TOSHIBA TPC8105-H Technical data

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TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (High Speed U−MOSII)
TPC8105-H
TPC8105−H
High Speed and High Efficiency DCDC Converters
Notebook PCs
Portable Equipment Applications
Small footprint due to small and thin package High speed switching Small gate charge : Qg = 32 nC (typ.) Low drainsource ON resistance : RHigh forward transfer admittance : |YLow leakage current : IEnhancementmode : V
Maximum Ratings
Characteristics Symbol Rating Unit
Drain-source voltage
Drain-gate voltage (RGS = 20 kΩ)
Gate-source voltage
Drain current
Drain power dissipation (t = 10 s) (Note 2a)
Drain power dissipation (t = 10 s) (Note 2b)
Single pulse avalanche energy (Note 3)
Avalanche current IAR 7 A
Repetitive avalanche energy (Note 2a) (Note 4)
Channel temperature
Storage temperature range
DC (Note 1) ID 7
Pulse (Note 1) IDP 28
= −10 µA (max) (VDS = 30 V)
DSS
= −0.8~−2.0 V (VDS = −10 V, ID = −1 mA)
th
(Ta = 25°C)
DS (ON)
V
V
V
= 20 m (typ.)
| = 12 S (typ.)
fs
30 V
DSS
30 V
DGR
±20 V
GSS
A
2.4 W
P
D
1.0 W
P
D
63.7 mJ
E
AS
0.24 mJ
E
AR
T
150 °C
ch
T
55 to 150 °C
stg
Unit: mm
JEDEC
JEITA
TOSHIBA 2-6J1B
Weight: 0.080 g (typ.)
Circuit Configuration
Note: For (Note 1), (Note 2), (Note 3) and (Note 4), please refer to the
next page.
This transistor is an electrostatic sensitive device. Please handle with caution.
1
2002-01-18
Thermal Characteristics
Characteristics Symbol Max Unit
TPC8105-H
Thermal resistance, channel to ambient (t = 10 s) (Note 2a)
Thermal resistance, channel to ambient (t = 10 s) (Note 2b)
R
th (ch-a)
R
th (ch-a)
52.1 °C/W
125 °C/W
Marking
(Note 5)
TPC8105 H
Type
Note 1: Please use devices on condition that the channel temperature is below 150°C.
Note 2:
(a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
(a)
(b)
Note 3: V
= 24 V, Tch = 25°C (initial), L = 1.0 mH, RG = 25 Ω, IAR = 7 A
DD
Note 4: Reptitve rating; pulse width limited by maximum channel temperature.
Note 5: on lower left of the marking indicates Pin 1. shows Lot number. (year of manufacture: last decimal digit of the year of manufacture, month of
manufacture: january to december are denoted by letters A to L respectively)
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2002-01-18
TPC8105-H
Electrical Characteristics
(Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Gate leakage current I
Drain cutoff current I
V
Drainsource breakdown voltage
(BR) DSS
V
(BR) DSX
Gate threshold voltage V
R
Drainsource ON resistance
DS (ON)
R
DS (ON)
GSS
DSS
th
VGS = ±16 V, VDS = 0 V — — ±10 µA
VDS = 30 V, VGS = 0 V — — −10 µA
ID = 10 mA, VGS = 0 V 30 — —
ID = 10 mA, VGS = 20 V 15 — —
VDS = 10 V, ID = 1 mA 0.8 — 2.0 V
VGS = 4 V, ID = 3.5 A — 34 60
VGS = 10 V, ID = 3.5 A — 20 40
Forward transfer admittance |Yfs| VDS = 10 V, ID = 3.5 A 5.9 12 — S
Input capacitance C
Reverse transfer capacitance C
Output capacitance C
1440
iss
VDS = 10 V, VGS = 0 V, f = 1 MHz
— 330 —
rss
oss
— 485 —
Rise time tr — 10
Turnon time ton — 18
Switching time
Fall time tf — 50
V
m
pF
ns
Turnoff time t
Total gate charge (Gate−source plus gate−drain)
Gatesource charge Qgs — 23
off
Q
32 —
g
V
24 V, VGS = 10 V, ID = 7 A
DD
Gatedrain (“miller”) charge Qgd
— 140 —
nC
— 8 —
SourceDrain Ratings and Characteristics
Characteristics Symbol Test Condition Min Typ. Max Unit
Drain reverse current
Forward voltage (diode) V
Pulse (Note 1) I
DRP
DSF
IDR = 7 A, VGS = 0 V — — 1.2 V
(Ta = 25°C)
— — −28 A
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2002-01-18
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