Features
SMD Package (SOIC-14/18)
Construction in Lead Frame T echnology
Isolated Single and Dual Output
I/O-Isolation 1‘000 VDC
High Efficiency
Operating Temperature –40°C to +85°C
Reflow Solder Temperature up to 230°C
High Accuracy of Pin Co-Planarity
Available in T ape and Reel Package
2 Year Product Warranty
DC/DC Converter
TSM Series 1 Watt
The TSM series are isolated DC/DC converters with 1W output power
implemented in a molded plastic package with a pin accuracy suitable for high volume SMD-production. The devices do not require a
special reflow process but can be soldered like standard SMD-components. With their small footprint these converters are the economical solution for point of use power conversion, ground loop elimination, noise reduction and digital interface applications.
Models
Ordercode Input voltage Output voltage Output current max. Efficiency typ.
TSM 0505S 5 VDC 200 mA 80 %
TSM 0509S 9 VDC 110 mA 78 %
TSM 0512S 12 VDC 80 mA 80 %
TSM 0515S 5 VDC ±10% 15 VDC 65 mA 81 %
TSM 0505D ± 5 VDC ±100 mA 75 %
TSM 0512D ±12 VDC ± 40 mA 79 %
TSM 0515D ±15 VDC ± 30 mA 79 %
TSM 1205S 5 VDC 200 mA 81 %
TSM 1209S 9 VDC 110 mA 78 %
TSM 1212S 12 VDC 80 mA 81 %
TSM 1215S 12 VDC ±10% 15 VDC 65 mA 82 %
TSM 1205D ± 5 VDC ±100 mA 75 %
TSM 1212D ±12 VDC ± 40 mA 80 %
TSM 1215D ±15 VDC ± 30 mA 80 %
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DC/DC Conver ter
TSM Series 1 Watt
Input Specifications
Input current no load /full load 5 Vin models 30 mA / 260 mA typ.
12 Vin models 15 mA / 110 mA typ.
Surge voltage (1 sec. max.) 5 Vin models 9 V max.
12 Vin models 18 V max.
Reverse voltage protection 0.3 A max.
Reflected input ripple current can be reduced by ext. 1–2.2 µF polyester film
capacitor
Input filter internal capacitors
Output Specifications
V oltage set accuracy ± 3 %
V oltage balance (dual output models) ± 1 % max.
Regulation – Input variation ± 1.2 % / 1 % change Vin
– Load variation 20 – 100 % ± 10 % max.
Ripple and noise (20 MHz Bandwidth) 120 mVpk-pk max.
T emperature coefficient ± 0.02 % / °C
Short circuit protection limited 1 sec. max.
Capacitive load – Single output models 22 µF max.
– Dual output models 10 µF max.
General Specifications
T emperature ranges – Operating (see also enclosed derating curve) –40 °C ... +85 °C (no derating)
– Storage –55 °C ... +125 °C
Humidity (non condensing) 95 % rel H max.
Reliability , calculated MTBF (MIL-HDBK-217E) > 2’000’000 h @ 25 °C
Isolation voltage Input/Output 1‘000 VDC
Isolation capacity Input/Output 40 pF typ.
Isolation resistance Input/Output >1‘000 Mohm
Switching frequency 100 kHz typ. (Frequency modulation)
Frequency change over line and load ± 30 %
Physical Specifications
Case material Epoxy molding compound
(flammability to UL 94-V0)
Package weight – Single output models 1.2 g (0.04 oz)
– Dual output models 1.5 g (0.05 oz)
Reflow soldering profile Peak temp. 230°C (10 sec max.)
185°C for 90 sec max. Convection reflow
solder process is recommended
All specifications valid at nominal input voltage, full load and +25°C after warm-up time unless otherwise stated.
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