TRANS DIMENSION TD242LP User Manual

Datasheet

March 22, 2004 MU4001, Rev 1.1

TD242LP

USB On-The-Go Low Power, Two Port, Single Chip Host/Peripheral Controller

Description

TransDimension’s TD242LP is a Low Power, single chip USB Host and Peripheral controller that is the second controller in the family of integrated low-cost, high-performance, On-the-Go (OTG) controllers optimized and specifically designed for embedded systems, peripherals, mobile communication, and consumer products. The TD243 was the first controller in the USB OTG family delivered to the market by TransDimension. The TD242LP is a combination of a standard USB Host controller and an OTG Dual-Role Device controller. The TD242LP enables any embedded system to operate as a USB Host and Peripheral, thereby dramatically expanding the degree of interconnectivity and extending the applicability of USB into many new areas, especially low power, mobile markets. Software support for the TD242LP is available from SoftConnex Technologies, Inc., a wholly owned subsidiary of TransDimension Inc., and includes USBLink OTG Stack, ported to a wide variety of RTOSs, interface code to the TD242LP and USB device drivers. Peer-to-Peer connectivity is made simple with the TD242LP since USB connectivity is achieved without PC intervention. Applications include mobile and post-PC products such as cellular phone, palmtop PC, PDA, MP3 players, projectors, and Internet appliances, to name a few. The TD242LP can operate in the following modes:

 USB On-the-Go Dual-Role Device: One OTG port

 Simultaneous standard USB host with one

 Standard USB host with two downstream ports

The host controller in the TD242LP is the only true transfer level embedded USB host and On-the-Go controller that can be interfaced directly to most popular microprocessors and is easily programmable. The active endpoint and transfer descriptors are located in the on-chip memory, thus significantly reducing processor overhead relative to any comparable product on the market.

The full speed peripheral controller is very flexible and software configurable, in terms of the active bidirectional endpoint number (12), type, size, and buffering mechanism of each endpoint.

Features

 Concurrent operation of On-The-Go, Host and

Peripheral ports

 Fully compliant with USB On-the-Go specification

and USB Specification Rev. 2.0 for full-speed (12Mb/s) and low-speed (1.5Mb/s) USB devices

 High-performance USB host: Full USB bandwidth

utilization with low load on system microprocessor without bus mastering

 Transaction scheduling and transfer level protocol

implemented in hardware including bandwidth management, data toggle and retry

 Isochronous transfer with loose timing

requirements on the microprocessor

 Fast microprocessor access cycle (~25MB/s for

16-bit data bus)

 Double/multi buffering support for all four types of

USB transfers

 Separate transfer descriptor and data memory

space

 Capable of supporting up to 500mA to peripherals

when using external 5V power supply from an external charge pump

plus a standard USB host with one downstream port

downstream port and one USB peripheral upstream port

 No built-in charge pump leads to smaller die size

and more cost savings

 Integrated on-chip pull-up and pull-down resistors

 Power saving mode for whole chip and host

controller, and suspend mode for peripheral controller

 Integrated PLL supports external crystal or crystal

oscillators of 6MHz, 12MHz, 24MHz, and 48MHz

 Single 3.3V power supply, 2.5V to 3.3 V I/O

(LVCMOS/TTL), 5 V tolerant

 Software and hardware Host Negotiation Protocol

 Session Request Protocol

 Direct interface to microprocessors, RISC, CISC,

and DSPs including but not limited to x86, Intel XScale & StrongARM, Hitachi SH3, Fujitsu SPARCLite, NEC and Toshiba MIPS, ARM7,

TransDimension Inc. — Proprietary

TransDimension Data Sheet

r

A

r

A

r

TD242LP

ARM9, Motorola PowerPC, ColdFire and Dragonball among others

 Embedded RTOS software available for WinCE,

Linux, VxWorks, Nucleus, LynxOS, QNX, pSOS, PowerTV, SMX, AMX, ThreadX, VRTX, ITRON, Symbian OS and MS-DOS operating systems among others

Architecture

OSC

OSC OSC

OSC CLK

CLK

W

CLKCFG

/RESET

/CS

/WR

/RD

:A

12

D

:D

D

:D

15

INT

TEST

1

1 2

2

/

1

0

PLL

µP

Interface

Test

Control

PSC

48 MHz

48 MHz 12 MHz

12 MHz

System

Configuration

&

Control

Registers

USB Function

USB Peripheral

Controlle

Registers

Memory

Blocks

USB Host

USB Host Controlle

Controlle Registers

Registers

 USB device driver software available including

printer, speaker, mass storage, hub, modem, Ethernet, mouse, keyboard, digital camera, video camera, cell phone, STB, PDA, etc.

 Programmable IRQ polarities

 64 ball TF-BGA & 64 pin LQFP packages available

PSH

USB

Function

Peripheral

Control

Logic

USB

USB Host

Host

Control

Logic

PSH

PSF

Function

Peripheral

SIE

Host

SIE

&

Root

Hub

Voltage

Voltage Regulato

Regulato

VBus Control

Circuit

HNP/ SRP

Logic

H/F

OTG

Trans -

ceive

USB

Trans -

Trans ceive

ceive

ENVREG

ENVREG VREGOUT

VREGOUT VBUS

VBUS /EXVBO

/EXVBO

VBP

ID

DM

DM DP

DP

DM

DM DP

DP

/PO

/OC

1

2

Figure 1 – TD242LP Architectural Block Diagram

USB/OTG Host logic blocks: The USB Host Controller Logic, the host Serial Interface Engine (SIE) and the root

hub are responsible for the fully complaint (not reduced) USB host of the TD242LP - supporting transfer level user interface, scheduling/processing transactions, and monitoring/handling port events.

USB/OTG Peripheral logic blocks: The USB Peripheral Controller Logic, together with the peripheral SIE, manages all low-level USB peripheral protocols upon which a fully compliant full speed USB peripheral is operated.

Interrupt Handling: Interrupts from the TD242LP to a microprocessor are minimum, as an interrupt is generated only at the end of a USB transfer (for both host and peripheral), which can have a size of up to 4 Mbytes*. Moreover, an interrupt event may be delayed inside the TD242LP, and be bundled with others to further reduce the number of interrupt occurrences.

• Even though invisible to the high level software, low level interrupts are necessary to handle 4KByte internal data RAM.

TransDimension Inc. — Proprietary

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Data Sheet TransDimension TD242LP

Memory blocks: The Host Controller Logic, the Peripheral Controller logic, and the microprocessor are all entitled

to have access to the memory blocks for data and control. A RAM Arbiter sequences all RAM access.

Register banks: There are 3 register banks used for System Configuration, Host Control, and Peripheral Control.

Host Negotiation Protocol (HNP): The user may select one of two HNP types supported in the TD242LP. The

user simply selects software or hardware HNP, depending on their application, with each type of HNP having its own merits. Hardware HNP is a built-in state machine, which reduces microprocessor interrupts, whereas, software HNP is maintained and manipulated in the software space and provides an extra option to the user.

Both types of HNP, when enabled, will support negotiation with an attached OTG device, in order to determine in which role (A-device or B-device) the TD242LP will operate as, in a session. The TD242LP contains the required analog components (comparators, etc.) and digital logic to support the operation. The microprocessor interfaced to the TD242LP can also disable this negotiation process, and configure the Dual-Role Device port of the TD242LP to operate as a host or peripheral. HNP may only be implemented in conjunction with a Mini-AB receptacle.

Session Request Protocol (SRP): The USB OTG specification is positioned to service mobile products that are battery powered. The SRP protocol allows the A-device to conserve power by turning the USB VBus signal off depending on whether there is USB traffic. The B-device will have the capability to initiate bus activity via SRP and hence the A-device will be capable of responding to this via SRP. The TD242LP On-The-Go port fully complies to the SRP protocol as described and defined in the USB On-The-Go specification.

Operational Modes: The TD242LP can be operated in different modes via software configuration:

Port 1 Port 2 Application

On-The-Go

Host Only

Peripheral and Host

Microprocessor interface: The TD242LP is a memory mapped device that can easily interface, gluelessly, to the

system bus of most popular microprocessors, CISC, RISC and DSPs including but not limited to x86, Intel XScale & StrongARM, Hitachi SH3, Fujitsu SPARCLite, NEC and Toshiba MIPS, ARM7, ARM9, Motorola PowerPC, ColdFire and Dragonball, among others. Reference designs and evaluation boards for some of these processors are available with new designs being added and tailored to fit particular customer needs.

Software support: TransDimension is a leader in the USB embedded market, bringing both software and silicon to its customers. TransDimension provides development and support packages and a wide spectrum of USB host and On-The-Go software support in C source code to reduce development cost and time to market for its customers. Software for a variety of operating systems is fully tested and supported to easily interoperate with the above listed microprocessors. TransDimension is a Microsoft Windows embedded partner.

TransDimension Inc. — Proprietary

OTG Host OTG application and one host port

(concurrent OTG/Host operation supported. The OTG port may behave in either host or peripheral modes and dynamically switch between roles through the HNP, or when directed by a user by changinig of USB cable connection)

Host Host Host only controller with two ports

Peripheral Host Peripheral and Host ports

3

TransDimension Data Sheet

r

A

r

A

r

A

r

A

r

A

r

A

r

A

r

TD242LP

TransDimension is a Microsoft Windows Embedded Partner (WEP) and supplies Host Controller Driver (HCD) Interface code to the TD242LP for Linux and WinCE operating systems, as well as applicable USB class and device drivers for use in a wide variety of mobile and post-PC products.

For many other Real Time Operating Systems (RTOS) as listed previously, TransDimension and SoftConnex supply the USBLink On-The-Go software solution, which utilizes proven software technologies from SoftConnex’s USBLink Host and USBLink Peripheral software products, thereby providing a complete, integrated solution for USB On-The-Go applications.

Co

m

pl

et

e

O

T

G

So

lut

So

ftC

on

ne

x

Tra

ns

Di

me

nsi

on

Complete OTG Solution

SoftConnex

TransDimension

Mass Storage

Picture

Printing

File System

Class

Mobile

Phone

MP3

Download

Printe

Sub - -

Sub

Audio

Class

USBLink

Host Controller Drive

PDA

System

Host Laye

USB OTG

Transceive

External

WMC

Class

SoftConnex USBLink

Digital

Camera

File or Print

Sharing

pplication Software

Network

rchitecture

Operating System

Gaming

Othe

Classes

USBLink

Peripheral Controller Drive

Function Controller Drive

OTG Software

TransDimension USB OTG Core

MP3

Telematics

Device Function

Function Laye

Peripheral Laye

Function Laye

USB to

Bluetooth

Internal or External

USB

Transceive

Othe

Transceive

Drive

Othe

Embedded USB OTG System

E

m

be

dd

ed

U

S

B

O

T

G

Sy

Peripherals

Pe

rip

he

ral

s

Figure 2 – Software Stack and TransDimension’s Complete USB OTG solution

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Data Sheet TransDimension TD242LP

TD242LP Reference Designs, Evaluation/Demo Boards and Developer Kits

Reference Designs

The reference designs listed below will include schematics, application notes and instructions on how to interface to the associated microprocessor of interest. In addition, software will be available for specific operating systems including: WinCE, Linux, uCLinux, VxWorks, Nucleus, Lynx, QNX, Symbian OS, OS20, OS40, pSOS, PowerTV, SMX, ThreadX, VRTX, ITRON, MS-DOS operating systems. Contact your local TransDimension representative for ordering information of additional new reference designs for other microprocessors, CISC, RISC, and DSPs including Fujitsu SPARCLite, NEC and Toshiba MIPS, Motorola PowerPC, among others.

 TD242LP / Intel StrongARM (SA1110) USB On-The-Go Reference Design  TD242LP / Intel XScale (PXA250) USB On-The-Go Reference Design  TD242LP / Hitachi SH-3 / SH-4 USB On-The-Go Reference Design  TD242LP / Motorola ColdFire 5272 USB On-The-Go Reference Design  TD242LP / ARM7 USB On-The-Go Reference Design

Evaluation / Demo Kits

BGA242S: Evaluation Board with TD242LP silicon in TF-BGA package

The BGA242S will be a small board (3.0”x 4.8”) that brings out all of the pins necessary to interface with microprocessors available on the market, today. The BGA242S board will have 2 USB receptacles (one USB OTG mini-AB and one standard USB host receptacle) ready to connect to any USB peripheral, hub or USB host. The main components on the BGA242S board will consist of the TD242LP silicon in TF-BGA package, a PC104 interface connector and Vbus distribution/manipulation electronic circuitry. Please see your local TransDimension sales representative for ordering information and specifications when this product is available.

PCE242: PCI card with TD242LP silicon in TF-BGA package The PCE242 card and associated documentation will contain everything you need to perform an evaluation of the functionality and development on the TD242LP chip, in a PCI bus environment. The PCE242 card is a standard PCI card that may be inserted into any PCI slot, inside a personal computer or laptop docking station.

The PCE242 card may be used in any 33 MHz PCI system and it will automatically adjust to a 3.3V or 5V PCI environment. The PCE242 PCI card quickly allows customers to start developing software around the TD242LP controller. TransDimension will supply the drivers necessary to evaluate the PCI104 PCI card and associated daughter card in both OTG and Host mode simultaneously, under the Microsoft MS-DOS based operating systems and/or Linux operating systems. Please see your local TransDimension sales representative for ordering information, specifications and availability.

TransDimension Inc. — Proprietary

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TransDimension Data Sheet TD242LP

Pin Descriptions and Packaging

The following notations are used to indicate the type of a signal/pin:

I

IO

PW

H

INPUT O OUTPUT PL ACTIVE LEVEL PROGRAMMABLE

BI-DIRECTIONAL WO WIRED OR NA NOT APPLICABLE

POWER/GROUND PS PASSIVE NC NO CONNECT

ACTIVE HIGH L ACTIVE LOW

Pin/Signal

Name

OSC1

OSC2

Signal

Type

I

IO

Active

Level

Pin/Signal

Description

A 6 MHz passive crystal should be connected across the two

pins. Optionally, a 6 MHz oscillator can be sourced through OSC1 or a 12, 24, or 48 MHz oscillator can be sourced through OSC2 (12/24 MHz option available for the BGA package only).

/RESET I L Hardware reset.

/CS I L Chip select.

/WR I L Write strobe.

/RD I L Read strobe.

A12:A1 I Address bus for an addressing space of 8K bytes (4K bytes

Data memory + 512 bytes each of Registers, ETD Memory and EP Memory).

D15:D0 IO 16-bit data bus.

TEST I H Factory test mode. This pin should be grounded or left floating

(has an internal pull-down) for normal operation.

/EXVBO O

Turn on/off the external V

L

(5V) for OTG operation (1: V

BUS

off; 0: V

BUS

on).

/PO O L Turn on/off the gang power for all Host ports.

/OC I L Over current condition indicator for gang powered Host ports.

INT1

ID

O/WO PL

I

Interrupt to the MCU. This pin can be software configured as a regular output or WO. (WO is the default).

Connected to the ID pin of the mini-AB connector (Port 1) for OTG applications. With the help of an internal pull-up resistor, it determines the chip’s responsibility in an OTG application, (0: ADEVICE, 1: B-DEVICE).

1

The active level for INT is programmable by software but defaults to active low after power on or hardware reset. This feature allows glue-less interfacing with most microprocessors. Caution must be taken in user software to make sure relevant operations (interrupt) are disabled before alterations to default active levels are made.

TransDimension Inc. — Proprietary

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Data Sheet TransDimension TD242LP

, DP1 IO

DM

1

Data lines for Port 1, which may serve as a USB Host,

Peripheral or OTG port. If not used, these two pins should be left floating.

DM2, DP2 IO

VBUS I V

Data lines for Port 2, a dedicated USB Host port. If not used,

these two pins should be left floating.

input sampled during HNP/SRP operations by the OTG

BUS

port. This pin should be left floating when Port 1 is not used for OTG applications.

pulsing control. This pin is used only when Port 1 is an

V

VBP IO H

BUS

OTG port for a B-DEVICE.

This pin is sensed at power on or hardware reset (/RESET) to determine the frequency of the crystal or the crystal oscillator as outlined in the following table:

VBP

Frequency(QFP)

6 MHz Crystal

0

6 MHz 2.5V Oscillator input on OSC1

6 MHz 3.3V Oscillator input on CLKw

48 MHz 2.5V Oscillator input on OSC2

1

48 MHz 3.3V Oscillator input on CLKw

CLKW I This pin is available only in the QFP package

If 3.3V I/O is used along with an oscillator source (instead of a crystal), then the 3.3V input clock should go to this pin instead of the OSC1/OSC2.

If not used, this pin should be grounded.

CLKCFG I

This pin is available only in the BGA package

The state of this pin is used along with the VBP during power on or hardware reset to provide additional configurations of 12/24 MHz for the BGA package as show below:

VBP CLKCFG

0 0

0 1 12 MHz 2.5V Oscillator input on OSC2

1 0 48 MHz 2.5V Oscillator input on OSC2

1 1 24 MHz 2.5V Oscillator input on OSC2

Frequency(BGA)

6 MHz Crystal

6 MHz 2.5V Oscillator input on OSC1

ENVREG I Enables the internal Voltage Regulator if asserted. If not used,

this pin should be tied to V

SS

.

VREGOUT PW Internal Voltage Regulator output of 2.5V

If enabled, this output should be connected to the V (and V

if Wide-range IO is at 2.5V) supplies of the chip.

DDW

DD2.5

, V

DD2.5A

If the Regulator is disabled, then this pin should be treated as another V

V

PW Analog +3.3V.

DD3.3A

V

PW Analog +2.5V.

DD2.5A

supply input to the chip.

DD2.5

TransDimension Inc. — Proprietary

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TransDimension Data Sheet TD242LP

PW Analog ground.

V

SSA

V

PW Digital +2.5V.

DD2.5

V

PW Wide-range IO +3.3V or +2.5V.

DDW

VSS PW Digital/Wide-range IO ground.

NC PS No connection. These pins should be left floating.

Figure 3 – Detailed Pin Descriptions

Note:

1. Software attention may be required if some pins are not used, whether they are pulled-up, pulled-down or

left floating. This is especially true for OTG related pins.

TransDimension Inc. — Proprietary

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Data Sheet TransDimension

8

9

0

3

5

N

3

N

3

3 3

TD242LP

1 D

2 D9 18 A4 34 DM1 50 D1

17 A3 33 DP1 49 D0

8

3 D10 19 A5 35 V

51 D2

DD3.3

4 D11 20 A6 36 /OC 52 D3

5 V

21 V

DDW

37 /EXVBO 53 V

DDW

6 D12 22 A7 38 VBP 54 VSS

7 D13 23 A8 39 /PO 55 V

8 D14 24 A9 40 ID 56 D4

9 D15 25 A10 41 ENVREG 57 D5

10 V

11 INT 27 A12 43 V

12 /WR 28 Vss 44 V

13 /RD 29 V

26 A11 42 VREGOUT 58 D6

DD2.5

59 D7

DD3.3A

60 CLKW

SSA

45 V

DD2.5

61 V

DD3.3A

14 A1 30 /CS 46 VBUS 62 V

15 VSS 31 DP2 47 /RESET 63 OSC1

16 A2 32 DM2 48 TEST 64 OSC2

TD242LP pin assignment for the 64-pin LQFP

T

E

T

S

E

R

T

A

S

U

D

B

D

V

46 47 48

49

D

0

50

D

1

51

D

2

52

D

3

53

V

DD2.5

54

V

SS

55

V

DDW

56

D

4

57

D

5

58

D

6

59

D

7

60

CLK

W

61

V

SSA

62

V

DD2.5A

63

OSC1

64

OSC2

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

1

D

1

D

T U

G

O

E

A

R

G

A S S

V

E

D

R

D

V

E

P

O

B

D

P

V

TDOTG242LP

W

2

D D

V

4

1

D

T

2

1

D

V

O B V

C

X

O

E

D

R W

R

1

D

1

M

D

P D

D

V

33343536373839404142434445

1

2

S S

A

V

DD2.5

DDW

SSA

DD2.5A

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

DM DP /CS V

DD2.5

V

SS

A

12

A

11

A

10

A

9

A

8

A

7

V

DDW

A

6

A

5

A

4

A

3

2

TD242LP LQFP 64-pin package (top view)

TransDimension Inc. — Proprietary

9

TransDimension Data Sheet

A

TD242LP

A1 OSC

A2 OSC1 C2 D11 E2 V

A3 V

C1 D10 E1 D15 G1 A1

2

G2 A3

DD2.5

C3 D9 E3 /RD G3 A6

SSA

A4 D6 C4 D7 E4 VSS G4 A8

A5 V

A6 V

C5 CLKCFG E5 VSS G5 A11

DDW

C6 D2 E6 VBP G6 /CS

DD2.5

A7 D1 C7 VBUS E7 /PO G7 DP1

A8 TEST C8 V

E8 ID G8 DM1

SSA

B1 D8 D1 D12 F1 INT H1 A2

B2 V

B3 V

D2 D13 F2 /WR H2 A4

DD2.5

D3 D14 F3 A5 H3 V

DD2.5A

DDW

B4 D5 D4 VSS F4 A7 H4 A9

B5 D4 D5 VSS F5 A10 H5 A12

B6 D3 D6 ENVREG F6 V

B7 D0 D7 V

F7 /OC H7 DP2

DD3.3A

H6 V

DD3.3

DD2.5

B8 /RESET D8 VREGOUT F8 /EXVBO H8 DM2

TD242LP pin assignment for the 64-pin BGA

12345678

A1

B

C

B1

C1

D

D1

E

F

G

H

OTG242 BGA 64-pin package (top view)

G1

H1

E 1

F1

A2

B2

C2

D2

E 2

G2

H2

A3

A4

B3

B4

C3

C4

D3

D4

E

3

4

F2

F3

G3

H3

F4

G4

H4

A5

B5

C5

D5

E 5

F5

G5

H5

A6

B6

C6

D6

E 6

F6

G6

H6

A7

B7

C7

D7

E 7

F7

G7

H7

A8

B8

C8

D8

E 8

F8

G8

H8

TD242LP BGA 64 – pin package (top view)

OTG242 LQFP 64-pin package (top view)

TransDimension Inc. — Proprietary

10

Data Sheet TransDimension TD242LP

64 pin LQFP Mechanical Drawings:

TransDimension Inc. — Proprietary

11

TransDimension Data Sheet TD242LP

Note: 0.5mm equals 0.019685 inches. Please use these numbers for the pin pitch.

TransDimension Inc. — Proprietary

12

Data Sheet TransDimension TD242LP

TransDimension Inc. — Proprietary

13

TransDimension Data Sheet TD242LP

Note: 0.5mm equals 0.019685 inches. Please use these numbers for the pin pitch.

E

E1

TransDimension Inc. — Proprietary

14

Data Sheet TransDimension TD242LP

OTG242LP USB On-The-Go Application Scenarios

Connect a Cellular phone to:

a cellular phone to transfer directories, songs, files a PDA to exchange files, surf the web a digital camera to upload pictures to the web an MP3 player to exchange songs a scanner to scan business cards a portable hard disk to upload/download/broadcast music

Connect a Digital Camera to:

a digital camera to exchange pictures a cellular phone to upload pictures to web a printer to print pictures a STB to view photos on a Television set

Connect an MP3 player to:

an MP3 player to exchange songs a CD player to upload songs a USB speaker to play songs a portable hard disk to upload/download songs

Connect a Personal Computer to:

a cellular phone to synchronize/broadcast data, MP3 files a PDA to synchronize data, transfer files a digital camera to upload pictures and email out a portable hard disk to store data an MP3 player to upload/download songs

Connect a Digital Video Recorder to:

a cellular phone to transfer directories, songs, files a PDA to exchange files, surf the web a digital camera to upload pictures to the web

Connect a logic analyzer to:

a cellular phone to broadcast data a PDA to transfer data a digital camera to download waveforms a printer to print waveforms a projector to project onto a screen for anlysis

Connect a PDA to:

a keyboard for user interface a PDA to exchange files a digital camera to upload/download pictures a portable disk drive to upload/download/store files a printer to print files a cellular phone to upload/download files an MP3 player upload/download files

Connect a Portable Hard Disk to:

a digital video recorder to store video clips an MP3 player to store songs a digital camera to store pictures

Connect a CarKit (AutoPC) to: (next revision of silicon will support Carkit Spec.)

an MP3 player to play songs over a stereo connection a cellular phone to enable handsfree telephone operation, download latest phone list to your car

TransDimension Inc. — Proprietary

15

TransDimension Data Sheet TD242LP

Applicable Documents and Specifications

 On-The-Go supplement to the USB 2.0 specification, Revision 1.0, Dec 18, 2001.

URL Link: http://www.usb.org/developers/data/otg1_0.pdf

 USB 2.0 specification, URL Link: http://www.usb.org/developers/data/usb_20.zip

 USB On-The-Go Marketing Overview, Feb 26, 2002. URL Link:

http://www.usb.org/data/developers/otg/presentations/london/OTG_marketing.pdf

Ordering information

Silicon/Boards Pin/Ball Number Package Type TransDimension Order

TD242LP Silicon

Lead (Pb)-Free

BGA242S Board

PCE242 Board

64 TF-BGA TDOTG242-00BC

64 LQFP TDOTG242-000C

64 TF-BGA TDOTG242-0FBC

64 LQFP TDOTG242-0F0C

TDOTG242-1010

TDOTG242-2000

Number

TransDimension Inc. — Proprietary

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Data Sheet TransDimension

A

_

A

TD242LP

For additional information, contact your TransDimension Sales Representative or the following:

INTERNET: http://www.transdimension.com EMAIL: sales@transdimension.com

Headquarters: TransDimension Inc., 2 Venture, Irvine, CA 92618. Tel. (949) 727-2020, FAX (949) 727-3232 Pete Todd, VP of Worldwide Sales, ptodd@transdimension.com

mericas TransDimension Inc., 2 Venture, Irvine, CA 92618. Tel. (949) 727-2020, FAX (949) 727-3232

Larry Hayden, e-mail: lhayden@transdimension.com

Japan: TransDimension Inc., OYA Bldg. 5, 3 Chome-9-6, Nishishinjuku, Shinjuku-ku, Tokyo, Japan. Tel. +81 (3) 5308 7525, FAX +81 (3) 5308 7526 Masanori Sugane, e-mail: sugane@alto.ocn.ne.jp

Europe: TransDimension Inc., 7 The Orchard, Hilton, Derbyshire, UK, DE65 5JF. Tel. +44 1283 730045, FAX +44 1283 730651 Neil Huntingdon, e-mail: nhuntingdon@transdimension.com

sia (excluding Japan): TransDimension Inc., 3 Ubi Ave. 3, #05-01, Crocodile House, Singapore, 408857 Tel: +65 6743 9179, Fax: +65 6741 4393

T.L. Nge, e-mail: tlnge@transdimension.com

WorldWide Reps.: See detailed listing for your area TransDimension representative by viewing http://www.transdimension.com

_______________________________________________________________________________________________________________________________________

THE DEVICE AND ITS DOCUMENTATION ARE PROVIDED “AS IS”. T RANSDIMENSION HEREBY DISCLAIMS ALL WARRANTIES, EXPRESS, STATUT ORY AND IMPLIED, APPLICABLE TO THE SOFTW ARE AND ITS DOCUMENTATION AND ANY RELATED PRODUCTS, INCLUDING, BUT NOT LIMITED TO, ANY W ARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT OR FITNESS FOR A PARTICULAR PURPOSE. TRANSDIMENSION ASSUMES NO LIABILITY FOR ANY ACT OR OMISSION OF LICENSEE. IN NO EVENT SHALL TRANSDIMENSION BE LIABLE FOR DIRECT, SPECIAL, INDIRECT, INCIDENT AL, PUNITIVE, EXEMPLARY OR CONSEQUENTIAL DAMAGES, INCLUDING, WITHOUT LIMIT ATION, LOSS OF PROFITS OR REVENUE, LOSS OF PRODUCTS, DAT A OR ANY ASSOCIATED EQUIPMENT, COST OF CAPITAL, COST OF SUBSTITUTED EQUIPMENT OR PARTS, FACILITIES OR SERVICES, DOWN-TIME O R LABOR COSTS, EVEN IF TRANSDIMENSION HAS BEEN ADVISED OF THE POSSIBILIT Y THEREOF. The device and any related products are not designed, authorized, or warranted to be suitable for use in life-support devices or systems or other critical applications. Any such use and subsequent liabilities that may arise from suc h use are totally the responsibilities of the Licensee. Copyright © 2002, TransDimension Inc., All rights reserved. All product names are trademark s or registered trademarks of their res pective owners. This document is subject to change without notice.

ll Rights Reserved

Printed in U.S.

March 22, 2004 MU4001, Rev. 1.1

, techsupport@transdimension.com

TransDimension Inc. — Proprietary

17

TRANS DIMENSION TD242LP User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual