Toshiba tecra m3 Service Manual

Toshiba Personal Computer
TECRA M3
Maintenance Manual
TOSHIBA CORPORATION
File Number 960-507
© 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein.
Toshiba Personal Computer TECRA M3 Maintenance Manual
First edition January 2005
Disclaimer
The information presented in this manual has been reviewed and validated for accuracy. The included set of instructions and descriptions are accurate for the TECRA M3 at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Therefore, Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions, or discrepancies between any succeeding product and this manual.
Trademarks
Intel SpeedStep and Penteium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries/regions. Windows and Microsoft are registered trademarks of Microsoft Corporation. Photo CD is a trademark owned by its proprietor and used by TOSHIBA under license. Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license.
ii TECRA M3 Maintenance Manual (960-507)

Preface

This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M3.
The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
SAFETY PRECAUTIONS
Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or
serious bodily injury, if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily
injury, if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property
damage, if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance
service.
Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
Be sure to fasten screws securely with the right screwdriver. If a screw is not fully
fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.
If you replace the battery pack or RTC battery, be sure to use only the same model
battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.
TECRA M3 Maintenance Manual (960-507) iii
The manual is divided into the following parts:
Chapter 1 Hardware Overview describes the TECRA M3 system unit and each
FRU.
Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve
FRU problems.
Chapter 3 Test and Diagnostics describes how to perform test and diagnostic
operations for maintenance service.
Chapter 4 Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
Handling the LCD module Board layout Pin assignments Keyboard scan/character codes Key layout Wiring diagrams BIOS rewrite procedures EC/KBC rewrite procedures Reliability
iv TECRA M3 Maintenance Manual (960-507)
Conventions
This manual uses the following formats to describe, identify, and highlight terms and operating procedures.
Acronyms
On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Key operation
Some operations require you to simultaneously use two or more keys. We identify such
operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If
three keys are used, hold down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISKCOPY A: B:
The display
Text generated by the computer that appears on its display is presented in the type face below:
Format complete System transferred
TECRA M3 Maintenance Manual (960-507) v

Table of Contents

Chapter 1 Hardware Overview
1.1 Features ...................................................................................................................... 1-1
1.2 System Unit Block Diagram ...................................................................................... 1-8
1.3 3.5-inch Floppy Disk Drive (USB External) ........................................................... 1-16
1.4 2.5-inch Hard Disk Drive......................................................................................... 1-17
1.5 CD-ROM Drive ....................................................................................................... 1-21
1.6 DVD-ROM Drive .................................................................................................... 1-22
1.7 CD-RW/DVD-ROM Drive...................................................................................... 1-24
1.8 DVD±R/±RW Drive ................................................................................................ 1-26
1.9 DVD±R/±RW/-RAM ( DVD-Super Multi) Drive................................................... 1-27
1.10 Keyboard..................................................................................................................1-29
1.11 TFT Color Display...................................................................................................1-30
1.12 Power Supply ........................................................................................................... 1-33
1.13 Batteries ................................................................................................................... 1-35
Chapter 2 Troubleshooting Procedures
2.1 Troubleshooting ......................................................................................................... 2-1
2.2 Troubleshooting Flowchart........................................................................................ 2-2
2.3 Power Supply Troubleshooting.................................................................................. 2-6
2.4 System Board Troubleshooting................................................................................ 2-16
2.5 USB FDD Troubleshooting .....................................................................................2-29
2.6 HDD Troubleshooting ............................................................................................. 2-32
2.7 Keyboard and Touch pad Troubleshooting.............................................................. 2-37
2.8 Display Troubleshooting.......................................................................................... 2-40
2.9 Optical Drive Troubleshooting ................................................................................ 2-42
2.10 Modem Troubleshooting.......................................................................................... 2-44
2.11 LAN Troubleshooting.............................................................................................. 2-46
2.12 Bluetooth Troubleshooting ...................................................................................... 2-47
vi TECRA M3 Maintenance Manual (960-507)
2.13 Wireless LAN Troubleshooting............................................................................... 2-50
2.14 Sound Troubleshooting............................................................................................ 2-53
2.15 SD Card Slot Troubleshooting................................................................................. 2-56
2.16 Express Card Slot Troubleshooting ......................................................................... 2-57
Chapter 3 Tests and Diagnostics
3.1 The Diagnostic Test ................................................................................................... 3-1
3.2 Executing the Diagnostic Test ................................................................................... 3-4
3.3 Setting of the hardware configuration ....................................................................... 3-8
3.4 Heatrun Test............................................................................................................. 3-11
3.5 Subtest Names.......................................................................................................... 3-12
3.6 System Test.............................................................................................................. 3-14
3.7 Memory Test............................................................................................................ 3-16
3.8 Keyboard Test.......................................................................................................... 3-17
3.9 Display Test ............................................................................................................. 3-18
3.10 Floppy Disk Test...................................................................................................... 3-21
3.11 Printer Test............................................................................................................... 3-23
3.12 Async Test ............................................................................................................... 3-25
3.13 Hard Disk Test ......................................................................................................... 3-26
3.14 Real Timer Test........................................................................................................ 3-29
3.15 NDP Test.................................................................................................................. 3-31
3.16 Expansion Test......................................................................................................... 3-32
3.17 CD-ROM/DVD-ROM Test ..................................................................................... 3-34
3.18 Error Code and Error Status Names......................................................................... 3-35
3.19 Hard Disk Test Detail Status ................................................................................... 3-38
3.20 ONLY ONE TEST................................................................................................... 3-40
3.21 Head Cleaning.......................................................................................................... 3-46
3.22 Log Utilities ............................................................................................................. 3-47
3.23 Running Test............................................................................................................ 3-49
3.24 Floppy Disk Drive Utilities...................................................................................... 3-50
3.25 System Configuration .............................................................................................. 3-55
TECRA M3 Maintenance Manual (960-507) vii
3.26 Wireless LAN Test Program (Intel-made Calexico2 a /g)....................................... 3-57
3.27 Wireless LAN Test Program (Intel-made Calexico2 b/g) ....................................... 3-62
3.28 Wireless LAN Test Program (Askey-made Atheros) .............................................. 3-66
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-70
3.30 Sound Test program................................................................................................. 3-84
3.31 SETUP ..................................................................................................................... 3-90
Chapter 4 Replacement Procedures
4.1 General....................................................................................................................... 4-1
4.2 Battery pack ............................................................................................................... 4-8
4.3 PC card / Express card ............................................................................................. 4-10
4.4 SD card..................................................................................................................... 4-11
4.5 HDD......................................................................................................................... 4-12
4.6 Slim select bay module ............................................................................................ 4-16
4.7 Keyboard.................................................................................................................. 4-19
4.8 Memory module....................................................................................................... 4-25
4.9 Cover / Touch pad.................................................................................................... 4-27
4.10 Modem Daughter Card (MDC)................................................................................ 4-34
4.11 Wireless LAN board ................................................................................................ 4-36
4.12 Bluetooth module..................................................................................................... 4-38
4.13 Display assembly ..................................................................................................... 4-40
4.14 Sound board ............................................................................................................. 4-45
4.15 RTC battery / HDD con holder................................................................................ 4-47
4.16 LAN jack.................................................................................................................. 4-50
4.17 RGB harness holder / RGB board / Modem jack ....................................................4-51
4.18 Fan............................................................................................................................ 4-55
4.19 Cooling fin / CPU .................................................................................................... 4-57
4.20 System board / DC-IN jack...................................................................................... 4-61
4.21 Speaker..................................................................................................................... 4-62
4.22 Power switch board.................................................................................................. 4-64
4.23 LCD unit/FL inverter ............................................................................................... 4-66
4.24 Microphone / Wireless LAN antenna / Bluetooth antenna...................................... 4-77
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4.25 Hinge........................................................................................................................ 4-80
4.26 Fluorescent Lamp..................................................................................................... 4-85
Appendices
Appendix A Handling the LCD Module ........................................................................... A-1
Appendix B Board Layout ................................................................................................ B-1
Appendix C Pin Assignments............................................................................................ C-1
Appendix D Keyboard Scan/Character Codes .................................................................. D-1
Appendix E Key Layout.....................................................................................................E-1
Appendix F Wiring Diagrams............................................................................................F-1
Appendix G BIOS rewrite Procedures .............................................................................. G-1
Appendix H EC/KBC rewrite Procedures......................................................................... H-1
Appendix I Reliability........................................................................................................I-1
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x TECRA M3 Maintenance Manual (960-507)
Chapter 1
Hardware Overview
1 Hardware Overview
1-ii TECRA M3 Maintenance Manual (960-507)
1 Hardware Overview
Chapter 1 Contents
1.1 Features.......................................................................................................................1-1
1.2 System Unit Block Diagram.......................................................................................1-8
1.3 3.5-inch Floppy Disk Drive (USB External)............................................................1-16
1.4 2.5-inch Hard Disk Drive .........................................................................................1-17
1.5 CD-ROM Drive ........................................................................................................1-21
1.6 DVD-ROM Drive.....................................................................................................1-22
1.7 CD-RW/DVD-ROM Drive.......................................................................................1-24
1.8 DVD±R/±RW Drive.................................................................................................1-26
1.9 DVD±R/±RW/-RAM (DVD-Super Multi) Drive ....................................................1-27
1.10 Keyboard ..................................................................................................................1-29
1.11 TFT Color Display ...................................................................................................1-30
1.11.1 LCD Module .......................................................................................1-30
1.11.2 FL Inverter Board ...............................................................................1-32
1.12 Power Supply............................................................................................................1-33
1.13 Batteries....................................................................................................................1-35
1.13.1 Main Battery .......................................................................................1-35
1.13.2 Battery Charging Control....................................................................1-36
1.13.3 RTC battery.........................................................................................1-37
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1 Hardware Overview
Figures
Figure 1-1 Front of the computer .....................................................................................1-6
Figure 1-2 System unit configuration...............................................................................1-7
Figure 1-3 System unit block diagram .............................................................................1-8
Figure 1-4 3.5-inch FDD (USB External) ......................................................................1-16
Figure 1-5 2.5-inch HDD ...............................................................................................1-17
Figure 1-6 CD-ROM drive .............................................................................................1-21
Figure 1-7 Keyboard ......................................................................................................1-29
Figure 1-8 LCD module .................................................................................................1-30
Tables
Table 1-1 3.5-inch FDD specifications .........................................................................1-16
Table 1-2 2.5-inch HDD specifications ........................................................................1-17
Table 1-3 CD-ROM drive specifications ......................................................................1-21
Table 1-4 DVD-ROM drive specifications ...................................................................1-22
Table 1-5 CD-RW/DVD-ROM drive specifications ....................................................1-24
Table 1-6 DVD±R/±RW drive specifications...............................................................1-26
Table 1-7 DVD Super Multi drive specifications.........................................................1-27
Table 1-8 LCD module specifications ..........................................................................1-30
Table 1-9 FL inverter board specifications ...................................................................1-32
Table 1-10 Power supply output rating...........................................................................1-34
Table 1-11 Battery specifications ...................................................................................1-35
Table 1-12 Time required for charges ............................................................................1-36
Table 1-13 RTC battery charging/data preservation time...............................................1-37
1-iv TECRA M3 Maintenance Manual (960-507)
1.1 Features 1 Hardware Overview
1 Features
1.1 Features
The Toshiba TECRA M3 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features.
Microprocessor
The TECRA M3 computer is equipped with an Intel Dothan Processor. The Intel Dothan Processor incorporates a math co-processor, a 64KB L1 cache memory and a 2MB L2 cache memory. The PC comes in with one of the following speeds:
1.6BGHz/1.73GHz/1.86GHz/2.0AGHz/2.13GHz (0.748 to 1.356V)
These processors operate at 533MHz bus clock.
Chipset
The TECRA M3 is equipped with Intel Alviso-PM, Intel ICH6-M and TI PCI7411.
Graphics Processing Unit
The computer has a NVIDIA MEP43L Graphics Processing Unit (GPU). The internal VRAM is 64MB or 128MB.
Memory
The computer comes with two PC3300/PC4300 compatible DDR2 SO-DIMM slots. Two memory modules of 256GB, 512MB or 1GB(1,024MB) can be installed.
HDD
The computer has a 2.5-inch HDD. The following capacities are available.
40/60/80/100 GB
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1 Hardware Overview 1.1 Features
USB FDD
A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks.
Slim Select Bay
An Optical drive, 2nd HDD or 2nd Battery can be installed in the Slim Select Bay.
Optical Drive
A CD-ROM drive, DVD-ROM drive, CD-RW/DVD-ROM drive, DVD±R/±RW drive or DVD super Multi drive can be installed in the Slim Select Bay.
Display
The PC comes in with one of the following two types:
14.1” XGA-TFT color display, resolution 1,024×768
14.1” SXGA+-TFT color display, resolution 1,400×1,050
A video controller and a 64/128MB VRAM enables an external monitor to display 16M colors at a resolution of 1,024×768 pixels or 1,400×1,050 pixels.
Keyboard
An-easy-to-use 85(US)/86(UK)-key keyboard provides a numeric keypad overlay for fast numeric data entry or for cursor and page control. The keyboard also includes two keys that have special functions in Microsoft Windows 2000/XP. It supports software that uses a 101- or 102-key enhanced keyboard.
TOSHIBA Dual Pointing Device
The TOSHIBA Dual Pointing Device consists of Touch Pad and AccuPoint. The touch pad and control buttons enable control of the on-screen pointer and scrolling of windows. The pointer control stick and AccuPoint enables convenient control of the cursor.
Batteries
The computer has two or three batteries: a rechargeable Lithium-Ion main battery pack and RTC battery (that backs up the Real Time Clock and CMOS memory).
Second battery can be mounted in the slim select bay as an option.
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1.1 Features 1 Hardware Overview
Universal Serial Bus (USB2.0)
Two USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.
IEEE 1394 port
The computer comes with one IEEE 1394 port. It enables high-speed data transfer directly from external devices such as digital video cameras.
Parallel port
The parallel port enables connection of parallel printer or other parallel devices. (ECP compatible)
External monitor (RGB) port
The port enables connection of an external monitor, which is recognized automatically by Video Electronics Standards Association (VESA) Display Data Channel (DDC) 2B compatible functions.
PC card and ExpressCard slot
A PC card slot and an ExpressCard slot are provided. The PC card slot (PCMCIA) accommodates one Type II card and the ExpressCard slot accommodates an ExpressCard.
SD Card
The SD Card Slot can accommodate Secure Digital flash memory cards with various capacities. SD cards let you easily transfer data from devices, such as digital cameras and Personal Digital Assistants, which use SD Card flash-memory.
TECRA M3 Maintenance Manual (960-507) 1-3
1 Hardware Overview 1.1 Features
Docking interface port
The docking interface port enables connection of an optional Advanced Port Replicator III. It provides additional features as follows:
RJ-45 LAN jack, RJ-11 Modem jack
External monitor port
PS/2 mouse and PS/2 keyboard ports
Parallel port
Serial port
DC IN socket
Audio line-in, line out jack
Two USB ports
IEEE 1394 port
TV-out (S-Video)
DVI port
Infrared port
The infrared port is compatible with Fast InfraRed (FIR) standards enabling cableless 4 Mbps, 1.152 Mbps, 115.2 kbps, 57.6 kbps, 38.4 kbps, 19.2 kbps or 9.6 kbps data transfer with Infrared Data Association (IrDA) 1.1 compatible external devices.
Sound system
The sound system is equipped with the following features:
AC Link (in ICH6-M) and Analog Deveices AD1981B
AMP: Matsushita AN12491 and MAX4410
Stereo speakers
Built-in microphone
Volume control knob
Stereo headphone jack
External microphone jack
Supports VoIP
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1.1 Features 1 Hardware Overview
Video-out jack
The video jack enables to transfer NTSC or PAL data to external devices connected with S-Video cable.
Internal modem
The computer contains a MDC, enabling data and fax communication. It supports ITU-T V.90 (V.92). The transfer rates are 56 Kbps for data reception, 33.6 Kbps for data transmission, and 14,400 bps for fax transmission. However, the actual speed depends on the line quality. The RJ11 modem jack is used to accommodate a telephone line. Both of V.90 and V.92 are supported only in USA, Canada and Australia. Only V.90 is available in other regions.
Internal LAN
The computer is equipped with LAN circuits that support Ethernet LAN (10 megabits per second, 10BASE-T), Fast Ethernet LAN (100 megabits per second, 100 BASE-TX) or Gigabit Ethernet LAN (1000 megabits per second, 1000BASE-T). It also supports Wakeup on LAN (WOL), Magic Packet and LED.
Wireless LAN
The computer is equipped with a mini-PCI Type III wireless LAN board that supports
802.11 a/g or 802.11b/g in the Mini PCI card slot. This function can be switched on and off by a switch on the computer.
Bluetooth
The computer is equipped with Bluetooth (V1.2) communications standard enable wireless connection between electronic devices such as computers and printers. It supports kill SW.
Presentation button
This button switches the display between internal display, external display, simultaneous display and multi-monitor display.
Toshiba Console button
When this button is pressed during power-on, the PC is connected to “Toshiba Console”. When this button is pressed during power-off, the PC is turned on and connected to “Toshiba Console”.
TECRA M3 Maintenance Manual (960-507) 1-5
1 Hardware Overview 1.1 Features
The front of the computer is shown in figure 1-1.
Figure 1-1 Front of the computer
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1.1 Features 1 Hardware Overview
The system unit configuration is shown in figure 1-2.
Figure 1-2 System unit configuration
TECRA M3 Maintenance Manual (960-507) 1-7
1 Hardware Overview 1.2 System Unit Block Diagram

1.2 System Unit Block Diagram

Figure 1-3 is a block diagram of the system unit.
Figure 1-3 System unit block diagram
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1.2 System Unit Block Diagram 1 Hardware Overview
The system unit is composed of the following major components:
Processor
Intel Dothan Processor: 1.6BGHz/1.73GHz/1.86GHz/2.0AGHz/2.13GHz
– Processor core speed: 1.6GHz/1.73GHz/1.86GHz/2.0GHz/2.13GHz
– Processor bus speed: 533MHz
– Integrated L1 cache memory: 32KB instruction cache and 32KB write-back
data cache
– Integrated L2 cache memory of 2MB
– Integrated NDP
– 478-pin Micro FC-PGA package
Memory
Two memory slots are provided. Expansion up to 2GB (2,048MB) is available.
Memory
DDR2-SDRAM
DDR400 or DDR533 memory
1.8 volt operation
FBGA
Memory Module
240 pin, SO Dual In-line Memory Module (SO-DIMM)
PC3300 or PC4300
256MB/512MB/1GB(1,024MB)
– 256 MB: 256Mb×8
– 512 MB: 512Mb×8
– 1GB: 512Mb×16
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1 Hardware Overview 1.2 System Unit Block Diagram
Intel GMCH (North Bridge)
One Intel Alviso-PM is used.
Features:
– Supports Dothan Processor System Bus
– System Memory Interface
– Memory Control: supports DDR333, DDR2-400/DDR2-533 2Gbmax.
– Graphics I/F: x16 PCI Express Based Graphics I/F
– DMI(Direct Media Interface)
– 1,257-ball, 40.0×37.5×2.6mm, FC-BGA package
Intel ICH6-M (South Bridge)
One Intel UICH6MA is used.
Features:
– DMI(Direct Media Interface)
– PCI Express I/F (4 ports)
– PCI Bus I/F Rev2.37 PCI REQ/GNT Pairs
– Integrated Serial ATA Host Controller (2 Prots,150MB/S)
– Integrated IDE ControllerUltra ATA 100/66/33
– AC’97 2.3 codecs
– USB 1.1/2.0 Controller 8 ports (EHCI: Enhanced Host Controller)
– Built-in LAN controller (WfM 2.0 & IEEE 802.3 compliance)
– Power Management (ACPI 2.0 compliance)
– SMBus2.0 controller
– FWH interface (BIOS)
– LPC interface (EC/KBC, Super I/O)
– IRQ controller
– Serial Interrupt Function
– Suspend/Resume control
– Built –in RTC
– GPIO
– 609-ball, 31×31mm, micro BGA Package
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1.2 System Unit Block Diagram 1 Hardware Overview
Firmware Hub (FWH)
One STMicro M50FW080N is used.
Card controller (TI PCI7411ZHK)
PCI I/F
CardBus / Ultra media Controller (1 socket)
SD/MMC, Memory Stick, XD Card Controller
1394 Controller (2 ports)
288-ball, 16×16×1.4mm, BGA Package
VGA Controller
One NVIDIA MEP43L chip is used. The video controller incorporates graphics accelerator and video accelerator.
Built-in VRAM 64MB/128MB
PCI Express Interface
LCD Interface LVDS 2ch
Supports TV Encoder, S-Video
Sound Controller
One AC'97Codec AD1981B chip and AC-Link controller embedded in ICH6-M
SW sound
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1 Hardware Overview 1.2 System Unit Block Diagram
EC/KBC (Embedded Controller/Keyboard Controller)
One Mitsubishi M306KA micon chip functions as both EC and KBC.
EC
This controller controls the following functions:
– Power supply sequence
– Thermal conditions
– LEDs
– Beep
– Device ON/OFF
– Fan speed
– Universal I/O port
– Docker Docking Sequence
– Battery capacity check
– Forced reset
– Flash rewriting
– EC interface
– I2C communication
– EC access
– Slim Select Bay Control
KBC
This controller has the following functions:
– Scan controller to check status of keyboard matrix
– Interface controller between the keyboard scan controller and the system
– Control of switching and simultaneous operation of the accupoint and internal
keyboard
PSC (Power Supply Controller)
One TMP87PM48UG chip is used.
This controller controls the power sources.
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1.2 System Unit Block Diagram 1 Hardware Overview
Clock Generator
One ICS 954204BGFT is used.
This device generates the system clock.
Modem Controller
One Askey made MDC is used.
This controller has the following functions:
– One RJ11 port
– Digital line protection support
– Ring wake up support
– Analog audio support
– AC97 interface
– The following communication codes are supported
Data:
V.90 (56K bps) data communication control
V.92 (56K bps) data communication control
V.34 (33.6K to 2400bps) data communication control
V.44, V.42, V.42bis and MNP class 5 data compression
V.32 turbo, V.32 bis and fallbacks
Fax:
V.34 (33.6K to 2400 bps)
V.17 (14.4K, 12K, 7200 bps)
V.29 (9600, 7200 bps)
V.27 ter (4800, 2400 bps)
V.21 ch2 (300 bps)
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1 Hardware Overview 1.2 System Unit Block Diagram
Internal LAN Controller
One internal chip (Marvell made 88E8053 or 88E8036) is used.
This controller has the following functions:
– 10/100M-Ethernet (88E8036)
– Gigabit-Ethernet chip (88E8053)
– WOL support
– Magic Packet support
– LED support
Wireless LAN
One Mini PCI card for wireless LAN with Type III card bus controller.
Super I/O
One LPC47N217 chip is used.
This gate array has the following features:
– Floppy Disk Controller
– Infrared Communications Controller
– Parallel Port Controller
IEEE1394
One TI PCI7411 is used.
Sensor
Thermal Sensor: One ADM1032ARMZ chip is used.
LCD Sensor: One NRS-701-1015T chip is used.
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1.2 System Unit Block Diagram 1 Hardware Overview
Other major chips
Clock Generator: One 954204BGFTCG chip is used.
TECRA M3 Maintenance Manual (960-507) 1-15
1 Hardware Overview 1.3 3.5-inch Floppy Disk Drive (USB External)

1.3 3.5-inch Floppy Disk Drive (USB External)

The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks.
The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1.
Figure 1-4 3.5-inch FDD (USB External)
Table 1-1 3.5-inch FDD specifications
Items
720KB mode 1.44MB mode
FDD part 250K bits/second 500K bits/second Data transfer rate
USB Full speed mode (12M bits/second)
Disk rotation speed 300rpm
Track density 5.3 track/mm (135TPI)
TEAC G8AC0000B310
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