Datasheet TLP2166A Datasheet (TOSHIBA)

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TOSHIBA PHOTOCOUPLER GaAℓAs Ired & PHOTO-IC

TLP2166A

Plasma Display Panels (PDPs)

High-Speed Interfaces

TLP2166A

Unit: mm

3.3-V Voltage Source

The Toshiba TLP2166A consists of a GaAℓAs light emitting diode and a
integrated high-gain, high-speed photodetector.
The TLP2166A is housed in the 8-pin SO package.
Since the TLP2166A contains two photocouplers, it saves board space.
the TLP2166A operates with a 3.3-V supply voltage.

z Inverting logic output (totem-pole output)

z SO8 package

z Guaranteed performance over -40 to 100°C

z Power supply voltage: 3.0 to 3.6 V

z Input threshold current: I

z Switching time (t

pHL

/ t

z Switching speed: 15 MBd (typ.)(NRZ)

z Common-mode transient immunity: ±15 kV/μs

z Isolation voltage: 2500 V

Truth Table

Input LED1(2) Tr1(3) Tr2(4) Output 1(2)

H

L

ON OFF ON

OFF ON OFF H

Schematic

IF1

1＋

VF1

2－

= 3 mA (max)

FHL

): 75 ns (max)

pLH

rms

Tr1

Tr2

ICC

IO1

L

8

V

CC

7

V

O1

8 6 5

7

3.95 ± 0.25

3 4

2

1

5.1 ± 0.2

2.5 ± 0.2

1.27 ± 0.15

0.38

0.305 min

0.1 ± 0.1

JEDEC ―
JEITA ―
TOSHIBA 11−5K1

Weight: 0.21 g (typ.)

Pin Configuration (Top View)

1

VCC

2

3

4

SHIELD

GND

1: ANODE 1

8

2: CATHODE 1
3: CATHODE 2

7

4: ANODE 2
5: GND

6

6: V

O2

7: V

O1

5

8: VCC

6.0 ± 0.2

11- 5K1

(Output2)
(Output1)

SHIELD

3－

VF2

4＋

I

F2

SHIELD

A bypass capacitor of 0.1μF must be
connected between pins 8 and 5.

Tr3

Tr4

I

O2

6

V

O2

5

GND

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TLP2166A

Absolute Maximum Ratings (Ta=25°C)

CHARACTERISTIC SYMBOL RATING UNIT

Forward Current (Note 1) IF 15 mA

Forward current derating (Ta ≥ 95℃) (Note 1) ⊿IF/⊿Ta -0 . 5 m A / ℃

LED

Peak Transient Forward Current (Note 1,2) IFP 1 A

Reverse Voltage (Note 1) VR 5 V

Output Current (Note 1) IO 10 mA

Output Voltage (Note 1) VO 6 V

Supply Voltage VCC 6 V

DETECTOR

Output Power Dissipation PO 40 mW

Operating Temperature Range T

Storage Temperature Range T

Lead Soldering Temperature (10 s) T

Isolation Voltage (AC,1 min, R.H.≤ 60%,Ta=25°C) (Note 3) BVs 2500 V

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).

Note 1: Each Channel.

Note 2: Pulse width ≤ 1 μs, 300 pps.

Note 3: This device is regarded as a two terminal device : pins 1, 2, 3 and 4 are shorted together,

as are pins 5, 6, 7 and 8.

-40 to 100 °C

opr

-55 to 125 °C

stg

260 °C

sol

rms

Recommended Operating Conditions

CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT

Input Current , ON (Note 1) I

Input Voltage , OFF (Note 1) V

Supply Voltage* (Note 4) VCC 3.0 3.3 3.6 V

Operating Temperature T

5 ― 10 mA

F(ON)

F(OFF)

-40 ― 100 °C

opr

0 ― 0.8 V

* This item denotes operating range, not meaning of recommended operating conditions.

Note 4: The detector of this product requires a power supply voltage (VCC) of 3.0 V or higher for

stable operation.

If the VCC is lower than this value, an I

may increase, or an output may be unstable.

CCH

Be sure to use the product after checking the supply current, and the operation of a power-on/-off

Note 5: A ceramic capacitor (0.1 μF) should be connected from pin 8 (VCC) to pin 5 (GND) to stabilize the operation

of the high gain linear amplifier. Failure to provide the bypass may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.

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Electrical Characteristics
(Unless otherwise specified, Ta=-40 to 100°C, VCC=3.0 to 3.6 V)

TLP2166A

CHARACTERISTIC SYMBOL

Input Forward Voltage (Note 1) VF ― IF=10 mA , Ta=25°C 1.3 1.65 1.75 V

Temperature Coefficient of

Forward Voltage

Input Reverse Current (Note 1) IR ― VR=5 V , Ta=25°C ― ― 10 μA

Input Capacitance (Note 1) CT ― V=0 , f=1 MHz , Ta=25°C ― 45 ― pF

Logic Low Output Voltage (Note 1) VOL 1

Logic High Output Voltage (Note 1) VOH 2

Logic Low Supply Current I

Logic High Supply Current I

Operating Supply Voltage VCC ― ― 3.0

Input Current Logic

Low Output

Input Voltage Logic

High Output

(Note 1) ΔVF/ΔTa

CCL

CCH

(Note 1) I

(Note 1) V

FHL

FLH

TEST

CIRCUIT

― I

IOL=1.6 mA , IF=10 mA,

VCC=3.3 V

IOH=-0.02 mA, VF=1.05 V

VCC=3.3 V

3 IF=10 mA ― 7.0 10.0 mA

4 VF=0 V (Note 4) ― 4.0 10.0 mA

― I

― I

CONDITION MIN TYP. MAX UNIT

=10 mA ― -2.0 ― mV/°C

F

― 0.3 0.6 V

2.0 2.6 ― V

―

3.6 V

=1.6 mA, VO<0.6 V ― ― 3 mA

O

=-0.02 mA, VO>2.0 V 0.8 ― ― V

O

*All typical values are at Ta=25°C.

Isolation Characteristics

(Ta = 25℃)

Characteristic Symbol Test Condition Min Typ. Max Unit

Capacitance input to output CS VS = 0,f = 1 MHz (Note 3) ― 0.8 ― pF

12

14

Isolation resistance R

Isolation voltage BV

R.H. ≤ 60%,VS = 500 V (Note 3) 1×10

S

AC,1 minute 2500 ― ―

AC,1 second,in oil ― 5000 ―

S

DC,1 minute,in oil ― 5000 ― V

10

― Ω

V

rms

dc

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TLP2166A

A

A

Switching Characteristics
(Unless otherwise specified, Ta=-40 to 100℃､VCC=3.0 to 3.6 V)(Each Channel)

I

CCL

-

|

TEST

CIRCUIT

5

6

IO

CONDITION MIN TYP. MAX UNIT

IF=0→7.5 mA

IF=7.5→0 mA

IF=7.5 mA,R

=0→7.5 mA

F

IF=7.5→0 mA

VCM=1000 V

VO(min)=2 V, Ta=25°C

VCM=1000 V

VO(max)=0.8 V, Ta=25°C

V

V

OL

V

V

CC

IN

p-p

p-p

V

CC

R

=100 Ω

IN

CL=15 pF

(Note 6)

=100Ω,CL=15 pF

(Note 6)

=100 Ω

R

IN

CL=15 pF

(Note 6)

, IF=0 mA,

, IF=7.5 mA,

1

F

2

3

4

1

2

3 6

4

― ― 75 ns

― ― 75 ns

― ― 45 ns

― 5 ― ns

― 5 ― ns

15000

-15000

― ― V/μs

― ― V/μs

8

V

CC

7

6

0.1 μF

5

GND

SHIELD

Test Circuit

CCH

V

CC

8

I

CCH

7

0.1 μF

5

GND

SHIELD

IO

CHARACTERISTIC SYMBOL

Propagation Delay Time

to Logic Low output

Propagation Delay Time

to Logic High output

Switching Time Dispersion

between ON and OFF

Fall Time (90 – 10 %) tf I

Rise Time (10 – 90 %) tr

Common Mode transient

Immunity at High Level Output

Common Mode transient

Immunity at Low Level Output

t

pHL

t

pLH

|t

pHL

t

pLH

CMH

CML

*All typical values are at Ta=25°C, VCC=3.3 V.

Note 6: CL is approximately 15 pF which includes probe and jig/stray wiring capacitance.

TEST CIRCUIT 1: VOL Test Circuit TEST CIRCUIT 2: VOH Test Circuit

IF

1

2

3

4

SHIELD

V

CC

GND

8

7

6

0.1 μF

5

TEST CIRCUIT 3: I

IF1

1

2

3

IF2

SHIELD

Test Circuit TEST CIRCUIT 4: I

CCL

8

V

CC

7

0.1 μF

6

5 4

GND

V

O

V

V

CC

V

CC

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TEST CIRCUIT 5: Switching Time Test Circuit

A

IF=7.5 mA(P.G)

(f=5 MHz , duty=50%)

IF monitor

CL=15 pF

1

2

3 6

4

SHIELD

RIN=100 Ω

V

CC

GND

8

7

0.1 μF

5

V

O

V

CC

C

L

IF

VOH

V

OL

CL includes probe and stray capacitance.

P.G.: Pulse generator

TEST CIRCUIT 6: Common-Mode Transient Immunity Test Circuit

SW

IF

→

B

1

2

3

4

SHIELD

＋

－

V

CM

V

CC

GND

8

7

0.1 μF
V

O

VCM

6

V

CC

5

・SW B: IF=0 mA

VO

・SW A: IF=7.5 mA

CM

1.5 V

H

TLP2166A

50%

t

pHL

tf

tr

2 V

)(800

=

V

)(

str

μ

CM

=

L

t

pLH

90%

10%

tr

1000 V

90%

10%

tf

CMH

0.6 V
CML

)(800

V

)(

stf

μ

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Specification for Embossed–Tape Packing (TP) for SO8 Coupler

1. Applicable Package

Package Product Type

SO8 Photocoupler

2. Product Naming System

Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.

(Example)

3. Tape Dimensions

3.1 Orientation of Device in Relation to Direction of Tape Movement

Device orientation in the recesses is as shown in Figure 1.

TLP2166A (TP)

Tape type

Device name

TLP2166A

Figure 1 Device Orientation

3.2 Tape Packing Quantity:2500 devices per reel

3.3 Empty Device Recesses Are as Shown in Table 1.

Table 1 Empty Device Recesses

Standard Remarks

Occurrences of 2 or more
successive empty device
recesses

Single empty device
recesses

6 devices (max) per reel Not including leader and trailer

0

Within any given 40-mm section of
tape, not including leader and trailer

3.4 Start and End of Tape

The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns
only for a cover tape.

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3.5 Tape Specification

(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.

0.3 ± 0.05

φ1.5

+0.1

−0

F

G

E

D

B

12.0 ± 0.3

K

0

φ1.6 ± 0.1

A

3.3 ± 0.1

Figure 2 Tape Forms

Table 2 Tape Dimensions

Unit: mm

Unless otherwise specified: ±0.1

TLP2166A

Symbol Dimension Remark

A 6.5 ―

B 5.6 ―

D 5.5 Center line of indented square hole and sprocket hole

E 1.75 Distance between tape edge and hole center

F 8.0 Cumulative error (max) per 10 feed holes

G 4.0 Cumulative error (max) per 10 feed holes

K0 3.1 Internal space

+0.1

-0.3
+0.1

-0.3

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3.6 Reel

(TP)

(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.

TLP2166A

U

W2

Figure 3 Reel Form

Table 3 Reel Dimensions

Unit: mm

Symbol Dimension

A Φ330 ±2

B Φ80 ±1

C Φ13 ±0.5

E 2.0 ±0.5

U 4.0 ±0.5

W1 13.5 ±0.5

W2 17.5 ±1.0

4. Packing

Either one reel or five reels of photocoupler are packed in a shipping carton.

5. Label Indication

The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.

6. Ordering Method

When placing an order, please specify the product number, the CTR rank, the tape type and the quantity
as shown in the following example.

(Example)

TLP2166A

2500 pcs

A

B

C

Quantity (must be a multiple of 2500)

Tape type

Device name

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TLP2166A

Precautions Of Surface Mounting Type Photocoupler Soldering & General Storage

(1) Precautions for Soldering

1) When Using Soldering Reflow

z An example of a temperature profile when Sn-Pb eutectic solder is used:

z An example of a temperature profile when lead(Pb)-free solder is used:

z Reflow soldering must be performed once or twice.
z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

z Apply preheating of 150 deg.C for 60 to 120 seconds.
z Mounting condition of 260 deg.C or less within 10 seconds is recommended.
z Flow soldering must be performed once

3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds

not exceeding 350 deg.C.

z Heating by soldering iron must be only once per 1 lead

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(2) Precautions for General Storage

1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.

2) When transportation or storage of devices, follow the cautions indicated on the carton box.

3) The storage area temperature should be kept within a temperature range of 5 degree C
to 35 degree C, and relative humidity should be maintained at between 45% and 75%.

4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions.

5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature

changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.

6) When repacking devices, use anti-static containers.

7) Do not apply any external force or load directly to devices while they are in storage.

8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.

TLP2166A

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TLP2166A

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.

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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

BSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

• A

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or

vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
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or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.

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