Toshiba Personal Computer Satellite & SatellitePro Maintenance Manual
First edition April. 2010
Disclaimer
The information presented in this manual has been reviewed and validated for accuracy. The
included set of instructions and descriptions are accurate for the Satellite Series at the time of this
manual's production. However, succeeding computers and manuals are subject to change without
notice. Therefore, Toshiba assumes no liability for damages incurred directly or indirectly from
errors, omissions, or discrepancies between any succeeding product and this manual.
Trademarks
IBM is a registered trademark, and OS/2 and PS/2 are trademarks of IBM Corporation.
Microsoft, MS-DOS, Windows, DirectSound and DirectMusic are registered trademarks of
Microsoft Corporation.
Intel and Pentium are registered trademarks, and SpeedStep is a trademark of Intel Corporation.
Sound Blaster is a registered trademark of Creative Technology Ltd.
Centronics is a registered trademark of Centronics Data Computer Corporation.
Photo CD is a trademark of Eastman Kodak.
All other properties are trademarks or registered trademarks of their respective holders.
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Satellite L670/L675/ Pro L670/L675 Series Maintenance Manual
Preface
This maintenance manual describes how to perform hardware service maintenance for the Toshiba
Personal Computer Satellite, referred to as the Satellite Series in this manual.
The procedures described in this manual are intended to help service technicians isolate faulty
Field Replaceable Units (FRUs) and replace them in the field.
SAFETY PRECAUTIONS
Four types of messages are used in this manual to bring important information to your attention.
Each of these messages will be italicized and identified as shown below.
DANGER: “Danger” indicates the existence of a hazard that could result in death or
serious bodily injury if the safety instruction is not observed.
WARNING: “Warning” indicates the existence of a hazard that could result in bodily
injury if the safety instruction is not observed.
CAUTION: “Caution” indicates the existence of a hazard that could result in property
damage if the safety instruction is not observed.
NOTE: “Note” contains general information that relates to your safe maintenance
service.
Improper repair of the computer may result in safety hazards. Toshiba requires service technicians
and authorized dealers or service providers to ensure the following safety precautions are adhered
to strictly.
Be sure to fasten screws securely with the right screwdriver. If a screw is not fully fastened, it
could come loose, creating a danger of a short circuit, which could cause overheating,
smoke or fire.
If you replace the battery pack or RTC battery, be sure to use only the same model battery or
an equivalent battery recommended by Toshiba. Installation of the wrong battery can
cause the battery to explode.
Satellite L670/L675/ProL670/L675 Series Maintenance Manual
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iii
The manual is divided into the following parts:
Chapter 1 Hardware Overview describes the Satellite Series system unit and each
FRU.
Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU
problems.
Chapter 3 Test and Diagnostics describes how to perform test and diagnostic
operations for maintenance service.
Chapter 4 Replacement Procedures describes the removal and replacement of the
FRUs.
Appendices The appendices describe the following:
Handling the LCD module
Board layout
Pin assignments
Keyboard scan/character codes
Key layout
Screw torque list
Reliability
Conventions
This manual uses the following formats to describe, identify, and highlight terms and operating
procedures.
Acronyms
On the first appearance and whenever necessary for clarification, acronyms are enclosed in
parentheses following their definition. For example:
Read Only Memory (ROM)
Keys
Keys are used in the text to describe many operations. The key top symbol as it appears on the
keyboard is printed in boldface type.
Key operation
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[CONFIDENTIAL]
Satellite L670/L675/ Pro L670/L675 Series Maintenance Manual
Some operations require you to simultaneously use two or more keys. We identify such operations
by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means
you must hold down Ctrl and at the same time press Pause (Break). If three keys are used, hold
down the first two and at the same time press the third.
User input
Text that you are instructed to type in is shown in the boldface type below:
DISKCOPY A: B:
The display
Text generated by the computer that appears on its display is presented in the typeface below:
Format complete
System transferred
Satellite L670/L675/ProL670/L675 Series Maintenance Manual
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v
Table of Contents
Chapter 1 Hardware Overview
1.1 Features ............................................................................................................................. 1-1
3.19 TOSHIBA Logo Setting…………………..…………………………………………...…..37
3.20 DYNABOOK Logo Setting..............................................................................................39
Chapter 4 Replacement Procedures
4.1General ........................................................................ Fehler! Textmarke nicht definiert.
Safety Precautions ....................................................... Fehler! Textmarke nicht definiert.
Before You Begin ....................................................... Fehler! Textmarke nicht definiert.
Disassembly Procedures .............................................. Fehler! Textmarke nicht definiert.
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Assembly Procedures .................................................. Fehler! Textmarke nicht definiert.
Tools and Equipment .................................................. Fehler! Textmarke nicht definiert.
Screw Tightening Torque ............................................ Fehler! Textmarke nicht definiert.
Colors of Screw Shanks .............................................. Fehler! Textmarke nicht definiert.
Symbols of Screws on the Laptop Body ..................... Fehler! Textmarke nicht definiert.
Symbol examples ........................................................ Fehler! Textmarke nicht definiert.
4.2Battery ......................................................................... Fehler! Textmarke nicht definiert.
Removing the Battery Pack ......................................... Fehler! Textmarke nicht definiert.
Installing the Battery Pack .......................................... Fehler! Textmarke nicht definiert.
4.3HDD ............................................................................ Fehler! Textmarke nicht definiert.
Removing the HDD ..................................................... Fehler! Textmarke nicht definiert.
Installing the HDD ...................................................... Fehler! Textmarke nicht definiert.
4.4Memory ....................................................................... Fehler! Textmarke nicht definiert.
Removing the Optional Memory ................................. Fehler! Textmarke nicht definiert.
Installing the Optional Memory .................................. Fehler! Textmarke nicht definiert.
4.5ODD ............................................................................ Fehler! Textmarke nicht definiert.
Removing the ODD ..................................................... Fehler! Textmarke nicht definiert.
Installing the ODD ...................................................... Fehler! Textmarke nicht definiert.
Disassembling the ODD .............................................. Fehler! Textmarke nicht definiert.
Assembling the ODD Drive ........................................ Fehler! Textmarke nicht definiert.
4.6Keyboard Cover and Keyboard .................................. Fehler! Textmarke nicht definiert.
Removing the Keyboard Cover and Keyboard ........... Fehler! Textmarke nicht definiert.
Installing the Keyboard Cover and Keyboard ............. Fehler! Textmarke nicht definiert.
4.7Logic Upper Assembly ............................................... Fehler! Textmarke nicht definiert.
Removing the Logic Upper Assembly ........................ Fehler! Textmarke nicht definiert.
Installing the Logic Upper Assembly ......................... Fehler! Textmarke nicht definiert.
4.8Touchpad FFC ............................................................ Fehler! Textmarke nicht definiert.
Removing the Touchpad FFC ..................................... Fehler! Textmarke nicht definiert.
Installing the Touchpad FFC ....................................... Fehler! Textmarke nicht definiert.
4.9WLAN Card ................................................................ Fehler! Textmarke nicht definiert.
Removing the WLAN Card ......................................... Fehler! Textmarke nicht definiert.
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ix
Installing the WLAN card ........................................... Fehler! Textmarke nicht definiert.
4.10Modem Card ............................................................... Fehler! Textmarke nicht definiert.
Removing the Modem Card ........................................ Fehler! Textmarke nicht definiert.
Installing the Modem Card.......................................... Fehler! Textmarke nicht definiert.
4.11USB Board .................................................................. Fehler! Textmarke nicht definiert.
Removing the Right USB Board on the Right Side .... Fehler! Textmarke nicht definiert.
Installing the Right USB Board .................................. Fehler! Textmarke nicht definiert.
4.12ODD Board ................................................................. Fehler! Textmarke nicht definiert.
Removing the ODD Board .......................................... Fehler! Textmarke nicht definiert.
Installing the ODD switch board ................................ Fehler! Textmarke nicht definiert.
4.13Touchpad Button Board .............................................. Fehler! Textmarke nicht definiert.
Removing the Touchpad Button Board ....................... Fehler! Textmarke nicht definiert.
Installing the touchpad button switch board ............... Fehler! Textmarke nicht definiert.
4.14Power Board ............................................................... Fehler! Textmarke nicht definiert.
Removing the Power Board ........................................ Fehler! Textmarke nicht definiert.
Installing the Power Board .......................................... Fehler! Textmarke nicht definiert.
4.15Bluetooth Card ............................................................ Fehler! Textmarke nicht definiert.
Removing the Bluetooth card ...................................... Fehler! Textmarke nicht definiert.
Installing the Bluetooth card ....................................... Fehler! Textmarke nicht definiert.
4.16Display Assembly ....................................................... Fehler! Textmarke nicht definiert.
Removing the Display Assembly ................................ Fehler! Textmarke nicht definiert.
Installing the Display Assembly ................................. Fehler! Textmarke nicht definiert.
4.17Thermal Fan ................................................................ Fehler! Textmarke nicht definiert.
Removing the Thermal Fan ......................................... Fehler! Textmarke nicht definiert.
Installing the Thermal Fan .......................................... Fehler! Textmarke nicht definiert.
4.18Motherboard................................................................ Fehler! Textmarke nicht definiert.
Removing the Motherboard ........................................ Fehler! Textmarke nicht definiert.
Installing the Motherboard .......................................... Fehler! Textmarke nicht definiert.
4.19Speakers ...................................................................... Fehler! Textmarke nicht definiert.
Removing the Speakers ............................................... Fehler! Textmarke nicht definiert.
Installing the Speakers ................................................ Fehler! Textmarke nicht definiert.
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4.20RJ11 Cable .................................................................. Fehler! Textmarke nicht definiert.
Removing the RJ11 Cable ........................................... Fehler! Textmarke nicht definiert.
Installing the RJ11 Cable ............................................ Fehler! Textmarke nicht definiert.
4.21CPU and Thermal Module .......................................... Fehler! Textmarke nicht definiert.
Removing the CPU and Thermal Module ................... Fehler! Textmarke nicht definiert.
Installing the CPU and Thermal Module .................... Fehler! Textmarke nicht definiert.
4.22LCD Bezel .................................................................. Fehler! Textmarke nicht definiert.
Removing the LCD Bezel ........................................... Fehler! Textmarke nicht definiert.
Install the LCD bezel assembly according to the following procedures.Fehler! Textmarke
nicht definiert.
4.23LCD Module ............................................................... Fehler! Textmarke nicht definiert.
Removing the LCD Module ........................................ Fehler! Textmarke nicht definiert.
Installing the LCD Panel ............................................. Fehler! Textmarke nicht definiert.
4.24Camera Module ........................................................... Fehler! Textmarke nicht definiert.
Removing the Camera Module ................................... Fehler! Textmarke nicht definiert.
Installing the Camera Module ..................................... Fehler! Textmarke nicht definiert.
4.25Antennas for WLAN ................................................... Fehler! Textmarke nicht definiert.
Removing the Antennas for WLAN ............................ Fehler! Textmarke nicht definiert.
Installing the Antennas for WLAN ............................. Fehler! Textmarke nicht definiert.
Figures
Figure 4.1 Removing the Battery Pack ............................. Fehler! Textmarke nicht definiert.
Figure 4.2 Removing the logic lower door ....................... Fehler! Textmarke nicht definiert.
Figure 4.3 Removing the HDD from the HDD bay .......... Fehler! Textmarke nicht definiert.
Figure 4.4 Removing the HDD aluminum ........................ Fehler! Textmarke nicht definiert.
Figure 4.5 Installing the HDD aluminum ......................... Fehler! Textmarke nicht definiert.
Figure 4.6 Installing the logic lower door......................... Fehler! Textmarke nicht definiert.
Figure 4.7 Removing the RAM from the connectors ....... Fehler! Textmarke nicht definiert.
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Figure 4.8 Removing the ODD ......................................... Fehler! Textmarke nicht definiert.
Figure 4.9 Removing the ODD bracket from the ODD .... Fehler! Textmarke nicht definiert.
Figure 4.10 Removing the keyboard cover ....................... Fehler! Textmarke nicht definiert.
Figure 4.11 Removing screws securing the keyboard ...... Fehler! Textmarke nicht definiert.
Figure 4.12 Removing the keyboard ................................. Fehler! Textmarke nicht definiert.
Figure 4.13 Removing twenty-one screws from the bottom of the laptopFehler! Textmarke nicht
definiert.
Figure 4.14 Removing five screws and disconnecting one FFC from the motherboard Fehler!
Textmarke nicht definiert.
Figure 4.15 Removing the logic upper assembly from the laptop ..... Fehler! Textmarke nicht
definiert.
Figure 4.16 Removing the touchpad FFC ......................... Fehler! Textmarke nicht definiert.
Figure 4.17 Removing the WLAN Card ........................... Fehler! Textmarke nicht definiert.
Figure 4.18 Removing two screws securing the modem cardFehler! Textmarke nicht definiert.
Figure 4.19 Disconnecting the cable from the modem cardFehler! Textmarke nicht definiert.
Figure 4.20 Disconnecting the FFC from the motherboardFehler! Textmarke nicht definiert.
Figure 4.21 Disconnecting the ODD board FFC .............. Fehler! Textmarke nicht definiert.
Figure 4.22 Removing the touchpad button board ........... Fehler! Textmarke nicht definiert.
Figure 4.23 Disconnecting the FFC from the motherboardFehler! Textmarke nicht definiert.
Figure 4.24 Removing the power board ........................... Fehler! Textmarke nicht definiert.
Figure 4.25 Removing the Bluetooth card ........................ Fehler! Textmarke nicht definiert.
Figure 4.26 Disconnecting the Bluetooth cable ................ Fehler! Textmarke nicht definiert.
Figure 4.27 Removing the display assembly .................... Fehler! Textmarke nicht definiert.
Figure 4.28 Removing the thermal fan from the logic lower assemblyFehler! Textmarke nicht
definiert.
Figure 4.29 Removing the motherboard from the logic lower assemblyFehler! Textmarke nicht
definiert.
Figure 4.30 Removing the speakers .................................. Fehler! Textmarke nicht definiert.
Figure 4.31 Pulling out the cable from the routing channelFehler! Textmarke nicht definiert.
Figure 4.32 Removing the RJ11 connector ...................... Fehler! Textmarke nicht definiert.
Figure 4.33 Removing the Thermal Module spring screwsFehler! Textmarke nicht definiert.
Figure 4.34 Removing the Thermal Module spring screwsFehler! Textmarke nicht definiert.
Figure 4.35 Removing the CPU ........................................ Fehler! Textmarke nicht definiert.
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Figure 4.36 Reapply the Shinetsu 7726 grease on the thermal module and remove any release
papers ........................................................ Fehler! Textmarke nicht definiert.
Figure 4.37 Removing the LCD Bezel ............................. Fehler! Textmarke nicht definiert.
Figure 4.38 Prying up the LCD Bezel .............................. Fehler! Textmarke nicht definiert.
Figure 4.39 Removing the LCD Bezel ............................. Fehler! Textmarke nicht definiert.
Figure 4.40 Removing the LCD Module from the LCD cover assemblyFehler! Textmarke nicht
definiert.
Figure 4.41 Disconnect the camera module cable ............ Fehler! Textmarke nicht definiert.
Figure 4.42 Removing the LCD hinges ............................ Fehler! Textmarke nicht definiert.
Figure 4.43 Removing the LVDS cable from the LCD panelFehler! Textmarke nicht definiert.
Figure 4.44 Installing the LCD hinges .............................. Fehler! Textmarke nicht definiert.
Figure 4.45 Removing the Camera Module ...................... Fehler! Textmarke nicht definiert.
Figure 4.46 Removing the antennas from the LCD cover assembly Fehler! Textmarke nicht
definiert.
Appendices
Appendix A Handling the LCD Module .................................................................................... A-1
Appendix B Board Layout ......................................................................................................... B-1
Appendix C Pin Assignments..................................................................................................... C-1
Appendix D Keyboard Scan/Character Codes ........................................................................... D-1
Appendix E Key Layout............................................................................................................. E-1
Appendix F Series Screw Torque List ....................................................................................... F-1
Appendix G Reliability ............................................................................................................... G-1
Satellite L670/L675/ProL670/L675 Series Maintenance Manual
The Toshiba Satellite L670/Pro L670 is a full-size PC notebook equipped with a Dual Core
Processor, providing high-speed processing capabilities and advanced features. The computer
employs a lithium ion battery that allows it to be battery-operated for long periods of time. The
display uses 17.3-inch WXGA LCD panel. Many features can be Built To Order (BTO) to
customize the system for each user.
The computer has the following features:
Processor (BTO)
The computer is equipped with one of the following Intel® processors:
Intel® Arrandale Processor
Memory (BTO)
The computer has two SODIMM slots which come standard with 1GB/2GB/4GB, accepting
BTO for your memory requirements. It can incorporate up to 8 GB of main memory and
supports DDR3 at 1333MHz (Works as 1066MHz)/1066MHz/800MHz.
Battery Pack
The computer is powered by one rechargeable and removable lithium ion battery pack. The
capacity can be either 3-cell, 6-cell or 12-cell, depending on the model of the computer.
RTC Battery
The internal RTC battery backs up the Real Time Clock and calendar.
Hard Disk Drive (HDD) (BTO)
The computer accommodates a 9.5 mm HDD with the following storage capacities:
y 250/320/400/500/640 GB, S-ATA (5,400rpm)
y 500 GB, S-ATA (7,200rpm)
y 12.7mm height DVD Super Multi drive supporting ±R Double Layer
y 12.7mm height DVD Super Multi drive supporting ±R Double Layer w/ Labelflash
y 12.7mm height BD-Combo drive
y 12.7mm height BD Writer drive
Display
The LCD display comes with the following:
y 17.3" W (16:9) HD+ (1600x900) LED CSV and Non-CSV Type.
Graphics (BTO)
Mobile Intel
®
HM55/HM57 Chipset for integrated graphics display
ATI Mobility RadeonTM HD 5145/HD5470/HD5650 (DDR3, 1024MB)for external
graphics support
(depending on model)
Keyboard
The computer is equipped with a Toshiba standard 360mm keyboard, which has A4 +
10key Genchaku Keyboard without stick-point. It is a Win7-compliant keyboard with
optional Windows keys and application keys.
Pointing Device
The integrated Wide Touch Pad and two control buttons in the palm rest allow control of
the on-screen pointer and support functions such as the scrolling of windows.
External Monitor Port
The analog VGA port provides support for VESA DDC2B compatible functions. A WDDM
driver is ready for Win7.
Universal Serial Bus (USB) Ports
The computer has two USB 2.0 ports along with one USB/eSATA combo port (see below).
It is supported to daisy-chain a maximum of 127 USB devices. The serial data transfer rate
is 480 Mbps or 12 Mbps and 1.5 Mbps. These ports support PnP installation and hot
plugging.
The external SATA or eSATA port executes high-speed data transfer to external devices
and supports shielded cable lengths of up to 2 meters outside the PC. The port also provides
dual USB compatibility.
Bridge Media Slot
This slot allows you to insert SD/SDHC/SDXC memory card, miniSD/microSD Card,
Memory Stick (PRO), and MultiMediaCard. It supports high-speed SD, SDHC and SDXC.
This model does not support CF, SmartMedia cards, xD or Memory Stick Duo cards.
Sound system
The integrated sound system is composed of two Realtek Azalia internal speakers, an
internal microphone (BTO with internal camera), and standard Microphone-IN and
Headphone-OUT ports. Dolby® Advanced Audio function is also integrated in the system.
Internal Camera (BTO)
It supports 0.3M and 1.3M pixels with Auto Macro and comes with a blue LED indicator.
An internal microphone is BTO with the internal camera and includes echo cancellation.
The camera is not a rotation type.
Headphones/Line-out Jack
This jack connects digital speakers or stereo headphones (16 ohm minimum). When
connected to digital speakers or headphones, the internal speaker is automatically disabled.
Microphone/ Line-in Jack
A 3.5mm mini microphone jack enables connection of a three-conductor microphone for
monaural input and also enables the connection of a stereo device for audio input.
HDMI Out Port (BTO)
The HDMI out port can connect with a Type A connector HDMI cable. The HDMI out port
can send SD and HD video/audio signals.
The computer has built-in support for 10M/100M Ethernet LAN (10/100 megabits per
second, 10/100BASE-T). It employs a Realtek RTL8105E for 10M/100Mbit LAN (for
discrete platform, Realtek RTL8111E for 10M/100M/1000M is employed). It is preinstalled as a standard device in some markets.
Wireless LAN (BTO)
Some computers in this series are equipped with a Wireless LAN (WLAN) card. This
WLAN module may come with the following types (depending on the model):
Some models are equipped with an integrated modem. The integrated modem provides
capability for data and fax communications that support the V.90 (V.92) standards and
includes a modem jack for connection to the telephone line. Please note that both the V.90
and V.92 standards are only supported in the USA, Canada, United Kingdom, France,
Germany and Australia - only the V.90 standard is supported in other regions. You should
also be aware that the speed of data and fax transfer will depend on the analog telephone
line conditions. The integrated model is only installed as a standard device in some markets.
This internal modem comes with MDC 1.5 solution (Azalia interface).
Bluetooth (BTO)
Some computers in this series offer Bluetooth wireless communication functionality which
eliminates the need for cables between electronic devices such as computers and printers.
When implemented, Bluetooth provides wireless communication in a small space. This
module is Version 2.1 + EDR (BCM2070 Flash SLIM with Antenna), ie – Toshiba stack
support.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF CO MPAL ELECTRONICS, INC. AND CONTAINS CON FIDENTIAL
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF CO MPAL ELECTRONICS, INC. AND CONTAINS CON FIDENTIAL
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF CO MPAL ELECTRONICS, INC. AND CONTAINS CON FIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
VGA (DDR3)
ATI M92 XTX,64bit with 512MB
ATI Park XT,64bit with 512MB
ATI Madison LP,128bit with 1GB
page 13,14,15,16,17,18,19,20,21
22
33
44
LCD Conn.
Power/B
page 43
AUDIO & USB/B
page 39
ODD/B
page 34
LED/B
page 43
CRT
page 22
RJ45
page 37
DC/DC Interface CKT.
Power Circuit DC/DC
RTC Circuit
A
PCIE-Express 16X 2.5GHz
page 23
RTL8105E-VB-GR 10/100M
RTL8111E-VB-GR Giga
page 44
page 45~54
page 25
HDMI Conn.
page 24
PCIe port 1
B
page 37
SPI ROM
rPGA-988
page 5,6,7,8,9,10
DMI X4
2.5GHz
Intel Ibex Peak
BGA-951
PCIe 1x
1.5V 2.5GHz(250MB/s)
page 25
page 25,26,27,28,29,30,31,32,33
HD Audio
3.3V 33 MHz
LPC BUS
Debug Port
ENE KB926 E0
page 42
Touch Pad
page 35
Security Classification
Security Classification
Security Classification
Issued Date
Issued Date
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PRO PERTY OF COMPAL ELECTRONICS, INC. AND CON TAINS CONFIDENTIAL
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PRO PERTY OF COMPAL ELECTRONICS, INC. AND CON TAINS CONFIDENTIAL
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PRO PERTY OF COMPAL ELECTRONICS, INC. AND CON TAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
The system unit of the computer consists of the following components:
Processor (BTO)
The computer is equipped with one of the following Intel® processors:
Intel® Arrandale Processor
Memory (BTO)
The computer has two SODIMM slots which come standard with 1GB/2GB/4GB, accepting
BTO for your memory requirements. It can incorporate up to 8 GB of main memory. It
supports DDR3 at 1333MHz (Works as 1066MHz)/1066MHz/800MHz.
BIOS ROM (EEPROM)
The system BIOS uses one 4096KB flash ROM and the keyboard BIOS uses another
256KB flash ROM. The flash utility can be used to program both system and keyboard
BIOS at the same time.
System Controllers
Advanced Power Management 1.2 support
ACPI 4.0b and Windows Logo Program 3.0 compliant
Support SMBIOS specification V2.4
Hot keys for system control
Audio volume output control
External LED control
Battery scope report and control
Sticky key support
Power switch control
Two host interface channels support
Supports three independent devices
Internal Keyboard country selection
Computrace
Intel® HM55/HM57 Chipset for integrated graphics display
TM
ATI Mobility Radeon
HD5145/HD5470/HD5650 (DDR3, 1024MB)for external
graphics support
Audio Controller
Realtek Azalia ALC259
One Audio-in port: Mic-in/Line-in
One Audio-out port: Headphone-out/Line-out
Internal Microphone (with Internal Camera, MIC with echo cancellation)
Volume control: Digital control
Microsoft inbox audio driver support
Software EQ support
The computer contains an extremely low-profile and lightweight, high-performance HDD. The
HDD incorporates a 9.5 mm magnetic disk and mini-Winchester type magnetic heads. The HDD
interface conforms to Serial ATA. Storage capacities supported are 250, 320, 400, 500 and 640
GB.
The HDD is shown in Figure 1-2 and some of its specifications are listed in Table 1-1.
Figure 1-2 SATA HDD
Table 1-1 HDD Specifications
Item
Capacity (GB)
Rotational Speed (RPM)
Height
User Data Sectors
Bytes / Sector 512 512 512
1.3 DVD Super Multi (+-R Double Layer) 1 Hardware Overview
1.3 DVD Super Multi (+-R Double Layer)
The DVD Super Multi drive accepts 12-cm (4.72-inch) and 8-cm (3.15-inch) discs. At maximum,
the drive can play back a DVD at 8x speed, read CD-ROM at 24x speed, and write CD-R at 24x
speed, CD-RW at 24x speed, DVD-R at 8x speed, DVD-R (Dual Layer) at 6x speed, DVD-RW
at 6x speed, DVD+R at 8x speed, DVD+R (Double Layer) at 6x speed, DVD+RW at 8x speed
and DVD-RAM at 5x speed.
The DVD Super Multi drive is shown in Figure 1-3 and its specifications are listed in Table 1-2.
Figure 1-3 DVD Super Multi Drive
Table 1-2 DVD Super Multi Drive Specifications
Item DVD-ROM Mode CD-ROM Mode
33.3 (U-DMA transfer mode 2)
Data Transfer Rate (Mbytes/s)
16.6 (PIO mode 4, Multiword DMA mode 2)
Access Time (ms)
Average Random Access 130 130
1 Hardware Overview 1.4 BD-Writer and BD-Combo drives
1.4 BD-Writer and BD-Combo drives
The BD-Writer and BD-Combo drives accept 12-cm (4.72-inch) and 8-cm (3.15-inch) discs and
can play BDs, DVDs and CDs. At maximum the drives can playback BD at 6x speed, DVD at 8x
speed, read CD-ROM at 24x speed, and write, CD-R at 24x speed, CD-RW at 16x speed, DVDR at 8x speed, DVD-R (Dual Layer) at 4x speed, DVD-RW at 6x speed, DVD+R at 8x speed
(BD-Combo drive at 4x speed), DVD+R (Double Layer) at 4x speed, DVD+RW at 8x speed and
DVD-RAM at 5x speed.
In addition to being able to write to recordable CD/DVD discs, the BD-Writer drive can write to
BD-R at 6x speed, BD-R (DL) at 4x speed, BD-RE at 2x speed and BD-RE (DL) at 2x speed.
Figure 1-4 BD-Writer or BD-Combo drive (depending on the model)
The power supply unit provides constant voltage (19V) for the system board and performs the
following functions:
1. Power input monitor
y Checks whether the AC adapter (DC power supply) is connected to the computer.
y Checks whether the battery pack is connected to the computer.
y Monitors the DC power supply input voltage (AC Adapter output voltage).
2. Power supply's internal control
y Turns on and off the battery pack charging power supply.
y Issues a charging current instruction to the PWM control IC of the battery pack charging
power supply.
y Controls the supply of DC power supply input (AC Adapter output) to the power supply
unit.
y Controls the supply of power to the system block (load/logic circuit side).
y Controls forced shutdown if the power supply malfunctions.
3. Logic circuit control
y Instructs the gate array to enable/disable tuning the power on.
y Controls power-on/off operation.
4. Status display
y Turns on the Power LED (in White).
y Battery indicator (in White or Amber).
y DC-IN indicator (in White)
5. External interface
y Performs communication through the I2C bus (via the internal EC/KBC).
y Transfers the power supply operation mode.
y Monitors the voltage output to the system block (load/logic circuit side).
y Monitors the voltage, over-voltage, input/output current of the battery pack.
y Monitors the internal temperature of the battery pack.
y Monitors the supply voltage from the AC adapter.