Toshiba portege r700 Service Manual

Toshiba Personal Computer

PORTÉGÉ R700 Series

Maintenance Manual

First edition June 2010

TOSHIBA CORPORATION

File Number 960-833

[CONFIDENTIAL]

© 2010 by Toshiba Corporation. All rights reserved. Under the copyright laws, this manual cannot be reproduced in any form without the prior written permission of Toshiba. No patent liability is assumed with respect to the use of the information contained herein.

Toshiba Personal Comp

uter PORTÉGÉ R700 Series Maintenance Manual

First edition June 2010

Disclaimer

The information presented in this manual has been reviewed and validated for accuracy. The included set of instructions and descriptions are accurate for the

PORTÉGÉ R700 Series at the

time of this manual's production. However, succeeding computers and manuals are subject to change without notice. Therefore, Toshiba assumes no liability for damages incurred directly or indirectly from errors, omissions, or discrepancies between any succeeding product and this manual.

Trademarks

IBM is a registered trademark and IBM PC is a trademark of International Business Machines Corporation. Intel, Intel SpeedStep, Intel Core, Celeron and Centrino are trademarks or registered trademarks of Intel Corporation. Windows, Microsoft and Windows Vista are either registered trademarks or trademarks of Microsoft Corporation. Bluetooth is a trademark owned by its proprietor and used by TOSHIBA under license. InterVideo and WinDVD are registered trademarks of InterVideo Inc. Photo CD is a trademark of Eastman Kodak. i.LINK is trademark and registered trademark of Sony Corporation. Other trademarks and registered trademarks not listed above may be used in this manual.

ii PORTÉGÉ R700 Series Maintenance Manual (960-813)) [CONFIDENTIAL]

Preface

This maintenance manual describes how to perform hardware service maintenance for the Toshiba Personal Computer PORTÉGÉ R700 Series

The procedures described in this manual are intended to help service technicians isolate faulty Field Replaceable Units (FRUs) and replace them in the field.

SAFETY PRECAUTIONS

Four types of messages are used in this manual to bring important information to your attention. Each of these messages will be italicized and identified as shown below.

DANGER: “Danger” indicates the existence of a hazard that could result in death or

serious bodily injury, if the safety instruction is not observed.

WARNING: “Warning” indicates the existence of a hazard that could result in bodily

injury, if the safety instruction is not observed.

CAUTION: “Caution” indicates the existence of a hazard that could result in property

damage, if the safety instruction is not observed.

NOTE: “Note” contains general information that relates to your safe maintenance

service.

Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.

 Be sure to fasten screws securely with the right screwdriver. If a screw is not fully

fastened, it could come loose, creating a danger of a short circuit, which could cause overheating, smoke or fire.

 If you replace the battery pack or RTC battery, be sure to use only the same model

battery or an equivalent battery recommended by Toshiba. Installation of the wrong battery can cause the battery to explode.

PORTÉGÉ R700 Series Maintenance Manual (960-813) [CONFIDENTIAL] iii

The manual is divided into the following parts:

Chapter 1 Hardware Overview describes the Qosmio F60 Series system unit and

each FRU.

Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve

FRU problems.

Chapter 3 Test and Diagnostics describes how to perform test and diagnostic

operations for maintenance service.

Chapter 4 Replacement Procedures describes the removal and replacement of the

FRUs.

Appendices The appendices describe the following:

 Handling the LCD module  Board layout  Pin assignments  Keyboard scan/character codes  Key layout  Wiring diagrams  BIOS rewrite procedures  EC/KBC rewrite procedures  Reliability

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Conventions

This manual uses the following formats to describe, identify, and highlight terms and operating procedures.

Acronyms

On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example:

Read Only Memory (ROM)

Keys

Keys are used in the text to describe many operations. The key top symbol as it appears on the keyboard is printed in boldface type.

Key operation

Some operations require you to simultaneously use two or more keys. We identify such operations by the key top symbols separated by a plus (+) sign. For example, Ctrl + Pause (Break) means you must hold down Ctrl and at the same time press Pause (Break). If three keys are used, hold down the first two and at the same time press the third.

User input

Text that you are instructed to type in is shown in the boldface type below:

DISKCOPY A: B:

The display

Text generated by the computer that appears on its display is presented in the type face below:

Format complete System transferred

PORTÉGÉ R700 Series Maintenance Manual (960-813) [CONFIDENTIAL] v

Table of Contents

Chapter 1 Hardware Overview

1.1 Features......................................................................................................................1-5

1.2 System Unit Block Diagram....................................................................................1-13

1.3 3.5-inch Floppy Disk Drive (USB External) ...........................................................1-20

1.4 HDD&SSD ..............................................................................................................1-21

1.5 Optical Drive (ODD) ...............................................................................................1-24

1.6 Keyboard..................................................................................................................1-26

1.7 TFT Color Display...................................................................................................1-27

1.8 Power Supply...........................................................................................................1-28

1.9 Batteries ...................................................................................................................1-31

1.10 AC Adapter.............................................................................................................. 1-34

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Chapter 2 Troubleshooting Procedures

2.1 Troubleshooting.........................................................................................................2-6

2.2 Troubleshooting Flowchart........................................................................................2-8

2.3 Power Supply Troubleshooting................................................................................2-13

2.4 System Board Troubleshooting................................................................................2-22

2.5 USB FDD Troubleshooting .....................................................................................2-30

2.6 HDD/SSD Troubleshooting.....................................................................................2-34

2.7 Keyboard Troubleshooting ......................................................................................2-39

2.8 Touch pad Troubleshooting.....................................................................................2-40

2.9 Display Troubleshooting..........................................................................................2-42

2.10 Optical Disk Drive Troubleshooting........................................................................2-44

2.11 LAN Troubleshooting..............................................................................................2-46

2.12 Wireless LAN Troubleshooting...............................................................................2-47

2.13 Bluetooth Troubleshooting ......................................................................................2-50

2.14 Sound Troubleshooting............................................................................................2-52

2.15 Bridge media Slot Troubleshooting.........................................................................2-54

2.16 PCI ExpressCard Slot Troubleshooting...................................................................2-56

2.17 Fingerprint sensor Troubleshooting......................................................................... 2-57

2.18 Web camera Troubleshooting..................................................................................2-61

2.19 3G Troubleshooting:................................................................................................2-63

2.20 HDMI Troubleshooting ........................................................................................... 2-65

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Chapter 3 Tests and Diagnostics

3.1 The Diagnostic Test...................................................................................................3-7

3.2 Executing the Diagnostic Test................................................................................. 3-10

3.3 Setting of the hardware configuration .....................................................................3-15

3.4 Heatrun Test.............................................................................................................3-17

3.5 Subtest Names.......................................................................................................... 3-18

3.6 System Test.............................................................................................................. 3-20

3.7 Keyboard Test.......................................................................................................... 3-23

3.8 Display Test.............................................................................................................3-24

3.9 Floppy Disk Test......................................................................................................3-27

3.10 Printer Test...............................................................................................................3-29

3.11 Async Test ............................................................................................................... 3-31

3.12 Hard Disk Test.........................................................................................................3-32

3.14 Real Timer Test........................................................................................................3-35

3.15 NDP Test.................................................................................................................. 3-37

3.16 Expansion Test.........................................................................................................3-38

3.17 CD-ROM/DVD-ROM Test .....................................................................................3-40

3.18 Error Code and Error Status Names.........................................................................3-41

3.19 Hard Disk Test Detail Status ................................................................................... 3-44

3.20 ONLY ONE TEST................................................................................................... 3-46

3.21 Head Cleaning.......................................................................................................... 3-56

3.22 Log Utilities............................................................................................................. 3-57

3.23 Running Test............................................................................................................ 3-59

3.24 Floppy Disk Drive Utilities......................................................................................3-60

3.25 System Configuration ..............................................................................................3-65

3.26 Wireless LAN Test Program (Atheros)................................................................... 3-67

3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC)...............3-69

3.28 Wireless LAN Test Program on DUT PC (Intel-made)...........................................3-74

3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program .................................................. 3-78

3.30 Sound Test program.................................................................................................3-85

3.31 SETUP .....................................................................................................................3-86

3.32 Maintenance (WinPE&FreeDos) Test Program Operation..................................... 3-94

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3.33 Starting TOSHIBA Test & Diagnostic....................................................................3-95

3.34 Windows PE T&D...................................................................................................3-97

3.35 DOS T&D.............................................................................................................. 3-143

3.36 Maintenance (WinPE&FreeDos) Test Program Supplementary Information.......3-171

3.37 Maintenance (WinPE&FreeDos) Test Program Supplementary Information.......3-174

Chapter 4 Replacement Procedures

4.1 Overview....................................................................................................................4-1

4.2 Battery pack............................................................................................................. 4-10

4.3 SIM card...................................................................................................................4-12

4.4 ExpressCard............................................................................................................. 4-13

4.5 Bridge media (SD, mini SD, Micro SD Card).........................................................4-14

4.6 Memory module.......................................................................................................4-15

4.7 HDD/SSD ................................................................................................................4-18

4.8 Base assembly.......................................................................................................... 4-22

4.9 ExpressCard slot ......................................................................................................4-26

4.10 Battery lock..............................................................................................................4-28

4.11 3G card.....................................................................................................................4-29

4.12 Optical disk drive (DVD-Super Multi drive)/SD board..........................................4-33

4.13 Wireless LAN card ..................................................................................................4-38

4.14 DC fan...................................................................................................................... 4-40

4.15 E-SATA board.........................................................................................................4-42

4.16 Fin............................................................................................................................4-44

4.17 Bluetooth module.....................................................................................................4-46

4.18 System board............................................................................................................ 4-48

4.19 Sound board.............................................................................................................4-55

4.20 Speaker..................................................................................................................... 4-59

4.21 DC-IN harness ......................................................................................................... 4-62

4.22 Touch pad/Fingerprint sensor board........................................................................ 4-63

4.23 Keyboard..................................................................................................................4-67

4.24 Cover assembly/LCD assembly...............................................................................4-69

4.25 LCD..........................................................................................................................4-75

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4.26 Camera module........................................................................................................ 4-82

4.27 Wireless LAN antenna/Bluetooth antenna/3G antenna........................................... 4-84

4.28 Hinge........................................................................................................................4-93

Appendices

Appendix A Handling the LCD Module ........................................................................... A-1

Appendix B Board Layout ................................................................................................ B-1

Appendix C Pin Assignments............................................................................................ C-1

Appendix D Keyboard Scan/Character Codes.................................................................. D-1

Appendix E Key Layout.....................................................................................................E-1

Appendix F Wiring Diagrams............................................................................................F-1

Appendix G BIOS rewrite Procedures.............................................................................. G-1

Appendix H EC/KBC rewrite Procedures......................................................................... H-1

Appendix I Reliability........................................................................................................I-1

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Chapter 1 Hardware Overview

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Chapter 1 Contents

Chapter 1 Hardware Overview ......................................................................................... 1

1.1 Features......................................................................................................................... 5

1.2 System Unit Block Diagram....................................................................................... 13

1.3 3.5-inch Floppy Disk Drive (USB External) .............................................................. 20

1.4 HDD&SSD ................................................................................................................. 21

1.4.1 2.5-inch SATA HDD............................................................................. 21

1.4.2 SATA SSD............................................................................................ 23

1.5 Optical Drive (ODD) .................................................................................................. 24

1.5.1 DVD-Super Multi Drive........................................................................ 24

1.6 Keyboard..................................................................................................................... 27

1.7 TFT Color Display...................................................................................................... 28

1.7.1 LCD Module.......................................................................................... 28

1.8 Power Supply.............................................................................................................. 29

1.9 Batteries ...................................................................................................................... 32

1.9.1 Main Battery.......................................................................................... 32

1.9.2 Battery Charging Control...................................................................... 33

1.9.3 RTC battery........................................................................................... 34

1.10 AC Adapter ................................................................................................................. 35

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Figures

Figure 1-1 Front of the computer........................................................................................... 11

Figure 1-2 System unit configurations................................................................................... 12

Figure 1-3 System unit block diagram................................................................................... 13

Figure 1-4 3.5-inch FDD (USB External).............................................................................. 20

Figure 1-5 2.5-inch SATA HDD ........................................................................................... 21

Figure 1- 6 Keyboard............................................................................................................. 27

Figure 1- 7 LCD module........................................................................................................ 28

Tables

Table 1-1 3.5-inch FDD specifications.................................................................................. 20

Table 1-2 2.5-inch SATA HDD specifications (HGST)........................................................ 21

Table 1-3 2.5-inch HDD specifications (TSDC) ................................................................... 22

Table 1-4 1.8-inch Solid State Drive (SSD) specifications.................................................. 23

Table 1-5 DVD Super Multi drive (Double Layer) specifications......................................... 24

Table 1-6 DVD Super Multi drive specifications................................................................... 25

Table 1-7 LCD module specifications................................................................................... 28

Table 1-8 Power supply output rating.................................................................................... 30

Table 1-9 Battery specifications ............................................................................................ 32

Table 1-10 Time required for charges ................................................................................... 33

Table 1-11 Data preservation time......................................................................................... 34

Table 1-12 RTC battery charging/data preservation time ..................................................... 34

Table 1-13 AC adapter specifications.................................................................................... 35

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1.1 Features

The Toshiba PORTÉGÉ R700 Series Personal Computer uses extensive Large Scale Integration (LSI), and Complementary Metal-Oxide Semiconductor (CMOS) technology extensively to provide compact size, minimum weight, low power usage and high reliability. This computer incorporates the following features.

There some models and options. Refer to the Parts List for the configuration of each model and options.

 Microprocessor

The Toshiba PORTÉGÉ R700 Series computer is equipped with an Intel® Processor. The PC comes in with one of the following speeds:

Intel® Arrandale Processor (Calpella Arrandale SV BGA)

Core Frequency System Bus

Frequency

2.66GHz

1066MHz 4MB 3.33GHz 2/4

L2 Cache Size

Turbo Cores/Thread

Core i7-620M

2.40GHz

1066MHz 3MB 2.93GHz 2/4

Core i5-520M

2.40GHz

1066MHz 3MB 2.60GHz 2/4

Core i5-450M

2.26GHz

1066MHz 3MB

2/4

Core i3-350M

 Memory

Two DDR3-1066 SDRAM slots. Memory modules can be installed to provide a maximum of 8GB. Memory modules are available in 1024MB, 2048MB and 4096MB sizes.

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 Chipset

Toshiba PORTÉGÉ R700 Series computer is Equipped with Intel

Calpella Ibex peak-M

QM57 (AMT model) or HM55 (Non-AMT model).

 VGA Controller

The PC comes in with one of the following types:

 The internal graphics controller in Intel Processor (Core i*) is used..

 HDD

The computer has a 2.5-inch SATA HDD. The following capacities are available.

 160/320/500 GB

 SSD

Some models are equipped with a "Solid State Drive (SSD)" instead of a hard disk drive.

2.5"SATA SSD type

 256GB/512GB

1.8"SATA SSD type

 128GB

 USB FDD

A 3.5-inch USB FDD accommodates 2HD (1.44MB) or 2DD (720KB) disks.

 Optical Drive

A DVD Super Multi drive (double layer) can be installed. They are 7mm thickness or 9.5mm thickness by a model.

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 Display

The PC comes in with one of the following types:

33.8cm (13.3”) LCD screen, 16 million colors, configured with the following resolution:

 HD, 1366 horizontal x 768 vertical pixels

Interface

To external monitor via - RGB connector and mini display port

 Keyboard

An-easy-to-use 85(US)/87(UK)-key keyboard provides a numeric keypad overlay for fast numeric data entry or for cursor and page control. The keyboard also includes two keys that have special functions in Microsoft® Windows® 7. It supports software that uses a 101- or 102-key enhanced keyboard.

 Touch Pad

A Touch Pad and control buttons in the palm rest enable control of the on-screen pointer and scrolling of windows.

 Batteries

The computer has two batteries: a rechargeable Lithium-Ion main battery pack and RTC battery (that backs up the Real Time Clock and CMOS memory.

 Universal Serial Bus (USB2.0)

Two Universal Serial Bus ports, which comply to the USB 2.0 standard, are provided on the right hand side of the computer.

 eSATA/USB combo

One eSATA/USB combo port, which complies to the USB 2.0 standard, is provided on the left hand side of the computer. This port has eSATA (External Serial ATA) function. Some models are equipped with an eSATA/USB combo port. A Charge power supply (When a computer is power-on or sleep).

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 External monitor (RGB) port

This port provides 15-pin, analog VGA port. This port allows you to connect an external monitor to the computer.

 HDMI out port

HDMI out port can connect with Type A connector HDMI cable. HDMI cable can send video and audio signals.

 SD Media slot

This slot lets you insert an SD™/SDHC™ memory card, miniSD™/microSD™ Card, and MultiMediaCard

 ExpressCard slot(Some models)

This slot allows you to install a single ExpressCard device.

 PC Card slot(Some models)

This slot allows you to install a single PC Card device.

 Fingerprint sensor(Some models)

The computer is equipped with a fingerprint sensor and fingerprint authentication utility. They enable only person who has registered his/her fingerprint to use the computer.

 Sound system

The sound system is equipped with the following features:

 Stereo speakers  Built-in microphone  Stereo headphone jack  External microphone jack  External Headphone jack

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 Docking interface port The docking interface port enables connection of an optional TOSHIBA Hi-Speed Port

Replicator. It provides additional features as follows:

 RJ45 LAN jack  External monitor port  DC IN 19V jack  Security lock slot  Universal Serial Bus 2.0 port (four)  Universal Serial Bus 3.0 port (two)  Serial port  HDMI out port (some models are equipped with a HDMI out port)  Microphone jack  Line out (Headphones, Speakers)

 Internal LAN

The computer has built-in support for Ethernet LAN (10 megabits per second, 10BASET), Fast Ethernet LAN (100 megabits per second, 100BASE-TX) and Gigabit Ethernet LAN (1000 megabits per second, 1000BASE-T).

 Wireless LAN

Some computers in this series are equipped with a Wireless LAN module that is compatible with other LAN systems based on Direct Sequence Spread Spectrum/Orthogonal Frequency Division Multiplexing radio technology that complies with the IEEE 802.11 Standard.

 Bluetooth

Some computers in this series have Bluetooth wireless communication function which eliminates the need for cables between electronic devices such as computers, printers and mobile phones. When it is enabled, Bluetooth provides the wireless personal area network environment which is safe and trustworthy, that is quick and easy.

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 Web Camera

Web Camera is a device that allows you to record video or take photographs with your computer. You can use it for video chatting or video conferences using a communication tool such as Windows Live Messenger. TOSHIBA Web Camera Application will help you to add various video effects to your video or photograph.

 3G：Not used

Some computers in this series are equipped with a 3G module.

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Figure 1-1 Front of the computer

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The system unit configuration is shown in figure 1-2

Figure 1-2 System unit configurations

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1.2 System Unit Block Diagram

Figure 1-3 is a block diagram of the system unit.

Figure 1-3 System unit block diagram

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The system unit is composed of the following major components:

 Microprocessor

The Toshiba PORTÉGÉ R700 Series computer is equipped with an Intel® Processor. The PC comes in with one of the following speeds:

Intel® Arrandale Processor (Arrandale SV BGA)

Core Frequency System Bus

Frequency

2.66GHz

1066MHz 4MB 3.33GHz 2/4

L2 Cache Size

Turbo Cores/Thread

Core i7-620M

2.40GHz

1066MHz 3MB 2.93GHz 2/4

Core i5-520M

2.40GHz

1066MHz 3MB 2.60GHz 2/4

Core i5-450M

2.26GHz

1066MHz 3MB

2/4

Core i3-350M

 Memory

Two DDR3-1066 SDRAM slots. Memory modules can be installed to provide a maximum of 8GB. Memory modules are available in 1024MB, 2048MB and 4096MB sizes.

- 204-pin slot

- DDR3-1066 support

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 Chipset

Toshiba PORTÉGÉ R700 Series computer is Equipped with Intel QM57 (AMT model) or HM55 (Non-AMT model).

Names Feature

QM57 HM55

PCI Express* 2.0 Ports USB 2.0 Ports SATA Ports HDMI/DVI/VGA/SDVO/DisplayPort LVDS Graphics Support with PAVP 1.5 Intel® Quiet System Technology Intel® Rapid

Storage Technology Intel® ME Ignition FW only

Intel® AT Intel® Active Managment Technology

(Intel AMT) 6.0 Intel® Remote PC Assist Technology for Business Intel® Remote PC Assist Technology for Consumer Intel® Remote Wake Technology

AHCI Raid 0/1/5/10 Support

8 6

14 12

6 4 Yes Yes Yes Yes Yes Yes

No No Yes Yes Yes No

Yes No

No No

Calpella Ibex peak-M

- 1071-ball 25x27mm FCBGA Package

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 VGA Controller

The PC comes in with one of the following types:

 The internal graphics controller in Intel Processor (Core i*) is used..

 LAN Controller

This controller has the following functions:

 Support only a Gigabit Ethernet.  RJ45x1 port (with LED), docking connector (branch) 1 port.  WOL support (from S3, S4, and S5)  LAN controller

Made in Intel Hanksville (WG82577 LC/LM (AMT)): PCI-Ex Connection

 AMT6.0 support (BTO correspondence)

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 Wireless LAN

 One PCI Express Mini Card slot1

802.11a/g+WiMax : Intel Kilmer Peak (2x2) (JPN) Intel 802.16e(a/g)13ch+WiMAX-KP 2x2 MOW-HMC Intel 802.11(a/b/g)13ch-PP 2x2 MOW-HMC Intel 802.11(a/b/g/n)13ch-PP 2x2 MOW-HMC

802.11a/g/n : Atheros HB92

802.11b/g : Atheros HB95

802.11b/g/n : Atheros HB95 Broadcom 802.11(b/g)BCM94313-HMC w/ BT V2.1+EDR

 WOWL support (only Intel module)

 Bluetooth

 V2.1 +EDR Module with a External antenna  USB I/F connection

 Express Card slot

 ExpressCard/34 x1、USB/PCI Express I/F

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 SD Media Controller slot

 Card slotｘ１  SD, mini SD (w/ adapter),Micro SD (w/adapter),xD, MMC  SD Token KEY, SD boot correspondence  SD IO is No-supporting.  Controller : RICOH R5U230-QFN48P

 Sound Controller

 PCH built-in HD Audio Link (Intel High Definition Audio I/F)+RealTek ALC268  Amplifier: Matsushita AN12947AA  Built-in microphone :(BTO correspondence by Camera and a set)  Built-in speaker: Stereo  External monophonic microphone input plug  Stereo headphone jack  Digital volume (button type)  VoIP support

 Camera

 It is BTO correspondence by the built-in microphone and a set.  Connection interface: USB I/F connection  Product made from Chicony.  Resolution :VGA

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 Other chips

 Clock generator： ICS9LVRS394CKLFT (Made by Integrated Device Technology)  EC/KBC： MEC1609-PZP(REVISION.D) (Made by standard micro system)  GPIO Expander： ECE1088-DZK (Made by standard micro system)  PSC: TMP86FS49BUG (made by Toshiba)  TPM: SLB9635 TT 1.2 (made by Infineon) 

 Sensor

 Temperature reset IC ：85-degree-C type  Thermistor： Three places (CPU, Memory, for normal temperature measurement)  Magneto metric sensor ：

Use it as a LCD opening-and-closing sensor (ferrite magneto system).

 Acceleration sensor ： Made by ST Microelectronics

TSH35TR (Three axes) HDD protection

 Fingerprint sensor ： Made by Authen Tec. It mounts between the Touchpad buttons.

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1.3 3.5-inch Floppy Disk Drive (USB External)

The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks.

The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1.

Figure 1-4 3.5-inch FDD (USB External)

Table 1-1 3.5-inch FDD specifications

TEAC FD-05PUB-337

Items

720KB mode 1.44MB mode

FDD part 250K bits/second 500K bits/second Data transfer rate

USB Full speed mode (12M bits/second) Disk rotation speed 300rpm Track density 5.3 track/mm (135TPI)

(G8AC0000B320)

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