TOSHIBA TPC8016-H Technical data

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TPC8016-H
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (High speed U-MOS III)
TPC8016-H
High Speed and High Efficiency DC-DC Converters Notebook PC Applications Portable Equipment Applications
Small footprint due to small and thin package
High speed switching
Small gate charge: Qg = 48 nc (typ.)
Low drain-source ON resistance: R
High forward transfer admittance: |Yfs| = 25 S (typ.)
Low leakage current: I
Enhancement-mode: Vth = 1.1 to 2.3 V (VDS = 10 V, ID = 1 mA)
= 10 µA (max) (VDS = 30 V)
DSS
DS (ON)
= 3.7 mO (typ.)
Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
V
Drain-source voltage Drain-gate voltage (RGS = 20 kΩ) Gate-source voltage
Drain current
Drain power dissipation (t = 10 s) (Note 2a)
Drain power dissipation (t = (Note 2b) Single pulse avalanche energy
Avalanche current IAR 15 A Repetitive avalanche energy
Channel temperature Storage temperature range
Note: For (Note 1), (Note 2), (Note 3) and (Note 4), please refer to the
next page.
DC (Note 1) Pulsed (Note 1)
(Note 3)
(Note 2a) (Note 4)
30 V
DSS
V
30 V
DGR
V
±20 V
GSS
ID 15
IDP 60
PD 1.9 W
PD 1.0 W
EAS 146 mJ
EAR 0.19 mJ
Tch 150 °C
T
55 to 150 °C
stg
A
Unit: mm
JEDEC ? JEITA ? TOSHIBA
Weight: 0.080 g (typ.)
2-6J1B
Circuit Configuration
8
7
This transistor is an electrostatic sensitive device. Please handle with caution.
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2003-07-14
Thermal Characteristics
TPC8016
TPC8016-H
Characteristics Symbol M ax
Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Thermal resistance, channel to ambient (t = 10 s) (Note 2b)
R
th (ch-a)
R
th (ch-a)
65.8 °C /W
125 °C /W
Unit
Marking (Note 5)
Type
H
Note 1: Please use devices on condition that the channel temperature is below 150°C. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b)
Lot No.
25.4 × 25.4 × 0.8
(unit: mm)
FR-4
FR-4
25.4 × 25.4 × 0.8
(unit: mm)
(a)
Note 3: VDD = 24 V, Tch = 25°C (initial), L = 0.5 mH, RG = 25 Ω, IAR = 15 A Note 4: Repetitive rating: pulse width limited by max channel temperature Note 5: • on lower left of the marking indicates Pin 1.
* Weekly code: (Three digits)
Week of manufacture (01 for first week of year, continues up to 52 or 53)
Year of manufacture (One low-order digits of calendar year)
(b)
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Electrical Characteristics (Ta = 25°C)
L
GS
OUT
Characteristics Symbol Test Condition Min Typ. Max Unit
TPC8016-H
Gate leakage current I Drain cut-OFF current I
Drain-source breakdown voltage
VGS = ±16 V, VDS = 0 V ±10 µA
GSS
VDS = 30 V, VGS = 0 V 10 µA
DSS
V
(BR) DSS
V
(BR) DSX
ID = 10 mA, VGS = 0 V 30  ID = 10 mA, VGS = −20 V 15
Gate threshold voltage Vth VDS = 10 V, ID = 1 mA 1.1 2.3 V
Drain-source ON resistance R
DS (ON)
VGS = 4.5 V, ID = 7.5 A 5.5 7.5
VGS = 10 V, ID = 7.5 A 3.7 5.7 Forward transfer admittance |Yfs| VDS = 10 V, ID = 7.5 A 12.5 25 S Input capacitance C Reverse transfer capacitance C Output capacitance C
Rise time tr 9.8
Turn-ON time ton 21
2380 
iss
VDS = 10 V, VGS = 0 V, f = 1 MHz
410
rss
oss
980
10 V
V
0 V
ID = 7.5 A
V
 
Switching time
Fall time tf 15
4.7
= 2 R
VDD15 V
Turn-OFF time t
Total gate charge (gate-source plus gate-drain)
Gate-source charge 1 Q Gate-drain (“miller”) charge Qgd 12.2  Gate switch charge QSW
off
Qg
Duty
1%, tw = 10 µs
VDD24 V, VGS = 10 V, ID = 15 A  46
60
VDD24 V, VGS = 5 V, ID = 15 A 26
7.2
gs1
VDD24 V, VGS = 10 V, ID = 15 A
15.6
Source-Drain Ratings and Characteristics (Ta = 25°C)
V
m
pF
ns
nC
Characteristics Symbol Test Condition Min Typ. Max Unit
Drain reverse current Pulse (Note 1) Forward voltage (diode) V
I
60 A
DRP
IDR = 15 A, VGS = 0 V −1.2
DSF
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V
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