TOREX XP152A12C0MR-G User Manual

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XP152A12C0MR-G
ETR1121_003
Power MOSFET
GENERAL DESCRIPTIO N
The XP152A12C0MR-G is a P-channel Power MOSFET with low on-state resistance and ultra high-speed switching characteristics. Because high-speed switching is possible, the IC can be efficiently set thereby saving energy. In order to counter static, a gate protect diode is built-in. The small SOT-23 p acka
APPLICATIONS
Notebook PCs
Cellular and portable phones
On-board power supplies
Li-ion battery systems
PIN CONFIGURATION/
MARKING
EQUIVALENT CIRCUIT
2 1 2
* x represents production lot number.
e makes high density mounting possible.
GGate
x
SSource DDrain
FEATURES
Low On-State Resistance : :
Ultra High-Speed Switching Gate Protect Diode Built-in Driving Voltage : -2.5V P-Channel Power MOSFET DMOS Structure Small Package : SOT-23 Environmentally Friendly : EU RoHS Compliant, Pb Free
Rds(on) = 0.3Ω@ Vgs = -4.5V Rds(on) = 0.5Ω@ Vgs = -2.5V
PINASSIGNMENT
PRODUCTS PACKAGE ORDER UNIT
XP152A12C0MR SOT-23 3,000/Reel
XP152A12C0MR-G
The “-G” suffix denotes Halogen and Antimony free as well as
being fully RoHS compliant.
BSOLUTE MAXIMUM RATINGS
Drain - Source Voltage Vdss -20 V
Gate - Source Voltage Vgss ±12 V
PARAMETER SYMBOL RA TINGS UNITS
SOT-23 3,000/Reel
Ta = 25
Drain Current (DC) Id -0.7 A Drain Current (Pulse) Idp -2.8 A Reverse Drain Current Idr -0.7 A
Channel Power Dissipation *
Channel T emperature Tch 150
Storage Temperature Tstg -55~150
* When implemented on a ceramic PCB
Pd 0.5 W
1/5
XP152A12C0MR-G
ELECTRICAL CHARACTERISTICS
DC Characteristics
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS
Drain Cut-Off Current Idss Vds= -20V, Vgs= 0V - - -10 μA
Gate-Source Leak Current Igss Vgs= ±12V, Vds= 0V - - ±10 μA
Gate-Source Cut-Off Voltage Vgs(off) Id= -1mA, Vds= -10V -0.5 - -1.2 V
Drain-Source On-State Resistance *1
Forward Transfer Admittance *1 | Yfs | Id= -0.4A, Vds= -10V - 1.5 - S
Rds(on)
Id= -0.4A, Vgs= -4.5V - 0.23 0.30 Ω Id= -0.4A, Vgs= -2.5V - 0.37 0.50 Ω
Ta = 25
Body Drain Diode
Forward Voltage
*1 Effective during pulse test.
Dynamic Characteristics
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS
Input Capacitance Ciss
Output Capacitance Coss
Feedback Capacitance Crss
Switching Characteristics
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS
Turn-On Delay Time td (on)
Rise Time
Turn-Off Delay T ime td (off)
Fall Time tf
Thermal Characteristics
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS
Vf If= -0.7A, Vgs= 0V - -0.8 -1.1 V
Vds= -10V, Vgs=0V
f= 1MHz
Ta = 25
- 180 - pF
- 120 - pF
- 60 - pF
Ta = 25
- 5 - ns
tr - 20 - ns
Vgs= -5V, Id= -0.4A
Vdd= -10V
- 55 - ns
- 70 - ns
2/5
Thermal Resistance
(Channel-Ambience)
Rth (ch-a)
Implement on a ceramic PCB
- 250 - ℃/W
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