Toshiba tecra m4 Service Manual

1
Toshiba Personal Computer
TECRA M4
Maintenance Manual
TOSHIBA CORPORATION
File Number 960-521
[CONFIDENTIAL]
Copyright
© 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed, with respect to the use of the information contained herein.
Toshiba TECRA M4 Maintenance Manual First edition April 2005
Disclaimer
This manual has been validated and reviewed for accuracy. The instructions and descriptions it contains are accurate for the Toshiba TECRA M4 at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions or discrepancies between the computer and the manual.
Trademarks
IBM is a registered trademark and IBM PC is a trademark of International Business Machines Corporation. Intel, Intel SpeedStep and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries/regions. Windows and Microsoft are registered trademarks of Microsoft Corporation. Photo CD is a trademark of Eastman Kodak. Sonic RecordNow! Is registered trademark of Sonic Solutions. Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license. i.LINK is trademark and registered trademark of Sony Corporation. InterVideo and WinDVD are registered trademarks of the InterVideo Inc. WinDVD Creator is trademark of the InterVideo Inc.
ii [CONFIDENTIAL] TECRA M4 Maintenance Manual (960-521)
Preface
This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M4, referred to as TECRA M4 in this manual.
The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.

SAFETY PRECAUTIONS

Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or serious bodily injury, if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily injury, if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property damage, if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance service.
Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
Be sure to fasten screws securely with the right screwdriver. Be sure to use the PH
Point size “0” and “1” screwdrivers complying with the ISO/DIS 8764-1:1996. If a screw is not fully fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.
If you replace the battery pack or RTC battery, be sure to use only the same model
battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.
TECRA M4 Maintenance Manual (960-521) [CONFIDENTIAL] iii
The manual is divided into the following parts:
Chapter 1 Hardware Overview describes the Satellite R10 system unit and each
FRU.
Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve
FRU problems.
Chapter 3 Test and Diagnostics describes how to perform test and diagnostic
operations for maintenance service.
Chapter 4 Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
Handling the LCD module Board layout Pin assignment Keyboard scan/character codes Key layout Wiring Diagrams BIOS Rewrite Procedures EC/KBC Rewrite Procedures Reliability
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Conventions
This manual uses the following formats to describe, identify, and highlight terms and operating procedures.
Acronyms
On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Key operation
Some operations require you to simultaneously use two or more keys. We identify such operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If three keys are used, hold down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISKCOPY A: B:
The display
Text generated by the Satellite R10 that appears on its display is presented in the type face below:
Format complete System transferred
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Table of Contents

Chapter 1 Hardware Overview

1.1 Features......................................................................................................................1-1
1.2 2.5-inch Hard Disk Drive......................................................................................... 1-11
1.3 Optical Drive............................................................................................................ 1-13
1.4 Keyboard..................................................................................................................1-26
1.5 TFT Color Display...................................................................................................1-27
1.6 Power Supply...........................................................................................................1-29
1.7 Batteries ...................................................................................................................1-32
1.8 AC Adapter.............................................................................................................. 1-35

Chapter 2 Troubleshooting Procedures

2.1 Troubleshooting......................................................................................................... 2-1
2.2 Troubleshooting Flowchart........................................................................................2-2
2.3 Power Supply Troubleshooting..................................................................................2-6
2.4 System Board Troubleshooting................................................................................2-17
2.5 USB 3.5” FDD Troubleshooting..............................................................................2-33
2.6 2.5” HDD Troubleshooting...................................................................................... 2-36
2.7 Keyboard Troubleshooting ......................................................................................2-41
2.8 Display Troubleshooting.......................................................................................... 2-42
2.9 Touch Pad Troubleshooting.....................................................................................2-44
2.10 Selectable bay(optical drive) Troubleshooting........................................................2-45
2.11 Modem Troubleshooting.......................................................................................... 2-46
2.12 Bluetooth Troubleshooting ......................................................................................2-47
2.13 LAN Troubleshooting..............................................................................................2-50
2.14 Sound Troubleshooting............................................................................................2-51
2.15 SD Card Slot Troubleshooting................................................................................. 2-52
2.16 Tablet Pen Troubleshooting.....................................................................................2-53
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2.17 Wireless LAN Troubleshooting...............................................................................2-55

Chapter 3 Tests and Diagnostics

3.1 The Diagnostic Test................................................................................................... 3-1
3.2 Executing the Diagnostic Test...................................................................................3-4
3.3 Setting of the hardware configuration........................................................................3-8
3.4 Heatrun Test.............................................................................................................3-11
3.5 Subtest Names.......................................................................................................... 3-12
3.6 System Test.............................................................................................................. 3-14
3.7 Memory Test............................................................................................................ 3-16
3.8 Keyboard Test.......................................................................................................... 3-17
3.9 Display Test.............................................................................................................3-18
3.10 Floppy Disk Test...................................................................................................... 3-21
3.11 Printer Test...............................................................................................................3-23
3.12 Async Test ............................................................................................................... 3-25
3.13 Hard Disk Test.........................................................................................................3-26
3.14 Real Timer Test........................................................................................................3-29
3.15 NDP Test.................................................................................................................. 3-31
3.16 Expansion Test.........................................................................................................3-32
3.17 CD-ROM/DVD-ROM Test ..................................................................................... 3-34
3.18 Error Code and Error Status Names.........................................................................3-35
3.19 Hard Disk Test Detail Status....................................................................................3-38
3.20 Only One Test.......................................................................................................... 3-40
3.21 Head Cleaning.......................................................................................................... 3-48
3.22 Log Utilities.............................................................................................................3-49
3.23 Running Test............................................................................................................ 3-51
3.24 Floppy Disk Drive Utilities......................................................................................3-52
3.25 System Configuration ..............................................................................................3-57
3.26 Wireless LAN Test Program (Intel-made b/g).........................................................3-59
3.27 Wireless LAN Test Program (Intel-made a/b/g)......................................................3-63
3.28 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-68
3.29 Sound Test Program.................................................................................................3-82
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3.30 SETUP ....................................................................................................................3-88

Chapter 4 Replacement Procedures

4.1 Overview...................................................................................................................4-1
4.2 Battery pack..............................................................................................................4-8
4.3 PC card/SD card......................................................................................................4-10
4.4 Memory module......................................................................................................4-12
4.5 HDD........................................................................................................................4-14
4.6 Selectable bay module ............................................................................................4-16
4.7 Keyboard.................................................................................................................4-19
4.8 Bottom cover assembly...........................................................................................4-21
4.9 Battery latch assembly/Selectable bay lock............................................................4-23
4.10 QI button assembly/PC card slot brace...................................................................4-25
4.11 Bluetooth module....................................................................................................4-27
4.12 MDC/Modem cable ................................................................................................4-29
4.13 Wireless LAN card .................................................................................................4-32
4.14 Fan/CPU..................................................................................................................4-34
4.15 DC-IN jack..............................................................................................................4-39
4.16 Penholder/RTC battery ...........................................................................................4-40
4.17 LCD harness holder................................................................................................4-42
4.18 Mic (L) cable guide................................................................................................ 4-45
4.19 QI board/CN board ................................................................................................ 4-47
4.20 System board...........................................................................................................4-49
4.21 PC card slot cover ...................................................................................................4-51
4.22 Speaker....................................................................................................................4-52
4.23 Microphone/Front panel..........................................................................................4-53
4.24 Lens holder..............................................................................................................4-57
4.25 Touch pad................................................................................................................4-58
4.26 LCD unit & FL inverter ..........................................................................................4-59
4.27 Application switch board........................................................................................4-63
4.28 LCD latch assembly................................................................................................4-64
4.29 Digitizer ..................................................................................................................4-65
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4.30 LCD harnesses & Wireless LAN/Bluetooth antennas............................................4-71
4.31 Hinge switch Board.................................................................................................4-76
4.32 Fluorescent Lamp....................................................................................................4-77

Appendices

Appendix A Handling the LCD Module .......................................................................A-1
Appendix B Board Layout ............................................................................................B-1
Appendix C Pin Assignment ......................................................................................... C-1
Appendix D Keyboard Scan/Character Codes ..............................................................D-1
Appendix E Key Layout.................................................................................................E-1
Appendix F Wiring Diagrams........................................................................................F-1
Appendix G BIOS Rewrite Procedures.........................................................................G-1
Appendix H EC/KBC Rewrite Procedures.................................................................... H-1
Appendix I Reliability....................................................................................................I-1
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Chapter 1 Hardware Overview
[CONFIDENTIAL]
1 Hardware Overview
1 Hardware Overview
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1 Hardware Overview

Chapter 1 Contents

1.1 Features...................................................................................................................... 1-1
1.2 2.5-inch Hard Disk Drive......................................................................................... 1-11
1.3 Optical Drive............................................................................................................ 1-13
1.3.1 DVD-ROM Drive............................................................................... 1-13
1.3.2 DVD-ROM & CD-R/RW Drive ........................................................ 1-16
1.3.3 DVD Super Multi Drive..................................................................... 1-19
1.3.4 DVD Super Multi Drive (Double-layer)............................................ 1-22
1.4 Keyboard.................................................................................................................. 1-26
1.5 TFT Color Display................................................................................................... 1-27
1.5.1 LCD Module ...................................................................................... 1-27
1.5.2 FL Inverter Board............................................................................... 1-28
1.6 Power Supply........................................................................................................... 1-29
1.7 Batteries ...................................................................................................................1-32
1.7.1 Main Battery....................................................................................... 1-32
1.7.2 Battery Charging Control...................................................................1-33
1.7.3 RTC Battery .......................................................................................1-34
1.8 AC Adapter.............................................................................................................. 1-35
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1 Hardware Overview
Figures
Figure 1-1 Front of the computer.....................................................................................1-5
Figure 1-2 System units configuration ............................................................................ 1-6
Figure 1-3 System Block Diagram ..................................................................................1-7
Figure 1-4 2.5-inch HDD............................................................................................... 1-11
Figure 1-5 DVD-ROM drive ......................................................................................... 1-13
Figure 1-6 DVD-ROM & CD-R/RW drive................................................................... 1-16
Figure 1-7 DVD Super Multi drive ............................................................................... 1-19
Figure 1-8 DVD Super Multi drive (Double-layer)....................................................... 1-22
Figure 1-9 Keyboard...................................................................................................... 1-26
Figure 1-10 LCD module.................................................................................................1-27
Tables
Table 1-1 2.5-inch HDD Specifications....................................................................... 1-11
Table 1-2 DVD-ROM drive outline dimensions..........................................................1-13
Table 1-3 DVD-ROM drive specifications.................................................................. 1-14
Table 1-4 DVD-ROM & CD-R/RW drive outline dimensions.................................... 1-16
Table 1-5 DVD-ROM & CD-R/RW drive specifications............................................ 1-17
Table 1-6 DVD Super Multi drive outline dimensions................................................ 1-19
Table 1-7 DVD Super Multi drive specifications ........................................................ 1-20
Table 1-8 DVD Super Multi drive (Double-layer) outline dimensions .......................1-22
Table 1-9 DVD Super Multi drive (Double-layer) specifications................................ 1-23
Table 1-10 LCD module specifications (14.1 TFT).......................................................1-27
Table 1-11 FL inverter board specifications ..................................................................1-28
Table 1-12 Power supply output specifications ............................................................. 1-30
Table 1-13 Battery specifications................................................................................... 1-32
Table 1-14 Time required for charges of main battery .................................................. 1-33
Table 1-15 Data preservation time................................................................................. 1-33
Table 1-16 RTC battery charging/data preservation time..............................................1-34
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Table 1-17 AC adapter specifications............................................................................1-35
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1.1 Features 1 Hardware Overview
1 Features

1.1 Features

The TECRA M4 is an ultra thin and lightweight tablet PC realizing cable-less environment on a table by wireless function with a Intel ® Mobile Pentium ®-M processor realizing high performance.
Microprocessor
Microprocessor that is used will be different of the model.
¾ Intel ® Mobile Pentium ®-M Processor
1.60GHz (Processor Number ; 730)
1.73GHz (Processor Number ; 740)
1.86GHz (Processor Number ; 750)
2.00GHz (Processor Number ; 760)
2.13GHz (Processor Number ; 770) PPV: 0.748 to 1.308
L1 cache : 64KB (32KB(Code) + 32KB(Data)) L2 cache : 2MB
Chipset
Equipped with Intel 915PM as North Bridge, Intel ICH6-M as South Bridge and Texas Instrument PCI7411ZHK as Card Controller.
GPU Controller
Equipped with a nVIDIA MEP43L with 64MB/128MB.
Memory
Two DDR2 SO-DIMM slots support DDR2 400 or DDR2 533. Memory modules can be installed to a maximum of 2GB (2,048MB). Memory modules of 256MB, 512MB and 1GB sizes are available.
HDD
Single SATA 40/60/80/100GB internal drive. 2.5-inch x 9.5mm height
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1 Hardware Overview 1.1 Features
Selectable Bay
Supporting hot-swap with DVD-ROM drive, DVD-ROM & CD-R/RW drive, DVD
nd
Super Multi drive, 2
HDD adapter and 2nd battery.
USB FDD
3.5 inch USB FDD supports 720KB/1.44MB formats.
Display
Display swivels automatically 0/90/180/270 degrees by display driver. LCD and CRT can be displayed at the same time.
LCD Built-in 14.1 inch, 16M colors, SXGA+ (1,400×1,050 dots), thin type low
temperature poly-silicon TFT color display. External monitor Supported via an RGB connector Video-out Supported via an S-Video connector
Digitizer
Digitizer is installed at the rear of LCD unit. The supplied tablet pen enables pen computing.
Tablet pen / Reserve pen
Tablet pen / Reserve pen can be used as a mouse by touching the display softly with the pen tip. Tablet button on the side of the pen corresponds to the right click of the mouse. Erase button on the pen tail can be used as an eraser depending on the application.
Keyboard
Keyboard has 85(US)/86(UK)-key with a pointing stick (AccuPoint) and supports Windows key and Hot key.
Touch pad
Touch pad is installed as a pointing device.
Batteries
The computer has two batteries: a rechargeable Lithium-Ion main battery pack and an RTC battery (that backs up the Real Time Clock and CMOS memory).
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1.1 Features 1 Hardware Overview
USB (Universal Serial Bus)
Three USB ports are usable. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.
PC card slot
The PC card slot (PCMCIA) accommodates one 5mm Type II card. (Based on PC Card Standard, supporting CardBus)
SD card slot
A SD Card Slot can accommodate Secure Digital flash memory cards with various capacities. Supporting memory card and I/O card.
Sound system
The sound system is equipped with the following features:
- Built-in stereo speakers
- Built-in monaural microphone
- Stereo Headphone jack (3.5mm mini headphone jack)
- External microphone jack (3.5mm mini microphone jack)
Switch/Button
Windows Security tablet button, ESC/Rotation button, Cross Function button, Toshiba Application button and Wireless communication switch are available.
Internal Modem
The internal modem is equipped as a modem daughter card (MDC). The internal modem provides capability for data and fax communication and supports
ITU-T V.90 standard. For data reception it operates at 56Kbps and for data transmission it operates at 33.6Kbps. For fax transmission, it operates at 14,4Kbps. The speed of data transfer and fax depends on analog telephone line condition. It has an RJ11 modem jack for connecting to a telephone line.
LAN
The internal LAN supports 10/100Mbit or Gigabit Ethernet.
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1 Hardware Overview 1.1 Features
Wireless LAN
Wireless LAN Card can be equipped with mini-PCI slot. Based on IEEE802.11b/g, a/b/g with 2.45GHz/5.0GHz Dual-band antenna.
i.LINK (IEEE1394)
This port enables high-speed data transfer directly from external devices such as digital video cameras.
Docking port
Advanced Port Replicator III and Tablet Multi Dock II can be connected through docking port on the bottom.
Infrared port The infrared port is compatible with Fast infrared (FIR) standards enabling wireless
4 Mbps, 1.152 Mbps, 115.2 kbps, 57.6 kbps, 38.4 kbps, 19.2 kbps or 9.6 kbps data transfer with Infrared Data Association (IrDA) 1.1 compatible external devices.
Bluetooth The computer is equipped with Bluetooth (V1.2) communications standard that
enables wireless connection between electronic devices such as computers and printers. It supports wireless communication switch.
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1.1 Features 1 Hardware Overview
Figure 1-1 shows the front of the computer and Figure 1-2 shows the system units configuration.
Figure 1-1 Front of the computer
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1 Hardware Overview 1.1 Features
Figure 1-2 System units configuration
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1.1 Features 1 Hardware Overview
Figure 1-3 shows the system block diagram.
Figure 1-3 System Block Diagram
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1 Hardware Overview 1.1 Features
The PC contains the following components.
CPU ¾ Intel ® Mobile Pentium ®-M Processor
1.60GHz (Processor Number ; 730)
1.73GHz (Processor Number ; 740)
1.86GHz (Processor Number ; 750)
2.00GHz (Processor Number ; 760)
2.13GHz (Processor Number ; 770)
Core voltage : 0.748 to 1.308 FSB : 533MHz L1 cache : 64KB [32KB (Code) + 32KB (Data)] L2 cache : 2MB Support : Geyservile III , Deeper Sleep Mode
Memory
Two DDR2 SO-DIMM slots support DDR2 400/DDR2 533 Memory modules in 256MB, 512 MB and 1GB can be installed to a maximum of 2GB (2,048MB).
1.8V operation 240 pin, SO Dual In-line Memory Modules (SO-DIMM) Supports PC3200/PC4300
BIOS ROM (Flash memory)
8Mbit
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PCI chipset
This gate array incorporates the following elements and functions
Intel 915PM (North Bridge)
- Dothan Processor System Bus Support
- System Memory Interface
- Memory Control: supports DDR333, DDR2-400/DDR2-533 2Gbmax.
- Graphics I/F: x16 PCI Express Based Graphics I/F
- DMI(Direct Media Interface)
- 1,257-ball, 40.0×37.5×2.6mm, FC-BGA package
Intel ICH6-M (South Bridge)
- DMI(Direct Media Interface)
- PCI Express I/F (4 ports)
- PCI Bus I/F Rev2.37 PCI REQ/GNT Pairs
- Integrated Serial ATA Host Controller (2 Prots,150MB/S)
- Integrated IDE ControllerUltra ATA 100/66/33
- AC’97 2.3 codecs
- USB 1.1/2.0 Controller 8 ports (EHCI: Enhanced Host Controller)
- Built-in LAN controller (WfM 2.0 & IEEE 802.3 compliance)
- Power Management (ACPI 2.0 compliance)
- SMBus2.0 controller
- FWH interface (BIOS)
- LPC interface (EC/KBC, Super I/O)
- IRQ controller
- Serial Interrupt Function
- Suspend/Resume control
- Built –in RTC
- GPIO
- 609-ball, 31×31mm, micro BGA Package
PC Card Controller (Texas Instruments-made PCI7411ZHK)
- PCI interface
- CardBus/Ultra Media controller
- SD card controller
- IEEEE1394 controller
- 288-ball (16x16x1.4) BGA package
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1 Hardware Overview 1.1 Features
GPU controller (Internal graphic controller)
- VRAM 64/128MB
- PCI Express interface
- LCD I/F LVDS 2ch
- S-video support
Batteries
The main battery is a detachable lithium-ion main battery (10.8V, 4700mAh, 6 cell) and the RTC battery is a lithium ion battery (2.4V-16mAh).
Modem controller
Supported by MDC. Using of the secondary AC97 Line
LAN controller (Marvell made)
Controls LAN and supports 10/100Mbit or Gigabit Ethernet.
Other main system chips
- EC/KBC (Mitsubishi-made LPC microcontroller M306KAFCLRP)
- PSC (Toshiba-made TMP87PM48UG)
- Temperature sensor (ADM-made ADM1032ARMZ)
- Acceleration sensor (ST Micro-made LIS3L02AQ)
- Super I/O (SMSC-made LPC47N217-JN)
- SOUND CODEC (ADM-made AD1981B)
- AMP (Matsushita-made MM1667XHFE) + HP AMP (MAX4410)
- CLK Generator (ICS-made ICS950812CGLFT)
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1.2 2.5-inch Hard Disk Drive 1 Hardware Overview

1.2 2.5-inch Hard Disk Drive
A compact, high-capacity SATA HDD with a height of 9.5mm contains a 2.5-inch magnetic disk and magnetic heads.
Figure 1-4 shows a view of the 2.5-inch HDD and Tables 1-1 list the specifications.
Figure 1-4 2.5-inch HDD
Table 1-1 2.5-inch HDD Specification (1/2)
Specifications
Items
Outline Width (mm) dimensions Height (mm) Depth (mm) Weight (g)
Storage size (formatted) 40GB 60GB 80GB Speed (RPM) 5,400 Data transfer rate
Media Host
Data buffer size (MB) 8 Average random seek time
(ms) Read
FUJITU
G8BC0001R410
1.5Gb/s (Serial-ATA Generation-1)
FUJITU
G8BC0001R610
70
9.5
100
99 max.
53.9MB/s max
12
FUJITU
G8BC0001R810
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1 Hardware Overview 1.2 2.5-inch Hard Disk Drive
Table 1-1 2.5-inch HDD Specifications(2/2)
Specifications
Items
Outline Width (mm) dimensions Height (mm) Depth (mm) Weight (g)
Storage size (formatted) 100GB Speed (RPM) 5400
TOSHIBA
HDD2D30BZK01
100
9.5
69.85 98
Data transfer speed (MB/s) Internal Host
Data buffer size (MB) 8 Access time (ms)
Average seek time Track to Track Max seek
236.1-456.0 150
12
2
22
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1.3 Optical Drive 1 Hardware Overview

1.3 Optical Drive

1.3.1 DVD-ROM Drive

The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD­ROM and CD-R/RW and DVD-RAM (read-only).
The DVD-ROM drive is shown in Figure 1-5. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-2, Table 1-3.
Figure 1-5 DVD-ROM drive
Table 1-2 DVD-ROM drive outline dimensions
Specifications
Items
Outline Width (mm) dimensions Height (mm) Depth (mm) Weight (g)
TSST
G8BC0002B410
128±0.2
12.7±0.2
126.1 129.4 170 180
TEAC
G8BC0002E410
128.0
12.7
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1 Hardware Overview 1.3 Optical Drive
Table 1-3 DVD-ROM drive specifications (1/2)
Parameter
Data transfer
speed
Access time
(ms)
Buffer memory 256KByte
Supported disk format
Drive Specification
TSST (G8CC0002B410)
DVD-ROM(Single-L) MAX 8x(CAV) [MAX 10816KB/s] DVD-ROM(Double-L) MAX 6x(CAV) [MAX 8112KB/s] DVD-R/-RW MAX 4x(CAV) [MAX 5408KB/s] DVD+R/+RW MAX 4x(CAV) [MAX 5408KB/s]
Read
ATAPI interface
(MB/s)
CD-ROM 110 (Random) DVD-ROM 110 (Random) DVD-RAM 140 (Random)
CD
DVD
DVD-RAM(Ver2.1) MAX 2x(ZCLV) [MAX 2704KB/s] CD(Mode1) MAX 24x(CAV) [MAX 3600KB/s] CD(Mode2) MAX 24x(CAV) [MAX 4104KB/s] CD-DA(Mode1) MAX 10x(CLV) [MAX 1500KB/s] CD-DA(Mode2) MAX 10x(CLV) [MAX 1710KB/s]
PIO mode16.7 MB/s PIO-MODE4 supported
DMA mode16.7 MB/s MultiwordDMA-MODE2 supported
Ultra DMA mode 33.3 MB/s UltraDMA-MODE2 supported
CD-DA, CD+(E)G, CD-MIDI, CD-TEXT, CD-ROM, CD-ROM XA, CD-I, CD-I Bridge(Photo-CD, Video-CD), Multi-session CD(Photo-CD, CD-EXTRA, CD-R, CD-RW, Portfolio),CD-R, CD-RW
DVD-ROM (DVD-5, DVD-9, DVD-10, DVD-18), DVD-R (Ver1.0, Ver2.1), DVD-RW (Ver1.0, Ver1.1), DVD+R, DVD+RW, DVD-RAM (Version2.1)
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Table 1-3 DVD-ROM drive specifications (2/2)
Parameter
Data transfer
speed
Access time
(ms)
Buffer memory 256K
Supported disk format
Drive Specification
TEAC (G8CC0002E410)
DVD-ROM MAX 8x(CAV) [MAX 4594KB/s] DVD-VIDEO MAX 4x(CAV) [MAX 2297KB/s] DVD-R/RW MAX 8x(CAV) [MAX 4594KB/s]
Read
ATAPI interface
(MB/s)
CD-ROM 120 (Random) DVD-ROM 130 (Random)
CD
DVD
DVD-RAM(4.7GB) MAX 5x(CAV) [MAX 3246KB/s] DVD-RAM(2.6GB) MAX 2.5x(CAV) [MAX 1626KB/s] CD(Mode1) MAX 24x(CAV) [MAX 5137KB/s] CD(Mode2) MAX 20x(CAV) [MAX 4280KB/s] CD-RW MAX 24x(CLV) [MAX 5137KB/s]
PIO mode16.7 MB/s PIO-MODE4 supported
DMA mode16.7 MB/s MultiwordDMA-MODE2 supported
Ultra DMA mode 33.3 MB/s UltraDMA-MODE2 supported
CD-DA, CD-ROM MODE1, CD-ROM MODE2, Multi-session CD, Video-CD, Enhanced CD, CD-TEXT, Photo-CD, addressing Method 2
DVD-ROM DVD-R (General, Authoring, Single/Multi-boarder), DVD-Video, DVD-RW (Single/Multi-boarder, Packet), DVD-RAM (4.7GB, 2.6GB), DVD+R/RW (Single/Multi-boarder, Packet)
TECRA M4 Maintenance Manual (960-521) [CONFIDENTIAL] 1-15
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