TQ TQMx50UC User Manual

TQMx50UC

User's Manual

TQMx50UC UM 0101 2018-09-26

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and License Expenses............................................................................................................................................................1

1.2 Registered Trademarks..............................................................................................................................................................................1

1.3 Disclaimer...................................................................................................................................................................................................... 1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Service and Support...................................................................................................................................................................................1

1.6 Tips on Safety ...............................................................................................................................................................................................2

1.7 Symbols and Typographic Conventions..............................................................................................................................................2

1.8 Handling and ESD Tips .............................................................................................................................................................................. 2

1.9 Naming of Signals....................................................................................................................................................................................... 3

1.10 Further Applicable Documents / Presumed Knowledge................................................................................................................ 3

2. INTRODUCTION ...........................................................................................................................................................................................4

2.1 Functional Overview..................................................................................................................................................................................4

2.2 Specification Compliance.........................................................................................................................................................................5

2.3 Versions..........................................................................................................................................................................................................5

2.4 Accessories....................................................................................................................................................................................................5

3. FUNCTIONAL SPECIFICATION..................................................................................................................................................................6

3.1 Block Diagram..............................................................................................................................................................................................6

3.2 Electrical Specification...............................................................................................................................................................................6

3.2.1 Supply Voltage Characteristics ...............................................................................................................................................................6

3.2.2 Power Consumption Specification........................................................................................................................................................7

3.2.3 Real Time Clock Current Specification..................................................................................................................................................7

3.3 Environmental Specification ................................................................................................................................................................... 8

3.4 System Components.................................................................................................................................................................................. 8

3.4.1 Processor ....................................................................................................................................................................................................... 8

3.4.1.1 Intel® Turbo Boost Technology ..............................................................................................................................................................9

3.4.1.2 Intel® Configurable Thermal Design Power........................................................................................................................................9

3.4.2 Graphics .........................................................................................................................................................................................................9

3.4.3 Chipset............................................................................................................................................................................................................9

3.4.4 Memory....................................................................................................................................................................................................... 10

3.4.4.1 DDR3L SDRAM .......................................................................................................................................................................................... 10

3.4.4.2 SPI Boot Flash............................................................................................................................................................................................ 10

3.4.4.3 EEPROM....................................................................................................................................................................................................... 10

3.4.5 Real Time Clock......................................................................................................................................................................................... 10

3.4.6 Trusted Platform Module....................................................................................................................................................................... 10

3.4.7 Hardware Monitor.................................................................................................................................................................................... 10

3.4.8 TQ Flexible I/O Configuration (TQ-flexiCFG).................................................................................................................................... 10

3.4.9 Ultra Deep Power State Green ECO-Off ............................................................................................................................................ 11

3.5 Interfaces .................................................................................................................................................................................................... 11

3.5.1 PCI Express ................................................................................................................................................................................................. 11

3.5.2 PCI Express Graphics (PEG).................................................................................................................................................................... 11

3.5.3 Gigabit Ethernet ....................................................................................................................................................................................... 11

3.5.4 Serial ATA.................................................................................................................................................................................................... 11

3.5.5 Digital Display Interface......................................................................................................................................................................... 11

3.5.6 LVDS Interface........................................................................................................................................................................................... 11

3.5.7 USB 2.0 Interfaces..................................................................................................................................................................................... 11

3.5.8 USB 3.0 Interfaces..................................................................................................................................................................................... 12

3.5.9 General Purpose Input / Output.......................................................................................................................................................... 12

3.5.10 High Definition Audio Interface........................................................................................................................................................... 12

3.5.11 LPC Bus........................................................................................................................................................................................................ 12

3.5.12 IC Bus.......................................................................................................................................................................................................... 12

3.5.13 SMBus .......................................................................................................................................................................................................... 12

3.5.14 Serial Peripheral Interface ..................................................................................................................................................................... 12

3.5.15 Serial Ports.................................................................................................................................................................................................. 13

3.5.16 Watchdog Timer....................................................................................................................................................................................... 13

TABLE OF CONTENTS (continued)

3.6 Connectors................................................................................................................................................................................................. 14

3.6.1 COM Express™ Connector ..................................................................................................................................................................... 14

3.6.2 Debug Header........................................................................................................................................................................................... 14

3.6.3 Debug Module LED ................................................................................................................................................................................. 14

3.7 COM Express™ Connector Pinout List................................................................................................................................................ 14

3.7.1 Signal Assignment Abbreviations....................................................................................................................................................... 14

3.7.2 COM Express™ Connector Pin Assignment...................................................................................................................................... 15

4. MECHANICS ............................................................................................................................................................................................... 23

4.1 TQMx50UC Dimensions ......................................................................................................................................................................... 23

4.2 Heat Spreader Dimensions ................................................................................................................................................................... 24

4.3 Mechanical and Thermal Aspects ....................................................................................................................................................... 24

4.4 Protection Against External Effects .................................................................................................................................................... 24

5. SOFTWARE.................................................................................................................................................................................................. 25

5.1 System Resources .................................................................................................................................................................................... 25

5.1.1 IC Bus.......................................................................................................................................................................................................... 25

5.1.2 SMBus .......................................................................................................................................................................................................... 25

5.1.3 Memory Map ............................................................................................................................................................................................. 25

5.1.4 IRQ Map....................................................................................................................................................................................................... 25

5.2 Operating Systems .................................................................................................................................................................................. 26

5.2.1 Supported Operating Systems............................................................................................................................................................. 26

5.2.2 Driver Download...................................................................................................................................................................................... 26

5.3 BIOS.............................................................................................................................................................................................................. 26

5.3.1 Enter BIOS Setup ...................................................................................................................................................................................... 26

5.4 Software Tools........................................................................................................................................................................................... 26

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 27

6.1 EMC............................................................................................................................................................................................................... 27

6.2 ESD................................................................................................................................................................................................................ 27

6.3 Shock & Vibration..................................................................................................................................................................................... 27

6.4 Operational Safety and Personal Security........................................................................................................................................ 27

6.5 Reliability and Service Life..................................................................................................................................................................... 27

7. ENVIRONMENT PROTECTION................................................................................................................................................................ 28

7.1 RoHS............................................................................................................................................................................................................. 28

7.2 WEEE®.......................................................................................................................................................................................................... 28

7.3 REACH®........................................................................................................................................................................................................ 28

7.4 EUP................................................................................................................................................................................................................ 28

7.5 Battery ......................................................................................................................................................................................................... 28

7.6 Packaging................................................................................................................................................................................................... 28

7.7 Other Entries.............................................................................................................................................................................................. 28

8. APPENDIX ................................................................................................................................................................................................... 29

8.1 Acronyms and Definitions..................................................................................................................................................................... 29

8.2 References.................................................................................................................................................................................................. 31

TABLE DIRECTORY

Table 1: Terms and Conventions.....................................................................................................................................................................2

Table 2: TQMx50UC Power Consumption....................................................................................................................................................7

Table 3: RTC Current Consumption................................................................................................................................................................7

Table 4: Processor Specifications....................................................................................................................................................................8

Table 5: Maximum Resolution in Dual Display Configuration ............................................................................................................... 9

Table 6: USB 3.0 COM Express™ Port Mapping........................................................................................................................................ 12

Table 7: Serial Port COM Express™ Port Mapping................................................................................................................................... 13

Table 8: LED boot messages.......................................................................................................................................................................... 14

Table 9: Signal Assignment Abbreviations ............................................................................................................................................... 14

Table 10: COM Express™ Connector Pin Assignment .............................................................................................................................. 15

Table 11: IC address mapping COM Express™ IC port........................................................................................................................... 25

Table 12: IC address mapping COM Express™ SMBus port................................................................................................................... 25

Table 13: Acronyms ............................................................................................................................................................................................ 29

Table 14: Further Applicable Documents and Links................................................................................................................................. 31

ILLUSTRATION DIRECTORY

Illustration 1: Block Diagram TQMx50UC................................................................................................................................................................6

Illustration 2: Three view drawing TQMx50UC .................................................................................................................................................. 23

Illustration 3: Bottom view drawing TQMx50UC............................................................................................................................................... 23

Illustration 4: Standard Heat Spreader “TQMx50UC-HSP”.............................................................................................................................. 24

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 2015-12-16 FP First edition

0101 2017-07-04 FP

All

3.5.1, 3.5.2

3.7.2

6.5.2

Typo Information clarified Errors corrected Updated

0102 2018-09-26 FP

2.1

3.4.4.3

3.5.1, 3.5.2 7

“Memory”: Type of EEPROM corrected “Peripheral interfaces”: PCIe lane assignment clarified; Size and type of EEPROM corrected PCIe lane assignment clarified Reworked

1. ABOUT THIS MANUAL

1.1 Copyright and License Expenses

machine readable, or in any other form without the written consent of TQ-Systems GmbH. The drivers and utilities for the components used as well as the BIOS are subject to copyrights of the respective manufacturers.

The licence conditions of the respective manufacturer are to be adhered to. BIOS-licence expenses are paid by TQ-Systems GmbH and are included in the price. Licence expenses for the operating system and applications are not taken into consideration and have to be calculated /

declared separately.

1.2 Registered Trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original or license-free graphics and texts.

All brand names and trademarks mentioned in the publication, including those protected by a third party, unless specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in the User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without special notification.

1.4 Imprint

TQ-Systems GmbH Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0 Fax: +49 8153 9308–4223 Email:

info@tq-group.com

Web:

TQ-Group

1.5 Service and Support

Please visit our website TQ-Group for latest product documentation, drivers, utilities and technical support. You can register on our website

TQ-Group to have access to restricted information and automatic update services.

For direct technical support you can contact our FAE team by email:

TQ-Support.

Our FAE team can also support you with additional information like 3D-STEP files and confidential information, which is not provided on our public website.

For service/RMA, please contact our service team by email (

TQ-Service) or your sales team at TQ-Systems GmbH.

1.6 Tips on Safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.7 Symbols and Typographic Conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These components are often damaged / destroyed by the transmission of a voltage higher than about 50 V. A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V. Please note the relevant statutory regulations in this regard. Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.8 Handling and ESD Tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMx50UC and be dangerous to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD). Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings, or connect other devices.

1.9 Naming of Signals

A hash mark (#) at the end of the signal name indicates a low-active signal. Example: RESET# If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked

with a hash mark and shown at the end. Example: C / D# If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring. The identification of the individual functions follows the above conventions. Example: WE2# / OE#

1.10 Further Applicable Documents / Presumed Knowledge

• Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used.

• Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of. They contain, if applicable, additional information that must be taken note of for safe and reliable operation. These documents are stored at TQ-Systems GmbH.

• Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of. The manufacturer’s advice should be followed.

• Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

• General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

Implementation information for the carrier board design is provided in the COM Express™ Design Guide (5) maintained by the PICMG®. This Carrier Design Guide includes a very good guideline to design a COM Express™ carrier board.

It includes detailed information with schematics and detailed layout guidelines. Further information can be found in the official PICMG® documentation (4).

2. INTRODUCTION

Based on the internationally established PICMG® standard COM Express™ (COM.0 R2.1), Compact, the TQMx50UC enables the design of not only powerful but also economical x86 based systems. The user has access to all essential interfaces of the CPU at the Type 6 compliant pin out connector. Hence all features of the 5th Generation Intel® Core™ processor can be used. The direct access to all interfaces gives the user the freedom to use the features of the CPU in the most suitable way for his application.

The compact and robust design as well as the option of conformal coating extends the use cases to applications within rugged industry, railway and aviation environments. Based on the very low-power consumption and the extended temperature support it is also possible to realize outdoor applications in an easy and reliable way.

2.1 Functional Overview

The following key functions are implemented on the TQMx50UC:

Processor:

• 5th Generation Intel

Core™ 5000U series (“Broadwell-U”)

• Intel

Core™ i7-5650U: 2 × 2.2 GHz / 3.2 GHz Turbo, 4 MB Cache, HD6000

• Intel

Core™ i5-5350U: 2 × 1.8 GHz / 2.9 GHz Turbo, 3 MB Cache, HD6000

• Intel

Core™ i3-5010U: 2 × 2.1 GHz, 3 MB Cache, HD5500

• Intel

Celeron® 3765U: 2 × 1.7 GHz, 2 MB Cache, HD

• Hyper-Threading and Virtualization support

• 15 W TDP max. (configurable down to 9.5 / 10 W)

Memory:

• DDR3L-1600 dual channel: 4 Gbyte and 8 Gbyte memory down configuration

• EEPROM: 32 kbit (24AA32)

Graphics:

• Three independent display outputs:

• 2 × Digital Display Interface / DP++ with up to 4K; DisplayPort 1.2a with support for Multi-Stream Transport (MST)

• LVDS Interface (18/24 bit, single/dual channel); optional eDP 1.3 with 4 lanes

System interfaces:

• 1 × Gigabit Ethernet (Intel

i218)

• 2 × USB 3.0 (with USB 2.0 backward compatibility)

• 8 × USB 2.0 (incl. USB 3.0 ports)

Peripheral interfaces:

• 4 × SATA Gen3 (up to 6 Gb/s)

• 4 × PCIe 2.0 (×1) (up to 5 Gb/s), (4 (×1), 2 (×2) or 1 (×4))

• 4 × PCIe 2.0 PEG port (×1) (up to 5 Gb/s), (+1 additional PCIe 2.0 PEG port (×1), if no Ethernet)

• 1 × LPC bus

• 1 × Intel

HD audio (HDA)

• 1 × IC, (2

IC optional) (master/slave capable)

• 1 × SMBus

• 1 × SPI (for external uEFI BIOS flash)

• 2 × Serial port (Rx/Tx, legacy compatible), 4-wire optional through TQ-flexiCFG

• 8 × GPIO through TQ-flexiCFG

Security components:

• TPM (SLB9660 TPM 1.2, alternatively SLB9665 TPM 2.0)

Others:

• TQMx86 board controller with Watchdog and TQ-flexiCFG

• Industrial real time clock (iRTC) (option)

• Hardware monitor

Power supply:

• Voltage: 8.5 V to 20 V, 5 V Standby (optional)

3 V Battery for RTC (GoldCap option with iRTC)

Environment:

• Standard Temperature: 0 °C to +60 °C

• Extended temperature: –40 °C to +85 °C (on request)

Form factor / dimensions:

• COM Express™ Compact, Type 6, 95 × 95 mm

2.2 Specification Compliance

The TQMx50UC is compliant to the PICMG® COM Express™ Module Base Specification (COM.0 R2.1) Compact, Type 6, 95 × 95 mm.

2.3 Versions

The TQMx50UC is available in several standard configurations.

• TQMx50UC-AC ("Premium")

Intel® Core™ i7-5650U (2 × 2.2 GHz / 3.2 GHz Turbo, 4 MB Cache, HD6000 Gfx), 8GB DDR3L-1600, TPM, Standard-Temp. 0 to +60 °C

• TQMx50UC-AB ("Mainstream")

Intel® Core™ i5-5350U (2 × 1.8 GHz / 2.9 GHz Turbo, 3 MB Cache, HD6000 Gfx), 4GB DDR3L-1600, TPM, Standard-Temp. 0 to +60 °C

• TQMx50UC-AA ("Entry Level")

Intel® Core™ i3-5010U (2 × 2.1 GHz, 3 MB Cache, HD5500 Gfx), 4GB DDR3L-1600, Standard-Temp. 0 to +60 °C

• TQMx50UC-AD ("Basic")

Intel® Celeron® 3765U (2 × 1.7 GHz, 2 MB Cache, HD Gfx), 4GB DDR3L-1600, Standard-Temp. 0 to +60 °C

Please visit to

TQ-Group/TQMx50UC for a complete list of standard versions.

Other configurations are available on request.

Standard configuration features are:

• CPU version

• Memory configuration

• TPM

• Temperature range

Optional hardware and software configuration features:

• Conformal coating can be offered as a customer specific add-on

• Custom specific GPIO configuration through TQ-flexiCFG

• 4 (×1) PCIe lanes on PCI Express PEG port

• LVDS / eDP configuration

• iRTC

• Custom specific BIOS configuration

For further information regarding other versions, please contact TQ-Support.

2.4 Accessories

• TQMx50UC-HSP (TQMx50UC-HSP-11-M-5083-BL)

Heat spreader for TQMx50UC according to the COM Express™ specification.

• Evaluation platform MB-COME6-1

Mainboard for COM Express™ Compact Modules, Type 6. Interfaces: 2 × DP, LVDS, 2 × Gbit Ethernet, 4 × USB, 3 × COM, audio, mini PCIe, mSATA, 2.5” SSD, SD card, riser extension with PCIe and USB, fan, debug. Dimensions: 170 × 170 mm.

3. FUNCTIONAL SPECIFICATION

3.1 Block Diagram

The following illustration shows the block diagram of the TQMx50UC.

Illustration 1: Block Diagram TQMx50UC

3.2 Electrical Specification

3.2.1 Supply Voltage Characteristics

The TQMx50UC supports a wide-range voltage input from 8.5 V to 20 V.

The following supply voltages are specified at the COM Express™ connector:

Wide input: 8.5 V to 20 V maximum input ripple: ±100 mV VCC_5V_SBY: 4.75 V to 5.25 V maximum input ripple: ±50 mV VCC_RTC: 2.0 V to 3.3 V maximum input ripple: ±20 mV

The input voltages shall rise from 10 % of nominal to 90 % of nominal within 0.1 ms to 20 ms (0.1 ms ≤ Rise Time ≤ 20 ms). There must be a smooth and continuous increase of each DC output voltage from 10 % to 90 % of its final set point within the

regulation range.

Note: Power source

For single supply operations, the 5 V Standby voltage is not required. VCC_5V_SBY can be left open.

3.2.2 Power Consumption Specification

The power consumption values below show the voltage and power specifications of the TQMx50UC. The values were measured with two power supplies; one for the TQMx50UC and the other one for the MB-COME6-1 COM

Express™ carrier board. The power consumption of each TQMx50UC was measured under Windows® 7, 64-bit.

All measurements were done at a temperature of +25 °C. The power consumption of the TQMx50UC depends on the application, the mode of operation and the operating system. The power consumption was measured under the following test modes:

• Windows

7, 64-bit, idle state:

Desktop idle state, Ethernet port is disconnected.

• Windows

7, 64-bit, maximum workload (cTDP down mode enabled) These values show the maximum cTDP down power consumption using the Intel® stress test tool to stress the processor and graphic engine. Ethernet port is connected (1,000 Mbps Speed).

• Windows

7, 64-bit, maximum workload: These values show the maximum worst case power consumption using the Intel® stress test tool to stress the processor and graphic engine. Ethernet port is connected (1,000 Mbps Speed).

• Suspend mode:

The system is in S5/S4 state, Ethernet port is disconnected.

• Green ECO-Off state:

The system is in Green ECO-Off state, all DC/DC power supplies on the TQMx50UC are switched off.

The following table shows the power consumption with different processor configurations.

Table 2: TQMx50UC Power Consumption

Mode

Standby 5 V Wide input 12 V

TQMx50UC

Green ECO-Off state Suspend

Win7, 64 bit

idle

Win7, 64 bit

cTDP down

max. load

Win7, 64 bit

max. load

i7-5650U with 4 / 8 Gbyte DDR3L (TQMx50UC-AC) 4.0 mW 190.0 mW 3.5 W 11.4 W 16.5 W

i5-5350U with 4 / 8 Gbyte DDR3L (TQMx50UC-AB) 4.0 mW 190.0 mW 3.5 W 11.4 W 16.5 W

i3-5010U with 4 / 8 Gbyte DDR3L (TQMx50UC-AA) 4.0 mW 190.0 mW 3.6 W 11.8 W 16.3 W

Celeron 3765U with 4 / 8 Gbyte DDR3L (TQMx50UC-AD) 4.0 mW 190.0 mW 3.6 W 11.9 W 16.3 W

Note: Power requirement

The power supplies on the carrier board for the TQMx50UC must be designed with enough reserve. The carrier board should be able to provide at least twice the maximum workload power of the TQMx50UC. The TQMx50UC supports several low-power states. The power supply of the carrier board has to be stable even with no load.

3.2.3 Real Time Clock Current Specification

The RTC (VCC_RTC) current consumption is shown below. The values were measured at +25 °C under battery operating conditions.

Table 3: RTC Current Consumption

Mode Voltage Current

5th Generation Intel® Core™ 5000U series integrated RTC 3.0 V 3 µA

With iRTC option 3.0 V 300 nA

The current consumption of the RTC in the 5th Generation Intel® Core™ 5000U series processor Product Family Datasheet is specified with 6 µA in average, but the values measured on several TQMx50UC were lower.

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