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satellite r20
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Toshiba satellite r20 Service Manual

1
Toshiba Personal Computer
Satellite R10
Maintenance Manual
TOSHIBA CORPORATION
File Number 960-509
Copyright
© 2005 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed, with respect to the use of the information contained herein.
Toshiba Satellite R10 Maintenance Manual First edition January 2005
Disclaimer
This manual has been validated and reviewed for accuracy. The instructions and descriptions it contains are accurate for the Toshiba Satellite R10 at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions or discrepancies between the computer and the manual.
Trademarks
IBM is a registered trademark and IBM PC is a trademark of International Business Machines Corporation. Intel, Intel SpeedStep, Centrino, Pentium and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries/regions. Windows and Microsoft are either registered trademarks of Microsoft Corporation. i.LINK is a trademark and registered trademark of Sony Corporation. Other trademarks and registered trademarks not listed above may be used in this manual.
Preface
This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite R10, referred to as Satellite R10 in this manual.
The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
SAFETY PRECAUTIONS
Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or serious bodily injury, if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily injury, if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property damage, if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance service.
Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
? Be sure to fasten screws securely with the right screwdriver. Be sure to use the PH
Point size “0” and “1” screwdrivers complying with the ISO/DIS 8764-1:1996. If a screw is not fully fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.
? If you replace the battery pack or RTC battery, be sure to use only the same mode l
battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.
The manual is divided into the following parts:
Chapter 1 Hardware Overview describes the Satellite R10 system unit and each
FRU.
Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve
FRU problems.
Chapter 3 Test and Diagnostics describes how to perform test and diagnostic
operations for maintenance service.
Chapter 4 Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
? Handling the LCD module ? Board layout ? Pin assignment ? Keyboard scan/character codes ? Key layout ? Wiring Diagrams ? BIOS Rewrite Procedures ? EC/KBC Rewrite Procedures ? Reliability
Conventions
This manual uses the following formats to describe, identify, and highlight terms and operating procedures.
Acronyms
On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Key operation
Some operations require you to simultaneously use two or more keys. We identify such operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If three keys are used, hold down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISKCOPY A: B:
The display
Text generated by the Satellite R10 that appears on its display is presented in the type face below:
Format complete System transferred

Table of Contents

Chapter 1 Hardware Overview
1.1 Features ......................................................................................................................1-1
1.2 2.5-inch Hard Disk Drive .........................................................................................1-10
1.3 Optical Drive ............................................................................................................1-12
1.4 Keyboard..................................................................................................................1-23
1.5 TFT Color Display...................................................................................................1-24
1.6 Power Supply...........................................................................................................1-26
1.7 Batteries ...................................................................................................................1-29
1.8 AC Adapter..............................................................................................................1-32
Chapter 2 Troubleshooting Procedures
2.1 Troubleshooting .........................................................................................................2-1
2.2 Troubleshooting Flowchart........................................................................................2-2
2.3 Power Supply Troubleshooting..................................................................................2-6
2.4 System Board Troubleshooting................................................................................2-17
2.5 USB 3.5” FDD Troubleshooting..............................................................................2-33
2.6 2.5” HDD Troubleshooting ......................................................................................2-36
2.7 Keyboard Troubleshooting ......................................................................................2-41
2.8 Display Troubleshooting ..........................................................................................2-42
2.9 Touch Pad Troubleshooting.....................................................................................2-45
2.10 Selectable bay(optical drive) Troubleshooting ........................................................2-46
2.11 Modem Troubleshooting ..........................................................................................2-47
2.12 LAN Troubleshooting..............................................................................................2-48
2.13 Sound Troubleshooting............................................................................................2-49
2.14 SD Card Slot Troubleshooting .................................................................................2-50
2.15 Tablet Pen Troubleshooting.....................................................................................2-51
2.16 Wireless LAN Troubleshooting...............................................................................2-53
Chapter 3 Tests and Diagnostics
3.1 The Diagnostic Test...................................................................................................3-1
3.2 Executing the Diagnostic Test ...................................................................................3-4
3.3 Setting of the hardware configuration........................................................................3-8
3.4 Heatrun Test.............................................................................................................3-11
3.5 Subtest Names..........................................................................................................3-12
3.6 System Test ..............................................................................................................3-14
3.7 Memory Test ............................................................................................................3-16
3.8 Keyboard Test ..........................................................................................................3-17
3.9 Display Test .............................................................................................................3-18
3.10 Floppy Disk Test......................................................................................................3-21
3.11 Printer Test...............................................................................................................3-23
3.12 Async Test ................................................................................................................3-25
3.13 Hard Disk Test.........................................................................................................3-26
3.14 Real Timer Test ........................................................................................................3-29
3.15 NDP Test..................................................................................................................3-31
3.16 Expansion Test.........................................................................................................3-32
3.17 CD-ROM/DVD-ROM Test .....................................................................................3-34
3.18 Error Code and Error Status Names.........................................................................3-35
3.19 Hard Disk Test Detail Status....................................................................................3-38
3.20 Only One Test ..........................................................................................................3-40
3.21 Head Cleaning..........................................................................................................3-48
3.22 Log Utilities .............................................................................................................3-49
3.23 Running Test ............................................................................................................3-51
3.24 Floppy Disk Dr ive Utilities......................................................................................3-52
3.25 System Configuration..............................................................................................3-57
3.26 Wireless LAN Test Program (Intel-made b/g).........................................................3-59
3.27 Wireless LAN Test Program (Intel-made a/b/g)......................................................3-63
3.28 Wireless LAN Test Program (Askey-made)............................................................3-68
3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program ..................................................3-72
3.30 Sound Test Program.................................................................................................3-86
3.31 SETUP .....................................................................................................................3-92
Chapter 4 Replacement Procedures
4.1 Overview..............................................................................................................4-1
4.2 Battery pack .........................................................................................................4-8
4.3 PC card/SD card.................................................................................................4-10
4.4 Memory module .................................................................................................4-12
4.5 HDD ...................................................................................................................4-14
4.6 Selectable bay module .......................................................................................4-16
4.7 Keyboard............................................................................................................4-19
4.8 Bottom cover assembly......................................................................................4-21
4.9 Battery latch assembly/Selectable bay lock.......................................................4-23
4.10 QI button assembly/PC card slot brace..............................................................4-25
4.11 MDC/Modem cable............................................................................................4-27
4.12 Mini PCI module................................................................................................4-30
4.13 Fan/CPU.............................................................................................................4-32
4.14 DC-IN jack.........................................................................................................4-35
4.15 Pen holder/RTC battery.....................................................................................4-36
4.16 LCD harness holder ...........................................................................................4-38
4.17 Mic (L) cable guide........................................................................................... 4-41
4.18 QI board/CN board............................................................................................ 4-42
4.19 System board......................................................................................................4-44
4.20 PC card slot cover ..............................................................................................4-46
4.21 Speaker...............................................................................................................4-47
4.22 Microphone/Front panel.....................................................................................4-48
4.23 Lens holder .........................................................................................................4-50
4.24 Touch pad...........................................................................................................4-51
4.25 LCD unit & FL inverter .....................................................................................4-52
4.26 Application switch board ...................................................................................4-56
4.27 LCD latch assembly...........................................................................................4-57
4.28 Digitizer .............................................................................................................4-58
4.29 LCD harness/Digitizer harness/Wireless LAN antenna cable ...........................4-64
4.30 Hinge switch Board ............................................................................................4-68
4.31 Fluorescent Lamp...............................................................................................4-69
Appendices
Appendix A Handling the LCD Module ........................................................................ A-1
Appendix B Board Layout...............................................................................................B-1
Appendix C Pin Assignment .......................................................................................... C-1
Appendix D Keyboard Scan/Character Codes ............................................................... D-1
Appendix E Key Layout..................................................................................................E-1
Appendix F Wiring Diagrams .........................................................................................F-1
Appendix G BIOS Rewrite Procedures .......................................................................... G-1
Appendix H EC/KBC Rewrite Procedures..................................................................... H-1
Appendix I Reliability.....................................................................................................I-1

Chapter 1 Hardware Overview

1 Hardware Overview
1 Hardware Overview
1 Hardware Overview
Chapter 1 Contents
1.1 Features ......................................................................................................................1-1
1.2 2.5-inch Hard Disk Drive .........................................................................................1-10
1.3 Optical Drive ............................................................................................................1-12
1.3.1 DVD-ROM Drive...............................................................................1-12
1.3.2 DVD-ROM & CD-R/RW Drive .........................................................1-16
1.3.3 DVD Super Multi Drive .....................................................................1-19
1.3.4 DVD Super Multi Drive (Double-layer) ............................................1-21
1.4 Keyboard..................................................................................................................1-23
1.5 TFT Color Display...................................................................................................1-24
1.5.1 LCD Module.......................................................................................1-24
1.5.2 FL Inverter Board ...............................................................................1-25
1.6 Power Supply...........................................................................................................1-26
1.7 Batteries ...................................................................................................................1-29
1.7.1 Main Battery.......................................................................................1-29
1.7.2 Battery Charging Control...................................................................1-30
1.7.3 RTC Battery........................................................................................1-31
1.8 AC Adapter..............................................................................................................1-32
1 Hardware Overview
Figures
Figure 1-1 Front of the computer.....................................................................................1-5
Figure 1-2 System units configuration............................................................................1-5
Figure 1-3 System Block Diagram..................................................................................1-6
Figure 1-4 2.5-inch HDD...............................................................................................1-10
Figure 1-5 DVD-ROM drive .........................................................................................1-12
Figure 1-6 DVD-ROM & CD-R/RW drive ...................................................................1-16
Figure 1-7 DVD Super Multi drive ...............................................................................1-19
Figure 1-8 DVD Super Multi drive (Double-layer).......................................................1-21
Figure 1-9 Keyboard......................................................................................................1-23
Figure 1-10 LCD module .................................................................................................1-24
Tables
Table 1-1 2.5-inch HDD dimensions ...........................................................................1-10
Table 1-2 2.5-inch HDD Specifications .......................................................................1-11
Table 1-3 DVD-ROM drive outline dimensions ..........................................................1-12
Table 1-4 DVD-ROM drive specifications ..................................................................1-13
Table 1-5 DVD-ROM & CD-R/RW drive outline dimensions....................................1-16
Table 1-6 DVD-ROM & CD-R/RW drive specifications ............................................1-17
Table 1-7 DVD Super Multi drive outline dimensions ................................................1-19
Table 1-8 DVD Super Multi drive specifications ........................................................1-20
Table 1-9 DVD Super Multi drive (Double-layer) outline dimensions .......................1-21
Table 1-10 DVD Super Multi drive (Double-layer) specifications................................1-22
Table 1-11 LCD module specifications (14.1 TFT).......................................................1-24
Table 1-12 FL inverter board specifications ..................................................................1-25
Table 1-13 Power supply output specifications .............................................................1-27
Table 1-14 Battery specifications ...................................................................................1-29
Table 1-15 Time required for charges of main battery...................................................1-30
Table 1-16 Data preservation time .................................................................................1-30
1 Hardware Overview
Table 1-17 RTC battery charging/data preservation time ..............................................1-31
Table 1-18 AC adapter specifications ............................................................................1-32
1 Hardware Overview

1.1 Features 1 Hardware Overview

1 Features
1.1 Features
The Satellite R10 is an ultra thin and lightweight tablet PC realizing cable -less environment on a table by wireless function with a Pentium-M/Celeron-M processor realizing high performance.
? Microprocessor
Microprocessor that is used will be different of the model.
? Intel ® Mobile Pentium ®-M
Pentium-M 1.60GHz (Processor Number ; 725)
1.70GHz (Processor Number ; 735)
1.80GHz (Processor Number ; 745)
2.00GHz (Processor Number ; 755) L1 cache : 64KB (32KB + 32KB)
L2 cache : 2MB
? Intel ® Mobile Celeron ®-M
Celeron-M 1.30GHz (Processor Number ; 350)
1.40GHz (Processor Number ; 360) L1 cache : 64KB (32KB + 32KB)
L2 cache : 1MB
? Chipset
Equipped with Intel 855GME (Montara-GM+) as North Bridge, Intel ICH4 -M as South Bridge and Texas Instrument PCI7411ZHK as Card Controller.
? GPU Controller
Internal graphic controller in north bridge. VRAM 16-64MB
? Memory
Two DDR SO-DIMM slots support DDR333/DDR226. Memory modules can be installed to a maximum of 2GB (2,048MB). Memory modules in 256MB, 512MB and 1GB sizes are available.
? HDD
Single 40/60/80/100GB internal drive. 2.5-inch x 9.5mm height
1 Hardware Overview 1.1 Features
? Selectable Bay
Supporting hotswap with DVD-ROM drive, DVD-ROM & CD-R/RW drive, DVD Super Multi drive and 2nd HDD adapter.
? USB FDD
3.5 inch USB FDD supports 720KB/1.44MB formats.
? Display
Display swivels automatically 0/90/180/270 degrees by display driver. LCD and CRT can be displayed at the same time.
LCD Built-in 14.1 inch, 16M colors, XGA (1,024?768 dots), thin type low
temperature poly-silicon TFT co lor display. CRT Supported via an RGB connector TV-out Supported via an S-Video connector
? Digitizer
Digitizer is installed at the rear of LCD unit. The supplied tablet pen enables pen computing.
? Keyboard
Keyboard has 85(US)/86(UK)-key and supports Windows key and Hot key.
? Touch pad
Touch pad is installed as a pointing device.
? Tablet pen (Tablet PC pen)
Tablet pen can be used as a mouse by touching the display softly with the pen tip. Tablet button on the side of the pen corresponds to the right click of the mouse. Erase button on the pen tail can be used as an eraser depending on the application.
? Batteries
The computer has two batteries: a rechargeable Lithium-Ion main battery pack and an RTC battery (that backs up the Real Time Clock and CMOS memory).
1.1 Features 1 Hardware Overview
? USB (Universal Serial Bus )
Three USB ports are usable. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.
? PC card slot
The PC card slot (PCMCIA) accommodates one 5mm Type II card. (Based on PC Card Standard, supporting CardBus)
? SD card slot
A SD Card Slot can accommodate Secure Digital flash memory cards with various capacities. Supporting memory card and I/O card.
? Sound system
The sound system is equipped with the follo wing features:
- Built in stereo speakers
- Built-in monaural microphone
- Stereo Headphone jack (3.5mm mini headphone jack)
- External microphone jack (3.5mm mini microphone jack)
? Switch/Button
Windows Security tablet button, ESC/Rotation button, Cross Function button, Toshiba Assist button and Wireless communication switch are available.
? Internal Modem
The internal modem is equipped as a modem daughter card (MDC). The internal modem provides capability for data and fax communication and supports
ITU-T V.90 standard. For data reception it operates at 56Kbps and for data transmission it operates at 33.6Kbps. For fax transmission, it operates at 14,4Kbps. The speed of data transfer and fax depends on analog telephone line condition. It has an RJ11 modem jack for connecting to a telephone line.
? LAN
The internal LAN supports 10/100Mbit Ethernet.
1 Hardware Overview 1.1 Features
? Wireless LAN
Wireless LAN Card can be equipped with mini -PCI slot. Based on IEEE802.11b/g, a/b/g with 2.45 GHz/5.0GHz Dual-band antenna.
? i.LINK (IEEE1394)
This port enables high-speed data transfer directly from external devices such as digital video cameras.
? Docking port
Advanced Port Replicator III can be connected through docking port on the bottom.
1.1 Features 1 Hardware Overview
Figure 1-1 shows the front of the computer and Figure 1-2 shows the system units configuration.
Figure 1-1 Front of the computer
Figure 1-2 System units configuration
1 Hardware Overview 1.1 Features
Figure 1-3 shows the system block diagram.
Figure 1-3 System Block Diagram
1.1 Features 1 Hardware Overview
The PC contains the following components.
? CPU
? Intel ® Mobile Pentium ®-M Processor 1.60GHz (Processor Number ; 725)
1.70GHz (Processor Number ; 735)
1.80GHz (Processor Number ; 745)
2.00GHz (Processor Number ; 755) Core voltage : 1.05V FSB : 400MHz L1 cache : 64KB [32KB (Code) + 32KB (Data)] L2 cache : 2MB Support : Enhanced Intel® SpeedStep technology
? Intel ® Mobile Celeron ®-M Processor 1.30GHz (Processor Number ; 350)
1.40GHz (Processor Number ; 360) Core voltage : 0.748V FSB : 400MHz L1 cache : 64KB [32KB (Code) + 32KB (Data)] L2 cache : 1MB
? Memory
Two DDR SO-DIMM slots support DDR333/DDR226. Memory modules in 256MB, 512 MB and 1GB can be installed to a maximum of 2GB (2,048MB).
2.5V operation 200 pin, SO Dual In-line Memory Modules (SO-DIMM) Supports PC2700/PC2100
? BIOS ROM (Flash memory)
4Mbit (256K?16-bit chip)
- 64KB used for logo
- 64KB used for setup and checksum
- 128KB used for system BIOS
- 64KB used for VGA-BIOS
- 64KB used for ACPI
- 8KB used for PnP
- 8KB used for password security
- 16KB used for booting
- 64KB used for LAN
- 32KB are reserved
5.0V operation Access time : 120 ns or 90 ns Data transfer: 8-bit
1 Hardware Overview 1.1 Features
? PCI chipset
This gate array incorporates the following elements and functions
Intel 855GME (Montara-GM+) (North Bridge)
- Dothan Processor System Bus Support
- DRAM Controller supporting DDR333/DDR266, 2GB max
- Accelerated Graphics Port Interface: adheres to AGP2.0, AGP ?4 mode
- Hub Link Interface
- 732-ball 37.5?37.5 mm FC-BGA package
Intel ICH4 -M (South Bridge )
- Hub Link Interface
- PCI Rev2.2 Interface (6 PCI REQ/GNT Pairs)
- BusMaster IDE Controller (Ultra ATA 100/66/33)
- USB 1.1/2.0 Controller 6 Ports (EHCI: Enhanced Host Controller)
- I/O APIC (ACPI 1.06)
- SMBus2.0 Controller
- FWH Interface (BIOS)
- LPC Interface (EC/KBC, Super I/O)
- IRQ Controller
- Serial Interrupt Controller
- Power Management Controller
- Deeper Sleep (C4) Support
- Suspend/Resume Control
- AC'97 2.2 Interface
- Internal RTC
- Internal LAN Controller (WfM2.0)
- 421-ball 31?31mm BGA Package
? PC Card Controller (Texas Instruments-made PCI7411ZHK)
PCI interface CardBus/Ultra Media controller SD card controller IEEEE1394 controller 288-ball (16x16x1.4) BGA package
? GPU controller (Internal graphic controller)
VRAM 16-64MB AGP V2.0 standard x4 mode LCD I/F LVDS 2ch S-video support
1.1 Features 1 Hardware Overview
? Batteries
The main battery is a detachable lithium-ion main battery (10.8V, 4700mAh, 6 cell) and the RTC battery is a lithium ion battery (2.4V-16mAh).
? Modem controller
Supported by MDC. Using of the secondary AC97 Line
? LAN controller (ICH4-M Kinnerth 82562EP)
Controls LAN and supports 100BASE-TX (Fast Ethernet)/10BASE-T (Ethernet).
? Other main system chips
- EC/KBC (Mitsubishi-made LPC microcontroller M306K5F8LRP)
- PSC (Toshiba-made TMP87PM48UG)
- Temperature sensor (ADM-made ADM1032ARMZ)
- Acceleration sensor (ST Micro-made LIS3L02AQ)
- Super I/O (SMSC-made LPC47N217-JN)
- SOUND CODEC (ADM-made AD1981B)
- AMP (Matsushita-made MM1667XHFE) + HP AMP (MAX4410)
- CLK Generator (ICS-made ICS950812CGLFT)
1 Hardware Overview 1.2 2.5-inch Hard Disk Drive

1.2 2.5-inch Hard Disk Drive

A compact, high-capacity HDD with a height of 9.5mm contains a 2.5-inch magnetic disk and magnetic heads.
Figure 1-4 shows a view of the 2.5-inch HDD and Tables 1-1 and 1-2 list the specifications.
Figure 1-4 2.5-inch HDD
Table 1-1 2.5-inch HDD dimensions
Parameter
Width (mm) Outline Height (mm)
dimensions Depth (mm)
Weight (g)
Parameter
Width (mm) Outline Height (mm) dimensions Depth (mm)
Weight (g)
Standard value
TOSHIBA
HDD2188BZE02
TOSHIBA
HDD2189BZE02
TOSHIBA
HDD2190BZE02
TOSHIBA
HDD2D08BZE02
69.85
9.5
100
99 (max) 95 102 (max)
Standard value
HGST
G8BC0001E411
HGST
G8BC0001N611
HGST
G8BC0001N811
HGST
G8BC0001NA10
69.85± 0.25
9.5±0.2
100.2± 0.25
95 (max) 102 (max)
1.2 2.5-inch Hard Disk Drive 1 Hardware Overview
Table 1-2 2.5-inch HDD Specifications
Specification
Parameter TOSHIBA
Storage size (formatted)
Speed (RPM) Data transfer speed
(Mbits/s) Interface transfer
rate (MB/s) Storage
density(Kbpi) Track density (Ktpi) Average seek time
(Read) (ms) Average seek time
(Write) (ms) Start time (sec)
HDD2190BZE02
TOSHIBA
HDD2189BZE02
TOSHIBA
HDD2188BZE02
HDD2D08BZE02
40GB 60GB 80GB 100GB
4,200 5,400
175.0-341.7 230.6-445.9
100 (Ultra DMA mode)
735 - 735( max) 756
96 88.1 110
12
12
4.0
TOSHIBA
Specification
Parameter HGST
Storage size (formatted)
Speed (RPM) Data transfer speed
(Mbits/s) Interface transfer
rate (MB/s) Storage
density(Kbpi) Track density (Ktpi) Average seek time
(Read) (ms) Average seek time
(Write) (ms) Start time (sec)
G8BC0001E411
HGST
G8BC0001N611
HGST
G8BC0001N811
G8BC0001NA10
40GB 60GB 80GB 100GB
4,200 5,400
512 493
100 (Ultra DMA mode)
702 717 764
96 96.6 113.2
12
14
3.0 3.5
HGST
1 Hardware Overview 1.3 Optical Drive

1.3 Optical Drive

1.3.1 DVD-ROM Drive
The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD/DVD­ROM and CD-R/RW and DVD-RAM (read-only).
The DVD-ROM drive is shown in Figure 1-5. The dimensions and specifications of the DVD-ROM & CD-R/RW drive are described in Table 1-3, Table 1-4.
Parameter Standard value
Outline dimensions
Figure 1-5 DVD-ROM drive
Table 1-3 DVD-ROM drive outline dimensions
Maker (code)
Width (mm) 128±0.2 128 Height (mm) 12.7±0.2 (excluding projections) 12.7 Depth (mm) 126.1 129.4 Mass (g) 200 170 180
TSST
(G8CC0000R410)
TSST
(G8CC0002B410)
TEAC
(G8CC0002E410)
1.3 Optical Drive 1 Hardware Overview
Table 1-4 DVD-ROM drive specifications (1/3)
Parameter
Data transfer
speed
Access time
(ms)
Buffer memory 192KByte
Drive Specification
TSST (G8CC0000R410)
DVD-ROM(Single-L) MAX 8x(CAV) [MAX 10820KB/s]
DVD-ROM(Double-L) MAX 6x(CAV) [MAX 8112KB/s]
DVD-VIDEO(CSS) MAX 4x(CAV) [MAX 5408KB/s]
DVD-R/RW MAX 4x(CAV) [MAX 5408KB/s]
DVD-RAM(Ver1.0) MAX 2x(ZCLV ) [MAX 2704KB/s]
Read
ATAPI interface
(MB/s)
CD-ROM 95 (Random)
DVD-ROM 100 (Random)
DVD-RAM 170 (Random)
DVD-RAM(Ver2.1) MAX 1x(ZCLV ) [MAX 2704KB/s]
CD(Mode1) MAX 5.7x(PCAV) [MAX 855KB/s]
MAX 24x(CAV) [MAX 3600KB/s]
CD(Mode2) MAX 5.7x(PCAV) [MAX 975.3KB/s]
MAX 24x(CAV) [MAX 4104KB/s]
CD-RW MAX 8.6x(CLV) [MAX 1293KB/s]
PIO mode16.7 MB/s PIO-MODE4 supported
DMA mode16.7 MB/s MultiwordDMA-MODE2 supported
Ultra DMA mode 33.3 MB/s UltraDMA-MODE2 supported
Supported disk format
CD
DVD
CD-Audio, CD+(E)G, CD-MIDI, CD -TEXT, CD-ROM,
CD-ROM XA, CD-I, CD-I Bridge(Photo-CD, Video-CD),
Multi-session CD(Photo-CD, CD -EXTRA, CD-R,
CD-RW), CD-R(read), CD -RW (read)
DVD-ROM (DVD-5, DVD-9, DVD-10, DVD-18),
DVD-R (read), DVD-RW (read),
DVD-RAM (read, Version2.1),
DVD-RAM (read, Version1.0)
1 Hardware Overview 1.3 Optical Drive
Table 1-4 DVD-ROM drive specifications (2/3)
Parameter
Data transfer
speed
Access time
(ms)
Buffer memory 256KByte
Supported disk format
Drive Specification
TSST (G8CC0002B410)
DVD-ROM(Single-L) MAX 8x(CAV) [MAX 10816KB/s]
DVD-ROM(Double-L) MAX 6x(CAV) [MAX 8112KB/s]
DVD-R/-RW MAX 4x(CAV) [MAX 5408KB/s]
DVD+R/+RW MAX 4x(CAV) [MAX 5408KB/s]
Read
ATAPI interface
(MB/s)
CD-ROM 110 (Rand om)
DVD-ROM 110 (Random)
DVD-RAM 140 (Random)
CD
DVD
DVD-RAM(Ver2.1) MAX 2x(ZCLV ) [MAX 2704KB/s]
CD(Mode1) MAX 24x(CAV) [MAX 3600KB/s]
CD(Mode2) MAX 24x(CAV) [MAX 4104KB/s] CD-DA(Mode1) MAX 10x(CLV ) [MAX 1500KB/s] CD-DA(Mode2) MAX 10x(CLV ) [MAX 1710KB/s]
PIO mode16.7 MB/s PIO-MODE4 supported
DMA mode16.7 MB/s MultiwordDMA-MODE2 supported
Ultra DMA mode 33.3 MB/s UltraDMA-MODE2 supported
CD-DA, CD+(E)G, CD-MIDI, CD-TEXT, CD-ROM,
CD-ROM XA, CD-I, CD-I Bridge(Photo-CD, Video-CD),
Multi-session CD(Photo-CD, CD -EXTRA, CD-R,
CD-RW, Portfolio), CD-R, CD-RW
DVD-ROM (DVD-5, DVD-9, DVD-10, DVD-18),
DVD-R (Ver1.0, Ver2.1), DVD-RW (Ver1.0, Ver1.1),
DVD+R, DVD+RW, DVD-RAM (Version2.1)
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