查询TPC8105-H供应商
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (High Speed U−MOSII)
TPC8105-H
TPC8105−H
High Speed and High Efficiency DC−DC Converters
Lithium Ion Battery Applications
Notebook PCs
Portable Equipment Applications
Small footprint due to small and thin package
High speed switching
Small gate charge : Qg = 32 nC (typ.)
Low drain−source ON resistance : R
High forward transfer admittance : |Y
Low leakage current : I
Enhancement−mode : V
Maximum Ratings
Characteristics Symbol Rating Unit
Drain-source voltage
Drain-gate voltage (RGS = 20 kΩ)
Gate-source voltage
Drain current
Drain power dissipation (t = 10 s)
(Note 2a)
Drain power dissipation (t = 10 s)
(Note 2b)
Single pulse avalanche energy
(Note 3)
Avalanche current IAR −7 A
Repetitive avalanche energy
(Note 2a) (Note 4)
Channel temperature
Storage temperature range
DC (Note 1) ID −7
Pulse (Note 1) IDP −28
= −10 µA (max) (VDS = −30 V)
DSS
= −0.8~−2.0 V (VDS = −10 V, ID = −1 mA)
th
(Ta = 25°C)
DS (ON)
V
V
V
= 20 mΩ (typ.)
| = 12 S (typ.)
fs
−30 V
DSS
−30 V
DGR
±20 V
GSS
A
2.4 W
P
D
1.0 W
P
D
63.7 mJ
E
AS
0.24 mJ
E
AR
T
150 °C
ch
T
−55 to 150 °C
stg
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 2-6J1B
Weight: 0.080 g (typ.)
Circuit Configuration
Note: For (Note 1), (Note 2), (Note 3) and (Note 4), please refer to the
next page.
This transistor is an electrostatic sensitive device. Please handle with
caution.
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Thermal Characteristics
Characteristics Symbol Max Unit
TPC8105-H
Thermal resistance, channel to ambient
(t = 10 s) (Note 2a)
Thermal resistance, channel to ambient
(t = 10 s) (Note 2b)
R
th (ch-a)
R
th (ch-a)
52.1 °C/W
125 °C/W
Marking
(Note 5)
TPC8105
H
※
Type
Note 1: Please use devices on condition that the channel temperature is below 150°C.
Note 2:
(a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
(a)
(b)
Note 3: V
= −24 V, Tch = 25°C (initial), L = 1.0 mH, RG = 25 Ω, IAR = −7 A
DD
Note 4: Reptitve rating; pulse width limited by maximum channel temperature.
Note 5: ● on lower left of the marking indicates Pin 1.
※ shows Lot number. (year of manufacture: last decimal digit of the year of manufacture, month of
manufacture: january to december are denoted by letters A to L respectively)
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TPC8105-H
Electrical Characteristics
(Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Gate leakage current I
Drain cut−off current I
V
Drain−source breakdown voltage
(BR) DSS
V
(BR) DSX
Gate threshold voltage V
R
Drain−source ON resistance
DS (ON)
R
DS (ON)
GSS
DSS
th
VGS = ±16 V, VDS = 0 V — — ±10 µA
VDS = −30 V, VGS = 0 V — — −10 µA
ID = −10 mA, VGS = 0 V −30 — —
ID = −10 mA, VGS = 20 V −15 — —
VDS = −10 V, ID = −1 mA −0.8 — −2.0 V
VGS = −4 V, ID = −3.5 A — 34 60
VGS = −10 V, ID = −3.5 A — 20 40
Forward transfer admittance |Yfs| VDS = −10 V, ID = −3.5 A 5.9 12 — S
Input capacitance C
Reverse transfer capacitance C
Output capacitance C
— 1440 —
iss
VDS = −10 V, VGS = 0 V, f = 1 MHz
— 330 —
rss
oss
— 485 —
Rise time tr — 10 —
Turn−on time ton — 18 —
Switching time
Fall time tf — 50 —
V
mΩ
pF
ns
Turn−off time t
Total gate charge (Gate−source
plus gate−drain)
Gate−source charge Qgs — 23 —
off
Q
― 32 —
g
V
≈ −24 V, VGS = −10 V, ID = −7 A
DD
Gate−drain (“miller”) charge Qgd
— 140 —
nC
— 8 —
Source−Drain Ratings and Characteristics
Characteristics Symbol Test Condition Min Typ. Max Unit
Drain reverse
current
Forward voltage (diode) V
Pulse (Note 1) I
DRP
DSF
IDR = −7 A, VGS = 0 V — — 1.2 V
(Ta = 25°C)
— — — −28 A
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