TOSHIBA 2sj620 Datasheet

Page 1
2SJ620
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (L
2SJ620
Motor Drive Applications
• 4-V gate drive
• Low drain-source ON resistance: R
DS (ON)
• High forward transfer admittance: |Y
• Low leakage current: I
• Enhancement-model: V
= −100 µA (max) (VDS = −100 V)
DSS
= −0.8 to −2.0 V (VDS = −10 V, ID = −1 mA)
th
Maximum Ratings
Characteristics Symbol Rating Unit
Drain-source voltage V
Drain-gate voltage (R
Gate-source voltage V
Drain current
Drain power dissipation (Tc = 25°C) P
Single pulse avalanche energy (Note 2)
Avalanche current I
Repetitive avalanche energy (Note 3) EAR 12.5 mJ
Channel temperature Tch 150 °C
Storage temperature range T
(Ta ==== 25°C)
= 20 kΩ) V
GS
DC (Note 1) I
Pulse (Note 1) I
Thermal Characteristics
= 63 mΩ (typ.)
| = 15 S (typ.)
fs

DSS
DGR
GSS
−18
D
−72
DP
D
E
AS
−18 A
AR
stg
−100 V
−100 V ±20 V
125 W
937 mJ
−55 to150 °C
A
JEDEC ―
JEITA SC-97
TOSHIBA 2-9F1B
Weight: 0.74 g (typ.)
Circuit Configuration
2
-π-MOSV)
Unit: mm
4
Characteristics Symbol Max Unit
Thermal resistance, channel to case R
1.0 °C/W
th (ch-c)
Note 1: Please use devices on condition that the channel temperature
is below 150°C.
Note 2: V
= −50 V, Tch = 25°C (initial), L = 3.56 mH, RG = 25 Ω,
DD
I
= −18 A
AR
Note 3: Repetitive rating: pulse width limited by maximum channel
temperature
This transistor is an electrostatic sensitive device. Please handle with caution.
1
1
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Electrical Characteristics (Ta ==== 25°C)
<
Characteristics Symbol Test Condition Min Typ. Max Unit
2SJ620
Gate leakage current I
Drain cut-OFF current I
Drain-source breakdown voltage V
Gate threshold voltage Vth V
Drain-source ON resistance R
Forward transfer admittance
Input capacitance C
Reverse transfer capacitance C
Output capacitance
Rise time
Turn-ON time
Switching time
Total gate charge (gate-source plus gate-drain)
Gate-source charge
Gate-drain (“miller”) charge
Fall time
Turn-OFF time
V
GSS
V
DSS
(BR) DSS
DS (ON)
Y
V
fs
2900
iss
480
rss
C
oss
t
25
r
t
45
on
t
25
f
t
off
Q
g
Q
gs
Q
gd
= ±16 V, VDS = 0 V ±10 µA
GS
= −100 V, VGS = 0 V
DS
I
= −10 mA, VGS = 0 V
D
= −10 V, ID = −1 mA
DS
V
= −4 V, ID = −9 A 85 120
GS
= −10 V, ID = −9 A 63 90
V
GS
= −10 V, ID = −6 A 7 15 S
DS
= −10 V, VGS = 0 V, f = 1 MHz
V
DS
0 V
V
GS
−10 V
Duty
∼
V
−
DD
Source-Drain Ratings and Characteristics
4.7 Ω
1%, t
=
−80 V, V
= 10 µs
w
= −10 V, ID = −18 A
GS
(Ta ==== 25°C)
= −9 A
I
D
V
DD
= 5.55 Ω
L
R
∼
−50 V
−
V
100 V
−
0.8
−
1000
OUT
170
140
90   50
100 µA
−
2.0 V
−
mΩ
pF
ns
nC
Characteristics Symbol Test Condition Min Typ. Max Unit
Continuous drain reverse current (Note 1) I
Pulse drain reverse current (Note 1) I
Forward voltage (diode) V
Reverse recovery time t
Reverse recovery charge Qrr
Marking
※ Lot Number
J620
※
Type
−18 A
DR
DRP
I
DSF
220 µs
rr
= −18 A, VGS = 0 V 1.7 V
DR
= −18 A, VGS = 0 V,
I
DR
/dt = 50 A/µs
dI
DR
−72 A
0.97 µC
Month (starting from alphabet A)
Year (last number of the christian era)
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2SJ620
−20
(A)
D
Drain current I
Common source Tc = 25°C pulse test
−16
−12
−8
−4
0
0 −0.4 −0.8 −1.2 −1.6 −2.0
Drain-source voltage VDS (V)
−20
(A)
D
Drain current I
Common source V
= −10 V
DS
pulse test
−16
−12
−8
−4
0
0 −2 −3 −4 −5 −1
Gate-source voltage VGS (V)
100
(S)
fs
Common source
V
= −10 V
DS
50
pulse test
30
10
5
3
Forward transfer admittance Y
2
−1
Drain current ID (A)
25
100
−5 −10 −30 −50 −3
– VDS
I
D
−8
−6
– VGS
I
D
Y
 − I
fs
Tc = −55°C
−10
Tc = −55°C
D
100
−4.5
I
– VDS
−5
−4.5
D
Common source Tc = 25°C pulse test
−4
−3.5
−3
V
= −2.5 V
GS
−50
−4
−40
−3.5
−3
−2.5
V
= −2 V
GS
(A)
D
−30
−20
Drain current I
−10
0
0 −4 −8 −12 −16 −20
−6
−10
−8
Drain-source voltage VDS (V)
– V
V
DS
−3.0
−2.5
(V)
DS
−2.0
−1.5
−1.0
−0.5
Drain-source voltage V
0
0 −8 −12 −16 −4
−2 −6 −10 −14
Gate-source voltage VGS (V)
GS
Common source Tc = 25°C
pulse test
I
= −18 A
D
−9
−4.5
− I
D
V
= −4 V
GS
−10
−100
25
−100
R
0.3 Common source
Tc = 25°C
Pulse test
0.1
(Ω)
DS (ON)
R
0.03
Drain-source on resistance
0.01
−1 −10
DS (ON)
−3 −30
Drain current ID (A)
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2SJ620
0.20
(Ω)
0.15
DS (ON)
Common source
pulse test
0.10
Drain-source on resistance R
V
= −4 V
GS
0.05
V
= −10 V
GS
0
−80 −40 0 40 80 160 120
Case temperature Tc (°C)
50000
30000
10000
5000
3000
Capacitance – V
1000
Capacitance C (pF)
500
Common source
300
V
GS
f = 1 MHz Tc = 25°C
100
= 0 V
−0.3 −3 −30
Drain-source voltage VDS (V)
200
(W)
150
D
DS (ON)
− Tc
R
DS
−1 −0.1 −100 −10
− Tc
P
D
I
= −18 A
D
−4.5
− V
DS
Common source Tc = 25°C
pulse test
−9
I
V
DR
GS
= 0, 1 V
−100
−50
−30
(A)
DR
−10
−5
−3
−1.0
Drain reverse current I
−0.5
−0.3
0 0.4 1.2 1.6 2.0 2.4 0.8
−10
−5
−1
Drain-source voltage VDS (V)
− Tc
V
th
−4
(V)
−3
th
C
iss
C
oss
C
rss
−2
−1
Gate threshold voltage V
0
−80 −40
0 40 80 120 160
Case temperature Tc (°C)
Common source V I
D
pulse test
= −10 V
DS
= −1 mA
−200
(V)
−120
DS
Dynamic input/output characteristics
Common source I
= −18 A
D
Tc
= 25°C
pulse test
VGS
−16
(V)
−12
GS
V
−40
DD
= −80 V
−8
−4
Gate-source voltage V
0
100
50
Drain power dissipation P
0
0
40 80 120 160
Case temperature Tc (°C)
Drain-source voltage V
−80
−40
VDS
−20
0
0
40 80 120 160 200
Total gate charge Qg (nC)
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2SJ620
10
3
1
Duty = 0.5
th (ch-a)
0.3
/R
th (t)
r
Normalized transient thermal impedance
0.2
0.1
0.1
0.05
0.02
0.03
0.01
10 µ 100 µ 1m 10m 100m 1 10
0.01
Single pulse
Pulse width tw (S)
−1000
Safe operating area
−100
ID max (pulsed) *
100 µs *
(A)
D
−10
ID max (continuous)
1 ms *
DC operation
Tc = 25°C
*: Single nonrepetitive pulse
−1
Drain current I
Tc = 25°C
Curves must be derated linearly with increase in temperature.
−0.1
−0.1
V
max
DSS
−1
Drain-source voltage VDS (V)
−10 −100 −1000
− t
r
th
w
PDM
Duty = t/T R
th (ch-c)
t
T
= 1.0°C/W
– Tch
E
1000
800
(mJ)
AS
600
400
Avalanche energy E
200
0
25
50 75 100 125 150
Channel temperature (initi al) Tch (°C)
AS
B
15 V
−15 V
VDSS
I
AR
V
V
DD
DS
Test circuit Wave form
R
= 25 Ω
G
V
= −50 V, L = 3.56 mH
DD
5
1
Ε
AS
2
B
2
IL
⋅⋅⋅=
  
B
VDSS
VDSS
  
−
V
DD
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2SJ620
A
RESTRICTIONS ON PRODUCT USE
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others.
• The information contained herein is subject to change without notice.
000707EA
6
2002-09-11
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