Transcend Information TS64MRMMC4, TS1GRMMC4 User Manual

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Description
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Features
MMCmobile
TS64MRMMC4 ~ TS1GRMMC4 is a 64MB ~ 1GB MMCmobile memory card. It’s a fastest, low-power, highly integration memory card. TS64MRMMC4 ~ TS1GRMMC4 is designed to provide an inexpensive, mechanically robust storage medium in card form for multimedia consumer applications and mobile devices (handheld PCs, digital cameras, MP3 players, etc.) to store, copy, and move data at high-speed transfer rate.
Placement
Front Back
Pin Definition
MMC Mode SPI Mode
Pin No.
Name Type Description Name Type Description
1 DAT3 I/O/PP Data CS I Chip select 2 CMD I/O/PP/OD Command/Response DI I/PP Data in 3 VSS1 S Ground VSS S Ground 4 VDD S Power supply VDD S Power supply 5 CLK I Clock SCLK I Clock 6 VSS2 S Ground VSS2 S Ground 7 DAT0 I/O/PP Data DO O/PP Data out
8 DAT1 I/O/PP Data Not used
9 DAT2 I/O/PP Data Not used 10 DAT4 I/O/PP Data Not used 11 DAT5 I/O/PP Data Not used 12 DAT6 I/O/PP Data Not used 13 DAT7 I/O/PP Data
Storage Capacity: 64MB ~ 1GB
Support Dual Operating Voltage: 2.7~3.6V/1.65~1.95V
Support clock frequencies: 0~52MHz
Support different Bus width: x1, x4, x8
Operating Temperature: -25°C ~ 85°C
Data access mode: Byte mode
Fully compatible with MultiMediaCard system
specification version 4.0 and backwards compatibility with previous specification
Form Factor: 18mm x 24mm x 1.4mm
Not used
S: Power Supply; I:Input; O:Output; PP:Push-Pull; OD:Open-Drain; NC:Not Connected
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MultiMediaCard Architecture
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MMCmobile
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Temperature Characteristics
Parameter Min. Max. Unit
Operating temperature -25 85
Electrical Characteristics
• Absolute Maximum Ratings
Parameter Symbol Rating Unit
Power Supply Voltage V Input Voltage V Input/Output Voltage V
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I/O
-0.6~+4.6 V
IN
-0.6~+4.6 V
-0.6~+4.6 V
MMCmobile
• Recommended Operation Conditions
Parameter Symbol Min. Typ. Max. Unit
Power Supply Voltage (High Voltage Range) V Power Supply Voltage (Low Voltage Range) V
DDH
DDL
2.7 3.3 3.6 V
1.65 1.8 1.95 V
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DC Characteristics
• High Voltage Power Supply
Parameter Symbol Min.
Output Low Voltage (OD) V Output High Voltage (PP) V Output Low Voltage (PP) V Input High Voltage V Input Low Voltage V Operating Current I Stand-by Current I Input Leakage Current I Output Leakage Current I Pin Capacitance C Power Output Voltage V
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ODOL
OH
OL
IH
IL
CC
SB
LI
LO
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F
0.75* V
0.625* V
DDH
DDH
-0.3
1.50
Typ.
1.8
MMCmobile
(Ta=-25 to 85℃,V
Max. Unit Condition
0.3 V IOL =2mA V I
0.125* V V
0.25* V 20(TBD) mA I
400(TBD) uA
DDH
+0.3 V
DDH
DDH
-10/+10 uA VIN =0 to V
-10/+10 uA V 7 pF
1.95 V IF<=240mA
V IOL =100uA
V
=2.7V to3.6V)
DDH
=-100uA
OH
=0mA
VCCF
=0 to V
OUT
DDH
DDH
• Low Voltage Power Supply
Parameter Symbol Min.
Output High Voltage V Output Low Voltage V Input High Voltage V Input Low Voltage V Operating Current I Stand-by Current I Input Leakage Current I Output Leakage Current I Pin Capacitance C
CC
SB
LO
OH
OL
IH
LI
V
-0.2
DDL
0.7* V
DDL
IL
P
-0.3
Typ.
(Ta=-25 to 85,V
Max. Unit Condition
V IOH =-100uA
0.2 V IOL =100uA +0.3 V
V
DDL
0.3* V
DDL
20(TBD) mA I
400(TBD) uA
-10/+10 uA VIN =0 to V
-10/+10 uA V 7 pF
=1.65V to 1.95V)
DDL
V
=0mA
VCCF
DDL
=0 to V
OUT
DDL
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AC Characteristics
• High Speed Card Interface Timing
Parameter Symbol Min. Max. Unit Notes
Clock Frequency (Data Transfer Mode) fpp 26 52 MHz
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(Ta=-25 to 85,V
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=2.7V to3.6V)
DDH
Clock Frequency (Identification Mode) f Clock Low Time t Clock Rise Time t Clock Fall Time t Input Set-up Time t Input Hold Time t Output Delay Time t
Signal Rise Time t Signal Fall Time t
OD
WL
TLH
THL
ISU
IH
DLY
rise
fall
0 400 KHz
6.5 ns 3 ns 3 ns
3 ns 3 ns
<=30pF
5 14 ns
3 ns 3 ns CL<=30pF
C
L
<=30pF
C
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• Backwards Compatible Card Interface Timing
Parameter Symbol Min. Max. Unit Notes
Clock Frequency (Data Transfer Mode) fpp 0 20 MHz
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(Ta=-25 to 85,V
MMCmobile
=2.7V to3.6V)
DDH
Clock Frequency (Identification Mode) f Clock Low Time t Clock Rise Time t Clock Fall Time t Input Set-up Time t Input Hold Time t
Output Delay Time t
OD
WL
TLH
THL
ISU
IH
DLY
0 400 KHz
10 ns
10 ns 10 ns
3 ns 3 ns
<=30pF
9.7 35 ns
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• Command Latch Cycle
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Parameter Symbol Min. Unit Notes
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MMCmobile
CLE Setup Time t CLE Hold Time t CE Setup Time t CE Hold Time t ALE Setup Time t ALE Hold Time t WE Pulse Width t Data Setup Time t Data Hold Time t
CLS1
CLH1
CS1
CH1
ALS1
ALH1
WP1
DS1
DH1
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15
40
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ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF
• Address Latch Cycle
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Parameter Symbol Min. Unit Remark
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MMCmobile
CLE Setup Time t CE Setup Time t ALE Setup Time t ALE Hold Time t Write Cycle Time t WE Pulse Width t WE High Hold Time t Data Setup Time t Data Hold Time t
CLS2
CS2
ALS2
ALH2
WC2
WP2
WH2
DS2
DH2
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30
15
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45
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ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF
• Input Data Latch Cycle
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Parameter Symbol Min. Unit Remark
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MMCmobile
CLE Hold Time t CE Hold Time t ALE Setup Time t Write Cycle Time t WE Pulse Width t WE High Hold Time t Data Setup Time t Data Hold Time t
CLH3
CH3
ALS3
WC3
WP3
WH3
DS3
DH3
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90
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45
15
30
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ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF
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• Serial Access Cycle after Read
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Parameter Symbol Min. Unit Remark
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MMCmobile
CE Access Time t Read Cycle Time t RE Pulse Width t RE High Hold Time t Data Setup Time t Data Hold Time t Ready to RE Low t
CEA4
RC4
RP4
REH4
DS4
DH4
RR4
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45
15
5(TBD)
5(TBD)
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ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF ns CL<=80pF
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Reliability and Durability
Temperature Operation: -25°C / 85°C
Moisture and corrosion Operation: 25°C / 95% rel. humidity
ESD protection Contact Pads:
Durability 10.000 mating cycles; test procedure: t.b.d. Bending t.b.d. Torque t.b.d. Drop test 1.5m free fall UV light exposure UV: 200nm, 15Ws/cm² according to ISO 7816-1 Visual inspection Shape and form
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Storage: -40°C (168h) / 85°C (500h) Junction temperature: max. 95°C
Stress: 40°C / 93% rel. hum./500h Salt Water Spray: 3% NaCl/35C; 24h acc. MIL STD Method 1009
+/-4kV, Human body model according to ANSI EOS/ESD-S5.1-1998 Non Contact Pads area: +/-8kV(coupling plane discharge) +/-15kV(air discharge) Human body model according to IEC61000-4-2
No warp page; no mold skin; complete form; no cavities surface smoothness sigma
-0.1 mm/cm² within contour; no cracks; no pollution (fat, oil dust, etc.)
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MMCmobile
Above technical information is based on MMC4.0 standard specification and tested to be reliable. However, Transcend makes no warranty, either expressed or implied, as to its accuracy and assumes no liability in connection with the use of this product. Transcend reserves the right to make changes in specifications at any time without prior notice.
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