TOSHIBA TLP1243-C8 Technical data

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TOSHIBA Photo-interrupter Infrared LED + Phototransistor

TLP1243(C8)

TLP1243(C8)

Copiers, Printers and Fax Machines

Air-conditioners

Game Machines

The TLP1243 (C8) is a compact photointerrupter with a
built-in connector that uses a GaAs infrared LED and an Si
phototransistor.

• Small package
Compared to Toshiba’s TLP1241 (C5), the volume and the

mounting area of the TLP1243 (C8) are reduced to
approximately 70% and 75% respectively.

• Three board thicknesses supported: 1.0 mm, 1.2 mm and

1.6 mm

• Gap: 5 mm

• Resolution: Slit width = 0.7 mm

• High-temperature operation: T

• Current transfer ratio: IC/IF = 2.5% (min)

• Mini CT connector (1.5-mm pitch, receptacle

assembly/housing crimp type) made by Tyco Electronics
AMP, Ltd.

• Package and connector material: Polycarbonate (UL94V-2)

• Lead(Pb)-Free

= 95°C (max)

opr

Marking

TOSHIBA 11-15G1

Weight: 0.8 g (typ.)

Connector classification

8

43

Monthly lot number

Product No.

Month of manufacture
(January to December, denoted by the letters A to L respectively)

Year of manufacture (the last digit of the calendar year)

1

2007-10-01

TLP1243(C8)

Absolute Maximum Ratings

Characteristics Symbol Rating Unit

Forward current I

Forward current derating
(Ta>25°C)

LED

Reverse voltage VR 5 V

Collector-emitter voltage V

Emitter-collector voltage V

Collector power dissipation PC 75 mW

Collector power dissipation

Detector

derating (Ta>25℃)

Collector current IC 50 mA

Operating temperature range T

Storage temperature range T

(Ta = 25°C)

F

/°C −0.28 mA/°C

ΔI

F

CEO

ECO

/°C −1 mW/°C

ΔP

C

opr

stg

30 mA

35 V

5 V

−30 to 95 °C

−40 to 100 °C

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).

Optical and Electrical Characteristics

(Ta = 25°C)

Characteristics Symbol Test conditions Min Typ. Max Unit

Forward voltage VF IF = 10 mA 1.00 1.18 1.40 V

Reverse current IR VR = 5 V ⎯ ⎯ 10 μA

LED

Peak emission wavelength λP I

Dark current ID (I

Peak sensitivity wavelength λP ⎯ ⎯ 870 ⎯ nm

Detector

Current transfer ratio IC/IF VCE = 2 V, IF = 10 mA 2.5 ⎯ 100 %

Collector-emitter saturation
voltage

Coupled

Rise time tr ⎯ 15 50

Fall time tf

V

CE (sat)

CEO

= 10 mA ⎯ 940 ⎯ nm

F

) VCE = 24 V, IF = 0 ⎯ 0.001 0.1 μA

IF = 20 mA, IC = 0.25 mA ⎯ 0.1 0.35 V

V

= 5 V, IC = 1 mA, RL = 1 kΩ

CE

⎯ 15 50

μs

2

2007-10-01

TLP1243(C8)

Recommended Connector

Mini CT connector (1.5-mm pitch, receptacle assembly/housing crimp type) made by
Tyco Electronics AMP, Ltd.

External Diameter of

Insulation Coating
Housing-Terminal
En Block Type

Type Model Number Terminal Material AWG Size

Receptacle

assembly

Housing crimp type 353908-3

353293-3

Phosphor bronze AWG26 to 28 0.85 mm to 0.95 mm

Note: For further details of connector characteristics, please contact the relevant connector manufacturer.

Precautions

• Protect the device from ambient light interference. The integrated phototransistor is insensitive to light below
700 nm (e.g., fluorescent light), but is sensitive to light above 700 nm (e.g., incandescent light). If it detects
ambient light, it may cause malfunction. Be sure to make a thorough evaluation of the equipment in which the
device is to be used.

• Care must be taken regarding the environment in which the device is to be installed. Oil or chemicals may
cause the package to melt or crack.

• When attaching the device to the metal board, always hold the body of the device. Do not hold the device by the
connector. Ensure that the board is flat, and not warped or twisted. Attach the device to the metal board at
room temperature.

• Toshiba recommends attaching the device to the smoother side of the board.

• Toshiba recommends testing the attachment strength beforehand by actually attaching a device to the board.

• Do not apply solder to the pins of the device's connector. Make sure that the connector is plugged into the Mini

CT connector or equivalent connector.

• When inserting or removing the Mini CT connector or equivalent connector, always grasp it and its cable firmly
and either plug it straight into or pull it straight out of the device's connector. If the Mini CT connector or
equivalent connector is inserted or removed at an angle, both the device's connector and the Mini CT connector
or equivalent connector may get damaged, resulting in an unreliable connection.

• Conversion efficiency decreases over time due to current flow in the infrared LED. When designing a circuit,
take into account this change in conversion efficiency over time. The ratio of fluctuation in conversion efficiency
to fluctuation in infrared LED optical output is 1:1:

I
I

C/IF (t)
C/IF (0)

P

o (t)

=

P

.

o (0)

• The leadframe of the package is exposed as shown below. Ensure that no conductive material or object (such as
a metal pin) comes into contact with the leads of the leadframe and shorts them together. Care must be taken
when designing a chassis.

Top View

Connector

(1) (2)

(3)

(4) (5)

Leads (1) to (5) of the leadframe shown
on the left must not be shorted together.

3

2007-10-01