TOSHIBA 50XP37C, 50XP37E, 50XP37F, 50XP37H Service Manual

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SERVICE MANUAL

Plasma Display

50XP37C

FILE NO. 010-200328

50XP37E

50XP37F

50XP37H

Mar. 2004 (YC)

50XP37

Page Page

1 Applicable signals 3 2 Safety Precautions

2.1. General Guidelines

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 4 About lead free solder (PbF) 5 PCB Structure sheet of GPH6D2 chassis 6 Service Hint 7 Location of Lead Wiring 8 Adjustment Procedure

8.1. Driver Set-up

8.2. Initialization Pulse Adjust

8.3. P.C.B. (Printed Circuit Board) exchange

8.4. Adjustment Volume Location

8.5. Test Point Location

9 Service mode

9.1. CAT (computer Aided Test) mode

9.2. IIC mode structure (following items value is sample data.)

10 Alignment

10.1. 625i/625p panel white balance

10.2. PC/RGB panel white balance

10.3. HD panel white balance

11 Trouble shooting guide

11.1. Self Check

11.2. No Power (Power shut down)

11.3. No Picture

11.4. Local screen failure

12 Conductor Views

12.1. PF-Board

12.2. P-Board

12.3. HX-Board

12.4. HV-Board

12.5. HZ-Board

12.6. HT-Board

12.7. J-Board

12.8. D-Board

12.9. C1-Board

12.10. C2-Bo ard

12.11. C3-Bo ard

12.12. C4-Bo ard

12.13. C5-Bo ard

12.14. C6-Bo ard

12.15. SC-Bo ard

12.16. SU-Bo ard

12.17. SD-Bo ard

10 11 12 13 13

16 18

20 20 21 22

23 25

28 29

30 31 32 34 37

38 39 40 41 42 43 45 47

5 6 7 8 9

12.18. SS, SS2 and SS3-B oard

12.19. Z- Board

12.20. V1, S1 and H3-Bo ard

13 Replacementpanelhandlingprecautionsandreplacement

procedure

14 PartsLocation

15 Chassis and Cabinet Replacement Parts List 16 Specifications

Appendix

Block and Schematic Diagrams

50 51

55 57

END

– 2 –

1 Applicable signals

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– 3 –

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2 Safety Precautions

2.1. General Guidelines

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

2.1.1. Leakage Current Cold Check

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1MW and 5.2MW.

When the exposed metal does not have a return path to

the chassis, the reading must be

Figure 1

2.1.2. Leakage Current Hot Check (See

Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

– 4 –

3 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

50XP37

– 5 –

50XP37

4 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

stamped on the back of PCB.

– 6 –

5 PCB Structure sheet of GPH6D2 chassis

Board Name Function Remarks

D Digital Signal Processor 1

J Slot Interface & SYNC processor 1

Z Audio out, DC-DC converter SS Sustain Out 1 SC Scan out 1 SU Scan connection (Upper) 1 SD Scan connection (Lower) 1 C1 Data Drive (Upper Right) C2 Data Drive (Upper Center) C3 Data Drive (Upper Left) C4 Data Drive (Lower Left) C5 Data Drive (Lower Center) C6 Data Drive (Lower Right) H3 Speaker terminal S1 Power switch

SS2 Sustain connection (Upper) SS3 Sustain connection (Lower)

V1 Front SW. & Remote receiver PF Line filter 1

P Power supply 1

HX PC_type_Input terminal

HZ (RTB033) RCA Component Video terminal HV (RTB031) RCA Composite Video terminal HT (RTB032) 21 Pin Scart terminal

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Remarks

1. Recommend PCB´s for initial service for GPH6D2 chassis.

– 7 –

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6 Service Hint

SS3

– 8 –

7 Location of Lead Wiring

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– 9 –

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8 Adjustment Procedure

8.1. Driver Set-up

8.1.1. Item / Preparation

1. Input an APL 100 % white signal.

2. Set the picture controls: Picture mode: Normal White balance: Cool Aspect: 16:9

8.1.2. Adjustments

Adjust driver section voltages referring the panel data on the panel data label.

Name Test Point Voltage Volume Remarks

Vsus TPVSUS

(SS)

Vbk TPVBK (SC) 140V ± 1V R6670 (SC) GND =

Vad TPVAD (SC) -85V ± 1V R6477 (SC) GND =

Ve TPVE (SS) Ve* ± 1V R6770 (SS) GND =

Vda TPVDA (SS) 75V ± 1V R665 (P) GND =

Vlow anode of

D540 (P)

PFC PR401 395V ± 0.5V R443 (P) Hot=PR401,

Vsus* ± 2V R641 (P) GND =

78V ± 0.1V R661 (P) GND =

chassis

Cold= W14 (wire)

*See the Panel label.

– 10 –

8.2. Initialization Pulse Adjust

1. Input a Cross hatch signal.

2. Set the picture controls: Picture mode: Normal White balance: Cool

Adjust the indicated test point for the specified wave form.

Test point Volume Level

T2 TPSC1 (SC) R6557 (SC) 155 ± 10µ Sec

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– 11 –

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8.3. P.C.B. (Printed Circuit Board) exchange

8.3.1. Caution

1. To remove P.C.B. , wait 1 minute after power was off for discharge from electrolysis capacitors.

8.3.2. Quick adjustment after P.C.B. exchange

P.C.B. Name Test Point Voltage Volume Remarks

P Board Vsus TPVSUS (SS) Vsus* ± 2V R641 (P)

Vda TPVDA (SS) 75V ± 1V R665 (P)

SC Board Vad TPVAD (SC) -85V ± 1V R6477 (SC)

Vbk TPVBK (SC) 140 ± 1V R6670 (SC) SS Board Ve TPVE (SS) Ve* ± 1V R6770 (SS) D Board White blance

*See the Panel label.

8.4. Adjustment Volume Location

GND = chassis

8.5. Test Point Location

SS3

– 12 –

9 Service mode

9.1. CAT (computer Aided Test) mode

50XP37

To exit the CAT mode, access the ID mode and switch off the main power.

9.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the remote control.

Subject and item are mentioned on page 16.

To exit the IIC mode, press the R button on the remote control.

– 13 –

50XP37

9.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode then press the Mute button on the remote control more than 5 sec.

Micom software version (IC9705), this version can be upgrade by replacing of IC. Memory data change

To exit the CD mode, press the R button on the remote control.

9.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode then press the Action button on the remote control.

To exit the SD mode, press the R button on the remote control.

– 14 –

9.2. IIC mode structure (following items value is sample data.)

50XP37

– 15 –

50XP37

10 Alignment

10.1. 625i/625p panel white balance

INPUT Alignment menu ProcedureEquipment Setting

1 PC (625i) Color Picture: 1) Find the nearest area to brightness of 10 cd/m2 as Low

Gray Scale Analyzer Normal Sub Adjust light by color sensor. Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/m

Cool

Aspect: PANEL W/B

16:9 G cut off 3) Set G cut off to " 80 ".

Component /RGB-in

Component shown Fig.-02.

High light 75% Sub Adjust

Low light 15% Sub Bright 5) If Sub Bright is changed re-adjust it to set Low light

PANEL W/B

exactly.

B cut off 4) Adjust B and R cut off to set color temperature as R cut off

to 10 cd/m

6)Find 75% of white area by color sensor.

G Drive 7) Set G Drive to " E8 ".

B Drive 8) Adjust B and R Drive to set color temperature R Drive as shown Fig.-02.

9) Repeat procedure 4) to 7) to set both Low light and high light.

PANEL W/B

All Drive 10) Set All Drive to "FC".

PANEL W/B

R,G,B cut off 11) Re-adjust Low light level again.

Color Temp. x y

Cool(Hi) 0.276 0.276

Normal(Mid) 0.288 0.296

Warm(Low) 0.313 0.329

Fig. -02

2 Picture: 1) Change white balance to "Normal".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Normal

PANEL W/B

Aspect: R,G,B Drive

16:9

3 Picture: 1) Change white balance to "Warm".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Warm

PANEL W/B

Aspect: R,G,B Drive

16:9

4 Picture: Picture Menu 1) Change color templature to "Cool".

Normal Sub Adjust

White balance: Sub Bright 2)Re-set Sub bright to "30"

Cool

Aspect:

16:9

– 16 –

Alignment menu ProcedureEquipment Setting

5 Picture:PC (525i) 1) Write down each color temaparature of R,G,B drive and

Normal Cut off data as follows.

Aspect:

16:9

White

White balance:

Cool

Normal

Warm

Balance Cool Normal Warm R Drive G Drive B Drive R Cut off G Cut off B Cut off

2) Input 525i signal.

3) Copy 625i R,G,B drive and cut off data of each white balance mode to 525i position.

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– 17 –

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10.2. PC/RGB panel white balance

INPUT Alignment menu ProcedureEquipment Setting

1 PC (VGA) Color Picture: 1) Find the nearest area to brightness of 10 cd/m2 as Low

Gray Scale Analyzer Normal Sub Adjust light by color sensor. Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/m

Aspect: PANEL W/B

Component /RGB-in

High light 75% Sub Adjust

Low light 15% Sub Bright 5) If Sub Bright is changed re-adjust it to set Low light

Cool

exactly.

16:9 G cut off 3) Set G cut off to " 80 ".

PANEL W/B

B cut off 4) Adjust B and R cut off to set color temperature as

RGB shown Fig.-03.

R cut off

to 10 cd/m

6)Find 75% of white area by color sensor.

PANEL W/B

G Drive 7) Set G Drive to " E8 ".

PANEL W/B

B Drive 8) Adjust B and R Drive to set color temperature

R Drive as shown Fig.-03.

9) Repeat item 4) to 7) to set both Low light and high light.

PANEL W/B

All Drive 10) Set All Drive to "FC".

PANEL W/B

R,G,B cut off 11) Re-adjust Low light level again.

Color Temp. x y

Cool(Hi) 0.276 0.276

Normal(Mid) 0.288 0.296

Warm(Low) 0.313 0.329

Fig. -03

2 Picture: 1) Change white balance to "Normal".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Normal

PANEL W/B

Aspect: R,G,B Drive

16:9

3 Picture: 1) Change white balance to "Warm".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Warm

PANEL W/B

Aspect: R,G,B Drive

16:9

4 Picture: Picture Menu 1) Change color templature to "Cool".

Normal Sub Adjust

White balance: Sub Bright 2)Re-set Sub bright to "30"

Cool

Aspect:

16:9

– 18 –

10.3. HD panel white balance

INPUT Alignment menu ProcedureEquipment Setting

1PC(HD:720i or 1080i) Color Picture: 1) Find the nearest area to brightness of 10 cd/m2 as Low

Gray Scale Analyzer Normal Sub Adjust light by color sensor. Pattern White balance: Sub Bright 2) Adjust Sub bright to set Low light level to 10 cd/m

Cool

Aspect: PANEL W/B

16:9 G cut off 3) Set G cut off to " 80 ".

PANEL W/B

Component /RGB-in

Component shown Fig.-04.

B cut off 4) Adjust B and R cut off to set color temperature as R cut off

High light 75% Sub Adjust

Low light 15% Sub Bright 5) If Sub Bright is changed re-adjust it to set Low light

PANEL W/B

G Drive 7) Set G Drive to " E8 ".

PANEL W/B

R Drive as shown Fig.-04.

exactly.

to 10 cd/m

6)Find 75% of white area by color sensor.

B Drive 8) Adjust B and R Drive to set color temperature

50XP37

9) Repeat item 4) to 7) to set both Low light and high light.

PANEL W/B

All Drive 10) Set All Drive to "FC".

PANEL W/B

R,G,B cut off 11) Re-adjust Low light level again.

Color Temp. x y

Cool(Hi) 0.276 0.276

Normal(Mid) 0.288 0.296

Warm(Low) 0.313 0.329

Fig. -04

2 Picture: 1) Change white balance to "Normal".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Normal

PANEL W/B

Aspect: R,G,B Drive

16:9

3 Picture: 1) Change white balance to "Warm".

Normal PANEL W/B

White balance: R,G,B cut off 2) Repeat procedure 3) to 11) of Cool mode.

Warm

PANEL W/B

Aspect: R,G,B Drive

16:9

4 Picture: Picture Menu 1) Change color templature to "Cool".

Normal Sub Adjust

White balance: Sub Bright 2)Re-set Sub bright to "30"

Cool

Aspect:

16:9

– 19 –

50XP37

11 Trouble shooting guide

11.1. Self Check

1. Self-check is used to automatically check the bus line controlled circuit of the Plasma display.

2. To get into the Self-check mode, press the volume down button on the customer controls at the front of the set, at the same time pressing the OFF-TIMER button on the remote control, and the screen will show :-

If the CCU ports have been checked and found to be incorrect Or not located then " - - " will appear in place of " OK "

11.2. No Power (Power shut down)

11.2.1. Power LED Blinking timing chart

1. Subject Information of LED Flashing timing chart.

2. Contents When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the

defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.

– 20 –

+ 46 hidden pages

TOSHIBA 50XP37C, 50XP37E, 50XP37F, 50XP37H Service Manual

CONTENTS

1 Applicable signals

2 Safety Precautions

2.1. General Guidelines

4 About lead free solder (PbF)

5 PCB Structure sheet of GPH6D2 chassis

6 Service Hint

7 Location of Lead Wiring

8 Adjustment Procedure

8.1. Driver Set-up

8.2. Initialization Pulse Adjust

8.3. P.C.B. (Printed Circuit Board) exchange

8.4. Adjustment Volume Location

8.5. Test Point Location

9 Service mode

9.1. CAT (computer Aided Test) mode

9.2. IIC mode structure (following items value is sample data.)

10 Alignment

10.1. 625i/625p panel white balance

10.2. PC/RGB panel white balance

10.3. HD panel white balance

11 Trouble shooting guide

11.1. Self Check

11.2. No Power (Power shut down)