Tyan FT77B-B7059 User Manual

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FT77B-B7059

Service Engineer’s Manual

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PREFACE

This publication, including all photographs, illustrations, and software, is protected under international copyright laws, with all rights reserved. Neither this manual, nor any material contained herein, may be reproduce d without written consent of manufacturer.

Version 1.0

Disclaimer

Information contained in this document is furnished by MiTAC International Corporation and has been reviewed for accuracy and reliability prior to printing. MiTAC assumes no liability whatsoever, and disclaims any express or implie d

warranty, relating to sale and/or use of TYAN® products including liability or warranties relating to fitness for a particular purpose or merchantability. MiTAC retains the right to make changes to produce descriptions and/or specifications at any time, without notice. In no event will MiTAC be held liable for any direct or indirect, incidental or consequential damage, loss of use, loss of data or other malady resulting from errors or inaccuracies of information conta ined in this document.

Trademark Recognition

All registered and unregistered trademarks and company names contain ed in this manual are property of their respective owners including, but not limited to the following.

TYAN® is a trademark of MiTAC International Corporation.

is a trademark of Intel® Corporation.

Intel

AMI

, AMIBIOS® and combinations thereof are trademarks of AMI Technologies. Microsoft®, Windows® are trademarks of Microsoft Corporation.

, PC®, AT® and PS/2® are trademarks of IBM Corporation.

IBM Winbond

is a trademark of Winbond Electronics Corporation.

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FCC Declaration

Notice for the US

Compliance Information Statement (Declaration of Conformity Procedure) DoC FCC Part 15: This device complies with part 15 of the FCC Rules

This device complies with Part 15 of the FCC Rules. Operation is subject to the following conditions:

 This device must not cause harmful interference.  This device must accept any interference received, including

interference that may cause undesirable operation.

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

Notice for Canada

This Class A digital apparatus complies with Canadian ICES-003. Cet appareil numérique de la Classe A est conforme à la norme NMB-003 du Canada.

CAUTION: Lithium battery included with this board. Do not puncture, mutilate, or dispose of battery in fire. There will be danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by manufacturer. Dispose of used battery according to manufacturer instructions and in accordance with your local regulations.

Notice for Europe (CE Mark)

This product is in conformity with the Council Directive 2004/108/EC.

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About this Manual

This manual is intended for experienced users and integrators with hardware knowledge of personal computers. It is aimed to provide you with instructions on installing your TYAN FT77B-B7059.

How this guide is organized

This guide contains the following parts:

Chapter 1: Overview

This chapter provides an introduction to the TYAN FT77B-B7059 barebones and standard parts list, describes the external components, gives an overview of the product from different angles.

Chapter 2: Setting Up

This chapter covers procedures on installing the processors, memory modules, hard drivers and other optional parts.

Chapter 3: Replacing the Pre-installed Components

This chapter covers the removal and replacement procedures for pre-installed components.

Chapter 4: Motherboard Information

This chapter lists the hardware setup procedures that you need to abide by when installing system components. It includes description of the jumpers and connectors on the motherboard.

Chapter5: BIOS Setup

This chapter tells how to change system settings through the BIOS setup menu. Detailed descriptions of the BIOS parameters are also provided.

Chapter 6: Diagnostics

This chapter introduces some BIOS codes and technical terms to provide better service for the customers.

Appendix: This chapter provides the cable connection table, the FRU parts list for ref erence of system setup, and technical support in case a problem arises with your system.

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Safety and Compliance Information

Before installing and using TYAN FT77B-B7059, take not e of the following precautions:

·Read all instructions carefully.

·Do not place the unit on an unstable surface, cart, or stand.

·Do not block the slots and opening on the unit, which are provided for

ventilation.

Only use the power source indicated on the marking labe l. If you are not

sure, contact the power company.

·The unit uses a three-wire ground cable, which is equipped with a third pin to ground the unit and prevent electric shock. Do not defeat the purpose of this pin. If your outlet does not support this kind of plug, contact your electrician to replace your obsolete outlet.

·Do not place anything on the power cord. Place the power cord where i t will not be in the way of foot traffic.

·Follow all warnings and cautions in this manual and on the unit case.

·Do not push objects in the ventilation slots as they may touch high voltage

components and result in shock and damage to the components.

·When replacing parts, ensure that you use parts specified by the

manufacturer.

·When service or repairs have been done, perform routine safety checks to verify that the system is operating correctly.

·Avoid using the system near water, in direct sunlight, or near a heating device.

·Cover the unit when not in use.

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Safety Information

Retain and follow all product safety and operating instructions provided with your equipment. In the event of a conflict between the instructions in this guide and the instructions in equipment documentation, follow the guidelines in the equipment documentation.

Observe all warnings on the product and in the operating instructions. To reduce the risk of bodily injury, electric shock, fire and damage to the equipment, observe all precautions included in this guide.

You must become familiar with the safety information in this guide before you install, operate, or service TYAN products.

Symbols on Equipment

Caution. This symbol indicates a potential hazard.

The potential for injury exists if cautions are not observed. Consult equipment documentation for specific details.

Caution. Slide-mounted equipment is not to be used as a shelf or a work space.

Warning. This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.

Warning. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. To reduce risk of injury from a hot component, allow the surface to cool before touching.

General Precautions

· Follow all caution and warning instructions marked on the equipment and explained in the accompanying equipment documentation.

Machine Room Environment

· This device is for use only in a machine room or IT room.

 · Make sure that the area in which you install the s ystem is properly

ventilated and climate-controlled.

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· Ensure that the voltage and frequency of your power source match the voltage and frequency inscribed on the electrical rating label of the equipment.

· Do not install the system in or near a plenum, air duct, radiator, or heat register.

· Never use the product in a wet location.

Equipment Chassis

· Do not block or cover the openings to the system.

· Never push objects of any kind through openings in the equipment.

Dangerous voltages might be present.

· Conductive foreign objects can produce a short circuit and cause fire, electric shock, or damage to your equipment.

· Lift equipment using both hands and with your knees bent.

Equipment Racks

To avoid injury or damage to the equipment:

· Observe local occupational health and safety requirements and guidelines for manual materials handling.

· Do not attempt to move a rack by yourself; a minimum of two people are needed to move a rack.

· Do not attempt to move a fully loaded rack. Remove equipment from the rack before moving it.

· Do not attempt to move a rack on an incline that is greater than 10 degrees from the horizontal.

· Make sure the rack is properly secured to the floor or ceiling.

· Make sure the stabilizing feet are attached to the rack if it is a single-rack

installation.

· Make sure racks are coupled together if it is a multiple-rack installation.

· Make sure the rack is level and stable before installing an appliance in the

rack.

· Make sure the leveling jacks are extended to the floor.

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· Make sure the full weight of the rack rests on the leveling jacks.

· Always load the rack from the bottom up. Load the heaviest component in

the rack first.

· Make sure the rack is level and stable before pulling a component out of the rack.

· Make sure only one component is extended at a time. A rack might become unstable if more than one component is extended.

To avoid damage to the equipment:

· The rack width and depth must allow for proper serviceability and cable management.

· Ensure that there is adequate airflow in the rack. Improper installation or restricted airflow can damage the equipment.

· The rack cannot have solid or restricted airflow doors. You must use a mesh door on the front and back of the rack or remove the doors to ensure adequate air flow to the system.

· If you install the Model in a rack, do not place equipment on top of the unit. It will cause restricted airflow and might cause damage to the equipment.

Make sure the product is properly matted with the rails. Products that are

improperly matted with the rails might be unstable.

Verify that the AC power supply branch circuit that provides power to the

rack is not overloaded. This will reduce the risk of personal injury, fire, or damage to the equipment. The total rack load should not exceed 80 percent of the branch circuit rating. Consult the electrical authority having jurisdiction over your facility wiring and installation requirements.

· Verify that the AC power supply branch circuit that provides power to the

Verify that the AC power supply branch circuit that provides power to the

· When use 100V-127VAC input: The system does not support redundant PSU operation if the total system load exceeds 20A.

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Equipment Power Cords

· Use only the power cords and power supply units provided with your system. The system might have one or more power cords.

· Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times.

· In all European electrical environments, you must ground the Green/Yellow tab on the power cord. If you do not ground the Green/Yellow tab, it can cause an electrical shock due to high leakage currents.

Do not place objects on AC power cords or cables. Arrange them so that no

one might accidentally step on or trip over them.

· Do not pull on a cord or cable. When unplugging from the electrical outlet, grasp the cord by the plug.

· To reduce the risk of electrical shock, disconnect all power cords before servicing the appliance.

Equipment Batteries

· The system battery contains lithium manganese dioxide. If the battery pack

is not handled properly, there is risk of fire and burns.

· Do not disassemble, crush, puncture, short external contacts, or dispose of

the battery in fire or water.

· Do not expose the battery to temperatures higher than 60°C (140°F).

· The system battery is not replaceable. If the battery is replaced by an

incorrect type, there is danger of explosion. Replace the battery only with a spare designated for your product.

· Do not attempt to recharge the battery.

· Dispose of used batteries according to the instructions of the manufacturer.

Do not dispose of batteries with the general household waste. To forward them to recycling or proper disposal, use the public collection system or return them to TYAN, your authorized TYAN partner, or their agents.

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Equipment Modifications

· Do not make mechanical modifications to the system. TYAN is not

responsible for the regulatory compliance of T YAN equipment that has been modified.

Equipment Repairs and Servicing

· The installation of internal options and routine maintenance and service of

this product should be performed by individuals who are knowledgeable about the procedures, precautions, and hazards associated with equipment containing hazardous energy levels.

· Do not exceed the level of repair specified in the procedures in the product

documentation. Improper repairs can create a safety hazard.

· Allow the product to cool before removing covers and touching internal

components.

· Remove all watches, rings, or loose jewelry when working before removing

covers and touching internal components.

· Do not use conductive tools that could bridge live parts.

· Use gloves when you remove or replace system components; they can

become hot to the touch.

· If the product sustains damage requiring service, disconnect the product

from the AC electrical outlet and refer servicing to an authorized service provider. Examples of damage requiring service include:

– The power cord, extension cord, or plug has been damaged. – Liquid has been spilled on the product or an object has fallen into the

product. – The product has been exposed to rain or water. – The product has been dropped or damaged. – The product does not operate normally when you follow the op erating

instructions.

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Table of Contents

Chapter 1: Overview....................................................................... 17

1.1 About the TYAN FT77B-B7059 .............................................. 17

1.2 Product Models ....................................................................... 17

1.3 Features .................................................................................. 18

1.4 Standard Parts List ................................................................. 22

1.4.1 Box Contents.................................................................... 22

1.4.2 Accessories ..................................................................... 22

1.5 About the Product ................................................................... 24

1.5.1 System Front View ........................................................... 24

1.5.2 System Rear View ........................................................... 26

1.5.3 LED Definitions ................................................................ 27

1.5.4 System Top View ............................................................. 29

Chapter 2: Setting Up ..................................................................... 31

2.0.1 Before you Begin ............................................................. 31

2.0.2 Work Area ........................................................................ 31

2.0.3 Tools ................................................................................ 31

2.0.4 Precautions ...................................................................... 32

2.1 Installing Motherboard Components ...................................... 33

2.1.1 Removing the Chassis Cover and Air Duct ..................... 33

2.1.2 Installing the CPU and Heatsink ...................................... 35

2.1.3 Installing the Memory ...................................................... 38

2.1.4 Installing the Expansion Cards ........................................ 39

2.1.6 Installing the Mezzanine Card ......................................... 41

2.1.7 Installing Hard Drives ...................................................... 43

2.2 Rack Mounting ........................................................................ 47

2.2.1 Installing the Server in a Rack ......................................... 47

2.2.2 Installing the inner Rails to the Chassis .......................... 48

2.2.3 Installing the Outer Rails to the Rack .............................. 49

2.2.4 Rack mounting the Server ............................................... 49

Chapter 3: Replacing Pre-Installed Components ........................ 51

3.0.1 Introduction ...................................................................... 51

3.0.2 Disassembly Flowchart .................................................... 51

3.1 Removing the Cover ............................................................... 52

3.2 Replacing the Power Supply .................................................. 52

3.3 Replacing the Power Distribution Board ................................. 53

3.3.1 Power Distribution Board Features ................................. 54

3.3.2 Pin Definitions .................................................................. 55

3.4 Replacing the Power Backplane Board .................................. 56

3.4.1 Power Backplane Board Features ................................... 57

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3.4.2 Pin Definitions .................................................................. 58

3.5 Replacing the Riser Card ....................................................... 59

3.5.1 Riser Card Features ........................................................ 61

3.6 Replacing the System Fan ..................................................... 62

3.6.1 Fan Board Features ......................................................... 64

3.6.2 Pin Definitions .................................................................. 65

3.7 Replacing the Front Panel Board ........................................... 66

3.7.1 Front Panel Board Features ............................................ 67

3.7.2 Pin Definitions .................................................................. 68

3.8 Replacing the Motherboard .................................................... 69

Chapter 4: Motherboard Information ............................................ 71

4.1 Board Image ........................................................................... 72

4.2 Block Diagram ........................................................................ 73

4.3 Motherboard Mechanical Drawing .......................................... 74

4.4 Board Parts, Jumpers and Connectors .................................. 75

4.5 Thermal Interface Material ...................................................... 85

4.6 Tips on Installing Motherboard in Chassis ............................. 86

4.7 Installing the Memory ............................................................. 88

4.8 PLXPXE8747 LED Definition.................................................. 93

4.9 Finishing Up ............................................................................ 94

Chapter 5: BIOS Setup ................................................................... 95

5.1 About the BIOS ....................................................................... 95

5.1.1 Setup Basics .................................................................... 95

5.1.2 Getting Help ..................................................................... 96

5.1.3 In Case of Problems ........................................................ 96

5.1.4 Setup Variations .............................................................. 96

5.2 Main Menu .............................................................................. 97

5.3 Advanced Menu ...................................................................... 98

5.3.1 PCI Subsystem Settings ................................................ 100

5.3.2 ACPI Settings ................................................................ 102

5.3.3 Trusted Computing ........................................................ 103

5.3.4 CPU Configuration ......................................................... 104

5.3.5 Runtime Error Logging .................................................. 109

5.3.6 SATA Configuration ....................................................... 110

5.3.7 SAS Configuration ......................................................... 111

5.3.8 Onboard Device Configuration ...................................... 112

5.3.9 PCIe Slot Configuration ................................................. 113

5.3.10 USB Configuration ......................................................... 114

5.3.11 Info Report Configuration .............................................. 115

5.3.12 Hardware Health Configuration ..................................... 116

5.3.13 Super IO Configuration .................................................. 118

5.3.14 Serial Port Console Redirection .................................... 120

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5.4 Chipset Menu ....................................................................... 125

5.4.1 North Bridge .................................................................. 126 

5.4.2 South Bridge .................................................................. 133

5.4.3 WatchDog Timer Configuration ..................................... 134

5.5 Boot ..................................................................................... 135

5.5.1 Network Device BBS Priorities ...................................... 137

3.5.2 CSM Parameters ........................................................... 138 

5.5.3 Delete Boot Option ........................................................ 140

5.6 Security ................................................................................. 141

5.7 Server Management ............................................................. 142

5.7.1 System Event Log ......................................................... 143

5.7.2 BMC Network Configuration .......................................... 144

5.8 Event Logs ............................................................................ 145

5.9 Save & Exit ........................................................................... 146

Chapter 6: Diagnostics ................................................................ 149

6.1 Flash Utility ........................................................................... 149

6.2 AMIBIOS Post Code (Aptio) ................................................. 150

Appendix I: Cable Connection Tables ........................................ 159

Appendix II: Fan and Temp Sensors .......................................... 161

Appendix III: FRU Parts Table ..................................................... 167

Appendix IV: Technical Support ................................................. 169

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NOTE

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Chapter 1: Overview

1.1 About the TYAN FT77B-B7059

Congratulations on your purchase of the TYAN® FT77B-B7059, a highly optimized 4U rack-mountable barebone system. The FT77B-B7059 is designed to support dual

Intel

Xeon E5-2600 Series Processors and up to 192GB UDIMM and 384GB

RDIMM, providing a rich feature set and incredible performance. Leveraging advanced technology from Intel offering scalable 32 and 64-bit computing, high bandwidth memory design, and lightning-fast PCI-E bus implementation. The FT77B-B7059 not only empowers your company in nowadays IT demand but also offers a smooth path for future application usage.

TYAN

also offers the FT77B-B7059 in a version that can support up to ten 2.5” or

3.5” hard drives. The FT77B-B7059 uses TYAN’s latest chassis featuring a rob ust structure and a solid mechanical enclosure. All of this provides FT77B-B7059 the power and flexibility to meet the needs of nowadays server application.

, the FT77B-B7059 server system is capable of

1.2 Product Models

The system boards within the Tyan MicroServer blades contain different features and chipsets, which are defined by the following models:



B7059F77BV10R-2T: Intel-based platform



B7059F77BV10R: Intel-based platform

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1.3 Features

TYAN FT77BB7059 (B7059F77BV10R-2T)

Form Factor 4U Rackmount Gross Weight 35 kg

System

Front Panel

External Drive Bay

System Cooling Configuration

Power Supply

Processor

Chipset PCH Intel C602

Memory

Expansion Slots

Chassis Model FT77B

Dimension (D x W x H)

Motherboard S7059GM2NR-2T Buttons (1) RST / (1) ID / (1) PWR w/ LED LEDs (1) HDD / (2) LAN / (1) ID / (1) IPMI/Warning I/O Ports (2) USB ports Type / Q'ty (10) 3.5"/2.5" HDDs

Supported HDD Interface

FAN (5+1) hot-swap 12cm fans Efficiency 80 plus Platinum

Redundancy 2+1 Serviceability Hot-swap Input Range 100-127V AC / 200-240V AC Output Watts 3,200 Watts

Supported CPU Series

Socket Type / Q'ty LGA2011 / (2)

Thermal Design Power (TDP) wattage

System Bus

Supported DIMM Qty

DIMM Type / Speed

Capacity

Memory channel 4 Channels per CPU Memory voltage 1.5V or 1.35V

PCI-E

PCI (1) PCI 32-bit slot Recommended M7059F77-QDR-2, Dual QSFP IB mezzanie card

30.31" x 17.24" x 6.93" (770 x 438 x 176mm)

(2) SATA 6Gb/s / (4) SATA 3Gb/s / (1) Mini-SAS (4port w/ SATA 3Gb/s)

Intel Xeon Processor E5-2600/E5-2600 v2 series processors

Max up to 150W

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath Interconnect (QPI) support

(12)+(12) DIMM slots RDIMM ECC 1866/1600/1333/1066 /

UDIMM/LRDIMM ECC 1866/1600/1333/1066 up to 192GB UDIMM / 384GB RDIMM / 768GB

LRDIMM

(8) PCI-E Gen3 x16 slots / (2) PCI-E Gen3 x8 slots(one for mezzanine card) / (3) PCI-E Gen2 x1 slots

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TYAN Mezzanie Card

LAN

Storage SATA

Graphic

I/O Ports

System Monitoring

Server Management

BIOS

Operating System

Regulation

Operating Environment

RoHS RoHS 6/6 Compliant Yes

Package Contains

Port Q'ty (2) 10GbE ports (1 port shared with IPMI) Controller Intel X540-AT2

Connector

Controller Intel C602 Speed (2) 6.0 Gb/s, (8) 3.0 Gb/s

RAID RAID 0/1/10/5 (Intel RST) Connector type D-Sub 15-pin Chipset Aspeed AST2300 USB (2) ports (via a dongle cable) VGA (1) D-Sub 15-pin port (via a dongle cable) RJ-45 (2) ports (1 port shared with IPMI) Chipset Aspeed AST2300

Voltage

Temperature Monitors temperature for CPU & memory

LED

Others Watchdog timer support Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI Feature

AST2300 iKVM Feature

Brand / ROM size AMI / 8MB

Feature

OS supported list Please refer to our Intel OS supported list. FCC (DoC) Class A

CE (DoC) Yes Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp.

In/Non-operating Humidity

Barebone (1) FT77B-B7059 Barebone Manual (1) Quick Installation Guide

(40Gb/s) / M7059F77-FDR-2, Dual QSFP IB mezzanie card (56Gb/s)

(2) Mini-SAS (4-ports) + (2) SATA (totally support 10 ports)

Monitors voltage for CPU, memory, chipset & power supply

Fan fail LED indicator / Over temperature warning indicator / Fan & PSU fail LED indicator

IPMI 2.0 compliant baseboard management controller (BMC) / Supports storage over IP and remote platform-flash / USB 2.0 virtual hub

24-bit high quality video compression / 10/100 Mb/s MAC interface

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE boot / ACPI 2.0 power management /Power on mode after power recovery / User-configurable H/W monitoring / Auto-configurable of hard disk types

- 40° C ~ 70° C (-40° F ~ 158° F)

90%, non-condensing at 35° C

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Installation CD (1) TYAN installation CD Cable Others (1) via a dongle cable

TYAN FT77BB7059 (B7059F77BV10R)

Form Factor 4U Rackmount Gross Weight 35 kg

System

Front Panel

External Drive Bay

System Cooling Configuration

Power Supply

Processor

Chipset PCH Intel C602

Memory

Expansion Slots PCI-E

Chassis Model FT77B

Dimension (D x W x H)

30.31" x 17.24" x 6.93" (770 x 438 x 176mm)

Motherboard S7059GM2NR Buttons (1) RST / (1) ID / (1) PWR w/ LED LEDs (1) HDD / (2) LAN / (1) ID / (1) IPMI/Warning I/O Ports (2) USB ports Type / Q'ty (10) 3.5"/2.5" HDDs

Supported HDD Interface

(2) SATA 6Gb/s / (4) SATA 3Gb/s / (1) Mini-SAS (4port w/ SATA 3Gb/s)

FAN (5+1) hot-swap 12cm fans Efficiency 80 plus Platinum

Redundancy 2+1 Serviceability Hot-swap Input Range 100-127V AC / 200-240V AC Output Watts 3,200 Watts

Supported CPU Series

Intel Xeon Processor E5-2600/E5-2600 v2 series processors

Socket Type / Q'ty LGA2011 / (2)

Thermal Design Power (TDP)

Max up to 150W

wattage

System Bus

Supported DIMM Qty

DIMM Type / Speed

Capacity

Up to 8.0/ 7.2/ 6.4 GT/s with Intel QuickPath Interconnect (QPI) support

(12)+(12) DIMM slots RDIMM ECC 1866/1600/1333/1066 /

UDIMM/LRDIMM ECC 1866/1600/1333/1066 up to 192GB UDIMM / 384GB RDIMM / 768GB

LRDIMM

Memory channel 4 Channels per CPU Memory voltage 1.5V or 1.35V

(8) PCI-E Gen3 x16 slots / (2) PCI-E Gen3 x8 slots(one for mezzanine card) / (3) PCI-E Gen2 x1 slots

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PCI (1) PCI 32-bit slot

Recommended TYAN Mezzanie Card

LAN

Storage SATA

Graphic

I/O Ports

System Monitoring

Server Management

BIOS

Operating System

Regulation

Operating Environment

RoHS RoHS 6/6 Compliant Yes

Port Q'ty (2) GbE ports (1 port shared with IPMI) Controller Intel I350-BT2

Connector

Controller Intel C602

Speed (2) 6.0 Gb/s, (8) 3.0 Gb/s

Voltage

Temperature Monitors temperature for CPU & memory

LED

Others Watchdog timer support Onboard Chipset Onboard Aspeed AST2300

AST2300 IPMI Feature

AST2300 iKVM Feature

Brand / ROM size AMI / 8MB

Feature

OS supported list Please refer to our Intel OS supported list. FCC (DoC) Class A

CE (DoC) Yes Operating Temp. 10° C ~ 35° C (50° F~ 95° F)

Non-operating Temp.

In/Non-operating Humidity

M7059F77-QDR-2, Dual QSFP IB mezzanie card (40Gb/s) / M7059F77-FDR-2, Dual QSFP IB mezzanie card (56Gb/s)

(2) Mini-SAS (4-ports) + (2) SATA (totally support 10 ports)

Monitors voltage for CPU, memory, chipset & power supply

Fan fail LED indicator / Over temperature warning indicator / Fan & PSU fail LED indicator

IPMI 2.0 compliant baseboard management controller (BMC) / Supports storage over IP and remote platform-flash / USB 2.0 virtual hub

24-bit high quality video compression / 10/100 Mb/s MAC interface

Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE boot / ACPI 2.0 power management /Power on mode after power recovery / User-configurable H/W monitoring / Auto-configurable of hard disk types

- 40° C ~ 70° C (-40° F ~ 158° F)

90%, non-condensing at 35° C

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Barebone (1) FT77B-B7059 Barebone

Package Contains

Manual (1) Quick Installation Guide Installation CD (1) TYAN installation CD Cable Others (1) via a dongle cable

1.4 Standard Parts List

This section describes FT77B-B7059 package contents and accessories . Open the box carefully and ensure that all components are present and undamaged. The product should arrive packaged as illustrated below.

1.4.1 Box Contents

FT77B-B7059 Chassis Kit

 (1) 4U chassis  (3) DELTA,DPS-1600CB A,1600W Power Supply (pre-installed)  (6) 120X120X38MM Fan (pre-installed)  (1) S7059 Mother Board (pre-installed)  (1) M1008 Front Panel Board (pre-installed)  (1) M7059F77-D-PDB Power Distribution Board (pre-installed)  (1) M7059F77-D-PBP Power Backplane (pre-installed)  (1) M1809F77A-FB Fan Board (pre-installed)  (1) M2210-L8-1F riser card (pre-installed)

1.4.2 Accessories

If any items are missing or appear damaged, contact your retailer or browse to TYAN’s website for service: http://www.tyan.com

FT77B-B7059 Accessory Kit

 (1) Rail kit  (2) CPU heatsink  (3) US power cord  (3) EU power cord  (1) Mounting ears  (8) 2*3P GPU power cable  (8) 2*4P GPU power cable  (1) Display port cable  (1) 3.5” HDD screw pack  (1) 2.5” HDD screw pack  (1) HDD rubber kit

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 (1) TYAN Installation CD  (8) GPU card holder BKT(Only for GPU card bundle SKU) w/ screw

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1.5 About the Product

The following views show you the product.

1.5.1 System Front View

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M1008 Front Panel LED Control Board

Switch and LED Indication

Item Status

Access Green Blinking

5. LAN1 Off Link Green Off Access Green Blinking

6. LAN2 Off Link Green Off Access Green Blinking

7. LAN3 Off Link Green Off

8. Power

9. ID

10. HDD Access Green Blinking

11. IPMI / Warning

＊Warning LED Indication for 2+1 PSU Redundancy System

Power On Green Solid On Power Off Green Off Located Blue Solid On Free Blue Off

Normal Amber Off Alert Amber Solid On

LED Color

Behavior Note

Link Green Solid On

BMC & HWM system alert event (＊) N+1 Redundant

PSU Indication

Status System Warning LED

All PSU present and plug AC cord when system power on

One of PSU AC lose Amber solid on One of PSU not present Amber solid on

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Off

1.5.2 System Rear View

No. Description 1 Power Supply 2 PCIE x8 Slot for Mezzanine Card (optional) 3 ID LED Button 4 VGA/USB Port via a dongle cable 5 LAN2 6 LAN1 7 ID LED 8 Expansion Slots

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1.5.3 LED Definitions

10Gbps LAN Port LAN Indication

10Gbps LAN Link/Activity LED Scheme

Left LED

(Link/Activity)

LED Color: Green

Right LED

(Speed)

LED Color: Yellow

No Link OFF OFF

100 Mbps

1000 Mbps

(1Gbps)

10 Gbps

Link Green Solid On Green Solid On

Active Green Blinking Green Solid On

Link Green Solid On Yellow Solid On

Active Green Blinking Yellow Solid On

Link Yellow Solid On Yellow Solid On

Active Yellow Blinking Yellow Solid On

1Gbps LAN Port LAN Indication

1Gbps LAN Link/Activity LED Scheme

Left LED

(Link/Activity)

No Link OFF OFF

10 Mbps

100 Mbps

1000 Mbps

(1Gbps)

Link Green Solid On OFF

Active Green Blinking OFF

Link Green Solid On Green Solid On

Active Green Blinking Green Solid On

Link Green Solid On Amber Solid On

Active Green Blinking Amber Solid On

LED Color: Green

Right LED

(Speed)

LED Color: Amber

NOTE: “Left” and “Right” are viewed from the rear panel.

NOTE:

1. When i350 LAN chip is on, LAN1 and LAN2 can support 10Mbps~1Gbps.

2. When X540 LAN chip is on, LAN1 and LAN2 can support up to 100Mbps~10Gbps.

3. Peripheral devices can be plugged straight into any of these ports but software may be required to complete the installation.

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PSU LED Definitions

Dual-colo

Power Supply Condition Green LED

No AC power to all power supplies OFF OFF Power supply critical event causing a shutdown; failure, OCP, OVP, Fan Fail, OTP, UVP Power supply warning events where the power supply continues to operate; but triggered high Temperature, high Voltage, high Current, and low fan rpm critical limit. AC present only 12VSB on (PS off) or PS in Smart Redundant state Output ON and OK ON OFF AC cord unplugged OFF ON

OFF ON

OFF

1Hz Blinking Green OFF

mber LED

1Hz Blinking

Amber

Warning: All PSUs have to be AC-ON at the same time before you power on the

system.

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1.5.4 System Top View

No. Description 1 M1008 Front Panel LED Control Board 2 Ten 2.5”/3.5” HDD Trays 3 System Fans 4 M7059F77-D-PDB Power Distribution Board 5 M7059F77-D-PBP Power Backplane Board 6 Power Supply Cage

NOTE: The system is pre-installed with S7059 motherboard.

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NOTE

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2.0.1 Before you Begin

This chapter explains how to install the CPUs, CPU heatsinks, memory modules, and hard drives. Instructions on inserting add on cards are also given.

2.0.2 Work Area

Make sure you have a stable, clean working environment. Dust and dirt can get into components and cause malfunctions. Use containers to keep small components separated. Putting all small components in separate containers prevents them from becoming lost. Adequate lighting and proper tools can prevent you from accidentally damaging the internal components.

2.0.3 Tools

The following procedures require only a few tools, including the following:

 A cross head (Phillips) screwdriver  A grounding strap or an anti-static pad

Most of the electrical and mechanical connections can be disconnected with your hands. It is recommended that you do not use pliers to remove connectors as it may damage the soft metal or plastic parts of the connectors.

Caution!

1. To avoid damaging the motherboard and as sociated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

2. Do not apply power to the board if it has been

damaged.

Chapter 2: Setting Up

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2.0.4 Precautions

Components and electronic circuit boards can be damaged by discharges of static electricity. Working on a system that is connected to a power supply can be extremely dangerous. Follow the guidelines below to avoid damage to FT77B-B7059 or injury to yourself.

 Ground yourself properly before removing the top cover of the

system. Unplug the power from the power supply and then touch a safely grounded object to release static charge (i.e. power supply case). If available, wear a grounded wrist strap. Alternatively, discharge any static electricity by touching the bare metal chassis of the unit case, or the bare metal body of any other grounded appliance.

 Avoid touching motherboard components, IC chips, connectors,

memory modules, and leads.

 The motherboard is pre-installed in the system. When removing

the motherboard, always place it on a gr ounded anti-static surface until you are ready to reinstall it.

 Hold electronic circuit boards by the edges only. Do not touch the

components on the board unless it is necessary to do so. Do not flex or stress circuit boards.

 Leave all components inside the static-proof packaging that they

ship with until they are ready for installation.

 After replacing optional devices, make sure all screws, springs, or

other small parts are in place and are not left loose inside the case. Metallic parts or metal flakes can cause electrical shorts.

CAUTION: Please note that the following illustrations may not look

exactly like the rackmount server you purchased. Therefore, the illustrations should be held for your reference only.

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2.1 Installing Motherboard Components

This section describes how to install components onto the motherboard, including CPUs, memory modules, HDD and PCI-E cards.

2.1.1 Removing the Chassis Cover and Air Duct

Follow these instructions to remove the FT77B-B7059 chassis cover.

1. Loosen the thumb screws.

2. Slide the top cover off.

3. Unscrew the top cover and release the latch es to remove the top cover from the chassis.

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4. Unscrew to remove the air duct.

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2.1.2 Installing the CPU and Heatsink

Follow the steps below on installing CPUs and CPU heatsinks.

1. Locate the CPU socket.

2. Pull the lever slightly away from the socket and then push it to a fully open position.

3. Push the CPU socket cover to a fully open position.

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4. Take out the p rotection cap when installing the CPU. Place the CP U into the socket and make sure that the gold arrow is located in the right direction.

5. Close the CPU socket cover and press the lever down to secure the CPU.

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6. Position the heatsink on top of the CPU and secure it with 4 screws.

7. Repeat the procedures mentioned earlier to install the second CPU and heatsink.

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2.1.3 Installing the Memory

Follow these instructions to install the memory modules onto the motherboard.

1. Locate the memory slots on the motherboard.

2. Press the memory slot locking levers in the direction of the arrows as shown in the following illustration.

3. Align the memory module with the slot. When inserted properly, the memory slot locking levers lock automatically onto the indentations at the ends of the module. Follow the recommended memory population table to install the other memory modules.

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2.1.4 Installing the Expansion Cards

FT77B-B7059 has fourteen expansion slots. Only the PCI-E Gen.3 x16 Slots can support GPU (Graphic Processing Unit) cards. One PCI-E Gen3 x8 Slot is reserved for Mezzanine card.

PCI-E Gen3 x8 slot (x8 link)

PCI-E Gen3 x16 slot (x16 link)

PCI-E Gen2 x1 slot (x1 link)

PCI 32-bit/33MHz slot

Follow these instructions to install the GPU card.

1. Locate the PCI-E Gen.3 x16 slots on the motherboard. Unscrew to take out the PCI shields.

2. Insert the card into the slot and secure it with the screws.

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3. Connect the cables between the expansion card and the power distribution board, the connectors you use should match with the slot you add the card with.

4. The installation of the GPU card is now complete.

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2.1.6 Installing the Mezzanine Card

Follow these instructions to install the Mezzanine Card.

1. Locate the PCI-E Gen3 x8 slot reserved for the Mezzanine card.

2. Push the latches inwards to remove the PCI dummy bracket.

3. Prepare a Mezzanine card (M7059F77-FDR) associated with tray and insert the tray into the slot.

4. The installation of the Mezzanine card is completed.

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Caution: The M7059F77A-QDR-2 and M7059F77A-DFR-2

mezzanine cards are equipped with Quad Small Form-factor Pluggable (QSFP) modules. Only QSFPs should be installed into the cards.

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2.1.7 Installing Hard Drives

The FT77B-B7059 can support (10) 2.5” or 3.5” hard drives.

2.5” Hard Disk Drive

The FT77B-B7059 supports up to ten internal 2.5” SATAII hard drives. Follow these instructions to install a hard drive.

1. Lift up the 2.5’’ HDD tray from the chassis.

2. Insert HDD rubber into the 2.5” HDD tray as shown.

3. Place a 2.5’’ hard drive into the HDD tray and secure it using four flat screws.

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4. Reinsert the HDD tray into the chassis and connect the Mini SAS cable and SATA power cable to the 2.5” HDD tray.

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3.5” Hard Disk Drive

The FT77B-B7059 can support up to ten internal 3.5” SATAII hard drives. Follow these instructions to install a hard drive.

1. Lift up the 3.5’’ HDD tray from the chassis.

2. Unscrew to remove the 2.5” HDD tray bracket.

3. Insert HDD rubber into the 3.5” HDD tray as shown.

4. Place a 3.5’’ hard drive into the HDD tray and secure it using four flat screws.

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5. Reinsert the HDD tray into the chassis and connect the Mini SAS cable and SATA power cable to the 3.5” HDD tray.

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2.2 Rack Mounting

After installing the necessary components, FT77B-B7059 can be mounted in a rack using the supplied rack mounting kit.

Rack Mount Kit

 Rail with Bracket x 2  Mounting Ears x 2  Screw Sack x 1

Screw Sack

A B C

A: M5 Washer------ 8pcs B: M5 x 10 ----------8pcs

2.2.1 Installing the Server in a Rack

Follow these instructions to mount the FT77B-B7059 into an industry standard 19” rack.

NOTE: Before mounting the TYAN FT77B-B7059 in a rack, ensure that all

internal components have been installed and that the unit has been fully tested. However, to make the installation easier, we suggest that you remove all HDD trays before you insert the chassis to the rack.

C: M5 x13 -----------2pcs

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2.2.2 Installing the inner Rails to the Chassis

1. Screw the mounting ear to each side of FT77A as shown using 3 screws from the supplied screws kit.

2. Push the latch key and draw out the inner rails from sliding rails.

3. Secure inner rails to both sides of the chassis, be sure the five mounting holes are correctly matched.

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2.2.3 Installing the Outer Rails to the Rack

Secure the outer rail to the rack using the rail and four M5 x 10 screws with washer for each side.

2.2.4 Rack mounting the Server

1. Draw out the middle rail till the latch position.

2. Lift the chassis and then insert the inner slide rails into the middle rails.

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3. Push the chassis in and pull the latch key (A). Then push the whole system into the rack (B).

4. Secure the mounting ears of chassis to the rack with two M5 x 13 screws.

Note:

To avoid injury, it is strongly recommended that two people lift the TYAN FT77B-B7059 into the place while a third person screws it to the rack.

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Chapter 3: Replacing Pre-Installed Components

3.0.1 Introduction

This chapter explains how to replace the pre-installed components, including the

S7059 Motherboard, M1008 Front Panel LED Control Board, M1809F77A-FB Fan

Board, M2210-L8-1F Riser Card, M7059F77-FDR Mezzanine Card, M1257F65-BP HDD Backplane Board, M7059F77-D-PBP Power Backplane Board,

M7059F77-D-PDB Power Distribution Board, System Fan and Power Supply etc.

3.0.2 Disassembly Flowchart

The following flowchart outlines the disassembly procedures.

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3.1 Removing the Cover

Before replacing any parts you must remove the chassis cover. Follow Section 2.1.1 Removing the Chassis Cover (page 33) to remove the cover of the FT77B-B7059.

3.2 Replacing the Power Supply

The system has three pre-installed Power Supply Units. Please unplug the power cord before you follow these instructions to replace the power supply units.

1. Press the latch to pull the power supply out.

2. After replacing a new power supply, press the latch to push the power supply back into the chassis.

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3.3 Replacing the Power Distribution Board

Follow these instructions to replace the M7059F77-D-PDB Power Distribution Board.

1. Unscrew the M7059F77-D-PDB and disconnect the 8-pin power cable.

2. Remove the power distribution board for replacement.

3. Follow the steps described earlier in reverse order to reinstall the power distribution board into the chassis.

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3.3.1 Power Distribution Board Features

Form Factor

Connectors

W66.93 x L394 (mm), 8-layer PCB Input:

(1) 24S+6P Connector Output: (1) 2x4-pin Power Connector for Fan Board (16) 2x4-pin Power Connector for GPU

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3.3.2 Pin Definitions

J1: FCI_PWR_CONN_S24P6_RA to PBP

Definition Pin Pin Definition

VCC12

VCC12 C1 ~ C6 A1 ~ A6 GND VCC12 D1 ~ D6 B1 ~ B6 GND

P11 ~ 18 P21 ~ 28 P31 ~ 38

J2: 2×4-Pin ATX Power Connector for FAN Board, the max current is 30A

Definition Pin Pin Definition

GND 1 5 +12V GND 2 6 +12V GND 3 7 +12V GND 4 8 +12V

J3 ~ J18: 2×4-Pin ATX Power Connector for GPU, the max current is 20A

Definition Pin Pin Definition

GND 1 5 +12V GND 2 6 +12V GND 3 7 +12V GND 4 8 +12V

P41 ~ 48 P51 ~ 58 P61 ~ 68

GND

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3.4 Replacing the Power Backplane Board

Follow these instructions to replace the M7059F77-D-PBP Power Backplane Board.

1. Make sure to take out three power supply units.

2. Remove the M7059F77-D-PBP bracket.

3. Unscrew the M7059F77-D-PBP from the bracket and replace with a new one. Follow the steps described earlier in reverse order to reinstall the power backplane board.

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3.4.1 Power Backplane Board Features

Form Factor

Connectors

W80 x L145 (mm), 8-layer PCB Input:

(3) Power Connector for GPU Output: (1) 24S+6P R/A Connector for Motherboard (1) 24S+6P Connector for M7059F77-D-PDB (1) 2x4-pin ATX Power Connector

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3.4.2 Pin Definitions

J1: FCI_PWR_CONN_S24P6_RA to PBP

Definition Pin Pin Definition

VCC12

VCC12 C1 ~ C6 A1 ~ A6 GND VCC12 D1 ~ D6 B1 ~ B6 GND

P11 ~ 18 P21 ~ 28 P31 ~ 38

J2: 2×4-Pin ATX Power Connector for FAN Board, the max current is 30A

Definition Pin Pin Definition

GND 1 5 +12V GND 2 6 +12V GND 3 7 +12V GND 4 8 +12V

J3 ~ J18: 2×4-Pin ATX Power Connector for GPU, the max current is 20A

Definition Pin Pin Definition

GND 1 5 +12V GND 2 6 +12V GND 3 7 +12V GND 4 8 +12V

P41 ~ 48 P51 ~ 58 P61 ~ 68

GND

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3.5 Replacing the Riser Card

Follow these instructions to replace the M2210-L8-1F Riser Card.

1. Unscrew the power supply cage.

2. Lift out the power supply cage.

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3. Unscrew the riser card bracket from the chassis.

4. Take out the riser card bracket.

5. Unscrew to replace with a new riser card.

6. Reinstall the riser card into the chassis following the steps in reverse.

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3.5.1 Riser Card Features

Form Factor

Specifications

W31.85 x L94 (mm), 4-layer PCB

(1) PCI-E Gen3 x8 Slot for non-standard add-on card

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3.6 Replacing the System Fan

Follow these instructions to replace the system fans.

1. Remove the power distribution board bracket.

2. Pull out all fans.

3. Unscrew the fan cage.

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4. Lift up the fan cage from the chassis.

5. Disconnect all cables attached to the M1809F77A-FB Fan Board.

6. Unscrew to replace the fan board with a new one. Follow the steps described earlier in reverse order to reinstall the fans and fan cage into the chassis.

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3.6.1 Fan Board Features

Form Factor

Specifications

FAN Sequence

W81.4 x L312.28 (mm), 4-layer PCB

(4) 1x4P ATX Power Connector for Fan (6) 2x2-pin Power Connector (1) 2x10-pin System Fan Connector for Motherboard

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3.6.2 Pin Definitions

J1/J2/J3/J4/J5/J6: 2x2-pin Power Connector

Definition Pin Pin Definition

GND 1 2 +12V TACH 3 4 PWM

J8: 2×10-Pin System Fan Connector for Motherboard

Definition Pin Pin Definition

Tachometer Input1 1 2 Tachometer Input6 Tachometer Input2 3 4 Tachometer Input7 Tachometer Input3 5 6 Tachometer Input8 Tachometer Input4 7 8 Tachometer Input9 Tachometer Input5 9 10 Tachometer Input10 GND 11 12 KEY PWM Output2 13 14 PWM Output1 Tachometer Input11 15 16 SMB Data Tachometer Input12 17 18 SMB Clock

3.3V Standby 19 20 PWM Output3

J7/J9/J10/J11: 1×4-Pin ATX Power Connector for Fan

Definition Pin Pin Definition

+12V 1 2 GND GND 3 4 NC

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3.7 Replacing the Front Panel Board

Follow these instructions to replace the M1008 Front Panel LED Control Board.

1. Unscrew and disconnect both cables from the front panel board.

2. Prepare a new one to replace. Follow the procedure described earlier in reverse order to reinsert the front panel board into the chassis.

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3.7.1 Front Panel Board Features

Form Factor

Specifications

W45.21 x L97 (mm), 4-layer PCB

Support Power Button, Reset Button, NMI Switch, ID LED Button Support Power Standby Function

 Power ON: Power LED solid green on  Power Standby: Power LED blinking green)

Support dual USB Ports Power LED, HDD LED, ID LED, 3 LAN LEDs & BMC LED (1) 2x15-pin Header for SSI FP (Pitch 2.54)

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3.7.2 Pin Definitions

J1: USB Header

Definition Pin Pin Definition

VCC 1 2 VCC USB1- 3 4 USB2USB1+ 5 6 USB2+ GND 7 8 GND KEY 9 10 GND

J3: New SSI FP

Definition Pin Pin Definition

PW_LED+ 1 2 VCC KEY 3 4 ID_LED+ PW_LED- 5 6 ID_LEDHDD_LED+ 7 8 HDD_LED- 9 10 PWR_SW- 11 12 GND 13 14 RESET- 15 16 GND 17 18 ID_SW- 19 20 TEMP_SENSOR 21 22 NMI_SW 23 24 NC 25 26 LAN3_LED+ 27 28 NC 29 30

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3.8 Replacing the Motherboard

Follow these instructions to replace the motherboard.

1. Unscrew the power distribution board bracket.

2. Take out the power distribution board bracket.

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3. Disconnect all cables.

4. Unscrew the motherboard to lift it out.

5. Replace the motherboard and follow the procedures described earlier in reverse order to reinstall.

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Chapter 4: Motherboard Information

You are now ready to install your motherboard.

How to install our products right… the first time

The first thing you should do is read this user’s manual. It contains important information that will make configuration and setup much easier. Here are some precautions you should take when installing your motherboard:

(1) Ground yourself properly before removing your motherboard from the

antistatic bag. Unplug the power from your computer power supply and then touch a safely grounded object to release static charge (i.e. power supply case). For the safest conditions, MiTAC recommends wearing a static safety wrist strap.

(2) Hold the motherboard by its edges and do not touch the bottom of the

board, or flex the board in any way.

(3) Avoid touching the motherboard components, IC chips, connectors,

memory modules, and leads.

(4) Place the motherboard on a g roun ded antist atic surface or on the antist ati c

bag that the board was shipped in.

(5) Inspect the board for damage.

The following pages include details on how to install your motherboard into your chassis, as well as installing the processor, memory, disk drives and cables.

Caution!

1. To avoid damaging the motherboard and as sociated

components, do not use torque force greater than

7kgf/cm (6.09 lb/in) on each mounting screw for

motherboard installation.

2. Do not apply power to the board if it has been damaged.

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4.1 Board Image

S7059

This picture is representative of the latest board revision available at the time of publishing. The board you receive may not look exactly like the above picture.

NOTE:

SATA #0 ~ #3 (AHCI, SATA 6Gb/s from #0, #1; SATA 3Gb/s from #2, #3) use

vertical mini SAS connector (marked with red). The associate cables are labeled as #1, #2, #3 and #4. #1 and #2 are sourced from SATA #0 and #1, running at SATA 6Gb/s. #3 and #4 are sourced from SATA #2 and #3, running at SATA 3Gb/s. SATA #4~ #5 (AHCI, SATA 3Gb/s) use standard SATA connectors (marked with yellow). SATA #0 ~ #3 (SCU#0, SATA 3Gb/s) use horizontal mini SAS connector (marked with red but de-populated)

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4.2 Block Diagram

S7059 Block Diagram

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4.3 Motherboard Mechanical Drawing

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4.4 Board Parts, Jumpers and Connectors

This diagram is representative of the latest board revision available at the time of publishing. The board you receive may not look exactly like the above diagram. The DIMM slot numbers shown above can be used as a reference when reviewing the DIMM population guidelines shown later in the manual. For the latest board revision, please visit our web site at http://www.tyan.com.

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Jumpers & Connectors

Jumper/Connector Function

J5 IDLED Switch Header J18 Flash Security Override Header J26 SATA SGPIO Header for BB HD Board J31 IPMB Connector

J32 J35 Front Fan Connector Reserved for Barebone

J36 Power Connector J38 Chassis Intrusion Header J39 USB Front Panel Header J41/J43 CPU0 / CPU1 FAN Connector

J42

J56(SATA4) / J57(SATA5) SATA2.0 Connector J58/J59 Vertical Type-A USB Connector J60 Front Panel Header J73/J74/J75/J76 4-pin FAN Connector JP5 Clear CMOS Jumper JP6 BIOS Recovery Mode Jumper JP7 ME Firmware Update Jumper PW1 4-pin HDD Power Connector SW1 / LED1 ID LED Button / ID LED

Jumper Legend

Mini SAS Connector (SATA0~3) SATA0~3: SATA 2.0 Connector

Vertical Mini SAS Connector (SATA0~3) SATA0~1: SATA3.0 Connector SATA2~3: SATA2.0 Connector

OPEN - Jumper OFF Without jumper cover

CLOSED - Jumper ON With jumper cover

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J76

J43

J75

J74

J41

J73

J38

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J60

J41J43//J73/J74/J75/J76: 4-Pin FAN Connector

Pin 1 2 3 4

Signal GND VCC Tachometer PWM

Use this header to connect the cooling fan to your motherboard to keep the system stable and reliable.

J41: CPU0_FAN J43: CPU1_FAN J73: SYS_FAN_4 J74: SYS_FAN_3 J75: SYS_FAN_2 J76: SYS_FAN_1

J5: IDLED Switch Header

Pin 1 2

Signal FP IDLED Switch

J38: Chassis Intrusion Header

open

Short (Default)

J60: Front Panel Header

PWRLED-(GND) 5 6 ID_LED-(GND)

Power Switch+ 11 12 LAN1_ACTIVE_LED+

Power Switch-(GND) 13 14 LAN1_ACTIVE_LED-

Reset Switch+ 15 16 SMB_DATA

Reset Switch-(GND) 17 18 SMB_CLK

TEMP Sensor 21 22 LAN2_ACTIVE_LED+

FP IDLED Switch

(GND)

Pin 1 2

Signal Intrusion Switch

Open: Use this header to trigger the system chassis intrusion alarm. Short: Use this header to disable the system chassis intrusion alarm.

Signal Pin Pin Signal

PWRLED+ 1 2 FP Power(3.3V standby)

KEY 3 4 ID_LED+

HD_LED+ 7 8 Fault LED1-

HD_LED- 9 10 Fault LED2-

ID Switch+ 19 20 INTRUDER#

NMI Switch# 23 24 LAN2_ACTIVE_LED -

Intrusion Switch

(GND)

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J31

J35

JP5

J39

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J39: USB Front Panel Header (blue)

Signal Pin Pin Signal

USB 5V Power 1 2 USB 5V Power

USB Data- 3 4 USB Data-

USB Data+ 5 6 USB Data+

GND 7 8 GND

KEY 9 10

J35: Front Fan Connector (Reserved for Barebone Fan Board)

Signal Pin Pin Signal

Tachometer input1 1 2 Tachometer input6 Tachometer input2 3 4 Tachometer input7 Tachometer input3 5 6 Tachometer input8 Tachometer input4 7 8 Tachometer input9 Tachometer input5 9 10 Tachometer input10

GND 11 12 KEY

PWM output2 13 14 PWM output1 Tachometer input11 15 16 SMB DATA Tachometer input12 17 18 SMB CLK

3.3V Standby 19 20 PWM output3

J31: IPMB Connector

Signal Pin Pin Signal

SMB_SDA2 1 2 GND SMB_SCL2 3 4 NC

JP5: Clear CMOS Jumper

You can reset the CMOS settings by using this jumper. This can be useful if you have forgotten your system/setup password, or need to clear the system BIOS setting.

Normal (Default)

Clear CMOS

1. Power off system and disconnect power connectors from the motherboard.

2. Remove the jumper from Pin_1 and Pin_2 (Default setting).

3. Move the jumper cap to close Pin_2 and Pin_3 for several seconds to Clear CMOS.

4. Put jumper cap back to Pin_1 and Pin_2 (Default setting).

5. Reconnect power connectors to the motherboard and power on system.

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SW1

LED1

J18

J26

J56/J57

J58/J59

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LED1 / SW1: ID LED and ID LED Button

Pin Signal

+ P3V3_AUX

- ID_SW_L

State Color Description

On Blue System identified Off Off System not identified

NOTE: The ID LED can be activated remotely using IPMI.

Please visit the TYAN Web Site at http://www.tyan.com to download the latest IPMI Configuration Guide for more details.

J58/J59: Vertical Type-A USB Connector

Pin 1 2 3 4

Signal USB 5V Power USB Data- USB Data+ GND

J56/J57: SATA2.0 Connector

1 GND

2 SATA TX DP 3 SATA TX DN 4 GND 5 SATA RX DN 6 SATA RX DP 7 GND

J26: SATA SGPIO Header for BB HD Board

Connects to the Serial ATA ready drives via the Serial ATA cable.

J56: SATA4 J57: SATA5

Signal Pin Pin Signal

3.3V Standby 1 2 SMB SCL GND 3 4 SMB SDA KEY 5 6 BP HDD FAULT

J18: Flash Security Override Header

Pin 1 2

Signal Signal Input GND

PW1: 4-pin HDD Power Connector

Pin 1 2 3 4

Signal +12V GND GND +5V

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JP6/JP7

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JP6: BIOS Recovery Mode Jumper

Pin 1-2 Closed: Normal (Default)

Pin 2-3 Closed: Recovery CMOS

JP7: ME Firmware Update Jumper

Pin 1-2 Closed: Open (Default)

Pin 2-3 Closed: ME Force Update

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4.5 Thermal Interface Material

There are two types of thermal interface materials designed for use with the processors.

The most common material comes as a small pad attached to the heat sink at the time of purchase. There should be a protective cover over the material. Take care not to touch this material. Simply remove the protective cover and place the heat sink on the processor.

The second type of interface material is usually packaged separately. It is commonly referred to as ‘thermal compound’. Simply apply a thin layer on to the CPU lid (applying too much will actually reduce the cooling).

NOTE: Always check with the manufacturer of the heat sink & processor to

ensure that the thermal interface material is compatible with the processor and meets the manufacturer’s warranty requirements.

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4.6 Tips on Installing Motherboard in Chassis

Before installing your motherboard, make sure your chassis has the necessary motherboard support studs installed. These studs are usually metal and are gold in color. Usually, the chassis manufacturer will pre-install the support studs. If you are unsure of stud placement, simply lay the motherboard inside the ch assis and align the screw holes of the motherboard to the studs inside the case. If there are a ny studs missing, you will know right away since the motherboard will not be able to be securely installed.

NOTE: Be especially careful to look for extra stand-offs. If there are any stand-offs

present that are not aligned with a mounting hole on the motherboard, it will likely short components on the back of the motherboard when installed. This will cause malfunction and/or damage to your motherboard.

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Some chassis include plastic studs instead of metal. Although the plastic studs are usable, MiTAC recommends using metal studs with screws that will fasten the motherboard more securely in place.

Below is a chart detailing what the most common motherboard studs look like and how they should be installed.

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4.7 Installing the Memory

Before installing memory, ensure that the memory you have is compatible with the motherboard and processor. Check the TYAN Web site at http://www.tyan.com for details of the type of memory recommended for your motherboard.

The following pictures show common types of DDR3 memory modules.

 This platform supports Unbuffered DDR3, Registered DDR3, and LR DIMM

(Load Reduced DIMM) DDR3 for buffered memory solutions demanding higher capacity memory subsystems.

 DDR3 data transfer rates of 1066, 1333, and 1600 MT/s are supported  Each memory channel is 72 or 64 bits wide for ECC or Non-ECC  Both 1.5V and 1.35V DDR3 DIMMs are supported  Up to 8 ranks are supported per memory channel. DIMMS may be 1, 2 or 4

ranks per module.

 All installed memory will automatically be detected. No jumpers or settings

need to be changed for memory detection.

 All memory must be of the same type and density. Registered, Unbuffered,

and LRDIMM memory types can NOT be mixed and matched on the same

motherboard.

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Recommended Memory Population Table

Quantity of

memory installed

CPU0_DIMM_A0 √ √ √ √ √ √ CPU0_DIMM_A1 √ √ CPU0_DIMM_A2 √ CPU0_DIMM_B0 √ √ √ √ √ CPU0_DIMM_B1 √ √ CPU0_DIMM_B2 √ CPU0_DIMM_C0 √ √ √ √ CPU0_DIMM_C1 √ √ CPU0_DIMM_C2 √ CPU0_DIMM_D0 √ √ √ CPU0_DIMM_D1 √ √ CPU0_DIMM_D2 √

NOTE:

1. √ indicates a populated DIMM slot.

2. Use paired memory installation for max performance.

3. Populate the same DIMM type in each channel, specifically

- Use the same DIMM size

- Use the same # of ranks per DIMM

4. Dual-rank DIMMs are recommended over single-rank DIMMs.

5. Un-buffered DIMM can offer slightly better performance than registered DIMM if populating only a single DIMM per channel.

6. Always install with CPU0 Socket and DIMM_0 Slot first, following the alphabetical order.

1 2 3 4 8 12

Single CPU Installed

(CPU0 only)

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Quantity of

memory installed

CPU0_DIMM_A0 √ √ √ √ √ √ √ √ √ √ CPU0_DIMM_A1 √ √ √ CPU0_DIMM_A2 √ CPU0_DIMM_B0 √ √ √ √ √ √ √ √ √ CPU0_DIMM_B1 √ √ CPU0_DIMM_B2 √ CPU0_DIMM_C0 √ √ √ √ √ √ √ CPU0_DIMM_C1 √ √ CPU0_DIMM_C2 √ CPU0_DIMM_D0 √ √ √ √ √ CPU0_DIMM_D1 √ √ CPU0_DIMM_D2 √ CPU1_DIMM_A0 √ √ √ √ √ √ √ √ √ √ CPU1_DIMM_A1 √ √ √ CPU1_DIMM_A2 √ CPU1_DIMM_B0 √ √ √ √ √ √ √ √ CPU1_DIMM_B1 √ √ CPU1_DIMM_B2 √ CPU1_DIMM_C0 √ √ √ √ √ √ CPU1_DIMM_C1 √ √ CPU1_DIMM_C2 √ CPU1_DIMM_D0 √ √ √ √ CPU1_DIMM_D1 √ √ CPU1_DIMM_D2 √

2 3 4 5 6 7 8 10 18 24

Dual CPU installed (CPU0 and CPU1)

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Intel®Xeon®processor E5-2600/4600 product families UDIMM Support

Ranks Per DIMM & Data Width

SRx8 Non-ECC 1 GB 2GB 4GB N/A N/A DRx8 Non-ECC 2GB 4GB 8GB N/A N/A SRx16 Non-ECC 512 MB 1GB 2GB N/A N/A SRx8 ECC 1GB 2GB 4GB 1066 1066 DRx8 ECC 2GB 4GB 8GB 1066 1066

NOTE 1: The blue blocks indicate that the DRAM Densities are supported but not validated. NOTE 2: The grey blocks indicate that the DRAM Densities are supported and validated. NOTE 3: 1DPC => One dimm per channel NOTE 4: 2DPC => Two dimm per channel NOTE 5: 3DPC => Three dimm per channel

 Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated by

Intel.

 Command Address Timing is 1N for 1DPC and 2N for 2DPC.  Romley-EP/EX platform does not support 3DPC when using UDIMMs.

Intel®Xeon®processor E5-2600/4600 product families LRDIMM Support

Ranks Per DIMM & Data Width

QRx4 (DDP) 16GB 32GB 1066 1066 QRx8 (P) 8GB 16GB 1066 1066

NOTE: The grey blocks indicate that the DRAM Densities are supported and validated.

 Physical Rank is used to calculate DIMM Capacity.  Supported and validated DRAM Densities are 2Gb and 4Gb.  Command Address Timing is 1N.  The speeds are estimated targets and will be verified through simulation.  For 3SPC/3DPC -Rank Multiplication (RM) >= 2.  DDP -Dual Die Package DRAM stacking. P –Planer monolithic DRAM Die.  Romley-EP/EX platform does not support 3DPC when using E5-2400 LRDIMMs.

Memory Capacity per DIMM

Memory Capacity per

DIMM

1&2DPC 3DPC 1&2DPC 3DPC

1.35V 1.50V

1DPC 2DPC 1DPC 2DPC

1.35V 1.50V

1066,

1333

1066,

1333

1066,

1333

1066,

1333

1066,

1333

1066,

1333

1066,

1333

1066,

1333

1066,

1333

1066,

1333

1066,

1333

1066,

1333

1066 1066

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Intel®Xeon®processor E5-2600/4600 product families RDIMM Support

Ranks Per DIMM & Data Width

SRx8 1GB 2GB 4GB

DRx8 2GB 4GB 8GB

SRx4 2GB 4GB 8GB

DRx4 4GB 8GB 16GB QRx4 8GB 16GB 32GB 800 800 N/A 1066 800 N/A

QRx8 4GB 8GB 16GB 800 800 N/A 1066 800 N/A

NOTE 1: The blue blocks indicate that the DRAM Densities are supported but not

validated.

NOTE 2: The grey blocks indicate that the DRAM Densities are supported and

validated.

NOTE 3: The yellow blocks indicate that the DRAM Densities are supported with limited

validated.

Memory Capacity per DIMM

1DPC 2DPC 3DPC 1DPC 2DPC 3DPC

1066, 1333

1.35V 1.50V

1066, 1333

N/A

1066, 1333, 1600 1066, 1333, 1600 1066, 1333, 1600 1066, 1333, 1600

800, 1066

 Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated by

Intel.

 Command Address Timing is 1N.  QR RDIMM are supported but not validated by Intel/PMO in a homogenous environment.

The coverage will have limited system level testing, no signal integrity testing, and no interoperability testing. The passing QR RDIMMs will be web posted.

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4.8 PLXPXE8747 LED Definition

LED Signal A: LED36 Red On: Fatal Error Off: Normal B: LED37 Red On: Fatal Error Off: Normal C: LED35 Red On: Fatal Error Off: Normal D: LED38 Red On: Fatal Error Off: Normal

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4.9 Finishing Up

Congratulations on making it this far! You have finished setting up the hardware aspect of your computer. Before closing up your chassis, make sure that all cables and wires are connected properly, especially SATA cables and most importantly, jumpers. You may have difficulty powering on your system if the motherboard jumpers are not set correctly. In the rare circumstance that you have experienced difficulty, you can find help by asking your vendor for assistance. If they are not available for assistance, please find setup information and documentation online at our website or b y calling your vendor’s support line.

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Chapter 5: BIOS Setup

5.1 About the BIOS

The BIOS is the basic input/output system, the firmware on the motherboard that enables your hardware to interface with your software. The BIOS determines what a computer can do without accessing programs from a disk. The BIOS contains all the code required to control the keyboard, display screen, disk drives, serial communications, and a number of miscellaneous functions. This chapter describes the various BIOS settings that can be used to configure your system.

The BIOS section of this manual is subject to change without notice and is provided for reference purposes only. The settings and configurations of the BIOS are current at the time of print and are subject to change, and therefore may not match exactly what is displayed on screen.

This section describes the BIOS setup program. The setup program lets you modify basic configuration settings. The settings are then stored in a dedicated, battery-backed memory (called NVRAM) that retains the information even when the power is turned off.

To start the BIOS setup utility:

1. Turn on or reboot your system.

2. Press <Del> or <F2> during POST (Del on remote console) to start the BIOS setup utility.

5.1.1 Setup Basics

The table below shows how to navigate in the setup program using the keyboard.

Key Function

Left/Right Arrow Keys Change from one menu to the next Up/Down Arrow Keys Move between selections Enter Open highlig hted section PgUp/PgDn Keys Change pages +/- Change options ESC Exit

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5.1.2 Getting Help

Pressing [F1] will display a small help window that describes the appropriate keys to use and the possible selections for the highlighted item. To exit the Help Window, press [ESC] or the [Enter] key again.

5.1.3 In Case of Problems

If you have trouble booting your computer after making and saving the changes with the BIOS setup program, you can restart the computer by holding the power button down until the computer shuts off (usually within 4 seconds); resetting by pressing CTRL-ALT-DEL; or clearing the CMOS. The best advice is to only alter settings that you thoroughly understand. In particular, do not change settings in the Chipset section unless you are absolutely sure of what you are doing. The Chipset defaults have been carefully chosen either by MiTA C or your system manufacturer for best performance and reliability. Even a seemingly small change to the Chipset setup options may cause the system to become unstable or unusable.

5.1.4 Setup Variations

Not all systems have the same BIOS setup layout or options. While the basic look and function of the BIOS setup remains more or less the same for most systems, the appearance of your Setup screen may differ from the charts shown in this section. Each system design and chipset combination requires a custom configuration. In addition, the final appearance of the Setup program depends on the system designer. Your system designer may decide that certain items should not be available for user configuration, and remove them from the BIOS setup program.

NOTE: The following pages provide the details of BIOS menu. Please be noticed

that the BIOS menu are continually changing due to the BIOS updating. The BIOS menu provided are the most updated ones when this manual is written. Please visit TYAN’s website at http://www.tyan.com for the information of BIOS updating.

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5.2 Main Menu

In this section, you can alter general features such as the date and time. Note that the options listed below are for options that can directly be changed within the Main Setup screen.

BIOS Information

It displays BIOS related information.

Memory Information

This displays the total memory size.

System Date

Adjust the system date. MM (Months): DD (Days): YYYY (Years)

System Time

Adjust the system clock. HH (24 hours format): MM (Minutes): SS (Seconds)

Access Level

Read only.

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5.3 Advanced Menu

This section facilitates configuring advanced BIOS options for your system.

PCI Subsystem Settings

PCI, PCI-X and PCI Express Settings.

ACPI Settings

System ACPI Parameters.

Trusted Computing

Trusted Computing Settings.

CPU Configuration

CPU Configuration Parameters.

Runtime Error Logging

Runtime Error Logging Support Setup Options

SATA Configuration

SATA Devices Configuration.

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SAS Configuration

SAS Devices Configuration.

Onboard Device Configuration

Onboard Device Configuration.

PCIe Slot Configuration

PCIe Slot Configuration.

USB Configuration

USB Configuration Parameters.

Info Report Configuration

Info Report Configuration.

Hardware Health Configuration

Hardware health Configuration Parameters.

Super IO Configuration

System Super IO Chip Parameters.

Serial Port Console Redirection

Serial Port Console Redirection.

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5.3.1 PCI Subsystem Settings

Above 4G Decoding

Enables or Disables 64bit capable Devices to be Decoded in Above 4G Address Space (Only if System Supports 64 bit PCI Decoding).

Disabled / Enabled

NOTE: Above 4G Decoding has to be [Enabled] for NVIDIA GRID K2 card

deployment.

BIOS

Notes

Options

Disabled Default setting, also valid for NV Tesla K10/K20/K20X

deployment

Enabled

Valid for NV GRID K2 deployment

MMIOH Base

MMIOH Base Help.

MMIOH Base 46 / MMIOH Base 42

NOTE: MMIOH Base has to be [MMIOH Base 42] for NVIDIA GRID K2 card

deployment.

100

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Tyan FT77B-B7059 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual