TOSHIBA TLGE174P Technical data
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TOSHIBA LED Lamp InGaAℓP Green Light Emission
TLGE174P
TLGE174P
Panel Circuit Indicator
· 5mm diameter (T1−3 / 4)
· InGaAℓP green LED
· All plastic mold type.
· Colored transparent lens
· Low drive current, high intensity green light emission
Recommended forward current: I
· All plastic molded lens, provides an excellent on−off contrast ratio.
· Fast response time, capable of pulse operation.
· High power luminous intensity
· Without stand-offs
· Applications: Suitable for outdoor message signboard,
safety equipment, etc.
Maximum Ratings
Characteristic Symbol Rating Unit
Forward current (DC) IF 50 mA
Reverse voltage VR 4 V
Power dissipation PD 140 mW
Operating temperature range T
Storage temperature range T
(Ta = 25°C)
=15~20mA(DC)
F
-30~85 °C
opr
-40~120 °C
stg
Unit: mm
JEDEC ―
EIAJ ―
TOSHIBA
Weight: 0.31g (typ.)
1
2002-09-25
TLGE174P
Electrical And Optical Characteristics
Characteristic Symbol Test Condition Min Typ. Max Unit
Forward voltage VF IF = 20mA ― 2.27 2.8 V
Reverse current IR V
Luminous intensity IV I
Peak emission wavelength λp I
Spectral line half width ∆λ IF = 20mA ― 11 ― nm
Dominant wavelength λd I
(Note): Lamps are classified into the following ranks according to their luminous intensity.
Measurement tolerance for each limit is ±15%.
R: 560-1120mcd, S: 1000-2000mcd, T: 1800-3600mcd
(Ta = 25°C)
= 4V ― ― 50 µA
R
= 20mA (Note) 476 1400 ― mcd
F
= 20mA ― 574 ― nm
F
= 20mA ― 571 ― nm
F
Precaution
Please be careful of the followings
· Soldering temperature: 260°C max Soldering time: 3 s max
(Soldering portion of lead: Up to 2mm from the body of the device)
· If the lead is formed, the lead should be formed up to 5mm from the body of the device without forming stress to
the resin. Soldering should be performed after lead forming.
· This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure
that it will not be affected by this IR light.
2
2002-09-25
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