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TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CRS08
CRS08
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
· Forward voltage: V
· Average forward current: I
· Repetitive peak reverse voltage: V
· Suitable for compact assembly due to small surface-mount package
TM
“S−FLAT
” (Toshiba package name)
Maximum Ratings
Characteristics Symbol Rating Unit
Repetitive peak reverse voltage V
Average forward current I
Peak one cycle surge forward current
(non-repetitive)
Junction temperature Tj -40~125 °C
Storage temperature T
= 0.36 V (max)
FM
F (AV)
(Ta ==== 25°C)
= 1.5 A
RRM
F (AV)
I
FSM
= 30 V
RRM
30 (50 Hz) A
stg
30 V
1.5 (Note) A
-40~150 °C
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 3-2A1A
Note: Tℓ = 86°C: Rectangular waveform (a = 180°C), VR = 15 V
Weight: 0.013 g (typ.)
Electrical Characteristics
Characteristics Symbol Test Condition Min Typ. Max Unit
Peak forward voltage
Repetitive peak reverse current
Junction capacitance Cj VR = 10 V, f = 1.0 MHz ¾ 90 ¾ pF
Thermal resistance (junction to ambient) R
Thermal resistance (junction to lead) R
(Ta ==== 25°C)
V
IFM = 0.1 A ¾ 0.23 ¾
FM (1)
V
IFM = 1.0 A ¾ 0.32 ¾
FM (2)
IFM = 1.5 A ¾ 0.345 0.36
V
FM (3)
I
V
RRM (1)
V
I
RRM (2)
th (j-a)
¾ ¾ ¾ 20 °C/W
th (j-ℓ)
= 5 V ¾ 50 ¾ mA
RRM
= 30 V ¾ ¾ 1.0 mA
RRM
Device mounted on a ceramic board
(soldering land: 2 mm ´ 2 mm)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm ´ 6 mm)
¾ ¾ 70
¾ ¾ 140
°C/W
V
1
2003-02-17
CRS08
y
Marking Following Indicates the Date of
Manufacture
1 2 3 4
Type Code
Lot No.
0
S8
Cathode mark
Month of
manufacture
Year of
manufacture
January to December
are denoted by letter A
to L respectivel
Last decimal digit of
the year of
manufacture
.
5 6 7 8 9
Standard Soldering Pad
Unit: mm
1.2
1.2
2.8
Handling Precaution
Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier
products. This current leakage and improper operating temperature or voltage may cause thermal runaway.
Please take forward and reverse loss into consideration when you design.
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CRS08
)
10
3
(A)
F
0.03
0.3
0.1
Tj = 125°C
1
75°C
Instantaneous forward current i
0.01
0 0.3 0.1 0.2 0.8 0.6 0.4 0.5 0.7
Instantaneous forward voltage vF (V)
25°C
i
F
– vF
P
0.7
0.6
0.5
0.4
(W)
0.3
F (AV)
P
0.2
0.1
Average forward power dissipation
0
a = 60°
0 0.4 0.8 1.2 2.0 2.41.6
F (AV)
– I
120°
Average forward current I
F (AV)
180°
Rectangular
0° 360°
Conduction angle a
F (AV)
DC
waveform
a
(A)
140
Tℓ max – I
120
100
80
a = 60°
60
Rectangular
Tℓ MAX (°C)
Maximum allowable lead temperature
Rectangular
waveform
waveform
40
a
a
a
20
360° 0°
I
Conduction angle a
0 0.4 1.2 1.6 2.0 2.40.8
F (AV
VR = 15 V
Average forward current I
120°
F (AV)
180°
F (AV)
DC
(A)
30000
① Device mounted on a ceramic
10000
(°C/W)
th (j-a)
r
Transient thermal impedance
board
Soldering land: 2 mm ´ 2 mm
② Device mounted on a glass-epoxy
board
Soldering land: 6 mm ´ 6 mm
1000
100
10
1
1 10 100 1000 10000 100000
– t
r
th (j-a)
Time t (ms)
②
①
1000
500
300
(pF)
j
Cj – VR (typ.)
f = 1 MHz
Ta = 25°C
Surge forward current
(non-repetitive)
40
(A)
30
FSM
Ta = 25°C
f = 50 Hz
100
50
30
Junction capacitance C
20
10
Peak surge forward current I
10
1
3 10 30 5 50 100
Reverse voltage VR (V)
3
0
10 1 3 30 100 5 50
Number of cycles
2003-02-17
CRS08
I
1000
Pulse test
100
(mA)
R
10
1
Reverse current I
0.1
0.01
0 20 120 80 40 60 100
Junction temperature Tj (°C)
– Tj (typ.)
R
VR = 30 V
3 V
5 V
20 V
10 V
140
P
Average reverse power dissipation
4.8
4.0
3.2
(W)
2.4
R (AV)
P
1.6
0.8
Rectangular
waveform
360°
0°
V
R
Conduction angle a
Tj = 125°C
0
4
8 0 16 12 24 20 28
Reverse voltage VR (V)
R (AV)
60°
120°
– V
240°
180°
R
300°
(typ.)
DC
4
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CRS08
A
RESTRICTIONS ON PRODUCT USE
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
000707EA
5
2003-02-17
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