Disconnect the device from the power supply
Ensure against accidental restart
Verify isolation from the supply
Cover or close off neighbouring units that are live.
The assembly instructions provided for the device are to be
complied with
Only suitably qualified personnel according to EN 50 110-1/-2
(VDE 0105 part 100) are authorised to carry out work on this
device/system.
When conducting installation work ensu re that you are free of
electrostatic charge before touching the dev ice.
Connection and signa l cables are to be installed so that any
inductive or capacitive interference does not impair the
automation func ti o ns .
The installation of aut omation devices and their operating
elements is to be carried out in such a way as to preven t
unintentional operation.
In order to prevent cable or wire breakage on the signal side
generating undefined states in the automation dev ices,
appropriate safety measures are to be taken for the I/O coupling
on the hardware and software side.
The functional earth (FE) must be connected to the protective
earth (PE) or the equip otential bonding. The system installer is
responsible for establis hing this connecti on.
Ensure a reliable isolation of the extra-low voltage for the 24 volt
supply. Only those power supply units that comply with IEC 60
364-4-41, i.e. HD 384.4.41 S2 (VDE 0100 part 410) are to be
deployed.
Fluctuations or deviations of the mains voltage from the nominal
value should not exceed the tolerance limits specified in the
technical data, otherwise malfunctions and dangerous states
may occur.
D101583 0207BL ident3
Page 4
Devices for mounting in hou sings or cabinets, desk top or
portable units, are only to be operated and controlled with the
housing closed.
Measures are to be taken to ensure the correct restarting of a
program following interruption due to a voltage drop or failure.
Dangerous operating conditions, even short term, should not
occur as a result. If required an emergency stop should be
carried out.
External measures are to be implemented at thos e locations
where faults in the automation installation could lead to injury to
persons or damage to property. These measures must
guarantee safe operating conditions even in the event of a faul t
or malfunction (e.g. by means of independent limit switches or
mechanical locking devices etc.).
The electrical installation must be carried out in accordance with
the relevant regulati ons (e.g. in respect of the cable cross
sections,
fuses and protecti ve earth connections).
All work involving transport, installation, commissioning and
maintenance is to be carried out exclusively by qualified
personnel (in accordance with IEC 60 364 i.e. HD 384 or
DIN VDE 0100 and national accident prevention regulations).
USA Radio Frequency In terference FCC Part 15 Notice:
Changes or modifications no t expressly approved by TURCK
could void the user's au thority to operate the equipment
Description of symbols used ............................................................................4
Prescribed use ........................................................................................... 5
Notes concerning planning / Installation of this product ........................... 5
Page 14
About this manual
0 – 2D101583 0207BL ident
Documentation concept
This manual contains all the information necessary for professional
installation of the BL ident systems particularly with regard to the
data carriers and the read-write heads.
The following chapter provides an overview of the BL ident system,
how to plan a BL ident system and indicates the necessary
installation guidelines while providing a brief overview of the EMC
directives. The manual also describes the functional principle of the
data carriers and read-write heads, the technical data and operating
data as well as the available accessories.
The manuals for BL67 and BL20 I/O modules contain information
concerning the non bus-specific I/O modules of the modular TURCK
BL67 and BL20 systems. You can find a short system description, a
detailed function description of the I/O modules as well as all the
information concerning topics such as mounting/dismounting and
inscription. The manuals contain a short description of the I/OASSISTANT which is the engineering and configuration software for
TURCK I/O products.
Manual BL67 I/O Modules
TURCK documentation number:
German D300572/
English D300529
Manual BL20 I/O Modules
TURCK documentation number:
German D300716/
English D300717
Also included are manuals concerning the PROFIBUS-DP and
DeviceNet™ gateway of the BL67 and BL20 series. These include a
short BL67 or BL20 system description and a description of the
PROFIBUS-DP or DeviceNet™ fieldbus systems. Besides you will
find exact details concerning the function and design of bus-specific
gateways as well as all bus-specific information concerning the
connection to different automation devices, the maximum system
extension, etc.
Manual BL67 PROFIBUS-DP
TURCK documentation number:
German D300570/
English D300527
Page 15
0 – 3
About this manual
D101583 0207BL ident
Manual BL67 DeviceNet™
TURCK documentation number:
English D300528
Manual BL20 PROFIBUS-DP
TURCK documentation number:
German D300822/
English D300458
Manual BL20 DeviceNet™
TURCK documentation number:
English D300460.
Further support can be found in the following manuals for
engineering, installation and commissioning:
Manual D101580 - This manual describes the professional
application of BL ident interface modules.
Manual D101578 - This manual includes instructions for
commissioning of a BL ident systems using the function block
“Proxy Ident Function Block”. The commissioning example is
undertaken using a SIMATIC S7/-300 station (Siemens).
SIMATIC STEP 7 standard software is used.
Manual D101606 - This manual contains the software
description for the so-called “Handheld” (programming device)
which can be used to read data irrespective of the location.
Manual D101584 - This manual contains the hardware
description for the so-called “Handheld” (programming device)
which can be used to read data irrespective of the location.
Page 16
About this manual
0 – 4D101583 0207BL ident
Description of symbols used
Warning
This sign can be found next to all notes that indicate a source of
hazards. This can refer to danger to personnel or damage to the
system (hardware and software).
This sign means for the operator: work with extreme caution.
Attention
This sign can be found next to all notes that indicate a source of
potential hazards.
This can refer to possible danger to personnel or damage to the
systems (hardware and software) and installations.
Note
This sign can be found next to all general notes that supply
important information about one or more operating stages.
These specific notes are intended to make operation easier and
avoid unnecessary work due to incorrect operation.
Page 17
0 – 5
About this manual
D101583 0207BL ident
This manual contains all the necessary information concerning the
intended usage of TURCK products. It has been specially developed
for qualified personnel who have the required level of expertise.
Prescribed use
Appropriate transport, storage deployment and mounting as well as
careful operating and thorough maintenance guarantee trouble-free
and safe operation of these devices.
Notes concerning planning / Installation of this product
Attention
Please read this section carefully. Safety aspects cannot be left to
chance when dealing with electrical equipment
Warning
The devices described in this manual must be used only in
applications prescribed in this manual or in the respective technical
descriptions, and only in connection with components and devices
from third party manufacturers that have been certified.
Warning
It is imperative that all respective safety measures and accident
protection guidelines be adhered to.
Page 18
About this manual
0 – 6D101583 0207BL ident
Page 19
D101583 0207BL ident1 – 1
1
The TURCK BL ident System
1The TURCK BL ident system
Schematic representation of the identification system BL ident .........................2
Support for BL ident projects......................................................................2
Networking with BL ident systems..............................................................3
Identification systems with radio frequency technology (RFID)........................4
Characteristics and fields of application of the BL ident system......................5
Degree of protection ...................................................................................5
Service life ...................................................................................................5
Transmission frequency ..............................................................................5
Areas of application (examples): .................................................................7
The BL ident configurator .................................................................................8
Page 20
The TURCK BL ident System
D101583 0207BL ident1 – 2
Schematic representation of the identification system BL ident
The TURCK BL ident system consists of several levels. Every level
offers variation options. An application adapted to the overall
system is possible.
Support for BL ident projects
Further support can be found in the following software for
engineering, installation and commissioning:
For simulation and optimisation of an application a “BL ident
configurator” is available free of charge on the internet at
www. turck.com (see page 1 - 8).
Figure: 1
System overview
PLC/PC for commissioning
Interface module for integration
in the fieldbus systems
Read/write devices
Mobile data carriers
IP20
IP67
Page 21
D101583 0207BL ident1 – 3
The TURCK BL ident System
1
Networking with BL ident systems
As it is possible to integrate BL ident systems in (existing) bus
systems, networking of several BL ident systems is possible.
The guidelines which relate to the maximum extension of the
respective bus systems apply.
A PROFIBUS system can only extend, for example, up to a
maximum of 31 stations with 1 master when a repeater is not used.
Page 22
The TURCK BL ident System
D101583 0207BL ident1 – 4
Identification systems with radio frequency technology (RFID)
RFID is the abbreviation for Radio Frequency Identification.
An RFID system consists of a data carrier, a device for reading the
data from the data carrier (read-write head) as well as other devices
which perform the transfer and processing of data (interfaces).
The transfer of data from the data carrier to the read-write heads is
undertaken using electromagnetic waves. This type of data transfer
is non-contact, without a visual contact and is insensitive to dirt and
temperature fluctuations.
The data carriers can be attached directly to a product. Further
terms used for the data carriers are TAGs or transponders. The data
content can consist of production and manufacturing data.
Important it that this data identifies the product. This is the
origination of the term “Identification System”.
A whole range of possibilities exist as the data content can be
changed by writing on the data carrier. Accordingly, the production
and manufacturing processes can be traced and monitored.
Logistics/distribution can be optimized.
The “Identifications Systems” can be integrated into (existing)
fieldbus systems (e.g. PROFIBUS). The integration of the respective
fieldbus system is undertaken with suitable interfaces.
Standardized software modules (e.g. the Proxy Ident Function Block
for PROFIBUS) enable simple system integration and
commissioning with different controls.
Page 23
D101583 0207BL ident1 – 5
1
The TURCK BL ident System
Characteristics and fields of application of the BL ident system
In order to comply with the demands presented by different fields of
application, TURCK offers the BL ident system with a whole range
of combination possibilities of data carriers and read-write heads as
well as interfaces for integration into fieldbus systems (e.g.
PROFIBUS-DP). Software modules enable simple integration and
commissioning.
The characteristics of the TURCK BL ident system are listed in the
following:
Degree of protection
All data carriers as well as the suitable write-read heads feature a
high mechanical degree of protection (e.g. IP67) and can thus be
subject to the most harsh industrial conditions.
The integration into a fieldbus system is implemented with suitable
TURCK interface modules. The interface modules are available in
degrees of protection IP20 and IP67. TURCK connection cables
featuring an adequate degree of protection round off the
identification system.
Service life
The service life results from the possible number or read-write
operations on the data memory.
FRAM memory features an unlimited number of read operations
and 10
10
write operations.
EEPROM memory features an unlimited number of read operations
and 105 write operations.
The data carrier does not require batteries.
Transmission frequency
The TURCK BL ident system operates with 13.56 MHz transmission
frequency between the data memories and the read/write devices.
Systems which operate with these transmission frequencies are
practically immune to electromagnetic interference. The 13.56 MHz
transmission frequency has developed into a standard in many RFID
fields of application.
Page 24
The TURCK BL ident System
D101583 0207BL ident1 – 6
Size
TURCK supplies the data carriers with diameters of 16, 20, 30 and
50 mm.
The read-write units are available in different housing styles ranging
from cylindrical M18 and M30, to rectangular CK40 and Q80 and
ring-shaped S32XL.
Memory capacity
The memory capacity on the data storage device is 64 Bytes or
128 Bytes with an EEPROM memory and 2KBytes with an FRAM
memory. New data carriers are in the design stage.
FRAM: (Ferroelectric Random Access Memory), non-volatile, high
service life based on the higher number of write-read operations
(10
10
up to 1011)
EEPROM: (Electrically Erasable Programmable Read Only Memory),
non-volatile
Write time/read time (air interface only)
The write and read times depend for all data carriers on the number
of bytes which are to be transferred. On FRAM data carriers the read
and write time are almost identical and are between 0.7 and 3.4 ms/
byte. On EEPROM data carriers the read time is between 0.7 and 6
ms/byte and the write time is between 3.3 and 7.9 ms/byte.
The write-read distances depend on the corresponding combination
of data carrier and read-write head, and can be between 0 and
200 mm. With the BL ident configurator the application variables
speed, range and data quantity can be varied and the optimum
combination can be selected for the respective application. The
configurator is available online at http://www.turck.com/ (also see
page 1 - 8).
Page 25
D101583 0207BL ident1 – 7
The TURCK BL ident System
1
Compatibility
All technical data relates to the BL ident system, i.e. to the
combinations of BL ident data carriers, read-write heads and
interface modules. Completely different values may apply for data
carriers from other manufacturers. Therefore they may only be used
after prior approval by TURCK.
Areas of application (examples):
The characteristics as stated beforehand allow the application of a
TURCK BL ident system in the following fields:
Automotive
Transport and handling
Machine (mechanical) engineering
Food and beverages
Chemicals
Pharmaceuticals and petrochemicals.
Possible areas of application are:
Assembly lines
Conveyors
Industrial manufacturing
Warehousing
Logistics
Distribution
Component picking
Transport logistics
Page 26
The TURCK BL ident System
D101583 0207BL ident1 – 8
The BL ident configurator
The use of sensors and actuators – and even fieldbusses – is stateof-the-art in many industrial fields. When RFID systems are used on
the other hand, there are always questions relating to the airinterface, e.g. "How fast and at which distance can I move the data
carrier past the write-read heads?". That is to say that there is a
certain amount of general uncertainty concerning the range of
applications of an RFID system.
General details such as "recommended write-read distance" or
"transmission speed = 0.5 ms/ byte" are usually not sufficient for
evaluation of the usage of the devices in a determined application,
as the application variables such as data quantity, speed and
distance are the result of a complex interaction between the readwrite heads and data carriers.
With the “BL ident configurator” the respective application can be
simulated and the correct preliminary selection can be made.
The setting of applications parameters by "playing" with the values
allows the user to easily test the options and limits associated with
the respective combinations.
Page 27
D101583 0207BL ident1 – 9
The TURCK BL ident System
1
The online variants of the configurator (available free on the Internet
at www.turck.com) accesses the data in the TURCK product
database and always provides the most up-to-date information.. In
addition to simulating the application, the configurator also
generates the corresponding data sheets and documentation.
Figure: 2
BL ident
configurator
Page 28
The TURCK BL ident System
D101583 0207BL ident1 – 10
Page 29
BL ident System – Planning
2TURCK-BL ident System – Planning
Selection criteria for data carriers, read-write head and interface module.......2
Transfer zone and read-write distance .............................................................3
Length of the transfer zone and width offset....................................................4
Minimum distance of the data carriers to read-write head,
Permissible direction of movement and alignment of the data carrier.............4
Reading and writing in static operation ............................................................4
Reading and writing in dynamic operation (on the fly)......................................5
Dwell time of the data carrier Td.......................................................................5
Calculation of the maximum quantity of user data in dynamic operation ........5
Minimum distances between two adjacent data carriers .................................6
influence of adjacent
2
D101583 0207BL ident
2 – 1
Page 30
BL ident System – Planning
Selection criteria for data carriers, read-write head and interface module
The applic ation should b e judged using t he following cri teria in order
to make the correct selection of BL ident system components:
Mechanical dimensi o ns
Distance from data carriers to read-write heads when reading
and writing
Tolerances in the mechanical guidance
Static and/or dynamic trans f er of data
Data quantities to be transferred
Speed with dynamic writi ng and reading (on the fly)
Metal-free areas with data carriers and read-write heads
Ambient condition s such as humidity, temp erature, chemical
influences, etc.
There are special selectio n cri teria relating to read-write h eads:
Mechanical dimensi o ns
Required transfer zone
Size of the data carrier in use
The following criteria should be considered specially for the use of
the interface modules:
Degree of protection
Bus type
Number of channels
2 – 2D101583 020 7BL ident
Page 31
BL ident System – Planning
S
r
H
L
sr
Transfer zone and read-write distance
Figure 1
Transfer zone
The read-write head generates an alternating inductive field. The
recommended read-write distance results from the combinati o n of
data carrier and read-write head. The appearance of the distribution
of this field depends on the design of the antenna in the data carrier
and in the read-write head.
2
Exchange of data is only possible within the transfer zone (Fig. 1)
with the parameters L
= length of the transfer zone and Sr =
sr
recommended write-read distance. The transfer zone reduces when
the distance from the data carrier to the read-write head increases
and is reduced to a point at the threshold distance H, i.e. as the
distance increases less data can be transferred or the speed at
which the read-write head moves past the data carrier must be
reduced.
Note
Using the BL ident configurator at www.turck.com allows the
relationships to be simulated.
D101583 0207BL ident
2 – 3
Page 32
BL ident System – Planning
Length of the transfer zone LSr and width offset
The length of the transfer zone LSr (Fig. 1) is dependent on the
combination of data carrier an d read-write head.
The width is particularly important for the tolerance of mechanical
tracking.
Note
An illustrative representation of this relationship can be found in the
BL ident configurator at www.turck.com.
Minimum distance of the data carriers to read-write head, influence of adjacent fields
Adjacent fields are practically always a vailable. Normally the
adjacent fields should not be used for transfer of data, so there must
be an minimum distance between data carriers and read-write head.
But with the TURCK BL ident system a minimum distance must not
be observed.
Permissible direction of movement and alignment of the data carrier
The data carrier can pass over the read-write head from any
direction.
The data carriers can have any horizontal alignment. They sh ould
only be aligned in parallel to the read-write head.
Reading and writing in static operation
In static operation a data exchange is possible up to the range of the
threshold distance H. The data carrier must be positioned exactly
above the read-write head.
Reading and writing in dynamic operation (on the fly)
In dynamic operation the data carriers move past the read-write
head. A data exchange is only possible within the transfer zone.
2 – 4D101583 020 7BL ident
Page 33
BL ident System – Planning
Dwell time of the data carrier T
The dwell time Td is the time i n which the data carrier is present in
the transfer zone of the read-write head as it passes by. The readwrite head exchanges data with the data carrier during this time.
The dwell time Td is calculated as follow s:
Td = LSr / V
Tag
where:
LSr:length of the transfer zone
V
:speed of the data carrier in dynamic operation
Tag
In static mode the dwell time can be as long as necessary. The dwell
time must be long enough to ensure that communication with the
data carrier has been completed.
In dynamic operation the dwell time is defined by the system
environme nt. The dwell time must be ma tched to the data quantity
to be transferred. Conversely, this means that the shorter the dwell
time, the lower the quantity of data to be transferred.
d
2
Note
At www.turck.com various examples relating to this topic can be
examined with the BL ident configurator.
Calculation of the maximum quantity of user data in dynamic operation
The calculation of the maximum user data quantity is dependent on
the read-write head used and the corresponding data carrier.
Example:
Read-write head: TB-M18-H1147,
Data carrier: TW-R30-K2
Pass speed: 0.5 m/s
D101583 0207BL ident
2 – 5
Page 34
BL ident System – Planning
The read-write head contacts the data carrier when it is entering
the transfer zone: This takes about 2.7 ms.
With the second contact to th e data carrier the read-write head
recognizes the data carrier. A signal is sent to the interface
module: Duration about 12 ms.
The interface module sends a read-wri te command, e.g. read 4
bytes, incl. version and feedback of the data on the interface
module: Duration about 7 ms.
This results in total to about 22 ms.
Until 4 bytes of data have been processed by the interface module
takes about 5 ms/byte.
This means when the data carrier passes the read-write head, a
max. of 8 bytes can be read or written.
Note
With the BL ident configurator at www.t urck.com different operating
states in dynamic operation can be simulated and represented.
Minimum distances between two adjacent data carriers
The minimum distance between two data c arriers is dependent on
the size of the data carrier and the read-write head.
In dynamic operation (on the fly) the minimum distance is still
dependent on the data quantity and the bus cycle time.
Note
Corresponding tests for determination of the minimum distance
should be undertaken before commissioning.
Reduction of metallic influences.......................................................................2
Installation of severa l read-write heads on metal frames
or metal supports..............................................................................................3
No mounting of the data carrier directly on metal............................................6
Conclusion – influence on the transfer from metal...........................................7
3
D101583 0207BL ident
3 – 1
Page 36
Installation guidelines
metal core
data carrier
read/write head
non-metallic spacer
plate
Overview
Because of the inductive operating principle of the data carriers and
read-write heads, every type of metal (particu larly iron and
ferromagnetic materials) should be avoided in proximity of these
devices, as they will influence the man ner in which they function.
It is neces sary to observe the following importa nt points during
engineering and installation:
Minimum distance between read-write heads
Minimum distance between two adjacent data carriers (see
chapter 2, page 2 - 6)
Metal-free areas with installation of read-write heads and data
carriers on metals
Installation of several read-write heads on metal frames or
metal supports.
Reduction of metallic influences
Problem: A metal support is located above the transfer zone of the
read-write head. This influences the entire field. Specifically, the
transfer zone between read-write head and data ca rrier is reduced
(Fig. 1).
Figure 1
Interfering metal
supports.
3 – 2D101583 020 7BL ident
Page 37
Installation guidelines
metal core
data carrier
read/write head
plate
non-metallic spacer
Remedy: Install the data carriers in a different manner and there will
no longer by an influence on th e transfer zone (Fig. 2).
Figure 2
Other
arrangement of
the data carrier
Installation of several read-write heads on metal frames or metal supports
3
Every read-write head which is mounted on metal couples a part of
the field to the metal support. If the minimum distance d and the
metal-free zones are observed, there is generally no mutual
influence. If however a metal frame should have an unfavourable
form an inf luence is sti ll poss ible. Th is resu lts in longer d ata t ransfer
times and error messages in the in terface module.
Problem: Mutual interference of the read-write heads
D101583 0207BL ident
3 – 3
Page 38
Installation guidelines
d
read/write head
additional strunck
Remedy 1: Extend the distance d between both read-write heads
(Fig. 3).
Figure 3
Extending the
distance
Figure 4
Fitti ng iron stru ts
Remedy 2: Fit one or several iron struts which should short-circuit
the parasiti c fi e lds (Fig . 4) .
3 – 4D101583 020 7BL ident
Page 39
Installation guidelines
non-metallic spacer
Remedy 3: Place a non-metallic intermediary element of 20 to 40
mm thickness between the read-write head and the iron frame. This
will significantly reduce the parasitic coupling of the field and the
support (Fig. 5).
Figure 5
Addition of an
intermediary nonmetallic element
3
Remedy 4: It is also possible to contact the read-write heads via the
function block (PLC) and t o use it to switch them on and off. The
influence through anot her read-write head can be avoided using the
selective mode, where the channel in whose transfer window the
data is located is active (see manual BL ident Proxy-Ident-Block
(PIB), D101578). Using this method the adjacent read-write heads
do not emit a field and th ere is no mutual interference.
D101583 0207BL ident
3 – 5
Page 40
Installation guidelines
h
metal
non-metallic spacer
data carrier
a
No mounting of the data carrier directly on metal
The data carriers (with the exception of high temperature data
carriers) may not be mounted directly on metal. Non-metallic
spacers (see chapter 9, Accessories) enable mountin g which does
not lead to an interruption of the functions (Fig. 6).
Figure 6
Installation with
spacers
Figure 7
Installation
considering the
minimum dist ance
from metal
The data carriers may not be mounted so that the necessary
minimum distance to metal and to the data carriers around them is
less than the minimum distance. The minimum distance is
dependent on the hous ing design of the read-wr ite head; a = 10 mm
around the data carrier can be assumed (Fig. 7). The high
temperature data carrier (see page 5 - 2, table 1) can be constructed
so that it can be mounted directly on metal without the need for
additional measures.
3 – 6D101583 020 7BL ident
Page 41
Installation guidelines
Conclusion – influence on the transfer from metal
The following points should be considered with the installation of the
BL ident components:
Data carriers (except high temperature data carriers) can not be
mounted directly on metal or suitable accessories must be used
(spacers)
It is important to ensure that no metallic rails (or similar parts)
intersect the transfer zone. The met al rails would interfere with
the field data .
Only plastic or stainless steel screws can be used for attachment
of the read-write heads.
3
D101583 0207BL ident
3 – 7
Page 42
Installation guidelines
3 – 8D101583 020 7BL ident
Page 43
4 – 1
EMC Directives
D101583 0207BL ident
4
4EMC directives
For whom are the EMC directives intended?................................................... 2
Dispersion of electromagnetic interference ......................................................2
How can RFID be subject to interference? .................................................3
Shielding the cable......................................................................................7
Page 44
EMC Directives
4 – 2D101583 0207BL ident
For whom are the EMC directives intended?
These EMC directives are intended for:
Project engineers and planners who are planning the system
with the RFID modules to be configured.
Installation personnel, service technicians and engineers, who
use this description to correctly lay the connection cables
or
have to remedy the existing problems during a malfunction.
In this chapter you will learn more about the EMC guidelines,
particularly:
Dispersion of electromagnetic interference
What does EMC mean?
Fundamentals for EMC protection
Installation in a switch cabinet
Avoiding sources of interference
Potential equalisation
Shielding the cable
Dispersion of electromagnetic interference
In a system or installation electromagnetic interference can only occur
if the following components are mutually present:
Source of interference
Interference path
Susceptible equipment.
If one of these components is not present (for example the
interference path), no interference will occur even if the source of
interference sends high levels of interference (Fig. 1):
Figure 1
Interference
components
source of interference
e.g. motor
susceptible equipment
e.g. read/write head
link
e.g. cable connector
Page 45
4 – 3
EMC Directives
D101583 0207BL ident
4
The measures for prevention of the interference (EMC) are relevant
for all three components. The manufacturer is obliged to undertake
all possible measures to counter the development of sources of
interference.
The installation design must be implemented to ensure that mutual
interference of the individual components is avoided or kept to as
low a level as possible.
How can RFID be subject to interference?
Problem: interference radiation from the power supply when
switching mode power supplies are used.
Remedy: use of a stabilized power supply
Problem: interference via the serial connection cable.
Remedy: improved cable shielding and/or read-write head
earthing
HF interference via the antenna from another read-write head or
via an external source of interference which operates using the
same frequency.
Remedy: the interference from another read-write head can be
avoided by using the selective mode (see manual
BL ident Proxy-Ident-Block (PIB), D101578).
Coupled interference
There are four possibilities for coupled interference:
Galvanic coupled interference
Capacitive coupled interference
Inductive coupled interference
Radiated interference
There are different causes for the radiated interference on the data
interface paths:
With cables and wiring:
Incorrect or poorly laid
Missing or incorrectly connected shield
Unfavourable arrangement of the cable
Page 46
EMC Directives
4 – 4D101583 0207BL ident
With the switch cabinet or housing:
Missing or incorrectly wired potential equalization wiring
Missing or incorrect earthing
Unfavourable arrangement
Modules which are not mounted in a fixed position
Unfavourable switch cabinet design.
What does EMC mean?
The increasing component density, increased switching speed of
power electronics and the continuous rise in switching speeds
present more and more sources of interference to electronic
elements of a system. The following generally applies: the higher the
level of automation, the higher the danger of mutual interference.
Definition of EMC:
“Electromagnetic compatibility (EMC) is the capability of an
electrical or electronic device in an electromagnetic environment to
function without fault, without influencing or interfering with the
environment beyond defined limits.”
The TURCK BL ident devices are subjected to test compliance to
the following standards:
EN 61000-4-2 (ESD)
EN 61000-4-3 (Electromagnetic fields)
EN 61000-4-4 (Burst)
EN 61000-4-5 (Surge)
EN 61000-4-6 (immunity to conducted disturbances induced by
radio-frequency fields)
As the RFID modules are only components of an overall system and
sources of interferences can result from the combination of different
components, the design of a system or installation must be subject
to certain guidelines.
In order to obtain an installation which is immune to interference, a
whole package of measures must be implemented; where the
operator of the system or installation is responsible for the RFI
suppression. They must observe and comply with the local and
national stipulations and directives. All measures, which have been
Page 47
4 – 5
EMC Directives
D101583 0207BL ident
4
undertaken during system design save expensive modifications and
elimination of interference at a later date.
Fundamentals for EMC protection
The following elementary rules relating to electromagnetic
compatibility (EMC) must be observed:
Shielding by a housing
Protect the device from external sources of interference by the
installation in a switch cabinet or housing. The cabinet or the
housing must be included in the connection to earth.
Shield the electromagnetic fields from inductances by partition
panels of devices. Use shielded data transmission cables with
metallic connector housings.
Large area ground connections
Connect all inductive metal parts over a large area and use a low
resistance for radio frequencies. Establish a large area
connection between the inactive metal parts and the central
earthing point.
Integrate the shield earth into the earthing concept, i.e. the end
of the shield must be connected to a large area to earth.
Planning of the cable routes
Divide the cables into power groups and lay them separately.
Lay the high power cables and the data cables in separate ducts
or bundles.
Introduce the entire cabling into the cabinet only from one side
and on a single level when possible.
Lay the data cables as close to earthed surfaces as possible.
Twist the incoming and outgoing cables of individually laid
conductor pairs.
In many cases an independent cable guidance for the bus cable
is already provided. Ideally this should also be used for laying the
data cables between read-write heads and interface modules.
Shielding of cables
Shield the data transfer cables and apply the shield on gateway
side. Shield the analogue cables and apply the shield at one end,
e.g. on the drive unit.
Always apply the cable shields at the entry to the switch cabinet
to a large area on the grounding bar and attach them with fixing
clamps.
Page 48
EMC Directives
4 – 6D101583 0207BL ident
Connect the applied shield to the module without interruption.
Use a braided shield and not a metal foil shield.
Mains and signal filter
Use the mains filter with metal housing.
Connect the filter housing on a wide area and with a low radio
frequency resistance to the switch cabinet earth.
Never attach the filter housing to painted surfaces.
Attach the filter at the switch cabinet entry or in the direction of
the interference source.
Installation in a switch cabinet
Metal housings shield susceptible equipment against magnetic and
electrical fields as well as electromagnetic waves. The better that
the induced interference current can flow, the better that the
interference field will weaken itself. It is therefore essential to ensure
that all housing panels are connected electrically conducting to
each other.
If the switch cabinet panels are insulated from one another, an RF
conductive connection using metal braiding and RF clips or RF
paste (the greater the surface area of the connection the better)
must be possible.
Interference can be avoided by optimum switch cabinet design. The
following generally applies:
The effects of the interference generally reduce as the distance
between the susceptible equipment and the source of
interference increases.
An additional reduction in interference can be achieved by
installation of shield panels
Signal cables should keep a minimum distance of at least 10 cm
from high power cables.
External interference induced through the mains is avoided by the
installation of mains filters. Ensure that the mains filter is correctly
rated and fitted directly at the entry to the switch cabinet.
Page 49
4 – 7
EMC Directives
D101583 0207BL ident
4
Avoiding sources of interference
Avoid the installation of sources of interference which occur
primarily due to switched inductances.
Interference is generated primarily by relays, contactors, fluorescent
lamps in the switch cabinet and valves, and can be avoided by the
use of RC combinations, freewheel diodes etc. This also avoids
inductive interference in the cables which are laid parallel to the coil
cables.
Potential equalisation
If the system sections are subject to a different design and different
voltage levels result, potential differences can result between the
different sections of the system. Equalization currents then flow via
signal cables (potential equalization should not be confused with a
protective earth).
Therefore correctly implemented potential equalization is essential.
The following points should be observed:
The potential equalization cable must have a sufficient cross-
section (min. 10 mm
2
).
The distance between signal cables and the respective potential
equalization cable must be as small as possible.
A stranded conductor must be used.
If the potential equalization cables are connected to the central
potential equalization bars, the power components and the nonpower components must be combined.
Shielding the cable
Signal cables must be shielded in order to avoid coupled
interference. Even though the best shielding effect when laying the
cables is achieved by using steel ducts, the use of cables with
braided shields is usually sufficient. Decisive for the effect of the
shield in both cases is however the correct connection, as a nonconnected or incorrectly connected shield has no effect.
Page 50
EMC Directives
4 – 8D101583 0207BL ident
The following must be observed:
As the interference signals are frequently in a range > 10 kHz, a
large area shield connection is necessary.
The shield bar is very conductive and connected over a large
area with the switch cabinet housing and must be as near as
possible to the cable entry. The cable must be stripped and
connected to the grounding bar with an RF clip or cable tie.
The shielding bar must be connected with the PE bar.
If shielded cables have to be interrupted, the shield must
continue via the corresponding connector housing using
suitable connectors.
If intermediate connectors are used which do not feature a
suitable shield, the shield must be connected via cable clips to
the point where it is interrupted.
Page 51
Description of the data carrier
5Description of the data carrier
Type overview...................................................................................................2
Function principle..............................................................................................3
The BLident data carrier s (TAGs) can be written and read on a non-
contact basis using the corresponding read-write heads. The
operating frequency is 13.56 MHz.
The data carriers are passive, i.e. without ba tteries. If the data
carriers enter the transfer range of a read-write head, the energy is
inductively coupled and the data transfer is initiated.
Figure 1
Block diagram
Data carrier
The achievable distances vary depending on the sizes from
15…200 mm. All housing styles (with the exception of the
TW-R16...-B128, EEPROM only) are available both as EEPROM
and FRAM memory variants. The BLident data carrier consists of
a memory module, electronics and an antenna (see Fig. 1).
5
Memory module
The information on the data carrier can be read – and new data can
also be added (read/write). The memory size is 64 Bytes, 128 Bytes
or 2 KBytes.
The memory consists alternatively of the foll owing components:
EEPROM: unlimited read but limited write cycles are possible
(10
FRAM = ferroelectric memory: unlimited read and almost
unlimited wr ite cycles are poss ible (10
D101583 0207BL ident
5
). No battery required.
10
). No battery required.
5 – 3
Page 54
Description of the data carrier
The data retention time of the memory is:
1 year at 85 °C,
10 years at 55 °C,
120 years at 25 °C.
Electrical fields do not have an influence as they are normally have
a frequency which is much too low to erase the memory.
Data carrier electronics
The electronics ensure the communication on the data carrier side
with the read-write head.
Data carrier antenna
The antenna is designed as an air coil and is used to transfer data
and energy between the data carrier and the read-write head.
5 – 4D101583 020 7BL ident
Page 55
Description of the data carrier
2,5
16
3
Technical data TW-R16-B64
Figure 2
TW-R16-B64
5
Table 2:
TW-R16-B64
Type
Ident-No.
TW-R16-B64
6900???
Memory data
Operating frequency
Memory size
13.56 MHz
128 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-25…+85 °C
D101583 0207BL ident
5 – 5
Page 56
Description of the data carrier
Table 2:
TW-R16-B64
Type
Ident-No.
TW-R16-B64
6900???
Storage te m p era ture-25…+120 °C
+160 °C (1 x 35 h)
+220 °C (1 x 30 s)
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialEpoxy, plastic-moulded
5 – 6D101583 020 7BL ident
Page 57
Description of the data carrier
2,5
16
3
Technical data TW-R16-B128
Figure 3
TW-R16-B128
5
Table 3:
TW-R16-B128
Type
Ident-No.
TW-R16-B128
6900501
Memory data
Operating frequency
Memory size
13.56 MHz
128 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-25…+85 °C
D101583 0207BL ident
5 – 7
Page 58
Description of the data carrier
Table 3:
TW-R16-B128
Type
Ident-No.
TW-R16-B128
6900501
Storage te m p era ture-25…+120 °C
+160 °C (1 x 35 h)
+220 °C (1 x 30 s)
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialEpoxy, plastic-moulded
5 – 8D101583 020 7BL ident
Page 59
Description of the data carrier
1,5
ø 20
2,5
ø 20
Technical data TW-R20-B128
Figure 4
TW-R20-B128
5
Table 4:
TW-R20-B128
Type
Ident-No.
TW-R20-B128
6900502
Memory data
Operating frequency
Memory size
13.56 MHz
128 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-25…+85 °C
D101583 0207BL ident
5 – 9
Page 60
Description of the data carrier
Table 4:
TW-R20-B128
Type
Ident-No.
TW-R20-B128
6900502
Storage te m p era ture-40…+90 °C
+140 °C (1 x 100 h)
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialPA6
5 – 10D101583 0207BL ident
Page 61
Description of the data carrier
1,5
ø 30
ø 3,2
2,5
ø 30
ø 5,2
Technical data TW-R30-B128
Figure 5
TW-R30-B128
5
Table 5:
TW-R30-B128
Type
Ident-No.
TW-R30-B128
6900503
Memory data
Operating frequency
Memory size
13.56 MHz
128 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-25…+85 °C
D101583 0207BL ident
5 – 11
Page 62
Description of the data carrier
Table 5:
TW-R30-B128
Type
Ident-No.
TW-R30-B128
6900503
Storage te m p era ture-40…+90 °C
+140 °C (1 x 100 h)
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialPA6
5 – 12D101583 0207BL ident
Page 63
Description of the data carrier
1,5
ø 50
ø 4,2
3
ø 50
ø 5,2
Technical data TW-R50-B128
Figure 6
TW-R50-B128
5
Table 6:
TW-R50-B128
Type
Ident-No.
TW-R50-B128
6900504
Memory data
Operating frequency
Memory size
13.56 MHz
128 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-25…+85 °C
D101583 0207BL ident
5 – 13
Page 64
Description of the data carrier
Table 6:
TW-R50-B128
Type
Ident-No.
TW-R50-B128
6900504
Storage te m p era ture-40…+90 °C
+140 °C (1 x 100 h)
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialPA6
5 – 14D101583 0207BL ident
Page 65
Description of the data carrier
2,5
ø 20
Technical data TW-R20-K2
Figure 7
TW-R20-K2
5
Table 7:
TW-R20-K2
Type
Ident-No.
TW-R20-K2
6900505
Memory data
Operating frequency
Memory size
13.56 MHz
2 KBytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
10
0.5…5 ms/Byte
0.5…5 ms/Byte
Memory typeFRAM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-20…+85 °C
D101583 0207BL ident
5 – 15
Page 66
Description of the data carrier
Table 7:
TW-R20-K2
Type
Ident-No.
TW-R20-K2
6900505
Storage te m p era ture-20…+85 °C
+140 °C (1 x 100 h)
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialPA6
5 – 16D101583 0207BL ident
Page 67
Description of the data carrier
2,5
ø 30
ø 5,2
Technical data TW-R30-K2
Figure 8
TW-R30-K2
5
Table 8:
TW-R30-K2
Type
Ident-No.
TW-R30-K2
6900506
Memory data
Operating frequency
Memory size
13.56 MHz
2 KBytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
10
0.5…5 ms/Byte
0.5…5 ms/Byte
Memory typeFRAM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-20…+85 °C
D101583 0207BL ident
5 – 17
Page 68
Description of the data carrier
Table 8:
TW-R30-K2
Type
Ident-No.
TW-R30-K2
6900506
Storage te m p era ture-20…+85 °C
+140 °C (1 x 100 h)
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialPA6
5 – 18D101583 0207BL ident
Page 69
Description of the data carrier
3
ø 50
ø 5,2
Technical data TW-R50-K2
Figure 9
TW-R50-K2
5
Table 9:
TW-R50-K2
Type
Ident-No.
TW-R50-K2
6900507
Memory data
Operating frequency
Memory size
13.56 MHz
2 KBytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
10
0.5…5 ms/Byte
0.5…5 ms/Byte
Memory typeFRAM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-20…+85 °C
D101583 0207BL ident
5 – 19
Page 70
Description of the data carrier
Table 9:
TW-R50-K2
Type
Ident-No.
TW-R50-K2
6900507
Storage te m p era ture-20…+85 °C
+140 °C (1 x 100 h)
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialPA6
5 – 20D101583 0207BL ident
Page 71
Description of the data carrier
30
125
10
ø 22
Technical data TW-R22-HT-B64
Figure 10
TW-R22-HT-B64
5
Table 10:
TW-R22-HT-B64
Type
Ident-No.
TW-R22-HT-B64
1542323
Memory data
Operating frequency
Memory size
13.56 MHz
64 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-25…+85 °C (time-dependent)
D101583 0207BL ident
5 – 21
Page 72
Description of the data carrier
Table 10:
TW-R22-HT-B64
Type
Ident-No.
TW-R22-HT-B64
1542323
Storage te m p era ture-40…+210 °C
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialPA66
5 – 22D101583 0207BL ident
Page 73
Description of the data carrier
ø 95
ø 108,5
ø 136,5
ø 125
68
ø 5,5
(3 x 120°)
Technical data TW-R50-90-H T-B128
Figure 11
TW-R50-90-HTB128
5
Table 11:
TW-R50-90HTB128
Type
Ident-No.
TW-R50-90-HT-B128
1542326
Memory data
Operating frequency
Memory size
13.56 MHz
128 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
–
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-25…+85 °C (time-dependent)
D101583 0207BL ident
5 – 23
Page 74
Description of the data carrier
Table 11:
TW-R50-90HTB128
Type
Ident-No.
TW-R50-90-HT-B128
1542326
Storage te m p era ture-40…+210 °C
Degree of protection (IEC
IP67
60529/EN 60529)
Housing materialPA66
5 – 24D101583 0207BL ident
Page 75
Description of the data carrier
ø 95
ø 108,5
ø 136,5
ø 125
68
ø 5,5
(3 x 120°)
Technical data TW-R50-90-HT-K2
Figure 12
TW-R50-90-HTK2
5
Table 12:
TW-R50-90-HTK2
Type
Ident-No.
TW-R50-90-HT-K2
1542329
Memory data
Operating frequency
Memory size
13.56 MHz
2 KBytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
10
0.5…5 ms/Byte
0.5…5 ms/Byte
Memory typeFRAM
Installation guidelines
Minimum distances when
–
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-20…+85 °C (time-dependent)
D101583 0207BL ident
5 – 25
Page 76
Description of the data carrier
Table 12:
TW-R50-90-HTK2
Type
Ident-No.
TW-R50-90-HT-K2
1542329
Storage te m p era ture-40…+210 °C
Degree of protection (IEC
IP68
60529/EN 60529)
Housing materialPA66
5 – 26D101583 0207BL ident
Page 77
Description of the data carrier
14
Technical data TW-I14-B128
Figure 13
TW-I14-B128
5
Table 13:
TW-I14-B128
Type
Ident-No.
TW-I14-B128
6900526
Memory data
Operating frequency
Memory size
13.56 MHz
128 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourblack
Ambient temperature-25…+85 °C
D101583 0207BL ident
5 – 27
Page 78
Description of the data carrier
Table 13:
TW-I14-B128
Type
Ident-No.
TW-I14-B128
6900526
Storage te m p era ture-25…+120 °C
+160 °C (1 x 35 h)
+220 °C ( 1 x 30 s)
Degree of protection (IEC
IP10
60529/EN 60529)
Housing materialEpoxy foil
5 – 28D101583 0207BL ident
Page 79
Description of the data carrier
43
43
Technical data TW-L43-43-F-B128
Figure 14
TW-L43-43-FB128
5
Table 14:
TW-L43-43-FB128
Type
Ident-No.
TW-L43-43-F-B128
6901344
Memory data
Operating frequency
Memory size
13.56 MHz
128 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourwhite
Ambient temperature-20…+70 °C
D101583 0207BL ident
5 – 29
Page 80
Description of the data carrier
Table 14:
TW-L43-43-FB128
Type
Ident-No.
TW-L43-43-F-B128
6901344
Storage te m p era ture-20…+70 °C
Degree of protection (IEC
IP40
60529/EN 60529)
Housing materialFoil, self-adhesive
5 – 30D101583 0207BL ident
Page 81
Description of the data carrier
49
82
Technical data TW-L82-49-P-B128
Figure 15
TW-L82-49-PB128
5
Table 15:
TW-L82-49-PB128
Type
Ident-No.
TW-L82-49-P-B128
6901345
Memory data
Operating frequency
Memory size
13.56 MHz
128 Bytes
Number of read operationsunlimited
Number of write operatio ns10
Read time (typical)
Write time (typical)
5
0.5…5 ms/Byte
3…6 ms/Byte
Memory typeEEPROM
Installation guidelines
Minimum distances when
10 mm
mounting in metal (around the
data carrier)
General data
Colourwhite
Ambient temperature-20…+70 °C
D101583 0207BL ident
5 – 31
Page 82
Description of the data carrier
Table 15:
TW-L82-49-PB128
Type
Ident-No.
TW-L82-49-P-B128
6901345
Storage te m p era ture-20…+70 °C
Degree of protection (IEC
IP40
60529/EN 60529)
Housing materialPaper, self-adhesive
5 – 32D101583 0207BL ident
Page 83
Description of the read-write heads
6Description of the read-write heads
Type overview.................................. ... .......................................... ....................2
Function principle..............................................................................................3
Read-write head electronics ....................... ... .......................................... ...3
Read-write head antenna....................... .. ... .......................................... ......4
The BLident read-write heads (transceivers) are used for noncontact data exchange with the corresponding data c arriers (TAGs).
They form the so-called air-interface (transfer window), whose size
varies depending on the combination of data carrier and transceiver.
In this air-interface the data carrier is supplied with energy and the
exchange of data is also implemented. The operating frequency is
13.56 MHz.
The achievable distances vary depending on the sizes from 15…200
mm. The read-write heads consist of electronics and an antenna.
(Figure 1)
Figure 1
Block diagram
Read-write head
6
Read-write head electronics
The electronics ensure the communication between the data carrier,
the read-write head and the BLident interface module.
D101583 0207BL ident
6 – 3
Page 86
Description of the read-write heads
Read-write head antenna
The antenna consists of an air coil. It is used to transfer data and
energy between the data carrier and the read-write head. The
antenna generates an electromagnetic field which is detected by the
data carrier within the transfer zone. A data and energy transfer is
only possible as long as the data carrier is located in this field
(Figure 2).
Active face materialPlastic, LCP-GF30
ConnectionConnector, M12 × 1
Vibration resistance
55 Hz (1 mm)
Shock resistance30 g (11 ms)
Degree of protectionIP67
Power ON indicationGreen LED
Function displayGreen LED, flashing
6 – 12D101583 0207BL ident
Page 95
Description of the read-write heads
36/5
46
62
LED
M30 x 1,5
9
M12 x 1
Technical data TB-M30-H1147
Figure 11
TB-M30-H1147
Table 10:
TB-M30-H1147
This device complies with Part 15
of the FCC Rules.
Operation is subject to the
following two conditions:
(1) this device may not cause
harmful interference, and
(2) this device must accept any
interference received, including
interference that may cause
undesired operation.
Active face materialPlastic, PA12-GF30
ConnectionConnector, M12 × 1
Vibration resistance
55 Hz (1 mm)
Shock resistance30 g (11 ms)
Degree of protectionIP67
Power ON indicationGreen LED
Function displayGreen LED, flashing
D101583 0207BL ident
6 – 13
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Description of the read-write heads
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46
62
LED
M30 x 1,5
9
M12 x 1
Technical data TB-M30-H1147/S1126
Figure 12
TB-M30-H1147/
S1126
Table 11:TB-M30
-H1147/S1126
This device complies with Part 15
of the FCC Rules.
Operation is subject to the
following two conditions:
(1) this device may not cause
harmful interference, and
(2) this device must accept any
interference received, including
interference that may cause
undesired operation.
Active face materialPlastic, PA12-GF30
ConnectionConnector, M12 × 1
Vibration resistance
55 Hz (1 mm)
Shock resistance30 g (11 ms)
Degree of protectionIP67
Power ON indicationGreen LED
Function displayGreen LED, flashing
6 – 14D101583 0207BL ident
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Description of the read-write heads
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62
LED
M30 x 1,5
9
M12 x 1
Technical data TB-EM30WD-H1147
Figure 13
TB-EM30WDH1147
Table 12:TBEM30WD-H1147
This device complies with Part 15
of the FCC Rules.
Operation is subject to the
following two conditions:
(1) this device may not cause
harmful interference, and
(2) this device must accept any
interference received, including
interference that may cause
undesired operation.
Active face materialPlastic, LCP-GF30
ConnectionConnector, M12 × 1
Vibration resistance
55 Hz (1 mm)
Shock resistance30 g (11 ms)
Degree of protectionIP67
Power ON indicationGreen LED
Function displayGreen LED, flashing
D101583 0207BL ident
6 – 15
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Description of the read-write heads
36/5
46
62
LED
M30 x 1,5
9
M12 x 1
Technical data TB-EM30WD-H1147/S1126
Figure 14
TB-EM30WDH1147/S1126
Table 13:
WD-H1147/S1126
TB-EM30
Type
Ident-No.
TB-EM30WD-H1147/S1126
7030225
Mounting conditionflush
Ambient temperature
-25…+ 70 °C
This device complies with Part 15
of the FCC Rules.
Operation is subject to the
following two conditions:
(1) this device may not cause
harmful interference, and
(2) this device must accept any
interference received, including
interference that may cause
undesired operation.
Active face materialPlastic, LCP-GF30
ConnectionConnector, M12 × 1
Vibration resistance
55 Hz (1 mm)
Shock resistance30 g (11 ms)
Degree of protectionIP67
Power ON indicationGreen LED
Function displayGreen LED, flashing
6 – 16D101583 0207BL ident
Page 99
Description of the read-write heads
36/5
46
62
LED
M30 x 1,5
9
15
M12 x 1
Technical data TN-M30-H1147
Figure 15
TN-M30-H1147
Table 14:
TN-M30-H1147
This device complies with Part 15
of the FCC Rules.
Operation is subject to the
following two conditions:
(1) this device may not cause
harmful interference, and
(2) this device must accept any
interference received, including
interference that may cause
undesired operation.
Active face materialPlastic, PA12-GF30
ConnectionConnector, M12 × 1
Vibration resistance
55 Hz (1 mm)
Shock resistance30 g (11 ms)
Degree of protectionIP67
Power ON indicationGreen LED
Function displayGreen LED, flashing
D101583 0207BL ident
6 – 17
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Description of the read-write heads
36/5
46
62
LED
M30 x 1,5
9
15
M12 x 1
Technical data TN-M30-H1147/S1126
Figure 16
TN-M30-H1147/
S1126
Table 15:TN-M30H1147/S1126
This device complies with Part 15
of the FCC Rules.
Operation is subject to the
following two conditions:
(1) this device may not cause
harmful interference, and
(2) this device must accept any
interference received, including
interference that may cause
undesired operation.