Toshiba tecra m3 Service Manual

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Toshiba Personal Computer
TECRA M3
Maintenance Manual
TOSHIBA CORPORATION
File Number 960-507
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© 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein.
Toshiba Personal Computer TECRA M3 Maintenance Manual
First edition January 2005
Disclaimer
The information presented in this manual has been reviewed and validated for accuracy. The included set of instructions and descriptions are accurate for the TECRA M3 at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Therefore, Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions, or discrepancies between any succeeding product and this manual.
Trademarks
Intel SpeedStep and Penteium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries/regions. Windows and Microsoft are registered trademarks of Microsoft Corporation. Photo CD is a trademark owned by its proprietor and used by TOSHIBA under license. Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license.
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Preface

This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer TECRA M3.
The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
SAFETY PRECAUTIONS
Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or
serious bodily injury, if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily
injury, if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property
damage, if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance
service.
Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
Be sure to fasten screws securely with the right screwdriver. If a screw is not fully
fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.
If you replace the battery pack or RTC battery, be sure to use only the same model
battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.
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The manual is divided into the following parts:
Chapter 1 Hardware Overview describes the TECRA M3 system unit and each
FRU.
Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve
FRU problems.
Chapter 3 Test and Diagnostics describes how to perform test and diagnostic
operations for maintenance service.
Chapter 4 Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
Handling the LCD module Board layout Pin assignments Keyboard scan/character codes Key layout Wiring diagrams BIOS rewrite procedures EC/KBC rewrite procedures Reliability
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Conventions
This manual uses the following formats to describe, identify, and highlight terms and operating procedures.
Acronyms
On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Key operation
Some operations require you to simultaneously use two or more keys. We identify such
operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If
three keys are used, hold down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISKCOPY A: B:
The display
Text generated by the computer that appears on its display is presented in the type face below:
Format complete System transferred
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Table of Contents

Chapter 1 Hardware Overview
1.1 Features ...................................................................................................................... 1-1
1.2 System Unit Block Diagram ...................................................................................... 1-8
1.3 3.5-inch Floppy Disk Drive (USB External) ........................................................... 1-16
1.4 2.5-inch Hard Disk Drive......................................................................................... 1-17
1.5 CD-ROM Drive ....................................................................................................... 1-21
1.6 DVD-ROM Drive .................................................................................................... 1-22
1.7 CD-RW/DVD-ROM Drive...................................................................................... 1-24
1.8 DVD±R/±RW Drive ................................................................................................ 1-26
1.9 DVD±R/±RW/-RAM ( DVD-Super Multi) Drive................................................... 1-27
1.10 Keyboard..................................................................................................................1-29
1.11 TFT Color Display...................................................................................................1-30
1.12 Power Supply ........................................................................................................... 1-33
1.13 Batteries ................................................................................................................... 1-35
Chapter 2 Troubleshooting Procedures
2.1 Troubleshooting ......................................................................................................... 2-1
2.2 Troubleshooting Flowchart........................................................................................ 2-2
2.3 Power Supply Troubleshooting.................................................................................. 2-6
2.4 System Board Troubleshooting................................................................................ 2-16
2.5 USB FDD Troubleshooting .....................................................................................2-29
2.6 HDD Troubleshooting ............................................................................................. 2-32
2.7 Keyboard and Touch pad Troubleshooting.............................................................. 2-37
2.8 Display Troubleshooting.......................................................................................... 2-40
2.9 Optical Drive Troubleshooting ................................................................................ 2-42
2.10 Modem Troubleshooting.......................................................................................... 2-44
2.11 LAN Troubleshooting.............................................................................................. 2-46
2.12 Bluetooth Troubleshooting ...................................................................................... 2-47
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2.13 Wireless LAN Troubleshooting............................................................................... 2-50
2.14 Sound Troubleshooting............................................................................................ 2-53
2.15 SD Card Slot Troubleshooting................................................................................. 2-56
2.16 Express Card Slot Troubleshooting ......................................................................... 2-57
Chapter 3 Tests and Diagnostics
3.1 The Diagnostic Test ................................................................................................... 3-1
3.2 Executing the Diagnostic Test ................................................................................... 3-4
3.3 Setting of the hardware configuration ....................................................................... 3-8
3.4 Heatrun Test............................................................................................................. 3-11
3.5 Subtest Names.......................................................................................................... 3-12
3.6 System Test.............................................................................................................. 3-14
3.7 Memory Test............................................................................................................ 3-16
3.8 Keyboard Test.......................................................................................................... 3-17
3.9 Display Test ............................................................................................................. 3-18
3.10 Floppy Disk Test...................................................................................................... 3-21
3.11 Printer Test............................................................................................................... 3-23
3.12 Async Test ............................................................................................................... 3-25
3.13 Hard Disk Test ......................................................................................................... 3-26
3.14 Real Timer Test........................................................................................................ 3-29
3.15 NDP Test.................................................................................................................. 3-31
3.16 Expansion Test......................................................................................................... 3-32
3.17 CD-ROM/DVD-ROM Test ..................................................................................... 3-34
3.18 Error Code and Error Status Names......................................................................... 3-35
3.19 Hard Disk Test Detail Status ................................................................................... 3-38
3.20 ONLY ONE TEST................................................................................................... 3-40
3.21 Head Cleaning.......................................................................................................... 3-46
3.22 Log Utilities ............................................................................................................. 3-47
3.23 Running Test............................................................................................................ 3-49
3.24 Floppy Disk Drive Utilities...................................................................................... 3-50
3.25 System Configuration .............................................................................................. 3-55
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3.26 Wireless LAN Test Program (Intel-made Calexico2 a /g)....................................... 3-57
3.27 Wireless LAN Test Program (Intel-made Calexico2 b/g) ....................................... 3-62
3.28 Wireless LAN Test Program (Askey-made Atheros) .............................................. 3-66
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-70
3.30 Sound Test program................................................................................................. 3-84
3.31 SETUP ..................................................................................................................... 3-90
Chapter 4 Replacement Procedures
4.1 General....................................................................................................................... 4-1
4.2 Battery pack ............................................................................................................... 4-8
4.3 PC card / Express card ............................................................................................. 4-10
4.4 SD card..................................................................................................................... 4-11
4.5 HDD......................................................................................................................... 4-12
4.6 Slim select bay module ............................................................................................ 4-16
4.7 Keyboard.................................................................................................................. 4-19
4.8 Memory module....................................................................................................... 4-25
4.9 Cover / Touch pad.................................................................................................... 4-27
4.10 Modem Daughter Card (MDC)................................................................................ 4-34
4.11 Wireless LAN board ................................................................................................ 4-36
4.12 Bluetooth module..................................................................................................... 4-38
4.13 Display assembly ..................................................................................................... 4-40
4.14 Sound board ............................................................................................................. 4-45
4.15 RTC battery / HDD con holder................................................................................ 4-47
4.16 LAN jack.................................................................................................................. 4-50
4.17 RGB harness holder / RGB board / Modem jack ....................................................4-51
4.18 Fan............................................................................................................................ 4-55
4.19 Cooling fin / CPU .................................................................................................... 4-57
4.20 System board / DC-IN jack...................................................................................... 4-61
4.21 Speaker..................................................................................................................... 4-62
4.22 Power switch board.................................................................................................. 4-64
4.23 LCD unit/FL inverter ............................................................................................... 4-66
4.24 Microphone / Wireless LAN antenna / Bluetooth antenna...................................... 4-77
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4.25 Hinge........................................................................................................................ 4-80
4.26 Fluorescent Lamp..................................................................................................... 4-85
Appendices
Appendix A Handling the LCD Module ........................................................................... A-1
Appendix B Board Layout ................................................................................................ B-1
Appendix C Pin Assignments............................................................................................ C-1
Appendix D Keyboard Scan/Character Codes .................................................................. D-1
Appendix E Key Layout.....................................................................................................E-1
Appendix F Wiring Diagrams............................................................................................F-1
Appendix G BIOS rewrite Procedures .............................................................................. G-1
Appendix H EC/KBC rewrite Procedures......................................................................... H-1
Appendix I Reliability........................................................................................................I-1
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x TECRA M3 Maintenance Manual (960-507)
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Chapter 1
Hardware Overview
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1 Hardware Overview
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1 Hardware Overview
Chapter 1 Contents
1.1 Features.......................................................................................................................1-1
1.2 System Unit Block Diagram.......................................................................................1-8
1.3 3.5-inch Floppy Disk Drive (USB External)............................................................1-16
1.4 2.5-inch Hard Disk Drive .........................................................................................1-17
1.5 CD-ROM Drive ........................................................................................................1-21
1.6 DVD-ROM Drive.....................................................................................................1-22
1.7 CD-RW/DVD-ROM Drive.......................................................................................1-24
1.8 DVD±R/±RW Drive.................................................................................................1-26
1.9 DVD±R/±RW/-RAM (DVD-Super Multi) Drive ....................................................1-27
1.10 Keyboard ..................................................................................................................1-29
1.11 TFT Color Display ...................................................................................................1-30
1.11.1 LCD Module .......................................................................................1-30
1.11.2 FL Inverter Board ...............................................................................1-32
1.12 Power Supply............................................................................................................1-33
1.13 Batteries....................................................................................................................1-35
1.13.1 Main Battery .......................................................................................1-35
1.13.2 Battery Charging Control....................................................................1-36
1.13.3 RTC battery.........................................................................................1-37
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1 Hardware Overview
Figures
Figure 1-1 Front of the computer .....................................................................................1-6
Figure 1-2 System unit configuration...............................................................................1-7
Figure 1-3 System unit block diagram .............................................................................1-8
Figure 1-4 3.5-inch FDD (USB External) ......................................................................1-16
Figure 1-5 2.5-inch HDD ...............................................................................................1-17
Figure 1-6 CD-ROM drive .............................................................................................1-21
Figure 1-7 Keyboard ......................................................................................................1-29
Figure 1-8 LCD module .................................................................................................1-30
Tables
Table 1-1 3.5-inch FDD specifications .........................................................................1-16
Table 1-2 2.5-inch HDD specifications ........................................................................1-17
Table 1-3 CD-ROM drive specifications ......................................................................1-21
Table 1-4 DVD-ROM drive specifications ...................................................................1-22
Table 1-5 CD-RW/DVD-ROM drive specifications ....................................................1-24
Table 1-6 DVD±R/±RW drive specifications...............................................................1-26
Table 1-7 DVD Super Multi drive specifications.........................................................1-27
Table 1-8 LCD module specifications ..........................................................................1-30
Table 1-9 FL inverter board specifications ...................................................................1-32
Table 1-10 Power supply output rating...........................................................................1-34
Table 1-11 Battery specifications ...................................................................................1-35
Table 1-12 Time required for charges ............................................................................1-36
Table 1-13 RTC battery charging/data preservation time...............................................1-37
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1.1 Features 1 Hardware Overview
1 Features
1.1 Features
The Toshiba TECRA M3 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features.
Microprocessor
The TECRA M3 computer is equipped with an Intel Dothan Processor. The Intel Dothan Processor incorporates a math co-processor, a 64KB L1 cache memory and a 2MB L2 cache memory. The PC comes in with one of the following speeds:
1.6BGHz/1.73GHz/1.86GHz/2.0AGHz/2.13GHz (0.748 to 1.356V)
These processors operate at 533MHz bus clock.
Chipset
The TECRA M3 is equipped with Intel Alviso-PM, Intel ICH6-M and TI PCI7411.
Graphics Processing Unit
The computer has a NVIDIA MEP43L Graphics Processing Unit (GPU). The internal VRAM is 64MB or 128MB.
Memory
The computer comes with two PC3300/PC4300 compatible DDR2 SO-DIMM slots. Two memory modules of 256GB, 512MB or 1GB(1,024MB) can be installed.
HDD
The computer has a 2.5-inch HDD. The following capacities are available.
40/60/80/100 GB
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1 Hardware Overview 1.1 Features
USB FDD
A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks.
Slim Select Bay
An Optical drive, 2nd HDD or 2nd Battery can be installed in the Slim Select Bay.
Optical Drive
A CD-ROM drive, DVD-ROM drive, CD-RW/DVD-ROM drive, DVD±R/±RW drive or DVD super Multi drive can be installed in the Slim Select Bay.
Display
The PC comes in with one of the following two types:
14.1” XGA-TFT color display, resolution 1,024×768
14.1” SXGA+-TFT color display, resolution 1,400×1,050
A video controller and a 64/128MB VRAM enables an external monitor to display 16M colors at a resolution of 1,024×768 pixels or 1,400×1,050 pixels.
Keyboard
An-easy-to-use 85(US)/86(UK)-key keyboard provides a numeric keypad overlay for fast numeric data entry or for cursor and page control. The keyboard also includes two keys that have special functions in Microsoft Windows 2000/XP. It supports software that uses a 101- or 102-key enhanced keyboard.
TOSHIBA Dual Pointing Device
The TOSHIBA Dual Pointing Device consists of Touch Pad and AccuPoint. The touch pad and control buttons enable control of the on-screen pointer and scrolling of windows. The pointer control stick and AccuPoint enables convenient control of the cursor.
Batteries
The computer has two or three batteries: a rechargeable Lithium-Ion main battery pack and RTC battery (that backs up the Real Time Clock and CMOS memory).
Second battery can be mounted in the slim select bay as an option.
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1.1 Features 1 Hardware Overview
Universal Serial Bus (USB2.0)
Two USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.
IEEE 1394 port
The computer comes with one IEEE 1394 port. It enables high-speed data transfer directly from external devices such as digital video cameras.
Parallel port
The parallel port enables connection of parallel printer or other parallel devices. (ECP compatible)
External monitor (RGB) port
The port enables connection of an external monitor, which is recognized automatically by Video Electronics Standards Association (VESA) Display Data Channel (DDC) 2B compatible functions.
PC card and ExpressCard slot
A PC card slot and an ExpressCard slot are provided. The PC card slot (PCMCIA) accommodates one Type II card and the ExpressCard slot accommodates an ExpressCard.
SD Card
The SD Card Slot can accommodate Secure Digital flash memory cards with various capacities. SD cards let you easily transfer data from devices, such as digital cameras and Personal Digital Assistants, which use SD Card flash-memory.
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1 Hardware Overview 1.1 Features
Docking interface port
The docking interface port enables connection of an optional Advanced Port Replicator III. It provides additional features as follows:
RJ-45 LAN jack, RJ-11 Modem jack
External monitor port
PS/2 mouse and PS/2 keyboard ports
Parallel port
Serial port
DC IN socket
Audio line-in, line out jack
Two USB ports
IEEE 1394 port
TV-out (S-Video)
DVI port
Infrared port
The infrared port is compatible with Fast InfraRed (FIR) standards enabling cableless 4 Mbps, 1.152 Mbps, 115.2 kbps, 57.6 kbps, 38.4 kbps, 19.2 kbps or 9.6 kbps data transfer with Infrared Data Association (IrDA) 1.1 compatible external devices.
Sound system
The sound system is equipped with the following features:
AC Link (in ICH6-M) and Analog Deveices AD1981B
AMP: Matsushita AN12491 and MAX4410
Stereo speakers
Built-in microphone
Volume control knob
Stereo headphone jack
External microphone jack
Supports VoIP
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1.1 Features 1 Hardware Overview
Video-out jack
The video jack enables to transfer NTSC or PAL data to external devices connected with S-Video cable.
Internal modem
The computer contains a MDC, enabling data and fax communication. It supports ITU-T V.90 (V.92). The transfer rates are 56 Kbps for data reception, 33.6 Kbps for data transmission, and 14,400 bps for fax transmission. However, the actual speed depends on the line quality. The RJ11 modem jack is used to accommodate a telephone line. Both of V.90 and V.92 are supported only in USA, Canada and Australia. Only V.90 is available in other regions.
Internal LAN
The computer is equipped with LAN circuits that support Ethernet LAN (10 megabits per second, 10BASE-T), Fast Ethernet LAN (100 megabits per second, 100 BASE-TX) or Gigabit Ethernet LAN (1000 megabits per second, 1000BASE-T). It also supports Wakeup on LAN (WOL), Magic Packet and LED.
Wireless LAN
The computer is equipped with a mini-PCI Type III wireless LAN board that supports
802.11 a/g or 802.11b/g in the Mini PCI card slot. This function can be switched on and off by a switch on the computer.
Bluetooth
The computer is equipped with Bluetooth (V1.2) communications standard enable wireless connection between electronic devices such as computers and printers. It supports kill SW.
Presentation button
This button switches the display between internal display, external display, simultaneous display and multi-monitor display.
Toshiba Console button
When this button is pressed during power-on, the PC is connected to “Toshiba Console”. When this button is pressed during power-off, the PC is turned on and connected to “Toshiba Console”.
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1 Hardware Overview 1.1 Features
The front of the computer is shown in figure 1-1.
Figure 1-1 Front of the computer
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1.1 Features 1 Hardware Overview
The system unit configuration is shown in figure 1-2.
Figure 1-2 System unit configuration
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1 Hardware Overview 1.2 System Unit Block Diagram

1.2 System Unit Block Diagram

Figure 1-3 is a block diagram of the system unit.
Figure 1-3 System unit block diagram
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1.2 System Unit Block Diagram 1 Hardware Overview
The system unit is composed of the following major components:
Processor
Intel Dothan Processor: 1.6BGHz/1.73GHz/1.86GHz/2.0AGHz/2.13GHz
– Processor core speed: 1.6GHz/1.73GHz/1.86GHz/2.0GHz/2.13GHz
– Processor bus speed: 533MHz
– Integrated L1 cache memory: 32KB instruction cache and 32KB write-back
data cache
– Integrated L2 cache memory of 2MB
– Integrated NDP
– 478-pin Micro FC-PGA package
Memory
Two memory slots are provided. Expansion up to 2GB (2,048MB) is available.
Memory
DDR2-SDRAM
DDR400 or DDR533 memory
1.8 volt operation
FBGA
Memory Module
240 pin, SO Dual In-line Memory Module (SO-DIMM)
PC3300 or PC4300
256MB/512MB/1GB(1,024MB)
– 256 MB: 256Mb×8
– 512 MB: 512Mb×8
– 1GB: 512Mb×16
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1 Hardware Overview 1.2 System Unit Block Diagram
Intel GMCH (North Bridge)
One Intel Alviso-PM is used.
Features:
– Supports Dothan Processor System Bus
– System Memory Interface
– Memory Control: supports DDR333, DDR2-400/DDR2-533 2Gbmax.
– Graphics I/F: x16 PCI Express Based Graphics I/F
– DMI(Direct Media Interface)
– 1,257-ball, 40.0×37.5×2.6mm, FC-BGA package
Intel ICH6-M (South Bridge)
One Intel UICH6MA is used.
Features:
– DMI(Direct Media Interface)
– PCI Express I/F (4 ports)
– PCI Bus I/F Rev2.37 PCI REQ/GNT Pairs
– Integrated Serial ATA Host Controller (2 Prots,150MB/S)
– Integrated IDE ControllerUltra ATA 100/66/33
– AC’97 2.3 codecs
– USB 1.1/2.0 Controller 8 ports (EHCI: Enhanced Host Controller)
– Built-in LAN controller (WfM 2.0 & IEEE 802.3 compliance)
– Power Management (ACPI 2.0 compliance)
– SMBus2.0 controller
– FWH interface (BIOS)
– LPC interface (EC/KBC, Super I/O)
– IRQ controller
– Serial Interrupt Function
– Suspend/Resume control
– Built –in RTC
– GPIO
– 609-ball, 31×31mm, micro BGA Package
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1.2 System Unit Block Diagram 1 Hardware Overview
Firmware Hub (FWH)
One STMicro M50FW080N is used.
Card controller (TI PCI7411ZHK)
PCI I/F
CardBus / Ultra media Controller (1 socket)
SD/MMC, Memory Stick, XD Card Controller
1394 Controller (2 ports)
288-ball, 16×16×1.4mm, BGA Package
VGA Controller
One NVIDIA MEP43L chip is used. The video controller incorporates graphics accelerator and video accelerator.
Built-in VRAM 64MB/128MB
PCI Express Interface
LCD Interface LVDS 2ch
Supports TV Encoder, S-Video
Sound Controller
One AC'97Codec AD1981B chip and AC-Link controller embedded in ICH6-M
SW sound
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1 Hardware Overview 1.2 System Unit Block Diagram
EC/KBC (Embedded Controller/Keyboard Controller)
One Mitsubishi M306KA micon chip functions as both EC and KBC.
EC
This controller controls the following functions:
– Power supply sequence
– Thermal conditions
– LEDs
– Beep
– Device ON/OFF
– Fan speed
– Universal I/O port
– Docker Docking Sequence
– Battery capacity check
– Forced reset
– Flash rewriting
– EC interface
– I2C communication
– EC access
– Slim Select Bay Control
KBC
This controller has the following functions:
– Scan controller to check status of keyboard matrix
– Interface controller between the keyboard scan controller and the system
– Control of switching and simultaneous operation of the accupoint and internal
keyboard
PSC (Power Supply Controller)
One TMP87PM48UG chip is used.
This controller controls the power sources.
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1.2 System Unit Block Diagram 1 Hardware Overview
Clock Generator
One ICS 954204BGFT is used.
This device generates the system clock.
Modem Controller
One Askey made MDC is used.
This controller has the following functions:
– One RJ11 port
– Digital line protection support
– Ring wake up support
– Analog audio support
– AC97 interface
– The following communication codes are supported
Data:
V.90 (56K bps) data communication control
V.92 (56K bps) data communication control
V.34 (33.6K to 2400bps) data communication control
V.44, V.42, V.42bis and MNP class 5 data compression
V.32 turbo, V.32 bis and fallbacks
Fax:
V.34 (33.6K to 2400 bps)
V.17 (14.4K, 12K, 7200 bps)
V.29 (9600, 7200 bps)
V.27 ter (4800, 2400 bps)
V.21 ch2 (300 bps)
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1 Hardware Overview 1.2 System Unit Block Diagram
Internal LAN Controller
One internal chip (Marvell made 88E8053 or 88E8036) is used.
This controller has the following functions:
– 10/100M-Ethernet (88E8036)
– Gigabit-Ethernet chip (88E8053)
– WOL support
– Magic Packet support
– LED support
Wireless LAN
One Mini PCI card for wireless LAN with Type III card bus controller.
Super I/O
One LPC47N217 chip is used.
This gate array has the following features:
– Floppy Disk Controller
– Infrared Communications Controller
– Parallel Port Controller
IEEE1394
One TI PCI7411 is used.
Sensor
Thermal Sensor: One ADM1032ARMZ chip is used.
LCD Sensor: One NRS-701-1015T chip is used.
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1.2 System Unit Block Diagram 1 Hardware Overview
Other major chips
Clock Generator: One 954204BGFTCG chip is used.
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1 Hardware Overview 1.3 3.5-inch Floppy Disk Drive (USB External)

1.3 3.5-inch Floppy Disk Drive (USB External)

The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks.
The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1.
Figure 1-4 3.5-inch FDD (USB External)
Table 1-1 3.5-inch FDD specifications
Items
720KB mode 1.44MB mode
FDD part 250K bits/second 500K bits/second Data transfer rate
USB Full speed mode (12M bits/second)
Disk rotation speed 300rpm
Track density 5.3 track/mm (135TPI)
TEAC G8AC0000B310
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1.4 2.5-inch Hard Disk Drive 1 Hardware Overview

1.4 2.5-inch Hard Disk Drive

The removable HDD is a random access non-volatile storage device. It has a non-removable
2.5-inch magnetic disk and mini-Winchester type magnetic heads. The computer supports a 40GB, 60GB, 80GB or 100GB. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2.
Figure 1-5 2.5-inch HDD
Table 1-2 2.5-inch HDD specifications (1/7)
Specifications
Items
Outline Width (mm)
dimensions Height (mm)
Depth (mm)
Weight (g)
Storage size (formatted) 40GB 40GB 40GB
Speed (RPM) 4,200 4,200 4,200
Data transfer speed (Mbits/s) 175.0-341.7 372 175.0-341.7
Interface transfer rate (MB/s) 100 max (Ultra DMA mode)
Track density (Ktpi) 88.1 96.0 88.1
Average random seek time (read) (ms)
TOSHIBA
HDD 2190BZKO*
69.85 69.85±0.25 69.85
9.5 9.5±0.2 9.5
100 100.2±0.25 100
95 max. 95 max 95
12 12
HITACHI GST
G8BC0001E411
TOSHIBA
HDD 2190BZE02
Motor startup time (ms) 4typ 3 4
TECRA M3 Maintenance Manual (960-507) 1-17
Page 32
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive
Table 1-2 2.5-inch HDD specifications (2/7)
Specifications
Items
Outline Width (mm)
dimensions Height (mm)
Depth (mm)
Weight (g)
Storage size (formatted) 40GB 40GB 40GB
Speed (RPM) 5,400 5,400 5,400
Data transfer speed (Mbits/s) 233-446 493 233-446
Interface transfer rate (MB/s) 100 max (Ultra DMA mode)
Track density (Ktpi) 88.8 113.2 88.8
TOSHIBA
HDD2193VZKO*
69.85 69.85±0.25 69.85
9.5 9.5±0.2 9.5
100 100.2±0.25 100
97 max. 102 max. 97 max.
HITACHI GST
G8BC0001N410
16.6 (PIO mode
TOSHIBA
HDD2193VZE02
Average random seek time (read) (ms)
Motor startup time (ms) 4 typ. 3.5 4 typ.
12 12 12
Table 1-2 2.5-inch HDD specifications (3/7)
Specifications
Items
Outline Width (mm)
dimensions Height (mm)
Depth (mm)
Weight (g)
Storage size (formatted) 60GB 60GB 60GB
Speed (RPM) 4,200 4,200 4,200
Data transfer speed (Mbits/s) 175.0-341.7 175.0-341.7 175.0-341.7
Interface transfer rate (MB/s) 100(Ultra DMA mode)
Track density (Ktpi) 88.1 88.1 96.6
TOSHIBA
HDD2189BZKO*
69.85 69.85 69.85±0.25
9.5 9.5 9.5±0.2
100 100 100.2±0.25
95 95 102
TOSHIBA
HDD2189BZE02
HITACHI GST
G8BC0001N611
Average seek time (ms) Read Write
Motor startup time (ms) 4 4 3.5
12
12
12 14
1-18 TECRA M3 Maintenance Manual (960-507)
Page 33
1.4 2.5-inch Hard Disk Drive 1 Hardware Overview
Table 1-2 2.5-inch HDD specifications (4/7)
Specifications
Items
Outline Width (mm)
dimensions Height (mm)
Depth (mm)
Weight (g)
Storage size (formatted) 60GB 60GB 60GB
Speed (RPM) 5,400 5,400 5,400
Data transfer speed (Mbits/s) 258-394 202.9-373.3 493
Interface transfer rate (MB/s) 100 max (Ultra DMA mode)
Track density (Ktpi) 88.8 88.8 113.2
TOSHIBA
HDD2194VZKO*
69.85 69.85 69.85±0.25
9.5 9.5 9.5±0.2
100±0.25
102 max. 95 102 max.
TOSHIBA
HDD2194VZE02
100 100.2±0.25
16.6 (PIO mode)
HITACHI GST
G8BC0001N610
Average seek time (ms) Read Write
Motor startup time (ms) 4 typ. 4 3.5
12
12 12
Table 1-2 2.5-inch HDD specifications (5/7)
Specifications
Items
Outline Width (mm)
Dimensions Height (mm)
Depth (mm)
Weight (g)
Storage size (formatted) 60GB 80GB
Speed (RPM) 7,200 5,400
Data transfer speed (Mb/s) 507 max. 493
Interface transfer rate (MB/s) 100 (MAX Ultra DMA mode)
HITACHI GST
G8BC00015610
69.85 69.85±0.25
9.5 9.5±0.2
100.2 100.2±0.25
115 max. 102 max.
HITACHI GST
G8BC0001N810
12 14
Track density (Ktpi) 88.2 113.2
Average seek time (ms) Read Write
Motor startup time (ms) 4 3.5
10 11
12 14
TECRA M3 Maintenance Manual (960-507) 1-19
Page 34
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive
Table 1-2 2.5-inch HDD specifications (6/7)
Specifications
Items
Outline Width (mm)
Dimensions Height (mm)
Depth (mm)
Weight (g)
Storage size (formatted) 80GB 80GB 100GB
Speed (RPM) 5,400 5,400 5,400
Data transfer speed (Mb/s) 154.3-298.0 154.3-298.0 493
Interface transfer rate (MB/s) 100 (MAX Ultra DMA mode)
Track density (Ktpi) 78.9 78.9 113.2
TOSHIBA
HDD2191VZKO*
69.85 69.85 69.85
9.5 9.5 9.5
100 100.2 100.2
95 102 max. 102 max.
TOSHIBA
HDD2191VZE02
HITACHI GST
G8BC0001NA10
Average seek time (ms) Read Write
Motor startup time (ms) 4 4 3.5
12 12
12 12
12 14
Table 1-2 2.5-inch HDD specifications (7/7)
Specifications
Items
Outline Width (mm)
Dimensions Height (mm)
Depth (mm)
Weight (g)
Storage size (formatted) 100GB 100GB
Speed (RPM) 4,200 4,200
Data transfer speed (Mb/s) 170.0-373.0 170.0-373.0
Interface transfer rate (MB/s) 100 (Ultra DMA mode)
TOSHIBA
HDD2A02BZK01
69.85 69.85
9.5 9.5
100 100.2
99 max. 99 max.
TOSHIBA
HDD2A02BZE01
Track density (Ktpi) 110-120 110-120
Access time (ms) Track to track Average seek
Motor startup time (ms) 4 typ. 4 typ.
2
12
2
12
1-20 TECRA M3 Maintenance Manual (960-507)
Page 35
1.5 CD-ROM Drive 1 Hardware Overview
1.5 CD-ROM Drive
The CD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDs. They provide high-performance, 24-speed plays on a maximum (reads 3,600 KB per second).
The CD-ROM drive is shown in figure 1-6. Specifications are listed in Table 1-3.
Figure 1-6 CD-ROM drive
Table 1-3 CD-ROM drive specifications
Item TEAC G8CC00005410
ATAPI Burst (Mbytes/s) 33.3 (U-DMA Transfer mode 2)
Access time (ms)
Average Random Access Average Full Stroke Access
Rotation speed (rpm) (typ.) 5,136
Data Buffer Capacity (Kbytes) 128
Supported Format CD-DA, CD-ROM Mode 1, Mode 2
CD-ROM XA Mode 2 (Form 1, Form 2) Photo CD (Single/multi-session), Enhanced CD
110 (except in Audio play mode) 240 (except in Audio play mode)
TECRA M3 Maintenance Manual (960-507) 1-21
Page 36
1 Hardware Overview 1.6 DVD-ROM Drive
1.6 DVD-ROM Drive
The DVD-ROM drive accommodates either 12cm (4.72-inch) or 8cm (3.15-inch) DVDs. This drive plays DVDs at maximum 8-speed and reads CDs at maximum 24-speed.
The specifications for the DVD-ROM drive are described in table 1-4.
Table 1-4 DVD-ROM drive specifications (1/3)
Item
DVD-ROM mode CD-ROM mode
ATAPI Burst (Mbytes/s) 33.3 (U-DMA Transfer mode 2)
Access time (ms)
Average Random Access
Rotation speed (rpm) 4,594 max. 5,136 max
Data Buffer Capacity (Kbytes) 256
Supported Format DVD-ROM, DVD-R (Read)
CD-DA, CD+(E)G, CD-MIDI, CD-TEXT CD-ROM, CD-ROM XA, CD-I CD-I Bridge (Photo-CD, Video-CD) Multisession CD (Photo-CD, CD-EXTRA, CD-R, CD-RW) CD-R (Read), CD-RW (Read)
TSST G8CC0000R410
110 (Typ.)
Item
DVD-ROM mode CD-ROM mode
HITACHI G8CC00015410
85 (Typ.)
ATAPI Burst (Mbytes/s) 33.3 (U-DMA Transfer mode 2)
Access time (ms)
Average Random Access
Rotation speed (rpm) 4,594 Max 5,136Max
Data Buffer Capacity (Kbytes) 256
Supported Format
DVD-ROM, DVD-R (Read) CD-DA, CD+(E)G, CD-MIDI, CD-TEXT CD-ROM, CD-ROM XA, CD-I CD-I Bridge (Photo-CD, Video-CD) Multi-session CD (Photo-CD, CD-EXTRA, CD-R, CD-RW) CD-R (Read), CD-RW (Read)
110 (Typ.)
85 (Typ.)
1-22 TECRA M3 Maintenance Manual (960-507)
Page 37
1.6 DVD-ROM Drive 1 Hardware Overview
Table 1-4 DVD-ROM drive specifications (3/3)
Item
DVD-ROM mode CD-ROM mode
ATAPI Burst (Mbytes/s) 33.3 (U-DMA Transfer mode 2)
Access time (ms)
Average Random Access
Rotation speed (rpm) 4,670Max 5,100Max
Data Buffer Capacity (Kbytes) 256
Supported Format
DVD-ROM (DVD-5, DVD-9, DVD-10, DVD-18), DVD-R (Ver.1.0, Ver.2.1), DVD-RW (Ver. 1.0, Ver. 1.1), DVD+R, DVD+RW, DVD-RAM Ver. 2.1
CD-DA, CD+(E)G, CD-MIDI, CD-TEXT, CD-ROM, CD-ROM XA, CD-I, CD-I Bridge (Photo-CD, Video-CD), Multi-session CD (Photo-CD, CD-EXTRA, CD-R, CD-RW, Portfolio), CD-R, CD-RW
TSST SD-C2712
110
110
TECRA M3 Maintenance Manual (960-507) 1-23
Page 38
1 Hardware Overview 1.7 CD-RW/DVD-ROM Drive
1.7 CD-RW/DVD-ROM Drive
The CD-RW/DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CDs, CD-R/RW and DVDs. It is a high-performance drive that reads CD-ROM at maximum 24-speed, DVD-ROM at maximum 8-speed and writes CD-R at maximum 24-speed, CD-RW at maximum 4-speed.
The specifications are listed in Table 1-5.
Table 1-5 CD-RW/DVD-ROM drive specifications (1/2)
Item
MATSUSHITA G8CC001X411
ATAPI Burst (Mbytes/s) 16.6 (PIO mode)
CD-ROM 150 typ. (Random) Average access
time (msec)
Data Buffer Capacity 2MB
Supported Discs CD: CD/CD-ROM, CD-R, CD-RW
Supported Formats CD: CD-DA, CD-ROM, CD-ROM XA, Photo CD,
DVD-ROM 180 typ. (Random)
DVD: DVD-ROM, DVD-R, DVD-RW, DVD+R, DVD+RW,
DVD+RAM
CD-Extra (CD+), CD-TEXT
DVD: DVD-R, DVD-RW (Ver.1.2), DVD-Video, DVD+R,
DVD+RW, DVD-RAM (2.6GB/4.7GB)
Specifications
16.6 (DMA mode)
33.3 (Ultra DMA Mode2)
1-24 TECRA M3 Maintenance Manual (960-507)
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1.7 CD-RW/DVD-ROM Drive 1 Hardware Overview
Table 1-5 CD-RW/DVD-ROM drive specifications (2/2)
Item
ATAPI Burst (Mbytes/s) 33.3 max
Average access time (msec)
Data Buffer Capacity -
Readable Discs CD/CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-R,
Recordable Discs CD-R/RW
Applicable Format CD-DA, CD-ROM (Mode1, Mode2),
CD-ROM 90
DVD-ROM 110
DVD-RW, DVD-RAM, DVD+R, DVD+RW
CD-ROM XA Mode2 (Form 1, Form2) Photo CD (Single/Multi-border) Enhanced CD, CD-TEXT, DVD-ROM DVD-R (General Authoring, Single/Multi-border) DVD-RW (Single/Multi-border) DVD-Video DVD-RAM (4.7GB, 2.6GB) DVD+R/RW ((Single/Multi-session, Packer)
Specifications
TEAC G8CC0001Y411
TECRA M3 Maintenance Manual (960-507) 1-25
Page 40
1 Hardware Overview 1.8 DVD±R/±RW Drive
1.8 DVD±R/±RW Drive
This full size DVD±R/±RW drive module lets you record data to rewritable CD/DVDs as well as run either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD without using an adaptor. It is a high-performance drive. It reads CD-ROM and CD-R/RW at maximum 24-speed, DVD at maximum 8-speed, DVD-R/-RW and DVD+R/+RW at maximum 8-speed. It writes CD-R/-RW at maximum 24-speed, DVD-R/+R at maximum 8-speed and DVD­RW/+RW at 4-speed.
The specifications for the DVD ±R/±RW drive are described in table 1-6.
Table 1-6 DVD±R/±RW drive specifications
Item
ATAPI Interface
IDE Data Transfer Mode PIO Mode4, Multi Word DAM Mode2,
Average access time (ms) DVD-ROM
CD-ROM
Data buffer (MB) 2
Supported format (Read) CD: KODAK Photo CD (single and multiple
DVD : DVD-ROM, DVD-R (Ver.2.0)
SFF-8090 Ver5, ATA5, MMC3
session) CD Extra (CD Plus), Mixed CD CD-ROM/XA, CD text CD-R, CD-RW
DVD-RW(Ver.1.1, Ver.1.2), DVD+R, DVD+RW
Pioneer
G8CC00020410
Ultra DMA Mode2
150 130
1-26 TECRA M3 Maintenance Manual (960-507)
Page 41
1.9 DVD±R/±RW/-RAM (DVD-Super Multi) Drive 1 Hardware Overview
1.9 DVD±R/±RW/-RAM (DVD-Super Multi) Drive
This drive is a combination of DVD-ROM and DVD±R/±RW/-RAM Drive. It is full-size and runs either 12cm (4.72-inch) or 8cm (3.15-inch) DVD/CDs without an adaptor. It reads DVDs at maximum 8-speed and CDs at maximum 24-speed. It also writes CD-R at maximum 16-speed, CD-RW at maximum 8-speed, DVD-R at maximum 4-speed, DVD-RW at maximum 2-speed, DVD+R at maximum 2.4-speed, DVD +RW at maximum 2.4-speed, and DVD-RAM at maximum 2-speed.
The specifications are listed in Table 1-7.
Table 1-7 DVD Super Multi drive specifications(1/2)
Item
ATAPI Burst (MB/sec) 33.3 (Ultra DMA mode 2)
16.6 (PIO Mode 4, Multi word DMA mode 2)
Average access time (ms) DVD-ROM
CD-ROM
Data buffer (MB) 2
Supported format (Read) CD: CD-DA, CD-ROM, CD-R, CD-RW
CD-ROM XA, Photo CD, Video CD CD-Extra (CD+), CD-Text
DVD : DVD-VIDEO, DVD-ROM
DVD-R (3.9GB, 4.7GB) DVD-RW (Ver.1.1) DVD-RAM (2.6GB, 4.7GB, 9.4GB) DVD+R, DVD+RW
MATSUSHITA
G8CC0001S410
180 typ. 150 typ.
TECRA M3 Maintenance Manual (960-507) 1-27
Page 42
1 Hardware Overview 1.9 DVD±R/±RW/-RAM (DVD-Super Multi) Drive
Table 1-7 DVD Super Multi drive specifications (2/2)
Item MATUSHITA
G8CC00021410
ATAPI Burst (Mbytes/s) 33.3 (Ultra DMA mode 2)
16.6 (PIO Mode 4, Multi word DMA mode
2)
Average access time (ms) DVD-ROM
CD-ROM
Data Buffer Capacity (MB) 2
Supported Format CD: CD-DA, CD-ROM, CD-ROM XA,
Photo CD, CD-Extra (CD+), CD-TEXT
DVD:DVD-R, DVD-RW(Ver. 1.1)
DVD-Video, DVD+R, DVD-RW, DVD-RAM(2.6GB/4.7GB)
180 150
1-28 TECRA M3 Maintenance Manual (960-507)
Page 43
1.10 Keyboard 1 Hardware Overview
1.10 Keyboard
The keyboard is mounted 85(US)/86(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller.
Figure 1-7 is a view of the keyboard.
See Appendix E about a layout of the keyboard.
Figure 1-7 Keyboard
TECRA M3 Maintenance Manual (960-507) 1-29
Page 44
1 Hardware Overview 1.11 TFT Color Display
1.11 TFT Color Display
The TFT color display consists of 14.1-inch XGA/SXGA+ LCD module and FL inverter board.
1.11.1 LCD Module
The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 262,144 colors with 1,024 x 768 or 1,400 x 1,050 resolution. The nVIDIA MEP43L can control both internal and external XGA- or SXGA+- support displays simultaneously.
Figure 1-8 shows a view of the LCD module and Table 1-8 lists the specifications.
Figure 1-8 LCD module
Table 1-8 LCD module specifications (1/4)
Item
14.1-inch XGA TFT (G33C0001P110)
Number of Dots 1,024 (W) x 768 (H)
Dot spacing (mm) 0.279 (H) x 0.279 (V)
Display range (mm) 285.7 (H) x 214.3 (V)
Specifications
Table 1-8 LCD module specifications (2/4)
Item
14.1-inch XGA TFT (G33C0001M110)
Number of Dots 1,024 (W) x 768 (H)
Dot spacing (mm) 0.279 (H) x 0.279 (V)
Display range (mm) 285.7 (H) x 214.3 (V)
Specifications
1-30 TECRA M3 Maintenance Manual (960-507)
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1.11 TFT Color Display 1 Hardware Overview
Table 1-8 LCD module specifications (3/4)
Item
14.1-inch XGA+ TFT (G33C00025110)
Number of Dots 1,024 (W) x 768 (H)
Dot spacing (mm) 0.279 (H) x 0.279 (V)
Display range (mm) 228 (H) x 299 (V)
Specifications
Table 1-8 LCD module specifications (4/4)
Item
14.1-inch SXGA+ TFT (G33C00022110)
Number of Dots 1,400 (W) x 1,050 (H)
Dot spacing (mm) 0.204 (H) x 0.204 (V)
Display range (mm) 285.6 (H) x 214.2 (V)
Specifications
TECRA M3 Maintenance Manual (960-507) 1-31
Page 46
1 Hardware Overview 1.11 TFT Color Display

1.11.2 FL Inverter Board

The FL inverter board supplies a high frequency current to illuminate the LCD module FL. Table 1-9 lists the FL inverter board specifications.
Table 1-9 FL inverter board specifications
Item Specifications
G71C00011121 G71C00011110
Voltage (V) DC 5 Input
Power (W) 7
Output
Voltage (V) 750
Current (mA) 6.00
Power (mA) 5W/7VA
1-32 TECRA M3 Maintenance Manual (960-507)
Page 47
1.12 Power Supply 1 Hardware Overview
1.12 Power Supply
The power supply supplies many different voltages to the system board and performs the following functions:
1. Checks power input to determine:
Whether the AC adaptor is connected to the computer.
Whether the battery pack is installed and supplying power.
2. Checks power supply’s internal controls:
Battery pack charging: start, stop and voltage supplied to the battery pack
Power supply system: Power supplied from a DC power source (AC adaptor)
Faulty power supply: Executes forced shutdown if needed
Logic: Power supply to various circuits
Charging current to PWM control IC for battery pack charging
3. Controls the following aspects of the logic system;
Power supply to gate arrays
Power on/off
4. Indicates the following:
DC IN (sets LED to orange or green)
Battery icon (sets LED to orange or green)
Faulty power supply by low battery
5. Interface for the following:
BIOS via EC/KBC
Function mode of power supply
6. Detects the following:
Input voltage to logic system
Input voltage, overvoltage and input/output to battery pack
Battery pack’s internal temperature
Input voltage to DC power supply (output from AC adaptor)
The power supply output rating is specified in Table 1-10.
TECRA M3 Maintenance Manual (960-507) 1-33
Page 48
1 Hardware Overview 1.12 Power Supply
Table 1-10 Power supply output rating
Name Voltage (V) Use
PPV
PTV 1.05 CPU, MCH, ICH6-M
1R5-P1V 1.5 CPU, MCH, ICH6-M, Express Card
1R8-B1V 1.8 MCH, DDR2-SDRAM
2R5-P2V 2.5 MCH, CH6-M
MR0R9-B0V 0.9 MCH, DDR2-SDRAM
0R9-P0V 0.9 DDR2-SDRAM
1R5-S1V 1.5 ICH4-M
P3V 3.3
E3V 3.3
LAN-E3V 3.3 LAN Power
LAN2R5-E2V 2.5 LAN Power
BT-P3V 3.3 Bluetooth
S3V 3.3 ICH6-M, EC/KBC, PSC
0.748-1.308 CPU
Clock Generator, Thermal Sensor, SDRAM(SPD), ICH6­M, SATA Bridge, PC CARD Cont., Mini-PCI, TPM, Express Card, FWH, AD1981B, Super I/O, EC/KBC FIR, GPU, LCD
PC CARD Cont., PC Card Power, Mini-PCI, Express Card, MDC, RS232C
P5V 5
SB-P3V 3.3 Select Bay
ICH-S5V 5 ICH6-M
ICH-S3V 3.3 ICH6-M
ICH1R5-S1V 1.5 ICH6-M
SND-P5V 5 AN12940AA(Amp)
A4R7-P4V 4.7 AD1981B, Amp, Head Phone, Ring Phone
E5V 5 PC Card Power, USB Power
M5V 5 ICH6-M, MAX6501, LED
MCV 5 PSC
R3V 2.0-3.5 ICH6-M(RTC)
CRT, ICH6-M, FL inverter, LEDs, HDD, KB, PAD, Parallel, Bluetooth Power
1-34 TECRA M3 Maintenance Manual (960-507)
Page 49
1.13 Batteries 1 Hardware Overview
1.13 Batteries
The computer has three types of batteries as follows:
Main battery pack
RTC battery
Secondary battery pack (optional slim select bay module)
The battery specifications are listed in Table 1-11.
Table 1-11 Battery specifications
Battery name Material Output voltage Capacity

Main battery Lithium-Ion 10.8 V

2nd battery Lithium-Ion 10.8 V 3,600 mAh
RTC battery NiMH 2.4 V 16 mAh
8,800 mAh
4,700 mAh
1.13.1 Main Battery
The removable main battery pack is the computer’s main power source when the AC adaptor is not attached. The main battery maintains the state of the computer when the computer enters in resume mode.
TECRA M3 Maintenance Manual (960-507) 1-35
Page 50
1 Hardware Overview 1.13 Batteries

1.13.2 Battery Charging Control

Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer. The system charges the battery.
Battery Charge
When the AC adaptor is attached, there are two types of charge: When the system is powered off and when the system is powered on. Table 1-12 lists the charging time required for charges.
Table 1-12 Time required for charges
Battery type Power on (hours) Power off (hours)
High capacity battery (8,800 mAh) About 9.0 to 21.5 About 4.5
Battery (4,700 mAh) About 5.5 to 13.0 About 3.0
2nd battery (3,600 mAh) About 4.0 to 9.5 About 3.0
NOTE: The time required when the system is powered on is affected by the amount of
power the system is consuming. Use of the fluorescent lamp and frequent disk access diverts power and lengthens the charge time.
If any of the following occurs, the battery charge process stops.
1. The battery becomes fully charged.
2. The AC adaptor or battery is removed.
3. The battery or output voltage is abnormal.
Detection of full charge
A full charge is detected only when the battery is charging at charge. A full charge is detected under any of the following conditions:
1. The current in the battery charging circuit drops under the predetermined limit.
2. The charging time exceeds the fixed limit.
1-36 TECRA M3 Maintenance Manual (960-507)
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1.13 Batteries 1 Hardware Overview
1.13.3 RTC battery
The RTC battery provides power to keep the current date, time and other setup information in memory while the computer is turned off. Table 1-13 lists the charging time and data preservation period of the RTC battery.
Table 1-13 RTC battery charging/data preservation time
Status Time
Charging Time (power on) 8 hours
Data preservation period (full charge) 30 days
TECRA M3 Maintenance Manual (960-507) 1-37
Page 52
1 Hardware Overview 1.13 Batteries
1-38 TECRA M3 Maintenance Manual (960-507)
Page 53
Chapter 2
Troubleshooting Procedures
Page 54
2 Troubleshooting Procedures
2-ii TECRA M3 Maintenance Manual (960-507)
Page 55
2 Troubleshooting Procedures
Chapter 2 Contents
2.1 Troubleshooting..........................................................................................................2-1
2.2 Troubleshooting Flowchart ........................................................................................2-2
2.3 Power Supply Troubleshooting ..................................................................................2-6
Procedure 1 Icons in the LCD Check...............................................................2-6
Procedure 2 Error Code Check ........................................................................2-7
Procedure 3 Connection Check ......................................................................2-13
Procedure 4 Charge Check .............................................................................2-14
Procedure 5 Replacement Check....................................................................2-15
2.4 System Board Troubleshooting ................................................................................2-16
Procedure 1 Message Check ..........................................................................2-17
Procedure 2 Debug Port Check ......................................................................2-19
Procedure 3 Diagnostic Test Program Execution Check ...............................2-27
Procedure 4 Replacement Check....................................................................2-28
2.5 USB FDD Troubleshooting......................................................................................2-29
Procedure 1 USB FDD Head Cleaning Check...............................................2-29
Procedure 2 Diagnostic Test Program Execution Check ...............................2-30
Procedure 3 Connector Check and Replacement Check ................................2-31
2.6 HDD Troubleshooting ..............................................................................................2-32
Procedure 1 Message Check ..........................................................................2-32
Procedure 2 Partition Check...........................................................................2-33
Procedure 3 Format Check .............................................................................2-34
Procedure 4 Diagnostic Test Program Execution Check ...............................2-35
Procedure 5 Connector Check and Replacement Check ................................2-36
2.7 Keyboard and Touch pad Troubleshooting ..............................................................2-37
Procedure 1 Diagnostic Test Program Execution Check ...............................2-37
Procedure 2 Connector and Replacement Check ...........................................2-38
TECRA M3 Maintenance Manual (960-507) 2-iii
Page 56
2 Troubleshooting Procedures
2.8 Display Troubleshooting ..........................................................................................2-40
Procedure 1 External Monitor Check.............................................................2-40
Procedure 2 Diagnostic Test Program Execution Check ...............................2-40
Procedure 3 Connector Check and Cable Check ...........................................2-40
Procedure 4 Replacement Check....................................................................2-41
2.9 Optical Drive Troubleshooting.................................................................................2-42
Procedure 1 Diagnostic Test Program Execution Check ...............................2-42
Procedure 2 Connector Check and Replacement Check ................................2-43
2.10 Modem Troubleshooting ..........................................................................................2-44
Procedure 1 Diagnostic Test Program Execution Check ...............................2-44
Procedure 2 Connector Check and Replacement Check ................................2-45
2.11 LAN Troubleshooting ..............................................................................................2-46
Procedure 1 Diagnostic Test Program Execution Check ...............................2-46
Procedure 2 Connector Check and Replacement Check ................................2-46
2.12 Bluetooth Troubleshooting.......................................................................................2-47
Procedure 1 Diagnostic Test Program Execution Check ...............................2-47
Procedure 2 Connection Check ......................................................................2-48
Procedure 3 Replacement Check....................................................................2-49
2.13 Wireless LAN Troubleshooting ...............................................................................2-50
Procedure 1 Transmitting-Receiving Check ..................................................2-50
Procedure 2 Antenna Connection Check .......................................................2-51
Procedure 3 Replacement Check....................................................................2-52
2.14 Sound Troubleshooting ............................................................................................2-53
Procedure 1 Diagnostic Test Program Execution Check ...............................2-53
Procedure 2 Connector Check........................................................................2-54
Procedure 3 Replacement Check....................................................................2-55
2.15 SD Card Slot Troubleshooting .................................................................................2-56
Procedure 1 Check on Windows XP ..............................................................2-56
Procedure 2 Connector Check and Replacement Check ................................2-56
2.16 PCI ExpressCard Slot Troubleshooting....................................................................2-57
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2 Troubleshooting Procedures
Figures
Figure 2-1 Troubleshooting flowchart ..................................................................................2-3
Figure 2-2 A set of tool for debug port test .........................................................................2-19
Tables
Table 2-1 Battery icon..........................................................................................................2-6
Table 2-2 DC IN icon...........................................................................................................2-6
Table 2-3 Error code ............................................................................................................2-7
Table 2-4 Result code ........................................................................................................2-14
Table 2-5 Debug port LED boot mode status ....................................................................2-20
Table 2-6 FDD error code and status .................................................................................2-30
Table 2-7 HDD error code and status ................................................................................2-35
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2.1 Troubleshooting 2 Troubleshooting Procedures
2
2.1 Troubleshooting
Chapter 2 describes how to determine if a Field Replaceable Unit (FRU) in the computer is causing the computer to malfunction. The FRUs covered are:
1. Power Supply 6. Display 11. Wireless LAN
2. System Board 7. Optical Drive 12. Sound components
3. USB Floppy Disk Drive 8. Modem 13. SD Card Slot
4. Hard Disk Drive 9. LAN 14. PCI ExpressCard Slot
5. Keyboard/Touch pad 10. Bluetooth
The Diagnostics Disk operations are described in Chapter 3. Detailed Replacement Procedures are given in Chapter 4, Replacement Procedures. The following tools are necessary for implementing the troubleshooting procedures:
The following tools are necessary for implementing the Diagnostics procedures: For tools required for executing the Test Program, refer to the Chapter3. For tools required for disassembling/assembling, refer to the Chapter 4.
1. A set of tools for debugging port test (test cable, test board, RS-232C cross cable,
display, D port FD)
2. A PC with a serial port (for displaying debug port test result)
3. Toshiba MS-DOS system FD
4. An external CRT display(for Display trouble shooting)
5. A SD card(for SD card slot trouble shooting)
6. An external microphone(for Sound trouble shooting)
7. Headphone(for Sound trouble shooting)
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2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart
2.2 Troubleshooting Flowchart
Use the flowchart in Figure 2-1 as a guide for determining which FRU malfunctions. Before going through the flowchart steps, check the following:
Ask the user if a password is registered and, if it is, ask him or her to enter the
password.
Make sure that Toshiba Windows
®
XP is installed on the hard disk. Non-Toshiba
operating systems can cause the computer malfunction.
Make sure all optional equipment is removed from the computer.
Make sure the USB FDD and optical drive are empty.
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2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures
Figure 2-1 Troubleshooting flowchart (1/2)
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2 Troubleshooting Procedures 2.2 Troubleshooting Flowchart
Figure 2-1 Troubleshooting flowchart (2/2)
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2.2 Troubleshooting Flowchart 2 Troubleshooting Procedures
If the diagnostics program cannot detect an error, the problem may be intermittent. The Running Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error, then perform the appropriate troubleshooting procedures as follows:
1. If an error is detected on the system test, memory test, real timer test, perform the
System Board Troubleshooting Procedures in Section 2.4.
2. If an error is detected on the floppy disk test, perform the USB FDD Troubleshooting
Procedures in Section 2.5.
3. If an error is detected on the hard disk test, perform the HDD Troubleshooting
Procedures in Section 2.6.
4. If an error is detected on the keyboard test, perform the Keyboard and Touch pad
Troubleshooting Procedures in Section 2.7.
5. If an error is detected on the display test, perform the Display Troubleshooting
Procedures in Section 2.8.
6. If an error is detected on the CD-ROM/DVD-ROM test, perform the Optical Drive
Troubleshooting Procedures in Section 2.9.
7. If an error is detected on the modem test, perform the Modem Troubleshooting
Procedures in Section 2.10.
8. If an error is detected on the LAN test, perform the LAN Troubleshooting Procedures
in Section 2.11.
9. If an error is detected on the Bluetooth test, perform the Bluetooth Troubleshooting
Procedures in Section 2.12.
10. If an error is detected on the Wireless LAN test, perform the Wireless LAN
Troubleshooting Procedures in Section 2.13.
11. If an error is detected on the sound test, perform the Sound Troubleshooting
Procedures in Section 2.14.
12. If an error is detected on SD card, perform the SD Card Slot Troubleshooting
Procedures in Section 2.15.
13. If an error is detected on PCI ExpressCard, perform the PCI ExpressCard Slot
Troubleshooting Procedures in Section 2.16.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting
2.3 Power Supply Troubleshooting
The power supply controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed. The procedures described in this section are:
Procedure 1: Icons in the LCD Check
Procedure 2: Error Code Check
Procedure 3: Connection Check
Procedure 4: Charge Check
Procedure 5: Replacement Check
Procedure 1 Icons in the LCD Check
The following Icons in the LCD indicate the power supply status:
Battery icon
DC IN icon
The power supply controller displays the power supply status through the Battery icon and the DC IN icon in the LCD as listed in the tables below. To check the power supply status, install a battery pack and connect an AC adaptor.
Table 2-1 Battery icon
Battery icon Power supply status
Lights orange Battery has been charging and AC adapter is connected.
Lights green Battery is fully charged and AC adapter is connected.
Flashes orange Battery charge is low. The AC adaptor must be connected to recharge
the battery.
Doesn’t light Any condition other than those above.
Table 2-2 DC IN icon
DC IN icon Power supply status
Lights green DC power is being supplied from the AC adapter.
Flashes orange There is a problem with the power supply.
Doesn’t light Any condition other than those above.
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Procedure 2 Error Code Check
If the power supply microprocessor detects a malfunction, it indicates the error code as shown below.
The error code begins with the least significant digit.
Table 2-3 Error code
Error code Where Error occurs
1*h Adaptor
(AC Adaptor, DS)
2*h 1st battery The 1st Battery is not connected.
3*h 2nd Battery The 2nd Battery is not connected.
4*h S3V output (P60)
5*h 1R5-C1V output (P61)
6*h A-C3V output (P62)
7*h PPV output (P63:CH0)
8*h E5V output (P64:CH0)
9*h PTV output (P65:CH0)
AC Adaptor is not connected.
Error code begins with : 0x10
Error code ends with : 0x1F
Error code begins with : 0x20
Error code ends with : 0x2F
Error code begins with : 0x30
Error code ends with : 0x3F
Operating Power ON
Error code begins with : 0x40
Error code ends with : 0xEF
A*h 1R8-B1V output (P66:CH0)
B*h PTV output (P63:CH1)
C*h E3V output (P64:CH1)
D*h PTV output (P65:CH1)
E*h 1R8-B1V output (P66:CH1)
F*h
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting
Check 1 Compare the patterns in the hexadecimal error code to the tables below.
DC IN
Error code Meaning
10h AC Adaptor output voltage is over 16.5V.
11h Common Dock voltage is over 16.5V.
12h Current from the DC power supply is over 7.00A.
13h Current from the DC power supply is over 0.5A when there is no load.
14h Current sensing IC is not normal.
1st Battery
Error code Meaning
20h Overvoltage is detected. (Not supported)
21h 1st battery charge current is over 7.00A.
2nd Battery
22h 1st battery discharge current over 0.5A when there is no load.
23h
24h Current sensing IC is not normal.
25h 1st battery charge current is over 0.3A.
Error code Meaning
30h Overvoltage is detected. (Not supported)
31h Secondary battery charge current is over 7.00A.
32h Secondary battery discharge current is over 0.5A when there is no
33h Secondary battery charge current is over 3.1A when AC adapter is not
34h Current sensing IC is not normal.
35h Secondary battery charge current is over 0.3A.
1st battery charge current is over 3.9A when AC adapter is not connected.
load.
connected.
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S3V output (P60)
Error code Meaning
40h S3V voltage is 2.81V or less when the computer is powered on/off.
45h S3V voltage is 2.81V or less when the computer is booting up. (CV
support)
1R5-C1V output (P61)
Error code Meaning
50h 1R5-C1V voltage is over 1. 80V when the computer is powered on/off.
51h 1R5-C1V voltage is 1.275V or less when the computer is powered on.
52h 1R5-C1V voltage is 1.275V or less when the computer is booting up.
53h 1R5-C1V voltage is 1.275V or less when the computer is suspended.
54h 1R5-C1V voltage is abnormal when the computer shuts down. (CV
support)
55h 1R5-C1V voltage is 1.275V or less when the computer is booting up.
A-C3V output (P62)
Error code Meaning
60h A-C3V voltage is over 3.96V when the computer is powered on/off.
61h A-C3V voltage is 2.81V or less when the computer is powered on.
62h A-C3V voltage is 2.81V or less when the computer is booting up.
63h A-C3V voltage is 2.81V or less when the computer is booting up.
64h A-C3V voltage is abnormal when the computer shuts down. (CV
65h A-C3V voltage is 2.81V or less when the computer is booting up.
PPV output (P63:CH0)
Error code Meaning
70h PPV voltage is over 1.80V when the computer is powered on/off.
(CV support)
support)
(CV support)
71h PPV voltage is 0.56V or less when the computer is powered on.
72h PPV voltage is 0.56V or less when the computer is booting up.
73h PPV voltage is 0.56V or more when the computer is powered off.
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E5V output (P64:CH0)
Error code Meaning
80h E5V voltage is over 6.00V when the computer is powered on/off.
81h E5V voltage is 4.50V or less when the computer is powered on.
82h E5V voltage is 4.50V or less when the computer is booting up.
83h E5V voltage is 4.50V or more when the computer is powered off.
84h E5V voltage is 4.50V or less when the computer is suspended.
PTV output (P65: CH0)
Error code Meaning
90h PTV voltage is over 1.26V when the computer is powered on/off.
91h PTV voltage is 0.89V or less when the computer is powered on.
92h PTV voltage is 0.89V or less when the computer is booting up.
93h PTV voltage is 0.89V or more when the computer is powered off.
94h PTV voltage is 0.89V or less when the computer is suspended.
1R8-B1V output (P66:CH0)
Error code Meaning
A0h 1R8-B1V voltage is over 2.40V when the computer is powered on/off.
A1h 1R8-B1V voltage is 1.53V or less when the computer is powered on.
A2h 1R8-B1V voltage is 1.53V or less when the computer is booting up.
A3h 1R8-B1V voltage is 1.53V or less when the computer is suspended.
A4h 1R8-B1V voltage is 1.53V or less when the computer is booting up.
PGV output (P63:CH1)
Error code Meaning
B0h PGV voltage is over 1.62V when the computer is powered on/off.
B1h PGV voltage is 0.68V or less when the computer is powered on.
(CV support)
B2h PGV voltage is 0.68V or less when the computer is booting up.
B3h PGV voltage is 0.68V or more when the computer is powered off.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures
E3V output (P64:CH1)
Error code Meaning
C0h E3V voltage is over 3.96V when the computer is powered on/off.
C1h E3V voltage is 2.81V or less when the computer is powered on.
C2h E3V voltage is 2.81V or less when the computer is booting up.
C3h E3V voltage is 2.81V or more when the computer is powered off.
C4h E3V voltage is 2.81V or less when the computer is suspended.
PTV output (P65:CH1)
Error code Meaning
D0h PTV voltage is over 1.26V when the computer is powered on/off.
D1h PTV voltage is 0.89V or less when the computer is powered on.
D2h PTV voltage is 0.89V or less when the computer is booting up.
D3h PTV voltage is 0.89V or more when the computer is powered off.
D4h PTV voltage is 0.89V or less when the computer is suspended.
1R8-B1V output (P66:CH1)
Error code Meaning
E0h 1R8-B1V voltage is over 2.40V when the computer is powered on/off.
E1h 1R8-B1V voltage is 1.53V or less when the computer is powered on.
E2h 1R8-B1V voltage is 1.53V or less when the computer is booting up.
E3h 1R8-B1V voltage is 1. 53 V or more when the computer is powered off.
E4h 1R8-B1V voltage is 1.53V or less when the computer is suspended.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting
Check 2 In the case of error code 10h or 12h:
Make sure the AC adaptor cord and AC power cord are firmly plugged into
the DC IN 15 V socket and wall outlet. If the cables are connected correctly, go to the following step:
Connect a new AC adaptor and/or AC power cord, if necessary. If the error
still exists, go to Procedure 5.
Check 3 In the case of error code 2Xh:
Make sure the battery pack is correctly installed in the computer. If the
battery pack is correctly installed, go to the following step:
Replace the battery pack with a new one. If the error still exists, go to
Procedure 5.
Check 4 For any other error, go to Procedure 5.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures
Procedure 3 Connection Check
The power supply wiring diagram is shown below:
Any of the connectors may be disconnected. Perform Check 1.
Check 1 Disconnect the AC power cord from the wall outlet. Check the power cable for
breaks. If the power cord is damaged, connect a new AC power cord. If there is no damage, go to Check 2.
Check 2 Make sure the AC adaptor cord and AC power cord are firmly plugged into the
DC-IN jack socket and AC adaptor inlet/wall outlet, respectively. If these cables are connected correctly, go to Check 3.
Check 3 Make sure the DC IN jack is firmly connected to the connector CN8800 on the
system board.
If the DC IN jack is not firmly connected, go to Procedure 5.
If it is connected, go to Check 4.
Check 4 Use a multimeter to make sure the AC adaptor output voltage is close to 15 V. If
the output is several percent lower than 15 V, go to Check 5. If the output is close to 15 V, go to Check 6.
Check 5 Connect a new AC adaptor or AC power cord.
If the DC IN icon does not light, go to Procedure 5.
If the battery icon does not light, go to Check 6.
Check 6 Make sure the battery pack is installed in the computer correctly. If the battery is
properly installed and the battery icon still does not light, go to Procedure 4.
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2 Troubleshooting Procedures 2.3 Power Supply Troubleshooting
Procedure 4 Charge Check
The power supply may not charge the battery pack. Perform the following procedures:
1. Reinstall the battery pack.
2. Attach the AC adaptor and turn on the power. If you cannot turn on the power, go to
Procedure 5.
3. Run the Diagnostic test, go to System test and execute subtest 06 (Quick charge)
described in Chapter 3.
4. When charge is complete, the diagnostics test displays the result code. Check the
result code against the table below and perform any necessary check.
Table 2-4 Result code
Result code Contents Check items
0 The battery is charging normally. Normal
1 The battery is fully charged. Normal
2 The AC adaptor is not attached. Check 1
3 The AC adaptor’s output voltage is not normal. Check 1
4 The battery is not installed. Check 2
5 The battery’s output voltage is not normal. Check 3
6 The battery’s temperature is not normal. Check 4
7 A bad battery is installed. Check 2
8 Any other problems. Check 5
Check 1 Make sure the AC adaptor and AC power cord are firmly plugged into the DC IN
socket and the wall outlet. If these cables are connected correctly, replace the AC adaptor (and/or AC power cord, if necessary).
Check 2 Make sure the battery is properly installed. If the battery is properly installed, go
to Check 3.
Check 3 The battery pack may be completely discharged. Wait a few minutes to charge the
battery pack. If the battery pack is still not charged, go to Check 4.
Check 4 The battery’s temperature is too hot or cold. Return the temperature to a normal
operating condition. If the battery pack still is not charged, go to Check 5.
Check 5 Replace the battery pack with a new one. If the battery pack still is not charged,
go to Procedure 5.
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2.3 Power Supply Troubleshooting 2 Troubleshooting Procedures
Procedure 5 Replacement Check
The system board processor module may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures. Check the connection between the AC adaptor and system board and connection. After checking the connections, perform the following Check 1:
Check 1 Replace the AC adaptor with a new one. If the AC adaptor is still not functioning
properly, perform Check 2.
Check 2 Replace the system board with a new one following the steps described in Chapter
4, Replacement Procedures.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting
2.4 System Board Troubleshooting
This section describes how to determine if the system board and CPU are defective or not functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
The procedures described in this section are:
Procedure 1: Message Check
Procedure 2: Debug Port Check
Procedure 3: Diagnostic Test Program Execution Check
Procedure 4: Replacement Check
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures
Procedure 1 Message Check
When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it.
If an error message is shown on the display, perform Check 1.
If there is no error message, go to Procedure 2.
If Toshiba MS-DOS or Windows XP is properly loaded, go to Procedure 3.
Check 1 If one of the following error messages appears on the screen, press F1 as the
message instructs. These errors occur when the system configuration preserved in the RTC memory (CMOS type memory) is not the same as the actual configuration or when the data is lost.
If you press F1 as the message instructs, returns all system settings to their default
values. Then the system reboots.
If error message (b) appears often when the power is turned on, replace the RTC
battery. If any other error message displays, perform Check 2.
(a) *** Bad HDD type ***
Check system. Then press [F1] key ......
(b) *** Bad RTC battery ***
Check system. Then press [F1] key ......
(c) *** Bad configuration ***
Check system. Then press [F1] key ......
(d) *** Bad memory size ***
Check system. Then press [F1] key ......
(e) *** Bad time function ***
Check system. Then press [F1] key ......
(f) *** Bad check sum (CMOS) ***
Check system. Then press [F1] key ......
(g) *** Bad check sum (ROM) ***
Check system. Then press [F1] key ......
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting
Check 2 The IRT checks the system board. When the IRT detects an error, the system
stops or an error message appears.
If one of the following error messages (1) through (17), (22) or (23) appears, go to Procedure 4.
If the error message (18) appears, go to the Keyboard Troubleshooting Procedures in Section 2.7.
If the error message (19) or (20) appears, go to the HDD Troubleshooting Procedures in Section 2.6.
If the error message (21) appears, go to the Optical Drive Troubleshooting Procedures in Section 2.9.
(1) PIT ERROR (2) MEMORY REFRESH ERROR (3) TIMER CH.2 OUT ERROR (4) CMOS CHECKSUM ERROR (5) CMOS BAD BATTERY ERROR (6) FIRST 64KB MEMORY ERROR (7) FIRST 64KB MEMORY PARITY ERROR (8) VRAM ERROR (9) SYSTEM MEMORY ERROR (10) SYSTEM MEMORY PARITY ERROR (11) EXTENDED MEMORY ERROR (12) EXTENDED MEMORY PARITY ERROR (13) DMA PAGE REGISTER ERROR (14) DMAC #1 ERROR (15) DMAC #2 ERROR (16) PIC #1 ERROR (17) PIC #2 ERROR (18) KBC ERROR (19) HDC ERROR (20) IDE #0 ERROR (21) IDE #1 ERROR (22) TIMER INTERRUPT ERROR (23) RTC UPDATE ERROR
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures
Procedure 2 Debug Port Check
Check the D port status by a debug port test. The tool for debug port test is shown below.
Figure 2-2 A set of tool for debug port test
The test procedures are follows:
1. Connect the debug test cable to the connector CN3400 of the system board. For
disassembling to connect the test cable, refer to Chapter 4.
2. Connect the debug port test cable and RS-232C cross cable to the test board.
3. Connect the RS-232C cross cable to the PC that displays the test results.
4. Boot the computer in MS-DOS mode.
5. Execute GETDPORT.COM in the text menu in CPU REAL mode. (Insert the FD for
starting D port into USB FDD and input “FD starting drive:>dport”.)
6. When the D port status is FFFFh (normal status), go to Procedure 3.
7. When the D port status falls into any status in Table 2-5, go to Procedure 4.
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Table 2-5 Debug port LED boot mode status (1/7)
LED Status Item Contents/Message
Start
B1h EC/KBC rewrite check Transition to BIOS rewriting when required
B2h
B5h Enabling CPU cache
PIT CH0 initialization (for HOLD_ON)
BIOS rewrite flag initialization
Checksum check (FEF00000h­FEFF7FFFh)
Executing initialization of KBC sequence
BIOS signature check B6h
Clearance of software reset bit
Permission of A20 line
Initialization for special register and Intel chip set
Transition to protected mode
Boot block checksum (HLT when checksum error occurred.)
Checksum check except boot block
(HLT when Initialization for SC error occurred) B3H Start initializing the SC
(HLT when processing the SC can not be continued by the HW failure) B4H
transmission of KB enable command
Key check at Boot Block
BIOS rewrite request check Checksum error except boot block
(When key rewriting is requested, go to BIOS rewrite process)
Transition of the process to System BIOS IRT side
Rewriting BIOS H/W initialization
B7h
Setting of base for Power Management I/O Space
Permission of BIOS writing
Serial interrupt control
Releasing BIOS rewrite protection
Enabling SM Bus I/O space
Enabling SM Bus access
Opening work I/O for SDRAM initialization
Setting FDC port
Initialization of PIT channel 1 (Setting refresh interval to 30ms)
Initialization of PIT, DMAC, PIC
Prohibition of cache
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Table 2-5 Debug port LED boot mode status (2/7)
LED Status Item Contents/Message
(B7h) Memory type check
Initialization of cache Bus L2 configuration
Permission of cache
Prohibition of L2 cache
Memory clear
B9h
Setting of TASK_1ms_TSC
FAN control
Sound controller initialization (for beep)
massage
Key input (Key input is skipped when the BIOS is damaged)
Reading CHGBIOS.EXE
Setting of parameter for 2DD (720KB), transmission rate
Enabling system speaker setting
Reading security status Controlling LED instead of display
Reading policy (When reading error above is occurred, beep sounds every one second for thirty seconds)
Sound beep
FDC reset
Setting of parameter for 2HD (1.44MB), transmission rate
Reading first sector
When using 2HD (1.44MB), go to Search of entry for CHGBIOSA.EXE
Search of CHGBIOSA.EXE from route directory
Calculation of directory start head, sector
Reading contents of route directory by one sector
Search of entry for "CHGBIOSA.EXE" from the sector read
Reading of EXE header of "CHGBIOSA.EXE" key input when an error occurred
Execute "CHGBIOSA.EXE"/"CHGFIRMA.EXE"
00h
CHECK_SYSTEM
Prohibition of cache
Initialization of special register and Intel chipset
PIT CH1 initialization
(Setting refresh interval to 30µs)
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Table 2-5 Debug port LED boot mode status (3/7)
LED Status Item Contents/Message
01h Check of DRAM type and size (Reading DRAM size at Warm Boot)
(DRAM check at Cold Boot))
Check of DRAM size (HLT when the DRAM type is 0.) 11h
SM-RAM stack area test (HLT when the stack area can not be used.)
02h
03h
Permission of Cache (L1 cache only)
CMOS access test (at Cold Boot) (HLT when an error is detected.)
Battery level check of CMOS
CMOS checksum check
Initialization of CMOS data (1)
Setting of IRT status (Boot status, the remaining bit is 0.)
Storing DRAM size in CMOS
Resume error check
Not resume when a CMOS error occurred Resume branch (at Cold Boot)
Not resume when resume status code is not set
SM-RAM checksum check (Resume error 0F4H)
Check of memory configuration change
RAM area checksum check in system BIOS (Resume error 0FAH)
PnP RAM checksum check (Resume error 0F8H)
PIT test and initialization (HLT when refresh signal is not changed.)
Initialization of PIT CH0 (Setting of timer interrupt interval to 55ms)
Initialization of PIT CH2 (Setting of sound generator frequency to 664Hz)
Transition to RESUME-MAIN
Resume error process
Boot mode process (in no resume)
Reset of CPU clock to low
Prohibition of all SMI
Clearance of resume status
Return to ROM
Initialization of memory map
Check hibernation from S4 OS
Check hibernation status code
ROM/RAM copy of system BIOS (HLT when copied BIOS checksum error.)
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Table 2-5 Debug port LED boot mode status (4/7)
LED Status Item Contents/Message
04h BIOS signature check (at Cold
Boot)
05h
06h Initialization of a device which
SMRAM initialization
Check of Wake Up factor
Rewriting of SMRAM base and storing CPU state map for BIOS (Enabling SMI only by ASMI)
needs initialization before initialization of PCI bus
PIT test (at the Cold Boot) and initialization
Setting of test pattern for PIT#0 of CH0
Check whether the test pattern set can be read.
Initialization of PIT CH0 (Setting of timer interrupt interval to 55ms)
Initialization of PIT CH2 (Setting of sound generator frequency to 664Hz)
Test of PIT CH1 (Check whether a refresh signal is working properly when refresh interval is set to 30ms. HLT when the time is out.)
Test of PIT CH2 (Check whether the speaker gate is working properly.)
Measuring of CPU clock
Enabling SMI except for auto-off function
07h
Storing memory configuration in buffer
Reading EC version
Update of flash ROM type
Evaluation of destination (home/overseas) by DMI data
Check of parameter block A
Control of input voltage over rating
Control of battery discharge current
Control of AC adapter over current rating
Division process of measuring IRT time
Setting for clock generator
CPU initialization
Setting of CPU core frequency
Setting of Gsv high and low frequency
Check of Geyserville support
Setting of CPU clock to high
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting
Table 2-5 Debug port LED boot mode status (5/7)
LED Status Item Contents/Message
(07h)
08h
Setting default when a CMOS default (Bad Battery, Bad Checksum (ROM, CMOS)) check
Initialization of ACPI table (for executing an option ROM)
Initialization of a device that needs initialization before PCI bus initialization
PIC initialization
PIC test
Password initialization
PCI Bus initialization
AC’97 control
Initialization of temperature control information
Initialization of HC sequence start, Recognition of device
VGA display off and reset control
KBC initialization
Sound initialization
Acquisition of multi box status
Start of HC initialization sequence and device recognition
Control of interval LAN enable/disable
09h
0Ah
Initialization of LAN information
Check of Wakeup factor
Running a task waiting for the end of INIT PCI
CMOS data initialization (2)
PnP initialization
Setting of setup item
Initialization of PC card slot
Running a task waiting for the end of PnP resource
Serial interrupt control
Initialization of H/W related to PnP
Setting of power on enable
Clearance of Wake Up condition
Controling CPU speed
Controling panel open/close
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures
Table 2-5 Debug port LED boot mode status (6/7)
LED Status Item Contents/Message
(0Ah) PCI automatic configuration
Initialization of H/W that is necessary after PCI configuration
Enabling power off
0Ch Check memory of first 64KB
0Dh Vector initialization
0Eh NDP initialization
0Fh System initialization
11h Display initialization
12h Display initialization (VGA chip, Waiting for the end of initialization,
Creating a work area for auto configuration
Configuration
Storing the results of VGA configuration
0Bh
Storing CMOS error status in IRT_ERR_STS_BUF
Start of TIMER initialization
Initialization of EC and Reading battery information
Update of system BIOS (model name, EDID of the LCD)
Setting of DRAM window from memory size
SMI Permission of Dock Port Multi box
initialization of VGA BIOS)
13h LOGO display
14h System memory check (Conventional memory check) (Boot)
15h Extension memory check (Check of exceptional cases in protected mode) (Boot)
16h Extension memory check (Occurrence of exceptional case)
17h System memory initialization (Conventional memory initialization) (Reboot)
18h DMA page check (Boot)
19h DMAC check (Boot)
1Ah DMAC initialization (Boot)
1Bh Printer check
1Ch SIO check
1Dh Boot password (Password check)
(Waiting for the end of INIT_KBC division process)
1Eh Extension I/O ROM check (Option I/O ROM check)
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting
Table 2-5 Debug port LED boot mode status (7/7)
LED Status Item Contents/Message
1Fh Pre boot setup
Storing the value of 40:00h (for SIO save/restore)
Font address setting for resume password
Setting of parameter for character repeat on a USB keyboard
Getting keys pressed during the IRT
Storing T_SHADO_RAM_SIZE
Reflecting expansion memory size to CMOS
Update of system resources information just before booting
Updating a table for DMI
Rewriting memory map data for INT15h E820h
Rewriting Wake UP factor of DMI and SM-BIOS structure table
Copying an ACPI table to the top of an expansion memory
Waiting for the end of writing PSC version on BIOS
Waiting for the end of clock generator setting and check (Stop at LED=20H when an error occurred)
Waiting for the end of serial port initialization
Canceling NMI Mask
Examining the checksum of TIT
Clearance of IRT running flag for runtime
Updating checksum for runtime
Branching to hibernation
Bluetooth initialization
Check upgrade of CPU, HDD, etc.
Check whether a target maintenance card is set
Disabling a PC card not used
Setting of Wake UP status data for ACPI
HW initialization prior to boot, Waiting for the end of HW initialization
SID of SC initialization
Cutting power consumption of built-in LAN
21h IRT post end
FFh
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2.4 System Board Troubleshooting 2 Troubleshooting Procedures
Procedure 3 Diagnostic Test Program Execution Check
Execute the following tests from the Diagnostic Test Menu. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform these tests.
1. System test
2. Memory test
3. Keyboard test
4. Display test
5. Floppy Disk test
6. Async test
7. Hard Disk test
8. Real Timer test
9. NDP test
10. Expansion test
11. CD-ROM/DVD-ROM test
12. Wireless LAN test
13. Sound test
14. LAN/Modem/Bluetooth/IEEE1394 test
If an error is detected during these tests, go to Procedure 4.
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2 Troubleshooting Procedures 2.4 System Board Troubleshooting
Procedure 4 Replacement Check
The system board connectors may be disconnected. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform Check 1.
Check 1 Visually check for the following:
a) Cracked or broken connector housing
b) Damaged connector pins
If their connectors are in good condition, but there is still a problem, go to Check
2.
Check 2 The system board may be damaged. Replace the system board with a new one
following the steps described in Chapter 4, Replacement Procedures.
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2.5 USB FDD Troubleshooting 2 Troubleshooting Procedures

2.5 USB FDD Troubleshooting

This section describes how to determine if the USB FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
Procedure 1: USB FDD Head Cleaning Check
Procedure 2: Diagnostic Test Program Execution Check
Procedure 3: Connector Check and Replacement Check
Procedure 1 USB FDD Head Cleaning Check
USB FDD head cleaning operation details are given in Chapter 3, Tests and Diagnostics.
Insert the Diagnostics Disk in the computer’s floppy disk drive, turn on the computer and run the test. Clean the USB FDD heads using the cleaning kit. If the USB FDD still does not function properly after cleaning, go to Procedure 2.
If the test program cannot be executed, go to Procedure 3.
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2 Troubleshooting Procedures 2.5 USB FDD Troubleshooting
Procedure 2 Diagnostic Test Program Execution Check
Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures.
Floppy disk drive test error codes and their status names are listed in Table 2-6. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled. If any other errors occur while executing the FDD diagnostics test, go to Check 1.
Table 2-6 FDD error code and status
Code Status
01h Bad command error
02h Address mark not found
03h Write protected
04h Record not found
06h Media removed
08h DMA overrun error
09h DMA boundary error
10h CRC error
20h FDC error
40h Seek error
60h Not drive error
80h Time out error
EEh Write buffer error
Check 1 If the following message appears, disable the write protect tab on the floppy disk.
If any other message appears, perform Check 2.
Write protected
Check 2 Make sure the floppy disk is formatted correctly. If it is, go to Procedure 3.
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2.5 USB FDD Troubleshooting 2 Troubleshooting Procedures
Procedure 3 Connector Check and Replacement Check
The USB FDD is connected to the System Board.
Check 1 When using the USB port, make sure the USB FDD cable is firmly connected to
CN4600 (USB port 0) or CN4601 (USB port 3) on the SN board and the SN cable is firmly connected to CN9501 on the system board and CN9511 on the SN board.
If any of the connections are loose, reconnect firmly and repeat Procedure 2. If any of the connections is damaged, or there is still an error, go to Check 2.
Check 2 The USB FDD or USB FDD cable may be defective or damaged. Replace it with
a new one. If the USB FDD is still not functioning properly, perform Check 3.
Check 3 The SN board or SN cable may be defective or damaged. Replace it with a new
one following the steps in Chapter 4, Replacement Procedures. If the USB FDD is still not functioning properly, perform Check 4.
Check 4 Replace the System board with a new one following the steps in Chapter 4,
Replacement Procedures.
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2 Troubleshooting Procedures 2.6 HDD Troubleshooting
2
2.6 HDD Troubleshooting
This section describes how to determine if the HDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.
Procedure 1: Message Check
Procedure 2: Partition Check
Procedure 3: Format Check
Procedure 4: Diagnostic Test Program Execution Check
Procedure 5: Connector Check and Replacement Check
CAUTION: The contents of the hard disk will be erased when you execute the HDD
troubleshooting procedures. Transfer the contents of the hard disk to floppy disks or other storage media.
Procedure 1 Message Check
When the computer’s HDD does not function properly, some of the following error messages may appear on the display. Start with Check 1 below and perform the other checks as instructed.
Check 1 If any of the following messages appear, go to Procedure 5. If the following
messages do not appear, perform Check 2.
HDC ERROR (After 5 seconds this message will disappear.)
or
IDE #0 ERROR (After 5 seconds this message will disappear.)
or
IDE #1 ERROR (After 5 seconds this message will disappear.)
Check 2 If either of the following messages appears, go to Procedure 2. If the following
messages do not appear, perform Check 3.
Insert system disk in drive
Press any key when ready .....
Non-System disk or disk error Replace and press any key
or
Check 3 Make sure the Hard Disk option is set to not used. If it is set to not used, choose
another setting and restart the computer. If the problem still exists, go to Procedure 2.
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2.6 HDD Troubleshooting 2 Troubleshooting Procedures
Procedure 2 Partition Check
Insert the Toshiba MS-DOS system disk and restart the computer with U key holding down. Perform the following checks:
Check 1 Type C: and press Enter. If you cannot change to drive C, go to Check 2. If you
can change to drive C, go to Check 3.
Check 2 Type FDISK and press Enter. Choose Display Partition Information from the
FDISK menu. If drive C is listed, go to Check 3. If drive C is not listed, return to the FDISK menu and choose the option to create a DOS partition on drive C. Restart the computer from the Toshiba MS-DOS system disk. If the problem still exists, go to Procedure 3.
Check 3 If drive C is listed as active in the FDISK menu, go to Check 4. If drive C is not
listed as active, return to the FDISK menu and choose the option to set the active partition for drive C. Restart the computer and then go to Procedure 3.
Check 4 Remove the FD and restart the computer. If the problem still exists, go to
Procedure 3.
Check 5 Using the SYS command on the Toshiba MS-DOS system disk, install system
files on the HDD.
If the following message appears on the display, the system files have been transferred to the HDD. Restart the computer. If the problem still exists, go to Procedure 3.
System transferred
NOTE: If the computer is running Windows 2000, OSR2 or higher and the hard disk has
more than 512 MB capacity, the FDISK program will ask if you need support for a partition larger than 2GB. Select Y for large partition support; however, be
sure to read the precaution regarding access by other operating systems.
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2 Troubleshooting Procedures 2.6 HDD Troubleshooting
Procedure 3 Format Check
The computer’s HDD is formatted using the low level format program and the MS-DOS FORMAT program. To format the HDD, start with Check 1 below and perform the other steps as required.
Check 1 Format the HDD and transfer system files using FORMAT C:/S/U. If the
following message appears on the display, the HDD is formatted.
Format complete
If an error message appears on the display, refer to the Toshiba MS-DOS Manual for more information and perform Check 2.
Check 2 Using the Diagnostics Disk, format the HDD with a low level format option.
Refer to Chapter 3, Tests and Diagnostics for more information about the diagnostic program.
If the following message appears on the display, the HDD low level format is complete. Partition and format the HDD using the MS-DOS FORMAT command.
Format complete
If you cannot format the HDD using the Tests and Diagnostic program, go to Procedure 4.
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2.6 HDD Troubleshooting 2 Troubleshooting Procedures
Procedure 4 Diagnostic Test Program Execution Check
The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program.
If an error is detected during the HDD test, an error code and status will be displayed. Replace the HDD with a new one following the instructions in Chapter 4, Replacement Procedures. The error codes and statuses are listed in Table 2-7. If an error code is not generated or the problem still exists, go to Procedure 5.
Table 2-7 HDD error code and status
Code Status
01h Bad command error
02h Address mark not found
04h Record not found
05h HDC not reset
07h Drive not initialized
08h Overrun error (DRQ ON)
09h DMA boundary error
0Ah Bad sector error
0Bh Bad track error
10h ECC error
11h ECC recover enable
12h DMA CRC error
20h HDC error
40h Seek error
80h Time out error
AAh Drive not ready
BBh Undefined error
CCh Write fault
E0h Status error
EEh Access time error
DAh No HDD
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2 Troubleshooting Procedures 2.6 HDD Troubleshooting
Procedure 5 Connector Check and Replacement Check
The HDD may be disconnected, or the HDD or the system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks:
Check 1 Make sure the HDD is firmly connected to CN1800 on the system board.
If any of the connections are loose, reconnect firmly and repeat Procedure 1. If
there is still an error, go to Check 2.
Check 2 The HDD may be damaged. Replace it with a new one following the instructions
in Chapter 4, Replacement Procedures. If the problem still exists, perform Check
3.
Check 3 The System board may be damaged. Replace it with a new one following the
instructions in Chapter 4, Replacement Procedures.
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2.7 Keyboard and Touch pad Troubleshooting 2 Troubleshooting Procedures
2.7 Keyboard and Touch pad Troubleshooting
To determine if the computer’s keyboard or touch pad is functioning properly, perform the following procedures. Start with Procedure 1 and continue with the other procedures as instructed.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector and Replacement Check
Procedure 1 Diagnostic Test Program Execution Check
Execute the Keyboard Test in the Diagnostic Program. Refer to Chapter 3, Tests and Diagnostics, for more information on how to perform the test program.
If an error occurs, go to Procedure 2. If an error does not occur, the keyboard is functioning properly.
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2 Troubleshooting Procedures 2.7 Keyboard and Touch pad Troubleshooting
Procedure 2 Connector and Replacement Check
The keyboard, touch pad or sensor/switch board may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks:
1. If the keyboard or AccuPoint malfunctions, start with Check 1.
2. If the touch pad malfunctions, start with Check 3.
3. If the power switch, InTouch button or Presentation button malfunctions, start with
Check 5.
Check 1 Make sure the keyboard cable is securely connected to CN3200 on the system
board.
If the connection is loose, reconnect firmly and repeat Procedure 2. If there is still an error, go to Check 2.
Check 2 The keyboard or its cable may be damaged. Replace it with a new one following
the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 7.
Check 3 Make sure the touch pad cable is firmly connected to CN3201 on the system
board.
If the connection is loose, reconnect firmly and repeat Procedure 2. If there is still
an error, go to Check 4.
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2.7 Keyboard and Touch pad Troubleshooting 2 Troubleshooting Procedures
Check 4 The touch pad or the touch pad cable may be damaged. Replace it with a new one
following the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 7.
Check 5 Make sure the sensor/switch cable is firmly connected to the connector CN9600
on the system board and to connector PJ9610 on the sensor/switch board.
If the connection is loose, reconnect firmly and repeat Procedure 1. If there is still
an error, go to Check 6.
Check 6 The sensor/switch board may be damaged. Replace it with a new one following
the instructions in Chapter 4, Replacement Procedures. If there is still an error, go to Check 7.
Check 7 The system board may be damaged. Replace it with a new one following the
instructions in Chapter 4, Replacement Procedures.
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2 Troubleshooting Procedures 2.8 Display Troubleshooting
2.8 Display Troubleshooting
This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed.
Procedure 1: External Monitor Check
Procedure 2: Diagnostic Test Program Execution Check
Procedure 3: Connector Check and Cable Check
Procedure 4: Replacement Check
Procedure 1 External Monitor Check
Connect an external monitor and tun on the computer. If there is no problem on it, the internal LCD may be defective. Go to Procedure 3. If there is any problem on the external monitor, the system board may be defective. Go to Procedure 2.
Procedure 2 Diagnostic Test Program Execution Check
The Display Test program is stored on the computer’s Diagnostics disk. This program checks the display controller on the system board. Insert the Diagnostics disk in the computer’s floppy disk drive, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics for details. If an error is detected, go to Procedure 3.
Procedure 3 Connector Check and Cable Check
Check 1 The LCD, FL, FL Inverter Board and System Board are connected by the HV
cable and LCD/FL cable as shown bellow. Check the connections. The connectors may be disconnected or damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures.
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2.8 Display Troubleshooting 2 Troubleshooting Procedures
If the connection is loose, reconnect firmly and restart the computer. If there is still an error, go to Procedure 4.
Procedure 4 Replacement Check
The FL, FL inverter board, LCD module, and system board are connected to display circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks:
1. If the FL does not light, perform Check 1.
2. If characters or graphics are not displayed clearly, perform Check 1.
3. If some screen functions do not operate properly, perform Check 2.
4. If the FL remains lit when the display is closed, perform Check 4.
Check 1 Replace the FL with a new one following the instructions in Chapter 4,
Replacement Procedures and test the display again. If the problem still exists, perform Check2.
Check 2 Replace the LCD module with a new one following the instructions in Chapter 4,
Replacement Procedures and test the display again. If the problem still exists, perform Check 3.
Check 3 Replace the display cable (FL cable and LCD cable) with a new one following the
instructions in Chapter 4, Replacement Procedures and test the display again. If the problem still exists, perform Check 4.
Check 4 The display controller on the system board may be damaged. Replace the system
board with a new one following the instructions in Chapter 4, Replacement
Procedures.
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2 Troubleshooting Procedures 2.9 Optical Drive Troubleshooting

2.9 Optical Drive Troubleshooting

This section describes how to determine if the optical drive (CD-ROM,DVD-ROM, CD­RW/DVD-ROM, DVD±R/±RW or DVD Super Multi drive) in the Slim Select Bay is functioning properly. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.
Procedure 1: Diagnostic Test Program Execution Check
Procedure 2: Connector Check and Replacement Check
Procedure 1 Diagnostic Test Program Execution Check
The CD-ROM/DVD-ROM test program is stored in the Diagnostics Disk.
For the test, prepare test Media.
Then insert the Diagnostics Disk in the computer’s floppy disk drive, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures.
If any errors occur while executing the CD-ROM/DVD-ROM test, go to Procedure 2.
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