TQ TQMa335xL User Manual

TQMa335xL User's Manual

TQMa335xL UM 0101

20.09.2019

TABLE OF CONTENTS

ABOUT THIS MANUAL ................................................................................................................................................................. 1

1.1 Copyright and license expenses .............................................................................................................................................. 1

1.2 Registered trademarks ................................................................................................................................................................ 1

1.3 Disclaimer ....................................................................................................................................................................................... 1

1.4 Imprint ............................................................................................................................................................................................. 1

1.5 Tips on safety ................................................................................................................................................................................. 2

1.6 Symbols and typographic conventions................................................................................................................................. 2

1.7 Handling and ESD tips ................................................................................................................................................................ 2

1.8 Naming of signals ......................................................................................................................................................................... 3

1.9 Further applicable documents / presumed knowledge................................................................................................... 3

2. BRIEF DESCRIPTION ...................................................................................................................................................................... 4

2.1 Key functions and characteristics ............................................................................................................................................ 4

2.2 Available interfaces ...................................................................................................................................................................... 5

3. ELECTRONICS ................................................................................................................................................................................. 6

3.1 System overview ........................................................................................................................................................................... 6

3.1.1 System architecture / block diagram ..................................................................................................................................... 6

3.1.2 Functionality .................................................................................................................................................................................. 6

3.1.3 Pin multiplexing ............................................................................................................................................................................ 6

3.2 System components .................................................................................................................................................................... 7

3.2.1 AM335x processor ........................................................................................................................................................................ 7

3.2.1.1 AM335x derivatives ..................................................................................................................................................................... 7

3.2.1.2 Boot modes .................................................................................................................................................................................... 8

3.2.1.3 Boot configuration ....................................................................................................................................................................... 9

3.2.1.4 Boot interfaces ........................................................................................................................................................................... 10

3.2.1.4.1 Boot device SD card .................................................................................................................................................................. 10

3.2.1.4.2 Boot device eMMC .................................................................................................................................................................... 10

3.2.2 Memory ........................................................................................................................................................................................ 11

3.2.2.1 DDR3L SDRAM ............................................................................................................................................................................ 11

3.2.2.2 eMMC NAND flash ..................................................................................................................................................................... 11

3.2.3 AM335x-RTC, PMIC-RTC ........................................................................................................................................................... 12

3.2.4 Interfaces ...................................................................................................................................................................................... 13

3.2.4.1 Overview ...................................................................................................................................................................................... 13

3.2.4.2 Gigabit Ethernet MAC .............................................................................................................................................................. 14

3.2.4.3 GPMC / External memory bus ............................................................................................................................................... 14

3.2.4.4 MMC / SD card ............................................................................................................................................................................ 15

3.2.4.5 GPIO ............................................................................................................................................................................................... 15

3.2.4.6 PWM .............................................................................................................................................................................................. 15

3.2.4.7 JTAG / DEBUG ............................................................................................................................................................................. 16

3.2.4.8 Touch and analog inputs ........................................................................................................................................................ 16

3.2.4.9 LCD controller ............................................................................................................................................................................. 17

3.2.4.10 Serial interfaces .......................................................................................................................................................................... 18

3.2.4.11 CAN ................................................................................................................................................................................................ 18

3.2.4.12 I2C .................................................................................................................................................................................................. 18

3.2.4.13 I2S / AUDMUX ............................................................................................................................................................................. 19

3.2.4.14 SPI ................................................................................................................................................................................................... 19

3.2.4.15 UART .............................................................................................................................................................................................. 20

3.2.4.16 UART0............................................................................................................................................................................................ 20

3.2.4.17 UART3............................................................................................................................................................................................ 20

3.2.4.18 UART4............................................................................................................................................................................................ 21

3.2.4.19 USB ................................................................................................................................................................................................. 21

3.2.4.20 EXTINT#......................................................................................................................................................................................... 21

3.2.4.21 Clockout ....................................................................................................................................................................................... 22

TABLE OF CONTENTS (continued)

3.2.5

Reset .............................................................................................................................................................................................. 22

3.2.6 WDOG ........................................................................................................................................................................................... 23

3.2.7 Power supply .............................................................................................................................................................................. 23

3.2.7.1 Main power supply ................................................................................................................................................................... 23

3.2.7.2 Overview TQMa335xL supply ................................................................................................................................................ 23

3.2.7.3 Adaptive Voltage Scaling (AVS) ............................................................................................................................................ 24

3.2.7.4 Voltage supervision .................................................................................................................................................................. 24

3.2.7.5 TQMa335xL / carrier board Power-Up sequence............................................................................................................. 24

3.2.8 Power-Modes .............................................................................................................................................................................. 25

3.2.8.1 RTC backup .................................................................................................................................................................................. 25

3.2.8.2 AM335x DEEP-SLEEP0-2, Standby ........................................................................................................................................ 25

3.2.8.3 AM335x Active Mode ............................................................................................................................................................... 25

3.3 TQMa335xL interface ............................................................................................................................................................... 26

3.3.1 Pin assignment ........................................................................................................................................................................... 26

3.3.2 Pinout TQMa335xL .................................................................................................................................................................... 26

4. SOFTWARE ................................................................................................................................................................................... 31

5. MECHANICS ................................................................................................................................................................................. 31

5.1 TQMa335xL dimensions and footprint ............................................................................................................................... 31

5.2 TQMa335xL 3D views ............................................................................................................................................................... 32

5.3 TQMa335xL component placement .................................................................................................................................... 32

5.4 Protection against external effects ...................................................................................................................................... 33

5.5 Thermal management ............................................................................................................................................................. 33

5.6 Structural requirements .......................................................................................................................................................... 33

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS .......................................................................................... 33

6.1 EMC ................................................................................................................................................................................................ 33

6.2 ESD ................................................................................................................................................................................................. 33

6.3 Operational safety and personal security .......................................................................................................................... 33

6.4 Climatic and operational conditions ................................................................................................................................... 34

6.5 Reliability and service life ........................................................................................................................................................ 34

6.6 Environment protection .......................................................................................................................................................... 35

6.6.1 RoHS .............................................................................................................................................................................................. 35

6.6.2 WEEE®............................................................................................................................................................................................ 35

6.7 REACH® ......................................................................................................................................................................................... 35

6.8 EuP ................................................................................................................................................................................................. 35

6.9 Battery ........................................................................................................................................................................................... 35

6.10 Packaging .................................................................................................................................................................................... 35

6.11 Other entries ............................................................................................................................................................................... 35

7. APPENDIX..................................................................................................................................................................................... 36

7.1 Acronyms and definitions ....................................................................................................................................................... 36

7.2 References ................................................................................................................................................................................... 38

top view through TQMa335xL

TABLE DIRECTORY

Table 1:

Terms and Conventions ............................................................................................................................................................. 2

Table 2: AM335x derivatives ..................................................................................................................................................................... 7

Table 3: Boot sequence ............................................................................................................................................................................... 8

Table 4: Oscillator frequency ..................................................................................................................................................................... 9

Table 5: General boot configuration CLKOUT1 ................................................................................................................................... 9

Table 6: Boot device selection .................................................................................................................................................................. 9

Table 7: Pins used for SD card boot ..................................................................................................................................................... 10

Table 8: Pins used for eMMC boot ........................................................................................................................................................ 10

Table 9: DDR3L SDRAM ............................................................................................................................................................................ 11

Table 10: SDRAM address space .............................................................................................................................................................. 11

Table 11: Internal interfaces...................................................................................................................................................................... 13

Table 12: External interfaces ..................................................................................................................................................................... 13

Table 13: RGMII1 ........................................................................................................................................................................................... 14

Table 14: RGMII2 ........................................................................................................................................................................................... 14

Table 15: SD card signals ........................................................................................................................................................................... 15

Table 16: GPIO signals ................................................................................................................................................................................ 15

Table 17: PWM signals ................................................................................................................................................................................ 15

Table 18: JTAG modes ................................................................................................................................................................................ 16

Table 19: JTAG signals ................................................................................................................................................................................ 16

Table 20: Touch signals .............................................................................................................................................................................. 16

Table 21: LCD signals .................................................................................................................................................................................. 17

Table 22: CAN1 / CAN2 signals ................................................................................................................................................................. 18

Table 23: I2C0 and I2C1 signals................................................................................................................................................................ 18

Table 24: I2C0 addresses ............................................................................................................................................................................ 18

Table 25: MCASP0 signals .......................................................................................................................................................................... 19

Table 26: SPI0 and SPI1 signals ................................................................................................................................................................ 19

Table 27: UART0 signals ............................................................................................................................................................................. 20

Table 28: UART3 signals ............................................................................................................................................................................. 20

Table 29: UART4 signals ............................................................................................................................................................................. 21

Table 30: USB_H1 signals ........................................................................................................................................................................... 21

Table 31: EXTINT# signal ............................................................................................................................................................................ 21

Table 32: Clockout signals ......................................................................................................................................................................... 22

Table 33: Reset signals ................................................................................................................................................................................ 22

Table 34: Parameter TQMa335xL supply .............................................................................................................................................. 23

Table 35: PMIC RTC ...................................................................................................................................................................................... 25

Table 36: AM335x DEEP-SLEEP0-2, Standby ........................................................................................................................................ 25

Table 37: AM335x Active Mode ............................................................................................................................................................... 25

Table 38: Pinout TQMa335xL,

Table 39: TQMa335xL pad description .................................................................................................................................................. 27

Table 40: Labels on TQMa335xL .............................................................................................................................................................. 32

Table 41: Climate and operational conditions extended temperature range –25 °C to +85 °C .......................................... 34

Table 42: Climate and operational conditions industrial temperature range –40 °C to +85 °C .......................................... 34

Table 43: Acronyms ..................................................................................................................................................................................... 36

Table 44: Further applicable documents .............................................................................................................................................. 38

.................................................................................................... 26

op view through TQMa335xL

ILLUSTRATION DIRECTORY

Illustration 1:

Illustration 2: TQMa335xL block diagram ........................................................................................................................................................ 6

Illustration 3: Block diagram AM335x ............................................................................................................................................................... 7

Illustration 4: Block diagram DDR3L SDRAM connection ........................................................................................................................ 11

Illustration 5: Block diagram eMMC flash connection .............................................................................................................................. 11

Illustration 6: Block diagram UART0 interface............................................................................................................................................. 20

Illustration 7: Block diagram UART3 interface............................................................................................................................................. 20

Illustration 8: Block diagram UART4 interface............................................................................................................................................. 21

Illustration 9: Block diagram Reset ................................................................................................................................................................. 22

Illustration 10: Block diagram power supply ................................................................................................................................................. 23

Illustration 11: Block diagram power supply carrier board ....................................................................................................................... 24

Illustration 12: TQMa335xL dimensions (1) .................................................................................................................................................... 31

Illustration 13: TQMa335xL dimensions (2) .................................................................................................................................................... 31

Illustration 14: TQMa335xL side view .............................................................................................................................................................. 31

Illustration 15: Recommended PCB land pattern for TQMa335xL, t

Illustration 16: TQMa335xL top view (3D) ...................................................................................................................................................... 32

Illustration 17: TQMa335xL bottom view (3D) .............................................................................................................................................. 32

Illustration 18: TQMa335xL component placement top ............................................................................................................................ 32

Illustration 19: TQMa335xL component placement bottom .................................................................................................................... 32

Block diagram TQMa335xL (simplified) ................................................................................................................................. 4

........................................... 31

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 03.04.2019 Petz Initial release

0101 20.09.2019 Petz

3.2.1.4.3

5.5, 5.6 (10)

Boot device NOR flash removed Updated Added

ABOUT THIS MANUAL

1.1

Copyright and license expenses

1.2

Registered trademarks

1.3

Disclaimer

Important Notice:

1.4

Imprint

D-82229 Seefeld

machine readable, or in any other form without the written consent of TQ-Systems GmbH. The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to. Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price. Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third party.

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without special notification.

Before using the Starterkit MBa335x or parts of the schematics of the MBa335x, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the usage of the Starterkit MBa335x or schematics used, regardless of the legal theory asserted.

TQ-Systems GmbH Gut Delling, Mühlstraße 2

Tel: +49 8153 9308–0 Fax: +49 8153 9308–4223 E-Mail: Info@TQ-Group Web: TQ-Group

1.5

Tips on safety

1.6

Symbols and typographic conventions

Command

1.7

Handling and ESD tips

Improper or incorrect handling of the product can substantially reduce its life span.

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive devices and / or components. These components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V. Please note the relevant statutory regulations in this regard. Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

A font with fixed-width is used to denote commands, file names, or menu items.

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMa335xL and be dangerous to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD). Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you power up the TQMa335xL or the Starterkit, change jumper settings, or connect other devices.

1.8

Naming of signals

1.9

Further applicable documents / presumed knowledge

Specifications and manuals of the modules used:

Specifications of the components used:

Chip errata:

Software behaviour:

General expertise:

A hash mark (#) at the end of the signal name indicates a low-active signal. Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring. The identification of the individual functions follows the above conventions. Example: WE2# / OE#

•

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of. They contain, if applicable, additional information that must be taken note of for safe and reliable operation. These documents are stored at TQ-Systems GmbH.

•

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of. The manufacturer’s advice should be followed.

•

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

• MBa335x circuit diagram

• MBa335x User's Manual

• Sitara™ AM335x Data Sheet

• U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

• PTXdist documentation: www.ptxdist.de

• TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:tqma335x

BRIEF DESCRIPTION

AM335

eMMC

LGA pads

DDR

3L SDRAM

.3 V

Power

2.1

Key functions and characteristics

This User's Manual describes the hardware of the TQMa335xL revision 02xx, and refers to some software settings. It does not replace the AM335x Reference Manual.

The TQMa335xL is a universal Minimodule based on the Texas Instruments ARM

The AM335x Cortex

A8 core works with up to 800 MHz.

Cortex® A8 Sitara™ AM335x.

The TQMa335xL extends the TQC product range and offers an outstanding computing performance.

Illustration 1: Block diagram TQMa335xL (simplified)

The TQMa335xL provides the following key functions and characteristics:

• Texas Instruments AM335x

• Up to 512 Mbyte DDR3L SDRAM with 16 bit interface

• Up to 8 Gbyte eMMC NAND flash

• Texas Instruments PMIC

• All essential AM335x pins are routed to the TQMa335xL pads

• Extended temperature range

• Single power supply 3.3 V

2.2

Available interfaces

The TQMa335xL provides the following interfaces at the TQMa335xL pads:

• 2 × Ethernet 10/100/1000 Mbit, RGMII

• 2 × USB 2.0 Hi-Speed

• 2 × CAN 2.0B

• 3 × UART (1 UART with handshake)

• 1 × SD 4 bit (SDIO / MMC / SD card)

• 2 × SPI

• 2 × I

• 1 × I2S (MCASP0)

• 3 × GPIO

• 4 × PWM

• 1 × parallel display RGB 24 bit

• 1 × JTAG

• 2 × General Purpose Clock

• 8 × AIN inclusive resistive touch controller (12 bit ADC)

As an alternative to the default interfaces, more AM335x interfaces are available with an adapted pin configuration. These are amongst others:

• GPMC (General-Purpose Memory Controller)

• PRU-MII1, PRU-MII2 (only available with AM3356, -7, -8, -9)

• PWMSS (Pulse-Width Modulation Subsystem)

• Enhanced Serial Audio Interface

• Ethernet 10/100 RMII

• More audio interfaces

• More I

C interfaces

• More SPI interfaces

• More UARTs

All useful AM335x signals are routed to the TQMa335xL pads. There are no restrictions for customers using the TQMa335xL with respect to an integrated customised design. Please take note of that not all listed interfaces can be used simultaneously.

ELECTRONICS

3.1

System overview

AM335x

DDR3L SDRAM

eMMC

PMIC

LGA pads

The information provided in this User's Manual is only valid in connection with the tailored boot loader, which is preinstalled on the TQMa335xL, and the BSP provided by TQ-Systems GmbH, see also section 4.

3.1.1 System architecture / block diagram

Illustration 2: TQMa335xL block diagram

3.1.2 Functionality

The following key functions are implemented on the TQMa335xL:

• AM335x (-2, -4, -8, -9, are standard, -1, -6, -7 on request)

• DDR3L SDRAM

• eMMC NAND flash

• PMIC

3.1.3 Pin multiplexing

The pin multiplexing of the AM335x permits to use many pins for different interfaces. The information provided in this User's Manual is based on the BSP provided by TQ-Systems GmbH.

Attention: Destruction or malfunction

Many AM335x pins can be configured as different function. Please take note of the information in the AM335x Data Sheet (1) concerning the configuration of these

pins before integration / start-up of your carrier board / Starterkit. Please also take note of the latest AM335x errata (7).

3.2

System components

3.2.1 AM335x processor

The following illustration shows the AM335x processor family block diagram:

Illustration 3: Block diagram AM335x (Source: Texas Instruments

)

3.2.1.1 AM335x derivatives

Depending on the TQMa335xL version, one of the following AM335x derivatives is assembled:

Table 2: AM335x derivatives

Description Part number Clock T

AM335x mask

junction

AM3352 AM3352BZCZA80 800 MHz –40 °C to +105 °C 2.1

AM3354 AM3354BZCZA80 800 MHz –40 °C to +105 °C 2.1

AM3358 AM3358BZCZA80 800 MHz –40 °C to +105 °C 2.1

AM3359 AM3359BZCZA80 800 MHz –40 °C to +105 °C 2.1

Attention: Malfunction

Please take note of the latest AM335x errata (7).

1st

2nd

3rd

4th

3.2.1.2 Boot modes

The AM335x provides a ROM with integrated boot loader. After power-up the boot code initialises the hardware and then loads the program image from the selected boot device. The integrated eMMC can be selected as standard boot device for the TQMa335xL. More external boot devices are available as an alternative to eMMC. Information thereto can be found in the AM335x Data Sheet (1) and the AM335x Reference Manual (3). The AM335x supports so-called boot-sequences, i.e. if it fails to boot from the first boot device, it will try to boot from the next

one automatically.

Table 3: Boot sequence

Boot Sequence

MMC0 / SD SPI0 / NOR (not available on TQMa335xL) UART0 / n.a. USB0 / n.a.

MMC1/ eMMC MMC0 / SD UART0 / n.a. USB0 / n.a.

SPI0 / NOR (not available on TQMa335xL) MMC0 / SD USB0 / n.a. UART0 / n.a.

The boot device and its configuration as well as other AM335x settings have to be done via Boot Mode Register SYSBOOT. The register SYSBOOT is read during reset from pins LCD_DATA[15:0].

Attention: Malfunction

On the carrier board must be ensured that even in the third and fourth boot sequence no pins drive against each other!

The settings for other boot devices are to be taken from the AM335x Data Sheet (1).

bold

00b

01b

Default

10b

11b

1st

2nd

3rd

4th

10111b

11100b

11000b

3.2.1.3 Boot configuration

The boot configuration of the TQMa335xL is defined through 16 GPIO pins.

Note: Boot configuration

None of these 16 boot configuration pins are connected on the TQMa335xL, which means, the TQMa335xL is delivered with no preset boot configuration.

With bits SYSBOOT[15:14] and SYSBOOT[5] some general settings are carried out, independent from the boot device. The value in the following table printed in

is used on account of the 24 MHz oscillator assembled on the TQMa335xL.

The bits SYSBOOT[15:14] set the frequency of the oscillator.

Table 4: Oscillator frequency

SYSBOOT[15:14] Oscillator frequency / MHz Remark

19.2 –

25 – 26 –

Bit SYSBOOT[5] indicates whether CLKOUT1 is activated.

Table 5: General boot configuration CLKOUT1

SYSBOOT[5] CLKOUT1

0 Deactivated 1 Activated

The boot device or the boot sequence is defined with bits SYSBOOT[4:0]. The following table shows the boot sequence defined for the MBa335x.

Table 6: Boot device selection

SYSBOOT[4:0] Boot Sequence

MMC0 / SD SPI0 / NOR (not available on TQMa335xL) UART0 / n.a. USB0 / n.a.

MMC1 / eMMC MMC0 / SD UART0 / n.a. USB0 / n.a.

SPI0 / NOR (not available on TQMa335xL) MMC0 / SD USB0 / n.a. UART0 / n.a.

Attention: Malfunction

On the carrier board must be ensured that even in the third and fourth boot sequence no pins drive against each other!

3.2.1.4 Boot interfaces

The configuration of the following boot devices is described in the next sections:

• MMC0 (external SD card)

• MMC1 (eMMC on TQMa335xL)

• SPI0 NOR flash (not available on TQMa335xL)

Attention: Destruction or malfunction

Many AM335x pins can be configured as different function. Please pay attention to the notes in the AM335x Data Sheet (1) concerning the wiring of these pins before integration / start-up of your carrier board / Starterkit. Please also take note of the latest AM335x errata (7).

3.2.1.4.1 Boot device SD card

The SD card boots from MMC0 of the AM335x. The following pins must be used for the boot process.

Table 7: Pins used for SD card boot

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

F17 MMC0_CLK MMC0_CLK I/O G17 – F15 MMC0_CMD MMC0_CMD I/O G18 – E14 MMC0_DAT3 MMC0_DAT3 I/O F17 – E15 MMC0_DAT2 MMC0_DAT2 I/O F18 – E16 MMC0_DAT1 MMC0_DAT1 I/O G15 – E17 MMC0_DAT0 MMC0_DAT0 I/O G16 –

3.2.1.4.2 Boot device eMMC

The eMMC boots from MMC1 of the AM335x. MMC1 supports eMMCs with a size of 4 Gbyte or greater. The following pins are used for the boot process.

Table 8: Pins used for eMMC boot

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

P3 MMC1_CLK GPMC_CS#1 I/O U9 – R3 MMC1_CMD GPMC_CS#2 I/O V9 –

M2 MMC1_DAT3 GPMC_AD3 I/O T8

L4 MMC1_DAT2 GPMC_AD2 I/O R8 L3 MMC1_DAT1 GPMC_AD1 I/O V7 L2 MMC1_DAT0 GPMC_AD0 I/O U7

4-bit boot

AM335x

A[15:0] D[15:0]

CS0#

CTRL

CLK0

DQM0

DDR3L SDRAM

A[15:0] D[15:0]

CS0#

CTRL

CLK0 DQM0

DQM1

BA[0:2]

0x8000_0000

0x4000_0000

AM335x eMMC

MMCHS1_CLK

MMCHS1_CMD

CLK CMD

MMCHS1_DAT[7:0]

DAT[7:0] RESET#WARMRST#

3.2.2 Memory

3.2.2.1 DDR3L SDRAM

The TQMa335xL is equipped with one DDR3L SDRAM chip with a data bus width of 16 bits. The AM335x supports 303 to 400 MHz bus clock. In the BSP provided by TQ-Systems GmbH

the memory is clocked with 400 MHz.

The following block diagram shows how the DDR3L SDRAM is connected to the AM335x.

Illustration 4: Block diagram DDR3L SDRAM connection

The TQMa335xL can be equipped with 256 Mbyte or 512 Mbyte of DDR3L SDRAM:

Table 9: DDR3L SDRAM

Placement option Size

1 × DDR3L 128M16 256 Mbyte

1 × DDR3L 256M16 512 Mbyte

The SDRAM is mapped to the following address:

Table 10: SDRAM address space

Start address Size Chip Select Remark

CS0# 1 Gbyte

3.2.2.2 eMMC NAND flash

The eMMC NAND flash on the TQMa335xL contains the boot loader and the application software. The following block diagram shows how the eMMC flash is connected to the AM335x.

Illustration 5: Block diagram eMMC flash connection

3.2.3 AM335x-RTC, PMIC-RTC

Both the AM335x and the PMIC on the TQMa335xL provide an RTC, which have their own power domain VRTC. The RTC power domain VRTC of the CPU is supplied by the PMIC through an internal regulator. The PMIC is either supplied by VIN (VCC3V3IN), or through the PMIC backup supply pin VBACKUP_PMIC,

which is routed to TQMa335xL pad C9. The PMIC can charge a battery or a SuperCap connected through TQMa335xL pad C9. Charging methods and electrical characteristics are to be taken from the PMIC User’s Guide (6). The typical current consumption of the PMIC_RTC is approximately 20 µA @ 3 V. The accuracy of the RTC is mainly determined by the characteristics of the quartz used. The 32.768 kHz crystal type FC-135 used

on the TQMa335xL has a standard frequency tolerance of ±20 ppm @ +25 °C. (Parabolic coefficient: max. –0.04 × 10

–6

/ °C2.)

Note: Current consumption

Long-term bridging with a coin cell is not possible due to the high current consumption of the PMIC-RTC. Depending on the use case a Li coin cell or a SuperCap can be used.

Secondary

RGB24

USB 2 Primary

3.2.4.19

USB0_OTG / USB1_OTG

3.2.4 Interfaces

3.2.4.1 Overview

The TQMa335xL provides interfaces with primary function. These can be used simultaneously independent from its configuration. If a secondary function (e.g. MII0) is required, some primary functions may be omitted. More information regarding availability and pinout can be found in the AM335x Data Sheet (1) and the AM335x Reference Manual (3).

Table 11: Internal interfaces

Interface Qty. Function Chapter Remark

MMC1 1 Primary 3.2.2.2 eMMC, 8 bit

Table 12: External interfaces

Interface Qty. Function Chapter Remark

AIN 8 Primary 3.2.4.13 AIN0 – AIN7 CLOCKOUT 2 Primary 3.2.4.21 General Purpose Clocks CLOCKIN 1 – – – CAN 2 Secondary 3.2.4.11 DCAN0 / DCAN1

JTAG / DEBUG

1 Primary 3 Secondary EMU2 / EMU3 / EMU4

3.2.4.7

JTAG / EMU0 / EMU1

ECAP 3 Secondary – ECAP0 – 2 ECAP_PRUSS 1 Secondary – – ECAT_PRUSS 1 Secondary – – EQEP 2 Primary – –

Gbit-Eth MAC

1 Primary 3.2.4.2 MII1

1 Secondary 3.2.4.1 MII0 GLUE 2 Primary 3.2.4.21 XDMA_EVENT_INTR0 / 1 GPIO – Secondary 3.2.4.5 GPIO[0:2] (32 bit), GPIO3 (22 bit) GPMC 1 Primary 3.2.4.3 12 address / 16 address/data EMIF 1 Primary 3.2.2.1 DDR

I2C

LCD controller

1 Primary

2 Secondary I2C1 / I2C2

1 Primary

3.2.4.12

3.2.4.9

I2C0

RGB16

MCASP 1 Primary MCASP 3 Secondary AUD4 / AUD5 / AUD6 | multiplexing has to be adapted

3.2.4.13

AUD3 / I2S

MDIO 1 Primary – – MDIO_PRUSS 1 Secondary – – MII_PRUSS 2 Secondary 3.2.4.2 MII0_PRUSS / MII1_PRUSS

MMC

1 Primary

2 Secondary MMC1 / eMMC / 1/4/8 bit

3.2.4.4

MMC0 / SD card / 1/4 bit

PRU_PRUSS 1 Secondary – 16 bit interface RTC 1 Primary 3.2.3 –

SPI

1 Primary

1 Secondary SPI1

3.2.4.14

SPI0

TIMER 4 Secondary – TIMER4 – 7

UART

2 Primary 3.2.4.15 UART0 / UART1

4 Secondary 3.2.4.16 UART2 / UART3 / UART4 / UART5 UART_PRUSS 1 Secondary – UART_PRUSS0

XTAL 2 Primary – XTALOSC0 / XTALOSC1

3.2.4.2 Gigabit Ethernet MAC

The AM335x provides a 10/100/1000 Mbit MAC Core. Two Ethernet interfaces are routed to the TQMa335xL pads using the 3-port switch. The switch supports two MII, RMII and RGMII. The following table shows the signals used.

Table 13: RGMII1

TQMa335xL pad Signal Pad Dir. AM335x ball

M15 RGMII1_RCLK MII1_RX_CLK I/O L18

R14 RGMII1_RCTL MII1_RX_DV I/O J17

M16 RGMII1_RD3 MII1_RXD3 I/O L17

M17 RGMII1_RD2 MII1_RXD2 I/O L16

N16 RGMII1_RD1 MII1_RXD1 I/O L15

N17 RGMII1_RD0 MII1_RXD0 I/O M16

K15 RGMII1_TCLK MII1_TX_CLK I/O K18

L15 RGMII1_TCTL MII1_TX_EN I/O J16

K16 RGMII1_TD3 MII1_TXD3 I/O J18

K17 RGMII1_TD2 MII1_TXD2 I/O K15

L16 RGMII1_TD1 MII1_TXD1 I/O K16

L17 RGMII1_TD0 MII1_TXD0 I/O K17

Table 14: RGMII2

TQMa335xL pad Signal Pad Dir. AM335x ball

P13 RGMII2_RCLK GPMC_A7 I/O T15

R14 RGMII2_RCTL GPMC_A1 I/O V14

T14 RGMII2_RD3 GPMC_A8 I/O V16

U14 RGMII2_RD2 GPMC_A9 I/O U16

T15 RGMII2_RD1 GPMC_A10 I/O T16

U15 RGMII2_RD0 GPMC_A11 I/O V17

R12 RGMII2_TCLK GPMC_A6 I/O U15

R13 RGMII2_TCTL GPMC_A0 I/O R13

T12 RGMII2_TD3 GPMC_A2 I/O U14

U12 RGMII2_TD2 GPMC_A3 I/O T14

T13 RGMII2_TD1 GPMC_A4 I/O R14

U13 RGMII2_TD0 GPMC_A5 I/O V15

3.2.4.3 GPMC / External memory bus

The AM335x provides a General Purpose Memory Controller (GPMC), whose pins are routed to the TQMa335xL pads. The GPMC signals are routed to the TQMa335xL pads as secondary function. GPMC-CLK is multiplexed with MMC1-CLK.

Note: Signal overlapping

There is an overlapping with an eMMC signal. GPMC-CLK is multiplexed with MMC1-CLK.

1: Currently not supported.

3.2.4.4 MMC / SD card

An SD card can be connected to the TQMa335xL. The MMC0 controller is routed to the TQMa335xL pads for this purpose. The MMC0 interface supports SD and SDIO as well. The following table shows the signals used by the SD card interface.

Table 15: SD card signals

TQMa335xL pad Signal Pad Dir. AM335x ball

F17 MMC0_CLK MMC0_CLK I/O G17

F15 MMC0_CMD MMC0_CMD I/O G18

E14 MMC0_DAT3 MMC0_DAT3 I/O F17

E15 MMC0_DAT2 MMC0_DAT2 I/O F18

E16 MMC0_DAT1 MMC0_DAT1 I/O G15

E17 MMC0_DAT0 MMC0_DAT0 I/O G16

3.2.4.5 GPIO

Besides their interface function, most AM335x pins can also be used as GPIOs. All these GPIOs are interrupt capable. Details are to be taken from the AM335x Data Sheet (1). Moreover several pins marked as GPIO are already routed to the TQMa335xL pads. The following table shows the signals, which can be used as GPIOs.

Table 16: GPIO signals

TQMa335xL pad Signal Pad Dir. AM335x ball

R1 GPIO1_29 GPMC_CS#0 I/O V6

P1 GPIO1_28 GPMC_BE#1 I/O U18

T1 GPIO2_0 GPMC_CS#3 I/O T13

The electrical characteristics of the GPIOs are to be taken from the respective Data Sheets provided by Texas Instruments (2), (3).

3.2.4.6 PWM

The AM335x provides several PWMs, which are routed to the TQMa335xL pads. The following table shows the available PWM signals.

Table 17: PWM signals

TQMa335xL pad Signal Pad Dir. AM335x ball

U2 Timer4 GPMC_ADV#_ALE I/O R7

T2 Timer5 GPMC_BE#0_CLE I/O T6

U3 Timer6 GPMC_WE# I/O U6

T3 Timer7 GPMC_OE#_RE# I/O T7

3.2.4.7 JTAG / DEBUG

The AM335x has two JTAG modes. The JTAG mode is defined by pins EMU0 and EMU1 during reset. The following table shows the modes available and the mode selected on the TQMa335xL:

Table 18: JTAG modes

EMU0 EMU1 Name Remark

1 0 ICEPick TAP only + WIR mode

1 1 ICEPick TAP only (default mode)

The following table shows the signals used by the JTAG interface.

Table 19: JTAG signals

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

C4 TDI TDI I B11 –

D4 TDO TDO O A11 –

C3 TMS TMS I C11 –

D5 TCK TCK I A12 –

D3 TRST# TRST# I B10 –

E3 EMU1 EMU1 I/O B14 –

E4 EMU0 EMU0 I/O C14 –

3.2.4.8 Touch and analog inputs

The AM335x provides analog inputs including a touch interface. These inputs are routed to the TQMa335xL pads. For the analog inputs a reference voltage of 1.8 V ±3 % is provided on the TQMa335xL. The following table shows the signals used by the analog interface.

Table 20: Touch signals

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

B5 AIN7 AIN7 AIN C9 –

B3 AIN3 AIN3 AIN A7 On MBa335x: Y–

A5 AIN6 AIN6 AIN A8 –

A3 AIN2 AIN2 AIN B7 On MBa335x: Y+

B4 AIN5 AIN5 AIN B8 –

B2 AIN1 AIN1 AIN C7 On MBa335x: X–

A4 AIN4 AIN4 AIN C8 –

A2 AIN0 AIN0 AIN B6 On MBa335x: X+

Wake-up by touch is possible. The implementation and the selection of a certain power mode is software dependent.

3.2.4.9 LCD controller

The LCD controller of the AM335x supports up to 24-bit (RGB) with a resolution of up to WXGA (1366 × 768). All necessary pins are routed to the TQMa335xL pads. Information regarding supported displays and resolutions can be found in the AM335x Reference Manual (3). The following table shows the signals used by the LCD controller.

Table 21: LCD signals

TQMa335xL pad Signal Pad Dir. AM335x ball

R5 LCD_MCLK GPMC_CLK I/O V12

P5 LCD_HSYNC LCD_HSYNC I/O R5

P4 LCD_VSYNC LCD_VSYNC I/O U5

U5 LCD_PCLK LCD_PCLK I/O V5

T5 LCD_AC_BIAS_EN LCD_AC_BIAS_EN I/O R6

P11 LCD_DATA23 GPMC_AD8 I/O U10

R11 LCD_DATA22 GPMC_AD9 I/O T10

T11 LCD_DATA21 GPMC_AD10 I/O T11

U11 LCD_DATA20 GPMC_AD11 I/O U12

P10 LCD_DATA19 GPMC_AD12 I/O T12

R10 LCD_DATA18 GPMC_AD13 I/O R12

T10 LCD_DATA17 GPMC_AD14 I/O V13

U10 LCD_DATA16 GPMC_AD15 I/O U13

P9 LCD_DATA15 LCD_DATA15 I/O T5

R9 LCD_DATA14 LCD_DATA14 I/O V4

T9 LCD_DATA13 LCD_DATA13 I/O V3

U9 LCD_DATA12 LCD_DATA12 I/O V2

P8 LCD_DATA11 LCD_DATA11 I/O U4

R8 LCD_DATA10 LCD_DATA10 I/O U3

T8 LCD_DATA9 LCD_DATA9 I/O U2

U8 LCD_DATA8 LCD_DATA8 I/O U1

P7 LCD_DATA7 LCD_DATA7 I/O T4

R7 LCD_DATA6 LCD_DATA6 I/O T3

T7 LCD_DATA5 LCD_DATA5 I/O T2

U7 LCD_DATA4 LCD_DATA4 I/O T1

P6 LCD_DATA3 LCD_DATA3 I/O R4

R6 LCD_DATA2 LCD_DATA2 I/O R3

T6 LCD_DATA1 LCD_DATA1 I/O R2

U6 LCD_DATA0 LCD_DATA0 I/O R1

0x2D / 0b010 1101

3.2.4.10 Serial interfaces

The supported standards, transfer modes and rates of the following interfaces are to be taken from the AM335x Data Sheet (1).

3.2.4.11 CAN

The AM335x provides two integrated CAN controller. The signals of both CAN controllers are routed to the TQMa335xL pads. The drivers have to be integrated on the carrier board. The following table shows the signals used by the CAN interfaces.

Table 22: CAN1 / CAN2 signals

TQMa335xL pad Signal Pad Dir. AM335x ball

H1 DCAN0_RX UART1_RTS# I/O D17

G1 DCAN0_TX UART1_CTS# I/O D18

K1 DCAN1_RX UART0_RTS# I/O E17

J1 DCAN1_TX UART0_CTS# I/O E18

3.2.4.12 I2C

The AM335x provides three I

C interfaces. I2C0 and I2C1 are routed to the TQMa335xL pads and are available as a primary function. The following table shows the signals used by the I2C buses.

Table 23: I2C0 and I2C1 signals

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

C1 I2C0_SCL I2C0_SCL I/O C16 3.3 kΩ PU to 3.3 V on TQMa335xL

D1 I2C0_SDA I2C0_SDA I/O C17 3.3 kΩ PU to 3.3 V on TQMa335xL

F1 I2C1_SCL UART1_TXD I/O D15 –

E1 I2C1_SDA UART1_RXD I/O D16 –

The I2C0 bus is also used for the PMIC on the TQMa335xL. It has the following I

C addresses:

Table 24: I2C0 addresses

Function Device Address

PMIC TPS65910

0x12 / 0b001 0010

If more devices have to be connected to the I2C0 bus on the carrier board, the maximum capacitive bus load accordingly to the

C standard has to be adhered to. If required additional pull-ups should be provided on the carrier board at the bus.

3.2.4.13 I2S / AUDMUX

The Multichannel Audio Serial Port 0 (MCASP0) is routed to the TQMa335xL pads to connect an audio-codec via I

The following table shows the signals used by the AUD3 interface.

Table 25: MCASP0 signals

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

C16 MCASP0_ACLKR MCASP0_ACLKR I/O B12 –

C15 MCASP0_ACLKX MCASP0_ACLKX I/O A13 –

B17 MCASP0_FSX MCASP0_FSX I/O B13 –

C17 MCASP0_FSR MCASP0_FSR I/O C13 –

B15 MCASP0_AXR3 MCASP0_AXR3 I/O A14 –

A15 MCASP0_AXR2 MCASP0_AXR2 I/O C12 –

B16 MCASP0_AXR1 MCASP0_AXR1 I/O D13 –

A16 MCASP0_AXR0 MCASP0_AXR0 I/O D12 –

The MCASP-Interface supports I2S and other synchronous modes. More information can be found in the AM335x Reference Manual (3).

3.2.4.14 SPI

The AM335x provides two MCSPIs (Multichannel Serial Port Interface). Both interfaces are routed to the TQMa335xL pads. The following table shows the signals used by the SPI0 and SPI1 interfaces.

Table 26: SPI0 and SPI1 signals

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

F14 SPI0_CS0# SPI0_CS0# I/O A16 CS

G14 SPI0_SCLK SPI0_SCLK I/O A17 CLK

J14 SPI0_MOSI SPI0_D1 I/O B16 MOSI

H14 SPI0_MISO SPI0_D0 I/O B17 MISO

N15 SPI1_CS0# RMII1_REF_CLK I/O H18 –

P14 SPI1_SCLK MII1_COL I/O H16 –

N14 SPI1_MOSI MII1_CRS I/O H17 SPI1_D0

M14 SPI1_MISO MII1_RX_ER I/O J15 SPI1_D1

Note: SPI0 as boot device

SPI0 can be configured as boot device. An SPI NOR flash can be assembled on the carrier board.

AM335x

LGA pads

UART0_TX UART0_RX

UART0_RTS#

UART0_CTS#

335x LGA pads

UART3_TX UART3_RX

3.2.4.15 UART

The AM335x provides five UART interfaces. UART0, UART3 and UART4 are routed to the TQMa335xL pads as primary functions. In the BSP provided by TQ-Systems GmbH

3.2.4.16 UART0

The UART0 interface also provides handshake signals.

Illustration 6: Block diagram UART0 interface

The following table shows the signals used by the UART0 interface.

Table 27: UART0 signals

UART4 is the serial console on the MBa335x.

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

M1 UART0_RXD UART0_RXD I/O E15 –

L1 UART0_TXD UART0_TXD I/O E16 –

K1 DCAN1_RX UART0_RTS# I/O E17 Muxed as DCAN1_RX in TQ-BSP

J1 DCAN1_TX UART0_CTS# I/O E18 Muxed as DCAN1_TX in TQ-BSP

UART0_CTS# and UART0_RTS# are only available if DCAN1 is not used.

3.2.4.17 UART3

The UART3 interface does not provide handshake signals. The UART3 signals are multiplexed with MMC0_CD# and MMC0_WP#.

Illustration 7: Block diagram UART3 interface

The following table shows the signals used by the UART3 interface.

Table 28: UART3 signals

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

K2 UART3_RXD SPI0_CS1# I/O C15 MMC0_CD#

J2 UART3_TXD ECAP0_IN_PWM0_OUT I/O C18 MMC0_WP#

335

LGA pads

UART4_TX UART4_RX

3.2.4.18 UART4

The UART4 interface does not provide handshake signals.

Illustration 8: Block diagram UART4 interface

The following table shows the signals used by the UART4 interface.

Table 29: UART4 signals

TQMa335xL pad Signal Pad Dir. AM335x ball

P15 UART4_RXD GPMC_WAIT0 I/O T17

R15 UART4_TXD GPMC_WP# I/O U17

3.2.4.19 USB

The AM335x provides two USB OTG cores with integrated High Speed PHYs. All signals are routed to the TQMa335xL pads as primary functions. The following table shows the signals used by the USB_H1 interface.

Table 30: USB_H1 signals

TQMa335xL pad Signal Pad Dir. AM335x ball

G16 USB0_CE USB0_CE A M15

G17 USB0_DM USB0_DM A N18

H17 USB0_DP USB0_DP A N17

J16 USB0_DRVBUS USB0_DRVBUS I/O F16

H16 USB0_ID USB0_ID A P16

J17 USB0_VBUS USB0_VBUS A P15

R16 USB1_CE USB1_CE A P18

P17 USB1_DM USB1_DM A R18

R17 USB1_DP USB1_DP A R17

U16 USB1_DRVBUS USB1_DRVBUS I/O F15

T16 USB1_ID USB1_ID A P17

T17 USB1_VBUS USB1_VBUS A T18

3.2.4.20 EXTINT#

The signal EXTINT# of the AM335x is routed to TQMa335xL pad A12.

Table 31: EXTINT# signal

TQMa335xL pad Signal Pad Dir. AM335x ball Remark

A12 EXTINT# (NMI#) EXTINT# I B18 Routed to NMI# of AM335x

PWRON

LGA pads

PMIC

PWRON

PWRONRST_

IN#

PWRONRST_OUT#

WARMRST#

10 kΩ

NRESPWRON

PMIC

AM335x

10 kΩ

Supervisor

PWRONRST#

WARMRST#

VCC3V3

• Reset input PWRONRST (Power-On Reset) of the AM335x

• Low-active signal

• Reset output RESETBMCU of the PMIC

Low-active signal

Warm-Reset# of the AM335x

Low-active signal

3.2.4.21 Clockout

The AM335x provides two Clockout signals, which are routed to the TQMa335xL pads. The following table shows the signals used for Clockout.

Table 32: Clockout signals

TQMa335xL pad Signal Pad Dir. AM335x ball

D17 Clkout1 XDMA_EVENT_INTR0 I/O A15 D15 TCLKIN / Clkout2 XDMA_EVENT_INTR1 I/O D14

3.2.5 Reset

The TQMa335xL provides Reset inputs, and Reset outputs at the TQMa335xL pads. The following block diagram shows the reset signals.

Illustration 9: Block diagram Reset

The following table describes the reset signals, which are routed to the TQMa335xL pads.

Table 33: Reset signals

TQMa335xL pad Signal name Dir. Remark

D2 PWRONRST_IN# I

E2 PWRONRST_OUT# O

D7 WARMRST# O

The reset output of the supervisor used on the TQMa335xL can be connected to the POR_B input of the AM335x as a placement option.

• Generates Cold-Reset at the AM335x

• Connect to open-drain output only!

• Can be used to reset external periphery

• Open drain, requires Pull-Up on carrier board (max. 3.3 V)

•

• 10 kΩ PU to 3.3 V on the TQMa335xL

•

LGA pads

PMIC

3.3 V

CPU

VCC2

VCC

VCCn

Module

components

3.2.6 WDOG

The AM335x provides a Watchdog Timer. If the Watchdog-Timer is active and not reset within the specified time, a reset is signalled to the PRCM. The PRCM then triggers a Warm-Reset. More information can be found in the AM335x Reference Manual (3).

3.2.7 Power supply

3.2.7.1 Main power supply

The input voltage for the TQMa335xL is 3.3 V ±3 %. All I/O voltages have a fixed supply voltage of 3.3 V.

Illustration 10: Block diagram power supply

3.2.7.2 Overview TQMa335xL supply

The given current consumption has to be seen as an approximate value. To estimate the power consumption of the system, the Texas Instruments Application Note AM335x Power Consumption

Summary should be taken note of, as the current consumption of the TQMa335xL strongly depends on the application,

the mode of operation and the operating system. The following table shows some technical parameters of the TQMa335xL supply and power consumption.

Table 34: Parameter TQMa335xL supply

Parameter Value typ. Remark

Supply voltage VIN 3.3 V ±3 % for TQMa335xL without extended voltage supervision

Supply voltage VIN 3.3 V ±2 % for TQMa335xL with extended voltage supervision

Power consumption Linux (idle) ~ 1.2 W AM335x 800 MHz / BSP without power management

Power consumption Linux (100 %) ~ 1.8 W AM335x 800 MHz / BSP without power management

Power consumption standby ~ 210 mW AM335x 800 MHz / BSP without power management

Switch

TQMa335x

VCC3V3

VDDSHV

3.3 V components on carrier board

3.3 V DC/DC

on carrier board

3.2.7.3 Adaptive Voltage Scaling (AVS)

The combination of AM335x and PMIC TPS65910A31 supports Adaptive Voltage Scaling (AVS) based on Smart Reflex. The function is very limited due to several errata!

3.2.7.4 Voltage supervision

The TQMa335xL is available with several voltage supervision options.

On the primarily manufactured version of the TQMa335xL a MAX803 with a trigger level of 3.08 V monitors the supply voltage. Below 3.08 V a PORESET# is triggered at the AM335x.

On a second version of the TQMa335xL all voltages, except the DVS-capable voltages VDDS_MPU and VDDS_CORE are monitored. If one of these voltages falls below the permitted level a PORESET# is triggered at the AM335x.

On a third version of the TQMa335xL undervoltage and overvoltage of the supply voltages are monitored. If one of these voltages fall below or exceed the permitted level a PORESET# is triggered at the AM335x.

3.2.7.5 TQMa335xL / carrier board Power-Up sequence

Since the AM335x is very sensitive to cross-supply it has to be ensured that the components on the carrier board are not supplied by the I/O-voltages (VDDSHV) during power-up.

With the procedure described above it is certified that the pull-ups on the carrier board are already supplied with voltage when the boot-configuration pins are read.

Attention: Power-Up sequence

Illustration 11: Block diagram power supply carrier board

To avoid cross-supply and errors in the power-up sequence, no I/O pins may be driven by external components until the power-up sequence has been completed.

The end of the power-up sequence is indicated by a high level of signal VDDSHV.

• Is in SLEEP MODE

CLKOUT has to be activated (SLEEP_KEEP_RES:ON)

3.2.8 Power-Modes

The following modes are supported by the hardware in combination of AM335x with PMIC, RTC and supply.

3.2.8.1 RTC backup

In this mode the controller is switched off. Only the RTC is buffered by the battery. Wakeup features are not available.

Table 35: PMIC RTC

RTC in PMIC Remark

PMIC Is in backup mode

BBCHEN=0 Battery charging has to be deactivated

Supply VCC_MAIN <2.5 V; VBACKUP = 2.3 V to 3.0 V

VDDS_RTC When supplied via LDO: Supply off

Current consumption Approximately 20 µA

3.2.8.2 AM335x DEEP-SLEEP0-2, Standby

In this mode the following wakeup sources of the AM335x are supported.

• GPIO0

• Dmtimer1_1ms

• Both USB

• Touchscreen and ADC monitor functions

• UART0

• I2C0

Table 36: AM335x DEEP-SLEEP0-2, Standby

Conditions Remark

PMIC

• Switch on voltages: (SLEEP_KEEP_LDO_ON, SLEEP_KEEP_RES_ON)

•

Supply VCC_MAIN = 3.3 V

PMIC_POWER_EN Connected with PWRHOLD

VDDS_RTC Supplied by PMIC

3.2.8.3 AM335x Active Mode

The default mode of operation is the Active Mode.

Table 37: AM335x Active Mode

Conditions Remark

PMIC Is in Active Mode

Supply VCC_MAIN = 3.3 V

PMIC_POWER_EN Connected with PWRHOLD

VDDS_RTC Supplied by PMIC

3.3

TQMa335xL interface

top view through TQMa335xL

A B C D E F G H J K L M N P R T

3.3.1 Pin assignment

The multiple pin configurations of all AM335x-internal function units must be taken note of. The pin assignment shown in Table 38 refers to the corresponding BSP provided by TQ-Systems GmbH. The electrical and pin characteristics are to be taken from the AM335x (1), (3) and PMIC Data Sheet (6).

3.3.2 Pinout TQMa335xL

The TQMa335xL has a total of 209 pads. The following table shows the pad-out as top view through the TQMa335xL. (NC: the pad does not exist.)

Table 38: Pinout TQMa335xL,

MCASP0

_FSX

MCASP0

_AXR1

MCASP0

_AXR3

MCASP0

_FSR

MCASP0

_ACLKR

MCASP0

_ACLKX

CLKOUT1

DGND

TCLKIN

MCASP0

_AXR0

MCASP0

_AXR2

MMC0

USB0

_DAT0

MMC0 _DAT1

MMC0 _DAT2

_CLK

DGND

MMC0 _CMD

USB0

_DM

_DP

USB0

_CE

_ID

DGND MDC MDIO

USB0

_VBUS

USB0_

DRVVBUS

RGMII1

_TD2

RGMII1

_TD3

RGMII1

_TCLK

RGMII1

_TD0

RGMII1

_TD1

RGMII1

_TCTL

RGMII1

_RD2

RGMII1

_RD3

RGMII1

_RCLK

RGMII1

_RD0

RGMII1

_RD1

SPI1_CS0

USB1

_DM

DGND

UART4

_RXD

USB1

_DP

USB1

_CE

UART4

_TXD

USB1

_VBUS

USB1

_ID

RGMII2

_RD1

USB1_

DRVVBUS

RGMII2

_RD0

VDDSHV

PWRON

EXTINT# DGND DGND

VDD-PLL DGND DGND DGND NC NC NC NC NC NC NC NC NC

VDD-

DGND DGND

USB

PMIC_

VDDS-

INT1

CORE

DGND DGND

VCC

3V3IN

VCC

3V3IN

VCC

3V3IN

DGND DGND

AIN6 AIN7 DGND TCK DGND NC NC NC NC NC NC NC DGND

AIN4 AIN5 T DI TDO EMU0

VDDS-

RTC

VCC

VBACKUP

3V3IN

_PMIC

VCC

DGND DGND NC NC NC NC NC NC NC NC NC

3V3IN

VCC

VDDS-

3V3IN

DDR

EXT_

WAKEUP

MMC0

SPI0_

DDR_ DQS0

SPI0_

D1_MOSI

DGND

_DAT3

VDDS-

DGND NC DGND NC NC NC NC NC NC

MPU

PMIC_ SLEEP

VDDS NC NC NC NC NC NC NC NC NC

VDDA-

ADC

WARM

RST#

DGND NC NC NC NC NC NC NC NC NC

CS0

SCLK

D0_MISO

NC NC NC NC NC NC NC NC NC DGND

NC NC NC NC NC NC NC NC NC

NC NC NC NC NC NC NC NC DGND

DDR_

DQS#0

DGND

DDR_ DQ15

RGMII1

_RCTL

MMC1_

DAT2

SPI1_

MMC1_

DAT5

SPI1_

DGND

SPI1_ SCLK

RGMII2

_RCLK

LCD_

DATA23

LCD_

DATA19

LCD_

DATA15

LCD_

DATA11

LCD_

DATA7

LCD_

DATA3

LCD_

HSYNC

LCD_

VSYNC

RGMII2

_RD3

RGMII2

_TD1

RGMII2

_TD3

LCD_

DATA21

LCD_

DATA17

LCD_

DATA13

LCD_

DATA9

LCD_

DATA5

LCD_

DATA1

LCD_ AS_ BIAS_EN

RGMII2

_RD2

RGMII2

_TD0

RGMII2

_TD2

LCD_

DATA20

LCD_

DATA16

LCD_

DATA12

LCD_

DATA8

LCD_

DATA4

LCD_

DATA0

LCD_ PCLK

_RTCL

RGMII2

_TCTL

RGMII2

_TCLK

LCD_

DATA22

LCD_

DATA18

LCD_

DATA14

LCD_

DATA10

LCD_

DATA6

LCD_

DATA2

LCD_

M_CLK

DGND DGND DGND

DDR_

MMC1_

AIN2 AIN3 TMS TRST# EMU1

PWRON

AIN0 AIN1 DGND

NC DGND

I2C0_

SCL

RST_IN#

I2C0_

SDA

PWRON

RST_OUT#

I2C1_

SDA

CK#

DQ7

DGND DGND DGND

I2C1_

DCAN0

_TX

DCAN0

_RX

SCL

DQS1

UART3

_TXD

DCAN1

_TX

DQS#1

UART3

_RXD

DCAN1

_RX

DAT1

MMC1_

DAT0

UART0

_TXD

DAT4

MMC1_

DAT3

UART0

_RXD

DATA7

MMC1_

DATA6

DGND

MMC1_

CMD

GPIO1

_29

TIMER7 TIMER6

GPIO2

CLK

DGND DGND TIMER5 TIMER4

GPIO1

_28

A10

DGND – P

–

A11

VDD-PLL_TEST

Test voltage O –

A12

EXTINT# (NMI#)

EXTINT# I B18

A13

PMIC_PWRON

TPS65910A31 Pin PWRON

–

A14

VDDSHV

Test voltage O –

A15

MCASP0_AXR2

I/O

C12

A16

MCASP0_AXR0

I/O

D12

AIN0

AIN0 A B6

AIN2

AIN2 A B7

AIN4

AIN4 A C8

AIN6

AIN6 A A8

DGND – P – A7

VCC3V3 – P – A8

VCC3V3 – P – A9

VCC3V3 – P – B1

DGND – P – B10

DGND – P – B11

DGND – P – B12

DGND – P

–

B13

PMIC_INT1

TPS65910A31 Pin INT1

–

B14

VDD-USB_TEST

Test voltage O –

B15

MCASP0_AXR3

I/O

A14

B16

MCASP0_AXR1

I/O

D13

B17

MCASP0_FSX

I/O

B13

AIN1

AIN1 A C7

AIN3

AIN3 A A7

AIN5

AIN5 A B8

AIN7

AIN7 A C9

DGND – P – B7

VCC3V3 – P – B8

VCC3V3 – P – B9

VCC3V3 – P – C1

I2C0_SCL

I/O

C16

C10

VDDS-RTC_TEST

Test voltage O –

C11

DGND – P – C12

DGND – P – C13

VDDS-CORE_TEST

Test voltage O –

C14

DGND – P – C15

MCASP0 ACLKX

I/O

A13

C16

MCASP0 ACLKR

I/O

B12

C17

MCASP0_FSR

I/O

C13

DGND – P

–

TMS

TMS I C11

TDI

TDI I B11

DGND – P

–

EXT_WAKEUP

VDDS-DDR_TEST

Test voltage O –

DGND – P

–

VBACKUP_PMIC

Backup Voltage for PMIC

–

3.3.2 Pinout TQMa335xL (continued)

Table 39: TQMa335xL pad description

TQMa335xL ball Signal Pad name I/O AM335x ball

I2C0_SDA

I/O

C17

D10

VDDS_TEST

Test voltage

–

D11

DGND – P – D12

PMIC_SLEEP

TPS65910A31 Pin SLEEP

–

D13

VDDS-MPU_TEST

Test voltage

–

D14

DGND – P – D15

TCLKIN

XDMA_EVENT_INTR1

I/O

D14

D16

DGND – P – D17

CLKOUT1

XDMA_EVENT_INTR0

I/O

A15

PWRONRST_IN#

PWRONRST# Input to Modul

I – D3

TRST#

TRST# I B10

TDO

TDO O A11

TCK

TCK I A12

DGND – P

–

WARMRST#

I/O

A10

DGND – P – D9

VDDA-ADC_TEST

Test voltage

O – E1

I2C1_SDA

UART1_RXD

I/O

D16

E13

DGND – – – E14

MMC0_DAT3

I/O

F17

E15

MMC0_DAT2

I/O

F18

E16

MMC0_DAT1

I/O

G15

E17

MMC0_DAT0

I/O

G16

PWRONRST_OUT#

PWRONRST# Output from Modul

–

EMU1

B14

EMU0

C14

DGND – P

–

I2C1_SCL

UART1_TXD

I/O

D15

F14

SPI0_CS0

I/O

A16

F15

MMC0_CMD

I/O

G18

F16

DGND – P – F17

MMC0_CLK

I/O

G17

DGND – P – F3

DDR_CK#

Test-Pin do not connect on Mainboard

– – F4

DDR_A0

Test-Pin do not connect on Mainboard

– – G1

DCAN0_TX

UART1_CTS#

I/O

D18

G13

DGND – P – G14

SPI0_SCLK

I/O

A17

G15

DGND – P

–

G16

USB0_CE

USB0_CE A M15

G17

USB0_DM

USB0_DM A N18

DGND – P

–

DDR_CK

Test-Pin do not connect on Mainboard

–

DDR_DQS0

Test-Pin do not connect on Mainboard

– – H1

DCAN0_RX

UART1_RTS#

I/O

D17

H14

SPI0_D0

I/O

B17

H15

MDC

I/O

M18

H16

USB0_ID

USB0_ID A P16

H17

USB0_DP

USB0_DP A N17

– – P – H3

DDR_DQ_7

Test-Pin do not connect on Mainboard

– – H4

DDR_DQS0#

Test-Pin do not connect on Mainboard

–

3.3.2 Pinout TQMa335xL (continued)

Table 39: TQMa335xL pad description (continued)

TQMa335xL ball Signal Pad name I/O AM335x ball

DCAN1_TX

UART0_CTS#

I/O

E18

J14

SPI0_D1

I/O

B16

J15

MDIO

I/O

M17

J16

USB0_DRVBUS

F16

J17

USB0_VBUS

P15

UART3_TXD

ECAP0_IN_PWM0_OUT

I/O

C18

DDR_DQS1#

Test-Pin do not connect on Mainboard

– – J4

DGND – P – K1

DCAN1_RX

UART0_RTS#

I/O

E17

K14

DGND – P – K15

RGMII1_TCLK

MMI1_TX_CLK

I/O

K18

K16

RGMII1_TD3

MMI1_TXD3

I/O

J18

K17

RGMII1_TD2

MMI1_TXD2

I/O

K15

UART3_RXD

SPI0_CS1

I/O

C15

DDR_DQS1

Test-Pin do not connect on Mainboard

– – K4

DDR_DQ15

Test-Pin do not connect on Mainboard

– – L1

UART0_TXD

I/O

E16

L15

RGMII1_TCTL

MMI1_TX_EN

I/O

J16

L16

RGMII1_TD1

MMI1_TXD1

I/O

K16

L17

RGMII1_TD0

MMI1_TXD0

I/O

K17

MMC1_DAT0

GPMC_AD0

I/O

MMC1_DAT1

GPMC_AD1

I/O

MMC1_DAT2

GPMC_AD2

I/O

UART0_RXD

I/O

E15

M14

SPI1_D1

MII1_RX_ER

I/O

J15

M15

RGMII1_RCLK

MMI1_RX_CLK

I/O

L18

M16

RGMII1_RD3

MMI1_RXD3

I/O

L17

M17

RGMII1_RD2

MMI1_RXD2

I/O

L16

MMC1_DAT3

GPMC_AD3

I/O

MMC1_DAT4

GPMC_AD4

I/O

MMC1_DAT5

GPMC_AD5

I/O

DGND – P – N14

SPI1_D0

MII1_CRS

I/O

H17

N15

SPI1_CS0

RMII1_REF_CLK

I/O

H18

N16

RGMII1_RD1

MMI1_RXD1

I/O

L15

N17

RGMII1_RD0

MMI1_RXD0

I/O

M16

MMC1_DAT6

GPMC_AD6

I/O

MMC1_DAT7

GPMC_AD7

I/O

DGND – P

–

DGND – P

–

DGND – P – P1

GPIO1_28

GPMC_BE#1

I/O

U18

P10

LCD_DATA19

GPMC_AD12

I/O

T12

P11

LCD_DATA23

GPMC_AD8

I/O

U10

P12

DGND – P

–

P13

RGMII2_RCLK

GPMC_A7

I/O

T15

P14

SPI1_SCLK

MII1_COL

I/O

H16

P15

UART4_RXD

GPMC_WAIT0

I/O

T17

P16

DGND – P

–

P17

USB1_DM

USB1_DM A R18

DGND – P – P3

MMC1_CLK

GPMC_CS#1

I/O

3.3.2 Pinout TQMa335xL (continued)

Table 39: TQMa335xL pad description (continued)

TQMa335xL ball Signal Pad name I/O AM335x ball

LCD_VSYNC

I/O

LCD_HSYNC

I/O

LCD_DATA3

I/O

LCD_DATA7

I/O

LCD_DATA11

I/O

LCD_DATA15

I/O

GPIO1_29

GPMC_CS#0

I/O

R10

LCD_DATA18

GPMC_AD13

I/O

R12

R11

LCD_DATA22

GPMC_AD9

I/O

T10

R12

RGMII2_TCLK

GPMC_A6

I/O

U15

R13

RGMII2_TCTL

GPMC_A0

I/O

R13

R14

RGMII1_RCTL

MMI1_RX_DV

I/O

J17

R14

RGMII2_RCTL

GPMC_A1

I/O

V14

R15

UART4_TXD

GPMC_WP#

I/O

U17

R16

USB1_CE

USB1_CE A P18

R17

USB1_DP

USB1_DP A R17

DGND – P – R3

MMC1_CMD

GPMC_CS#2

I/O

DGND – P – R5

LCD_MCLK

GPMC_CLK

I/O

V12

LCD_DATA2

I/O

LCD_DATA6

I/O

LCD_DATA10

I/O

LCD_DATA14

I/O

GPIO2_0

GPMC_CS#3

I/O

T13

T10

LCD_DATA17

GPMC_AD14

I/O

V13

T11

LCD_DATA21

GPMC_AD10

I/O

T11

T12

RGMII2_TD3

GPMC_A2

I/O

U14

T13

RGMII2_TD1

GPMC_A4

I/O

R14

T14

RGMII2_RD3

GPMC_A8

I/O

V16

T15

RGMII2_RD1

GPMC_A10

I/O

T16

USB1_ID

USB1_ID A P17

T17

USB1_VBUS

USB1_VBUS A T18

TIMER5

GPMC_BE#0_CLE

I/O

TIMER7

GPMC_OE#_RE#

I/O

DGND – P – T5

LCD_AC_BIAS_EN

I/O

LCD_DATA1

I/O

LCD_DATA5

I/O

LCD_DATA9

I/O

LCD_DATA13

I/O

U10

LCD_DATA16

GPMC_AD15

I/O

U13

U11

LCD_DATA20

GPMC_AD11

I/O

U12

RGMII2_TD2

GPMC_A3

I/O

T14

U13

RGMII2_TD0

GPMC_A5

I/O

V15

U14

RGMII2_RD2

GPMC_A9

I/O

U16

U15

RGMII2_RD0

GPMC_A11

I/O

V17

U16

USB1_DRVBUS

F15

TIMER4

GPMC_ADV#_ALE

I/O

TIMER6

GPMC_WE#

I/O

DGND – P – U5

LCD_PCLK

I/O

LCD_DATA0

I/O

LCD_DATA4

I/O

LCD_DATA8

I/O

LCD_DATA12

I/O

3.3.2 Pinout TQMa335xL (continued)

Table 39: TQMa335xL pad description (continued)

TQMa335xL ball Signal Pad name I/O AM335x ball

SOFTWARE

MECHANICS

5.1

TQMa335xL dimensions and footprint

Top view through TQMa335xL

op view through TQMa335xL

The TQMa335xL comes with a preinstalled boot loader U-Boot and a BSP tailored for the MBa335x. More information can be found in the Support Wiki for the TQMa335x.

The overall dimensions (length × width) of the TQMa335xL are 38 × 38 mm2. The maximum height of the TQMa335xL above the carrier board is approximately 3.3 mm.

Illustration 12: TQMa335xL dimensions (1)

Illustration 14: TQMa335xL side view

Illustration 13: TQMa335xL dimensions (2)

Illustration 15: Recommended PCB land pattern for TQMa335xL, t

5.2

TQMa335xL 3D views

5.3

TQMa335xL component placement

Illustration 16: TQMa335xL top view (3D) Illustration 17: TQMa335xL bottom view (3D)

Illustration 18: TQMa335xL component placement top Illustration 19: TQMa335xL component placement bottom

The labels on the TQMa335xL show the following information:

Table 40: Labels on TQMa335xL

Label Text

AK1 TQMa335xL 2D serial number

AK2 TQMa335xL version and revision

AK3 TQMa335xL tests performed

5.4

Protection against external effects

5.5

Thermal management

5.6

Structural requirements

SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS

6.1

EMC

6.2

ESD

6.3

Operational safety and personal security

As an embedded module the TQMa335xL is not protected against dust, external impact and contact (IP00). Adequate protection has to be guaranteed by the surrounding system.

To cool the TQMa335xL, a maximum of 2 W have to be dissipated. The power dissipation originates primarily in the AM335x and the DDR3L SDRAM. The power dissipation mainly depends on the software used and can vary according to the application. It is the customer’s responsibility to define a suitable cooling method for his use case. In most cases passive cooling should be sufficient. For further information see Texas Instruments Application Notes (4), (5).

Attention: Destruction or malfunction, TQMa335xL cooling

The TQMa335xL has to be soldered on the carrier board. Please contact TQ-Support for soldering instructions (10).

The AM335x belongs to a performance category in which a cooling system is essential. It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)

depending on the specific mode of operation (e.g., dependence on clock frequency, stack height, airflow, and software).

Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad, heatsink) as well as the maximum pressure on the AM335x must be taken into consideration when connecting the heat sink, see (5). The AM335x is not necessarily the highest component.

Inadequate cooling connections can lead to overheating of the TQMa335xL and thus malfunction, deterioration or destruction.

The TQMa335xL was developed according to the requirements of electromagnetic compatibility (EMC). Depending on the target system, anti-interference measures may still be necessary to guarantee the adherence to the limits for the overall system.

Following measures are recommended:

In order to avoid interspersion on the signal path from the input to the protection circuit in the system, the protection against electrostatic discharge should be arranged directly at the inputs of a system. As these measures always have to be implemented on the carrier board, no special preventive measures were planned on the TQMa335xL.

Following measures are recommended for a carrier board:

• Robust ground planes (adequate ground planes) on the printed circuit board

• A sufficient number of blocking capacitors in all supply voltages

• Fast or permanent clocked lines (e.g., clock) should be kept short; avoid interference of other signals by distance and/or

shielding besides, take note of not only the frequency, but also the signal rise times

• Filtering of all signals, which can be connected externally (also "slow signals" and DC can radiate RF indirectly)

• Generally applicable: Shielding of the inputs (shielding connected well to ground / housing on both ends)

• Supply voltages: Protection by suppressor diode(s)

• Slow signal lines: RC filtering, Zener diode(s)

• Fast signal lines: Integrated protective devices (e.g., suppressor diode arrays)

Due to the occurring voltages (≤3.3 V DC), tests with respect to the operational and personal safety haven’t been carried out.

6.4

Climatic and operational conditions

6.5

Reliability and service life

The temperature range, in which the TQMa335xL works reliably, strongly depends on the installation situation (heat dissipation by heat conduction and convection); hence, no fixed value can be given for the whole assembly.

In general, a reliable operation is given when following conditions are met:

Table 41: Climate and operational conditions extended temperature range –25 °C to +85 °C

Parameter Range Remark

Chip temperature AM335x –40 °C to +95 °C Tj = +105 °C

Environmental temperature AM335x –40 °C to +85 °C –

Chip temperature PMIC –40 °C to +125 °C Tj = +150 °C

Environmental temperature PMIC –40 °C to +85 °C –

Case temperature DDR3L SDRAM –40 °C to +95 °C –

Case temperature other ICs –25 °C to +85 °C –

Permitted storage temperature TQMa335xL –40 °C to +85 °C –

Relative humidity (operating / storage) 10 % to 90 % Not condensing

Table 42: Climate and operational conditions industrial temperature range –40 °C to +85 °C

Parameter Range Remark

Chip temperature AM335x –40 °C to +95 °C Tj = +105 °C

Environmental temperature AM335x –40 °C to +85 °C –

Chip temperature PMIC –40 °C to +125 °C Tj = +150 °C

Environmental temperature PMIC –40 °C to +85 °C –

Case temperature DDR3L SDRAM –40 °C to +95 °C –

Case temperature other ICs –40 °C to +85 °C –

Permitted storage temperature TQMa335xL –40 °C to +85 °C –

Relative humidity (operating / storage) 10 % to 90 % Not condensing

Detailed information concerning the thermal characteristics of the AM335x is to be taken from the Texas Instruments Data Sheets (1), (3), and (5).

No detailed MTBF calculation has been done for the TQMa335xL. Detailed information concerning the service life of the AM335x under different operational conditions is to be taken from the

Texas Instruments Data Sheets (1), (3), and (5).

6.6

Environment protection

6.7

REACH®

6.8

EuP

6.9

Battery

6.10

Packaging

6.11

Other entries

6.6.1 RoHS

The TQMa335xL is manufactured RoHS compliant.

• All components and assemblies are RoHS compliant

• The soldering processes are RoHS compliant

6.6.2 WEEE

The final distributor is responsible for compliance with the WEEE

regulation.

Within the scope of the technical possibilities, the TQMa335xL was designed to be recyclable and easy to repair.

The EU-chemical regulation 1907/2006 (REACH® regulation) stands for registration, evaluation, certification and restriction of substances SVHC (Substances of very high concern, e.g., carcinogen, mutagen and/or persistent, bio accumulative and toxic). Within the scope of this juridical liability, TQ-Systems GmbH meets the information duty within the supply chain with regard to the SVHC substances, insofar as suppliers inform TQ-Systems GmbH accordingly.

The Ecodesign Directive, also Energy using Products (EuP), is applicable to products for the end user with an annual quantity >200,000. The TQMa335xL must therefore always be seen in conjunction with the complete device.

The available standby and sleep modes of the components on the TQMa335xL enable compliance with EuP requirements for the TQMa335xL.

No batteries are used on the TQMa335xL.

By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment. To be able to reuse the TQMa335xL, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled. The energy consumption of this subassembly is minimised by suitable measures. The TQMa335xL is delivered in reusable packaging.

The energy consumption of this subassembly is minimised by suitable measures. Because currently there is still no technical equivalent alternative for printed circuit boards with bromine-containing flame

protection (FR-4 material), such printed circuit boards are still used. No use of PCB containing capacitors and transformers (polychlorinated biphenyls). These points are an essential part of the following laws:

• The law to encourage the circular flow economy and assurance of the environmentally acceptable removal of waste as at 27.9.94 (Source of information: BGBl I 1994, 2705)

• Regulation with respect to the utilization and proof of removal as at 1.9.96 (Source of information: BGBl I 1996, 1382, (1997, 2860))

• Regulation with respect to the avoidance and utilization of packaging waste as at 21.8.98 (Source of information: BGBl I 1998, 2379)

• Regulation with respect to the European Waste Directory as at 1.12.01 (Source of information: BGBl I 2001, 3379)

This information is to be seen as notes. Tests or certifications were not carried out in this respect.

APPENDIX

7.1

Acronyms and definitions

The following acronyms and abbreviations are used in this document:

ADC Analog/Digital Converter

AIN Analog In

ARM® Advanced RISC Machine

AVS Adaptive Voltage Scaling

BIOS Basic Input/Output System

BSP Board Support Package

CAN Controller Area Network

DC Direct Current

DDR3L Double Data Rate Type three Low voltage

DIN Deutsche Industrie Norm

DVS Dynamic Voltage Scaling

EEPROM Electrically Erasable Programmable Read-only Memory

EMC Electro-Magnetic Compatibility

eMMC embedded Multi-Media Card

EN Europäische Norm

ESD Electro-Static Discharge

EU European Union

EuP Energy using Products

FR-4 Flame Retardant 4

GMII Gigabit Media Independent Interface

GPIO General Purpose Input/Output

GPMC General Purpose Memory Controller

I2C Inter-Integrated Circuit

I2S Inter-Integrated Sound

IP Ingress Protection

JTAG Joint Test Action Group

LCD Liquid Crystal Display

MAC Media Access Control

MCASP Multichannel Audio Serial Port

MCSPI Multichannel Serial Port Interface

MD Management Data

MII Media-Independent Interface

MMC Multi-Media Card

MTBF Mean operating Time Between Failures

Table 43: Acronyms

Acronym Meaning

7.1 Acronyms and definitions (continued)

Table 43: Acronyms (continued)

Acronym Meaning

n.a. Not Available

NC Not Connected

PCB Printed Circuit Board

PCMCIA People Can’t Memorize Computer Industry Acronyms

PD Pull-Down

PHY Physical (layer of the OSI model)

PMIC Power Management Integrated Circuit

PRCM Power and Clock Management

PU Pull-Up

PWM Pulse-Width Modulation

RC Resistor-Capacitor

REACH® Registration, Evaluation, Authorisation (and restriction of) Chemicals

RF Radio Frequency

RFU Reserved for Future Usage

RGB Red Green Blue

RGMII Reduced Gigabit Media Independent Interface

RMII Reduced Media Independent Interface

RoHS Restriction of (the use of certain) Hazardous Substances

ROM Read-Only Memory

RTC Real-Time Clock

SD Secure Digital

SDIO Secure Digital Input Output

SDRAM Synchronous Dynamic Random Access Memory

SPI Serial Peripheral Interface

UART Universal Asynchronous Receiver/Transmitter

UM User's Manual

USB Universal Serial Bus

WEEE® Waste Electrical and Electronic Equipment

WP Write-Protection

WXGA Wide Extended Graphics Array

7.2

References

Table 44: Further applicable documents

No. Name Rev. / Date Company

(1) Sitara™ AM335x ARM® Cortex®-A8 Microprocessors (MPUs) Data Sheet G / June 2014 Texas Instruments

(2) Pinmux Utility for ARM® MPU Processors Feb. 2013 Texas Instruments

(3) AM335x ARM® Cortex®-A8 Microprocessors Technical Reference Manual K / June 2014 Texas Instruments

(4) AM335x Power Consumption Summary May 2013 Texas Instruments

(5) AM335x Thermal Considerations Apr. 2013 Texas Instruments

(6) TPS65910Ax PMIC October 2014 Texas Instruments

(7) Sitara™ AM335x ARM® Cortex®-A8 Silicon Errata E / Apr. 2013 Texas Instruments

(8) MBa335x User’s Manual – current – TQ-Systems

(9) Support-Wiki for the TQMa335x – current – TQ-Systems

(10) Processing instructions for TQMa335xL – current – TQ-Systems

TQ-Systems GmbH

Mühlstraße 2 l Gut Delling l 82229 Seefeld

Info@TQ-Group | TQ-Group

TQ TQMa335xL User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

ABOUT THIS MANUAL

Copyright and license expenses

Registered trademarks

Disclaimer

Imprint

Tips on safety

Symbols and typographic conventions

Handling and ESD tips

Naming of signals

Further applicable documents / presumed knowledge

BRIEF DESCRIPTION

Key functions and characteristics

Available interfaces

ELECTRONICS

System overview

3.1.1 System architecture / block diagram

3.1.2 Functionality

3.1.3 Pin multiplexing

System components

3.2.1 AM335x processor

3.2.1.1 AM335x derivatives

3.2.1.2 Boot modes

3.2.1.3 Boot configuration

3.2.1.4 Boot interfaces

3.2.1.4.1 Boot device SD card

3.2.1.4.2 Boot device eMMC

3.2.2 Memory

3.2.2.1 DDR3L SDRAM

3.2.2.2 eMMC NAND flash

3.2.3 AM335x-RTC, PMIC-RTC

3.2.4 Interfaces

3.2.4.1 Overview

3.2.4.2 Gigabit Ethernet MAC

3.2.4.3 GPMC / External memory bus

3.2.4.4 MMC / SD card

3.2.4.5 GPIO

3.2.4.6 PWM

3.2.4.7 JTAG / DEBUG

3.2.4.8 Touch and analog inputs

3.2.4.9 LCD controller

3.2.4.10 Serial interfaces

3.2.4.11 CAN

3.2.4.12 I2C

3.2.4.13 I2S / AUDMUX

3.2.4.14 SPI

3.2.4.15 UART

3.2.4.16 UART0

3.2.4.17 UART3

3.2.4.18 UART4

3.2.4.19 USB

3.2.4.20 EXTINT#

3.2.4.21 Clockout

3.2.5 Reset

3.2.6 WDOG

3.2.7 Power supply

3.2.7.1 Main power supply

3.2.7.2 Overview TQMa335xL supply

3.2.7.3 Adaptive Voltage Scaling (AVS)

3.2.7.4 Voltage supervision

3.2.7.5 TQMa335xL / carrier board Power-Up sequence

3.2.8 Power-Modes

3.2.8.1 RTC backup

3.2.8.2 AM335x DEEP-SLEEP0-2, Standby

3.2.8.3 AM335x Active Mode

TQMa335xL interface

3.3.1 Pin assignment

3.3.2 Pinout TQMa335xL

SOFTWARE

MECHANICS

TQMa335xL dimensions and footprint

TQMa335xL 3D views

TQMa335xL component placement

Protection against external effects

Thermal management

Structural requirements

SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS