Toshiba MK3006GAL, MK4006GAH User Manual
1.1.1.1.1.1.1.1 TOSHIBA
TOSHIBA
Hard Disk Drive Specification
1.8 inch Hard Disk Drive
MK6006GAH/MK4006GAH
/MK3006GAL
Rev. 01
REF 360050398
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Revision History
1.8 inch Hard Disk Drive MK6006GAH/MK4006GAH/MK3006GAL Product Specification
Revision Date
00 2004-07-01 Initial issue
01 2004-08-10
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ＳＡＦＥＴＹ
The hard disk drive and product specifications contain essential information for the protection of
users and others from possible injury and property damage and to ensure correct handling.
Please check that you fully understand the definition of the following messages (signs and
graphical symbols) before going on to read the text, and always follow the instructions.
Please describe requirements in the instruction manual of the product in which the drive is
mounted and ensure that users are made thoroughly aware of them.
IMPORTANT MESSAGES
Read this manual and follow its instructions. Signal words such as CAUTION and NOTE,
will be followed by important safety information that must be carefully reviewed.
NOTE
LIMITATION OF LIABILITY
・Toshiba Corporation shall not be liable for any damage due to the fault or negligence
of users, fire, earthquake, or other accident beyond the control of Toshiba
Corporation.
・Toshiba Corporation shall not be liable for any incidental or consequential damages
including but not limited to change or loss of stored data, loss of profit, or
interruption of business, which are caused by use or non-usability of the product.
・Toshiba Corporation shall not be liable for any damage result from failure to comply
with the contents in the product specification.
・Toshiba Corporation shall not be liable for any damage based on use of the product
in combination with connection devices, software, or other devices provided by
Indicates a potentially hazardous situation which if not avoided, may res ul t
in minor injury or property damage.
Gives you helpful information.
Toshiba Corporation with the product.
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USAGE RESTRICTIONS
● Since the drive is not designed or manufactured to be used for a system including
equipment (*1) directly linked with human life, etc., Toshiba Corporation shall not
be liable for this type of use.
*1: Equipment directly linked with human life, etc. corresponds to the
following.
−Medical equipment such as life support systems, equipment used in
operations，etc.
● When the drive is to be used for a system including equipment (*2) linked with
human safety or having a serious influence on the safe maintenance of public
function, etc., special consideration (*3) must be given with regard to operation,
maintenance, and management of the system.
*2: A system including equipment linked with human safety or having a
serious influence on the safe maintenance of public function, etc.
corresponds to the following.
−A main equipment control system used in atomic power plants, a safety
protection based system used in atomic facilities, other important
safety lines and systems.
−An operation control system for mass transport, an air-traffic control
system.
*3: Special consideration means that a safety system (fool proof design, fail
safe design, redundancy design, etc.) is established as a result of
adequate consultation with Toshiba engineers.
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SAFETY
■ Do not disassemble, remodel or repair.
Disassembly, remodeling or repair may cause injury, failure, or data loss.
■ Do not drop.
Dropping may cause injury.
■ Do not touch sharp edges or pins of the drive.
Sharp protrusions etc. may cause injury.
Hold the drive by both sides when carrying it.
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SAFETY
Observe the following to prevent failure, malfunction or data loss.
NOTE
●Follow the specifications for 7. POWER SUPPLY (page17), 9. ENVIRONMENT (page 22, 23),
etc. when using.
Failure to do so may cause damage to the drive.
●Observe cautions in 8.3 MOUNTING INSTRUCTION (page18) and 10.6 LOAD / UNLOAD
(page27 ) when handling, setting up, or using the drive.
●Take anti-static measures in order to avoid damage to the drive when handling it.
The drive uses parts susceptible to damage due to ESD (electrostatic discharge).
Wear ESD proof wrist strap in accordance with the usage specified when handling a drive that is not in an anti-static
protection bag.
●There is a certain probability of the drive causing failure including data error or data loss.
Take preventive steps such as backing up data etc. without exception in order to prevent loss etc. in cases where
data loss may result in loss or damage.
Please include this in the instruction manual etc. of the system in which this device is used and ensure that users
are made thoroughly aware of it.
●Inserting or pulling out the drive when the power is turned on may cause damage to the drive.
Exchange the drive etc. after the power of HDD is turned off.
●Extreme shock to the drive may cause damage to it, data corruption, etc..
Do not subject the drive to extreme shock such as dropping, upsetting or crashing against other objects.
●Do not touch the top cover since application of force to it may cause damage to the drive.
●Do not stack the drive on another drive or on other parts etc. or stack them on top of it during
storage or transportation.
Shock or weight may cause parts distortion etc..
●Labels and the like attached to the drive are also used as a seal for maintenance of its
performance.
Do not remove them from the drive.
●Attachment of dielectric materials such as metal powder, liquid, etc. to live parts such as
printed circuit board patterns or pins etc. may cause damage to the drive.
Avoid attachment of these materials.
●Do not place objects which generate magnetic fields such as magnets, speakers, etc. near the
drive.
Magnetism may cause damage to the drive or data loss.
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TABLE OF CONTENTS
1.
SCOPE........................................................................................................................................................ 11
2. GENERAL DESCRIPTION....................................................................................................................... 11
3. KEY FEATURES....................................................................................................................................... 13
4. BASIC SPECIFICATION.......................................................................................................................... 15
5. PERFORMANCE....................................................................................................................................... 16
6. POWER REQUIREMENTS ...................................................................................................................... 17
6.1 SUPPLY VOLTAGE.....................................................................................................................................17
6.2 POWER CONSUMPTION .............................................................................................................................17
6.3 ENERGY CONSUMPTION EFFICIENCY .......................................................................................................17
7. MECHANICAL SPECIFICATIONS......................................................................................................... 18
7.1 DIMENSION AND WEIGHT..........................................................................................................................18
7.2 DRIVE ORIENTATION................................................................................................................................18
7.3 MOUNTING INSTRUCTIONS.......................................................................................................................18
7.3.1 Installation ......................................................................................................................................19
8. ENVIRONMENTAL LIMITS.................................................................................................................... 22
8.1 TEMPERATURE AND HUMIDITY.................................................................................................................22
8.1.1 Temperature....................................................................................................................................22
8.1.2 Humidity..........................................................................................................................................22
8.2 VIBRATION................................................................................................................................................22
8.3 SHOCK......................................................................................................................................................22
8.4 ALTITUDE.................................................................................................................................................23
8.5 ACOUSTICS（SOUND POWER）................................................................................................................23
8.6 SAFETY STANDARDS.................................................................................................................................24
8.7 EMC ADAPTABILITY ................................................................................................................................25
8.8 MAGNETIC FIELDS ...................................................................................................................................25
9. RELIABILITY............................................................................................................................................ 26
9.1 ERROR RATE.............................................................................................................................................26
9.1.1 Non- Recoverable Error Rate .........................................................................................................26
9.1.2 Seek Error Rate...............................................................................................................................26
9.2 MEAN TIME TO FAILURE (MTTF) ............................................................................................................26
9.3 PRODUCT LIFE..........................................................................................................................................26
9.4 REPAIR .....................................................................................................................................................26
9.5 PREVENTIVE MAINTENANCE (PM)...........................................................................................................26
9.6 LOAD/UNLOAD..........................................................................................................................................27
10. HOST INTERFACE............................................................................................................................... 28
10.1 CABLING...................................................................................................................................................28
10.1.1 Interface Connector.........................................................................................................................28
10.2 ELECTRICAL SPECIFICATION ....................................................................................................................29
10.2.1 Cable length and capacitance.........................................................................................................29
10.2.2 DC input/output Characteristics....................................................................................................29
10.3 INTERFACE CONNECTOR...........................................................................................................................30
10.3.1 ATA interface connector .................................................................................................................30
10.3.2 Pin Assignment ...............................................................................................................................31
10.3.3 Signal Treatment ............................................................................................................................32
10.3.4 Series resistance..............................................................................................................................33
10.3.5 Signal Description...........................................................................................................................33
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10.4 HOST INTERFACE TIMING........................................................................................................................ 35
10.4.1 Program I/O Write Timing............................................................................................................. 35
10.4.2 Program I/O Read Timing.............................................................................................................. 36
10.4.3 Multiword DMA Write Timing......................................................................................................37
10.4.4 Multiword DMA Read Timing.......................................................................................................38
10.4.5 Ultra DMA Timing ......................................................................................................................... 39
10.4.6 Reset Timing................................................................................................................................... 48
10.5 GROUNDING............................................................................................................................................. 48
10.6 ADDRESS DECODING................................................................................................................................49
10.7 REGISTER DESCRIPTION ..........................................................................................................................50
10.7.1 Data Register..................................................................................................................................50
10.7.2 Error Register.................................................................................................................................51
10.7.3 Features Register (Write Precompensation Register) ................................................................. 51
10.7.4 Sector Count Register..................................................................................................................... 52
10.7.5 Sector Number Register................................................................................................................. 53
10.7.6 Cylinder Low Registers.................................................................................................................. 53
10.7.7 Cylinder High Registers.................................................................................................................53
10.7.8 Device/Head Register ..................................................................................................................... 54
10.7.9 Status Register ............................................................................................................................... 55
10.7.10 Command Register...................................................................................................................... 56
10.7.11 Alternate Status Register........................................................................................................... 58
10.7.12 Device Control Register.............................................................................................................. 58
10.7.13 Device Address register.............................................................................................................. 58
10.8 COMMAND DESCRIPTIONS ....................................................................................................................... 60
10.8.1 Nop (00h) ...................................................................................................................................... 61
10.8.2 Recalibrate (1xh).......................................................................................................................... 61
10.8.3 Flush Cache (E7h)........................................................................................................................ 61
10.8.4 Flush Cache EXT (EAh) .............................................................................................................. 61
10.8.5 Read Sector (20h/21h).................................................................................................................. 62
10.8.6 Read Sector EXT (24h) ................................................................................................................ 62
10.8.7 Write Sector (30h/31h)................................................................................................................. 63
10.8.8 Write Sector EXT (34h) ............................................................................................................... 63
10.8.9 Read Verify (40h) .........................................................................................................................64
10.8.10 Read Verify EXT (42h)............................................................................................................. 64
10.8.11 Write Verify (3Ch).................................................................................................................... 65
10.8.12 Format Track (50h) ................................................................................................................ 65
10.8.13 Seek (7xh).................................................................................................................................. 66
10.8.14 Toshiba Specific........................................................................................................................... 66
10.8.15 Execute Diagnostics (90h)........................................................................................................ 67
10.8.16 Initialize Device Parameters (91h) ......................................................................................... 67
10.8.17 Download Microcode (92h).......................................................................................................68
10.8.18 Read Multiple (C4h)................................................................................................................. 69
10.8.19 Read Multiple EXT (29h)......................................................................................................... 70
10.8.20 Write Multiple (C5h)................................................................................................................ 70
10.8.21 Write Multiple EXT (39h)........................................................................................................ 72
10.8.22 Set Multiple Mode (C6h).......................................................................................................... 72
10.8.23 Read DMA (C8h/C9h)............................................................................................................... 73
10.8.24 Read DMA EXT (25h) .............................................................................................................. 73
10.8.25 Write DMA (CAh/CBh) ............................................................................................................74
10.8.26 Write DMA EXT (35h) ............................................................................................................. 74
10.8.27 Power Control (Exh)................................................................................................................. 75
10.8.28 Read Buffer (E4h)..................................................................................................................... 77
10.8.29 Write Buffer (E8h).................................................................................................................... 77
10.8.30 Identify Device (ECh)............................................................................................................... 77
10.8.31 SET MAX (F9h)...........................................................................................................................91
10.8.32 SET MAX ADDRESS EXT (37h) ............................................................................................... 94
10.8.33 Read Native Max Address (F8h) ...........................................................................................94
10.8.34 Read Native Max Address EXT (27h)...................................................................................95
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10.8.35 Set Features (EFh)....................................................................................................................96
10.8.36 SECURITY SET PASSWORD (F1h) .......................................................................................97
10.8.37 SECURITY UNLOCK (F2h).....................................................................................................98
10.8.38 SECURITY ERASE PREPARE (F3h) .....................................................................................98
10.8.39 SECURITY ERASE UNIT (F4h)..............................................................................................99
10.8.40 SECURITY FREEZE LOCK (F5h) ..........................................................................................99
10.8.41 SECURITY DISABLE PASSWORD (F6h)............................................................................100
10.8.42 SMART Function Set (B0h)......................................................................................................100
10.8.43 Read Log EXT (2Fh) ...............................................................................................................121
10.8.44 Write Log EXT (3Fh) ..............................................................................................................127
10.8.45 Device Configuration (B1h).......................................................................................................127
10.9 SECURITY MODE FEATURE SET..............................................................................................................135
10.9.1 Security mode default setting.......................................................................................................135
10.9.2 Initial setting of the user password .............................................................................................135
10.9.3 Security mode operation from power-on......................................................................................136
10.9.4 Password lost.................................................................................................................................137
10.9.5 Command Table ............................................................................................................................138
10.10 SELF-MONITORING, ANALYSIS AND REPORTING TECHNOLOGY .........................................................139
10.10.1 Attributes...................................................................................................................................139
10.10.2 Attributes values .......................................................................................................................139
10.10.3 SMART function default setting...............................................................................................139
10.11 ADAPTIVE POWER MODE CONTROL ....................................................................................................140
10.11.1 Performance Idle........................................................................................................................140
10.11.2 Active Idle ..................................................................................................................................140
10.11.3 Low Power Idle ..........................................................................................................................140
10.11.4 Transition time..........................................................................................................................140
10.12 RESET .................................................................................................................................................141
10.13 DRIVE0/DRIVE1 CONFIGURATION ......................................................................................................142
10.14 CACHE MEMORY.................................................................................................................................143
10.14.1 Cache Operations.......................................................................................................................143
10.14.2 Notes for write cache.................................................................................................................143
10.15 AUTOMATIC WRITE REALLOCATION ...................................................................................................143
11. PROTOCOL.......................................................................................................................................... 144
11.1 PIO DATA IN COMMANDS........................................................................................................................145
11.2 PIO DATA OUT COMMANDS.....................................................................................................................145
11.3 NON-DATA COMMANDS...........................................................................................................................147
11.4 DMA DATA TRANSFER COMMANDS.........................................................................................................149
11.5 ULTRA DMA...........................................................................................................................................150
11.6 OTHER TIMINGS......................................................................................................................................153
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Table of Figures
FIGURE 1 MK3006GAL DIMENSIONS................................................................................................................20
FIGURE 2 MK6006GAH/MK4006GAH DIMENSIONS............................................................................21
FIGURE 3 ATA INTERFACE CONNECTOR................................................................................................................................30
FIGURE 4 PASSWORD SET SECURITY MODE POWER-ON FLOW .........................................................................................136
FIGURE 5 USER PASSWORD LOST.......................................................................................................................................137
FIGURE 6 OPTIONAL JUMPER FOR DRIVE0/DRIVE1.........................................................................................................142
ABLE 10.3-1 SIGNAL PIN ASSIGNMENT ................................................................................................................................31
T
TABLE 10.3-2 SIGNAL TREATMENT .......................................................................................................................................32
TABLE 10.6-1 REGISTER MAP................................................................................................................................................49
TABLE 10.6-2 DECODE LOGIC...............................................................................................................................................49
TABLE 10.7-1 DIAGNOSTIC MODE ERROR REGISTER..............................................................................................................51
TABLE 10.7-2 COMMAND CODE............................................................................................................................................57
TABLE 10.8-1 IDENTIFY INFORMATION .................................................................................................................................78
TABLE 10.8-2 IDENTIFY INFORMATION (CONTINUED)...........................................................................................................79
TABLE 10.8-3 IDENTIFY INFORMATION (CONTINUED)...........................................................................................................80
TABLE 10.8-4 IDENTIFY INFORMATION (CONTINUED)...........................................................................................................81
TABLE 10.8-5 IDENTIFY INFORMATION (CONTINUED)...........................................................................................................82
TABLE 10.8-6 SET MAX FEATURES REGISTER VALUES .......................................................................................................91
TABLE 10.8-7 SET MAX SET PASSWORD DATA CONTENT...............................................................................................92
TABLE 10.8-8 DEVICE CONFIGURATION IDENTIFY DATA STRACTURE .................................................................................129
TABLE 10.8-9 DEVICE CONFIGURATION OVERLAY DATA STRACTURE.................................................................................132
TABLE 10.9-1 SECURITY MODE COMMAND ACTIONS ...........................................................................................................138
TABLE 10.12-1 INITIALIZATION OF TASK FILE REGISTERS...................................................................................................141
TABLE 11.6-1 OTHER TIMINGS. ...........................................................................................................................................153
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2. SCOPE
This document describes the specifications of the following model, MK3006GAL
/MK4006GAH/MK6006GAH of 1.8- inch type Winchester disk drives.
.
Factory Number
Sales Number
HDD1442 MK3006GAL
HDD1564 MK4006GAH
HDD1544 MK6006GAH
3. GENERAL DESCRIPTION
The MK3006GAL/MK4006GAH/MK6006GAH which is noted hereinafter as
“ MK3006GAL/MK4006GAH/MK6006GAH” or as “ the drive ” comprises a series of intelligent disk
drives .
The drive features an ATA-2 / 3 / 4 / 5 / 6 interface embedded controller that requires a simplified adapter
board for interfacing to an AT or AT compatible bus. The drives employ Winchester technology and a closed
loop servo control system which have made high recording density of 149.6 M bit/mm
2
bit/in
)(MK3006GAL/MK6006GAH), 131.7 M bit/mm2(85.0G bit/in2)(MK4006GAH)and average access time
of 15 msec with highest reliability of 300,000 hours for MTTF (Mean Time to Failure) possible.
The drive is distinctive for its small and light body.
The
MK3006GAL/MK4006GAH/MK6006GAH consists of an HDA (Head Disk Assembly) and a
printed circuit board. The HDA has a sealed module which contains a disk spindle assembly, a head
actuator assembly and an air filtration system. This HDA adopts Winchester technology which enhances
high reliability. The actuator is a rotary voice coil motor which enables high-speed access.
2
(96.5G
The disk is driven directly by a DC spindle motor. Air filtration is provided by a high performance air filtration
system using both breather and circulation filters.
The drive provides a carriage lock mechanism which is activated automatically upon power down in order to
prevent head/media from being damaged when it is not operating or under shipment.
The printed circuit board which is set externally to the HDA and equipped with all the electric circuitry
necessary to operate the drive except the head drivers . The power supply and interface signal connectors
are mounted on the board. Only the head control IC’s are located within the HDA. The circuitry perform the
following functions:
Read/Write, Task File Control, Spindle Motor Control, Seek and Head Positioning Servo Control, Abnormal
Condition Detection and Shock Sensor Control.
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SAFETY
●There is a certain probability of the drive causing failure including data error or data
loss.
Take preventive steps such as backing up data etc. without exception in order to
■Do not disassemble, remodel or repair.
Disassembly, remodeling or repair may cause injury,
failure, or data loss.
NOTE
prevent loss etc. in cases where data loss may result in loss or damage.
●Do not touch the top cover since application of force to it may cause damage to the
drive.
●Do not stack the drive on another drive or on other parts etc. or stack them on top of
it during storage or transportation.
Shock or weight may cause parts distortion etc..
●Labels and the like attached to the drive are also used as hermetic sealing for
maintenance of its performance.
Do not remove them from the drive.
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4. KEY FEATURES
• High capacity in smallest size
. 1.8 inch-type 2 platters accommodating formatted capacity of 60.0116GB
(MK6006GAH)/40.000GB(MK4006GAH),
1 platter accommodating formatted capacity of 30.0058GB(MK3006GAL).
. Slim ( MK3006GAL: 5 mm in height, MK6006GAH: 8mm in height) and light (MK3006GAL: 51 gram in
weight, MK6006GAH/MK4006GAH: 62 gram in weight) design.
• Fast access and fast transfer rate
. Quick spin up of Spindle Motor 3 sec.
. Average access time 15 msec enabled by optimized balance of a head actuator assembly and an efficiently
designed magnet of rotary VCM.
. Bus transfer rate up to 100 megabytes per second and disk transfer 283 megabits maximum per
second,(MK3006GAL/MK6006GAH),265 megabits maximum per second. (MK4006GAH)
. Read ahead cache and write cache enhancing system throughput.
• Intelligent Interface
.
ATA-2/ATA-3/ATA-4/ATA-5/ATA-6 interface supported.
.
Ultra100 supported.
.
Quick address conversion in translation mode.
.
Translation mode which enables any drive configuration.
.
LBA (Logical Block Address) mode.
. Multi word DMA, Ultra-DMA modes and Advanced PIO mode supported.
• Data integrity
. Automatic retries and corrections for read errors.
. 520 bits computer generated ECC polynomial with 10 bits symbol 24 burst on-the-fly error correction
capability.
• High reliability
. Powerful self- diagnostic capability.
2
. Shock detection with shock sensor circuit for high immunity against operating shock up to 4,900 m/s
( 500 G ).
. Automatic carriage lock secures heads on the ramp with high immunity against non operating shock up to
14,700 m/s
• Low power consumption
• Supply voltage: 3.3V
2
(1,500G).
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. Low power consumption by Adaptive Power Mode Control .
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5. BASIC SPECIFICATION
MODEL MK3006GAL MK6006GAH MK4006GAH
Formatted Capacity
30.0058 60.0116 40.000
( gigabytes )
Number of sectors 58,605,120 117,210,240 78,126,048
Servo design method Sector Servo
Recording method 60/61 ME2PR4+MNP
Recording density
Track / mm (TPI ) 4704 (119.5k) 4331 (110k) typ.
Bit / mm ( BPI ) 31.8k (808k ) max. 29.0k (737k ) max.
Flux change / mm ( FRPI ) 32.3k (821k ) max. 29.5k (750k ) max.
Number of disks 1 2
Number of data heads 2 4
Number of user data cylinders 55,728 38,160
Bytes per sector 512
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6. PERFORMANCE
MK3006GAL MK6006GAH MK4006GAH
Access time ( msec ) <*1>
Track to track seek <*2> 3
Average seek <*3> 15
Max. seek <*4> 26
Rotation speed ( RPM ) 4,200 + 0.1%
Average Latency Time ( msec ) 7.14
Internal Transfer rate ( Mbits / sec )
Host Transfer rate ( Mbytes / sec )
Ultra DMA mode 100
PIO mode 16.6
Sector Interleave 1:1
Track skew Yes
Buffer size ( Mbytes ) 2 2 or 8 2
Cache Read Ahead Cache
Start time <*5>
( Up to Drive Ready)
Recovery time from Stand- by <*5> 3 sec ( Typical )
Command Overhead ( msec ) 1
<*1> Under the condition of normal voltage, 25oC normal temperature and bottom side down.
131.1−283.3 155−265
Write Cache
3.5 sec ( Typical )
20 sec ( Maximum )
20 sec ( Maximum )
<*2> Average time to seek all possible adjacent track without head switching.
<*3> Weighted average time to travel between all possible combination of track calculated as below.
Weighted average access time = [ Sum of P(n)*t(n) ] / [ Sum of P(n) ], n = 1 to N.
Where, N ; Total number of tracks.
P(n); Total number of seek for stroke n [ = 2*(N - n) ].
t(n); Average seek time for stroke n.
Average seek time to seek to stroke n is the average time to 1,000 seeks for stroke n, with random head
switch.
<*4> Average time for 1,000 full stroke seeks with random head switches.
<*5> Typical values are for the condition of normal voltage, 25oC normal temperature and placing bottom
side down. Maximum values are for all conditions specified in this document.
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7. POWER REQUIREMENTS
7.1 Supply Voltage
Allowable voltage 3.3V + 5%
Allowable noise/ripple 70 mV p-p or less
(note 1) When DC power is interrupted,+3.3V voltage drop must be greater than or equal 0V.
7.2 Power Consumption
Average(note 1)
MK3006GAL／MK6006GAH／MK4006GAH
Start 1.2 W Maximum
Seek (note 2) 1.1 W Typical
Read / Write(note 3) 1.1 W Typical
Active idle (note 4 ) 0.4 W Typical
Low power idle (note 5) 0.3 W Typical
Stand- by (note 6) 0.12 W Typical
Sleep 0.07 W Typical
(note 1) Under normal condition ( 25oC, 101.3 kPa ( 1,013 mb ) ) and 3.3V +
(note 2) The seek average current is specified based on three operations per 100 ms.
(note 3) The read/write current is specified based on three operations of 63 sector read/write per 100 ms.
(note 4) Motor is rotating at normal speed but none of Read, Write or Seek is executed.
(note 5) Motor is rotating at normal speed but heads are unloaded on the ramp.
(note 6) Motor is not rotating and heads are unloaded on the ramp.
0%.
7.3 Energy Consumption Efficiency
Energy consumption efficiency (W/GB) Classification
Power consumption at Low power idle / Capacity
MK3006GAL
MK4006GAH 0.0075 E
MK6006GAH 0.005 E
Energy consumption efficiency is calculated in accordance with the law regarding efficiency of energy
consumption
:Energy saving law,1979 law number 49.
Calculation of Energy consumption is dividing consumed energy by the capacity.
The consumed energy and capacity shall be measured and specified by the Energy saving low.
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0.010
D
8. MECHANICAL SPECIFICATIONS
8.1 Dimension and weight
MK3006GAL MK6006GAH/MK4006GAH
Width (mm)
0.15 8.0 + 0.15
Height (mm)
Depth (mm)
Warpage (mm)
Interconnected area
Width (shorter side)
Depth (longer side)
Substrate area
(thickness including warpage)
Weight 51 max. 62 max.
Figure 1 and Figure 2 show an outline of the drive.
5.0 +
5.35 max.
54.0 ±0.2
78.5±0.3
0.15 max.
0.35 max.
8.35 max.
8.2 Drive Orientation
The drive can be installed in all axes (6 directions).
8.3 Mounting Instructions
SAFETY
●Take anti-static measures in order to avoid damage to the drive when handling it.
The drive uses parts susceptible to damage due to ESD (electrostatic discharge).
Wear ESD proof wrist strap in accordance with the usage specified when handling
a drive that is not in an anti-static protection bag.
●Extreme shock to the drive may cause damage to it, data corruption, etc..
Do not subject the drive to extreme shock such as dropping, upsetting or crashing
against other objects.
NOTE
●Do not place objects which generate magnetic fields such as magnets, speakers,
etc. near the drive.
Magnetism may cause damage to the drive or data loss.
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8.3.1 Installation
1) The drive should be interconnected of mounted carefully on the surface of 0.1mm or less flatness to avoid
excessive distortion.
2) The drive can be easily damaged by shocks. In order to prevent the damege, avoid giving shock to the
drive.
3) Don’t apply any force to the top cover.
4) The drive contains several parts which may be easily damaged by ESD(Electric Static Discharge). Avoid
touching the interface connector pins and surface of PCB.
5) The temperature of top cover and the base must always be kept under 65°C to maintain the required
reliability. (If the drive runs continuousely or spins-up frequently, the temperature of the top cover may rise
to 15°C maximum. If the drive is used in ambient temperature of 50 °C or more, it should be kept where
adequate ventilation is available to keep the temperature of top cover under 65°C)
6) Be careful when removing the drive from the host device. The drive may have heated up during operation.
7) Do not disassemble, modify or repair.
8) A rattle heard when the drive is moved is not a sign of failure.
9) Provision for tying the DC logic ground and the chassis ground together or for separating these ground is
user specific.
Agreeable locations of chassis ground are in Figure 1 and Figure 2.
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m
Figure 1
MK3006GAL Dimensions
UNIT: m
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Figure 2
MK6006GAH/MK4006GAH Dimensions
UNIT: mm
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9. ENVIRONMENTAL LIMITS
9.1 Temperature and Humidity
9.1.1 Temperature
Operating 5oC- 60oC
Gradient 15oC / Hour maximum
Non- operating - 20oC- 65oC
Gradient 15oC / Hour maximum
Under shipment - 40oC- 70oC
Gradient 30oC / Hour maximum
( Packed in Toshiba’s original shipping package. )
The temperature of top cover and base must be kept under 65℃ at any moment to maintain the desire reliability.
9.1.2 Humidity
Operating 8%- 90% R.H. ( No condensation. )
Non- operating 8%- 90% R.H. ( No condensation. )
Under shipment 5%- 90% R.H. ( Packed in Toshiba’s original shipping package. )
Max. wet bulb 29o
C (Operating)
40oC (Non- operating)
9.2 Vibration
Operating 4 mm p-p displacement.
Non operating 10 mm p-p displacement.
9.3 Shock
Operating 4,900 m/s2 ( 500G )
Non- operating 14,700 m/s2 ( 1500G ) 1 msec half sine wave
Under shipment 70 cm free drop
5-15 Hz
No unrecoverable error.
19.6 m/s
15- 500 Hz
Sine wave sweeping 1 oct./ minute
No unrecoverable error.
5-15 Hz
No unrecoverable error.
49 m/s
15- 500 Hz
Sine wave sweeping 1 oct./ minute
No unrecoverable error.
2 msec half sine wave
Repeated twice maximum / second
No unrecoverable error.
No unrecoverable error.
No unrecoverable error.
Apply shocks in each direction of the drive’s three
mutually perpendicular axes, one axis at a time.
( Packed in Toshiba’s original shipping package. )
2
( 2.0G )
2
( 5.0G )
Repeated twice maximum / second
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9.4 Altitude
Operating - 300 m to 3,000 m
Non operating - 400 m to 15,000 m
9.5 Acoustics（Sound Power）
MK3006GAL MK6006GAH/
MK4006GAH
16dB 18dB For idle mode ( Spindle in rotating ).
Randomly select a track to be sought in such a way thatevery track
has equal probability of being selected.
Seek rate(n
) is defined by the following formura:
s
n
= 0.4 / ( tT = tL )
22dB 24dB
s
t
is published time to seek from one randam track to another
T
without including rotational latency;
t
is the time for the drive to ratate by half a revolution.
L
Measurements are to be taken in accordance with ISO 7779.
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p
C
/
9.6 Safety Standards
The drive satisfies the following standards .
MK3006GAL MK6006GAH/MK4006GAH
Underwriters Laboratories
Canadian Standard Association
TUV Rheinland
Bureau of Standards,Metrology
and Ins
ection
Ministry of Information and
ommunication
(Note 1) Marks of Ministory of Information and Communication
(UL) 1950
(CSA)C22.2 No.950
EN 60 950
D33003
(Note1)
Made in
Japan
Made in
Philippines
Made in
China
Made in
Indonesia
MK3006GAL MK6006GAH
MK3006GAL
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-05
TOSHIBA CORPORATION
MK3006GAL
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-05
TOSHIBA CORPORATION
MK3006GAL
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-05
TOSHIBA CORPORATION
MK3006GAL
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-05
TOSHIBA CORPORATION /
MK4006GAH
Made in
Japan
Made in
Philippines
Made in
China
Made in
Indonesia
MK4006GAH
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-08
TOSHIBA CORPORATION
MK4006GAH
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-08
TOSHIBA CORPORATION
MK4006GAH
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-08
TOSHIBA CORPORATION
MK4006GAH
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-08
TOSHIBA CORPORATION /
MK6006GAH
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-06
TOSHIBA CORPORATION
MK6006GAH
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-06
MK6006GAH
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-06
TOSHIBA CORPORATION
MK6006GAH
E-H011-04-2071(B)
TOSHIBA CORPORATION
2004-06
TOSHIBA CORPORATION
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EMC Adaptability
The drive satisfies the following standards .
MK3006GAL MK6006GAH/MK4006GAH
EN5008M1-E1
EN50081-1
EN55024
EN55022 : 1998 Class B
EN61000-3-2 : 1995
EN61000-3-3 : 1995
EN61000-4-2 : 1995
EN61000-4-3 : 1995
ENV50204 : 1995
EN61000-4-4 : 1995
EN61000-4-5 : 1995
EN61000-4-6 : 1996
EN61000-4-11 : 1994
9.7 Magnetic Fields
The disk drive shall work without degradation of the soft error rate under the following Magnetic Flux Density
Limits at the enclosure surface.
MK3006GAL/
MK6006GAH/MK4006GAH
0.6mT(6Gauss)
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10. RELIABILITY
A failure is defined as an inability of the drive to perform its specified function described in the requirements
of this document when being operated under the normal conditions or conditions specified in this document.
However , damages caused by operation mistake, mishandling, accidents, system errors and other
damages that can be induced by the customers are not defined as failure.
.
10.1 Error Rate
10.1.1 Non- Recoverable Error Rate
1 error per 10
The defective sectors allocated to the spare locations in the factory are not counted in the error rate.
10.1.2 Seek Error Rate
1 error per 106 seeks
A seek error is a positioning error recoverable by a retry including recalibration.
13
bits read
10.2 Mean Time to Failure (MTTF)
A failure means that the drive can not execute the function defined in this document under the nominal
temperature, humidity and the other conditions specified in this document . Damages caused by operation
mistake, mishandling, system failure and other damages occurred under the conditions which are not
described in this document are not considered as the failure.
MTTF 300,000 hours
Conditions
Power on hours 2,800 hours ( 200 days x 14 hours ) / year)
Operating hours 600 hours ( 200 days x 3 hours ) / year)
Seek hours 1.30 x 106 seeks / month
Number of load / unload 70 times / hour ( 60,000 times / year )
Environment
Normal ( 25oC, 101.3 kPa ( 1,013 mb ) )
10.3 Product Life
5 years or 20,000 power on hours whichever comes earlier
10.4 Repair
A defective drive should be replaced. Parts and subassemblies should not be repaired individually .
10.5 Preventive Maintenance (PM)
No preventive maintenance is required.
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10.6 Load/Unload
Be sure to issue and complete the following commands for unloading before cutting off the power
supply.
Following table shows the specification for normal load/unload cycles.
Load/unload cycle (Times) Environment
600,000 Room temperature
300,000 Operational temperature range
Unload is executed by the following commands :
・Standby
・Standby Immediate
・Sleep
・Hard reset
Load/Unload is also executed as one of the idle modes of the drive.
If the power supply is cut when the head is on a media, Emergency Unload is performed by routing
the back-EMF of SPM to the voice coil. In this case, Emergency Unload is performed 20,000 times
maximum. Emergency Unload should be used only when the host-system cannot perform normal
operation.
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11. HOST INTERFACE
Related Standards
Information technology - AT Attachment Interface with Extensions (ATA-2)
X3T10.279-199x
Information technology - AT Attachment-3 Interface (ATA-3)
X3T10/2008D Revision 6 October 26, 1995
Information technology - AT Attachment with Packet Interface Extension (ATA -4)
T13/1153D Revision 17 October 30, 1997
Information technology - AT Attachment with Packet Interface-5 Interface-5 (ATA-5)
T13/1321D Revision 2 December 13, 1999
Information technology - AT Attachment with Packet Interface-6 (ATA-6)
T13/1410D Revision 3b February 26, 2002
11.1 Cabling
11.1.1 Interface Connector
Drive side
connector
Recommended host side
connector
DDK Ltd, MCD-D50SA-3
DDK Ltd, MCD-D50P*-X
* : B, C, D the difference of connector height
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11.2 Electrical specification
11.2.1 Cable length and capacitance
0.46m MAX 35pF MAX
11.2.2 DC input/output Characteristics
11.2.2.1 Input
item Unit value
voltage high (note 1) V 2.0 to 5.5
low V -0.3 to 0.8
leak current
As non-connected logic voltage, input voltage level is from -0.3V to 0.5V.
(note 1) The max. input range of signal is from -0.3V to 5.5V .
(note 2) Except for signal lines pulled up as shown in Table 10.3.3-1
µA
+ 10 (note 2)
11.2.2.2 Output
item unit value Note
voltage high V 2.4 min. IOH = - 1mA
low V 0.4 max. IOL = 4mA
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11.3 Interface connector
11.3.1 ATA interface connector
UNIT:mm
Figure 3 ATA interface connector
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