Trimble 613 Users Manual
Data Sheet
Apr 28’th
.
2005 Rev
2.2
802.11
g
Wireless LAN SiP Module
(
WM
-BG-MR
-
01)
www.usi. com.tw
PRODUCT SPECIFICATION
o f 802.11g
WM-BG-MR -01 B2B Wireless Lan +BT Combo Module
All rights are reserved by USI. No part of this technical docum ent can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
802.11g Wireless LAN+BT SiP combo Module V2.2
16 bit PC Card /CF+ bus interface
enable high performance
Lead Free design which supporting Green
Small size suitable for low volume system
Introduction
The 802.11 Wireless SiP module WM-BG-MR-01
which refers as “SiP-g combo module” is a small
size module that provid es full function of 802.11g/b
and Bluetooth class 2 on a tiny module via 60 pins
board to board connector.
This multi- functionality and board to board physical
interface provides
for WiFi and UART for Bluetooth.
The small size & low profile physical design make it
easier for system design to
wireless connectivity without space constrain. The
low power consumption (Sleep mode 1 mA) and
excellent radio performance make it the best
solution for OEM customers who require embedded
802.11g Wi-Fi + Bluetooth featuress, such as,
Wireless PDA, Scanner Smart phone, Media player
slim type Notebook, barcode ,mini-Printer, VoIP
phone etc.
For 802.11g feature, Marvel l “Libertas” chipset
solution is adopted and CSR BlueCore 03-ROM for
Bluetooth. The Radio architecture & high integration
MAC/BB chip provide excellent sensitivity with rich
system performance. Two antenna connectors
provide antenna connectivity for each function.
WM-BG-AG-01 provides outstanding BT WiFi coexistence solution through internal 2 wires ,
hardware interface to optimized connection with
CSR Bluetooth solution even without good antenna
isolation between BT & WiFi module.
In addition to WEP 64/128, WPA and TKIP, AES is
supported to provide the latest security requirement
on your network.
For the software and driver development, USI
provides extensive technical document and
reference software code for the system integration
under the agreement of Marvell International Ltd.
Features
l
l 2 wires, hardware signaling BT WiFi co-
l
l Low power consumption & excellent
l 2.412-2.484 GHz two SKUs for worldwide
l Easy for integration into mobile and
design requirement.
existence supported.
integration.PCM audio interface
supported.
power management performance, extend
battery life.
market.
handheld device with flexible system
configuration and antenna design.
All rights are reserved by USI. No part of this technical docum ent can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
802.11g Wireless LAN+BT SiP combo Module V2.2
Executive summary for target available
to
Modify the function description for
to
Correct the Pin Definition for xxx_B is
add description for Pin 28;36;43;58 ;
s PCM interface ,
1. correct the pin definition for Pin24 from
gnal to enable engineer testing
operation. This signal is connected to ground at module
then Type is for GND to
the pin
This address range is mainly used
for accessing the CIS in Memory Mode. Signal
, Type
Input ,
Change Sheet
Rev.
Date
Page Par Change(s)
1.0 10/1/04 All All Draft version for Review
2.0 04/1 1/05 6,15,
2.1 04/18/05 25
Description of change
1.
17,22
,23,
25~2
7
2. Output power for 11g is 13 +/- 1dBm
3. Update the mech. Drawing .
4.
5.
6.
“Control si
mode “ to “Output signal to indicate 16 bit IO
date from “the middle of 1Q 2005”
“ the end of 2Q”
Marvell Transceiver from ”8010”
“8015”
for “active_high”
which reserved for BT ’
make it no confuse in customer reading.
Approval & Date
side to indicate 16 bit IO..”
indicate the module under the mode for 16bit IO.
2.2 04/28/05 24 1. Pin A10 pin definition change from “
is open to “
HA0 is not used in word access mode.”
change from “ No connection” to “
PD,5VT”
All rights are reserved by USI. No part of this technical docum ent can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
802.11g Wireless LAN+BT SiP combo Module V2.2
TABLE OF CONTENTS
1. EXECUTIVE SUMMARY................................................................................................................ 6
2. DELIVERABLES............................................................................................................................. 6
3. REFERENCE DOCUMENTS......................................................................................................... 7
4. TECHNICAL SPECIFICATION .....................................................................................................8
4.1. ABSOLUTE MAXIMUM RATING...............................................................................................8
4.2. RECOMMENDABLE OPERATION CONDITION......................................................................8
4.2.1. TEMPERATURE, HUMIDITY................................ ............................................................. 8
4.2.1. VOLTAGE AND CURRENT ...............................................................................................8
BLUETOOTH......................................................................................................................................8
4.3. COMPACTFLASH SPECIFICATION.........................................................................................9
4.3.1. DC ELECTRICALS................................ .............................................................................9
4.3.2. AC ELECTRICALS................................ .............................................................................9
4.3.3. COMPACTFLASH PROTOCAL TIMING.........................................................................10
4.4. WIRELESS SPECIFICATIONS ................................................................................................14
4.5. RADIO SPECIFICATIONS 802.11G........................................................................................15
4.6. RADIO SPECIFICATIONS 802.15 BLUETOOTH................................ ................................... 15
4.7. BLUETOOTH RADIO CHARACTE RISTICS............................................................................16
4.8. DIMENSIONS, WEIGHT AND MOUNTING.............................................................................17
4.8.1. DIMENSIONS................................ ...................................................................................17
4.8.2. WEIGHT............................................................................................................................17
4.8.3. MOUNTING ......................................................................................................................17
4.9. SHOCK AND VIBRATION........................................................................................................17
5. COMPATIBILITY AND INTEROPERABILITY ......................................................................... 18
5.1. WI-FI LOGO..............................................................................................................................18
5.2. WHQL COMPLIANCE..............................................................................................................18
6. CONFIGURABILITY..................................................................................................................... 18
7. SECURITY...................................................................................................................................... 18
8. OPERATING SYSTEM COMPATIBILITY................................................................................. 18
9. LEGAL, REGULATORY & OTHER TECHNICAL CONSTRAINTS ..................................... 18
9.1. EMC ..........................................................................................................................................19
9.2. PRODUCT SAFETY SPECIFICATION....................................................................................19
9.3. COMPONENT SPECIFICATION .............................................................................................19
9.4. RADIO REQUIREMENTS AND APPROVALS ........................................................................20
9.5. PRODUCT MARKING ..............................................................................................................21
9.6. ENVIRONMENTALLY SAFE MATERIAL RESTRICTIONS....................................................21
10. FUNCTIONAL DESCRIPTION................................................................................................ 22
10.1. HARDWARE............................................................................................................................. 22
10.2. HOST INTERFACE.................................................................................................................. 23
All rights are reserved by USI. No part of this technical docum ent can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
802.11g Wireless LAN+BT SiP combo Module V2.2
10.2.1. LED INTERFACE .............................................................................................................27
10.2.2. ANTENNA INTERFACE ................................ ...................................................................27
10.2.3. BLUETOOTH INTERFACE..............................................................................................28
10.3. SOFTWARE.............................................................................................................................. 28
11. DESIGN FOR EXCELLENCE (DFX)...................................................................................... 28
11.1. TESTABILITY...........................................................................................................................28
11.2. LOGISTICS............................................................................................................................... 28
12. HUMAN FACTORS................................................................................................................... 29
13. INDUSTRIAL DESIGN .............................................................................................................. 29
14. RELIABILITY.............................................................................................................................. 29
15. PACKAGE.................................................................................................................................. 29
All rights are reserved by USI. No part of this technical docum ent can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
802.11g Wireless LAN+BT SiP combo Module V2.2
1. EXECUTIVE SUMMARY
The WM-BG-MR-01 module - is one of the product families in USI’s product offering, targeting for
system integration requiring a smaller form factor. It also provides the standard migration to high
data rate to USI’s current SIP customers. The WM-BG-MR-01 module providing B to B type
connector is provided as option for customers, who want to have Board to board type assembly.
This document outlines the product requirements for a “system in Package” 802.11g /(b) combo module –
here after referred as WM-BG-MR-01 Module.
This product is targeted for first shipments by end of 2Q 2005 and is designated for use in
embedded applications mainly in the mobile device, which required, small size and high data rate
wireless connectivity. The application such as, Wireless PDA, slim type Notebook, Media Adapter,
Barcode scanner, mini-Printer, VoIP phone, Data storage device could be the potential application
for wireless WM-BG-MR-01.
2. DELIVERABLES
The following products and software will be part of the product.
• WM -BG-MR-01 Module with packaging
• Evaluation kits, including application (CF, PCMCIA Adapter card, RF cable with SMA
connector, antenna),
Software utility which supporting customer for integration, performance test, and
•
homologation. Capable of testing, loading (firmware) and configuring (MAC, CIS) for the
WM -BG-MR-01 module.
• Unit Test / Qualification report
• Product Specifications.
• Agency certification pre-test report base on adapter board s
All rights are reserved by USI. No part of this technical docum ent can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
802.11g Wireless LAN+BT SiP combo Module V2.2
3. REFERENCE DOCUMENTS
C.I.S.P.R.
Pub. 22
"Limits and methods of measurement of radio interference
characteristics of information technology equipment." International
Special Committee on Radio Interference (C.I.S.P.R.), Third Edition,
1997.
CB Bulletin
No. 96A
CFR 47,
Part 15-B
CFR 47,
Part 15-C
CSA C22.2
No. 950-95
EN 60 950 "Safety of Information Technology Equipment Including Electrical
IEC 950 "Safety of Information Technology Equipment Including Electrical
"Adherence to IEC Standards: “Requirements for IEC 950, 2nd Edition
and Amendments 1 (1991), 2(1993), 3 (1995) and 4(1996). Product
Categories: Meas, Med, Off, Tron." IEC System for Conformity Testing
to Standards for Safety of Electrical Equipment (IECEE), April 2000.
"Unintentional Radiators". Title 47 of the Code of Federal Regulations,
Part 15, FCC Rules, Radio Frequency Devices, Subpart B.
"Intentional Radiators". Title 47 of the Code of Federal Regulations,
Part 15, FCC Rules, Subpart C. URL:
http://www.access.gpo.gov/nara/cfr/waisidx_98/47cfr15_98.html
"Safety of Information Technology Equipment including Electrical
Business Equipment, Third Edition." Canadian Standards Association,
1995, including revised pages through July 1997.
Business Equipment." European Committee for Electrotechnical
Standardization (CENELEC), 1996, (IEC 950, Second Edition, including
Amendment 1, 2, 3 and 4).
Business Equipment." European Committee for Electrotechnical
Standardization, Intentional Electrotechnical Commission. 1991, Second
Edition, including Amendments 1, 2, 3, and 4.
IEEE 802.11 “Wireless LAN Medium Access Control (MAC) And Physical Layer (PHY)
Specifications.” Institute of Electrical and Electronics Engineers. 1999.
All rights are reserved by USI. No part of this technical docum ent can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
802.11g Wireless LAN+BT SiP combo Module V2.2
4. TECHNICAL SPECIFICATION
The WM-BG-MR-01 is a B2B type assembly part, technical supporting, package
requirement needs to be taken into consideration.
4.1. ABSOLUTE MAXIMUM RATING
Supply Power Max +3.6 Volt
Non Operating Temperature - 40° to 85° Celsius
Voltage ripple +/- 2% Max. Values not exceeding Operating
voltage
4.2. RECOMMENDABLE OPERATION CONDITION
4.2.1. TEMPERATURE, HUMIDITY
The WM-BG-MR- 01 module has to withstand the operational requirements as listed in the
table below.
Operating Temperature -20° to 60° Celsius
Humidity range Max 95% Non condensing, relative humidity
4.2.1. VOLTAGE AND CURRENT
Power supply for the WM-BG-MR- 01 module will be provided by the host via the power pins
There will be separated power source for WiFi and Bluetooth.
802.11 g(b)
Voltage : VDD
Operating Voltage 3.3 Volt +- 10%
Current
Transmit 450 mA Typical
Receive 275 mA
Sleep connected 1mA Average
Inrush current 3000 mA Max.
The power consumption is standard related.
Bluetooth
Voltage : VDD
Operating Voltage 3.3 Volt +- 10%
All rights are reserved by USI. No part of this technical docum ent can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
802.11g Wireless LAN+BT SiP combo Module V2.2
Current
Transmit 50 mA Typical
Receive ?40 mA
Sleep connected ? mA Average
4.3. COMPACTFLASH SPECIFI CATION
4.3.1. DC ELECTRICALS
The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended
Operation Condition” unless specified.
Power supply : VDD=3.3V
Symbol Parameter Condition Min Typ Max Units
V IH
V IL
VOH
V OL
Input high voltage 0.5 VDD - VDD+0.5 V
Input low voltage -0.5 - 0.35VDD V
Output high voltage 2.4 - - V
Output low voltage - - 0.4 V
4.3.2. AC ELECTRICALS
The DC specification is under 3.3 voltage. Over full range of values specified in the “Recommended
Operation Condition” unless specified.
Power supply : VDD = 3.3V
Symbol Parameter Condition Min Typ Max Units
I OH
I OL
V OH
V OL
Input high voltage =0.7 VDD 11.3 - 32 mA
Input low volt age =0.18VDD 10.5 - 38 mA
Output high voltage 0.2VDD- 0.6VDD 2.4 0.518 4.0 V/ns
Output low voltage 0.6VDD-0.2VDD - 0.592 4.0 V/ns
All rights are reserved by USI. No part of this technical docum ent can be reproduced in any form without permission of USI.
Preliminary release for evaluation, Subject to be changed without Notice
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