TOSHIBA TLP716F Technical data

TOSHIBA Photocoupler GaAAs IRED & Photo−IC
TLP716F
Plasma display panel
High Speed Interface
Factory Automation
The TOSHIBA TLP716F consists of a GaAAs light emitting diode and a high speed photodetector. This unit is 6-lead SDIP. TLP716F is 50% smaller than 8PIN DIP and has suited the safety standard reinforced insulation class. So, mounting area in safety standard required equipment can be reduced. Absolute maximum ratings and electrical characteristics are the same as the TLP716 technical data sheets.
z Inverter Logic (totempole output) z Package Type : SDIP6 z Guaranteed Performance Over Temperature : 40~100°C z Power Supply Voltage : 4.5~5.5 V z Input Thresholds Current : I z Propagation delay Time (t
FHL=6.5 mA(max.)
pHL/ tpLH) : 75 ns(max.)
z Switching speed : 15 MBd(typ.) (NRZ) z Common mode transient immunity : 10 kV/us(min.)
Pin Configuration (Top View)
z Isolation voltage : 5000 Vrms(min.) z UL Recognized :UL1577, File No.E67349 z Option (D4)
TÜV Approved : EN60747−5−2 Maximum Operating Insulation Voltage : 1140 V Highest Permissible Over Voltage
: 8000 V
PK
PK
(Note): When an EN6074752 approved type is needed,
1
2
3
Please designate “Option(D4)”
z Construction Mechanical Rating
Creepage Distance Clearance Insulation Thickness
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
Schematic

Truth Table

Input LED Tr1 Tr2 Output
ON OFF ON L
H
OFF ON OFF H
L
1
VF
3
4.58±0.25
6 5 4
6.8±0.25
+0.15
1 2 3
0.25
3.65
1.27±0.2
+0.10
0.05
0.25±
TOSHIBA 11-5J101
Weight0.26 g (typ.)
VCC
6
5
GND
SHIELD
4
IF
Unit in mm
7.62±0.25
0.75±0.25
11.7±0.3
1:ANODE 2:N.C. 3:CATHODE 4:GND 5:Vo 6:Vcc
I
CC
Tr1
Tr2
11-5J101
V
6
I
O
5
+0.25
0.15
3.9
CC
V
O
SHIELD
0.1 μF bypass capacitor must be connected between pins 6 and 4.
GND
4
2007-10-01 1
RESTRICTIONS ON PRODUCT USE
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
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BSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
A
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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2007-10-01 2
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