Toshiba satellite m30, satellite 35 Service Manual

Toshiba Personal Computer
Satellite M30-35 Series
Maintenance Manual
TOSHIBA CORPORATION
File Number 960-455
Copyright
© 2003 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein.
Toshiba Personal Computer Satellite M30-35 Series Maintenance Manual
First edition September 2003
Disclaimer
The information presented in this manual has been reviewed and validated for accuracy. The included set of instructions and descriptions are accurate for the Satellite M30 Series at the time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Therefore, Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions, or discrepancies between any succeeding product and this manual.
Trademarks
Intel, Intel SpeedStep and Banias are trade marks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries/regions. Windows and Microsoft are registered trademarks of Microsoft Corporation. Photo CD is a trademark owned by its proprietor and used by TOSHIBA under license. Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license.
Preface
This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer Satellite M30-35 Series.
The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.
SAFETY PRECAUTIONS
Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or serious bodily injury, if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily injury, if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property damage, if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance service.
Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
Be sure to fasten screws securely with the right screwdriver. If a screw is not fully
fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.
If you replace the battery pack or RTC battery, be sure to use only the same model
battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.
Satellite M30-35 Maintenance Manual (960-455) iii
The manual is divided into the following parts:
Chapter 1 Hardware Overview describes the Satellite M30 system unit and each
FRU.
Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve
FRU problems.
Chapter 3 Test and Diagnostics describes how to perform test and diagnostic
operations for maintenance service.
Chapter 4 Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
Handling the LCD module Board layout Pin assignments Keyboard scan/character codes Key layout Wiring diagrams BIOS Rewrite Procedures Reliability
iv Satellite M30-35 Maintenance Manual (960-455)
Conventions
This manual uses the following formats to describe, identify, and highlight terms and operating procedures.
Acronyms
On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.
Key operation
Some operations require you to simultaneously use two or more keys. We identify such
operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If
three keys are used, hold down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISKCOPY A: B:
The display
Text generated by the computer that appears on its display is presented in the type face below:
Format complete System transferred
Satellite M30-35 Maintenance Manual (960-455) v
Table of Contents
Chapter 1 Hardware Overview
1.1 Features ......................................................................................................................1-1
1.2 System Unit Block Diagram ...................................................................................... 1-7
1.3 3.5-inch Floppy Disk Drive (USB External) ........................................................... 1-14
1.4 2.5-inch Hard Disk Drive......................................................................................... 1-15
1.5 CD-RW/DVD-ROM Drive......................................................................................1-18
1.6 DVD-R/RW Drive ...................................................................................................1-19
1.7 DVD-Multi Drive..................................................................................................... 1-21
1.8 Keyboard..................................................................................................................1-23
1.9 TFT Color Display...................................................................................................1-24
1.10 Power Supply ........................................................................................................... 1-27
1.11 Batteries ................................................................................................................... 1-30
Chapter 2 Troubleshooting Procedures
2.1 Troubleshooting ......................................................................................................... 2-1
2.2 Troubleshooting Flowchart........................................................................................ 2-2
2.3 Power Supply Troubleshooting.................................................................................. 2-6
2.4 System Board Troubleshooting................................................................................ 2-17
2.5 FDD Troubleshooting .............................................................................................. 2-30
2.6 HDD Troubleshooting ............................................................................................. 2-33
2.7 Keyboard Troubleshooting ...................................................................................... 2-38
2.8 Display Troubleshooting.......................................................................................... 2-40
2.9 Optical Drive Troubleshooting ................................................................................ 2-43
2.10 Modem Troubleshooting.......................................................................................... 2-45
2.11 LAN Troubleshooting.............................................................................................. 2-47
2.12 Wireless LAN Troubleshooting............................................................................... 2-48
2.13 Sound Troubleshooting............................................................................................ 2-52
2.14 SD Card Slot Troubleshooting................................................................................. 2-55
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Chapter 3 Tests and Diagnostics
3.1 The Diagnostic Test ................................................................................................... 3-1
3.2 Executing the Diagnostic Test ................................................................................... 3-3
3.3 Subtest Names............................................................................................................ 3-7
3.4 System Test................................................................................................................ 3-9
3.5 Memory Test............................................................................................................ 3-12
3.6 Keyboard Test.......................................................................................................... 3-13
3.7 Display Test ............................................................................................................. 3-16
3.8 Floppy Disk Test...................................................................................................... 3-19
3.9 Printer Test............................................................................................................... 3-21
3.10 Async Test ............................................................................................................... 3-23
3.11 Hard Disk Test ......................................................................................................... 3-24
3.12 Real Timer Test........................................................................................................ 3-27
3.13 NDP Test.................................................................................................................. 3-29
3.14 Expansion Test......................................................................................................... 3-30
3.15 CD-ROM/DVD-ROM Test ..................................................................................... 3-31
3.16 LAN Test ................................................................................................................. 3-32
3.17 Error Code and Error Status Names......................................................................... 3-33
3.18 Hard Disk Test Detail Status ................................................................................... 3-36
3.19 Head Cleaning.......................................................................................................... 3-38
3.20 Log Utilities ............................................................................................................. 3-39
3.21 Running Test............................................................................................................ 3-41
3.22 Floppy Disk Drive Utilities...................................................................................... 3-42
3.23 System Configuration .............................................................................................. 3-47
3.24 Wireless LAN Test Program (Calexico).................................................................. 3-49
3.25 Wireless LAN Test Program (Ahteros 11b/g or 11a/b/g)........................................ 3-50
3.26 Sound/LAN/Modem Test Program.......................................................................... 3-53
3.27 IEEE1394 Test Program .......................................................................................... 3-57
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Chapter 4 Replacement Procedures
4.1 General....................................................................................................................... 4-1
4.2 Battery Pack ............................................................................................................... 4-9
4.3 PC Card.................................................................................................................... 4-11
4.4 SD Card.................................................................................................................... 4-13
4.5 HDD......................................................................................................................... 4-14
4.6 Optical Drive............................................................................................................ 4-17
4.7 Memory Module/Modem Daughter Card ................................................................ 4-20
4.8 Wireless LAN Card.................................................................................................. 4-24
4.9 Keyboard.................................................................................................................. 4-26
4.10 Switch Cover ASSY/Switch Membrane.................................................................. 4-29
4.11 Display Assembly .................................................................................................... 4-32
4.12 Touch Pad Button ....................................................................................................4-36
4.13 Microphone .............................................................................................................. 4-37
4.14 Touch Pad ................................................................................................................ 4-39
4.15 RTC Battery ............................................................................................................. 4-41
4.16 Sound Board/Touch Pad Holder .............................................................................. 4-43
4.17 CD-Key ASSY......................................................................................................... 4-46
4.18 System Board ........................................................................................................... 4-47
4.19 CPU.......................................................................................................................... 4-50
4.20 Speaker..................................................................................................................... 4-53
4.21 Fan............................................................................................................................ 4-55
4.22 USB Board/DC-IN Jack/Network Jack ...................................................................4-56
4.23 Power Board/RGB Board ........................................................................................ 4-58
4.24 Display Mask ........................................................................................................... 4-61
4.25 FL Inverter ............................................................................................................... 4-63
4.26 LCD Module ............................................................................................................ 4-65
4.27 Sensor/Switch Board................................................................................................ 4-69
4.28 LCD Cable Wireless LAN Antenna ........................................................................ 4-70
4.29 Fluorescent Lamp..................................................................................................... 4-76
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Appendices
Appendix A Handling the LCD Module ........................................................................... A-1
Appendix B Board Layout ................................................................................................ B-1
Appendix C Pin Assignments............................................................................................ C-1
Appendix D Character Codes............................................................................................ D-1
Appendix E Key Layout.....................................................................................................E-1
Appendix F Reliability.......................................................................................................F-1
Appendix G BIOS Rewrite Procedures............................................................................. G-1
Appendix H EC/KBC Rewrite Procedures........................................................................ H-1
Appendix I Reliability........................................................................................................I-1
Appendix J SETUP ............................................................................................................J-1
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Chapter 1
Hardware Overview
1 Hardware Overview
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1 Hardware Overview
Chapter 1 Contents
1.1 Features.......................................................................................................................1-1
1.2 System Unit Block Diagram.......................................................................................1-7
1.3 3.5-inch Floppy Disk Drive (USB External)............................................................1-14
1.4 2.5-inch Hard Disk Drive .........................................................................................1-15
1.5 CD-RW/DVD-ROM Drive.......................................................................................1-18
1.6 DVD-R/RW Drive....................................................................................................1-19
1.7 DVD-Multi Drive ....................................................................................................1-21
1.8 Keyboard ..................................................................................................................1-23
1.9 TFT Color Display ...................................................................................................1-24
1.9.1 LCD Module .......................................................................................1-24
1.9.2 FL Inverter Board ...............................................................................1-26
1.10 Power Supply............................................................................................................1-27
1.11 Batteries....................................................................................................................1-30
1.11.1 Main Battery .......................................................................................1-30
1.11.2 Battery Charging Control....................................................................1-31
1.11.3 RTC battery.........................................................................................1-32
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1 Hardware Overview
Figures
Figure 1-1 Front of the computer .....................................................................................1-6
Figure 1-2 System unit configuration...............................................................................1-6
Figure 1-3 System unit block diagram .............................................................................1-7
Figure 1-4 3.5-inch FDD (USB External) ......................................................................1-14
Figure 1-5 2.5-inch HDD ...............................................................................................1-15
Figure 1-6 CD-RW/DVD-ROM drive ..........................................................................1-18
Figure 1-7 DVD-R/RW drive.........................................................................................1-19
Figure 1-8 DVD-Multi drive ..........................................................................................1-21
Figure 1-9 Keyboard ......................................................................................................1-23
Figure 1-10 LCD module .................................................................................................1-24
Tables
Table 1-1 3.5-inch FDD specifications .........................................................................1-14
Table 1-2 2.5-inch HDD specifications ........................................................................1-15
Table 1-3 CD-RW/DVD-ROM drive specifications ....................................................1-18
Table 1-4 DVD-R/RW drive specifications..................................................................1-20
Table 1-5 DVD Multi drive specifications ...................................................................1-21
Table 1-6 LCD module specifications ..........................................................................1-24
Table 1-7 FL inverter board specifications ...................................................................1-26
Table 1-8 Power supply output rating...........................................................................1-28
Table 1-9 Battery specifications ...................................................................................1-30
Table 1-10 Time required for quick charges...................................................................1-31
Table 1-11 RTC battery charging/data preservation time...............................................1-32
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1.1 Features 1 Hardware Overview
1 Features
1.1 Features
The Toshiba Satellite M30 Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features and benefits: The product configuration is BTO­compatible so that a system can be designed to suit a specific purpose.
Microprocessor
The Satellite M30 computer is equipped with an Intel Banias Processor, which incorporates a math co-processor, a 64KB L1 cache memory and a 1MB L2 cache memory. The processor runs with one of the following speeds:
Intel Banias Processor 1.40GHz (1.35V) / 1.20GHz (0.85V)
Intel Banias Processor 1.50GHz (1.35V) / 1.20GHz (0.85V)
Intel Banias Processor 1.60GHz (1.35V) / 1.20GHz (0.85V)
Intel Banias Processor 1.70GHz (1.35V) / 1.20GHz (0.85V)
This processor operates at 1.35V-0.8V and 100MHz bus clock
Chipset
The Satellite M30 is equipped with Intel Odem+, Intel ICH4-M and YEBISU-SS.
Cache Memory
64KB primary cache (in CPU) and 1MB secondary cache (in CPU)
GPU Controller
The computer has a nVIDIA NV34M controller. The internal VRAM is 32MB/64M, DDR200MHz.
Memory
Two DDR SO-DIMM slots are available for installation of PC2700 compatible 256, 512MB and 1GB memory modules. The memory is expandable up to 2GB.
Built-in HDD
The computer has a 40GB, 60GB or 80GB internal drive. 2.5 inch x 9.5mm height.
USB FDD
An external two-mode 3.5-inch FDD, which connects with a USB port, supports 720KB and 1.44MB formats and enables booting from system FD.
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1 Hardware Overview 1.1 Features
CD-RW/DVD Drive
This drive is a combination of DVD-ROM and CD-R/RW Drive. . It is full-size and runs either 12cm (4.72-inch) or 8cm (3.15-inch) DVD/CDs without an adaptor. This drive reads CD-ROM at maximum 24-speed, reads DVD-ROM at maximum 8-speed writes CD-R at maximum 24-speed, and writes CD-RW at maximum 24-speed.
DVD-R/RW Drive
A full-size DVD-R/-RW drive module lets you record data to rewritable CD/DVDs as well as run either 12 cm (4.72") or 8 cm (3.15") CD/DVDs without using an adaptor. It reads DVD-ROMs at maximum 8 speed, CD-ROMs at maximum 24 speed and CD-Rs at maximum 16 speed. It writes CD-R at up to 16 speed, CD-RW at up to 10 speed, DVD-R and DVD-RW at single speed.
DVD Multi Drive
This drive is a combination of CD-R/RW, DVD-R/RW and DVD-RAM Drive. It is full­size and runs either 12cm (4.72-inch) or 8cm (3.15-inch) DVD/CDs without an adaptor. This drive reads CD-ROM at maximum 24-speed, reads DVD-ROM at maximum 8-speed writes CD-R at maximum 16-speed, writes CD-RW at maximum 8-speed, writes DVD-R at maximum 2-speed, writes DVD-RW at maximum 1-speed,.and writes DVD-RAM at maximum 2-speed.
Display
The display comes in the following three types:
15.4” WXGA-TFT color display, resolution 1280(H)×800(V), 16M colors
A high-resolution external monitor connected to the computer can display up to 2048(H)×1536(V), at 16M colors.
Keyboard
An-easy-to-use 85(US)/86(UK)-key keyboard provides a numeric keypad overlay for fast numeric data entry or for cursor and page control. The keyboard also includes two keys that have special functions in Microsoft Windows 2000/X P. It supports software that uses a 101- or 102-key enhanced keyboard.
Touch pad
Touch pad is installed as a pointing device.
Batteries
The computer has two batteries: a rechargeable Lithium-Ion main battery pack and RTC battery (that backs up the Real Time Clock and CMOS memory).
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1.1 Features 1 Hardware Overview
Universal Serial Bus (USB2.0)
Three USB ports are provided. The ports comply with the USB2.0 standard, which enables data transfer speeds 40 times faster than USB1.1 standard. USB1.1 is also supported.
IEEE 1394 port
The computer comes with one IEEE 1394 port. It enables high-speed data transfer directly from external devices such as digital video cameras.
Parallel port
The parallel port enables connection of parallel printer or other parallel devices. (ECP compatible)
External monitor port
The port enables connection of an external monitor, which is recognized automatically by Video Electronics Standards Association (VESA) Display Data Channel (DDC) 2B compatible functions.
PC card slot
The PC card slot (PCMCIA) accommodates one 5mm Type II card. The slot support 16­bit PC cards and Card Bus PC cards. CardBus supports 32-bit PC cards.
SD Card
An SD Card Slot can accommodate Secure Digital flash memory cards with various capacities. SD cards let you easily transfer data from devices, such as digital cameras and Personal Digital Assistants, that use SD Card flash-memory.
Infrared port
The infrared port is compatible with Fast InfraRed (FIR) standards enabling cableless 4 Mbps, 1.152 Mbps, 115.2 kbps, 57.6 kbps, 38.4 kbps, 19.2 kbps or 9.6 kbps data transfer with Infrared Data Association (IrDA) 1.1 compatible external devices.
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1 Hardware Overview 1.1 Features
Sound system
The sound system is equipped with the following features:
AC 97 Link
Sound CODEC: STAC9750 Stereo speakers Built-in Microphone (Mono) Volume control knob Stereo Headphone jack External microphone jack
Video-out jack
The video jack enables to transfer NTSC or PAL data to external devices connected with S-Video cable.
Internal modem
The internal modem is equipped as a modem daughter card (MDC).
The internal modem provides capability for data and fax communication and supports V.90/92. For data reception it operates at 56,000bps and for data transmission it operates at 33,600bps. For fax transmission it operates at 14,400bps. It is also equipped with Speakerphone and TAM (Telephony Answering Machine) function. The speed of data transfer and fax depends on analog telephone line conditions. It has an RJ11 modem jack for connecting to a telephone line. Both of V.90 and V.92 is supported in USA and Canada. In other regions, only V.90 is available.
Internal LAN
The computer is equipped with LAN circuits that support Ethernet LAN (10 megabits per second, 10BASE-T), Fast Ethernet LAN (100 megabits per second, 100 BASE-Tx). It also supports Wakeup on LAN (WOL) and Magic Packet.
Mini PCI Card slot (1 slot)
Some computers in this series are equipped with a wireless LAN mini-PCI card that is compatible with other LAN systems based on Direct Sequence Spread Spectrum/Orthogonal Frequency Division Multiplexing radio technology that complies with the IEEE802.11 Standard (Revision A, B or G) and Turbo Mode. Revisions A and G support a data transfer rate up to 54 Mbit/s. Revision-B supports a data transfer rate up to 11 Mbit/s. Turbo Mode supports a data transfer rate up to 108 Mbit/s.
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1.1 Features 1 Hardware Overview
Internet button
This button launches an Internet browser. If the computer’s power is off, you can press this button to turn on the computer’s power and launch the browser automatically in one step.
TOSHIBA Console button
This button launches an application automatically. The default is TOSHIBA Console.
S-Video out button
Pressing this button sets the display device to TV (Video out). Pressing it again returns to LCD.
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1 Hardware Overview 1.1 Features
The front of the computer is shown in figure 1-1 and the system unit configuration is shown in figure 1-2.
Figure 1-1 Front of the computer
Figure 1-2 System unit configuration
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1.2 System Unit Block Diagram 1 Hardware Overview
1.2 System Unit Block Diagram
Figure 1-3 is a block diagram of the system unit.
Internal Touch Pad
Figure 1-3 System unit block diagram
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1 Hardware Overview 1.2 System Unit Block Diagram
The system unit is composed of the following major components:
Processor
Intel Banias Processor 1.40GHz
– Processor core speed: 1.40GHz (Performance Mode at 1.35V) and 1.20GHz
(Battery Optimized Mode at 0.85V) – Processor bus speed: 400MHz – Integrated L1 cache memory: 32KB instruction cache and 32KB write-back
data cache, 4-way set associative – Integrated L2 cache memory: 1MB ECC protected cache data array, 8-way set
associative – Integrated NDP
Intel Banias Processor 1.50GHz
– Processor core speed: 1.50GHz (Performance Mode at 1.35V) and 1.20GHz
(Battery Optimized Mode at 0.85V) – Processor bus speed: 400MHz – Integrated L1 cache memory: 32KB instruction cache and 32KB write-back
data cache, 4-way set associative – Integrated L2 cache memory: 1MB ECC protected cache data array, 8-way set
associative – Integrated NDP
Intel Banias Processor 1.60GHz
– Processor core speed: 1.60GHz (Performance Mode at 1.35V) and 1.20GHz
(Battery Optimized Mode at 0.85V) – Processor bus speed: 400MHz – Integrated L1 cache memory: 32KB instruction cache and 32KB write-back
data cache, 4-way set associative – Integrated L2 cache memory: 1MB ECC protected cache data array, 8-way set
associative – Integrated NDP
Intel Banias Processor 1.70GHz
– Processor core speed: 1.70GHz (Performance Mode at 1.35V) and 1.20GHz
(Battery Optimized Mode at 0.85V) – Processor bus speed: 400MHz – Integrated L1 cache memory: 32KB instruction cache and 32KB write-back
data cache, 4-way set associative – Integrated L2 cache memory: 1MB ECC protected cache data array, 8-way set
associative – Integrated NDP
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1.2 System Unit Block Diagram 1 Hardware Overview
Memory
Two memory slots are provided. Expansion up to 2GB (2,048MB) is available.
Supports DDR CL2/2.5
Supports PC2700
– 256MB: 256Mbit (16M × 16bit) chips × 8 – 512MB: 512Mbit (32M × 8bit) chips × 16 – 512Mbit (32M × 16bit) chips × 8 – 1GB: 512Mbit (64M × 8 bit) chips × 16
200 pin, SO Dual In-line Memory Modules (SO-DIMM)
2.5 volt operation
Intel Odem+ (North Bridge)
One Intel RG82P4300M is used.
Features:
– Banias Processor System Bus Support – DRAM Controller supporting DDR333/DDR266/DDR200, 1GB max – Accelerated Graphics Port Interface: adheres to AGP2.0, AGP×4 mode – Hub Link Interface – 593-ball 37.5×37.5 mm FC-BGA package
Intel ICH4-M (South Bridge)
One Intel 82801LAM is used.
This gate array has the following features:
– Hub Link Interface – PCI Rev2.2 Interface (6 PCI REQ/GNT Pairs) – BusMaster IDE Controller (Ultra ATA 100/66/33) – USB 1.1/2.0 Controller 6 Prots (EHCI: Enhanced Host Controller) – I/O APIC (ACPI 1.06) – SMBus2.0 Controller – FWH Interface (BIOS) – LPC Interface (EC/KBC, Super I/O) – IRQ Controller – Serial Interrupt Controller – Power Management Controller – Deeper Sleep (C4) Support – Suspend/Resume Control – AC'97 2.2 Interface – Internal RTC – Internal LAN Controller (WfM2.0) – 421-ball 31×31mm BGA Package
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1 Hardware Overview 1.2 System Unit Block Diagram
PC Card Controller Gate Array
One YEBISU-SS gate array is used.
This gate array has the following functions and components.
– PCI interface (PCI Revision2.2) – CardBus/PC Card controller (Yenta2 Version2.2) – SD memory card controller (SDHC Ver.1.2) – SD IO card controller (Ver.1.0) – SmartMedia controller (SMHC Ver.01/SMIL1.0) – SIO (UART) controller (MS Debug Port Specification Ver.1.0) – Docking station interface – Q switch control, reset control – External device interface
Firmware Hub (FWH)
One Intel 82802AB8 is used.
This gate array has the following features:
– Intel platform compatibility – Firmware hub hardware interface mode – Industry-standard packages – Two configurable interfaces – 4Mbits of flash memory for platform code/data nonvolatile storage – Address/Address-Multiplexed (A/A Mux) interface/mode – Case temperature operating range – Vcc: 3.3V ± 0.3V – Vpp: 3.3V and 12V for fast programming (80 hours maximum) – 4Mbits of flash memory are used as shown below: – 64KB are used for VGA-BIOS. – 192KB are used for system BIOS. – 8KB are used for plug and play data area. – 8KB are used for password security. – 16KB are used for boot strap. – 64KB are used for ACPI P code. – 64KB are used for LOGO. – 64KB are reserved for LAN BIOS. – 32KB are reserved.
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1.2 System Unit Block Diagram 1 Hardware Overview
GPU Controller
One nVIDIA NV34M chip is used. The GPU controller incorporates graphics accelerator, video accelerator.
– VRAM 32MB (4M × 32 × 2)/64MB (4M × 32 × 4) DDR200MHz – AGP bus R2.0 x 4 – LCD Interface LVDS 2ch – TV Encoder: S-Video 4pin connectorTvxpress2
Sound Controller
AC-Link (in the South Bridge) and STAC975051T (Sigmatel made) are used.
Amplifier, Internal microphone, internal stereo speakers, stereo headphone
connector, external microphone connector and volume control knob are mounted.
EC/KBC (Embedded Controller/Keyboard Controller)
One Mitsubishi M306K9FCLRP micon chip functions as both EC and KBC.
EC
This controller controls the following functions: – Power supply sequence – Thermal conditions – LEDs – Beep – Device ON/OFF – Fan speed – Universal I/O port – Docker Docking Sequence – Battery capacity check – Forced reset – Flash rewriting – EC interface – I2C communication – EC access – Slim Select Bay Control
KBC
This controller has the following functions: – Scan controller to check status of keyboard matrix – Interface controller between the keyboard scan controller and the system
Control of switching and simultaneous operation of the accupoint/external
PS/2 mouse and of the internal keyboard/external PS/2 keyboard
PSC (Power Supply Controller)
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1 Hardware Overview 1.2 System Unit Block Diagram
One TMP87PM48U chip is used.
This controller controls the power sources.
Clock Generator
One ICS950812CGT is used.
This device generates the system clock.
Modem Controller
One built-in Askey-made 1456VQL4A(INT) modem card
This controller has the following functions:
– Digital line protection support – Ring wake up support – AC97 interface – Supports V.92 56k Modem/Fax.
Internal LAN Controller
One Kinnereth-R (82562EP) chip is used.
– Supports 10/100Mbit Ethernet. – Supports LED and WOL.
Wireless LAN
– Mini-PCI Type III 1slot – Supports Kill SW. – Supports Wireless LAN through PCMCIA – 802.11b, 802.11a/b: Intel-made – 802.11b/g, 802.11a/b/g: Atheros-made
Super I/O
One LPC 47N227 chip is used.
– This gate array has the following features: – Floppy Disk Controller – Serial Port Controller – Infrared Communications Controller – Parallel Port Controller
IEEE1394
One TSB43AB22 is used.
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1.2 System Unit Block Diagram 1 Hardware Overview
Sensor
Thermal Sensor: One ADM1032AR chip is used.
LCD Sensor: One NRS-701-1015T is used.
Satellite M30-35 Maintenance Manual (960-455) 1-13
1 Hardware Overview 1.3 3.5-inch Floppy Disk Drive (USB External)
1.3 3.5-inch Floppy Disk Drive (USB External)
The 3.5-inch USB FDD is a thin, high-performance reliable drive that supports 720KB and
1.44MB.
The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1.
Figure 1-4 3.5-inch FDD (USB External)
Table 1-1 3.5-inch FDD specifications
Items 720KB mode 1.44MB mode
FDD part
rate
Disk rotation speed 300rpm 360rpm
Track density 5.3 track/mm (135TPI)
USB Full speed mode (12M bits/second)
250K bits/second
500K bits/second Data transfer
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1.4 2.5-inch Hard Disk Drive 1 Hardware Overview
1.4 2.5-inch Hard Disk Drive
The removable HDD is a random access non-volatile storage device. It has a non-removable
2.5-inch magnetic disk and mini-Winchester type magnetic heads. The computer supports a 40GB, 60GB and 80GB HDD. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2.
Figure 1-5 2.5-inch HDD
Table 1-2 2.5-inch HDD specifications (1/2)
Parameter Specifications
Outline Width (mm)
dimensions Height (mm)
Depth (mm)
Weight (g)
TOSHIBA
HDD2182B
99 max. 102 max.
TOSHIBA HDD2183
69.85
9.5
100
TOSHIBA
HDD2184B
Parameter Specifications
Outline Width (mm)
dimensions Height (mm)
Depth (mm)
Weight (g)
HITACHI
G8C0000Z410
69.85±0.25 69.85±0.25
9.5±0.25 9.5±0.25 9.5±0.25
100±0.25 100±0.25 100±0.45
95 max. 99 max. 95 max.
HITACHI
G8C0000Z610
HITACHI
G8BC00013610
70 max
Satellite M30-35 Maintenance Manual (960-455) 1-15
1 Hardware Overview 1.4 2.5-inch Hard Disk Drive
Parameter Specifications
Outline Width (mm)
dimensions Height (mm)
Depth (mm)
Weight (g)
HITACHI
GBC000Z810
69.85±0.25 69.85±0.25
9.5±0.25 9.5±0.25
100±0.25 100.2±0.25
99 max 102 99 max.
HITACHI
GBC000014810
TOSHIBA
HDD2188B
69.85
9.5
100
Table 1-2 2.5-inch HDD specifications(2/2)
Specifications
Parameter
Storage size (formatted) 40GB 60GB 60GB
Speed (RPM) 4200 5400
TOSHIBA
HDD2182B
TOSHIBA HDD2183
TOSHIBA HDD2184
Data transfer speed (Mb/sec)
Interface transfer rate (MB/s)
Track density (Ktpi) 78.9
Access Time Average seek (sec)
Start time (sec)
154.3-298.0 202.9-373.3
100 max.
(Ultra DMA mode)
12
4 typ.
4 typ.
10 max.
Specifications
Parameter
Storage size (formatted) 40GB 60GB
Speed (RPM) 4200 5400
Data transfer speed (Mb/sec)
Interface transfer rate (MB/s)
HITACHI
G8C000Z410
HITACHI
G8C0000Z610
350 typ. 263.2-401.6
100 max.
(Ultra DMA mode)
HITACHI
G8BC00013610
Track density (Ktpi)
Access Time Average seek (Read) Average seek (Write)
Start time (sec)
96
12 typ. 14 typ.
5
(Power on)
85
13 typ.
-
5 typ
(Power on)
1-16 Satellite M30-35 Maintenance Manual (960-455)
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