T
S
1
T
S
1
T
S
1
Description
2
2
2
8
8
8
M
M
M
~
~
~
2
2
2
G
G
G
S
S
S
D
D
D
M
M
M
8
8
8
0
0
0
128M~2GB miniSD Memory Card
Features
miniSD Card is a compact, slim and high capacity
storage media with copyright protection. Designed in
advanced SD specification Ver.1.1, TS2GSDM80
now reaches a new performance milestone. Based on
0.18um process controller and high quality SLC
(Single-Level-Cell) NAND Flash chip, TS128M~
2GSDM80 can provide high performance ,low power
consumption yet excellent reliability.
Placement
9 1 2 3 10 11 4 5
Front Back
6 7 8
• Storage Capacity: 2GB(2GX8bit,2KB/page )
• Operating Voltage: 2.7 ~ 3.6V
• Operating Temperature: -25 ~ 85°C
• Maximum Data Transfer Rate:
Read:12MB/sec,Write:11MB/sec
• Insertion/removal durability: 10,000 cycles
• Fully compatible with SD card spec. v1.1
• Forward compatibility to MultiMediaCard Version 2.11
• Supports Copy Protection for Recorded Media(CPRM) for
music and other commercial media
• Form Factor: 21.5mm x 20mm x 1.4mm
Pin Definition
Pin
No.
Name Type Description
1
CD/DAT3 I/O/PP
2
CMD PP Command/Response
3
Card Detect/Data Line [Bit3]
Transcend Information Inc.
3
4
5
6
7
8
9
10
11
1
V
SS1
V
DD
CLK I Clock
V
SS2
DAT0 I/O/PP Data Line [Bit0]
DAT1 I/O/PP Data Line [Bit1]
DAT2
4
NC
4
NC
S Supply voltage ground
S Supply voltage
S Supply voltage ground
I/O/PP Data Line [Bit2]
I/O/PP For Future Use
I/O/PP For Future Use
T
S
1
2
8
M
~
2
G
S
D
T
S
1
2
8
M
~
2
G
T
S
1
2
8
M
~
2
G
S
S
D
D
M
M
M
8
8
8
0
0
0
128M~2GB miniSD Memory Card
Architecture
Transcend Information Inc.
2
T
S
1
2
8
M
~
2
G
S
D
T
S
1
2
8
M
~
2
G
T
S
1
2
8
M
~
2
Bus Operating Conditions
• General
Parameter Symbol Min. Max. Unit Remark
Peak voltage on all lines -0.3 VDD+0.3 V
All Inputs
Input Leakage Current -10 10 µA
All Outputs
Output Leakage Current -10 10 µA
• Power Supply Voltage
Parameter Symbol Min. Max. Unit Remark
Supply voltage V
Supply voltage specified in OCR register 2.7 3.6 V Except CMD0, 15,55,
Supply voltage differentials (V
Power up time 250 ms From 0v to V
Note. The current consumption of any card during the power-up procedure must not exceed 10 mA.
• Bus Signal Line Load
G
SS1
S
S
M
D
M
D
M
, V
) -0.3 0.3 V
SS2
8
8
8
0
0
0
DD
128M~2GB miniSD Memory Card
2.0 3.6 V CMD0, 15,55,ACMD41
commands
ACMD41 commands
DD
Min.
The total capacitance C
capacitance C
C
= C
L
HOST
Where N is the number of connected cards. Requiring the sum of the host and bus capacitances not to exceed 30 pF for
up to 10 cards, and 40 pF for up to 30 cards, the following values must not be exceeded:
Bus signal line capacitance C
Single card capacitance C
Maximum signal line inductance 16 nH f
Pull-up resistance inside card (pin1) R
Note that the total capacitance of CMD and DAT lines will be consist of C
connected separately to the SD Memory Card host.
Pull-up resistance R
Bus signal line capacitance C
Transcend Information Inc.
itself and the capacitance C
BUS
+ C
BUS
Parameter Symbol Min. Max. Unit Remark
Parameter Symbol Min. Max. Unit Remark
the CLK line of the SD Memory Card bus is the sum of the bus master capacitance C
L
of each card connected to this line:
CARD
+ Ν*C
CARD
CMD
L
CARD
DAT3
, R
L
DAT
100 pF f
10 pF
10 90 kΩ May be used for card
, C
HOST
10 100 kΩ To prevent bus floating
250 pF f
3
and one C
BUS
≤ 20 MHz, 7 cards
PP
≤ 20 MHz
PP
detection
≤ 5 MHz, 21 cards
PP
HOST
only since they are
CARD
, the bus
T
S
1
2
8
M
~
2
G
S
D
T
S
1
2
8
M
~
2
G
T
S
1
2
8
M
~
2
• Bus Signal Levels
As the bus can be supplied with a variable supply voltage, all signal levels are related to the supply voltage.
G
S
S
D
D
M
M
M
8
8
8
0
0
0
128M~2GB miniSD Memory Card
To meet the requirements of the JEDEC specification JESD8-1A, the card input and output voltages shall be within the
following specified ranges for any V
Parameter Symbol Min. Max. Unit Remark
Output HIGH voltage V
Output LOW voltage V
Input HIGH voltage V
Input LOW voltage V
of the allowed voltage range:
DD
OH
OL
IH
IL
0.75* V
0.625* V
V
DD
0.125* V
DD
– 0.3 0.25* V
SS
V I
DD
V
+ 0.3 V
DD
DD
= -100 μA @VDD min
OH
V I
V
= -100 μA @VDD min
OL
Transcend Information Inc.
4
T
S
1
2
8
M
T
S
1
2
T
S
• Bus Timing (Default)
1
2
8
8
M
M
~
~
~
2
2
2
G
G
G
S
S
S
D
D
D
M
M
M
8
8
8
0
0
0
128M~2GB miniSD Memory Card
Parameter Symbol Min Max. Unit Remark
Clock CLK (All values are referred to min (VIH) and max (VIL)
Clock frequency Data Transfer Mode f
Clock frequency Identification Mode
(The low freq. is required for MultiMediaCard
compatibility.)
Clock rise time t
Transcend Information Inc.
f
t
t
PP
OD
WL
WH
TLH
0 25 MHz C
0 400 KHz C
10 ns C
50 ns C
10 ns C
50 ns C
10 ns C
5
≤ 100 pF, (7 cards)
L
≤ 250 pF, (21 cards)
L
≤ 100 pF, (7 cards) Clock low time
L
≤ 250 pF, (21 cards)
L
≤ 100 pF, (7 cards) Clock high time
L
≤ 250 pF, (21 cards)
L
≤ 100 pF, (7 cards)
L
T
S
1
2
8
M
~
2
G
S
D
T
S
1
2
8
M
~
2
G
T
S
1
2
8
M
~
2
50 ns C
Inputs CMD, DAT (referenced to CLK)
Input set-up time t
Input hold time t
Outputs CMD, DAT (referenced to CLK)
Output Delay time during Data Transfer Mode t
Output Delay time during Identification Mode t
G
S
S
D
D
M
M
M
8
8
8
0
0
0
t
THL
50 ns C
ISU
IH
ODLY
ODLY
10 ns C
5 ns C
5 ns C
0 14 ns C
0 50 ns C
128M~2GB miniSD Memory Card
≤ 250 pF, (21 cards)
L
≤ 100 pF, (7 cards) Clock fall time
L
≤ 250 pF, (21 cards)
L
≤ 25 pF, (1 cards)
L
≤ 25 pF, (1 cards)
L
≤ 25 pF, (1 cards)
L
≤ 25 pF, (1 cards)
L
Transcend Information Inc.
6
T
S
1
2
8
M
~
2
G
S
T
S
1
2
8
M
~
2
T
S
1
2
8
M
• Bus Timing (High Speed Mode)
~
2
G
G
S
S
D
D
D
M
M
M
8
8
8
0
0
0
128M~2GB miniSD Memory Card
Parameter Symbol Min Max. Unit Remark
Clock CLK (All values are referred to min (VIH) and max (VIL)
Clock frequency Data Transfer Mode f
Clock low time t
Clock high time t
Clock rise time t
Clock fall time t
Inputs CMD, DAT (referenced to CLK)
Input set-up time t
Input hold time t
Outputs CMD, DAT (referenced to CLK)
Transcend Information Inc.
PP
WL
WH
TLH
THL
ISU
IH
0 50 MHz
7 ns
7 ns
3 ns
3 ns
6 ns
2 ns
7
T
S
1
2
8
M
~
2
G
S
D
T
S
1
2
8
M
~
2
G
T
S
1
2
8
M
~
2
Output Delay time during Data Transfer Mode t
Output Hold time t
Total System capacitance for each line C
Reliability and Durability
Temperature Operation: -25°C / 85°C (Target spec)
Moisture and corrosion Operation: 25°C / 95% rel. humidity
Durability 10.000 mating cycles;
Bending 10N
Torque 0.15N.m or +/-2.5 deg
Drop test 1.5m free fall
UV light exposure UV: 254nm, 15Ws/cm² according to ISO 7816-1
Visual inspection
Shape and form
Above technical information is based on industry standard data and tested to be reliable. However, Transcend makes no
warranty, either expressed or implied, as to its accuracy and assumes no liability in connection with the use of this product.
Transcend reserves the right to make changes in specifications at any time without prior notice.
G
S
S
M
D
M
D
M
Storage: -40°C (168h) / 85°C (500h)
Junction temperature: max. 95°C
Storage: 40°C / 93% rel. hum./500h
Salt Water Spray: 3% NaCl/35C; 24h acc. MIL STD Method 1009
No warp page; no mold skin; complete form; no cavities surface smoothness <=
-0.1 mm/cm² within contour; no cracks; no pollution (fat, oil dust, etc.)
8
8
8
0
0
0
ODLY
OH
128M~2GB miniSD Memory Card
14 ns
2.5 ns
L
40 pF
Transcend Information Inc.
8
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