Toshiba tecra s3 Service Manual
Toshiba Personal Computer
TECRA S3
Maintenance Manual
TOSHIBA CORPORATION
File Number 960-532
[CONFIDENTIAL]
Copyright
© 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual
cannot be reproduced in any form without the prior written permission of Toshiba. No patent
liability is assumed with respect to the use of the information contained herein.
Toshiba Personal Computer TECRA S3 Maintenance Manual
First edition August 2005
Disclaimer
The information presented in this manual has been reviewed and validated for accuracy. The
included set of instructions and descriptions are accurate for the TECRA S3 at the time of
this manual's production. However, succeeding computers and manuals are subject to
change without notice. Therefore, Toshiba assumes no liability for damages incurred
directly or indirectly from errors, omissions, or discrepancies between any succeeding
product and this manual.
Trademarks
IBM is a registered trademark and IBM PC is a trademark of International Business
Machines Corporation.
Intel, Intel SpeedStep, Pentium and Centrino are trademarks or registered trademarks of Intel
Corporation or its subsidiaries in the United States and other countries/regions.
Windows and Microsoft are registered trademarks of Microsoft Corporation.
Photo CD is a trademark of Eastman Kodak.
Sonic RecordNow! is a registered trademark of Sonic Solutions.
Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license.
i.LINK is trademark and registered trademark of Sony Corporation.
OmniPass is the trademark of Softex Incorporated.
InterVideo and WinDVD are registered trademarks of InterVideo Inc.
WinDVD Creator is trademark of InterVideo Inc.
Other trademarks and registered trademarks not listed above may be used in this manual.
ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Preface
This maintenance manual describes how to perform hardware service maintenance for the
Toshiba Personal Computer TECRA S3.
The procedures described in this manual are intended to help service technicians isolate
faulty Field Replaceable Units (FRUs) and replace them in the field.
SAFETY PRECAUTIONS
Four types of messages are used in this manual to bring important information to your
attention. Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or
serious bodily injury, if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily
injury, if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property
damage, if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance
service.
Improper repair of the computer may result in safety hazards. Toshiba requires service
technicians and authorized dealers or service providers to ensure the following safety
precautions are adhered to strictly.
Be sure to fasten screws securely with the right screwdriver. If a screw is not fully
fastened, it could come loose, creating a danger of a short circuit, which could cause
overheating, smoke or fire.
If you replace the battery pack or RTC battery, be sure to use only the same model
battery or an equivalent battery recommended by Toshiba. Installation of the wrong
battery can cause the battery to explode.
TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] iii
The manual is divided into the following parts:
Chapter 1 Hardware Overview describes the TECRA S3 system unit and each
FRU.
Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve
FRU problems.
Chapter 3 Test and Diagnostics describes how to perform test and diagnostic
operations for maintenance service.
Chapter 4 Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
Handling the LCD module
Board layout
Pin assignments
Keyboard scan/character codes
Key layout
Wiring diagrams
BIOS rewrite procedures
EC/KBC rewrite procedures
Reliability
Maintenance of TOSHIBA RAID
iv [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Conventions
This manual uses the following formats to describe, identify, and highlight terms and
operating procedures.
Acronyms
On the first appearance and whenever necessary for clarification acronyms are enclosed in
parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on
the keyboard is printed in boldface type.
Key operation
Some operations require you to simultaneously use two or more keys. We identify such
operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause
(Break) means you must hold down Ctrl and at the same time press Pause (Break). If
three keys are used, hold down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISKCOPY A: B:
The display
Text generated by the computer that appears on its display is presented in the type face
below:
Format complete
System transferred
TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] v
Table of Contents
Chapter 1 Hardware Overview
1.1 Features......................................................................................................................1-1
1.2 2.5-inch Hard Disk Drive......................................................................................... 1-11
1.3 Keyboard..................................................................................................................1-13
1.4 Optical Drive............................................................................................................ 1-14
1.5 TFT Color Display...................................................................................................1-16
1.6 Power Supply...........................................................................................................1-18
1.7 Batteries ...................................................................................................................1-20
1.8 AC Adapter.............................................................................................................. 1-22
Chapter 2 Troubleshooting Procedures
2.1 Troubleshooting.........................................................................................................2-1
2.2 Troubleshooting Flowchart........................................................................................2-2
2.3 Power Supply Troubleshooting..................................................................................2-6
2.4 System Board Troubleshooting................................................................................2-15
2.5 USB FDD Troubleshooting .....................................................................................2-38
2.6 HDD Troubleshooting ............................................................................................. 2-41
2.7 Keyboard/Touch pad Troubleshooting.................................................................... 2-46
2.8 Display Troubleshooting..........................................................................................2-48
2.9 Optical Drive Troubleshooting................................................................................ 2-50
2.10 Modem Troubleshooting.......................................................................................... 2-51
2.11 LAN Troubleshooting..............................................................................................2-53
2.12 Sound Troubleshooting............................................................................................2-54
2.13 SD Card Slot Troubleshooting................................................................................. 2-57
2.14 Wireless LAN Troubleshooting...............................................................................2-58
2.15 Bluetooth Troubleshooting ......................................................................................2-60
2.16 PCI ExpressCard slot...............................................................................................2-63
2.17 Fingerprint sensor ....................................................................................................2-64
vi [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Chapter 3 Tests and Diagnostics
3.1 The Diagnostic Test...................................................................................................3-1
3.2 Executing the Diagnostic Test................................................................................... 3-4
3.3 Check of the RAID configuration..............................................................................3-9
3.4 Setting of the hardware configuration .....................................................................3-17
3.5 Heatrun Test.............................................................................................................3-20
3.6 Subtest Names.......................................................................................................... 3-21
3.7 System Test.............................................................................................................. 3-23
3.8 Memory Test............................................................................................................ 3-25
3.9 Keyboard Test.......................................................................................................... 3-26
3.10 Display Test.............................................................................................................3-27
3.11 Floppy Disk Test......................................................................................................3-30
3.12 Printer Test...............................................................................................................3-32
3.13 Async Test ...............................................................................................................3-34
3.14 Hard Disk Test......................................................................................................... 3-35
3.15 Real Timer Test........................................................................................................3-38
3.16 NDP Test..................................................................................................................3-40
3.17 Expansion Test.........................................................................................................3-41
3.18 CD-ROM/DVD-ROM Test .....................................................................................3-43
3.19 Error Code and Error Status Names.........................................................................3-44
3.20 Hard Disk Test Detail Status ................................................................................... 3-47
3.21 ONLY ONE TEST................................................................................................... 3-49
3.22 Head Cleaning.......................................................................................................... 3-59
3.23 Log Utilities.............................................................................................................3-60
3.24 Running Test............................................................................................................ 3-62
3.25 Floppy Disk Drive Utilities......................................................................................3-63
3.26 System Configuration ..............................................................................................3-68
3.27 Wireless LAN Test Program (Intel-made b/g).........................................................3-70
3.28 Wireless LAN Test Program (Intel-made a/g).........................................................3-74
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program ..................................................3-79
3.30 Sound Test program................................................................................................. 3-94
3.31 SETUP ...................................................................................................................3-100
TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] vii
Chapter 4 Replacement Procedures
4.1 General....................................................................................................................... 4-1
4.2 Battery pack............................................................................................................... 4-8
4.3 PC card.....................................................................................................................4-10
4.4 SD card.....................................................................................................................4-11
4.5 Memory module.......................................................................................................4-12
4.6 HDD......................................................................................................................... 4-14
4.7 Wireless LAN card .................................................................................................. 4-17
4.8 Slim select bay module............................................................................................4-19
4.9 Keyboard..................................................................................................................4-22
4.10 Touch pad.................................................................................................................4-25
4.11 Bluetooth module.....................................................................................................4-27
4.12 Switch membrane.....................................................................................................4-29
4.13 Display assembly.....................................................................................................4-31
4.14 RTC battery.............................................................................................................. 4-35
4.15 Modem Daughter Card (MDC)................................................................................4-36
4.16 USB board................................................................................................................ 4-39
4.17 Internal microphone.................................................................................................4-41
4.18 SR board/DC-IN jack...............................................................................................4-43
4.19 Fan............................................................................................................................4-45
4.20 CPU..........................................................................................................................4-47
4.21 GFX board ...............................................................................................................4-50
4.22 System board............................................................................................................ 4-52
4.23 FP board...................................................................................................................4-56
4.24 LCD unit/FL inverter...............................................................................................4-58
4.25 Cover latch...............................................................................................................4-65
4.26 Wireless LAN antenna/Bluetooth antenna...............................................................4-66
4.27 Hinge........................................................................................................................4-68
4.28 Speaker..................................................................................................................... 4-72
4.29 Battery slider............................................................................................................ 4-73
4.30 Fluorescent Lamp.....................................................................................................4-75
Appendices
viii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Appendix A Handling the LCD Module ........................................................................... A-1
Appendix B Board Layout ................................................................................................ B-1
Appendix C Pin Assignments............................................................................................ C-1
Appendix D Keyboard Scan/Character Codes .................................................................. D-1
Appendix E Key Layout.....................................................................................................E-1
Appendix F Wiring Diagrams............................................................................................F-1
Appendix G BIOS rewrite Procedures .............................................................................. G-1
Appendix H EC/KBC rewrite Procedures......................................................................... H-1
Appendix I Reliability........................................................................................................I-1
Appendix J Maintenance of TOSHIBA RAID ..................................................................J-1
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x [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
Chapter 1
Hardware Overview
[CONFIDENTIAL]
1 Hardware Overview
1-ii [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
1 Hardware Overview
Chapter 1 Contents
1.1 Features.......................................................................................................................1-1
1.2 2.5-inch Hard Disk Drive.........................................................................................1-11
1.3 Keyboard ..................................................................................................................1-13
1.4 Optical Drive............................................................................................................1-14
1.4.1 DVD-ROM & CD-R/RW Drive.........................................................1-14
1.4.2 DVD Super Multi (DVD±R/±RW/-RAM) Drive...............................1-15
1.5 TFT Color Display ...................................................................................................1-16
1.5.1 LCD Module.......................................................................................1-16
1.5.2 FL Inverter Board ...............................................................................1-17
1.6 Power Supply............................................................................................................1-18
1.7 Batteries....................................................................................................................1-20
1.7.1 Main Battery .......................................................................................1-20
1.7.2 RTC battery.........................................................................................1-21
1.8 AC Adapter...............................................................................................................1-22
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1 Hardware Overview
Figures
Figure 1-1 Front of the computer .....................................................................................1-5
Figure 1-2 System unit configuration...............................................................................1-6
Figure 1-3 System unit block diagram .............................................................................1-7
Figure 1-4 2.5-inch HDD ...............................................................................................1-11
Figure 1-5 Keyboard ......................................................................................................1-13
Figure 1-6 LCD module .................................................................................................1-16
Tables
Table 1-1 2.5-inch HDD specifications ........................................................................1-11
Table 1-2 DVD-ROM & CD-R/RW drive specifications.............................................1-14
Table 1-3 DVD Super Multi (DVD±R/±RW/-RAM) drive specifications...................1-15
Table 1-4 LCD module specifications ..........................................................................1-16
Table 1-5 FL inverter board specifications...................................................................1-17
Table 1-6 Power supply output rating...........................................................................1-19
Table 1-7 Battery specifications ...................................................................................1-20
Table 1-8 Time required for charges of main battery...................................................1-20
Table 1-9 RTC battery charging/data preservation time...............................................1-21
Table 1-10 AC adapter specifications.............................................................................1-22
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1 Hardware Overview
1 Features
1.1 Features
The Toshiba TECRA S3 Personal Computer uses extensive Large Scale Integration (LSI),
and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide
compact size, minimum weight, low power usage and high reliability. This computer
incorporates the following features and benefits:
Microprocessor
The PC comes in with one of the followings:
• • Intel Mobile Pentium-M Processor
1.73GHz/1.86GHz/2.0AGHz (0.748-1.356V)/2.13GHz (0.748-1.372V)
/2.26GHz (0.748-1.404V)
These processors operate at 533MHz bus clock.
Cache memory
Intel Mobile Pentium-M Processor has 64KB primary cache and 2MB secondary cache.
Memory
The computer comes with two PC2-3200/PC2-4200 compatible DDR2 SO-DIMM slots.
Two memory modules of 256GB, 512MB or 1GB(1,024MB) can be installed.
Video Controller
The computer has a NV43 VGA controller. The internal VRAM is 64MB or 128MB.
HDD
The computer has a 2.5-inch, 9.5mm SATA HDD. The following capacities are available.
40/60/80/100GB
USB FDD
Supports a USB 3.5-inch FDD, which connected via a USB port, supports 720KB,
1.2MB and 1.44MB formats and enables booting from system FD.
Batteries
The RTC battery (NiMH 2.4V 16mAh) is mounted inside the computer.
The main battery is a detachable lithium-ion main battery (10.8V-4,700mAh/8,800mAh) .
Universal Serial Bus (USB2.0)
Three USB ports are provided. The ports comply with the USB2.0 standard.
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1 Hardware Overview
Display
LCD
The PC comes in with one of the following two types:
•
15.0” XGA-TFT color display, resolution 1,024×768, 16M colors
•
15.0” SXGA+-TFT color display, resolution 1,400×1,050, 16M colors
External monitor
Supported via a RGB connector.
Slim Select Bay
A DVD-ROM & CD-R/RW drive, DVD Super Multi drive (DVD±R/±RW/-RAM) or
2nd HDD can be installed in the Slim Select Bay.
Keyboard
An-easy-to-use 85-key (US) or 86-key (UK) keyboard provides a numeric keypad
overlay for fast numeric data entry or for cursor and page control. The keyboard supports
a Windows key and an application key.
Touch pad
Touch pad (dual point) is installed as a pointing device.
PC card slot
The PC card slot (PCMCIA) accommodates one 5mm Type II card. (Based on PC Card
Standard, supporting CardBus)
SD Card
The SD Card Slot can accommodate Secure Digital flash memory cards with various
capacities. SD cards let you easily transfer data from devices, such as digital cameras and
Personal Digital Assistants, which use SD Card flash-memory.
Sound system
The sound system is equipped with the following features:
•
Stereo speakers
•
Built-in microphone
•
Stereo headphone jack
•
External microphone jack
•
Supports VoIP
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1 Hardware Overview
Toshiba Assist button
When this button is pressed during power-on, the PC is connected to “Toshiba Assist”.
When this button is pressed during power-off, the PC is turned on and connected to
“Toshiba Assist”.
Toshiba Presentation button
This button switches the display between internal display, external display, simultaneous
display and multi-monitor display.
Internal modem
The internal modem is equipped as a modem daughter card (MDC).
The internal modem provides capability for data and fax communication and supports
V.90/92. For data reception it operates at 56,000bps and for data transmission it operates
at 33,600bps. For fax transmission it operates at 14,400bps. It is also equipped with
Speakerphone and TAM (Telephony Answering Machine) function. The speed of data
transfer and fax depends on analog telephone line conditions. It has a RJ11 modem jack
for connecting to a telephone line.
Internal LAN
The computer is equipped with LAN circuits that support 1,000Mbit (Gigabit) Ethernet
LAN. It also supports Wakeup on LAN (WOL), Magic Packet and LED.
Mini PCI card slot (Wireless LAN)
The computer is equipped with a mini-PCI Type III wireless LAN card that supports
802.11 b/g or 802.11a/b/g (Intel made Freeville). It also supports kill switch.
Bluetooth
Bluetooth module can be equipped. This enables a communication to devices that support
Bluetooth Version 2.0. Adopting AFH (Adaptive Frequency Hopping), reduce the
interference with the wireless communication in 2.4GHz.
IEEE 1394 port
The computer comes with one IEEE 1394 port. It enables high-speed data transfer
directly from external devices such as digital video cameras.
Infrared port
The infrared port is compatible with Fast InfraRed (FIR) standards enabling cableless 4
Mbps (max.) data transfer with Infrared Data Association (IrDA) 1.1 compatible external
devices.
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Fingerprint sensor
The computer is equipped with a fingerprint sensor and fingerprint authentication utility.
They enable only person who has registered his/her fingerprint to use the computer.
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1 Hardware Overview
The front of the computer is shown in figure 1-1.
Figure 1-1 Front of the computer
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1 Hardware Overview
The system unit configuration is shown in figure 1-2.
Figure 1-2 System unit configuration
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Figure 1-3 is a block diagram of the system unit.
Figure 1-3 System unit block diagram
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1 Hardware Overview
The system unit is composed of the following major components:
Processor
• Intel Mobile Pentium-M Processor
– Processor core speed: 1.73GHz/1.86GHz/2.0AGHz/2.13GHz/2.26GHz
– Processor bus speed: 533MHz
– Integrated L1 cache memory: 32KB instruction cache and 32KB write-back
data cache
– Integrated L2 cache memory: 2MB
– Integrated NDP
Memory
Two memory slots are provided. Expansion up to 2GB (2,048MB) is available.
Memory
• DDR2-SDRAM
• DDR400 or DDR533 memory
• 1.8 volt operation
• FBGA
Memory Module
• 240 pin, SO Dual In-line Memory Module (SO-DIMM)
• PC2-3200 or PC2-4200
• 256MB/512MB/1GB
– 256 MB 256Mb×8
– 512 MB 512Mb×8
– 1GB 512Mb×16
Firmware Hub (FWH)
• One STMicro M50FW080N is used.
• 8Mbits of flash memory are used.
PCI chipset
This gate array incorporates the following elements and functions.
• North Bridge (Intel GMCH, AlvisoPM)
– Dothan Processor System Bus Support
– System memory interface
– DRAM Controller: DDR333, DDR2-400/DDR2-533 Support, 2GB max
– X16 PCI Express Graphics Interface
– DMI (Direct Media Interface)
– 1257-ball, 40.0×40.0 mm, FC-BGA package
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• South Bridge (Intel ICH6)
– DMI (Direct Media Interface)
– PCI Express 2 Interface (4ports)
– PCI Bus Rev2.3 Interface (7 PCI REQ/GNT Pairs)
– Integrated Serial ATA Host Controller (2ports, 150MB/S)
– Integrated IDE Controller (Ultra ATA 100/66/33)
– AC'97 2.3 Interface
– USB 1.1/2.0 Controller 8 Ports (EHCI: Enhanced Host Controller)
– Internal LAN Controller (WfM 2.0 and IEEE 802.3)
– Power Management Controller (ACPI 2.0)
– SMBus2.0 Controller
– FWH Interface
– LPC Interface (EC/KBC, Super I/O)
– IRQ Controller
– Serial Interrupt Controller
– Suspend/Resume Control
– Internal RTC
– GPIO
– 609-ball, 31.0×31.0mm, BGA Package
PC Card Controller
• One TI PC7411ZHK gate array is used.
• This gate array has the following functions and components.
– PCI interface
– CardBus/Ultra Media (1 socket)
– SD/MMC, Memory Stick, XD Card Controller
– 1394 Controller (2 ports)
– 208-ball, 16.0×16.0×1.4mm, BGA Package
Other main system chips
• Clock Generator (ICS950812CG)
• Super I/O (SMSC Kona-Life)
• EC/KBC (Mitsubishi M306KA)
• PSC (TOSHIBA TMP87PM48U)
• LCD Sensor (NRS-701-1015T)
• Thermal Sensor (ADM1032×2)
• AXIS accelerometer (STMicro LIS3L02AQ)
Modem Controller
Supported by Azallia MDC 1.5 using the Azallia link.
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1 Hardware Overview
Internal LAN Controller (Marvell maid)
Controls LAN and supports Gigabit Ethernet.
Gigabit is connected to PCI-Express.
Sound Controller
Azallia and CODEC (STAC9200) are used.
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1.2 2.5-inch Hard Disk Drive
The HDD is a random access non-volatile storage device. The computer supports a 40GB,
60GB, 80GB and 100GB HDD.
The HDD is shown in figure 1-4. Specifications are listed in Table 1-1.
Figure 1-4 2.5-inch HDD
Table 1-1 2.5-inch HDD specifications (1/2)
Specifications
Items
Outline
dimensions
Storage size (formatted) 40GB 60GB 80GB 100GB
Speed (RPM) 5,400
Data transfer rate
To/From media (MB/s)
To/From host (Gbps)
Data buffer size (MB) 8
Width (mm)
Height (mm)
Depth (mm)
Weight (g)
FUJITSU
G8BC00028410
96 max. 101 max.
FUJITSU
G8BC00028610
70
9.5
100
64.0 max.
1.5 (150 MB/s) max.
FUJITSU
G8BC00028810
FUJITSU
G8BC00028A1
0
Average seek time
Read (ms)
Motor startup time (s) 4 typ.
12 typ.
TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 1-11
1 Hardware Overview
Table 1-1 2.5-inch HDD specifications (2/2)
Items Specifications
Outline
dimensions
Width (mm)
Height (mm)
Depth (mm)
Weight (g)
TOSHIBA
HDD2D34BZK01
TOSHIBA
HDD2D33BZK01
TOSHIBA
HDD2D32BZK01
69.85
9.5
100
98 max. 102 max.
TOSHIBA
HDD2D30BZK01
Storage size (formatted) 40GB 60GB 80GB 100GB
Speed (RPM) 5,400
Data transfer rate (Mb/s) 218-429 236.1-456.0
Data buffer size (kb) 8,192 16,384
Average seek time
Read (ms)
12
Motor startup time (s) 4
Items Specifications
Outline
dimensions
Width (mm)
Height (mm)
Depth (mm)
Weight (g)
Storage size (formatted) 40GB 60GB 80GB 100GB
HITACH GST
G8BC00029410
HITACH GST
G8BC00029610
HITACH GST
G8BC00029810
69.85±0.25
9.5±0.2
100.2±0.25
95 max. 102 max.
HITACH GST
G8BC00029A10
Speed (RPM) 5,400
Data transfer rate
To/From media (Mb/s)
To/From host (Gbps)
493 max.
1.5
Data buffer size (MB) 8
Average seek time
Read (ms)
12 typ.
Motor startup time (s) 3.5
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1.3 Keyboard
The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key.
The keyboard is connected to membrane connector on the system board and controlled by the
keyboard controller.
Figure 1-5 is a view of the keyboard.
See Appendix E about a layout of the keyboard.
Figure 1-5 Keyboard
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1 Hardware Overview
1.4 Optical Drive
1.4.1 DVD-ROM & CD-R/RW Drive
The DVD-ROM & CD-R/RW drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15inch) CDs, CD-R/RW and DVDs. It is a high-performance drive that writes CD-R at
maximum 24-speed and CD-RW at maximum 24-speed (Ultra Speed CD-RW) and reads
DVD-ROM at maximum 8-speed and CD-ROM at maximum 24-speed.
DVD-ROM & CD-R/RW drive specifications are listed in Table 1-2.
Table 1-2 DVD-ROM & CD-R/RW drive specifications
Item
MATSUSHITA G8CC00025A20
Outline Width (mm) 128 (The projection part is excluded)
Dimensions Height (mm) 9.5 (The projection part is excluded)
Depth (mm) 129 (The projection part is excluded)
Date transfer speed
READ
Write CD-R
ATAPI Burst (MB/s)
PIO Mode
DMA Mode
Ultra DMA Mode
Average access time
(msec)
Data Buffer Capacity 2MB
Supported Disks CD: CD/CD-ROM (12cm, 8cm), CD-R,
DVD-ROM
CD-ROM
CD-RW
High Speed CD-RW
Ultra Speed CD-RW
CD-ROM
DVD-ROM
CD-RW
Specifications
Max. 8x CAV
Max. 24x CAV
Max. 24x CAV
Max. 4x CLV
Max. 10x CLV
Max. 24x CAV
16.6 (PIO MODE4)
16.6 (Multi Word Mode2)
33.3 (Ultra DMA Mode2)
150 typ.
170 typ.
DVD:DVD-ROM, DVD-R, DVD-RW, DVD+R,
DVD+RW, DVD+RAM, DVD+R DL
Supported Formats CD: CD-DA, CD-ROM, CD-ROM XA,
PHOTO CD, CD-Extra(CD+), CD-text
DVD:DVD-R, DVD-RW (Ver.1.2), DVD-Video,
DVD+R, DVD+RW,
DVD-RAM (2.6GB/4.7GB)
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1.4.2 DVD Super Multi (DVD±R/±RW/-RAM) Drive
The DVD Super Multi drive is capable of driving either 12cm (4.72-inch) or 8cm (3.15-inch)
DVD and CD without using an adaptor. This drive reads DVD-ROM at maximum 8-speed,
reads CD-ROM at maximum 24-speed, writes CD-R at maximum 24-speed, writes CD-RW
at maximum 10-speed, writes DVD-R at maximum 4-speed, writes DVD-RW at maximum 2speed, writes DVD+R at maximum 4-speed, writes DVD+R DL at maximum 2.4-speed,
writes DVD+RW at maximum 2.4-speed and writes DVD-RAM at maximum 2-speed.
The DVD Multi drive specifications are listed in Table 1-3.
Table 1-3 DVD Super Multi (DVD±R/±RW/-RAM) drive specifications
Item
MATSUSHITA G8CC0002Q120
Outline Width (mm) 128 (The projection part is excluded)
Dimensions Height (mm) 9.5 (The projection part is excluded)
Depth (mm) 129 (The projection part is excluded)
Date transfer speed
READ
Write CD-R
ATAPI Burst (MB/s)
PIO Mode
DMA Mode
Ultra DMA Mode
DVD-ROM
CD-ROM
CD-RW
High Speed CD-RW
Ultra Speed CD-RW
DVD-R
DVD-RW
DVD+R
DVD+R DL
DVD+RW
DVD-RAM
Specifications
Max. 8x CAV
Max. 24x CAV
Max. 24x ZCLV
Max. 4x CLV
Max. 10x CLV
Max. 10x CLV
Max. 4x ZCLV
Max. 2x CLV
Max. 4x ZCLV
Max. 2.4x CLV
Max. 2.4x CLV
Max. 2x ZCLV
16.6 (PIO MODE4)
16.6 (Multi Word Mode2)
33.3 (Ultra DMA Mode2)
Average access
time (msec)
Data Buffer Capacity 2MB
Supported Formats CD: CD-DA, CD-ROM, CD-R, CD-RW, CD-
CD-ROM
DVD-ROM
150 typ.
180 typ.
ROM XA, PHOTO CD, Video CD,
CD-Extra(CD+), CD-text
DVD:DVD-VIDEO, DVD-ROM,
DVD-R(3.9GB/4.7GB),
DVD-RW(Ver. 1.1),
DVD-RAM(2.6GB/4.7GB/9.4GB),
DVD+R, DVD+R DL, DVD+RW
TECRA S3 Maintenance Manual (960-532) [CONFIDENTIAL] 1-15
1 Hardware Overview
1.5 TFT Color Display
The TFT color display consists of 15.0-inch XGA/SXGA+ LCD module and FL inverter
board.
1.5.1 LCD Module
The LCD module used for the TFT color display uses a backlight as the light source and can
display a maximum of 16M colors with 1,024 x 768 or 1,400x 1,050 resolution. The
NVIDIA-made NV43 can control both internal and external XGA/SXGA+ support displays
simultaneously.
Figure 1-6 shows a view of the LCD module and Table 1-4 lists the specifications.
Figure 1-6 LCD module
Table 1-4 LCD module specifications (1/2)
Specifications (15.0-inch XGA TFT)
Item
Number of Dots
Dot spacing (mm) 0.297(H) × 0.297(V)
Display range (mm) 304.128(H) × 228.096(V)
1-16 [CONFIDENTIAL] TECRA S3 Maintenance Manual (960-532)
LG Philips
G33C00030110
SHARP
G33C0002Y110
1,024(W) × 768(H)
Samsung
G33C0002W110
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