TOSHIBA TLP197D Technical data
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TOSHIBA Photocoupler Photorelay
TLP197D
TLP197D
PC Card Modems
PBX
Measurement Equipment
The Toshiba TLP197D consists of an aluminum gallium arsenide
infrared emitting diode optically coupled to a photo-MOSFET in a SOP
package.
TLP197D is housed in a compact and thin SOP package and has
characteristics of high-withstanding voltage and low ON-state resistance,
which enable TLP197D to be applied in hook switches, dial-pulse
switches for modems and facsimiles, and switches for test circuit
switching in PBXes.
• 6-pin SOP (2.54SOP6): Height = 2.1 mm, pitch = 2.54 mm
• Normally open (1-form-A) device
• Peak OFF-state voltage: 200 V (min)
• Trigger LED current: 3 mA (max)
• ON-state current: 200 mA (max)
• ON-state resistance: 8 Ω (max)
• Isolation voltage: 1500 Vrms (min)
• UL recognized: UL1577, file no. E67349
Pin Configuration (top view)
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 11-7C1
Weight: 0.13 g (typ.)
1
2 5
3
6
4
1:
Anode
Cathode
2:
Drain D1
4:
5: Source
Drain D2
6:
Schematic
1 6
2 5
4
1
2007-10-01
TLP197D
>
>
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Absolute Maximum Ratings
Characteristics Symbol Rating Unit
Forward current IF 50 mA
Forward current derating
25°C)
(Ta
Peak forward current
LED
(100 μs pulse, 100 pps)
Reverse voltage VR 5 V
Junction temperature Tj 125 °C
Off-state output terminal voltage V
A connection 200
On-state current
On-state current
Detector
derating
25°C)
(Ta
Junction temperature Tj 125 °C
Operating temperature range T
Storage temperature range T
Lead soldering temperature (10 s) T
Isolation voltage
(AC, 1 min, R.H.
B connection 200
C connection
A connection −2.0
B connection −2.0
C connection
60%) (Note 1)
(Ta = 25°C)
/°C −0.5 mA/°C
ΔI
F
1 A
I
FP
OFF
ION
ΔI
/°C
ON
opr
stg
sol
BV
S
200 V
mA
400
mA/°C
−4.0
−40 to 85 °C
−55 to 125 °C
260 °C
1500 Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together.
Recommended Operating Conditions
Characteristics Symbol Min Typ. Max Unit
Supply voltage VDD ⎯ ⎯ 160 V
Forward current IF 5 7.5 25 mA
On-state current ION ⎯ ⎯ 130 mA
Operating temperature T
−20 ⎯ 60 °C
opr
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Circuit Connections
1
2
3
6
5
4
A Connection B Connection C Connection
LOAD
AC
DC
or
1
2
3
6
5
4
LOAD
DC
1
2
3
6
5
4
LOAD
DC
2
2007-10-01
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