Toshiba satellite r70, tecra m7 Service Manual

Toshiba Personal Computer

Satellite R20 / TECRA M7

Maintenance Manual

TOSHIBA CORPORATION

File Number 960-572

[CONFIDENTIAL]

© 2006 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed, with respect to the use of the information contained herein.

Toshiba Satellite R20/TECRA M7 Maintenance Manual First edition June 2006

Disclaimer

This manual has been validated and reviewed for accuracy. The instructions and descriptions it contains are accurate for the Toshiba Satellite R20/TECRA M7 at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions or discrepancies between the computer and the manual.

Trademarks

IBM is a registered trademark and IBM PC is a trademark of International Business Machines Corporation. Intel, Intel SpeedStep, Intel Core, Celeron and Centrino are trademarks or registered trademarks of Intel Corporation. Windows and Microsoft are registered trademarks of Microsoft Corporation. Photo CD is a trademark of Eastman Kodak. Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license. Memory Stick and i.LINK are trademark and registered trademark of Sony Corporation. Other trademarks and registered trademarks not listed above may be used in this manual.

ii [CONFIDENTIAL] Satellite R20/TECRA M7 Maintenance Manual (960-572)

Preface

This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite R20/TECRA M7, referred to as Satellite R20/TECRA M7 in this manual.

The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.

SAFETY PRECAUTIONS

Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.

DANGER: “Danger” indicates the existence of a hazard that could result in death or

serious bodily injury, if the safety instruction is not observed.

WARNING: “Warning” indicates the existence of a hazard that could result in bodily

injury, if the safety instruction is not observed.

CAUTION: “Caution” indicates the existence of a hazard that could result in property

damage, if the safety instruction is not observed.

NOTE: “Note” contains general information that relates to your safe maintenance

service.

Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.

 Be sure to fasten screws securely with the right screwdriver. Be sure to use the PH

Point size “0” and “1” screwdrivers complying with the ISO/DIS 8764-1:1996. If a screw is not fully fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.

 If you replace the battery pack or RTC battery, be sure to use only the same model

battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.

Satellite R20/TECRA M7 Maintenance Manual (960-572) [CONFIDENTIAL] iii

The manual is divided into the following parts:

Chapter 1 Hardware Overview describes the Satellite R20/TECRA M7 system

unit and each FRU.

Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve

FRU problems.

Chapter 3 Test and Diagnostics describes how to perform test and diagnostic

operations for maintenance service.

Chapter 4 Replacement Procedures describes the removal and replacement of the

FRUs.

Appendices The appendices describe the following:

 Handling the LCD module  Board layout  Pin assignment  Keyboard scan/character codes  Key layout  Wiring Diagrams  BIOS Rewrite Procedures  EC/KBC Rewrite Procedures  Reliability

iv [CONFIDENTIAL] Satellite R20/TECRA M7 Maintenance Manual (960-572)

Conventions

This manual uses the following formats to describe, identify, and highlight terms and operating procedures.

Acronyms

On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:

Read Only Memory (ROM)

Keys

Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.

Key operation

Some operations require you to simultaneously use two or more keys. We identify such operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If three keys are used, hold down the first two and at the same time press the third.

User input

Text that you are instructed to type in is shown in the boldface type below:

DISKCOPY A: B:

The display

Text generated by the TECRA M7/Sattellite R20 that appears on its display is presented in the type face below:

Format complete System transferred

Satellite R20/TECRA M7 Maintenance Manual (960-572) [CONFIDENTIAL] v

Chapter 1 Hardware Overview

1.1 Features......................................................................................................................1-1

1.2 System block diagram................................................................................................ 1-8

1.3 2.5-inch Hard Disk Drive......................................................................................... 1-14

1.4 Optical Drive............................................................................................................ 1-17

1.5 Keyboard..................................................................................................................1-25

1.6 TFT Color Display...................................................................................................1-26

1.7 Power Supply...........................................................................................................1-28

1.8 Batteries ...................................................................................................................1-31

1.9 AC Adapter.............................................................................................................. 1-34

Chapter 2 Troubleshooting Procedures

2.1 Troubleshooting......................................................................................................... 2-1

2.2 Troubleshooting Flowchart........................................................................................2-2

2.3 Power Supply Troubleshooting..................................................................................2-6

2.4 System Board Troubleshooting................................................................................2-16

2.5 USB 3.5” FDD Troubleshooting..............................................................................2-32

2.6 2.5” HDD Troubleshooting...................................................................................... 2-35

2.7 Keyboard Troubleshooting ......................................................................................2-40

2.8 Display Troubleshooting.......................................................................................... 2-41

2.9 Touch Pad Troubleshooting.....................................................................................2-43

2.10 Optical Drive Troubleshooting................................................................................ 2-44

2.11 Modem Troubleshooting.......................................................................................... 2-45

2.12 Bluetooth Troubleshooting ......................................................................................2-47

2.13 LAN Troubleshooting..............................................................................................2-49

2.14 Sound Troubleshooting............................................................................................2-50

2.15 Bridge media Slot Troubleshooting.........................................................................2-51

2.16 Tablet Pen Troubleshooting.....................................................................................2-52

2.17 Wireless LAN Troubleshooting...............................................................................2-54

2.18 Fingerprint sensor Troubleshooting......................................................................... 2-56

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Chapter 3 Tests and Diagnostics

3.1 The Diagnostic Test................................................................................................... 3-1

3.2 Executing the Diagnostic Test...................................................................................3-4

3.3 Setting of the hardware configuration........................................................................3-8

3.4 Heatrun Test.............................................................................................................3-11

3.5 Subtest Names.......................................................................................................... 3-12

3.6 System Test.............................................................................................................. 3-14

3.7 Memory Test............................................................................................................ 3-16

3.8 Keyboard Test.......................................................................................................... 3-17

3.9 Display Test.............................................................................................................3-18

3.10 Floppy Disk Test...................................................................................................... 3-21

3.11 Printer Test...............................................................................................................3-23

3.12 Async Test ............................................................................................................... 3-25

3.13 Hard Disk Test.........................................................................................................3-26

3.14 Real Timer Test........................................................................................................3-29

3.15 NDP Test.................................................................................................................. 3-31

3.16 Expansion Test.........................................................................................................3-32

3.17 CD-ROM/DVD-ROM Test ..................................................................................... 3-34

3.18 Error Code and Error Status Names.........................................................................3-35

3.19 Hard Disk Test Detail Status....................................................................................3-38

3.20 Only One Test.......................................................................................................... 3-40

3.21 Head Cleaning.......................................................................................................... 3-49

3.22 Log Utilities.............................................................................................................3-50

3.23 Running Test............................................................................................................ 3-52

3.24 Floppy Disk Drive Utilities......................................................................................3-53

3.25 System Configuration ..............................................................................................3-58

3.26 Wireless LAN Test Program (Intel-made b/g).........................................................3-60

3.27 Wireless LAN Test Program (Intel-made a/b/g)......................................................3-64

3.28 Wireless LAN Test Program (Atheros)................................................................... 3-69

3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program ..................................................3-76

3.30 Sound Test Program.................................................................................................3-90

3.31 SETUP .....................................................................................................................3-96

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Chapter 4 Replacement Procedures

4.1 Overview...................................................................................................................4-1

4.2 Battery pack..............................................................................................................4-8

4.3 Reserve pen.............................................................................................................4-10

4.4 Tablet PC pen..........................................................................................................4-11

4.5 PC card/Bridge media.............................................................................................4-12

4.6 MDC/USIM card ....................................................................................................4-14

4.7 HDD........................................................................................................................4-16

4.8 Keyboard.................................................................................................................4-20

4.9 Memory module......................................................................................................4-23

4.10 SW membrane.........................................................................................................4-26

4.11 Optical disk drive....................................................................................................4-28

4.12 Cover assembly and Base assembly .......................................................................4-31

4.13 Base latch................................................................................................................4-35

4.14 Touch pen case/Battery lock...................................................................................4-36

4.15 Bluetooth module....................................................................................................4-37

4.16 Wireless LAN card .................................................................................................4-39

4.17 Microphone/Front panel..........................................................................................4-41

4.18 Modem jack/USB board/DC-IN jack......................................................................4-43

4.19 RTC battery.............................................................................................................4-46

4.20 System board...........................................................................................................4-48

4.21 GPU heat sink.........................................................................................................4-50

4.22 Fan/Heat sink/CPU .................................................................................................4-52

4.23 Sensor board............................................................................................................4-56

4.24 Speaker....................................................................................................................4-57

4.25 Touch pad................................................................................................................4-59

4.26 LCD mask...............................................................................................................4-61

4.27 Fingerprint sensor board .........................................................................................4-65

4.28 Switch board ...........................................................................................................4-66

4.29 LCD unit/FL inverter..............................................................................................4-67

4.30 Digitizer ..................................................................................................................4-71

4.31 LCD latch assembly................................................................................................4-78

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4.32 Hinge assembly.......................................................................................................4-79

4.33 Fluorescent Lamp....................................................................................................4-82

Appendices

Appendix A Handling the LCD Module .......................................................................A-1

Appendix B Board Layout ............................................................................................ B-1

Appendix C Pin Assignment......................................................................................... C-1

Appendix D Keyboard Scan/Character Codes.............................................................. D-1

Appendix E Key Layout.................................................................................................E-1

Appendix F Wiring Diagrams........................................................................................F-1

Appendix G BIOS Rewrite Procedures.........................................................................G-1

Appendix H EC/KBC Rewrite Procedures.................................................................... H-1

Appendix I Reliability....................................................................................................I-1

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x [CONFIDENTIAL] Satellite R20/TECRA M7 Maintenance Manual (960-572)

Chapter 1 Hardware Overview

[CONFIDENTIAL]

1 Hardware Overview

1-ii [CONFIDENTIAL] Satellite R20/TECRA M7 Maintenance Manual (960-572)

1 Hardware Overview

Chapter 1 Contents

1.1 Features...................................................................................................................... 1-1

1.2 System block diagram................................................................................................ 1-8

1.3 2.5-inch Hard Disk Drive......................................................................................... 1-14

1.4 Optical Drive............................................................................................................ 1-17

1.4.1 DVD-ROM Drive.............................................................................. 1-17

1.4.2 DVD-ROM & CD-R/RW Drive ........................................................ 1-19

1.4.3 DVD Super Multi Drive .................................................................... 1-22

1.5 Keyboard.................................................................................................................. 1-25

1.6 TFT Color Display................................................................................................... 1-26

1.6.1 LCD Module ...................................................................................... 1-26

1.6.2 FL Inverter Board............................................................................... 1-27

1.7 Power Supply........................................................................................................... 1-28

1.8 Batteries ...................................................................................................................1-31

1.8.1 Main Battery....................................................................................... 1-31

1.8.2 Battery Charging Control...................................................................1-32

1.8.3 RTC Battery .......................................................................................1-33

1.9 AC Adapter.............................................................................................................. 1-34

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1 Hardware Overview

Figures

Figure 1-1 Front of the computer.....................................................................................1-6

Figure 1-2 System units configuration ............................................................................ 1-7

Figure 1-3 System block diagram....................................................................................1-8

Figure 1-4 2.5-inch HDD............................................................................................... 1-14

Figure 1-5 DVD-ROM drive .........................................................................................1-17

Figure 1-6 DVD-ROM & CD-R/RW drive................................................................... 1-19

Figure 1-7 DVD Super Multi drive ............................................................................... 1-22

Figure 1-8 Keyboard...................................................................................................... 1-25

Figure 1-9 LCD module................................................................................................. 1-26

Tables

Table 1-1 2.5-inch HDD Specifications....................................................................... 1-14

Table 1-2 DVD-ROM drive outline dimensions..........................................................1-17

Table 1-3 DVD-ROM drive specifications.................................................................. 1-18

Table 1-4 DVD-ROM & CD-R/RW drive outline dimensions.................................... 1-19

Table 1-5 DVD-ROM & CD-R/RW drive specifications............................................ 1-20

Table 1-6 DVD Super Multi drive outline dimensions................................................ 1-22

Table 1-7 DVD Super Multi drive specifications ........................................................1-23

Table 1-8 LCD module specifications (14.1 TFT).......................................................1-26

Table 1-9 FL inverter board specifications ..................................................................1-27

Table 1-10 Power supply output specifications .............................................................1-29

Table 1-11 Battery specifications................................................................................... 1-31

Table 1-12 Time required for charges of main battery ..................................................1-32

Table 1-13 Data preservation time................................................................................. 1-32

Table 1-14 RTC battery charging/data preservation time..............................................1-33

Table 1-15 AC adapter specifications............................................................................1-34

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1.1 Features 1 Hardware Overview

1 Features

1.1 Features

The Satellite R20/TECRA M7 is an ultra thin and lightweight tablet PC realizing cable-less environment on a table by wireless function with an Intel® CoreTM Duo/Solo or Intel

Celeron® M processor realizing high performance. There some models and options. Refer to the Parts List for the configuration of each model

and option.

 Microprocessor

Microprocessor that is used will be different of the model. The PC comes in with one of the following speeds:

• Intel® Core

Core

Duo

Duo 1.60GHz (Processor Number : T2050)

1.66GHz (Processor Number : T2300E)

1.66GHz (Processor Number : T2300)

1.73GHz (Processor Number : T2250)

1.83GHz (Processor Number : T2400)

2.00GHz (Processor Number : T2500)

2.16GHz (Processor Number : T2600)

2.33GHz (Processor Number : T2700)

• Intel

Core

Solo

Solo 1.66GHz (Processor Number : T1300)

1.83GHz (Processor Number : T1400)

1.86GHz (Processor Number : T1350)

• Intel

Celeron® M

Celeron® M 1.60GHz (Processor Number : 420)

1.73GHz (Processor Number : 430)

 Chipset

Equipped with Intel 945GM or 945PM as North Bridge, Intel ICH7-M as South Bridge and Texas Instrument PCI7412ZHK as Card Controller.

 VGA Controller

An internal Graphics Controller in North Bridge or an nVIDIA Quadro NVS 110M is used.

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1 Hardware Overview 1.1 Features

 Memory

Two DDR2 SO-DIMM slots support DDR2 533 or DDR2 667. Memory modules can be installed to a maximum of 4GB (4,096MB). Memory modules of 256MB, 512MB, 1GB and 2GB sizes are available.

 HDD

The computer has a 2.5-inch SATA HDD. The following capacities are available.

• 40/60/80/100/120GB

 Optical disk drive

DVD-ROM drive, DVD-ROM&CD-R/RW drive or DVD Super Multi drive (double layer) can be installed.

 USB FDD

A 3.5 inch USB FDD supports 720KB/1.44MB formats.

 Display

The display swivels automatically 0/90/180/270 degrees by display driver. LCD and External monitor can be displayed at the same time.

LCD : Built-in 14.1 inch, 16M colors, WXGA+ (1,440×900 dots), thin type low

temperature poly-silicon TFT color display. External monitor : Supported via an RGB connector. DVI : Supported by a TOSHIBA Express Port Replicator. (Only in TECRA M7)

 Digitizer

A digitizer is installed at the rear of LCD unit. The supplied tablet pen enables pen computing.

 Tablet pen / Reserve pen

The Tablet pen / Reserve pen can be used as a mouse by touching the display softly with the pen tip. Tablet button on the side of the pen corresponds to the right click of the mouse. Erase button on the pen tail can be used as an eraser depending on the application.

 Keyboard

The keyboard has 85(US)/87(UK) keys and supports Windows key and Hot key.

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1.1 Features 1 Hardware Overview

 Touch pad

A touch pad is installed as a pointing device.

 Batteries

The computer has three batteries: a rechargeable Lithium-Ion main battery pack, a rechargeable Lithium-Ion secondary battery pack (Provided with some models or option) and an RTC battery (that backs up the Real Time Clock and CMOS memory).

 USB (Universal Serial Bus)

Four USB ports are usable. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.

 PC card slot

The PC card slot (PCMCIA) accommodates one 5mm Type II card. (Based on PC Card Standard, supporting CardBus)

 Bridge media slot

The Bridge media slot supports one SD memory card/SDIO card/Memory stick/ Memory stick PRO/xD picture card/MultiMediaCard slot. Data can be read and written by inserting each media to the slot.

 Sound system

The sound system is equipped with the following features:

- Built-in stereo speakers

- Built-in monaural microphone

- Stereo Headphone jack

- External microphone jack

- Digital volume

- VoIP (Receiving)

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1 Hardware Overview 1.1 Features

 Switch/Button

The following switches and buttons are equipped. Satellite R20/TECRA M7

- Windows-Security button

- Escape/Rotation button

- Cross Function button

- Wireless communication switch

- Power on switch

Satellite R20

- Internet button

- Mail button

- CD/DVD button

- Play button

- Stop button

- Rewind button

- Fast forward button

TECRA M7

- Presentation button

- Toshiba Assist button

- General 1 button

- General 2 button

 Internal Modem

The internal modem is equipped as a modem daughter card (MDC). The internal modem provides capability for data and fax communication and supports

ITU-T V.90 standard. For data reception it operates at 56Kbps and for data transmission it operates at 33.6Kbps. For fax transmission, it operates at 14,4Kbps. The speed of data transfer and fax depends on analog telephone line condition. It has an RJ11 modem jack for connecting to a telephone line.

 LAN

The computer has built-in support for Ethernet LAN (10 megabits per second, 10BASE-T), Fast Ethernet LAN (100 megabits per second, 100BASE-TX) and Gigabit Ethernet LAN (1000 megabits per second, 1000BASE-T). Some models are not equipped with a Gigabit Ethernet LAN.

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1.1 Features 1 Hardware Overview

 Wireless LAN

The computer is equipped with PCI Express Mini Card type wireless LAN card that supports 802.11 b/g or 802.11 a/b/g in the PCI Express MiniCard slot. This function can be switched on and off by a switch on the computer.

 i.LINK (IEEE1394)

This port enables high-speed data transfer directly from external devices such as digital video cameras.

 Docking port

TOSHIBA Express Port Replicator can be connected through docking port on the bottom.

 Bluetooth

The computer is equipped with Bluetooth (V2.0) communications standard that enables wireless connection between electronic devices such as computers and printers. It supports wireless communication switch.

 Fingerprint sensor

The computer is equipped with a fingerprint sensor and fingerprint authentication utility. They enable only person who has registered his/her fingerprint to use the computer.

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1 Hardware Overview 1.1 Features

Figure 1-1 shows the front of the computer and Figure 1-2 shows the system units configuration.

Figure 1-1 Front of the computer

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1.1 Features 1 Hardware Overview

Figure 1-2 System units configuration

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1 Hardware Overview 1.2 System block diagram

1.2 System block diagram

Figure 1-3 shows the system block diagram.

Figure 1-3 System block diagram

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1.2 System block diagram 1 Hardware Overview

The PC contains the following components.

 Processor

CoreTM Duo Processor (dual core) or Intel® CoreTM Solo Processor (single

Intel core)

• Core speed:

Dual core: 1.60GHz (T2050)/1.66GHz (T2300E)/1.66GHz (T2300)/

1.73GHz(T2250)/1.83GHz (T2400)/2.00GHz (T2500)/

2.16GHz(T2600)/ 2.33GHz (T2700)

Single core: 1.66GHz (T1300)/1.83GHz (T1400)/1.86GHz (T1350)

( ): Processor Number

– Processor bus speed: 533MHz/667MHz – Core voltage: 0.50 to 1.30V – Integrated L1 cache memory of 64KB (32KB +32KB) – Integrated L2 cache memory of 2MB – Integrated NDP – 478-pin Micro FC-PGA package

Intel

Celeron® M Processor

• Core speed:

1.60GHz (420)/1.72GHz (430) ( ): Processor Number

– Processor bus speed: 533MHz – Core voltage: 1.00 to 1.30V – Integrated L1 cache memory of 64KB (32KB +32KB) – Integrated L2 cache memory of 1MB – Integrated NDP – 478-pin Micro FC-PGA package

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1 Hardware Overview 1.2 System block diagram

 Memory

Two memory slots capable of accepting DDR2-SDRAM 256MB, 512MB, 1024MB or 2048MB memory modules for a maximum of 4GB.

• 200-pin Small Outline DIMM

• 1.8V operation

• PC2-4200(DDR2-533)/PC2-5300(DDR2-667) support

 BIOS ROM (Serial Peripheral Interface (SPI))

• One STMicro M25PE80 is used.

• 8Mbits of flash memory are used.

– 288KB for System BIOS – 64KB for VGA BIOS – 64KB for Finger Print PBA – 128KB for LAN BIOS – 24KB for Boot – 16KB for Parameter Block – 32KB for Option Log – Others

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1.2 System block diagram 1 Hardware Overview

 PCI chipset

This gate array incorporates the following elements and functions.

North Bridge (Intel 945GM (Satellite R20/TECRA M7)/945PM (TECRA M7))

- Yonah Processor System Bus Support

- System Memory Interface : supports DDR2-400/DDR2-533/DDR2-667

4GBmax.

- Internal Graphics Controller : Inter Generation 3.5 Integrated GFX Core

(250MHz)

- DMI (Direct Media Interface)

- ICH Support

- 1,466-ball, 37.5×37.5×2.56mm, FC-BGA package

South Bridge (Intel ICH7-M)

- DMI (Direct Media Interface)

- PCI Express I/F (4 ports)

- PCI Bus I/F Rev2.3 (6 PCI REQ/GNT Pairs)

- Integrated Serial ATA Host Controller (2 Prots,150MB/S)

- Integrated IDE Controller (Ultra ATA 100/66/33)

- AC’97 2.3 Controller

- Inter High Definition Controller (Azalia)

- USB 1.1/2.0 Controller 8 ports

(EHCI: Enhanced Host Controller Interface)

- Built-in LAN Controller (WfM 2.0 & IEEE 802.3 compliance)

- Power Management (ACPI 2.0 compliance)

- SMBus2.0 Controller

- Serial Perip h eral In terface (SPI) (BIOS)

- Low Pin Count (LPC) interface (EC/KBC, Super I/O)

- IRQ Controller

- Serial Interrupt Function

- Controlling Suspend/Resume

- Built –in RTC

- GPIO

- 652-ball, 31mm×31mm×2.51mm, BGA Package

PC Card Controller (Texas Instruments PCI7412ZHK)

- PCI interface

- CardBus/Ultra Media Controller (1soket)

- SD/MMC, Memory Stick, XD card Controller

- IEEE1394 controller

- 288-ball, 16mm×16mm×1.4mm BGA package

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1 Hardware Overview 1.2 System block diagram

 GPU controller (Internal graphic controller)

• Graphics interface in North Bridge (Intel 945GM) is used.

• VRAM : External DDR SDRAM MAX=128MB, Default=8MB

• LCD Interface LVDS 2ch, Supports 1440×900

• Analog CRT : 360MHz RAMDAC, QXGA (2048×1536) monitor

• DVI : Supported on the dock side

External DVI transmitter (Chrontel-made CH7313) is need

(nVIDIA Quadro NVS 110M)

• VRAM : 128MB

• PCI Express interface

• LCD Interface LVDS 2ch, Supports 1440×900

• Analog CRT : 400MHz RAMDAC, QXGA (2048×1536) monitor

• DVI : Supported on the dock side

 Batteries

The main battery is a detachable lithium-ion battery (10.8V, 4700mAh, 6cell), the secondary battery (Provided with some models or option) is a detachable lithium-ion battery (10.8V, 4000mAh, 6cell) and the RTC battery is a nickel hydrogen battery (2.4V-16mAh).

 Modem controller

• Askey-made one MDC (Azalia) is used.

• This controller has the following functions:

– One RJ11 port – V.92 (V.90) 56K Modem/FAX – Supports Ring Wakeup

 LAN controller (Intel-made Vidalia (Gigabit)/Ekron (10/100Mbit))

• This controller has the following functions: – PCI-Ex connection

– Supports Gigabit Ethernet – Supports 10/100Mbit Ethernet – One RJ45 port – Supports WOL

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1.2 System block diagram 1 Hardware Overview

– Supports Magic Packet – Supports LED – Makes LAN to “Disable” in BIOS

 Wireless LAN

• One Mini PCI Express Card slot

− Supports 802.11b/g or 802.11a/b/g

− Supports Communication SW

− Supports W-LAN via PCMCIA (Euro : GSM/GPRS)

 Sound Controller

• Azalia Link (Intel High Definition Audio I/F) built in the South Bridge (ICH7-

M) + ADI AD1981HD

− Stereo speakers

− Built-in microphone

− Digital volume

− Stereo headphone jack

− External microphone jack

− VOIP

 Other main system chips

• EC/KBC (Renesas-made LPC microcontroller M306KAFCLRP U0)

• PSC (Toshiba-made TMP86FS49UG)

• Temperature sensor (ADM-made 1032ARMZ)

• Acceleration sensor (ST Micro-made LIS3L02AQ3)

• Super I/O (SMSC-made LPC47N217-JV)

• Sound Codec (ADI-made AD1981HD)

• SP AMP (Matsushita-made AN12941A) + HP AMP (MAX9722)

• Clock Generator (ICS-made 954321AGLFT)

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1 Hardware Overview 1.3 2.5-inch Hard Disk Drive

1.3 2.5-inch Hard Disk Drive

A compact, high-capacity SATA HDD with a height of 9.5mm contains a 2.5-inch magnetic disk and magnetic heads.

Figure 1-4 shows a view of the 2.5-inch HDD and Tables 1-1 list the specifications.

Figure 1-4 2.5-inch HDD

Table 1-1 2.5-inch HDD Specifications (1/3)

Specifications

Items

Outline dimensions

Storage size (formatted) 40GB 60GB 80GB 100GB Speed (RPM) 5,400 Data transfer rate

To/From media (MB/s)

To/From host (Gbps) Data buffer size (MB) 8 Average seek time

Read (ms)

Width (mm)

Height (mm)

Depth (mm)

Weight (g)

FUJITSU

G8BC0002W410

96 max. 101 max.

FUJITSU

G8BC0002W610

61.3 max.

1.5 max.

12 typ.

FUJITSU

G8BC0002W810

9.5

100

FUJITSU

G8BC0002WA10

Motor startup time (s) 4 typ.

1-14 [CONFIDENTIAL] Satellite R20/TECRA M7 Maintenance Manual (960-572)

1.3 2.5-inch Hard Disk Drive 1 Hardware Overview

Table 1-1 2.5-inch HDD Specifications (2/3)

Items Specifications

Outline dimensions

Width (mm)

Height (mm)

Depth (mm)

Weight (g)

TOSHIBA

HDD2D34BZK01

98 max. 102 max.

TOSHIBA

HDD2D35BZK01

69.85±0.25

9.5±0.2

100±0.41

TOSHIBA

HDD2D32BZK01

TOSHIBA

HDD2D30BZK01

Storage size (formatted) 40GB 60GB 80GB 100GB Speed (RPM) 5,400 Data transfer rate (Mb/s) 218-429 244.7-474.7 218-429 236.1-456.0 Data buffer size (KB) 8,192 16,384 Average seek time

Read (ms)

Motor startup time (s) 4 typ. 3.5 typ. 4 typ.

Items Specifications

Outline dimensions

Width (mm)

Height (mm)

Depth (mm)

Weight (g)

Storage size (formatted) 40GB 60GB 80GB 100GB

HITACHI GST

G8BC00029411

HITACHI GST

G8BC00029611

HITACHI GST

G8BC00029811

69.85±0.25

9.5±0.2

100.2±0.25

95 max. 102 max.

HITACHI GST

G8BC00029A11

Speed (RPM) 5,400 Data transfer rate

To/From media (Mb/s)

To/From host (Gbps)

493 max.

1.5 Data buffer size (MB) 8 Average seek time

Read (ms)

12 typ.

Motor startup time (s) 3.5 typ.

Satellite R20/TECRA M7 Maintenance Manual (960-572) [CONFIDENTIAL] 1-15

1 Hardware Overview 1.3 2.5-inch Hard Disk Drive

Table 1-1 2.5-inch HDD Specifications (3/3)

Specifications

Items

Outline dimensions

Width (mm)

Height (mm)

Depth (mm)

Weight (g)

Storage size (formatted) 120GB Speed (RPM) 5,400

TOSHIBA

HDD2D31BZK01

FUJITSU

G8BC0002WC10

69.85±0.25

9.5±0.2

100±0.41 102 max. 101 max.

9.5

100

Data transfer rate

To/From media To/From host (Gbps)

244.7-474.7 (Mb/s)

61.3 (MB/s) max.

1.5 (150 Mb/s) Data buffer size (MB) 8 Average seek time Read (ms) 12 typ. Motor startup time (s) 3.5 typ. 4 typ.

Items Specifications

Outline dimensions

Width (mm)

Height (mm)

Depth (mm)

Weight (g)

Storage size (formatted) 80GB 100GB Speed (RPM) 7,200

Data transfer rate To/From media (Mb/s) To/From host (Gbps)

HITACH GST

G8BC0002N810

69.85±0.25

9.5±0.2

100.2±0.25 115 max.

629 max.

1.5

HITACH GST

G8BC0002NA10

Data buffer size (KB) 8,192 Average seek time Read (ms) 10 typ. Motor startup time (s) 4 typ.

1-16 [CONFIDENTIAL] Satellite R20/TECRA M7 Maintenance Manual (960-572)

+ 374 hidden pages

Toshiba satellite r70, tecra m7 Service Manual

SAFETY PRECAUTIONS

Table of Contents

Chapter 1 Hardware Overview

1.1 Features

1.2 System block diagram

1.3 2.5-inch Hard Disk Drive