

I/O Ports

USB

(2) USB3.0 ports (@ rear)
(2) USB3.0 ports (@ front)

COM

(1) DB-9 COM port (at front)

VGA

(1) D-Sub 15-pin port (at front)

RJ-45

(2) 10GbE ports
(1) dedicated GbE for IPMI

TPM (Optional)

TPM Support

Please refer to our TPM supported
list.

System Monitoring

Chipset

Aspeed AST2500

Temperature

Monitors temperature for CPU &
memory & system environment

Voltage

Monitors voltage for CPU, memory,
chipset & power supply

LED

Over temperature warning
indicator, Fan & PSU fail LED
indicator

Others

Watchdog timer support

Server Management

Onboard Chipset

Onboard Aspeed AST2500

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AST2500 iKVM
Feature

24-bit high quality video
compression, Supports storage over
IP and remote platform-flash, USB

2.0 virtual hub

AST2500 IPMI
Feature

IPMI 2.0 compliant baseboard
management controller (BMC),
10/100/1000 Mb/s MAC interface

BIOS

Brand / ROM size

AMI, 32MB

Feature

Hardware Monitor, SMBIOS

3.0/PnP/Wake on LAN, Boot from
USB device/PXE via LAN/Storage,
User Configurable FAN PWM Duty
Cycle, Console Redirection, ACPI
sleeping states S4,S5, ACPI 6.1

Operating System

OS supported list

Please refer to our AVL support
lists.

Regulation

FCC (SDoC)

Class A

CE (DoC)

Class A

CB/LVD

Yes

RCM

Class A

VCCI

Class A

Operating Environment

Operating Temp.

10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp.

- 40° C ~ 70° C (-40° F ~ 158° F)

In/Non-operating
Humidity

90%, non-condensing at 35° C

Note

Please refer to the TYAN NVIDIA
Compatibility List for the operating
temperature while GPGPU
deployed

RoHS

RoHS 6/6 Compliant

Yes

Package Contains

Barebone

(1) FT83-B7119 w/NV Tesla-aware
FW Barebone

Manual

(1) Quick Installation Guide

NOTE:

1. The specifications are subject to change without prior notice.

2. Please visit our website for the latest specifications.

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1.4 Standard Parts List

This section describes FT83-B7119 package contents and accessories. Open the
box carefully and ensure that all components are present and undamaged. The
product should arrive packaged as illustrated below.

1.4.1 Box Contents

FT83-B7119 Chassis Kit

 4U chassis*1
 (3+1) 4,800W (80+ Platinum) power Supply
 120X120X38MM FAN*6
 M1718T65-FPB Front Panel Board*1
 M1717T65-USB Front USB Board
 TYAN® S7119 Mother Board*1
 M7119FA77-IO PCIE board*1
 M2217-L16-IO OCP riser card*1
 M7119FA77-RIO Rear IO board*1
 M2218-GF16 IO Bridge*1
 M2221-GF24 IO Bridge*1
 M1297T65-BP12E-12*2 (B7119F83V24HR-2T-N SKU) or
 M1297T65-BP12E-12*1 (B7119F83V12HR-2T-N SKU)
 M1809F77A-FB Fan Board*1
 P3280-24i SAS Card
 Mini SAS Cable*3

1.4.2 Accessories

If any items are missing or appear damaged, contract your retailer or browse to
TYAN®’s website for service: http://www.tyan.com.

FT83-B7119 Accessory Kit

 CPU heatsink*2
 Rail Kit *1
 Quick Installation Guide *1
 Mounting ear kit *1
 AC Power code (US) *4
 AC Power code (EU) *4
 2*4P GPU Power Cable *10
 Air duct *1
 CPU CLIP *2
 Screw Pack *1

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1.5 About the Product

The following views show you the product.

1.5.1 System Front View

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M1718T65-FPB Front Panel LED Control Board

Field

QTY

Color

Behavior

Power

1

Green

System Power off / off
System Power On / solid on
System under S1 or S3 / Blinking (TBD)

LAN1/LAN2

2

Green

Offline / LED Off
Linking / Solid on
Access / Blinking

ID 1 Blue

Normal / Off
Located / Solid on

Warning

1

Red/Green/Blue

System normal /All off
Memory warning / Green blinking
PSU warning / Blue solid on
FAN warning / Blue blinking
System fault / Red solid on

HDD LED

1

Green/Red

HDD present / Green solid on
HDD activity / Green blinking
HDD fail / Red solid on

Switch and LED Indication

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DRIVE STATE

Active LED (Green)

Status LED (Red)

Drive Present, No Active

Solid on

Off

Drive Present with Active

Blinking

Off

Drive Failure

Don’t care

Solid on

RAID Rebuild

Don’t care

Blinking @4 Hz

Drive Locate Identifier

Don’t care

Blinking @1 Hz

1.5.2 System Rear View

1. LAN1: from Realtek RTL8211E PHY for IPMI

2. USB 3.0 x 2

3. ID BTN/ LED

4. OCP Card Area: via PCIex16 OCP2.0 slot add (2)SFP+ or (2)RJ45 ports

NOTE:

1. M7119FA77-RIO is pre-installed.

2. M7108-X550-2T LAN Card is pre-installed in this picture.
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1.5.3 LED Definitions

10/100/1000 Mbps LAN Link/Activity LED Scheme

Left LED

(Link/Activity)

Right LED

(Speed)

No Link

OFF

OFF

100 Mbps

Link

Solid Green

Solid Green

Active

Blinking Green

Solid Green

1000 Mbps

Link

Solid Green

Solid Amber

Active

Blinking Green

Solid Amber

(10Gbps)

Link

Solid Amber

Solid Amber

Active

Solid Amber

Solid Amber

1Gbps LAN Link/Activity LED Scheme

Left LED

(Link/Activity)

LED Color: Green

Right LED

(Speed)

LED Color: Amber

No Link

OFF

OFF

10 Mbps

Link

Green Solid On

OFF

Active

Green Blinking

OFF

100 Mbps

Link

Green Solid On

Green Solid On

Active

Green Blinking

Green Solid On

1000 Mbps

(1Gbps)

Link

Green Solid On

Amber Solid On

Active

Green Blinking

Amber Solid On

10Gbps LAN Port LAN Indication

1Gbps LAN Port LAN Indication

NOTE: “Left” and “Right” are viewed from the rear panel.

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Dual-color

Power Supply Condition

Green LED

Amber LED

No AC power to all power supplies

OFF

OFF

Power supply critical event causing a shutdown
failure, OCP, OVP, Fan Fail, OTP, UVP

OFF

AMBER

Power supply warning events where the power
supply continues to operate; high temp( inlet
temperature>54 deg (PMBus reading), or hot
spot temperature>105deg (PMBus reading),
high power, high current, slow fan(<1200rpm).

OFF

0.5Hz
Blink
AMBER

AC present Only 12VSB on(PS off) or PS in
Smart Redundant state

1Hz Blink GREEN

OFF

Output ON and OK

ON

OFF

AC cord unplugged or AC power lost, with a
second power supply in parallel still with AC
input power.

OFF

AMBER

FW update mode

2Hz Blink GREEN

OFF

PSU LED Definitions

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1.5.4 Internal View

NO.

Explanation

1.

(12) 3.5” HDDs/SSDs (HDD0 ~ HDD11) w/
M1297T65-BP12E-12 HDD BP Board pre-installed

2

System Fans

3

CPU0

4

CPU1

5

PCIE Gen3 x16 OCP2.0 Slot for SAS Card (from CPU#1,
M2217-L16-IO pre-installed)

6

M7119FA77-IO PCIE Board

7~11

PCIE Gen3 x16 Slots (FH/FL, GPU#1 ~ GPU#5)

12

PCIE Gen3 x16 Slot (FH/FL)

13~17

PCIE Gen3 x16 Slots (FH/FL, GPU#6 ~ GPU#10)

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Chapter 2: Setting Up

Caution!

1. To avoid damaging the motherboard and associated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

2. Do not apply power to the board if it has been
damaged.

2.0.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks, memory
modules, and hard drives. Instructions on inserting add on
cards are also given.

2.0.2 Work Area

Make sure you have a stable, clean working environment. Dust and dirt
can get into components and cause malfunctions. Use containers to
keep small components separated. Putting all small components in
separate containers prevents them from becoming lost. Adequate
lighting and proper tools can prevent you from accidentally damaging
the internal components.

2.0.3 Tools

The following procedures require only a few tools, including the
following:

 A cross head (Phillips) screwdriver
 A grounding strap or an anti-static pad

Most of the electrical and mechanical connections can be disconnected
using your fingers. It is recommended that you do not use needle nosed
pliers to remove connectors as these can damage the soft metal or plastic
parts of the connectors.

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2.0.4 Precautions

Components and electronic circuit boards can be damaged by
discharges of static electricity. Working on a system that is connected to
a power supply can be extremely dangerous. Follow the guidelines below
to avoid damage to FT83-B7119 or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then touch a
safely grounded object to release static charge (i.e. power supply
case). If available, wear a grounded wrist strap. Alternatively,
discharge any static electricity by touching the bare metal chassis
of the unit case, or the bare metal body of any other grounded
appliance.


 Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When removing

the motherboard, always place it on a grounded anti-static surface
until you are ready to reinstall it.

 Hold electronic circuit boards by the edges only. Do not touch the

components on the board unless it is necessary to do so. Do not
flex or stress circuit boards.

 Leave all components inside the static-proof packaging that they

ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs, or

other small parts are in place and are not left loose inside the case.
Metallic parts or metal flakes can cause electrical shorts.

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2.1 Installing Motherboard Components

This section describes how to install components on to the motherboard, including
CPUs, memory modules and Add-on cards.

2.1.1 Removing the Chassis Cover

Follow these instructions to remove FT83-B7119 chassis cover.

1. Remove the screw from the front top cover.

2. Release the latch to lift up the front top cover from the chassis.

3. Release the two screws on the back side as illustrated in the image.

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4. Press the two latch to pull the cover in the direction of the arrow to remove

the top cover.

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2.1.2 Installing the CPU, Heat sink and Air Duct

Follow the steps below on installing the processor, heatsink and air duct.

1. Align and install the processor on the carrier.

2. Carefully flip the heatsink. Then install the carrier assembly on the bottom of
the heatsink and make sure the guide pin is located in the correct direction.

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3. Always start with CPU0 first. Remove the CPU Socket protection cap. Locate
the CPU socket’s gold arrow (guide pin).

NOTE: A new heatsink comes with pre-applied thermal grease.

Once the heatsink has been removed from the processor, you need to clean the
processor and heatsink using an alcohol solvent. Then apply new thermal grease
before reinstalling the heatsink.

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4. Carefully flip the heatsink. Align the heatsink with the CPU socket by the guide
pins and make sure the guide pin is located in the correct direction. Then place the
heatsink onto the top of the CPU socket.

5. To secure the heatsink, use a T30 Security Torx to tighten the screws in a
sequential order (1234).

NOTE: When disassembling the heatsink, loosen the screws in reverse order

(4321).

6. Repeat the procedures described earlier to install the second processor and
heatsink.

7. Place the air duct on top of the heatsink and screw it to the chassis.

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2.1.3 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Press the memory slot locking levers in the direction of the arrows as shown in
the following illustration.

2. Align the memory module with the slot. When inserted properly, the memory
slot locking levers lock automatically onto the indentations at the ends of the module.

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DIMM Location

NOTE:

1. √ indicates a populated DIMM slot.

2. Use paired memory installation for max performance.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Always install with CPU0 Socket first.

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Memory Population Table

Single CPU Installed

(CPU0 only)

Quantity of memory installed

1 2 3 4 6 8 12

CPU0_DIMM_A0

√ √ √ √ √ √ √

CPU0_DIMM_A1

√ √

CPU0_DIMM_B0

√ √ √ √ √ √

CPU0_DIMM_B1

√ √

CPU0_DIMM_C0

√ √ √

CPU0_DIMM_C1

√

CPU0_DIMM_D0

√ √ √ √

CPU0_DIMM_D1

√ √

CPU0_DIMM_E0

√ √ √ √

CPU0_DIMM_E1

√ √

CPU0_DIMM_F0

√ √

CPU0_DIMM_F1

√

Dual CPU Installed

(CPU0 and CPU1)

Quantity of memory installed

2 4 6 8 10

12

14

16

18

20

22

24

CPU0_DIMM_A0

√ √ √ √ √ √ √ √ √ √ √

√

CPU0_DIMM_A1

√ √ √ √ √

√

CPU0_DIMM_B0

√ √ √ √ √ √ √ √ √ √

√

CPU0_DIMM_B1

√ √ √ √

√

CPU0_DIMM_C0

√ √ √ √ √ √ √ √ √

√

CPU0_DIMM_C1

√ √ √

√

CPU0_DIMM_D0

√ √ √ √ √ √ √ √

√

CPU0_DIMM_D1

√ √

√

CPU0_DIMM_E0

√ √ √ √ √ √ √

√

CPU0_DIMM_E1

√

√

CPU0_DIMM_F0

√ √ √ √ √ √ √ CPU0_DIMM_F1

√

CPU1_DIMM_A0

√ √ √ √ √ √ √ √ √ √ √

√

CPU1_DIMM_A1

√ √ √ √ √

√

CPU1_DIMM_B0

√ √ √ √ √ √ √ √ √ √

√

CPU1_DIMM_B1

√ √ √ √

√

CPU1_DIMM_C0

√ √ √ √ √ √ √ √ √

√

CPU1_DIMM_C1

√ √ √

√

CPU1_DIMM_D0

√ √ √ √ √ √ √ √

√

CPU1_DIMM_D1

√ √

√

CPU1_DIMM_E0

√ √ √ √ √ √ √

√

CPU1_DIMM_E1

√ √ CPU1_DIMM_F0

√ √ √ √ √ √

√

CPU1_DIMM_F1

√

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2.1.4 Installing the Expansion Card (PCIE Board)

Follow these instructions to install the PCIE cards.

Installing Expansion Cards

1. Unscrew to remove the GPU Bracket.

2. Locate the PCI-E Gen.3 x16 slot on the motherboard. Unscrew to take out
the dummy brackets.

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3. Insert the expansion card into the PCIE Gen. 3 slot and screw it to the chassis.
Connect the PWR cable to the expansion card and motherboard.

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4. Secure the GPU Bracket to the chassis with 4 screws.

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Optional GPU Extend Kit

Follow the instructions to install the expansion cards with card brackets or card
guides.

With Card Bracket

1. Unscrew to remove the Linkbar and GPU Bracket.

2. Loosen three screws on the motherboard.

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3. Insert the GPU Linkbard into the chassis and secure it to the chassis with
seven screws (3 to the motherboard, 2 on each side of the Linkbar to the chassis).

4. Locate the PCI-E Gen.3 x16 slot on the motherboard. Unscrew to take out
the dummy brackets.

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5. Screw the GPU card bracket to the GPU card.

6. Insert the GPU card into the PCIE Gen. 3 slot and screw the GPU card to the
chassis. Connect the GPU PWR cable to the GPU card and motherboard.

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With Card Guide

1. Screw the Linkbar to the chassis.

2. Align the expansion card with the card guide and insert the card onto the PCIE
slot as shown.

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3. Screw the expansion card to the chassis.

4. Connect the power cable to the expansion card and the motherboard.

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2.1.5 Installing the Expansion Card (OCP Riser Card)

Follow these instructions to install the M7076-3008-8I onto the OCP Riser Card Slot.

1. Locate the OCP Riser Card Slot.

2. Insert the M7076-3008-8I onto the OCP Riser Card Slot and use 4 screws to

secure it to the chassis.

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2.1.6 Installing Hard Drives

The FT83-B7119 supports 100 3.5”/2.5” Hard Drives. Follow these instructions
to install a hard drive.

Installing 3.5” HDD

1. Press Locking lever to release the 3.5”/2.5” HDD tray.

2. Pull the 3.5”/2.5” HDD tray out of the chassis.

3. Place a 3.5” hard drive into the drive tray.

4. Reinsert the HDD tray into the chassis.

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2.2 Rack Mounting

After installing the necessary components, the TYAN FT83-B7119 can be mounted
in a rack using the supplied rack mounting kit.

Sliding Rail Kit (outer rail)

Sliding Rail Kit (inner rail)

Press the button, to pull out the inner rail from the outer rail.

NOTE: Before mounting the TYAN FT83-B7119 in a rack, ensure that the right or left

inner rail have been installed correctly. If not, the power cable module cannot be
installed on the chassis kit.

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Installing the Inner Rails to the Chassis

Align the inner sliding rail on the side of the server, and pull towards the arrow to
secure the hooks.

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2.2.1 Installing the Server in a Rack

Follow these instructions to mount the TYAN FT83-B7119 into an industry standard
19" rack.

NOTE: Before mounting the TYAN FT83-B7119 in a rack, ensure that all internal

components have been installed and that the unit has been fully tested. However, to
make the installation easier, we suggest that you remove all HDD trays before you
insert the chassis into the rack.

Installing the Outer Rails to the Unit

Secure the outer rails to the rack, fix the screws to the rack to make them stuck to
both sides of the rack.

ack Mounting the Server

1. Pull out the outer rail to the full length.

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2. Lift the unit and then insert the inner slide rails into the Outer rails.

3. Secure the two rotary screws on the mounting ears of the unit to the rack.

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Chapter 3: Replacing Pre-Installed Components

3.1 Introduction

This chapter explains how to replace the pre-installed components, including the

S7119GMRE Motherboard, M2217-L16-IO OCP Riser Board, M1297T65-BP12E-12

HDD Backplane Board, M7119FA77-IO IO board, M2218-GF16 / M2221-GF24 IO

bridge, M7119FA77-RIO Rear IO card, M1809F77A-FB Fan Board, System Fan and

Power Supply, etc.

3.2 Disassembly Flowchart

The following flowchart outlines the disassembly procedure.

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3.3 Removing the Cover

Before replacing any parts you must remove the chassis cover. Follow Chapter

2.1.1 to remove the cover of FT83-B7119.

3.4 Replacing the Power Supply

To replace the power supply follow these instructions.

1. Press the tab as in the diagram from down to up.

2. Free the power from the power socket.

3. Replace a new single power and reinsert it into the power socket following

the above steps in reverse.

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3.5 Replacing the Front Panel Board

Follow these instructions to replace the M1718T65-FPB Front Panel Board.

1. Unscrew to remove the front panel board module.

2. Loosen three screws to take out the front panel board. Loosen two screws
to take out the front panel board.

3. Follow the steps described earlier in reverse order to reinstall the front panel
board module.

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3.5.1 Front Panel Board Features

M1718T65-FPB Front Panel Board

Form Factor

 PCB Dimensions: 40.00*18.00*1.6mm
 Thickness: 1.6mm
 Layer: 4 layers

Specifications

 power button with LED
 reset button
 ID button
 LED: LAN1 LED (green), LAN2 LED (green), ID LED

(blue), HDD LED (green/Red), FAULT LED (Red/green/Blue),
Power LED

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3.6 Replacing the USB Board

Follow these instructions to replace the M1717T65-USB USB Board.

1. Unscrew to remove the front panel board module.

2. Loosen three screws to take out the front panel board. Loosen two screws
to take out the front panel board.

3. Follow the steps described earlier in reverse order to reinstall the front panel
board module.

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3.6.1 Front Panel Board Features

M1717T65-USB USB Board

Form Factor

 PCB Dimensions: 48.00*19.00*1.6mm
 Thickness: 1.6mm
 Layer: 4 layers

Specifications

 USB 3.0 Connector
 5*2PIN input Connector

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3.7 Replacing the Fan Board

Follow these instructions to replace the M1809F77A-FB Fan Board.

1. Remove all Fan modules.

2. Unscrew the fan cage.

3. Lift up the fan cage.

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4. Disconnect all cables from the Fan Board.

5. Unscrew to replace with a new Fan Board. Follow the steps in reverse order

to reinstall the Fan Board.

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3.7.1 Fan Board Features

M1809F77A-FB Fan Board

Specifications

Support (6) 120x38 mm system FAN
(4) 4-pin B4P RA PWR Connector (run DC+12V)
(6) 4-pin Hot-swap FAN Connector
(1) 20-pin barebone system FAN connector to MB

FAN Sequence

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3.8 Replacing the HDD Backplane Board

Follow these instructions to replace the M1297T65-BP12E-12 HDD Backplane
Board.

1. Disconnect all cables connected to the HDD BP Board.

2. Unscrew the HDD BP Board from the chassis.

3. Take out the HDD BP Board to replace with a new one. Follow the

procedures described earlier in reverse order to reinstall the HDD BP Board
and HDD cage.

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3.8.1 HDD Backplane Board Features

Form Factor

Dimension: 422.4*29.8mm

Specifications
Overview

2x OCU Link Connector Input
3x Mini SAS HD Connector Input
4x SGPIO Header
12x SATA HDD or 8 SATA HDD + 4x NVMe Output

Front View

Rear View

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3.8.2 Connector Definition

Location

Definition

HDD0
HDD1
HDD2
HDD3
HDD4
HDD5
HDD6
HDD7
HDD8

HDD9
HDD10
HDD11

SATA0_3
SATA4_7

SATA8_11

NVME01
NVME23

PW1
SGPIO0
SGPIO2
SGPIO3
SGPIO1

SATA + NVMe Connector
SATA + NVMe Connector
SATA + NVMe Connector
SATA + NVMe Connector

SATA Connector
SATA Connector
SATA Connector
SATA Connector
SATA Connector
SATA Connector
SATA Connector

SATA Connector
Mini SAS HD Connector
Mini SAS HD Connector
Mini SAS HD Connector

SLIMSAS Connector
SLIMSAS Connector

Power Connector

SGPIO Header for HDD0~7

SGPIO Header for HDD8~11

Reserved for AMD Platform

Reserved

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3.9 Replacing PCIE Board

Follow these instructions to replace the M7119FA77-IO PCIE Board.

1. Unscrew to remove the GPU Bracket.

2. Disconnect all cables connected to the PCIE Board.

3. Unscrew to lift up the PCIE Board Bracket (totally 16 screws).

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4. Unscrew the PCIE Board from the M2218-GF16 IO Bridge Bracket.

5. Replace the PCIE Board with a new one. Follow the steps described earlier in
reverse order to reinstall the PCIE Board Bracket.

3.9.1 PCIE Board Features

Front View

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M7119FA77-IO PCIE Board

Specifications

Dual PCIE x24 lanes input and expansion to
(1) PCIEx16 + (10) DW PCIE x16 slots or
(1) PCIE x16 + (20) PCIE x8 slots

NOTE: There are 10 PCIE Card Jumpers on the PCIE Board.

PCIE x8/x16 Select Jumper:
3PHD_1, 3PHD_3, 3PHD_5, 3PHD_7, 3PHD_9, 3PHD_12,
3PHD_14, 3PHD_16, 3PHD_18, 3PHD_20

Pin 1-2 closed: Normal Mode (default)
Pin 2-3 closed: Insert PCIE x16 card to x8 slot.
PCI-E #1: 3PHD_1 PCI-E #12: 3PHD_12
PCI-E #3: 3PHD_3 PCI-E #14: 3PHD_14
PCI-E #5: 3PHD_5 PCI-E #16: 3PHD_16
PCI-E #7: 3PHD_7 PCI-E #18: 3PHD_18
PCI-E #9: 3PHD_9 PCI-E #20: 3PHD_20

Rear View

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3.10 Replacing the IO Bridge Board

Follow these instructions to replace the M2218-GF16/M2221-GF24 IO Bridge

Board.

1. Unscrew the M7119FA77-IO PCIE Board Bracket.

2. Flip the IO Bridge Bracket over and unscrew to replace the M2218-GF16 IO
Bridge Boards.

3. Follow the steps described earlier in reverse order to reinstall the IO Bridge
Bracket.

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3.10.1 IO Bridge Board Features

M2218-GF16 IO Bridge Board

Specifications

PCIE x24 lanes bridge board between S7119 and
M7119FA77-IO PCIE Board

M2221-GF24 IO Bridge Board

Specifications

PCIE x24 lanes bridge board between S7119 and
M7119FA77-IO PCIE Board

Front View

Front View

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3.11 Replacing the Rear IO Board

Follow these instructions to replace the M7119FA77-RIO Rear IO Board.

1. Unscrew the Rear IO Bracket.

2. Push both latches to pull the Rear IO Bracket out.

3. Unscrew to remove the iron bracket.

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4. Unscrew to lift up the pre-installed M7108-X550-2T LAN card.

5. Replace with a new Rear IO Board.

6. Follow the steps described earlier in reverse order to reinstall the Rear IO

Bracket.

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3.11.1 Rear IO Board Features

M7119FA77-RIO Rear IO Board

Specifications

 Rear I/O card for FA77-B7119
 Provide (1) 1G RJ-45 port for IPMI + (2) USB3.0

ports + (1) ID BTN w/ blue LED

 (1) FCI Board to board connector to mainboard
 (1) OCP type-A + (1) OCP type-B connector for NIC

OCP card

Front View

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3.12 Replacing the OCP Riser Card

Follow these instructions to replace the M2217-L16-IO OCP Riser Card.

1. Unscrew to lift up the M2217-L16-IO OCP Riser Card and replace with a new

one.

2. Follow the steps described earlier in reverse order to reinstall the OCP Riser

Card.

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3.12.1 OCP Riser Card Features

M2217-L16-IO OCP Riser Card

Specifications

 PCIE x16 support (1) OCPA slot + (1) OCPB slot

Front View

、

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3.13 Replacing the Motherboard

After removing all of the aforementioned cables and components, follow these
instructions to remove the motherboard from the chassis.

1. Disconnect all cables on the motherboard.

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2. Refer to 3.10 Replacing the Rear IO Board to remove the Rear IO Board

Bracket. Unscrew to lift up the Linkbar.

3. Use a hex screwdriver and Phillips screwdriver to loosen screws.

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4. Disconnect all cables on the motherboard.

5. Unscrew the motherboard to lift it up for replacement.

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Chapter 4: Motherboard Information

Caution!

3. To avoid damaging the motherboard and associated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

4. Do not apply power to the board if it has been
damaged.

You are now ready to install your motherboard.

How to install our products right… the first time

The first thing you should do is read this user’s manual. It contains important

information that will make configuration and setup much easier. Here are some
precautions you should take when installing your motherboard:

(1) Ground yourself properly before removing your motherboard from the

antistatic bag. Unplug the power from your computer power supply and
then touch a safely grounded object to release static charge (i.e. power
supply case). For the safest conditions, MiTAC recommends wearing a
static safety wrist strap.

(2) Hold the motherboard by its edges and do not touch the bottom of the

board, or flex the board in any way.

(3) Avoid touching the motherboard components, IC chips, connectors,

memory modules, and leads.

(4) Place the motherboard on a grounded antistatic surface or on the antistatic

bag that the board was shipped in.

(5) Inspect the board for damage.

The following pages include details on how to install your motherboard into your
chassis, as well as installing the processor, memory, disk drives and cables.

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4.1 Board Image

This picture is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above picture.

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4.2 Block Diagram

S7119 Block Diagram

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4.3 Motherboard Mechanical Drawing

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4.4 Board Parts, Jumpers and Connectors

This diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram. The
DIMM slot numbers shown above can be used as a reference when reviewing the
DIMM population guidelines shown later in the manual. For the latest board
revision, please visit our web site at http://www.tyan.com.

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Jumpers & Connectors

Connectors

1. COM2 Header (HD_COM2)

19. SATA Connector
(PCH_SATA_0123)

2. Power connector connect to
PCIE BOARD (PE_PW9)

20. SATA Connector
(PCH_SATA_4567)

3. Power connector connect to
PCIE BOARD (PE_PW8)

21. Power connector connect to
PCIE BOARD (PE_PW6)

4. Power connector connect to
GPU Card (PE_PW5)

22. Power connector connect to
GPU Card (PE_PW16)

5. Power connector connect to
GPU Card (PE_PW18)

23. USB Front panel Connector
(USB3_FPIO1)

6. Power connector connect to
GPU Card (PE_PW17)

24. USB TYPEA Connector
(TYPEA_USB3)

7. Power connector connect to
GPU Card (PE_PW11)

25. SSATA SGPIO Connector
(SSATA_SGPIO1)

8. Power connector connect to
GPU Card (PE_PW14)

26. VROC header (J51)

9. ITP Header (XDP1)

27. Power connector connect to
HDD BP (D4P_PW1)

10. CPU0 FAN Header
(CPU0_FAN_1)

28. Power connector connect to
HDD BP (D4P_PW3)

11. TPM and Port 80 Header
(DBG_HD1)

29. Power connector connect to
HDD BP (D4P_PW2)

12. Power connector connect to
GPU Card (PE_PW15)

30. Power connector connect to
HDD BP (PE_PW7)

13. Power connector connect to
GPU Card (PE_PW12)

31. CPU1 FAN Header
(CPU1_FAN_1)

14. Power connector connect to
GPU Card (PE_PW4)

32. IPMB Header (IPMB_HD1)

15. Power connector connect to
GPU Card (PE_PW13)

33. Front panel Connector (FPIO_1)

16. SSATA Connector
(PCH_SSATA_5)

34. Front panel VGA Header
(FPIO_VGA2)

17. SSATA Connector
(PCH_SSATA_4)

35. COM1 Header (HD_COM3)

18. SSATA Connector
(PCH_SSATA_0123)

36. System FAN Connector for
Barebone (J35)

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Jumpers

a ME Recovery Mode Jumper

(3PHD2)

Slots

A PCIE Slots (x24) connect to PCIE

Board (J1)

D OCULink (x8) (J8)

B PCIE slots (x24) connect to PCIE

Board (J7)

E OCULink (x8) (J9)

C PCIE slots (x16) connecto to

PCIE riser card (PEIC_5)

OPEN - Jumper OFF

Without jumper cover

CLOSED - Jumper ON

With jumper cover

Jumper Legend

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CPU0_FAN_1/CPU1_FAN_1: 4-Pin CPU FAN Connector

Pin

1 2 3 4 Signal

GND

P12V

FAN_TACH

FAN_PWM

Use this header to connect the cooling fan to your motherboard to keep the
system stable and reliable.
CPU0_FAN_1: CPU0 FAN Connector
CPU1_FAN_1: CPU1 FAN Connector

Signal

Pin

Pin

Signal

COM2_DCD

1

2

COM2_DSR

COM2_RXD

3

4

COM2_RTS

COM2_TXD

5

6

COM2_CTS

COM2_DTR

7

8

COM2_NRI

GND

9

10

NC

Signal

Pin

Pin

Signal

PW_LED+

1

2

FP_PWER(3.3V)

KEY

3

4

FP_ID_LED_PWR

PW_LED-

5

6

FP_ID_LED_N

HD_LED+

7

8

HWM_FAULT_LED-

HD_LED-

9

10

SYS_FAULT_LED-

PW_SW#

11

12

LAN1_ACTLED+

GND

13

14

LAN1_ACTLED-

RST_SW#

15

16

SDA

GND

17

18

SCL

FP_ID_LED_BTN_N

19

20

INTRUDER#

FPIO_TEMP_IN

21

22

LAN2_ACTLED+

NMI_SW#

23

24

LAN2_ACTLED-

Pin 1 2 3 4

Signal

GND

VCC3_AUX

GND

PCH_SATA_RAID_KEY

HD_COM3 / HD_COM2: COM Port Header

FPIO_1: Front Panel Header

J51: VROC Header (full featured RAID 0, 1, 10, 5, using Intel® VROC, for NVMe
SSD SKU)

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IPMB_HD1: IPMB Header

Signal

Pin

Pin

Signal

SMB_SDA2

1

2

GND

SMB_SCL2

3

4

NC

Signal

Pin

Pin

Signal

+5V

1

20

KEY

P0_RX_N

2

19

+5V

P0_RX_P

3

18

P1_RX_N

GND

4

17

P1_RX_P

P0_TX_N

5

16

GND

P0_TX_P

6

15

P1_TX_N

GND

7

14

P1_TX_P

P0_N

8

13

GND

P0_P

9

12

P1_N

OC_N

10

11

P1_P

Signal

Pin

Pin

Signal

SSRX-

5 1 +5V

SSRX+

6 2 USB DATA2-

GND 7 3

USB DATA2+

SSTX-

8 4 GND

SSTX+

9

Signal

Pin

Pin

Signal

SCL

1

2

SSDATA IN

SDA

3

4

SSDATA OUT

GND

5

6

SSLOAD

KEY

7

8

SSCLOCK

P3V3_AUX

9

10

NA

USB3_FPIO1: Front USB3.0 Header

TYPEA_USB3: Vertical Type-A USB3.0 Connector

SSATA_SGPIO1: SSATA SGPIO Pin Header

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FPIO_VGA2: Front Panel VGA Header

Signal

Pin

Pin

Signal

GND

1

2

VGA_5V

GND

3

4

HD_VGA_R

GND

5

6

HD_VGA_G

GND

7

8

HD_VGA_B

GND

9

10

HD_VGA_DAT

HD_VGA_HS

11

12

KEY

HD_VGA_CLK

13

14

HD_VGA_VS

Signal

Pin

Pin

Signal

TACH1

1

2

TACH6

TACH2

3

4

TACH7

TACH3

5

6

TACH8

TACH4

7

8

TACH9

TACH5

9

10

TACH10

GND

11

12

KEY

PWM2

13

14

PWM1

TACH11

15

16

SDA

TACH12

17

18

SCL

V3AUX1

19

20

PWM3

Signal

Pin

Pin

Signal

P3V3

1

2

FRAME_N

LAD0

3

4

KEY

LAD1

5

6

PLT_RST_N

LAD2

7

8

GND

LAD3

9

10

CLK_33M

DBG_SERIRQ

11

12

GND

DBG_PRES_N

13

14

VCC3_AUX

TPM_ADDR_MB

15

16

PCH_TPM_PP_EN

J35: Front Fan Connector (Reserved for Barebone Fan Board)

DBG_HD1: TYAN Module Header

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3PHD2: ME Recovery Mode Jumper

Pin 1-2 Closed: Normal (Default)

Pin 2-3 Closed: ME Recovery Mode

Pin 1 2 3 4

Signal

P12V_IN

GND

GND

VCC5

Signal

Pin

Pin

Signal

GND

1

5

P12V_IN

GND

2

6

P12V_IN

GND

3

7

P12V_IN

GND

4

8

P12V_IN

Signal

Pin

Pin

Signal

GND

1

5

P12V_IN

GND

2

6

P12V_IN

GND

3

7

P12V_IN

GND

4

8

P12V_IN

Signal

Pin

Pin

Signal

GND

1

5

P12V_IN

GND

2

6

P12V_IN

GND

3

7

P12V_IN

GND

4

8

P12V_IN

D4P_PW1 / D4P_PW2 / D4P_PW3: 4-pin Power Connector to HDD BP

PE_PW7: 8-pin Power Connector to HDD BP

PE_PW6/PE_PW8/PE_PW9: 8-pin Power Connector to PCIE Board

PE_PW4 / PE_PW5 / PE_PW11 / PE_PW12 / PE_PW13 / PE_PW14 / PE_PW15 /
PE_PW16 / PE_PW17 / PE_PW18: 8-pin Power Connector to GPU Card

NOTE: The 8-pin GPU power connector can support up to 20A.

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4.5 Thermal Interface Material

There are two types of
thermal interface materials
designed for use with the
processors.

The most common material
comes as a small pad
attached to the heat sink at
the time of purchase. There
should be a protective cover
over the material. Take care
not to touch this material.
Simply remove the protective
cover and place the heat sink
on the processor.

The second type of interface
material is usually packaged
separately. It is commonly

referred to as ‘thermal
compound’. Simply apply a

thin layer on to the CPU lid
(applying too much will
actually reduce the cooling).

NOTE: Always check with the manufacturer of the heat sink & processor to

ensure that the thermal interface material is compatible with the processor and
meets the manufacturer’s warranty requirements.

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4.6 Tips on Installing Motherboard in Chassis

Before installing your motherboard, make sure your chassis has the necessary
motherboard support studs installed. These studs are usually metal and are gold in
color. Usually, the chassis manufacturer will pre-install the support studs. If you are
unsure of stud placement, simply lay the motherboard inside the chassis and align
the screw holes of the motherboard to the studs inside the case. If there are any
studs missing, you will know right away since the motherboard will not be able to be
securely installed.

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NOTE: Be especially careful to look for extra stand-offs. If there are any stand-offs

present that are not aligned with a mounting hole on the motherboard, it will likely
short components on the back of the motherboard when installed. This will cause
malfunction and/or damage to your motherboard.

Some chassis include plastic studs instead of metal. Although the plastic studs are
usable, MITAC recommends using metal studs with screws that will fasten the
motherboard more securely in place.

Below is a chart detailing what the most common motherboard studs look like and
how they should be installed.

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4.7 Installing the Memory

Parameter

Possible Values

# of Channels

1, 2, 3, 4, 5 or 6

# of DIMMs Populated per channel

1DPC or 2DPC

DIMM Type

RDIMM (w/ECC), 3DS-RDIMM, LRDIMM, 3DS-LRDIMM, DCPMM

DIMM construction

 non-3DS RDIMM Raw Cards: A/B (2Rx4), C (1Rx4),

D (1Rx8), E (2Rx8)

 3DS RDIMM Raw Cards: A/B (4R/4)
 non-3DS LRDIMM Raw Cards: D/E (4Rx4)
 3DS LRDIMM Raw Cards: A/B (8Rx4)
 DPCMM

Before installing memory, ensure that the memory you have is compatible with the
motherboard and processor. Check the TYAN Web site at http://www.tyan.com for
details of the type of memory recommended for your motherboard.

 This platform supports (12)+(12) DDR4 RDIMM/RDIMM 3DS/LRDIMM/

LRDIMM 3DS 2933/2666

 Up to 768GB RDIMM/ 1,536GB LRDIMM/ 3,072GB RDIMM 3DS/LRDIMM 3DS

are supported

 1.2V DDR4 DIMMs are supported
 All installed memory will be automatically detected. No jumpers or settings

need to be changed for memory detection.

 All memory must be of the same type and density. Different memory types

can NOT be mixed and matched on the same motherboard.

 2933 MHz memory is supported by 2nd Generation Intel Xeon Scalable

Processor Platinum 8200 and Gold 6200 series processors only.

 16Gb-based memory modules are supported by 2nd Gen Intel Xeon

Scalable-SP processors only.

 Intel® Optane™ DC Persistent Memory Module (DCPMM) Implementation

Requirements
 DCPMM memory is supported by 2nd Generation Intel Xeon Scalable

Processor Platinum 8200, Gold 6200, Gold 5200 series and Silver 4215
processors only.

 All installed DCPMMs must be in the same size. Mixing DCPMMs of

different capacities is not supported.

 To maximize performance, balance all memory channels.
 No DDR4 1Rx8 for either DCPMM Memory Mode or App-Direct Mode
 Maximum 6 DCPMMs per processor (install 1 in each memory channel).
 Minimum 2 DCPMMs per processor (1 per memory controller).

Key Parameters for DIMM Configuration

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DIMM Location

NOTE:

1. √ indicates a populated DIMM slot.

2. Use paired memory installation for max performance.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Always install with CPU0 Socket first.

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Memory Population Table

Single CPU Installed

(CPU0 only)

Quantity of memory installed

1 2 3 4 6 8 12

CPU0_DIMM_A0

√ √ √ √ √ √ √

CPU0_DIMM_A1

√ √

CPU0_DIMM_B0

√ √ √ √ √ √

CPU0_DIMM_B1

√ √

CPU0_DIMM_C0

√ √ √

CPU0_DIMM_C1

√

CPU0_DIMM_D0

√ √ √ √

CPU0_DIMM_D1

√ √

CPU0_DIMM_E0

√ √ √ √

CPU0_DIMM_E1

√ √

CPU0_DIMM_F0

√ √

CPU0_DIMM_F1

√

Dual CPU Installed

(CPU0 and CPU1)

Quantity of memory installed

2 4 6 8 10

12

14

16

18

20

22

24

CPU0_DIMM_A0

√ √ √ √ √ √ √ √ √ √ √

√

CPU0_DIMM_A1

√ √ √ √ √

√

CPU0_DIMM_B0

√ √ √ √ √ √ √ √ √ √

√

CPU0_DIMM_B1

√ √ √ √

√

CPU0_DIMM_C0

√ √ √ √ √ √ √ √ √ √ CPU0_DIMM_C1

√ √ √

√

CPU0_DIMM_D0

√ √ √ √ √ √ √ √

√

CPU0_DIMM_D1

√ √

√

CPU0_DIMM_E0

√ √ √ √ √ √ √

√

CPU0_DIMM_E1

√

√

CPU0_DIMM_F0

√ √ √ √ √ √

√

CPU0_DIMM_F1

√

CPU1_DIMM_A0

√ √ √ √ √ √ √ √ √ √ √

√

CPU1_DIMM_A1

√ √ √ √ √

√

CPU1_DIMM_B0

√ √ √ √ √ √ √ √ √ √

√

CPU1_DIMM_B1

√ √ √ √ √ CPU1_DIMM_C0

√ √ √ √ √ √ √ √ √

√

CPU1_DIMM_C1

√ √ √

√

CPU1_DIMM_D0

√ √ √ √ √ √ √ √

√

CPU1_DIMM_D1

√ √

√

CPU1_DIMM_E0

√ √ √ √ √ √ √

√

CPU1_DIMM_E1

√

√

CPU1_DIMM_F0

√ √ √ √ √ √

√

CPU1_DIMM_F1

√

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DCPMM Support Location

Symmetric Population within the Socket

iMC1

iMC0

Channel F

Channel E

Channel D

Channel C

Channel B

Channel A

Modes

Slot 1

Slot 0

Slot 1

Slot 0

Slot 1

Slot 0

Slot 1

Slot 0

Slot 1

Slot 0

Slot 1

Slot 0

AD

DCPMM

DRAM1

DCPMM

DRAM1

DCPMM

DRAM1

DCPMM

DRAM1

DCPMM

DRAM1

DCPMM

DRAM1

2-2-2

MM

DCPMM

DRAM2

DCPMM

DRAM2

DCPMM

DRAM2

DCPMM

DRAM2

DCPMM

DRAM2

DCPMM

DRAM2

2-2-2

AD + MM

DCPMM

DRAM4

DCPMM

DRAM4

DCPMM

DRAM4

DCPMM

DRAM4

DCPMM

DRAM4

DCPMM

DRAM4

2-2-2

AD - DRAM1 - DRAM1

DCPMM

DRAM1 - DRAM1 - DRAM1

DCPMM

DRAM1

2-1-1

MM - DRAM3 - DRAM3

DCPMM

DRAM3 - DRAM3 - DRAM3

DCPMM

DRAM3

2-1-1

AD + MM

-

DRAM4 - DRAM4

DCPMM

DRAM4 - DRAM4 - DRAM4

DCPMM

DRAM4

2-1-1

AD - DRAM1

DCPMM

DRAM1

DCPMM

DRAM1 - DRAM1

DCPMM

DRAM1

DCPMM

DRAM1

2-2-1

MM - DRAM2

DCPMM

DRAM2

DCPMM

DRAM2 - DRAM2

DCPMM

DRAM2

DCPMM

DRAM2

2-2-1

AD + MM

-

DRAM4

DCPMM

DRAM4

DCPMM

DRAM4 - DRAM4

DCPMM

DRAM4

DCPMM

DRAM4

2-2-1

AD - DCPMM

-

DRAM1 - DRAM1 - DCPMM

-

DRAM1 - DRAM1

1-1-1

MM - DCPMM

-

DRAM2 - DRAM2 - DCPMM

-

DRAM2 - DRAM2

1-1-1

AD + MM

-

DCPMM

-

DRAM4 - DRAM4 - DCPMM

-

DRAM4 - DRAM4

1-1-1

AD - DCPMM

DRAM1

DRAM1

DRAM1

DRAM1 - DCPMM

DRAM1

DRAM1

DRAM1

DRAM1

2-2-1

Asymmetric Population within the Socket

iMC1

iMC0

Channel F

Channel E

Channel D

Channel C

Channel B

Channel A

Modes

Slot 1

Slot 0

Slot 1

Slot 0

Slot 1

Slot 0

Slot 1

Slot 0

Slot 1

Slot 0

Slot 1

Slot 0

AD - DRAM1 - DRAM1 - DRAM1 - DRAM1 - DRAM1

DCPMM

DRAM1

2-1-1

AD* - DRAM1 - DRAM1 - DRAM1 - DRAM1 - DRAM1

DCPMM

DRAM1

2-1-1

DDR4 Type

Capacity

DRAM1

RDIMM

3DS RDIMM

LRDIMM

3DS LRDIMM

Any Capcity

DRAM2

RDIMM

3DS RDIMM

LRDIMM

3DS LRDIMM

Any Capacity and Preferably, >=32GB

DRAM3

RDIMM - - - 16GB or 32GB

DRAM4

RDIMM

3DS RDIMM

LRDIMM

Any Capacity

 * 2nd socket has no DCPMM DIMM
 Mode definitions: AD=App Direct Mode, MM=Memory Mode, AD+MM=Mixed

Mode

 For MM, general DDR4+DCPMM ratio is between 1:4 and 1:16. Excessive

capacity for DCPMM can be used for AD.

 For each individual population, rearrangements between channels are allowed

as long as the resulting population is consistent to Purley PDG rules

 For each individual population, the same DDR4 DIMM has to used in all slots,

as specified by the Purley PDG rules

 For each individual population, sockets are normally symmetric with exceptions

for 1 DCPMM per socket and 1 DCPMM per node case.

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4.8 Finishing Up

Congratulations on making it this far! You have finished setting up the hardware
aspect of your computer. Before closing up your chassis, make sure that all cables
and wires are connected properly, especially SATA cables and most importantly,
jumpers. You may have difficulty powering on your system if the motherboard
jumpers are not set correctly.
In the rare circumstance that you have experienced difficulty, you can find help by
asking your vendor for assistance. If they are not available for assistance, please
find setup information and documentation online at our website or by calling your
vendor’s support line.

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Chapter 5: BIOS Setup

Key

Function

Left/Right Arrow Keys

Change from one menu to the next

Up/Down Arrow Keys

Move between selections

Enter

Open highlighted section

PgUp/PgDn Keys

Change pages

+/-

Change options

ESC

Exit

5.1 About the BIOS

The BIOS is the basic input/output system, the firmware on the motherboard that
enables your hardware to interface with your software. The BIOS determines what a
computer can do without accessing programs from a disk. The BIOS contains all the
code required to control the keyboard, display screen, disk drives, serial
communications, and a number of miscellaneous functions. This chapter describes
the various BIOS settings that can be used to configure your system.

The BIOS section of this manual is subject to change without notice and is provided
for reference purposes only. The settings and configurations of the BIOS are current
at the time of print and are subject to change, and therefore may not match exactly
what is displayed on screen.

This section describes the BIOS setup program. The setup program lets you modify
basic configuration settings. The settings are then stored in a dedicated,
battery-backed memory (called NVRAM) that retains the information even when the
power is turned off.

To start the BIOS setup utility:

1. Turn on or reboot your system.

2. Press <Del> or <F2> during POST (Del on remote console) to start the BIOS
setup utility.

5.1.1 Setup Basics

The table below shows how to navigate in the setup program using the keyboard.

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5.1.2 Getting Help

NOTE: The following pages provide the details of BIOS menu. Please be noticed

that the BIOS menu are continually changing due to the BIOS updating. The BIOS
menu provided are the most updated ones when this manual is written. Please visit
TYAN’s website at http://www.tyan.com for the information of BIOS updating.

Pressing [F1] will display a small help window that describes the appropriate
keys to use and the possible selections for the highlighted item. To exit the Help
Window, press [ESC] or the [Enter] key again.

5.1.3 In Case of Problems

If you have trouble booting your computer after making and saving the changes with
the BIOS setup program, you can restart the computer by holding the power button
down until the computer shuts off (usually within 4 seconds); resetting by pressing
CTRL-ALT-DEL; or clearing the CMOS.
The best advice is to only alter settings that you thoroughly understand. In particular,
do not change settings in the Chipset section unless you are absolutely sure of what
you are doing. The Chipset defaults have been carefully chosen either by MITAC or
your system manufacturer for best performance and reliability. Even a seemingly
small change to the Chipset setup options may cause the system to become
unstable or unusable.

5.1.4 Setup Variations

Not all systems have the same BIOS setup layout or options. While the basic look
and function of the BIOS setup remains more or less the same for most systems, the
appearance of your Setup screen may differ from the charts shown in this section.
Each system design and chipset combination requires a custom configuration. In
addition, the final appearance of the Setup program depends on the system
designer. Your system designer may decide that certain items should not be
available for user configuration, and remove them from the BIOS setup program.

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