TransCore 2000B User Manual
LEON-G100 / LEON-G200
quad-band GSM/GPRS
Data and Voice Modules
System Integration Manual
29.5 x 18.9 x 3.0 mm
www.u-blox.com
locate, communicate, accelerate
Abstract
This document describes the features and integration of the
LEON-G100/G200 quad-band GSM/GPRS data and voice modules.
The LEON-G100/G200 are complete and cost efficient solutions,
bringing full feature quad-band GSM/GPRS data and voice
transmission technology in a compact form factor.
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3
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Document Information
Title
LEON-G100 / LEON-G200
Subtitle
quad-band GSM/GPRS
Data and Voice Modules
Document type
System Integration Manual
Document number
GSM.G1-HW-09002-G3
Document status
Preliminary
Document status information
Objective
Specification
This document contains target values. Revised and supplementary data will be published
later.
Advance
Information
This document contains data based on early testing. Revised and supplementary data will
be published later.
Preliminary
This document contains data from product verification. Revised and supplementary data
may be published later.
Released
This document contains the final product specification.
This document applies to the following products:
Name
Type number
Firmware version
PCN / IN
LEON-G100
LEON-G100-04S-00
LEON-G100-05S-00
LEON-G100-06S-00
LEON-G100-06S-01
LEON-G100-07S-00
LEON-G100-08S-00
LEON-G100-06A-00
LEON-G100-07A-00
07.40.00
07.50.00
07.60.00
07.60.02
07.70
07.83
07.60.00
07.70
GSM.G1-SW-10007
GSM.G1-SW-10008
GSM.G1-SW-10012
GSM.G1-SW-10013
GSM.G1-SW-12002
UBX-TN-13001
GSM.G1-SW-10012
GSM.G1-SW-12002
LEON-G100 ECALL
LEON-G100-71S-00
TBD
TBD
LEON-G200
LEON-G200-04S-00
LEON-G200-05S-00
LEON-G200-06S-00
LEON-G200-06S-01
07.40.00
07.50.00
07.60.00
07.60.02
GSM.G1-SW-10007
GSM.G1-SW-10008
GSM.G1-SW-10012
GSM.G1-SW-10013
This document and the use of any information contained therein, is subject to the acceptance of the u-blox terms and conditions. They
can be downloaded from www.u-blox.com.
u-blox makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make
changes to specifications and product descriptions at any time without notice.
u-blox reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without
express permission is strictly prohibited. Copyright © 2013, u-blox AG.
u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries.
Trademark Notice
Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other
countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3 Preliminary Preface
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Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
AT Commands Manual: This document provides the description of the supported AT commands by the LEON
GSM/GPRS Voice and Data Modules to verify all implemented functionalities.
System Integration Manual: This Manual provides hardware design instructions and information on how to
set up production and final product tests.
Application Note: document provides general design instructions and information that applies to all u -blox
Wireless modules. See Section Related documents for a list of Application Notes related to your Wireless
Module.
How to use this Manual
The LEON-G100 / LEON-G200 System Integration Manual provides the necessary information to successfully
design in and configure these u-blox wireless modules.
This manual has a modular structure. It is not necessary to read it from the beginning to the end.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
Questions
If you have any questions about u-blox Wireless Integration, please:
Read this manual carefully.
Contact our information service on the homepage http://www.u-blox.com
Read the questions and answers on our FAQ database on the homepage http://www.u-blox.com
Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and
helpful FAQ can be accessed 24h a day.
By E-mail
Contact the nearest of the Technical Support offices by email. Use our service pool email addresses rather than
any personal email address of our staff. This makes sure that your request is processed as soon as possible. You
will find the contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support please have the following information ready:
Module type (e.g. LEON-G100) and firmware version
Module configuration
Clear description of your question or the problem
A short description of the application
Your complete contact details
LEON-G100 / LEON-G200 - System Integration Manual
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Contents
Preface ................................................................................................................................ 3
Contents .............................................................................................................................. 4
1 System description ....................................................................................................... 7
1.1 Overview .............................................................................................................................................. 7
1.2 Architecture .......................................................................................................................................... 8
1.2.1 Functional blocks ........................................................................................................................... 9
1.2.2 Hardware differences between LEON-G100 and LEON-G200 ...................................................... 10
1.3 Pin-out ............................................................................................................................................... 10
1.4 Operating modes ................................................................................................................................ 13
1.5 Power management ........................................................................................................................... 15
1.5.1 Power supply circuit overview ...................................................................................................... 15
1.5.2 Module supply (VCC) .................................................................................................................. 16
1.5.3 Current consumption profiles ...................................................................................................... 23
1.5.4 Battery charger (LEON-G200 only) ............................................................................................... 26
1.5.5 RTC Supply (V_BCKP) .................................................................................................................. 31
1.6 System functions ................................................................................................................................ 32
1.6.1 Module power on ....................................................................................................................... 32
1.6.2 Module power off ....................................................................................................................... 36
1.6.3 Module reset ............................................................................................................................... 37
1.6.4 Note: Tri-stated external signal .................................................................................................... 40
1.7 RF connection ..................................................................................................................................... 40
1.8 SIM interface ...................................................................................................................................... 41
1.8.1 SIM functionality ......................................................................................................................... 42
1.9 Serial Communication......................................................................................................................... 43
1.9.1 Asynchronous serial interface (UART)........................................................................................... 43
1.9.2 DDC (I2C) interface ...................................................................................................................... 55
1.10 Audio .............................................................................................................................................. 60
1.10.1 Analog Audio interface ............................................................................................................... 60
1.10.2 Digital Audio interface ................................................................................................................. 66
1.10.3 Voice-band processing system ..................................................................................................... 69
1.11 ADC input (LEON-G100 only) .......................................................................................................... 70
1.11.1 ADC Calibration .......................................................................................................................... 71
1.12 General Purpose Input/Output (GPIO) ............................................................................................. 73
1.12.1 LEON-G100-06x / LEON-G200-06S and subsequent versions ....................................................... 73
1.12.2 LEON-Gx00-04S and LEON-Gx00-05S versions ............................................................................ 75
1.13 Schematic for module integration ................................................................................................... 79
1.14 Approvals ........................................................................................................................................ 80
1.14.1 Compliance with FCC and IC Rules and Regulations .................................................................... 80
2 Design-In ..................................................................................................................... 83
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2.1 Design-in checklist .............................................................................................................................. 83
2.1.1 Schematic checklist ..................................................................................................................... 83
2.1.2 Layout checklist ........................................................................................................................... 83
2.1.3 Antenna checklist ........................................................................................................................ 84
2.2 Design Guidelines for Layout .............................................................................................................. 84
2.2.1 Layout guidelines per pin function ............................................................................................... 84
2.2.2 Footprint and paste mask ............................................................................................................ 90
2.2.3 Placement ................................................................................................................................... 92
2.3 Module thermal resistance .................................................................................................................. 92
2.4 Antenna guidelines ............................................................................................................................. 93
2.4.1 Antenna termination ................................................................................................................... 94
2.4.2 Antenna radiation ....................................................................................................................... 95
2.4.3 Antenna detection functionality .................................................................................................. 97
2.5 ESD Immunity Test Precautions ........................................................................................................... 99
2.5.1 General precautions .................................................................................................................. 100
2.5.2 Antenna interface precautions ................................................................................................... 102
2.5.3 Module interfaces precautions ................................................................................................... 103
3 Feature description .................................................................................................. 104
3.1 Firmware (upgrade) Over The Air (FOTA) (LEON-G200 only) .............................................................. 104
3.2 Firmware (upgrade) Over AT (FOAT) ................................................................................................. 104
3.2.1 Overview ................................................................................................................................... 104
3.2.2 FOAT procedure ........................................................................................................................ 104
3.3 Firewall ............................................................................................................................................. 104
3.4 TCP/IP ............................................................................................................................................... 104
3.4.1 Multiple IP addresses and sockets .............................................................................................. 104
3.5 FTP ................................................................................................................................................... 105
3.6 HTTP ................................................................................................................................................. 105
3.7 SMTP ................................................................................................................................................ 105
3.8 GPS .................................................................................................................................................. 105
3.9 Jamming detection ........................................................................................................................... 105
3.10 Smart Temperature Management ................................................................................................. 106
3.10.1 Smart Temperature Supervisor (STS) .......................................................................................... 106
3.10.2 Threshold Definitions ................................................................................................................. 108
3.11 Hybrid positioning and CellLocateTM .............................................................................................. 108
3.11.1 Positioning through cellular information: CellLocateTM ............................................................... 108
3.11.2 Hybrid positioning ..................................................................................................................... 110
4 Handling and soldering ........................................................................................... 111
4.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 111
4.2 Soldering .......................................................................................................................................... 111
4.2.1 Soldering paste.......................................................................................................................... 111
4.2.2 Reflow soldering ....................................................................................................................... 111
4.2.3 Optical inspection ...................................................................................................................... 113
4.2.4 Cleaning .................................................................................................................................... 113
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4.2.5 Repeated reflow soldering ......................................................................................................... 113
4.2.6 Wave soldering.......................................................................................................................... 113
4.2.7 Hand soldering .......................................................................................................................... 113
4.2.8 Rework ...................................................................................................................................... 113
4.2.9 Conformal coating .................................................................................................................... 113
4.2.10 Casting ...................................................................................................................................... 114
4.2.11 Grounding metal covers ............................................................................................................ 114
4.2.12 Use of ultrasonic processes ........................................................................................................ 114
5 Product Testing......................................................................................................... 115
5.1 u-blox in-series production test ......................................................................................................... 115
5.2 Test parameters for OEM manufacturer ............................................................................................ 115
5.2.1 ‘Go/No go’ tests for integrated devices ...................................................................................... 116
5.2.2 Functional tests providing RF operation ..................................................................................... 116
A Glossary .................................................................................................................... 119
Related documents......................................................................................................... 121
Revision history .............................................................................................................. 122
Contact ............................................................................................................................ 125
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1 System description
1.1 Overview
LEON-G100/LEON-G200 GSM/GPRS modules integrate a full-featured Release 99 GSM-GPRS protocol stack,
with the following main characteristics.
Quad-band support: GSM 850 MHz, EGSM 900 MHz, DCS 1800 MHz and PCS 1900 MHz
Power class 4 (33 dBm nominal maximum output power) for GSM/EGSM bands
Power class 1 (30 dBm nominal maximum output power) for DCS/PCS bands
GPRS multi-slot class 10
All GPRS coding schemes from CS1 to CS4 are supported
GPRS bit rate: 85.6 kb/s (max.), 53.6 kb/s (typ.) in down-link; 42.8 kb/s (max.), 26.8 kb/s (typ.) in up-link
CS (Circuit Switched) Data calls are supported in transparent/non transparent mode up to 9.6 kb/s
Encryption algorithms A5/1 for GSM and GPRS support
Bearer service fax Group 3 Class 2.0 support
Class B Mobile Stations (i.e. the data module can be attached to both GPRS and GSM services, using one
service at a time)
Network operation modes I to III are supported
GPRS multi-slot class determines the maximum number of timeslots available for upload and download and thus
the speed at which data can be transmitted and received: higher classes typically allow faster data transfer rates.
GPRS multi-slot class 10 uses a maximum of 4 slots in download (reception) and 2 slots in upload (transmission),
with 5 slots in total.
The network automatically configures the number of timeslots used for reception or transmission (voice calls
take precedence over GPRS traffic). The network also automatically configures channel encoding (CS1 to CS4).
The maximum GPRS bit rate of the mobile station depends on the coding scheme and number of time slots.
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1.2 Architecture
Memory
UART
2 Analog Audio
DDC (for GPS)
GPIO
ADC
SIM Card
Vcc
V_BCKP
Power-On
Reset
26 MHz
32.768 kHz
Headset Detection
RF
Transceiver
Power
Management
Baseband
ANT
SAW
Filter
Switch
PA
Digital Audio
Figure 1: LEON-G100 block diagram
Memory
Vcc
V_BCKP
26 MHz
32.768 kHz
Charger
RF
Transceiver
Power
Management
Baseband
ANT
SAW
Filter
Switch
PA
UART
2 Analog Audio
DDC (for GPS)
GPIO
SIM Card
Power-On
Reset
Headset Detection
Digital Audio
Figure 2: LEON-G200 block diagram
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1.2.1 Functional blocks
LEON-G100/LEON-G200 modules consist of the following functional blocks:
RF
Baseband
Power Management
1.2.1.1 RF
The RF block is composed of the following main elements:
RF transceiver (integrated in the GSM/GPRS single chip) performing modulation, up-conversion of the
baseband I/Q signals, down-conversion and demodulation of the RF received signals. The RF transceiver
includes:
Constant gain direct conversion receiver with integrated LNAs;
Highly linear RF quadrature demodulator;
Digital Sigma-Delta transmitter modulator;
Fractional-N Sigma-Delta RF synthesizer;
3.8 GHz VCO;
Digital controlled crystal oscillator.
Transmit module, which amplifies the signals modulated by the RF transceiver and connects the single
antenna input/output pin of the module to the suitable RX/TX path, via its integrated parts:
Power amplifier;
Antenna switch;
RX diplexer SAW (band pass) filters
26 MHz crystal, connected to the digital controlled crystal oscillator to perform the clock reference in active
or connected mode
1.2.1.2 Baseband
The Baseband block is composed of the following main elements:
Baseband integrated in the GSM/GPRS single chip, including:
Microprocessor;
DSP (for GSM/GPRS Layer 1 and audio processing);
Peripheral blocks (for parallel control of the digital interfaces);
Audio analog front-end;
Memory system in a multi-chip package integrating two devices:
NOR flash non-volatile memory;
PSRAM volatile memory;
32.768 kHz crystal, connected to the oscillator of the RTC to perform the clock reference in idle or power-
off mode
1.2.1.3 Power Management
The Power Management block is composed of the following main elements:
Voltage regulators integrated in the GSM/GPRS single chip for direct connection to battery
Charging control circuitry
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1.2.2 Hardware differences between LEON-G100 and LEON-G200
Hardware differences between the LEON-G100 and the LEON-G200 modules:
Charging control circuitry is available on the LEON-G200 module only
ADC input is provided on the LEON-G100 module only
1.3 Pin-out
Table 1 describes the pin-out of LEON-G100/LEON-G200 modules, with pins grouped by function.
Function
Pin
No
I/O
Description
Remarks
Power
VCC
50 I Module Supply
Clean and stable supply is required: low ripple and
low voltage drop must be guaranteed.
Voltage provided has to be always above the
minimum limit of the operating range.
Consider that there are large current spike in
connected mode, when a GSM call is enabled.
See section 1.5.2
GND
1, 3, 6,
7, 8, 17,
25, 36,
45, 46,
48, 49
N/A
Ground
GND pins are internally connected but good (low
impedance) external ground can improve RF
performances: all GND pins must be externally
connected to ground
V_BCKP
2
I/O
Real Time Clock supply
V_BCKP = 2.0 V (typical) generated by the module
to supply Real Time Clock when VCC supply
voltage is within valid operating range.
See section 1.5.5
VSIM
35 O SIM supply
SIM supply automatically generated by the
module.
See section 1.8
V_CHARGE
(LEON-G200-xx)
4 I Charger voltage supply
input
V_CHARGE and CHARGE_SENSE must be
externally connected.
The external supply used as charging source must
be voltage and current limited.
See section 1.5.4
CHARGE_SENSE
(LEON-G200-xx)
5 I Charger voltage
measurement input
V_CHARGE and CHARGE_SENSE must be
externally connected.
The external supply used as charging source must
be voltage and current limited.
See section 1.5.4
RF
ANT
47
I/O
RF antenna
50 nominal impedance.
See section 1.7, 2.2.1.1 and 2.4
Audio
HS_DET
(LEON-Gx00-05S
or previous)
18 I Headset detection input
Internal active pull-up to 2.85 V enabled.
See section 1.10.1.3
HS_DET
(LEON-G100-06x
LEON-G200-06S
or subsequent)
18
I/O
GPIO
Internal active pull-up to 2.85 V enabled when the
“headset detection” function is enabled (default).
See section 1.12 and section 1.10.1.3
I2S_WA
26 O I2S word alignment
Check device specifications to ensure compatibility
of supported modes to LEON-G100/LEON-G200
module.
Add a test point to provide access to the pin for
debugging.
See section 1.10.2.
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Function
Pin
No
I/O
Description
Remarks
I2S_TXD
27 O I2S transmit data
Check device specifications to ensure compatibility
of supported modes to LEON-G100/LEON-G200
module.
Add a test point to provide access to the pin for
debugging.
See section 1.10.2.
I2S_CLK
28 O I2S clock
Check device specifications to ensure compatibility
of supported modes to LEON-G100/LEON-G200
module.
Add a test point to provide access to the pin for
debugging.
See section 1.10.2.
I2S_RXD
29 I I2S receive data
Internal active pull-up to 2.85 V enabled. Check
device specifications to ensure compatibility of
supported modes to LEON-G100/LEON-G200
module.
Add a test point to provide access to the pin for
debugging.
See section 1.10.2.
HS_P
37 O First speaker output
with low power singleended analog audio
This audio output is used when audio downlink
path is “Normal earpiece“ or “Mono headset“.
See section 1.10.1
SPK_P
38 O Second speaker output
with high power
differential analog audio
This audio output is used when audio downlink
path is “Loudspeaker“.
See section 1.10.1
SPK_N
39 O Second speaker output
with power differential
analog audio output
This audio output is used when audio downlink
path is “Loudspeaker“.
See section 1.10.1
MIC_BIAS2
41 I Second microphone
analog signal input and
bias output
This audio input is used when audio uplink path is
set as “Headset Microphone“.
See section 1.10.1
MIC_GND2
42 I Second microphone
analog reference
Local ground of second microphone.
See section 1.10.1
MIC_GND1
43 I First microphone analog
reference
Local ground of the first microphone.
See section 1.10.1
MIC_BIAS1
44 I First microphone analog
signal input and bias
output
This audio input is used when audio uplink path is
set as “Handset Microphone“.
See section 1.10.1
SIM
SIM_CLK
32 O SIM clock
Must meet SIM specifications
See section 1.8.
SIM_IO
33
I/O
SIM data
Internal 4.7k pull-up to VSIM.
Must meet SIM specifications
See section 1.8.
SIM_RST
34 O SIM reset
Must meet SIM specifications
See section 1.8.
UART
DSR
9 O UART data set ready
Circuit 107 (DSR) in V.24.
See section 1.9.1.
RI
10 O UART ring indicator
Circuit 125 (RI) in V.24.
See section 1.9.1.
DCD
11 O UART data carrier detect
Circuit 109 (DCD) in V.24.
See section 1.9.1.
DTR
12 I UART data terminal
ready
Internal active pull-up to 2.85 V enabled.
Circuit 108/2 (DTR) in V.24.
See section 1.9.1.
RTS
13 I UART ready to send
Internal active pull-up to 2.85 V enabled.
Circuit 105 (RTS) in V.24.
See section 1.9.1.
CTS
14 O UART clear to send
Circuit 106 (CTS) in V.24.
See section 1.9.1.
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Function
Pin
No
I/O
Description
Remarks
TxD
15 I UART transmitted data
Internal active pull-up to 2.85 V enabled.
Circuit 103 (TxD) in V.24.
See section 1.9.1.
RxD
16 O UART received data
Circuit 104 (RxD) in V.24. See section 1.9.1.
DDC
SCL
30 O I2C bus clock line
Fixed open drain. External pull-up required.
See section 1.9.2
SDA
31
I/O
I2C bus data line
Fixed open drain. External pull-up required.
See section 1.9.2
ADC
ADC1
(LEON-G100-xx)
5 I ADC input
Resolution: 12 bits.
Consider that the impedance of this input changes
depending on the operative mode
See section 1.11
GPIO
GPIO1
20
I/O
GPIO
Add a test point to provide access to the pin for
debugging.
See section 1.12
GPIO2
21
I/O
GPIO
See section 1.12 and section 1.9.2
GPIO3
(LEON-G100-06x
LEON-G200-06S
or subsequent)
23
I/O
GPIO
See section 1.12 and section 1.9.2
GPIO4
(LEON-G100-06x
LEON-G200-06S
or subsequent)
24
I/O
GPIO
See section 1.12 and section 1.9.2
System
PWR_ON
19 I Power-on input
PWR_ON pin has high input impedance.
Do not keep floating in noisy environment:
external pull-up required.
See section 1.6.1
RESET_N
22
I/O
Reset signal
See section 1.6.3
Reserved
Reserved
(LEON-Gx00-05S
or previous)
23
Do not connect
Reserved
(LEON-Gx00-05S
or previous)
24
Do not connect
Reserved
40
Do not connect
Reserved
(LEON-G100-xx)
4
Do not connect
Table 1: LEON-G100 / LEON-G200 pin-out
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1.4 Operating modes
LEON-G100/LEON-G200 modules include several operating modes, each have different features and interfaces.
Table 2 summarizes the various operating modes and provides general guidelines for operation.
Operating Mode
Description
Features / Remarks
Transition condition
General Status: Power-down
Not-Powered
Mode
VCC supply not present or
below normal operating
range.
Microprocessor switched off
(not operating).
RTC only operates if supplied
through V_BCKP pin.
Module is switched off.
Application interfaces are not accessible.
Internal RTC timer operates only if a valid
voltage is applied to V_BCKP pin.
Any external signal connected to the
UART I/F, I2S I/F, HS_DET, GPIOs must be
tristated to avoid an increase of module
power-off consumption.
Module cannot be switched on by a
falling edge provided on the PWR_ON
input, neither by a preset RTC alarm, nor
by charger detection on the V_CHARGE
and CHARGE_SENSE pins.
Power-Off Mode
VCC supply within normal
operating range.
Microprocessor not
operating.
Only RTC runs.
Module is switched off: normal
shutdown after sending the
AT+CPWROFF command (refer to u-blox
AT Commands Manual [2]).
Application interfaces are not accessible.
Only internal RTC timer in operation.
Any external signal connected to the
UART I/F, I2S I/F, HS_DET, GPIOs must be
tristated to avoid an increase of the
module power-off consumption.
Module can be switched on by a falling
edge provided on the PWR_ON input, by
a preset RTC alarm, or by charger
detection on the V_CHARGE and
CHARGE_SENSE pins.
General Status: Normal Operation
Idle-Mode
Microprocessor runs with
32 kHz as reference oscillator.
Module does not accept data
signals from an external
device.
If power saving is enabled, the module
automatically enters idle mode whenever
possible.
If hardware flow control is enabled, the
CTS line indicates that the module is in
active-mode and the UART interface is
enabled: the line is driven in the OFF
state when the module is not prepared
to accept data by the UART interface.
If hardware flow control is disabled, the
CTS line is fixed to ON state.
Module by default is not set to
automatically enter idle mode whenever
possible, unless power saving
configuration is enabled by appropriate
AT command (refer to u-blox AT
Commands Manual [2], AT+UPSV).
If the module is registered with the
network and power saving is enabled, it
automatically enters idle mode and
periodically wakes up to active mode to
monitor the paging channel for the
paging block reception according to
network indication.
If module is not registered with the
network and power saving is enabled, it
automatically enters idle mode and
periodically wakes up to monitor external
activity.
Module wakes up from idle-mode to
active-mode for an incoming voice or
data call.
Module wakes up from idle mode to
active mode if an RTC alarm occurs.
Module wakes up from idle mode to
active mode when data is received on
UART interface (refer to 1.9.1 section).
Module wakes up from idle mode to
active mode when the RTS input line is
set to the ON state by the DTE if the
AT+UPSV=2 command is sent to the
module (refer to 1.9.1 section).
Active-Mode
Microprocessor runs with
26 MHz as reference
oscillator.
The module is ready to accept
data signals from an external
device.
Module is switched on and is fully active:
power saving is not enabled.
The application interfaces are enabled.
If power saving is enabled, the module
automatically enters idle mode whenever
possible.
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GSM.G1-HW-09002-G3 Preliminary System description
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Operating Mode
Description
Features / Remarks
Transition condition
Connected-Mode
Voice or data call enabled.
Microprocessor runs with
26 MHz as reference
oscillator.
The module is ready to accept
data signals from an external
device.
The module is switched on and a voice
call or a data call (GSM/GPRS) is in
progress.
Module is fully active.
Application interfaces are enabled.
When call terminates, module returns to
the last operating state (Idle or Active).
General Status: Charging (LEON-G200 only)
Pre-charge mode
Battery connected to VCC.
Battery voltage level is below
the VCC normal operating
range.
Charger connected to
V_CHARGE and
CHARGE_SENSE inputs with
proper voltage and current
characteristics.
Charging of the deeply
discharged battery is enabled
while the module is switched
off.
Microprocessor switched off
(not operating).
Module is switched off and cannot be
switched on (not powered mode).
The Pre-Charge phase of the charging
process is enabled: charging of the
deeply discharged battery is forced by
HW at low current while the module is
switched off
When battery voltage level reaches the
VCC normal operating range with a
charger connected to V_CHARGE and
CHARGE_SENSE inputs, the module
enters charge mode.
Charge-mode
Battery connected to VCC.
Battery voltage level is within
the VCC normal operating
range.
Charger connected to
V_CHARGE and
CHARGE_SENSE inputs with
proper voltage and current
characteristics.
Charging process enabled
while the module is switched
on and normal operations are
enabled.
Microprocessor runs with
32 kHz or 26 MHz as
reference oscillator.
Module is switched on and normal
operations are enabled (Idle mode,
Active mode or Connected mode).
The charging process is enabled:
charging of battery is controlled by the
microprocessor while the module is
switched on
When the charger is removed from
V_CHARGE and CHARGE_SENSE
inputs, the module returns to normal
operations (Idle-mode, Active-mode or
Connected-mode).
Table 2: Module operating modes summary
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3 Preliminary System description
Page 15 of 125
1.5 Power management
1.5.1 Power supply circuit overview
V_BCKP
GSM/GPRS Chipset
PSRAM
NOR Flash
MCP Memory
4-Bands GSM FEM
Antenna
Switch
PA
LDOs BB
LDOs RF
RTC
LDO
LDO EBU
Charging Control
1 µF
1 µF
LDO
VSIM
VCC
LEON-G100 /
LEON-G200
2 x 22 µF
2
35
50
Figure 3: Power supply concept
Power supply is via VCC pin. This is the only main power supply pin.
VCC pin connects the RF Power Amplifier and the integrated power management unit within the module: all
supply voltages needed by the module are generated from the VCC supply by integrated voltage regulators.
V_BCKP is the Real Time Clock (RTC) supply. When the VCC voltage is within the specified extended operating
range, the module supplies the RTC: 2.0 V typical are generated by the module on the V_BCKP pin. If the VCC
voltage is under the minimum specified extended limit, the RTC can be externally supplied via V_BCKP pin.
When a 1.8 V or a 3 V SIM card type is connected, LEON-G100/LEON-G200 automatically supply the SIM card
via VSIM pin. Activation and deactivation of the SIM interface with automatic voltage switch from 1.8 to 3 V is
implemented, in accordance to the ISO-IEC 78-16-e specifications.
The integrated power management unit also provides the control state machine for system start up, including
start up with discharged batteries, pre-charging and system reset control.
LEON-G100/LEON-G200 feature a power management concept optimized for most efficient use of battery
power. This is achieved by hardware design utilizing power efficient circuit topology, and by power management
software controlling the power saving configuration of the module. Battery management runs in the context of
the operation and maintenance process:
Battery charging control, in order to maintain the full capacity of the battery
Collecting and processing of measurements of battery voltage
LEON-G100 / LEON-G200 - System Integration Manual
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Page 16 of 125
1.5.2 Module supply (VCC)
LEON-G100/LEON-G200 modules must be supplied through VCC pin by a DC power supply. Voltages must be
stable, due to the surging consumption profile of the GSM system (described in the section 1.5.3).
Name
Description
Remarks
VCC
Module Supply
Clean and stable supply is required: low ripple and low
voltage drop must be guaranteed.
Voltage provided has to be always above the minimum limit
of the operating range.
Consider that there are large current spike in connected
mode, when a GSM call is enabled.
GND
Ground
GND pins are internally connected but good (low impedance)
external ground can improve RF performances: all GND pins
must be externally connected to ground.
Table 3: Module supply pins
VCC pin ESD sensitivity rating is 1 kV (HBM JESD22-A114F). A higher protection level could be required
if the line is externally accessible on the application board. A higher protection level can be achieved
mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) on the line connected to this
pin if it is externally accessible on the application board.
The voltage provided to VCC pin must be within the normal operating range limits specified in the LEON-G100 /
LEON-G200 Data Sheet [1]. Complete functionality of the module is only guaranteed within the specified
operational normal voltage range.
The module cannot be switched on if the VCC voltage value is below the specified normal operating
range minimum limit: ensure that the input voltage at VCC pin is above the minimum limit of the
normal operating range for more than 1 second after the start of the switch-on of the module.
When LEON-G100/LEON-G200 modules are in operation, the voltage provided to VCC pin can exceed the
normal operating range limits but must be within the extended operating range limits specified in
LEON-G100/LEON-G200 Data Sheet [1]. Module reliability is only guaranteed within the specified operational
extended voltage range.
The module switches off when VCC voltage value drops below the specified extended operating range
minimum limit: ensure that the input voltage at VCC pin never drops below the minimum limit of the
extended operating range when the module is switched on, not even during a GSM transmit burst,
where the current consumption can rise up to maximum peaks of 2.5 A in case of a mismatched
antenna load.
Operation above the extended operating range maximum limit is not recommended and
extended exposure beyond it may affect device reliability.
Stress beyond the VCC absolute maximum ratings may cause permanent damage to the
module: if necessary, voltage spikes beyond VCC absolute maximum ratings must be limited to
values within the specified boundaries by using appropriate protection.
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3 Preliminary System description
Page 17 of 125
When designing the power supply for the application, pay specific attention to power losses and
transients. The DC power supply has to be able to provide a voltage profile to the VCC pin with the
following characteristics:
o Voltage drop during transmit slots has to be lower than 400 mV
o Undershoot and overshoot at the start and at the end of transmit slots have to be not present
o Voltage ripple during transmit slots has to be:
lower than 100 mVpp if f
ripple
≤ 200 kHz
lower than 10 mVpp if 200 kHz < f
ripple
≤ 400 kHz
lower than 2 mVpp if f
ripple
> 400 kHz
Figure 4: Description of the VCC voltage profile versus time during a GSM call
Any degradation in power supply performance (due to losses, noise or transients) will directly affect the
RF performance of the module since the single external DC power source indirectly supplies all the
digital and analog interfaces, and also directly supplies the RF power amplifier (PA).
1.5.2.1 VCC application circuits
The LEON module must be supplied through the VCC pin by one (and only one) proper DC power supply from
the following:
Switching regulator
Low Drop-Out (LDO) linear regulator
Rechargeable Li-Ion battery
Primary (disposable) battery
Time
undershoot
overshoot
ripple
ripple
drop
Voltage
3.8 V
(typ)
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
GSM frame
4.615 ms
(1 frame = 8 slots)
Time
undershoot
overshoot
ripple
ripple
drop
Voltage
3.8 V
(typ)
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
GSM frame
4.615 ms
(1 frame = 8 slots)
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
GSM frame
4.615 ms
(1 frame = 8 slots)
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3 Preliminary System description
Page 18 of 125
Main Supply
Available?
Battery
Li-Ion 3.7 V
Linear LDO
Regulator
Main Supply
Voltage >5 V?
Switching
Step-Down
Regulator
No, portable device
No, less than 5 V
Yes, greater than 5 V
Yes, always available
Figure 5: VCC supply concept selection
The switching step-down regulator is the typical choice when the available primary supply source has a nominal
voltage much higher (e.g. greater than 5 V) than the LEON-G100/LEON-G200 operating supply voltage. The use
of switching step-down provides the best power efficiency for the overall application and minimizes current
drawn from main supply source.
The use of an LDO linear regulator becomes convenient for primary supplies with relatively low voltage (e.g. less
than 5 V). In this case a switching regulator with a typical efficiency of 90% reduces the benefit of voltage
step-down for input current savings. Linear regulators are not recommended for high voltage step-down as they
will dissipate a considerable amount of power in thermal energy.
If the LEON-G100/LEON-G200 is deployed in a mobile unit with no permanent primary supply source available,
then a battery is required to provide VCC. A standard 3-cell Lithium-Ion battery pack directly connected to VCC
is the typical choice for battery-powered devices. Batteries with Ni-MH chemistry should be avoided, since they
typically reach a maximum voltage during charging that is above the maximum rating for VCC.
The use of primary (disposable) batteries is uncommon, since the typical cells available are seldom capable of
delivering the burst peak current for a GSM call due to high internal resistance.
The following sections highlight some design aspects for each of these supplies.
Switching regulator
The characteristics of the switching regulator connected to the VCC pin should meet the following requirements:
Power capabilities: the switching regulator with its output circuit must be capable of providing a proper
voltage value to the VCC pin and delivering 2.5 A current pulses with a 1/8 duty cycle to the VCC pin
Low output ripple: the switching regulator and output circuit must be capable of providing a clean (low
noise) VCC voltage profile
High switching frequency: for best performance and for smaller applications select a switching frequency
≥ 600 kHz (since an L-C output filter is typically smaller for high switching frequency). Using a switching
regulator with a variable switching frequency or with a switching frequency lower than 600 kHz must be
carefully evaluated since this can produce noise in the VCC voltage profile and therefore impact and worsen
GSM modulation spectrum performance. An additional L-C low-pass filter between the switching regulator
output and the VCC supply pin can mitigate the ripple on VCC, but adds extra voltage drop due to resistive
losses in series inductors
PWM mode operation: select preferably regulators with Pulse Width Modulation (PWM) mode. Pulse
Frequency Modulation (PFM) mode and PFM/PWM mode transitions while in active mode must be avoided
to reduce the noise on the VCC voltage profile. Switching regulators able to switch between low ripple
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3 Preliminary System description
Page 19 of 125
PWM mode and high efficiency burst or PFM mode can be used, provided the mode transition occurs when
the GSM module changes status from idle mode (current consumption approximately 1 mA) to active mode
(current consumption approximately 100 mA): it is permissible to use a regulator that switches from the
PWM mode to the burst or PFM mode at an appropriate current threshold (e.g. 60 mA)
Figure 6 and the components listed in Table 4 show an example of a high reliability power supply circuit, where
the VCC module supply is provided by a step-down switching regulator capable to deliver 2.5 A current pulses,
with low output ripple, with 1 MHz fixed switching frequency in PWM mode operation. The use of a switching
regulator is suggested when the difference from the available supply rail and the VCC value is high: switching
regulators provide good efficiency transforming a 12 V supply to the 3.8 V typical value of the VCC supply. The
following power supply circuit example is implemented on the LEON Evaluation Board.
LEON-G100
LEON-G200
12V
C6
R3
C5
R2
C3C2
C1
R1
VIN
RUN
VC
RT
PG
SYNC
BD
BOOST
SW
FB
GND
6
7
10
9
5
C712
3
8
11
4
C8 C9
L2
D1
R4
R5
L1
C4
U1
50
VCC
GND
Figure 6: Suggested schematic design for the VCC voltage supply application circuit using a step-down regulator
Reference
Description
Part Number - Manufacturer
C1
47 µF Capacitor Aluminum 0810 50 V
MAL215371479E3 - Vishay
C2
10 µF Capacitor Ceramic X7R 5750 15% 50 V
C5750X7R1H106MB - TDK
C3
10 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C103KA01 - Murata
C4
680 pF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71H681KA01 - Murata
C5
22 pF Capacitor Ceramic COG 0402 5% 25 V
GRM1555C1H220JZ01 - Murata
C6
10 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C103KA01 - Murata
C7
470 nF Capacitor Ceramic X7R 0603 10% 25 V
GRM188R71E474KA12 - Murata
C8
22 µF Capacitor Ceramic X5R 1210 10% 25 V
GRM32ER61E226KE15 - Murata
C9
330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ
T520D337M006ATE045 - KEMET
D1
Schottky Diode 40 V 3 A
MBRA340T3G - ON Semiconductor
L1
10 µH Inductor 744066100 30% 3.6 A
744066100 - Wurth Electronics
L2
1 µH Inductor 7445601 20% 8.6 A
7445601 - Wurth Electronics
R1
470 kΩ Resistor 0402 5% 0.1 W
2322-705-87474-L - Yageo
R2
15 kΩ Resistor 0402 5% 0.1 W
2322-705-87153-L - Yageo
R3
33 kΩ Resistor 0402 5% 0.1 W
2322-705-87333-L - Yageo
R4
390 kΩ Resistor 0402 1% 0.063 W
RC0402FR-07390KL - Yageo
R5
100 kΩ Resistor 0402 5% 0.1 W
2322-705-70104-L - Yageo
U1
Step Down Regulator MSOP10 3.5 A 2.4 MHz
LT3972IMSE#PBF - Linear Technology
Table 4: Suggested components for VCC voltage supply application circuit using a high reliability step-down regulator
Figure 7 and the components listed in Table 5 show an example of a low cost power supply circuit, where the
VCC module supply is provided by a step-down switching regulator capable of delivering 2.5 A current pulses,
transforming a 12 V supply input.
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3 Preliminary System description
Page 20 of 125
LEON-G100
LEON-G200
12V
R5
C6C1
VCC
INH
FSW
SYNC
OUT
GND
2
6
3
1
7
8
C3
C2
D1
R1
R2
L1
U1
50
VCC
GND
FB
COMP
5
4
R3
C4
R4
C5
Figure 7: Suggested schematic design for the VCC voltage supply application circuit using a low cost step-down regulator
Reference
Description
Part Number - Manufacturer
C1
22 µF Capacitor Ceramic X5R 1210 10% 25 V
GRM32ER61E226KE15 – Murata
C2
100 µF Capacitor Tantalum B_SIZE 20% 6.3V 15mΩ
T520B107M006ATE015 – Kemet
C3
5.6 nF Capacitor Ceramic X7R 0402 10% 50 V
GRM155R71H562KA88 – Murata
C4
6.8 nF Capacitor Ceramic X7R 0402 10% 50 V
GRM155R71H682KA88 – Murata
C5
56 pF Capacitor Ceramic C0G 0402 5% 50 V
GRM1555C1H560JA01 – Murata
C6
220 nF Capacitor Ceramic X7R 0603 10% 25 V
GRM188R71E224KA88 – Murata
D1
Schottky Diode 25V 2 A
STPS2L25 – STMicroelectronics
L1
5.2 µH Inductor 30% 5.28A 22 mΩ
MSS1038-522NL – Coilcraft
R1
4.7 kΩ Resistor 0402 1% 0.063 W
RC0402FR-074K7L – Yageo
R2
910 Ω Resistor 0402 1% 0.063 W
RC0402FR-07910RL – Yageo
R3
82 Ω Resistor 0402 5% 0.063 W
RC0402JR-0782RL – Yageo
R4
8.2 kΩ Resistor 0402 5% 0.063 W
RC0402JR-078K2L – Yageo
R5
39 kΩ Resistor 0402 5% 0.063 W
RC0402JR-0739KL – Yageo
U1
Step Down Regulator 8-VFQFPN 3 A 1 MHz
L5987TR – ST Microelectronics
Table 5: Suggested components for VCC voltage supply application circuit using a low cost step-down regulator
Low Drop-Out (LDO) linear regulator
The characteristics of the LDO linear regulator connected to VCC pin should meet the following requirements:
Power capabilities: the LDO linear regulator with its output circuit has to be capable to provide a proper
voltage value to VCC pin and has to be capable to deliver 2.5 A current pulses with 1/8 duty cycle to VCC
pin
Power dissipation: the power handling capability of the LDO linear regulator has to be checked to limit its
junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input
voltage to the min output voltage to evaluate the power dissipation of the regulator)
Figure 8 and the components listed in Table 6 show an example of a power supply circuit, where the VCC
module supply is provided by an LDO linear regulator capable to deliver 2.5 A current pulses, with proper power
handling capability. The use of a linear regulator is suggested when the difference from the available supply rail
and the VCC value is low: linear regulators provide good efficiency transforming a 5 V supply to the 3.8 V typical
value of the VCC supply.
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3 Preliminary System description
Page 21 of 125
5 V
C1 R1
IN OUT
ADJ
GND
1
2
4
5
3
C2R2
R3
U1
SHDN
LEON-G100
LEON-G200
50
VCC
GND
Figure 8: Suggested schematic design for the VCC voltage supply application circuit using an LDO linear regulator
Reference
Description
Part Number - Manufacturer
C1
10 µF Capacitor Ceramic X5R 0603 20% 6.3 V
GRM188R60J106ME47 - Murata
C2
10 µF Capacitor Ceramic X5R 0603 20% 6.3 V
GRM188R60J106ME47 - Murata
R1
47 kΩ Resistor 0402 5% 0.1 W
RC0402JR-0747KL - Yageo Phycomp
R2
4.7 kΩ Resistor 0402 5% 0.1 W
RC0402JR-074K7L - Yageo Phycomp
R3
2.2 kΩ Resistor 0402 5% 0.1 W
RC0402JR-072K2L - Yageo Phycomp
U1
LDO Linear Regulator ADJ 3.0 A
LT1764AEQ#PBF - Linear Technology
Table 6: Suggested components for VCC voltage supply application circuit using an LDO linear regulator
Rechargeable Li-Ion battery
The characteristics of the rechargeable Li-Ion battery connected to VCC pin should meet the following
requirements:
Maximum pulse and DC discharge current: the rechargeable Li-Ion battery with its output circuit has to
be capable to deliver 2.5 A current pulses with 1/8 duty cycle to VCC pin and has to be capable to deliver a
DC current greater than the module maximum average current consumption to VCC pin. The maximum
pulse discharge current and the maximum DC discharge current are not always reported in batteries data
sheet, but the maximum DC discharge current is typically almost equal to the battery capacity in Amperehours divided by 1 hour
DC series resistance: the rechargeable Li-Ion battery with its output circuit has to be capable to avoid a
VCC voltage drop greater than 400 mV during transmit bursts
Maximum charging voltage (overcharge detection voltage): if the charging process is managed by the
GSM module, the overcharge detection voltage of the used battery pack, which enables battery protection,
must be greater or equal than 4.3 V, to be charged by the GSM module
Charging operating temperature range: if the charging process is managed by the GSM module, the
charging operating temperature range of the used battery pack must include the 0°C -40°C range, to be
charged by the GSM module
Maximum DC charging current: the rechargeable Li-Ion battery has to be capable to be charged by the
charging current provided by the selected external charger. The maximum DC charging current is not always
reported in batteries data sheet, but the maximum DC charging current is typically almost equal to the
battery capacity in Ampere-hours divided by 1 hour
Primary (disposable) battery
The characteristics of the primary (non-rechargeable) battery connected to VCC pin should meet the following
requirements:
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3 Preliminary System description
Page 22 of 125
Maximum pulse and DC discharge current: the no-rechargeable battery with its output circuit has to be
capable to deliver 2.5 A current pulses with 1/8 duty cycle to VCC pin and has to be capable to deliver a DC
current greater than the module maximum average current consumption to VCC pin. The maximum pulse
and the maximum DC discharge current is not always reported in batteries data sheet, but the maximum DC
discharge current is typically almost equal to the battery capacity in Ampere-hours divided by 1 hour
DC series resistance: the no-rechargeable battery with its output circuit has to be capable to avoid a VCC
voltage drop greater than 400 mV during transmit bursts
Additional hints for the VCC supply application circuits
To reduce voltage drops, use a low impedance power source. The resistance of the power supply lines
(connected to VCC and GND pins of the module) on the application board and battery pack should also be
considered and minimized: cabling and routing must be as short as possible in order to minimize power losses.
To avoid undershoot and overshoot on voltage drops at the start and at the end of a transmit burst during a
GSM call (when current consumption on the VCC supply can rise up to 2.5 A in the worst case), place a 330 µF
low ESR capacitor (e.g. KEMET T520D337M006ATE045) located near VCC pin of LEON-G100/LEON-G200.
To reduce voltage ripple and noise, place near VCC pin of the LEON-G100/LEON-G200 the following
components:
100 nF capacitor (e.g Murata GRM155R61A104K) to filter digital logic noises from clocks and data sources
10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noises from clocks and data sources
10 pF capacitor (e.g. Murata GRM1555C1E100J) to filter transmission EMI in the DCS/PCS bands
39 pF capacitor (e.g. Murata GRM1555C1E390J) to filter transmission EMI in the GSM/EGSM bands
Figure 9 shows the complete configuration but the mounting of the each single component depends on
application design.
VBAT
C1 C4
LEON-G100
LEON-G200
50
VCC
GND
C3C2
C5
+
Figure 9: Suggested schematics design to reduce voltage ripple, noise and avoid undershoot and overshoot on voltage drops
Reference
Description
Part Number - Manufacturer
C1
330 µF Capacitor Tantalum D_SIZE 6.3 V 45 mΩ
T520D337M006ATE045 - KEMET
C2
100 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R61A104KA01 - Murata
C3
10 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C103KA01 - Murata
C4
39 pF Capacitor Ceramic C0G 0402 5% 25 V
GRM1555C1E390JA01 - Murata
C5
10 pF Capacitor Ceramic C0G 0402 5% 25 V
GRM1555C1E100JA01 - Murata
Table 7: Suggested components to reduce voltage ripple and noise and avoid undershoot and overshoot on voltage drops
LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3 Preliminary System description
Page 23 of 125
1.5.3 Current consumption profiles
During operation, the current consumed by LEON-G100/LEON-G200 through VCC pin can vary by several orders
of magnitude. This is applied to ranges from the high peak of current consumption during the GSM transmitting
bursts at maximum power level in connected mode, to the low current consumption in idle mode when power
saving configuration is enabled.
1.5.3.1 Current consumption profiles – Connected mode
When a GSM call is established, the VCC consumption is determined by the current consumption profile typical
of the GSM transmitting and receiving bursts.
The current consumption peak during a transmission slot is strictly dependent on the transmitted power, which
is regulated by the network. If the module transmits in GSM talk mode in the GSM 850 or in the EGSM 900
band at the maximum power control level (32.2 dBm typical transmitted power in the transmit slot/burst), the
current consumption can reach up to 2500 mA (with highly unmatched antenna) for 576.9 µs (width of the
transmit slot/burst) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/8 duty cycle,
according to GSM TDMA.
During a GSM call, current consumption is in the order of 100-200 mA in receiving or in monitor bursts and is
about 30-50 mA in the inactive unused bursts (low current period). The more relevant contribution to determine
the average current consumption is set by the transmitted power in the transmit slot.
Figure 10 shows an example of current consumption profile of the data module in GSM talk mode.
Time [ms]
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
Current [A]
200 mA
~170 mA
2500 mA
Peak current
depends on
TX power
GSM frame
4.615 ms
(1 frame = 8 slots)
1.5
1.0
0.5
0.0
2.5
2.0
~170 mA
~40 mA
Figure 10: Description of the VCC current consumption profile versus time during a GSM call (1 TX slot)
When a GPRS connection is established there is a different VCC current consumption profile also determined by
the transmitting and receiving bursts. In contrast to a GSM call, during a GPRS connection more than one slot
can be used to transmit and/or more than one slot can be used to receive. The transmitted power depends on
network conditions and sets the peak of current consumption, but following the GPRS specifications the
maximum transmitted power can be reduced if more than one slot is used to transmit, so the maximum peak of
current consumption is not as high as can be the case in a GSM call.
If the module transmits in GPRS class 10 connected mode in the GSM 850 or in the EGSM 900 band at the
maximum power control level (30.5 dBm typical transmitted power in the transmit slot/burst), the current
consumption can reach up to 1800 mA (with highly unmatched antenna) for 1.154 ms (width of the 2 transmit
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slots/bursts) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/4 duty cycle, according
to GSM TDMA.
In the following figure is reported the current consumption profiles with 2 slots used to transmit.
Time [ms]
RX
slot
unused
slot
unused
slot
TX
slot
TX
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
TX
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
Current [A]
200mA
~170 mA
1800 mA
Peak current
depends on
TX power
~170 mA
GSM frame
4.615 ms
(1 frame = 8 slots)
1.5
1.0
0.5
0.0
2.5
2.0
~40 mA
Figure 11: Description of the VCC current consumption profile versus time during a GPRS connection (2 TX slots)
1.5.3.2 Current consumption profiles – Cyclic idle/active mode (power saving enabled)
The power saving configuration is by default disabled, but it can be enabled using the appropriate AT command
(refer to u-blox AT Commands Manual [2], AT+UPSV command). When the power saving is enabled, the module
automatically enters idle-mode whenever possible.
When power saving is enabled, the module is registered or attached to a network and a voice or data call is not
enabled, the module automatically enters idle-mode whenever possible, but it must periodically monitor the
paging channel of the current base station (paging block reception), in accordance to GSM system requirements.
When the module monitors the paging channel, it wakes up to active mode, to enable the reception of paging
block. In between, the module switches to idle-mode. This is known as GSM discontinuous reception (DRX).
The module processor core is activated during the paging block reception, and automatically switches its
reference clock frequency from the 32 kHz used in idle-mode to the 26 MHz used in active-mode.
The time period between two paging block receptions is defined by the network. It can vary from 470.76 ms
(width of 2 GSM multiframes = 2 x 51 GSM frames = 2 x 51 x 4.615 ms) up to 2118.42 ms (width of 9 GSM
multiframes = 9 x 51 frames = 9 x 51 x 4.615 ms): this is the paging period parameter, fixed by the base station
through broadcast channel sent to all users on the same serving cell.
An example of the current consumption profile of the data module when power saving is enabled is shown in
Figure 12: the module is registered with the network, automatically goes into idle mode and periodically wakes
up to active mode to monitor the paging channel for paging block reception (cyclic idle/active mode).
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~30 ms
IDLE MODE ACTIVE MODE IDLE MODE
500-700 µA
8-10 mA
20-22 mA
~150 mA
Active Mode
Enabled
Idle Mode
Enabled
PLL
Enabled
RX
Enabled
500-700 µA
~150 mA
0.44-2.09 s
IDLE MODE
~30 ms
ACTIVE MODE
Time [s]
Current [mA]
150
100
50
0
Time [ms]
Current [mA]
150
100
50
0
38-40 mA
DSP
Enabled
Figure 12: Description of the VCC current consumption profile versus time when power saving is enabled: the module is in idle
mode and periodically wakes up to active mode to monitor the paging channel for paging block reception
1.5.3.3 Current consumption profiles – Fixed active mode (power saving disabled)
Power saving configuration is by default disabled, or it can be disabled using the appropriate AT command (refer
to u-blox AT Commands Manual [2], AT+UPSV command). When power saving is disabled, the module doesn’t
automatically enter idle-mode whenever possible: the module remains in active mode.
The module processor core is activated during active-mode, and the 26 MHz reference clock frequency is used.
An example of the current consumption profile of the data module when power saving is disabled is shown in
Figure 13: the module is registered with the network, active-mode is maintained, and the receiver and the DSP
are periodically activated to monitor the paging channel for paging block reception.
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ACTIVE MODE
20-22 mA 20-22 mA
20-22 mA
~150 mA
0.47-2.12 s
Paging period
Time [s]
Current [mA]
150
100
50
0
Time [ms]
Current [mA]
150
100
50
0
RX
Enabled
DSP
Enabled
~150 mA
38-40 mA
Figure 13: Description of the VCC current consumption profile versus time when power saving is disabled: active-mode is
always held, and the receiver and the DSP are periodically activated to monitor the paging channel for paging block reception
1.5.4 Battery charger (LEON-G200 only)
For battery charging functionalities the module is provided with integrated circuitry and software. Two pins are
available to connect the positive pole of the external DC supply used as charger.
Name
Description
Remarks
V_CHARGE
Charger Voltage Supply Input
V_CHARGE and CHARGE_SENSE pins must be externally
connected together.
CHARGE_SENSE
Charger Voltage Measurement Input
V_CHARGE and CHARGE_SENSE pins must be externally
connected together.
Table 8: Battery charger pins
V_CHARGE and CHARGE_SENSE pins ESD sensitivity rating is 1 kV (HBM JESD22-A114F). A higher
protection level could be required if the lines are externally accessible on the application board. A higher
protection level can be achieved mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor
array) on the lines connected to these pins if they are externally accessible on the application board.
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The V_CHARGE pin is the charger supply input: it sinks the charge current that is typically in the order of several
hundred of mA. The CHARGE_SENSE pin is connected to an internal ADC converter to measure the charging
voltage: it senses the charger voltage and sinks a few µA.
V_CHARGE and CHARGE_SENSE pins must be externally connected together as shown in Figure 14.
There may not be any capacitor on the charge path: a straight connection must be provided between
the output of the external supply used as charging source and V_CHARGE and CHARGE_SENSE pins
of the module.
If the battery charging process is not managed by the GSM module, V_CHARGE and CHARGE_SENSE
pins can be left floating on the application board.
LEON-G200
+
Charger
Voltage and
current limited
Li-Ion
Battery
5
CHARGE_SENSE
4
V_CHARGE
GND
50
VCC
GND
-
+
-
Figure 14: Connection of an external DC supply used as charger and a Li-Ion battery to the LEON-G200 module
To prevent damage to the module and the battery, use only chargers that comply with the
characteristics given in section 1.5.4.2.
1.5.4.1 Charging process description
A valid charger is recognized if the voltage provided to V_CHARGE and CHARGE_SENSE pins are within the
operating range limits (5.6 V minimum, 15 V maximum). If the module is switched off, the charger circuitry
generates the power on in charging mode after charger detection.
The algorithm that controls battery charging, implements a classic Li-Ion battery charging process, divided into 4
phases:
1. Pre-Charge, at low current, for deeply discharged batteries (VCC voltage within 0 V and 3.1 V typical)
2. Fast Charge, at the maximum current provided by the external DC supply used as charger that must be
current limited, for discharged batteries (VCC voltage within 3.1 V typical and 4.2 V typical)
3. Top Charge, to complete the over-charging of the batteries, after the maximum voltage is reached (VCC
voltage equal to 4.2 V typical)
4. Trickle Charge, to maintain the battery at higher level of charge, if the external DC supply used as charger
remains connected
If the batteries are deeply discharged (VCC voltage within 0 V and 3.1 V typical with 7% tolerance due to
change in temperature and life time), and the device is in not-powered mode, the charger circuit starts
pre-charging when a valid voltage is provided to V_CHARGE and CHARGE_SENSE pins of the module. In the
pre-charging phase, the charge transistor switch mounted inside the module is pulsed with a 100 Hz clock and
an on-time of 12.5% of a period. This means the average charge current is reduced to avoid overheating of
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GSM.G1-HW-09002-G3 Preliminary System description
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charger parts and to gently charge the deeply discharged batteries: the average pre-charge current is ~1/8 (i.e.
12.5%) of the current provided by the external charger, so it is ~1/8 of the external charger current limit.
Pre-charging phase is hardware controlled and continues as long as the VCC voltage reaches the 3.1 V typical
limit, so the module is able to start the following fast charging phase.
During fast charging phase (following the pre-charging phase) the charge transistor switch mounted inside the
module is pulsed with a 100 Hz and an on-time of 99% of a period: the average charge current is almost equal
(i.e. 99%) to the current provided by the external charger, so it is almost equal to the external charger current
limit. The remaining off time (i.e. 1% of a period) is used to check if the external charger is still connected since
detection is critical when charging switch is closed.
The integrated charging circuit doesn’t have any voltage or current limitation, therefore the charger must be
chosen very carefully: during the fast charging phase, the battery is charged with the maximum DC current
provided by the external DC supply used as charger, which must be current limited as described in the charger
specification section.
When the battery voltage reaches the nominal maximum voltage (4.2 V typical with 2% tolerance due to change
in temperature and life time), charging enters the constant voltage phase (top charge algorithm): in this phase
the average charging current decreases until the battery is completely charged.
After the constant voltage phase, the battery is maintained at a higher level of charge with the trickle charge
algorithm until an external charger is connected to the module.
The charging process is enabled only within the temperature range from 0°C to 40°C, with a 5°C hysteresis to
prevent rapid switching on and off as the temperature drifts around the set point: charging is disabled when the
temperature falls below 0°C and then enabled when it rises above 5°C; charging is disabled when the measured
temperature rises above 40°C and then enabled when falls below 35°C.
Battery over-voltage detection is implemented to switch-off charging if the battery is removed during charging.
The VCC over-voltage threshold level is set to the nominal value of 4.47 V (evaluated with 2% of tolerance due
to change in temperature and life time).
The charging process is disabled when an external charger is removed from V_CHARGE and CHARGE_SENSE
pins.
1.5.4.2 External charger specification
It is suggested to use a charger with the following electrical characteristics:
6 V DC voltage
500 mA current limit (if it is less than the maximum DC charging current specified by the used battery)
To avoid damage to the module, the external supply used as charging source must be voltage
and current limited, with a voltage limit ≤ 15 V and a current limit ≤ 1.0 A.
DC supplies with fold-back current protection cannot be used as charger for the module.
The V-I output characteristics of the external supply used as charger must be within the valid area delineated by:
the maximum acceptable charging voltage (equal to 15 V in any case)
the minimum open circuit voltage valid for charger detection (equal to 5.6 V in any case)
the maximum acceptable charging current (equal to 1.0 A or to the maximum DC charging current specified
by the used battery if it is less than 1.0 A)
the minimum charging current (specified by the application, e.g. 400 mA)
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Maximum voltage
The voltage limit of the external charger must be ≤ 15 V. Since the module is not provided with an internal
overvoltage protection circuit on V_CHARGE and CHARGE_SENSE pins, the charging voltage must be lower or
equal to the maximum acceptable charging voltage value of 15 V at any time: voltage spikes that may occur
during connection or disconnection of the charger must be limited within this value, so the external supply used
as charging source must be voltage limited with a voltage limit ≤ 15 V.
Minimum voltage
The charger must be able to provide a minimum open circuit output voltage ≥ 5.6 V for the valid charger
detection.
Maximum current
The current limit of the external charger must be ≤ 1.0 A (that is the module absolute maximum rating as
charging current) and must be lower than the maximum DC charging current specified by the used battery.
Since the module is not provided with an internal over-current protection circuit on V_CHARGE and
CHARGE_SENSE pins, the charging current must be lower or equal to the maximum acceptable charging
current value at any time: current spikes that may occur during charger connection or disconnection must be
limited within this value, so the external supply used as charging source must be current limited with a proper
current limit.
Minimum current
A minimum acceptable value for the charging current is not specified, but the charging current value should be
large enough to perform the whole battery charging process within the time interval defined by the application
and the charging current value should be greater than the highest possible average current consumption of the
system that is supplied by the battery (i.e. the module plus any additional device on the application board) to let
the increase of the battery level while the system reaches its highest current consumption. For example, if the
battery supplies only the module and the charging current value is equal to 400 mA, the battery level can be
increased also when the module reaches its highest current consumption (during a GPRS connection). If some
other devices are supplied by the battery beside the module, when the battery is deeply discharged (VCC below
3.1 V typical), the module is switched off and the pre-charging current (~1/8 of the external charger current
limit) is enabled: this current should be greater than the highest possible average current consumption of the
system to let the increase of the battery level while the system reaches its highest current consumption.
For example, Figure 15 shows the valid area for the charger V-I output characteristics using a battery with a
maximum DC charging current equal to 600 mA: the maximum acceptable charging current is defined by the
battery requirement (600 mA).
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16
15.0
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
800700500
400
3002001000 900 1000 1100
mA
V
5.6
600
Figure 15: Valid area for the charger V-I output characteristics using a battery with a max DC charging current equal to 600 mA
For example, Figure 16 shows the valid area for the charger V-I output characteristics using a battery with a
maximum DC charging current greater than 1000 mA: the maximum acceptable charging current is defined by
the module requirement (1000 mA).
16
15.0
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
800700500
400
3002001000 900600 1100
mA
V
5.6
1000
Figure 16: Valid area for the charger V-I output characteristics using a battery with a max DC charging current greater than 1 A
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