TQ TQMa6x, TQMa6xP User Manual

TQMa6x & TQMa6xP User's Manual

TQMa6x & TQMa6xP UM 0401

21.10.2018

TABLE OF CONTENTS

1. ABOUT THIS MANUAL ........................................................................................................................................................................ 1

1.1 Copyright and license expenses .....................................................................................................................................................1

1.2 Registered trademarks.......................................................................................................................................................................1

1.3 Disclaimer ..............................................................................................................................................................................................1

1.4 Imprint ....................................................................................................................................................................................................1

1.5 Tips on safety ........................................................................................................................................................................................2

1.6 Symbols and typographic conventions........................................................................................................................................2

1.7 Handling and ESD tips........................................................................................................................................................................2

1.8 Naming of signals................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge..........................................................................................................3

2. BRIEF DESCRIPTION.............................................................................................................................................................................4

2.1 Key functions and characteristics...................................................................................................................................................4

3. ELECTRONICS........................................................................................................................................................................................4

3.1 System overview..................................................................................................................................................................................4

3.1.1 System architecture / block diagram.............................................................................................................................................4

3.1.2 Functionality .........................................................................................................................................................................................5

3.2 System components...........................................................................................................................................................................6

3.2.1 i.MX6........................................................................................................................................................................................................6

3.2.1.1 i.MX6 derivatives..................................................................................................................................................................................6

3.2.1.2 eFUSEs.....................................................................................................................................................................................................6

3.2.1.3 i.MX6 errata............................................................................................................................................................................................6

3.2.1.4 Boot modes ...........................................................................................................................................................................................7

3.2.1.5 Boot configuration..............................................................................................................................................................................8

3.2.1.6 Boot interfaces......................................................................................................................................................................................9

3.2.1.7 Boot device eMMC ..............................................................................................................................................................................9

3.2.1.8 Boot device SPI NOR flash.............................................................................................................................................................. 10

3.2.1.9 Boot device SD card......................................................................................................................................................................... 11

3.2.2 Memory................................................................................................................................................................................................ 12

3.2.2.1 DDR3L SDRAM................................................................................................................................................................................... 12

3.2.2.2 eMMC NAND flash............................................................................................................................................................................ 13

3.2.2.3 SPI NOR flash...................................................................................................................................................................................... 13

3.2.2.4 EEPROM ............................................................................................................................................................................................... 14

3.2.3 RTC ........................................................................................................................................................................................................ 15

3.2.4 Temperature sensor......................................................................................................................................................................... 15

3.2.5 Interfaces............................................................................................................................................................................................. 16

3.2.5.1 Overview ............................................................................................................................................................................................. 16

3.2.5.2 AUDMUX ............................................................................................................................................................................................. 17

3.2.5.3 CCM....................................................................................................................................................................................................... 17

3.2.5.4 ECSPI..................................................................................................................................................................................................... 17

3.2.5.5 ENET...................................................................................................................................................................................................... 18

3.2.5.6 FLEXCAN.............................................................................................................................................................................................. 20

3.2.5.7 GPIO...................................................................................................................................................................................................... 20

3.2.5.8 HDMI..................................................................................................................................................................................................... 21

3.2.5.9 I2C........................................................................................................................................................................................................... 21

3.2.5.10 I2C / ENET-Patch Variants................................................................................................................................................................ 22

3.2.5.11 IPU ......................................................................................................................................................................................................... 23

3.2.5.12 LDB........................................................................................................................................................................................................ 24

3.2.5.13 MIPI_CSI............................................................................................................................................................................................... 25

3.2.5.14 MIPI_DSI............................................................................................................................................................................................... 25

3.2.5.15 MLB ...................................................................................................................................................................................................... 25

3.2.5.16 PCIe ....................................................................................................................................................................................................... 26

3.2.5.17 PWM...................................................................................................................................................................................................... 26

3.2.5.18 SATA...................................................................................................................................................................................................... 26

3.2.5.19 SJC......................................................................................................................................................................................................... 27

3.2.5.20 S/PDIF................................................................................................................................................................................................... 27

3.2.5.21 Tamper................................................................................................................................................................................................. 27

3.2.5.22 UART..................................................................................................................................................................................................... 28

3.2.5.23 USB........................................................................................................................................................................................................ 29

3.2.5.24 uSDHC.................................................................................................................................................................................................. 29

3.2.5.25 Watchdog............................................................................................................................................................................................ 30

3.2.5.26 XTAL...................................................................................................................................................................................................... 30

TABLE OF CONTENTS (continued)

3.2.6 Reset ..................................................................................................................................................................................................... 31

3.2.7 Power supply ..................................................................................................................................................................................... 32

3.2.7.1 Overview TQMa6x power supply................................................................................................................................................. 32

3.2.7.2 Voltage monitoring VCC5V............................................................................................................................................................ 33

3.2.7.3 Power consumption TQMa6x ....................................................................................................................................................... 34

3.2.7.4 Power-Up sequence TQMa6x / carrier board........................................................................................................................... 35

3.3 TQMa6x interface.............................................................................................................................................................................. 35

3.3.1 Pin multiplexing................................................................................................................................................................................ 35

3.3.2 Pinout connector X1........................................................................................................................................................................ 36

3.3.3 Pinout connector X2........................................................................................................................................................................ 38

3.3.4 Pinout connector X3........................................................................................................................................................................ 40

4. MECHANICS........................................................................................................................................................................................ 41

4.1 Connectors ......................................................................................................................................................................................... 41

4.2 Dimensions......................................................................................................................................................................................... 41

4.3 Component placement .................................................................................................................................................................. 43

4.4 Adaptation to the environment................................................................................................................................................... 44

4.5 Protection against external effects ............................................................................................................................................. 44

4.6 Thermal management .................................................................................................................................................................... 44

4.7 Structural requirements ................................................................................................................................................................. 44

4.8 Notes of treatment........................................................................................................................................................................... 44

5. SOFTWARE.......................................................................................................................................................................................... 45

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ................................................................................................. 45

6.1 EMC....................................................................................................................................................................................................... 45

6.2 ESD........................................................................................................................................................................................................ 45

6.3 Operational safety and personal security ................................................................................................................................. 45

6.4 Climatic and operational conditions .......................................................................................................................................... 46

6.5 Reliability and service life............................................................................................................................................................... 46

6.6 Environmental protection.............................................................................................................................................................. 47

6.6.1 RoHS ..................................................................................................................................................................................................... 47

6.6.2 WEEE®................................................................................................................................................................................................... 47

6.6.3 REACH®................................................................................................................................................................................................ 47

6.6.4 EuP......................................................................................................................................................................................................... 47

6.6.5 Battery.................................................................................................................................................................................................. 47

6.6.6 Packaging............................................................................................................................................................................................ 47

6.6.7 Other entries ...................................................................................................................................................................................... 47

7. APPENDIX............................................................................................................................................................................................ 48

7.1 Acronyms and definitions.............................................................................................................................................................. 48

7.2 References........................................................................................................................................................................................... 50

TABLE DIRECTORY

Table 1: Terms and Conventions .............................................................................................................................................................2

Table 2: Processor derivatives .................................................................................................................................................................. 6

Table 3: Boot modes and BT_FUSE_SEL................................................................................................................................................7

Table 4: General boot settings ................................................................................................................................................................. 8

Table 5: Boot configuration eMMC at uSDHC3...................................................................................................................................9

Table 6: uSDHC3 eMMC modes ...............................................................................................................................................................9

Table 7: Boot configuration SPI NOR flash at eCSPI1...................................................................................................................... 10

Table 8: Boot configuration SD card at uSDHC2.............................................................................................................................. 11

Table 9: uSDHC2 SD card modes.......................................................................................................................................................... 11

Table 10: i.MX6 SDRAM interface according to i.MX6 derivative.................................................................................................. 12

Table 11: DDR3L SDRAM memory size options.................................................................................................................................. 12

Table 12: DDR3L SDRAM address range............................................................................................................................................... 12

Table 13: SPI NOR flash assembly options ........................................................................................................................................... 13

Table 14: EEPROM, component............................................................................................................................................................... 14

Table 15: EEPROM, TQMa6x-specific data............................................................................................................................................ 14

Table 16: Current consumption RTC at pin LICELL............................................................................................................................ 15

Table 17: Temperature sensor ................................................................................................................................................................. 15

Table 18: Internally used interfaces........................................................................................................................................................ 16

Table 19: Externally available interfaces............................................................................................................................................... 16

Table 20: Signals AUD3 .............................................................................................................................................................................. 17

Table 21: Signals CCM ................................................................................................................................................................................ 17

Table 22: Signals ECSPI1, ECSPI5............................................................................................................................................................. 17

Table 23: Signals RGMII.............................................................................................................................................................................. 18

Table 24: ENET-Patch variants.................................................................................................................................................................. 19

Table 25: Signals FLEXCAN........................................................................................................................................................................ 20

Table 26: Signals GPIO................................................................................................................................................................................ 20

Table 27: Signals HDMI............................................................................................................................................................................... 21

Table 28: Signals I2C .................................................................................................................................................................................... 21

Table 29: I2C address assignment ........................................................................................................................................................... 21

Table 30: Signals parallel display DISP0................................................................................................................................................ 23

Table 31: Signals LVDS0, LVDS1 .............................................................................................................................................................. 24

Table 32: Signals MIPI_CSI......................................................................................................................................................................... 25

Table 33: Signals MIPI_DSI ........................................................................................................................................................................ 25

Table 34: Signals MLB................................................................................................................................................................................. 25

Table 35: Signals PCIe................................................................................................................................................................................. 26

Table 36: Signals PWM ............................................................................................................................................................................... 26

Table 37: Signals SATA ............................................................................................................................................................................... 26

Table 38: JTAG modes ................................................................................................................................................................................ 27

Table 39: Signals JTAG................................................................................................................................................................................ 27

Table 40: Signals S/PDIF............................................................................................................................................................................. 27

Table 41: Signal TAMPER ........................................................................................................................................................................... 27

Table 42: Signals UARTs............................................................................................................................................................................. 28

Table 43: Signals USB_H1.......................................................................................................................................................................... 29

Table 44: Signals USB_OTG....................................................................................................................................................................... 29

Table 45: Signals uSDHC2 ......................................................................................................................................................................... 29

Table 46: Signal WDOG .............................................................................................................................................................................. 30

Table 47: Signals XTAL................................................................................................................................................................................ 30

Table 48: Reset signals................................................................................................................................................................................ 31

Table 49: Power consumption TQMa6x................................................................................................................................................ 34

Table 50: Pinout connector X1................................................................................................................................................................. 36

Table 51: Pinout connector X2................................................................................................................................................................. 38

Table 52: Pinout connector X3................................................................................................................................................................. 40

Table 53: Pinout differences TQMa6x revision 02xx and TQMa6x revision 04xx ..................................................................... 40

Table 54: TQMa6x, connectors................................................................................................................................................................. 41

Table 55: Carrier board mating connectors......................................................................................................................................... 41

Table 56: TQMa6x, heights ....................................................................................................................................................................... 41

Table 57: Labels on TQMa6x..................................................................................................................................................................... 43

Table 58: Climate and operational conditions extended temperature range –25 °C to +85 °C.......................................... 46

Table 59: Climate and operational conditions industrial temperature range –40 °C to +85 °C .......................................... 46

Table 60: Acronyms..................................................................................................................................................................................... 48

Table 61: Further applicable documents.............................................................................................................................................. 50

ILLUSTRATION DIRECTORY

Illustration 1: Block diagram TQMa6x............................................................................................................................................................... 4

Illustration 2: Block diagram i.MX6....................................................................................................................................................................6

Illustration 3: Block diagram DDR3L SDRAM connection........................................................................................................................ 12

Illustration 4: Block diagram eMMC NAND flash connection................................................................................................................. 13

Illustration 5: Block diagram SPI NOR flash connection........................................................................................................................... 13

Illustration 6: Block diagram EEPROM interface......................................................................................................................................... 14

Illustration 7: Block diagram RTC.................................................................................................................................................................... 15

Illustration 8: Block diagram temperature sensor interface................................................................................................................... 15

Illustration 9: ENET-Patch Variant “A”............................................................................................................................................................ 22

Illustration 10: ENET-Patch Variant “B” ............................................................................................................................................................ 22

Illustration 11: ENET-Patch Variant “C”............................................................................................................................................................ 22

Illustration 12: Block diagram UART interfaces............................................................................................................................................. 28

Illustration 13: Block diagram Reset................................................................................................................................................................. 31

Illustration 14: Block diagram power supply................................................................................................................................................. 32

Illustration 15: Block diagram PMIC signals ................................................................................................................................................... 32

Illustration 16: Block diagram VCC5V monitoring ....................................................................................................................................... 33

Illustration 17: Block diagram power supply carrier board....................................................................................................................... 35

Illustration 18: TQMa6x dimensions, side view............................................................................................................................................. 41

Illustration 19: TQMa6x dimensions, top view.............................................................................................................................................. 42

Illustration 20: TQMa6x dimensions, top view through TQMa6x ........................................................................................................ 42

Illustration 21: TQMa6x, component placement top.................................................................................................................................. 43

Illustration 22: TQMa6x, component placement bottom.......................................................................................................................... 43

REVISION HISTORY

Rev. Date Name Pos. Modification

0203 10.02.2018 Petz Initial document

0400 19.04.2018 Petz All Complete rework, DualPlus and QuadPlus CPUs added

0401 21.10.2018 Petz

All Table 10

3.2.7.4

3.2.5.23, 6.5, Illustration 22 Table 58, Table 59

Formatting, links updated, Clocks corrected Warning updated Updated “Package temperature” replaced with “Case temperature” Case temperature DDR3L SDRAM changed to +95 °C

1. ABOUT THIS MANUAL

1.1 Copyright and license expenses

in electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH. The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to. Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price. Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2 Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without special notification.

Important Notice:

Before using the Starterkit MBa6x or parts of the schematics of the MBa6x, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the usage of the Starterkit MBa6x or schematics used, regardless of the legal theory asserted.

1.4 Imprint

TQ-Systems GmbH Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0 Fax: +49 8153 9308–4223 E-Mail: Web:

Info@TQ-Group TQ-Group

1.5 Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6 Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These components are often damaged / destroyed by the transmission of a voltage higher than about 50 V. A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V. Please note the relevant statutory regulations in this regard. Non-compliance with these regulations can lead to serious damage to your health and may damage

or destroy the component.

This symbol indicates a possible source of danger. Ignoring the instructions described can cause health damage, or damage the hardware.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.7 Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations.

A general rule is not to touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMa6x and be dangerous to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD). Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings, or connect other devices.

1.8 Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal. Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring. The identification of the individual functions follows the above conventions. Example: WE2# / OE#

1.9 Further applicable documents / presumed knowledge

• Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

• Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of. They contain, if applicable, additional information that must be taken note of for safe and reliable operation. These documents are stored at TQ-Systems GmbH.

• Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of. The manufacturer’s advice should be followed.

• Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

• General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

• MBa6x circuit diagram

• MBa6x User's Manual

• i.MX6 Data Sheets

• i.MX6 Reference Manuals

• U-Boot documentation:

www.denx.de/wiki/U-Boot/Documentation

• PTXdist documentation: www.ptxdist.de

• TQ-Support Wiki:

support.tq-group.com/doku.php?id=en:arm:tqma6x

2. BRIEF DESCRIPTION

This User's Manual describes the hardware of the TQMa6x revision 04xx, and refers to some software settings. A certain derivative of the TQMa6x does not necessarily provide all features described in this User's Manual. Functional differences between Dual/Quad and DualPlus/QuadPlus are referred to in the relevant passages. This User's Manual does also not replace the NXP i.MX6 Reference Manuals (4), (5), and (6). The TQMa6x is a universal Minimodule based on the NXP ARM CPU MCIMX6 (i.MX6). The Cortex™ A9 core of this i.MX6 is typically clocked with 800 MHz. The TQMa6x extends the TQC product range and offers an outstanding computing performance. A suitable i.MX6 derivative (Single, Dual, Quad core) can be chosen for each requirement.

2.1 Key functions and characteristics

The TQMa6x provides the following key functions and characteristics:

• NXP i.MX6 (Solo, DualLite, Dual, Quad, DualPlus, QuadPlus)

• Up to 2 Gbyte DDR3L SDRAM, 64 bit interface (except “Solo”: 32 bit interface)

• Up to 8 Gbyte eMMC NAND flash

• Up to 128 Mbyte SPI NOR flash

• 64 kbit EEPROM

• Temperature sensor

• NXP PMIC (Power Management Integrated Circuit)

• Extended temperature range

• Single 5 V power supply

• Hardware is backward compatible with TQMa6x revision 02xx

All essential i.MX6 pins are routed to the connectors. There are therefore no restrictions for customers using the TQMa6x with respect to an integrated customised design.

3. ELECTRONICS

The information provided in this User's Manual is only valid in connection with the tailored boot loader, which is preinstalled on the TQMa6x, and the

3.1 System overview

3.1.1 System architecture / block diagram

BSP provided by TQ-Systems GmbH, see also chapter 5.

Illustration 1: Block diagram TQMa6x

1: It is not possible to boot from an SPI NOR flash bigger than 16 Mbyte.

3.1.2 Functionality

The following key functions are implemented on the TQMa6x:

• i.MX6 CPU

• DDR3L SDRAM

• eMMC NAND flash

• SPI NOR flash

• EEPROM

• Temperature sensor

• Supervisor

• PMIC / DC/DC converter

The following interfaces are provided at the connectors of the TQMa6x: 2

• 1 × Ethernet 10/100/1000 RGMII

• 1 × HDMI 1.4

• 1 × I

• 1 × JTAG

• 1 × MIPI CSI

• 1 × MIPI DSI

• 1 × MLB

• 1 × Parallel display RGB 24 bit

• 1 × PCIe 2.0 (1 Lane)

• 1 × SATA 3.0

• 1 × SD 8 Bit (SDIO / MMC / SD card)

• 1 × S/PDIF

• 2 × CAN

• 2 × General Purpose Clocks

• 2 × I

• 2 × LVDS display

• 2 × SPI

• 2 × USB 2.0 Hi-Speed (1 × USB Host, 1 × USB-OTG)

• 40 × GPIO

• 4 × PWM

• 4 × UART (with Handshake)

Further interfaces of the i.MX6 are also available as an alternative to the mentioned factory configuration, by adapting the pin configuration. These are amongst other:

• Camera Sensor Interfaces

• EIM bus

• Enhanced Periodic Interrupt Timer EPIT

• Enhanced Serial Audio Interface ESAI

• Ethernet 10/100 RMII

• General Purpose Media Interface GPMI

• General Purpose Timer GPT

• Keypad port

• MIPI HSI Host Controller

• More audio interfaces

• More I

C interfaces

• More SPI interfaces

• More UARTs

• One additional parallel display

2: Quantity of interfaces depends on the i.MX6 derivative.

3.2 System components

3.2.1 i.MX6

The following block diagram shows the main features of the i.MX6 processor family.

Illustration 2: Block diagram i.MX6 (Source:

NXP)

3.2.1.1 i.MX6 derivatives

Depending on the TQMa6x derivative, one of the following i.MX6 derivatives is assembled:

Table 2: Processor derivatives

Description Clock Temperature range TQ-BSP

i.MX6S Solo Industrial 800 MHz –40 °C to +105 °C Yes

i.MX6U DualLite Industrial 800 MHz –40 °C to +105 °C Yes

i.MX6D Dual Industrial 800 MHz –40 °C to +105 °C Yes

i.MX6Q Quad Industrial 800 MHz –40 °C to +105 °C Yes

i.MX6DP DualPlus Industrial 800 MHz –40 °C to +105 °C Yes

i.MX6QP QuadPlus Industrial 800 MHz –40 °C to +105 °C Yes

3.2.1.2 eFUSEs

The eFUSEs in the i.MX6 are available for the user, except for the MAC address eFUSEs. TQMa6x modules are delivered pre-programmed with MAC addresses from the TQ-Systems MAC address pool. The MAC addresses are burned in the designated OCOTP eFUSEs (bank 4, word 2, 3). The MAC address LOCK-FUSE WP (Write Protect) is burnt, which permits to temporarily overwrite the MAC address for test purposes. If this is not desired, the MAC address LOCK-FUSE OP (Overwrite Protect) can be burned by the user.

3.2.1.3 i.MX6 errata

Attention: Malfunction

Please take note of the current i.MX6 errata (7), (8).

3.2.1.4 Boot modes

The i.MX6 contains a ROM with integrated boot loader. After power-up, the boot code initializes the hardware and then loads the program image from the selected boot device. The eMMC or the SPI NOR flash integrated on the TQMa6x can for example be selected as the standard boot device. More boot interfaces are available as an alternative to booting from the integrated eMMC or the SPI NOR flash, see 3.2.1.6. More information about boot interfaces and its configuration is to be taken from the i.MX6 data sheets (1), (2), and (3) as well as

the i.MX6 Reference Manuals (4), (5), and (6). The boot device and its configuration, as well as different i.MX6 settings have to be set via different boot mode registers. Therefore, the i.MX6 provides two possibilities:

• Burning internal eFuses

• Reading dedicated GPIO pins

The exact behaviour during booting depends on the value of the register BT_FUSE_SEL. The following table shows the behaviour of the bit BT_FUSE_SEL in dependence of the selected boot mode.

Table 3: Boot modes and BT_FUSE_SEL

BOOT_MODE[1:0] Boot type

00 (default) Boot from eFuses

01 Serial Downloader n/a

10 Internal Boot

BT_FUSE_SEL = 0: Boot using Serial Loader (default) BT_FUSE_SEL = 1: Boot configuration is taken from eFuses

BT_FUSE_SEL = 0: Boot configuration is taken from BOOT_CFG pins (default) BT_FUSE_SEL = 1: Boot configuration is taken from eFuses

BT_FUSE_SEL

Usage

Series production

Development / production

Development

11 Reserved n/a n/a

Attention: Malfunction

Burning an eFuse is irreversible! TQ-Systems GmbH takes no responsibility for the correct operation of the TQMa6x,

if the user burns eFuses.

Attention: Boot configuration

It is recommended to implement a redundant update concept for field software updates during the carrier board design.

3.2.1.5 Boot configuration

Note: Boot configuration

No boot device is preset when the TQMa6x is delivered.

Some general settings are done with some eFuses independent from the boot device.

Table 4: General boot settings

i.MX6 TQMa6x

eFuse Option Setting 3 Signal Pin

BOOT_CFG1[7:0]

BOOT_CFG2[7:0]

BOOT_CFG3[7]

BOOT_CFG3[6]

BOOT_CFG3[5] 0 BOOT_CFG3_5 X2-99

BOOT_CFG3[4]

BOOT_CFG3[3] Reserved 0 BOOT_CFG3_3 X2-101

BOOT_CFG3[2]

Boot configuration 1:

Specific to selected boot mode

Boot configuration 2:

Specific to selected boot mode

L1 I-Cache DISABLE:

0 = Enabled

1 = Disabled

BT_MMU_DISABLE:

0 = MMU / L1 D Cache / PL310 enabled

1 = MMU / L1 D Cache / PL310 disabled

DDR Memory Map Config:

00 = Single DDR channel

01 = 2 × 32 Map 10 = 4 KB interleaving 11 = Reserved (Solo / DualLite / Dual / Quad) 11 = Extension Mode (DualPlus / QuadPlus) (see BOOT_CFG3[1:0])

Boot Frequencies ARM / DDR / AXI: Solo / DualLite:

0 = 792 / 396 / 264 MHz

1 = 396 / 352 / 176 MHz

Dual / Quad / DualPlus / QuadPlus:

0 = 792 / 528 / 264 MHz

1 = 396 / 352 / 176 MHz

– BOOT_CFG1_7:0 –

– BOOT_CFG2_7:0 –

0 BOOT_CFG3_7 X2-97

0 BOOT_CFG3_6 X2-98

0 BOOT_CFG3_4 X2-100

0 BOOT_CFG3_2 X2-102

BOOT_CFG3[1] 0 BOOT_CFG3_1 X2-103

BOOT_CFG3[0]

BOOT_CFG4[7]

BOOT_CFG4[6:0]

DDR Memory Map Extension Config: 4

00 = Single DDR Channel

01 = Fixed 2 × 32 Map 10 = Reserved 11 = Reserved

Debug loop:

0 = Loop disabled

1 = Loop enabled

Boot configuration 4:

Specific to selected boot mode

0 BOOT_CFG3_0 X2-104

0 BOOT_CFG4_7 X2-85

– BOOT_CFG4_6:0 –

3: Voltage level or condition of eFuse. 4: Reserved for Solo, DualLite, Dual, Quad, or if BOOT_CFG3[5:4] is not 0b11.

3.2.1.6 Boot interfaces

In the next chapters, the configuration of the following boot devices is described:

• eMMC

• SPI NOR flash

• SD card

3.2.1.7 Boot device eMMC

Table 5: Boot configuration eMMC at uSDHC3

i.MX6 TQMa6x

eFuse Option Setting 6 Signal Pin

BOOT_CFG1[7] 0 BOOT_CFG1_7 X2-115

BOOT_CFG1[6]

BOOT_CFG1[5]

BOOT_CFG1[4]

BOOT_CFG1[3] 0 BOOT_CFG1_3 X2-119

BOOT_CFG1[2]

BOOT_CFG1[1]

BOOT_CFG2[7] 0 BOOT_CFG2_7 X2-107

BOOT_CFG2[6] 1 BOOT_CFG2_6 X2-108

BOOT_CFG2[5]

BOOT_CFG2[4] 1 BOOT_CFG2_4 X2-110

BOOT_CFG2[3]

BOOT_CFG2[2]

BOOT_CFG2[1]

BOOT_CFG2[0]

Boot Device Selection:

01 = Boot from uSDHC Interfaces

SD / MMC-Selection:

0 = SD / eSD / SDXC

1 = MMC / eMMC

Fast Boot Support:

0 = Regular

1 = Fast Boot

MMC Speed Mode:

0x = High Speed Mode

1x = Normal Speed Mode

eMMC Reset Enable:

0 = eMMC-Reset disabled

1 = eMMC-Reset enabled

eMMC Bus Width:

000 = 1 bit 001 = 4 bit

010 = 8 bit

101 = 4 bit DDR (MMC 4.4) 110 = 8 bit DDR (MMC 4.4)

Port Select:

00 = uSDHC1 01 = uSDHC2

10 = uSDHC3

11 = uSDHC4

DLL Override:

0 = Boot ROM

1 = Apply value per eFuse field MMC_DLL_DLY[6:0]

Boot Acknowledge:

0 = Boot Acknowledge enable

1 = Boot Acknowledge disable

Override Pad Settings:

0 = default values

1 = Use PAD_SETTINGS values

1 BOOT_CFG1_6 X2-116

1 BOOT_CFG1_5 X2-117

0 BOOT_CFG1_4 X2-118

0 BOOT_CFG1_2 X2-120

1 BOOT_CFG1_1 X2-121

0 BOOT_CFG2_5 X2-109

0 BOOT_CFG2_3 X2-111

0 BOOT_CFG2_2 X2-112

0 BOOT_CFG2_1 X2-113

0 BOOT_CFG2_0 X2-114

In addition to the mode listed above the following eMMC modes are supported at port uSDHC3.

Table 6: uSDHC3 eMMC modes

eMMC mode 1 Bit 4 Bit 8 Bit Fast Boot DDR

Normal Speed

High Speed

  

5: It is not possible to boot from an SPI NOR flash bigger than 16 Mbyte. 6: Voltage level or condition of eFuse.

7: Not yet supported by software.

– 7 – 7

3.2.1.8 Boot device SPI NOR flash

Table 7: Boot configuration SPI NOR flash at eCSPI1

i.MX6 TQMa6x

eFuse Option Setting 8 Signal Pin

BOOT_CFG1[7] 0 BOOT_CFG1_7 X2-115

BOOT_CFG1[6] 0 BOOT_CFG1_6 X2-116

Boot Device Selection:

0011 = Boot from Serial ROM

BOOT_CFG1[5] 1 BOOT_CFG1_5 X2-117

BOOT_CFG1[4]

BOOT_CFG4[6]

BOOT_CFG4[5] 0 BOOT_CFG4_5 X2-89

BOOT_CFG4[4]

BOOT_CFG4[3]

BOOT_CFG4[2] 0 BOOT_CFG4_2 X2-92

BOOT_CFG4[1] 0 BOOT_CFG4_1 X2-93

BOOT_CFG4[0]

EEPROM Recovery: 9

0 = disabled

1 = enabled

CS select (SPI only):

00 = CS#0

01 = CS#1

10 = CS#2 11 = CS#3

SPI Addressing (SPI only)

0 = 2-bytes (16-bit) (3.75 MHz Clock)

1 = 3 Bytes (24-bit) (15 MHz Clock)

Port Select:

000 = ECSPI-1

001 = ECSPI-2 010 = ECSPI-3 001 = ECSPI-4 100 = ECSPI-5 101 = I2C-1 110 = I2C-2 111 = I2C-3

1 BOOT_CFG1_4 X2-118

0 BOOT_CFG4_6 X2-86

1 BOOT_CFG4_4 X2-90

1 BOOT_CFG4_3 X2-91

0 BOOT_CFG4_0 X2-96

Note: SPI NOR flash size

It is not possible to boot from an SPI NOR flash bigger than 16 Mbyte.

8: Voltage level or condition of eFuse. 9: The i.MX6 supports recovery devices. If this bit is set, the SPI NOR flash serves as recovery boot device.

3.2.1.9 Boot device SD card

Table 8: Boot configuration SD card at uSDHC2

i.MX6 TQMa6x

eFuse Option Setting 10 Signal Pin

BOOT_CFG1[7] 0 BOOT_CFG1_7 X2-115

BOOT_CFG1[6]

BOOT_CFG1[5]

BOOT_CFG1[4]

BOOT_CFG1[3] 0 BOOT_CFG1_3 X2-119

BOOT_CFG1[2]

BOOT_CFG1[1]

BOOT_CFG1[0]

BOOT_CFG2[7] 0 BOOT_CFG2_7 X2-107

BOOT_CFG2[6]

BOOT_CFG2[5]

BOOT_CFG2[4] 0 BOOT_CFG2_4 X2-110

BOOT_CFG2[3]

BOOT_CFG2[1]

BOOT_CFG2[0]

Boot Device Selection:

01 = Boot from uSDHC Interfaces

SD / MMC-Selection:

0 = SD / eSD / SDXC

1 = MMC / eMMC

Fast Boot:

0 = Regular

1 = Fast Boot

SD Speed Mode:

00 = Normal / SDR12

01 = High / SDR25 10 = SDR50 (on uSDHC3 and uSDHC4 only) 11 = SDR104 (on uSDHC3 and uSDHC4 only)

SD Power Cycle Enable:

0 = No Power Cycle

1 = Power cycle enabled via SD_RST pad (on uSDHC3 and uSDHC4 only)

SD Loopback Clock Source Sel (for SDR50 and SDR104 only)

0 = through SD pad

1 = direct

SD Calibration Step:

00 = 1 delay cell

01 = 1 delay cell 10 = 2 delay cell 11 = 3 delay cell

Bus Width:

0 = 1 bit

1 = 4 bit

Port:

00 = uSDHC1

01 = uSDHC2

10 = uSDHC3 11 = uSDHC4

Pull-Down during SD Power Cycle:

0 = Use default SD pad settings during power cycle

1 = Set pull-down on SD pads during power cycle (only used if "SD Power Cycle Enable" enabled)

Override Pad Settings:

0 = Use default values

1 = Use PAD_SETTINGS values

1 BOOT_CFG1_6 X2-116

0 BOOT_CFG1_5 X2-117

1 BOOT_CFG1_4 X2-118

0 BOOT_CFG1_2 X2-120

0 BOOT_CFG1_1 X2-121

0 BOOT_CFG1_0 X2-122

0 BOOT_CFG2_6 X2-108

1 BOOT_CFG2_5 X2-109

1 BOOT_CFG2_3 X2-111

0 BOOT_CFG2_1 X2-113

0 BOOT_CFG2_0 X2-114

In addition to the mode listed above the following SD card modes are supported at port uSDHC2:

Table 9: uSDHC2 SD card modes

SD mode 1 Bit 4 Bit Fast Boot

SDR12

SDR25

  

SDR50 – – –

SDR104 – – –

10: Voltage level or condition of eFuse.

3.2.2 Memory

3.2.2.1 DDR3L SDRAM

Depending on the i.MX6 derivative either two or four DDR3L SDRAM chips are assembled on the TQMa6x. All chips have one common chip select. The chips are connected to the i.MX6 with a 64-bit bus. (Exception: The i.MX6 “Solo” is connected with a 32-bit bus.) The following block diagram shows how the DDR3L SDRAM is connected to the i.MX6.

Illustration 3: Block diagram DDR3L SDRAM connection

The characteristics of the memory interface depend on the i.MX6 derivative. The following table shows the different possibilities.

Table 10: i.MX6 SDRAM interface according to i.MX6 derivative

i.MX6 derivative Bus width Clock SDRAM chips TQ-BSP

i.MX6 Solo × 32 396 MHz 2 Yes i.MX6 DualLite × 64 396 MHz 4 Yes i.MX6 Dual × 64 528 MHz 4 Yes i.MX6 DualPlus × 64 528 MHz 4 Yes i.MX6 Quad × 64 528 MHz 4 Yes i.MX6 QuadPlus × 64 528 MHz 4 Yes

The assembly options of DDR3L SDRAM on the TQMa6x are listed in the following table.

Table 11: DDR3L SDRAM memory size options

Assembly option Size

2 × DDR3L 128M16 / ×32 512 Mbyte 2 × DDR3L 256M16 / ×32 1 Gbyte 4 × DDR3L 128M16 / ×64 1 Gbyte 4 × DDR3L 256M16 / ×64 2 Gbyte

The following address range is reserved for the DDR controller in mode X32 / X64 fixed:

Table 12: DDR3L SDRAM address range

Start address Size Chip Select Remark

0x1000_0000 0xFFFF_FFFF

CS0# 3840 Mbyte

+ 39 hidden pages

TQ TQMa6x, TQMa6xP User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1. ABOUT THIS MANUAL

1.1 Copyright and license expenses

1.2 Registered trademarks

1.3 Disclaimer

1.4 Imprint

1.5 Tips on safety

1.6 Symbols and typographic conventions

1.7 Handling and ESD tips

1.8 Naming of signals

1.9 Further applicable documents / presumed knowledge

2. BRIEF DESCRIPTION

2.1 Key functions and characteristics

3. ELECTRONICS

3.1 System overview

3.1.1 System architecture / block diagram

3.1.2 Functionality

3.2 System components

3.2.1 i.MX6

3.2.1.1 i.MX6 derivatives

3.2.1.2 eFUSEs

3.2.1.3 i.MX6 errata

3.2.1.4 Boot modes

3.2.1.5 Boot configuration

3.2.1.6 Boot interfaces

3.2.1.7 Boot device eMMC

3.2.1.8 Boot device SPI NOR flash

3.2.1.9 Boot device SD card

3.2.2 Memory

3.2.2.1 DDR3L SDRAM