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TOSHIBA Zener Diode Silicon Epitaxial Type
CRY62~CRZ47
CRY62~CRZ47
Use in Communication, Automation and
Measurement Equipment
Constant Voltage Regulation
Transient Suppressors
l Average power dissipation: P = 0.7 W
l Zener voltage: VZ = 6.2~47 V
l Suitable for compact assembly due to small surface-mount package
“S−FLATTM” (Toshiba package name)
Maximum Ratings
Characteristic Symbol Rating Unit
Power dissipation P 700 mW
Junction temperature T
Storage temperature range T
(Ta = 25°C)
−40 ~ 150 °C
−40 ~ 150 °C
stg
j
Standard Soldering Pad
Unit: mm
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 3-2A1A
Weight: 0.013 g (typ.)
1.2
1.2
2.8
1
2002-08-29
CRY62~CRZ47
y
Marking Following Indicates
the Date of Manufacture
CRY62~CRY91
Lot No.
0 1 2 3 4
6 2
Cathode mark
CRZ10~CRZ47
Cathode mark
Type Code (e.g., CRY62)
Lot No.
10
Type Code (e.g., CRZ10)
Month of
manufacture
Year of
manufacture
Month of
manufacture
Year of
manufacture
January to December
are denoted by letter A
to L respectivel
Last decimal digit of
the year of
manufacture
January to December
are denoted by letter A
to L respectively.
Last decimal digit of
the year of
manufacture
.
5 6 7 8 9
0 1 2 3 4
5 6 7 8 9
2
2002-08-29
CRY62~CRZ47
Electrical Characteristics
Zener Voltage
Product
No.
CRY62 5.6 6.2 6.8 10 60 10 2 3 1.0 0.2 10 3.0
CRY68 6.2 6.8 7.4 10 60 10 3 4 1.0 0.2 10 3.0
CRY75 6.8 7.5 8.3 10 30 10 4 5 1.0 0.2 10 4.5
CRY82 7.4 8.2 9.0 10 30 10 4 6 1.0 0.2 10 4.9
CRY91 8.2 9.1 10.0 10 30 10 5 8 1.0 0.2 10 5.5
CRZ10 9.0 10.0 11.0 10 30 10 6 9 1.0 0.2 10 6.0
CRZ11 9.9 11.0 12.1 10 30 10 7 11 1.0 0.2 10 7.0
CRZ12 10.8 12.0 13.2 10 30 10 8 13 1.0 0.2 10 8.0
CRZ13 11.7 13.0 14.3 10 30 10 9 14 1.0 0.2 10 9.0
CRZ15 13.5 15.0 16.5 10 30 10 11 17 1.0 0.2 10 10.0
Min
V
Z
(V)
Typ. Max
(Ta = 25°C
Measure-
ment
Current
I
Z
(mA)
)
Zener
Impedance
r
d
(Ω)
Max
Measure-
ment
Current
IZ
(mA)
Temperature
Coefficient
of Zener
Voltage
αT
(mV / °C)
Typ. Max Max
VF
(V)
Forward
Voltage
Measure
-ment
Current
IF
(A)
IR
(µA)
Max
Reverse
Current
Measure-
Voltage
ment
V
(V)
R
CRZ16 14.4 16.0 17.6 10 30 10 12 19 1.0 0.2 10 11.0
CRZ18 16.2 18.0 19.8 10 30 10 14 23 1.0 0.2 10 13.0
CRZ20 18.0 20.0 22.0 10 30 10 16 26 1.0 0.2 10 14.0
CRZ22 19.8 22.0 24.2 10 30 10 18 28 1.0 0.2 10 16.0
CRZ24 21.6 24.0 26.4 10 30 10 20 32 1.0 0.2 10 17.0
CRZ27 24.3 27.0 29.7 10 30 10 23 36 1.0 0.2 10 19.0
CRZ30 27.0 30.0 33.0 10 30 10 25 40 1.0 0.2 10 21.0
CRZ33 29.7 33.0 36.3 10 30 10 26 41 1.0 0.2 10 26.4
CRZ36 32.4 36.0 39.6 9 30 9 28 45 1.0 0.2 10 28.8
CRZ39 35.1 39.0 42.9 8 35 8 30 48 1.0 0.2 10 31.2
CRZ43 38.7 43.0 47.3 7 40 7 33 53 1.0 0.2 10 34.4
CRZ47 42.3 47.0 51.7 6 65 6 38 60 1.0 0.2 10 37.6
3
2002-08-29
CRY62~CRZ47
Ta m a x – P
160
140
120
100
80
60
40
temperature Ta max (°C)
Maximum allowable ambient
20
0
0 0.6 0.2 0.4 0.8 1.0
Device mounted on a glass-epoxy
board
Soldering land: 6 mm ´ 6 mm
Non-repetitive peak reverse
– tW
P
1000
500
300
(W)
RSM
100
50
30
10
power dissipation P
5
3
0.01 1 3 10
Recommende d
RSM
P
tW
Rectangular pulse
Ta = 25°C
0.1 0.3 0.03
Pulse width tW (ms)
RSM
Power dissipation P (W)
25
20
CRY62~CRZ27
=
T – VZ
(typ.)
40
CRZ30~CRZ47
=
T – VZ
(typ.)
(mV/°C)
T
15
10
5
Temperature coefficient of
zenner voltage =
0
0 20 4 12 24 28
8 16
Zenner voltage VZ (V)
35
(mV/°C)
T
30
Temperature coefficient of
zenner voltage =
25
26 46 30 38 50
34 42
Zenner voltage VZ (V)
– t
r
10000
(1) Device mounted on a ceramic board
Soldering land: 2 mm ´ 2 mm
(2) Device mounted on a glass-epoxy board
1000
Soldering land: 6 mm ´ 6 mm
100
(°C/W)
th (j-a)
r
10
th (j-a)
(2)
(1)
Transient thermal impendance
1
0.001 0.01 0.1 100 1 10
Time t (s)
4
2002-08-29
CRY62~CRZ47
A
RESTRICTIONS ON PRODUCT USE
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
000707EA
5
2002-08-29
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