TOREX XC9516 User Manual

XC9516 Series

ETR0707-008

Triple Output Power Supply for TFT-LCD

■GENERAL DESCRIPTION

The XC9516 series can offer three different power supplies to TFT-LCD panels. These power supplies consist of a step-up



DC/DC converter for a source driver, positive and negative charge pumps for a gate driver.



This IC has power-on sequences



be used as power-on sequences with adding a P-channel FET as external component. Also, the FET can shut down a path to the power input line when CE pin is low.

■APPLICATIONS

●TFT-LCD panels

●LCD monitors

■

TYPICAL APPLICATION CIRCUITS

VIN

VOUT

VGL

CLcp1

CIN

CE

R3

R4

CDD

CVL

CD

D2D3C1

L1

VIN

CE

CVL

CD

VOUT

FB1

DRV1

AGND

e.g) Components List

V

= 9.2V, VGL = -5.3V, VGH= 12V

OUT

C

= 4.7μF

IN

C

=4.7μF

L1,CL2

, C2 = 0.01μF

C

1

C

= 0.1μF

VL,CD

= 1μF

C

DD

C

Lcp1,CLcp2

C

FB

C

5

= 1μF

= 22pF

= 0.01μF

to keep inrush current as small when output voltage rises. The step-up DC/DC output can

■FEATURES

A Step-up DC/DC Converter and 2 of Charge Pumps (Positive/Negative) Input Voltage Range ： 2.5V ～ 5.5V Maximum Output Voltage ： 19V (DC/DC output) Output Voltage Accuracy ： ±1.5％ Oscillation Frequency ： 300kHz ～ 1.2MHz (Adjustable) External MOSFET Gate Signal Output

： N-Channel Open Drain

Switch Over-Current Protection ： 1.3A Soft-Start Time ： Internally fixed Protection ：

Over Voltage Protection (Step-up DC/DC 21V)

Short-Circuit Protection (

Short-Circuit Protection (Positive and Negative Charge Pump)

Thermal Shutdown (150℃) UVLO (1.87V) Operating Ambient Temperature ： -40℃～+85℃ Package ： QFN-20 Environmentally Friendly ： EU RoHS Compliant, Pb Free

■TYPICAL PERFORMANCE

LX

PGND

ROSC

SWB

CP2SWB

DRV2

FB2

D1（SD）

CFB

FB

R1

R2

ROSC （R9）

C5（R7）

R8

R10

Tr2

C2

D4

D5

R5

R6

= 820 kΩ

R

1

= 100 kΩ

R

2

R

= 390 kΩ

3

= 300 kΩ

R

4

R

= 820 kΩ

5

= 75 kΩ

R

6

R

= 300 kΩ

8

（R9）= 130 kΩ

R

OSC

= 51 kΩ

R

10

CHARACTERISTICS

VOUT

CL1

●Efficiency vs. Output Current

100

90

80

VSRC

CLcp2

CL2

Tr1

VGH

70

60

50

40

Efficiency:EFFI(%)

30

20

10

0

1 10 100 1000

XC9516 Efficiency

VIN=5.5V

☆GreenOperation Compatible

VIN=2.5V

Iout[mA]

VIN=3.3V

VIN=4.0V

Step-up DC/DC)

VIN=VCE, VOUT=9.0V FOSC=1MHz Icp1=-1mA, Icp2=1mA

VIN=4.0V

VIN=5.5V

2.5V

3.3V

4.0V

5.5V

1/25

XC9516 Series

■PIN CONFIGURATION

*1 The dissipation pad：AGND Level

（If the pad needs to be connected to other pins, it should be considered about the level of pad voltage.）

■PIN ASSIGNMENT

PIN NUMBER

QFN-20

1 DRV1 Negative Charge Pump Driver Output 2 CP2SWB Positive Charge Pump for Output Control 3 FB1 FB Pin for Negative Charge Pump 4 CE Chip Enable Pin 5 FB FB Pin for Step-Up DC/DC Converter 6 ROSC Frequency Setting 7 NC No Connection 8 VIN Power 9 CD Short Protection Delay Capacitor Connection

10 AGND Analog Ground

11 FB2 FB Input for Positive Charge Pump 12 CVL Internal Power Capacitor Connection 13 SWB Step-Up DC/DC Converter Output Control 14 V 15 DRV2 Positive Charge Pump Driver Output

16 LX Driver Output Pin for Step-Up DC/DC Converter

17 LX Driver Output Pin for Step-Up DC/DC Converter

18 NC No Connection

19 PGND Power Ground Pin for Driver

20 PGND Power Ground Pin for Driver

■LOGIC CONDITION

PIN NAME LOGIC CONDITION

CE PIN

Voltage is based on VSS（GND=AGND=PGND）

■FUNCTION CHART

CONDITIONS IC OPERATION

L OFF(Stand-by) H ON

IC operation is unstable when CE opens so that these pins shall not be left open outside.

NC

LX

PGND

17

18

19

20

6

ROSC

16

9

8

7

10

IN

NC

CD

V

AGND

LXLXNC

17

16

9

10

CD

AGND

＜TOP VIEW＞＜BOTTOM VIEW＞

PIN NAME FUNCTIONS

Step-Up DC/DC Converter Output Voltage

OUT

H

L

GND≦V

1.2V≦V

≦0.4V

CE

CE≦VIN

PGND

20

19

18

6

7

8

IN

NC

V

ROSC

2/25

■PRODUCT CLASSIFICATION

●Ordering Information

XC9516①②③④⑤⑥-⑦

DESIGNATOR ITEM SYMBOL DESCRIPTON

① UVLO Detect Voltage A Detect Voltage: 1.87V, Hysteresis Width 0.44V

②③ Over Voltage Limit 21 Over Voltage Detect Voltage: 21V

④ Over Current Limit A Over Current Detect Voltage: 1.3A

⑤⑥-⑦

(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant. (*2) The XC9516 reels are shipped in a moisture-proof packing.

■BLOCK DIAGRAM

PGND and AGND are externally connected to the same potential.

(*1)

Package (Order Unit) ZR-G QFN-20 (1,000/Reel)

(*1)

⇒ XC9516A21AZR-G

(*2)

XC9516

Series

3/25

XC9516 Series

■ABSOLUTE MAXIMUM RATINGS

Operating Ambient Temperature Topr -40 ～ +85

PAR AMETER SYMBOL RATINGS UNITS

VIN Voltage VIN

CE Pin Voltage VCE

FB

Pin Voltage

FB1

Pin Voltage

FB2

Pin Voltage

ROSC Pin Voltage V

CD Pin Voltage VCD

CVL Pin Voltage VVL

SWB Pin Voltage V

CP2SWB Pin Voltage V

V

Pin Voltage V

OUT

LX Pin Voltage VLX DR1 Pin Voltage V DR2 Pin Voltage V

LX Pin Current ILX

Power Dissipation Pd

Storage Temperature Tstg -55 ～ +125

VFB

V

FB1

V

FB2

ROSC

SWB

CP2SWB

OUT

DRV1

DRV2

-0.3～6.0

-0.3～VIN+0.3 or 6.0

-0.3～V

+0.3 or 6.0

CVL

+0.3 or 6.0

CVL

+0.3 or 6.0

CVL

+0.3 or 6.0

CVL

+0.3 or 6.0

CVL

(*1)

(*2)

-0.3～6.0

-0.3～22

-0.3～V

+0.3 or 22

OUT

+0.3 or 22

OUT

(*3)

1650

300

V V V V V V V V V V V V V V

mA

mW

o

C

o

C

* All voltages are described based on GND. (GND=AGND=PGND) (*1) The maximum value should be either V (*2) The maximum value should be either V (*3) The maximum value should be either V

+0.3 or +6.0 in the lowest.

IN

+0.3 or +6.0 in the lowest.

CVL

+0.3 or +22.0 in the lowest.

OUT

4/25

■ELECTRICAL CHARACTERISTICS

Unless otherwise stated, V

IN=VCE

=3.3V, V

OUT

=9.0V, f

=300kHz, Ta=25℃

OSC

XC9516

Series

PAR AMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS

Power Input Voltage Range VIN 2.5 - 5.5 V

Input Voltage Rise Time t

Supply Current I

Stand-by Current I

Oscillation Frequency f

UVLO Detect Voltage

(VIN falls down)

UVLO Feedback Voltage

(VIN rises)

CE "High" Voltage V

CE "Low" Voltage V

VIN=VCE=0.2V→2.5V

VIN

VFB=V

DD1

VCE=0V - 0.1 8.0 μA

STB

VFB=V

VIN=VCE, VFB=V

VFB=V

V

UVLO1

V

UVLO2

OSC

CEH

CEL

FB2

=0.8V, V

FB2

=0.8V, V

FB2

=0.8V, V

(*1)

- - 15 ms

=1.2V, VCD=0V 0.8 2.0 4.0 μA

FB1

=1.2V, VCD=0V, R

FB1

=0.8V, V

=1.2V, VCD=0V

FB1

=1.2V, VCD=0V

FB1

=1.2V, VCD=0V 1.2 - VIN V

FB1

=1.2V, VCD=0V AGND - 0.4 V

FB1

OSC

Open

255 300 345 kHz

1.77 1.87 1.97 V

2.22 2.31 2.40 V

CE Input Current ICE VIN=5.5V, VCE=0V or 5.5V -0.1 - 0.1 μA

CD Pin Charge Current I

CD Pin Discharge Current I

CD Pin Detect Voltage VCD VFB= V

CP2SWB ”L” Output Voltage

SWB ”L” Output Voltage V

CP2SWB Pull up Resistance

SWB Pull up Resistance R

Thermal Shutdown Temperature

Hysteresis Width T

VFB=0.9V→0.4V, V

CD1

VFB=V

CD2

V

SWB2

SWB

R

VCE＝0V,V

CP2

VCE＝0V,V

SWB

T

- 150 - oC

TSD

- 20 - oC

HYS

FB1=VFB2

= V

FB1

FB2

Input Current=1mA

=5.5V,CP2SWB=1.0V 350 800 2500 kΩ

OUT

=5.5V,SWB=1.0V 350 800 2500 kΩ

OUT

= V

FB1

=0.9V 2.6 5.5 8.4 μA

FB2

=0.9V, VCD=0.1V 0.20 0.38 0.56 mA

=0V 0.95 1.0 1.05 V

0.55 0.65 0.80 V

0.26 0.33 0.40 V

CIRCUIT

-

⑳ ① ② ③

④

⑤ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑩ ⑪ ⑪

-

●Step-Up DC/DC Converter Block

FB Voltage VFB V

Setting Output Voltage Range

Maximum Duty Cycle D

V

OUTSET

MAX

Soft-Start Time tSS

LX “N-ch” ON Resistance R

LX Current Limit I

V

Over Voltage Limit V

OUT

Short Protection Voltage V

LXN

LIM

19.5 21 22

OVP

V

SHORT

FB Input Current IFB VIN=5.5V, VCE＝0V, VFB=0V, 5.5V -0.1 - 0.1

=1.2V, V

FB1

5.5 - 19 V

V

FB=VFB1=VFB2

R

Open

OSC

2.0 4.0 5.0

=0.8V, VCD=0V 0.985 1 1.015 V

FB2

=0V, VCD=0V,

92 95 98

%

ms

⑫

-

⑬

⑲

100 190 400 mΩ -

=1.0MHz 1.1 1.3 1.5

f

OSC

FB1=VFB2

=0.9V, CD=0.1μF 0.40 0.48 0.55 V ⑮

A

V

μA

⑱ ⑰

⑭

●Negative Charge Pump Block

FB1 Voltage V

Output Impedance 1 R

Short Protection Voltage 1 V

FB1 Input Current I

VFB=V

FB1

V

OUT1

VFB=V

SHORT1

VIN=5.5V, VCE＝0V , V

FB1

=0.8V, VCD=0V 0.985 1 1.015 V

FB2

=1.2V, I

FB1

DRV1

=0.9V, CD=0.1μF 1.2 2.4 2.8 V ⑮

FB2

=20mA -

=0V, 5.5V -0.1 - 0.1 μA ⑭

FB1

15 45

Ω

⑫ ⑯

●Positive Charge Pump Block

FB2 Voltage V

Output Impedance 2 R

Short Protection Voltage 2 V

FB2 Input Current I

(*1)Test Condition for input voltage rise time When used at V

Please also note input voltage before rise should be less than 0.2V. Please see test circuit 20 for test condition, and for the detail of recommended

input wave form, please see NOTES ON USE.

, input voltage should rise from 0.2V to 2.5V within 15ms.

IN=VCE

VFB=0.8V, V

FB2

V

OUT2

SHORT2

VIN=5.5V, VCE＝0V , V

FB2

=0.8V, I

FB2

VFB=V

FB1

DRV2

=0.9V, CD=0.1μF 0.40 0.48 0.55 V ⑮

FB1

=1.2V, VCD=0V

=20mA -

=0V, 5.5V -0.1 - 0.1

FB2

0.985 1.0 1.015

15 45

V

Ω

μA

⑫ ⑯

⑭

5/25

XC9516 Series

■TEST CIRCUITS

PGND LX

DRV1

CP2SWB

FB1 CE FB V

IN

A

VIN=3.3V

ROSC

AGND

DRV2

V

SWB

CVL FB2

CD

OUT

A

V

=9.0V

OUT

①VFB=0.8V→1.2V→0.8V LX oscillation is checked

=1.2V→0.8V→1.2V DRV1 Oscillation is checked.

②V

FB1

③V

=0.8V→1.2V

FB2

→0.8V DRV2 Oscillation is checked. After ①~③, supply current is measured at both V

LX Oscillation period is measured.

and V

IN

OUT

VCE=0V, supply current is measured at both VIN and V

.

OUT

.

UVLO Detect Voltage Measurement: VIN is decreased (2.5V→1.5V), VIN is measured when L UVLO Release Voltage Measurement: V

oscillation started,

L

X

oscillation stopped.

X

is increased (1.5V→2.5V) when

IN

CE H Voltage Measurement: VCE is increased(0.4V→1.2V), VCE is measured when LX oscillation started. CE L Voltage Measurement: V when L

oscillation stopped.

X

is decreased(1.2V→0.4V), VCE is measured

CE

6/25

CE H Input Current: Current is measured when CE pin Voltage is 5.5V. CE L Input Current: Current is measured when CE pin Voltage is 0V.

■TEST CIRCUITS (Continued)

< Circuit7 CD pin Charge Current>

＜測定回路7 CD端子充電電流＞

< Circuit8 CDpin Discharge Current>

＜測定回路8 CD端子放電電流＞

XC9516

Series

After VFB=0.9V→0.4V, CD pin output current is measured.

VFB=0.9V→0.4V後にCD端子出力電流を測定

＜測定回路9 CD端子検出電圧＞

VCD=0.1V→0.2 VCD is measured when LX oscillation stopped.

VCD=0V→1.2V、LX端子が発振停止するVCD電圧を測定

＜測定回路10 CP2SWB/SWB L出力電圧＞

Input current is measured when CD pin Voltage is 0.1V.

CD端子に0.1V入力時の入力電流を測定

＜測定回路11 CP2SWB/SWB プルアップ抵抗＞

CP2SWB L Output Voltage: Voltage is measured when 1.0mA is flow in

CP2SWB“L”出力電圧：CP2SWB端子に1.0mA入力し電圧を測定

CP2SWB pin.

SWB“L”出力電圧：SWB端子に1.0mA入力し電圧を測定

SWB L Output Voltage Voltage is measured when 1.0mA is flow in SWB pin.

CP2SWB Pull-up Resistance Measurement: Output current is measured when CP2SWB pin is 1.0V.R=(5.5-1.0)/I CP2SWB and SWB pins are internally pulled-up to V SWB Pull-up Resistance Measurement: Output Current is measured when SWB pin voltage is 1.0V.R=(5.5-1.0)/I *CP2SWB and SWB pins are internally pulled-up to V

OUT

7/25

XC9516 Series

■TEST CIRCUITS (Continued)

< Circuit12 FB/FB1/FB2 Voltage Test>

< Circuit13 Maximum Duty Cycle>

FB Voltage Measurement: VFB=1.1V→0.9V, VFB is measured when LX oscillation started. FB1 Voltage Measurement: V FB2 Voltage Measurement: V

=0.9V→1.1V, V

FB1

=1.1V→0.9V, V

FB2

is measured when DRV1 oscillation started.

FB1

is measured when DRV2 oscillation started.

FB2

< Circuit14 FB/FB1/FB2 H/L Input Current>

FB Input Current Measurement: Input Current is measured when FB Voltage is 5.5V/0V. FB1 Input Current Measurement: Input Current is measured when FB1 Voltage is 5.5V/0V. FB2 Input Current Measurement: Input Current is measured when FB2 Voltage is 5.5V/0V.

< Circuit16 Output Impedance 1/2>

Duty cycle of LX oscillation is measured.

< Circuit15 FB/FB1/FB2 Short Circuit Protection>

FB Short Protection Measurement: VFB=0.9V→0.4V, VFB is measured when VFB oscillation stopped. FB1 Short Protection Measurement: V FB2 Short Protection Measurement: V

< Circuit17 V

Over Voltage Limit Measurement>

OUT

=1.2V→2.8V, V

FB1

=0.9V→0.4V, V

FB2

is measured when DRV1 oscillation stopped.

FB1

is measured when DRV2 oscillation stopped.

FB2

Output Impedance1: A load current of 20mA is applied to DRV1,

Output Impedance2: A load current of 20mA is applied to DRV2,

DRV1 voltage is measured when a load is applied or not applied R=V/0.02.

DRV2 voltage is measured when a load is applied or not applied R=V/0.02.

8/25

V

=18V→22V, V

OUT

is measured when Lx oscillation stopped.

OUT

■TEST CIRCUITS (Continued)

< Circuit18 LX Current Limit>

＜測定回路18 LX電流制限＞

V

に負荷電流（可変抵抗）を接続

SRC

・A load current (Variable Resistor) is connected to

電流プローブを使用しVIN-L1間のコイルピークを確認

V

.

SRC

過電流制限がかかるまで負荷電流を増加

Coil peak current at VIN-L1 is monitored by the

過電流制限時のコイルピークを測定する。

current probe. A coil peak current is measured.

XC9516

Series

< Circuit18 LX External Components List>

・測定回路図18 外付け部品使用例

NAME MODEL NAME CHARACTERISTIC MANUFACTURER

名称型番特性メーカ

L

SD XBS204S17 Schottky diode, 2A/40V TOREX

SD XBS204S17 ショットキーダイオード, 2A/40V TOREX

D2-5 XBS104S13 Schottky diode, 1A/40V TOREX

D2-5 XBS104S13 ショットキーダイオード, 1A/40V TOREX

Tr1 XP152A11E5MR Pch MOSFET TOREX

Tr2 CPH3109 PNP transistor SANYO

Tr2 CPH3109 PNP トランジスタ三洋

C

CD,C

C

CL1,C

C

C R

R

C

R

< Setting values when the above parts are used>

LTF5022T-4R7N2R0 Coil, 4.7μH TDK

1

LTF5022T-4R7N2R0 コイル, 4.7uH TDK

1

LMK212BJ475KG ceramic condenser, 4.7μF/10V TAIYO YUDEN

IN

LMK212BJ475KG セラミックコンデンサ, 4.7μF/10V 太陽誘電

IN

TMK107BJ104KA ceramic condenser, 0.1μF/25V TAIYO YUDEN

VL

TMK107BJ104KA セラミックコンデンサ, 0.1μF/25V 太陽誘電

D,CVL

TMK107BJ105KA ceramic condenser, 1μF/25V TAIYO YUDEN

DD

TMK107BJ105KA セラミックコンデンサ, 1μF/25V 太陽誘電

DD

C3216X5R1E475M ceramic condenser, 4.7μF/25V TDK

L2

C3216X5R1E475M セラミックコンデンサ, 4.7μF/25V TDK

L1,CL2

TMK107BJ105KA ceramic condenser, 1μF/25V TAIYO YUDEN

Lcp1,CLcp2

TMK107BJ105KA セラミックコンデンサ, 1μF/25V 太陽誘電

Lcp1,CLcp2

C1608JB1H220J ceramic condenser, 22pF/50V TDK

C1608JB1H220J セラミックコンデンサ, 22pF/50V TDK

FB

C1608JB1H103K ceramic condenser, 0.01μF/50V TDK

C1608JB1H103K セラミックコンデンサ, 0.01μF/50V TDK

1,C2

RMC1/16K824FTP チップ抵抗, 820kΩ 釜屋電機

RMC1/16K824FTP chip resistance, 820kΩ KAMAYA

1

RMC1/16K104FTP チップ抵抗, 100kΩ 釜屋電機

RMC1/16K104FTP chip resistance, 100kΩ KAMAYA

2

RMC1/16K394FTP チップ抵抗, 390kΩ 釜屋電機

3

RMC1/16K394FTP chip resistance, 390kΩ KAMAYA

3

RMC1/16K304FTP チップ抵抗, 300kΩ 釜屋電機

4

RMC1/16K304FTP chip resistance, 300kΩ KAMAYA

4

RMC1/16K824FTP チップ抵抗, 820kΩ 釜屋電機

5

RMC1/16K824FTP chip resistance, 820kΩ KAMAYA

5

RMC1/16K753FTP チップ抵抗, 75kΩ 釜屋電機

6

RMC1/16K753FTP chip resistance, 75kΩ KAMAYA

6

C1608JB1H103K セラミックコンデンサ, 0.01μF/50V TDK

5

C1608JB1H103K ceramic condenser, 0.01μF/50V TDK

5

RMC1/16K304FTP チップ抵抗, 300kΩ 釜屋電機

8

RMC1/16K304FTP chip resistance, 300kΩ KAMAYA

8

RMC1/16K134FTP チップ抵抗, 130kΩ 釜屋電機

9

RMC1/16K134FTP chip resistance, 130kΩ KAMAYA

9

RMC1/16K513FTP チップ抵抗, 51kΩ 釜屋電機

10

RMC1/16K513FTP chip resistance, 51kΩ KAMAYA

10

各設定電圧（上記部品使用時）

OUT=VSRC

=-5.3V

GL

=12.0V

GH

=1.0MHz

=9.2V

V V V f

OSC

9/25

tti

XC9516 Series

■TEST CIRCUITS (Continued)

< Circuit19 Soft start/Start-up Sequence＞

＜測定回路19 ソフトスタート/立ち上がりシーケンス＞

・Soft start Measurement

・ソフトスタート測定

CE voltage is triggered on rising edge (0V→VIN).

CE端子に0V→VIN入力でCEをトリガにして測定

LX oscillation start from 1.0V≦VCE.

1.0V≦VCEからLXの発振開始時間、V

V

rising time is measured.

OUT

起動完了時間を測定する。

・Start-up Sequence Measurement

・立ち上がりシーケンス測定

Trigger on CE start-up. Sequence is checked in

CE起動をトリガにして測定

the order of V

V

出力完了、VGL出力完了、VGH出力完了、

OUT

V

出力完了を確認する。

SRC

, VCL, VGH and V

OUT

SRC

の

OUT

.

10/25

< Circuit19 LX External Components List>

・測定回路図19 外付け部品使用例

NAME MODEL NAME CHARACTERISTIC MANUFACTURER

名称型番特性メーカ

L

1

SD XBS204S17 Schottky diode, 2A/40V TOREX D2-5 XBS104S13 Schottky diode, 1A/40V TOREX Tr1 XP152A11E5MR Pch MOSFET TOREX Tr2 CPH3109 PNP transistor SANYO C C C C C C C R R R R R R C R R R

LTF5022T-4R7N2R0 Coil, 4.7μH TDK

L SD XBS204S17 ショットキーダイオード, 2A/40V TOREX D2-5 XBS104S13 ショットキーダイオード, 1A/40V TOREX Tr1 XP152A11E5MR Pch MOSFET TOREX Tr2 CPH3109 PNP トランジスタ三洋

IN

C

D,CVL

C

DD

C

L1,CL2

C

Lcp1,CLcp2

C C

FB

C

1,C2

R

1

R

2

R

3

R

4

R

5

R

6

C

5

R

8

R

9

R

10

< Se

LTF5022T-4R7N2R0 コイル, 4.7uH TDK

1

LMK212BJ475KG ceramic condenser, 4.7μF/10V TAIYO YUDEN

LMK212BJ475KG セラミックコンデンサ, 4.7μF/10V 太陽誘電

IN

TMK107BJ104KA ceramic condenser, 0.1μF/25V TAIYO YUDEN

TMK107BJ104KA セラミックコンデンサ, 0.1μF/25V 太陽誘電

D,CVL

TMK107BJ105KA ceramic condenser, 1μF/25V TAIYO YUDEN

TMK107BJ105KA セラミックコンデンサ, 1μF/25V 太陽誘電

DD

C3216X5R1E475M ceramic condenser, 4.7μF/25V TDK

C3216X5R1E475M セラミックコンデンサ, 4.7μF/25V TDK

L1,CL2

TMK107BJ105KA ceramic condenser, 1μF/25V TAIYO YUDEN

TMK107BJ105KA セラミックコンデンサ, 1μF/25V 太陽誘電

Lcp1,CLcp2

C1608JB1H220J ceramic condenser, 22pF/50V TDK

C1608JB1H220J セラミックコンデンサ, 22pF/50V TDK

FB

C1608JB1H103K ceramic condenser, 0.01μF/50V TDK

C1608JB1H103K セラミックコンデンサ, 0.01μF/50V TDK

1,C2

RMC1/16K824FTP chip resistance, 820kΩ KAMAYA

RMC1/16K824FTP チップ抵抗, 820kΩ 釜屋電機

1

RMC1/16K104FTP チップ抵抗, 100kΩ 釜屋電機

RMC1/16K104FTP chip resistance, 100kΩ KAMAYA

2

RMC1/16K394FTP チップ抵抗, 390kΩ 釜屋電機

3

RMC1/16K394FTP chip resistance, 390kΩ KAMAYA

RMC1/16K304FTP チップ抵抗, 300kΩ 釜屋電機

4

RMC1/16K304FTP chip resistance, 300kΩ KAMAYA

RMC1/16K824FTP チップ抵抗, 820kΩ 釜屋電機

5

RMC1/16K824FTP chip resistance, 820kΩ KAMAYA

RMC1/16K753FTP チップ抵抗, 75kΩ 釜屋電機

6

RMC1/16K753FTP chip resistance, 75kΩ KAMAYA

C1608JB1H103K セラミックコンデンサ, 0.01μF/50V TDK

5

C1608JB1H103K ceramic condenser, 0.01μF/50V TDK

RMC1/16K304FTP チップ抵抗, 300kΩ 釜屋電機

8

RMC1/16K304FTP chip resistance, 300kΩ KAMAYA

RMC1/16K134FTP チップ抵抗, 130kΩ 釜屋電機

9

RMC1/16K134FTP chip resistance, 130kΩ KAMAYA

RMC1/16K513FTP チップ抵抗, 51kΩ 釜屋電機

10

RMC1/16K513FTP chip resistance, 51kΩ KAMAYA

ng values when the above parts are used>

各設定電圧（上記部品使用時） V V V f

OSC

OUT=VSRC

=-5.3V

GL

=12.0V

GH

=1.0MHz

=9.2V

■TEST CIRCUITS (Continued)

< Circuit20 Input Voltage Start-up Time>

＜測定回路20 入力電圧立ち上げ時間＞

・Input Voltage Start-up Time

・入力電圧立ち上げ時間

V

is measured after rising VIN and VCE within

SRC

VIN=VCEを15ms以下で起動しV

less than 15ms.

VIN=VCE=0.2V→2.5V、t

VIN=VCE=0.2V→2.5V, t

・推奨入力波形

・Recommended Input Waveform

VIN=VCE≦0.2Vで起動

Start-up with VIN=VCE≦0.2V

立ち上げ時間 t

Start-up time t

入力電圧立ち上げ時間波形

≦15ms

VIN

Input Waveform

VIN

≦15ms

VIN

の出力を確認。

SRC

XC9516

Series

< Circuit20 LX External Components List>

・測定回路図20 外付け部品使用例

NAME MODEL NAME CHARACTERISTIC MANUFACTURER

L

1

SD XBS204S17 Schottky diode, 2A/40V TOREX

L

D2-5 XBS104S13 Schottky diode, 1A/40V TOREX

SD XBS204S17 ショットキーダイオード, 2A/40V TOREX D2-5 XBS104S13 ショットキーダイオード, 1A/40V TOREX

Tr1 XP152A11E5MR Pch MOSFET TOREX

Tr2 CPH3109 PNP transistor SANYO

Tr2 CPH3109 PNP トランジスタ三洋

C

IN

C

D,CVL

C

DD

C

L1,CL2

C

Lcp1,CLcp2

C

FB

C

1,C2

C

R

1

R

2

R

3

R

4

R

5

R

6

C

5

R

8

R

9

R

10

< Setting values when the above parts are used>

LTF5022T-4R7N2R0 Coil, 4.7μH TDK

名称型番特性メーカ

1

LTF5022T-4R7N2R0 コイル, 4.7uH TDK

LMK212BJ475KG ceramic condenser, 4.7μF/10V TAIYO YUDEN

LMK212BJ475KG セラミックコンデンサ, 4.7μF/10V 太陽誘電

IN

TMK107BJ104KA ceramic condenser, 0.1μF/25V TAIYO YUDEN

TMK107BJ104KA セラミックコンデンサ, 0.1μF/25V 太陽誘電

D,CVL

TMK107BJ105KA ceramic condenser, 1μF/25V TAIYO YUDEN

TMK107BJ105KA セラミックコンデンサ, 1μF/25V 太陽誘電

DD

C3216X5R1E475M ceramic condenser, 4.7μF/25V TDK

C3216X5R1E475M セラミックコンデンサ, 4.7μF/25V TDK

L1,CL2

TMK107BJ105KA ceramic condenser, 1μF/25V TAIYO YUDEN

TMK107BJ105KA セラミックコンデンサ, 1μF/25V 太陽誘電

Lcp1,CLcp2

C1608JB1H220J ceramic condenser, 22pF/50V TDK

C1608JB1H220J セラミックコンデンサ, 22pF/50V TDK

FB

C1608JB1H103K ceramic condenser, 0.01μF/50V TDK

C1608JB1H103K セラミックコンデンサ, 0.01μF/50V TDK

1,C2

RMC1/16K824FTP chip resistance, 820kΩ KAMAYA

RMC1/16K824FTP チップ抵抗, 820kΩ 釜屋電機

1

RMC1/16K104FTP chip resistance, 100kΩ KAMAYA

RMC1/16K104FTP チップ抵抗, 100kΩ 釜屋電機

2

RMC1/16K394FTP chip resistance, 390kΩ KAMAYA

RMC1/16K394FTP チップ抵抗, 390kΩ 釜屋電機

3

RMC1/16K304FTP chip resistance, 300kΩ KAMAYA

RMC1/16K304FTP チップ抵抗, 300kΩ 釜屋電機

4

RMC1/16K824FTP chip resistance, 820kΩ KAMAYA

RMC1/16K824FTP チップ抵抗, 820kΩ 釜屋電機

5

RMC1/16K753FTP チップ抵抗, 75kΩ 釜屋電機

RMC1/16K753FTP chip resistance, 75kΩ KAMAYA

6

C1608JB1H103K セラミックコンデンサ, 0.01μF/50V TDK

5

C1608JB1H103K ceramic condenser, 0.01μF/50V TDK

RMC1/16K304FTP チップ抵抗, 300kΩ 釜屋電機

8

RMC1/16K304FTP chip resistance, 300kΩ KAMAYA

RMC1/16K134FTP チップ抵抗, 130kΩ 釜屋電機

9

RMC1/16K134FTP chip resistance, 130kΩ KAMAYA

RMC1/16K513FTP チップ抵抗, 51kΩ 釜屋電機

10

RMC1/16K513FTP chip resistance, 51kΩ KAMAYA

各設定電圧（上記部品使用時） V V V f

OSC

OUT=VSRC

=-5.3V

GL

=12.0V

GH

=1.0MHz

=9.2V

11/25

XC9516 Series

■OPERATIONAL EXPLANATION

XC9516 series includes following blocks which are a reference voltage source, an oscillation circuit connecting to an external

R

register, a UVLO circuit to prevent malfunction in low voltage operation, internal power supply regulator connecting external

OSC

capacitor, a step-up DC/DC converter, step-up charge pump and inverting charge pump, a short circuit protection circuit, an

C

VL

over current sensing circuit, an over voltage sensing circuit and a thermal shutdown circuit.

VIN

VOUT

CIN

CDD

CE

CVL

CD

VGL

CLcp1

R3

R4

D2D3C1

The step-up DC/DC converter consists of a ramp wave circuit created from the above mentioned oscillation circuit, an error amplifier to compare feedback voltage through external resistor network from V a PWM comparator to decide duty cycle by comparing ramp wave form created by the above mentioned ramp wave circuit and error amplifier output, a phase compensation circuit and current feedback circuit for output voltage stabilization, a N-channel MOS driver transistor to provide duty cycle on-time from L MOS driver transistor, a over-voltage protection circuit operated at 1.3 typical to protect the devices connecting to the V voltage pin.

A multi-loop feedback control by feedback voltage and N-channel MOS driver transistor provides stable output voltage operation so that low ESR ceramic capacitor can be used.

The inverting voltage charge pump consists of an error amplifier to compare internal voltage reference and the feedback voltage thorough external resistor network from V by output level of the error amplifier, driver circuit for charge pump operation.

The step-up charge pump consists of an error amplifier to compare internal voltage reference and the feedback voltage thorough external resistor network from V

OUT

output level of the error amplifier, driver circuit for charge pump operation.

The reference voltage source provides the reference voltage to ensure stable output voltage of the IC.

The oscillation circuit determines switching frequency. The frequency can be changed by external resistance R of 300 kHz to 1.2MHz.

When R

pin is left open, the frequency is fixed at 300kHz.

OSC

When the frequency is low, efficiency is high at light load. When the frequency is high, “L” value of coil will be low and makes space saving.

The oscillation frequency is calculated by the following formula (Equation 1).

R

where f

denotes a setting frequency.

OSC

= 95 x 109 / (f

OSC

- 300 x 103)・・・(Equation 1)

OCS

< Ramp Wave Circuit >

This circuit is used to produce ramp waveforms needed for PWM operation.

< Error Amplifier for DC/DC>

The error amplifier is designed to monitor output voltage. The error amplifier compares the reference voltage with the feedback voltage through the external divider resistors. When a feedback voltage is lower than the reference voltage, the output voltage of the error amplifier is increased.

12/25

L1

VIN

CE

CVL

CD

VOUT

FB1

DRV1

AGND

output voltage, output impedance control circuit to adjust output impedance

OUT

D1（SD）

CFB

LX

FB

PGND

R8

R10

ROSC （R9）

C2

ROSC

SWB

CP2SWB

DRV2

FB2

pin, a current limit circuit to limit the current to flow the N-channel

X

VOUT

CL1

R1

R2

C5（R7）

CL2

Tr1

Tr2

VSRC

D4

D5

R5

R6

VGH

CLcp2

output voltage and internal reference voltage,

OUT

output

output voltage, output impedance control circuit to adjust output impedance by

in a range

OSC

XC9516

Series

■OPERATIONAL EXPLANATION (Continued)

<External Resistors for setting Output Voltages> A setting output voltage V V

OUT

V

A setting output voltage V

V

GL

V

A setting output voltage VGH for the step-up charge pump is calculated by the following formula (Equation 4). V

GH

V

The XC9516 series includes a regulator for internal power circuit in order to stabilize operation. Its power source is taken from VIN and V

. An external capacitor CVL=0.1μF is required to stabilize this internal power supply.

OUT

When the input voltage VIN falls below a threshold voltage 1.87V (TYP.), all driver transistors will be forced off to prevent malfunction. When the V soft-start function to initiate startup operation.

< Current Limit > The current limiter monitors the current flowing through the N-channel MOS driver transistor connected to the Lx pin, and features a combination of the current limit and latch function.

①When the driver current is greater than a specific level (a peak current of inductor), the constant-current type current limit

function operates to turn off the pulses from the Lx pin at any given timing.

②When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state. ③At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an

over-current state. ④When the over-current state is eliminated, the IC resumes its normal operation.

The IC waits for the over-current state to end by repeating the steps ①~③. During a latch delay time which was set by an external capacitor with CD pin, if the ①~③ over-current sate is repeated, all driver transistors in the step-up DC/DC converter, the step-up charge pump and the voltage inverting charge pump will be maintained to turn off. Once the IC is in suspension mode, operations can be resumed by either turning the IC off via the CE pin, or by restoring power to the V

Depending on the state of a substrate, it may result in the case where the latch delay time may become longer or the operation may not be latched. Please locate an input capacitor to the C

I

LX

V

OUT

L

X

V

CE

V

IN

for the step-up DC/DC is calculated by the following formula (Equation 2).

OUT

= VFB×( R1 + R2 ) / R2・・・(Equation 2)

=1.0V, R1 + R2 ＜ 1000kΩ

FB

for the negative charge pump is calculated by the following formula (Equation 3).

GL

= V

-( V

- V

FB1

OUT

=1.0V, R3 + R4 ＜ 1000kΩ

FB1

= V

×( R5 + R6 ) / R6・・・(Equation 4)

FB2

=1.0V, R5 + R6 ＜ 1000kΩ

FB2

voltage becomes 2.31V (TYP.) or higher, the UVLO function is released and the IC performs the

IN

) x R4 / R3・・・(Equation 3)

FB1

Limit < td

pin as close as possible.

D

Limit > td

pin.

IN

I

LIM

0mA

0V

VCE Restart

Current Limit Timing Chart

Level

13/25

XC9516 Series

■OPERATIONAL EXPLANATION (Continued)

<Short-circuit Detection Circuit >

When either output voltage falls below the set voltage while monitoring each feedback voltage of a step-up DC/DC converter, step-up charge pump and inverting charge pump it is allowed as short-circuit so that latch delay circuit starts operation. If the output voltage goes back in the range of the set voltage within the latch delay time, the start of the latch delay circuit will be released. When output voltage is not recovered, all of the driver transistors will be turned off and latched after the latch delay time.

<Latch Delay

Where each short-circuit detection circuit detects output voltage short-circuit or when the over-current detection circuit detects over-current of the L will be tuned off and latched after the delay time which was set by an external capacitor to the C latch, either turning the IC off and on via the CE pin or restoring power supply (V t

is calculated by the following formula (Equation 5).

D

For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal shutdown circuit starts operating and all of the driver transistors will be turned off when the chip’s temperature reaches 150 temperature drops to 130 startup operation.

<Over-voltage Protection>

The over-voltage limit monitors the voltage of V

elevates and beyond 21V (TYP.). In order to release the latch, either turning the IC off and on via the CE pin or restoring power supply (VIN pin) should be selected.

Circuit >

pin, All driver transistors in a step-up DC/DC converter, step-up charge pump and inverting charge pump.

X

C

= td x 5.5 x 10-6/ 1.0・・・(Equation 5)

D

5.5 x 10

1.0 (C

-6

(CD Pin Charge Current, Typical)

Pin Detect Voltage, TYP.)

D

O

C or less after shutting of the current flow, the IC performs the soft start function to initiate output

pin. In order to release the

pin) should be selected. A setting delay time

IN

pin. All of the driver transistors will be turned off when the voltage of V

OUT

D

O

C. When the

OUT

14/25

XC9516

Series

■OPERATIONAL EXPLANATION (Continued)

<Start-up Sequence>

After V

inverting charge pump starts to operate to see VGL voltage. After the negative charge pump, CP2SWB low signal output turns Tr2 on to make a positive charge pump starts to operate to see V for V come out. When falling, V when the Tr2 goes off.

When Rising

①VIN=VCE input ②V

OUT

③V

GL

④CP2SWB Low output, V ⑤SWB Low output, V

When Falling

⑥V

IN=VCE

input with CE same time, the DC/DC starts to operate to set V

IN

voltage. After VGH output, SWB low signal output turn Tr1 on

GH

output. The CP2SWB and SWB pins are internally pulled up to V

SRC

, VGL, and VGH outputs go off after VIN and V

OUT

Rising completed

Operation started

rising started

GH

output

SRC

=0V, V

, VGL, VGH, V

OUT

output is OFF

SRC

Rising/Falling Sequence

①

TSS

VIN=CE

0V

VOUT Level

②

VOUT

VGL

0V 0V

VIN Level

③

VOUT Level

VGH

0V

VOUT Level

CP2SWB

0V

VOUT Level

④

VGL Level

VGH Level

⑤

voltage. After the DC/DC start-up, a negative

OUT

, therefore, this V

OUT

goes to ground. The V

CE

level is kept until a low signal

OUT

output will be turned off

SRC

⑥

0V

VOUT Level

Low Level

VOUT Level

0V

SWB

VSRC

0V

Low Level

VOUT Level

0V

15/25

XC9516 Series

■NOTES ON USE

1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be

exceeded.

2. Switching regulators like step-up DC/DC converters may cause spike noise and/or ripple voltage. These amounts are greatly

affected by peripheral components (coil inductance values, capacitor value and substrate layout of peripheral circuit). Test and

inspect the actual circuits thoroughly before use.

3. An input capacitor should be placed near the IC VIN pin as much as possible.

4. As for power-on, when CE pin is used with connecting to VIN pin, VIN-VCE voltage should begin rising from below 2.0V. Rise

time should be less than 15ms. (Please refer to Figure 1.) On the other hand, when CE pin is used independently from V

voltage rising. (Please refer to Figure 2.)

5. GND pattern should be layouted to get a same level of voltage for AGND pin, PGND pin, and package heatsink.

6. When current over limited value (peak current) flows for a specified period, current limit circuit will turn off a built-in driver

transistor (integral latch circuit). Until the circuit detects the latch delay time and turns off the build-in driver transistor, current of

limited level continues to flow, so please take full care of rating of coils.

7. In case of VGL voltage, VGH voltage may overshoots or undershoots when power supply rise, please put speed-up capacitor

(CFB1, CFB2) between FB1 pin and V

, FB2 pin and VGH. (Please refer to figure 3 and 4.)

GL

8. When load of inverting charge pump and step-up charge pump are with no load and load current of step-up DC/DC converter

is large, the output of the each charge pump may become unstable by switch of step-up DC/DC converter. In case of that,

please put a ferrite bead (L2) into a driver output (DRV1 pin and DRV2 pin) of the each charge pump. (Please refer to figure 4.)

9. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.

pin, CE pin voltage should be started to rise after VIN pin

IN

Figure 1. (Recommended for input wave form for V

Rising is recommended from less than 0.2V.

Rise time should be within 15ms.

V

OUT

R3

CFB1

VGL

CLcp1

Figure 3.

Connection diagram for speed-up capacitor (CFB1)

CFB1 is connected to between FB1 pin and V

R4

D2

C1

D3

FB1

DRV1

GL

IN=VCE

V

IN

V

CE

)

Figure 2. (Recommended for input wave form for V

CE should be rising after V

DRV2

FB2

Figure 4.

Connection diagram for a ferrite bead / speed-up capacitor (CFB2)

L2 (ferrite bead) is connected to between DRV2 pin and C2.

CFB2 is connected to between FB2 pin and V

rising.

IN

L2

CFB2

C2

R5

R6

0V

pin and CE pin are input separately.)

IN

D4

D5

VGH

CLcp2

.

GH

16/25

(

)

■NOTES ON USE (Continued)

TOP VIEW (Layout example)

VIN

SD

L

CIN

NC

PGND

ROSCNCVINCDAGND

CD

CDD

C2

LX

DR_CP2

DR-CP2

VOUT

SWB

CVL

FB_CP2

R6 R2

FB

D2D3

PGND

R4

CLcp1

VOUT

CP1

Components List

DESIGNATOR PRODUCT NOTE MAKER QTY

IC XC9516A21AZR-G TOREX 1 L LTF5022T-4R7N2R0 Coil, 4.7μH TDK 1

SD XBS204S17 Schottky Barrie Diodes, 2A/40V TOREX 1

D2, D3, D4,

Tr1 XP152A11E5MR P-ch MOS FET TOREX 1

Tr2 CPH3109 PNP Transistor SANYO 1 CIN LMK212BJ475KG Ceramic Capacitor, 4.7μF/10V TAIYO UDEN 1 CD, CVL TMK107BJ104KA Ceramic Capacitor, 0.1μF/25V TAIYO UDEN 2 CDD TMK107BJ105KA Ceramic Capacitor, 1μF/25V TAIYO UDEN 1 CL1, CL2 C3216X5R1E475M Ceramic Capacitor, 4.7μF/25V TDK 2

DR_CP1

C1

DR-CP1

RDYB

FB_CP1

CE

FB

CE

FB CP1

R3

R9

XBS104S13 Schottky Barrie Diodes, 1A/40V TOREX 4

CLcp1, CLcp2 TMK107BJ105KA Ceramic Capacitor, 1μF/25V TAIYO UDEN 2

CFB C1608JB1H220J Ceramic Capacitor, 22pF/50V TDK 1 C1, C2 C1608JB1H103K Ceramic Capacitor, 0.01μF/50V TDK 2

R1 RMC1/16K824FTP Chip Resistor, 820kΩ KAMAYA ELECTRIC 1

R2 RMC1/16K104FTP Chip Resistor, 100kΩ KAMAYA ELECTRIC 1

R3 RMC1/16K394FTP Chip Resistor, 390kΩ KAMAYA ELECTRIC 1

R4 RMC1/16K304FTP Chip Resistor, 300kΩ KAMAYA ELECTRIC 1

R5 RMC1/16K824FTP Chip Resistor, 820kΩ KAMAYA ELECTRIC 1

R6 RMC1/16K753FTP Chip Resistor, 75kΩ KAMAYA ELECTRIC 1 R7 C1608JB1H103K Ceramic Capacitor, 0.01μF/50V TDK 1

R8 RMC1/16K304FTP Chip Resistor, 300kΩ KAMAYA ELECTRIC 1

R9 RMC1/16K134FTP Chip Resistor, 130kΩ KAMAYA ELECTRIC 1

R10 RMC1/16K513FTP Chip Resistor, 51kΩ KAMAYA ELECTRIC 1

L2 MMZ1608S400A Ferrite bead, 40Ω@100MHz TDK 1

R1 CFB

LX

SD

D4

D5

FB

R1

CP2

CFB

R5

CL1

TR2

GND

CL2

Tr

CLcp2

R10

CP2

VOUT

R8

R7

Tr

TR1

VOUTGND

*Notes for Board

VOUTCP1=V

VOUTCP2=V

GL

GH

XC9516

Series

TOP VIEW

PGND

CLcp1

VIN

D2D3

VOUT

CP1

L

CIN

DR_CP1

C1

R4

CE

FB CP1

R3

C2

DR_CP2

R6

R2

R9

CD

CDD

CVL

FB

R1 CFB

LX

D5

FB CP2

SD

D4

GND

CL2

TR2

R5

CL1

R10

CP2

VOUT

R8

R7

TR1

VOUTGND

BOTTOM VIEW

CLcp2

Flip horizontal

17/25

XC9516 Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(1) Efficiency vs. Output Current

100

90

80

70

60

50

40

Efficiency:EFFI(%)

30

20

10

0

1 10 100 1000

XC9516 Efficiency

VIN=5.5V

(2) Output Voltage vs. Output Current

9.6

LOAD REG DC/DC VOUT

9.4

9.2

VOUT(V)

9.0

8.8

Iout[mA]

VIN=2.5V

VIN=VCE, VOUT=9.0V FOSC=1MHz Icp1=-1mA, Icp2=1mA

VIN=3.3V

VIN=4.0V

VIN=VCE=2.5V, V Icp1=-10mA, Icp2=10mA

VIN=4.0V

VIN=5.5V

2.5V

3.3V

4.0V

5.5V

=9V

OUT

DC/DC VOUT

100

90

80

70

60

50

40

Efficiency:EFFI(%)

30

20

10

0

1 10 100 1000

LOAD REG CP1 VGL

-5.10

-5.20

-5.30

VGL(V)

-5.40

-5.50

XC9516 Efficiency

VIN=5.5V

Iout[mA]

VIN=VCE, VOUT=9.0V FOSC=1MHz Icp1=-10mA, Icp2=10mA

VIN=3.3V

VIN=2.5V

VIN=VCE=2.5 V, VGL=-5 .3V IOUT=100mA, Icp2=10mA

VIN=4.0V

VGL

2.5V

3.3V

4.0V

5.5V

8.6 0 20 40 60 80 100 120 140 160 180 200 220 240

LOAD REG CP2 VGH

12.3

12.2

12.1

VGH(V)

12.0

11.9

11.8 0 5 10 15 20 25 30

IOUT（mA）

VIN=VCE=2.5V, VGH=12V IOUT=100mA, Icp1=-10mA

ICP2（mA）

-5.60 0 5 10 15 20 25

ICP1（mA）

VGH

18/25

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(3) Frequency vs. Ambient Temperature

400

XC9516 FOSC

, V

V

IN=VCE

FOSC=OPEN

OUT

=9.0V

350

300

FOSC (kHz)

250

200

-50 -25 0 25 50 75 100 125

VIN=2.5V

VIN=5.5V

VIN=4.0V

Temperature （℃）

VIN=2.5V VIN=4.0V VIN=5.5V

(4) Supply Current vs. Ambient Temperature

4000.0

3500.0

3000.0

2500.0

2000.0

IDD1(μA)

1500.0

1000.0

500.0

0.0

-50 -25 0 25 50 75 100 125

VIN=5.5V

VIN=2.5V

IDD1

VIN=4.0V

Temperature（℃）

VIN=VCE, V

=9.0V

OUT

VIN=2.5V VIN=4.0V VIN=5.5V

(5) Stand-by Current vs. Ambient Temperature

XC9516 ISTB

4.00

3.50

3.00

2.50

2.00

1.50

ISTB(μA)

1.00

0.50

0.00

-0.50

-50 -25 0 25 50 75 100 125 Temperature（℃）

VCE=0V, V

(6) FB Voltage vs. Ambient Temperature

(7) FB1 Voltage vs. Ambient Temperature

XC9516 FB-V

1.030

1.025

1.020

1.015

1.010

1.005

1.000

FB (V)

0.995

0.990

0.985

0.980

0.975

0.970

VIN=5.5V

VIN=4.0V

-50 -20 10 40 70 100

VIN=2.5V

Temperature （℃）

, V

V

IN=VCE

OUT

FOSC=OPEN

VIN=2.5V VIN=4.0V VIN=5.5V

=9.0V

XC9516 FB1-V

1.030

1.025

1.020

1.015

1.010

1.005

1.000

FB1 (V)

0.995

0.990

0.985

0.980

0.975

0.970

-50 -20 10 40 70 100

VIN=2.5V

VIN=4.0V

VIN=5.5V

Temperature （℃）

=9.0V

OUT

VIN=2.5V VIN=4.0V VIN=5.5V

VIN=5.5V

VIN=4.0V

VIN=2.5V

, V

V

IN=VCE

FOSC=OPEN

VIN=2.5V VIN=4.0V VIN=5.5V

XC9516

Series

=9.0V

OUT

19/25

XC9516 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(8) FB2 Voltage vs. Ambient Temperature

1.030

1.025

1.020

1.015

1.010

1.005

1.000

FB2 (V)

0.995

0.990

0.985

0.980

0.975

0.970

-50 -20 10 40 70 100

XC9516 FB2-V

Temperature （℃）

(9) CE ”H” Voltage vs. Ambient Temperature (10) CE ”L” Voltage vs. Ambient Temperature

1.40

1.30

1.20

1.10

1.00

CE-H (V)

0.90

0.80

0.70

0.60

-50 -25 0 25 50 75 100 125

XC9516 CE-H

Temperature （℃）

V

(11) LX Pin N-ch Driver ON Resistance vs. Ambient Temperature

LX Nch ON-R (mΩ)

400

350

300

250

200

150

100

XC9516 LX Nch On resistance

CVL=4.0V, FOSC=OPEN

, V

V

IN=VCE

FOSC=OPEN

VIN=2.5V

VIN=4.0V

VIN=5.5V

VIN=2.5V VIN=4.0V VIN=5.5V

=9.0V, FOSC=OPEN

OUT

VIN=2.5V

VIN=4.0V

VIN=5.5V

VIN=2.5V VIN=4.0V VIN=5.5V

OUT

=9.0V

XC9516 CE-L

1.40

1.30

1.20

1.10

1.00

CE-L (V)

0.90

0.80

0.70

0.60

-50 -25 0 25 50 75 100 125

Temperature （℃）

V

OUT

=9.0V, FOSC=OPEN

VIN=2.5V VIN=4.0V VIN=5.5V

VIN=2.5V

VIN=4.0V

VIN=5.5V

20/25

50

0

-50 -25 0 25 50 75 100 125

Temperature （℃）

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(12) Load Transient Response 1 vs. DC/DC Output (V

OUT

)

V

OUT

200mV/div

I

OUT

2.0V/div

SW

I

=0mA→100mA

OUT

I

=0mA

OUT

VIN=VCE=2.5V, V

Ta= 2 5℃

I

=100mA

OUT

=9.0V

V

OUT

200mV/div

I

OUT

50mA/div

I

=100mA→0mA

OUT

I

=100mA

OUT

VIN=VCE=2.5V, V

Ta= 2 5℃

I

=0mA

OUT

XC9516

Series

=9.0V

OUT

100μs/div

(13) Load Transient Response 2 vs. CP1 Output (VGL)

VIN=VCE=2.5V, VGL=-5.0V

Ta= 2 5℃

ICP1 SW ON

=-10mA

VGL

200mV/div

ICP1 SW

2.0V/div

ICP1=-1mA→-10mA

ICP1 SW OFF

=-1mA

100μs/div

(14) Load Transient Response 3 vs. CP2 Output (VGH)

ICP1=-10mA→-1mA

VGL

200mV/div

ICP1 SW

2.0V/div

ICP1 SW ON

=-10mA

100μs/div

VIN=VCE=2.5V, VGL=-5.0V

Ta= 2 5℃

ICP1 SW OFF

=-1mA

100μs/div

VGH

200mV/div

ICP2 SW

2.0V/div

ICP2=1mA→10mA

ICP1 SW OFF

=1mA

100μs/div

V

IN=VCE

Ta= 2 5℃

ICP1 SW ON

=10mA

=2.5V, VGH=12V

VGH

200mV/div

ICP2 SW

2.0V/div

ICP2=10mA→1mA

ICP2 SW ON

=10mA

VIN=VCE=2.5V, VGH=12V

Ta= 2 5℃

ICP1 SW OFF

=1mA

100μs/div

21/25

r

XC9516 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(15) Ripple Rejection Rat vs. Output Current

VIN=VCE=2.5V, V

Ta= 2 5℃, I

V

OUT

20mV/div

VGL

20mV/div

VGH

20mV/div

VIN=VCE=2.5V, V

Ta= 2 5℃, I

V

OUT

20mV/div

VGL

20mV/div

VGH

20mV/div

(16) Start-up Sequence

V

OUT

VIN=VCE=2.5V, V

Ta= 2 5℃, I

Monitor

=9V, VGL=-5V, VGH=12V

OUT

=0mA, ICP1=0mA, ICP2=0mA

OUT

1μs/div

=9V, VGL=-5V, VGH=12V

OUT

=100mA, ICP1=-10mA, ICP2=10mA

OUT

1μs/div

=9V, VGL=-5V, VGH=12V

OUT

=1mA, ICP1=-1mA, ICP2=1mA

OUT

VGH 3.0V/div

V

3.0V/div

OUT

V

3.0V/div

IN

VGL 3.0V/div

V

OUT

20mV/div

VGL

20mV/div

VGH

20mV/div

VSRC Monito

V

Ta= 2 5℃, I

VIN=VCE=2.5V, V

Ta= 2 5℃, I

=2.5V, V

IN=VCE

=9V, VGL=-5V, VGH=12V

OUT

=50mA, ICP1=-5mA, ICP2=5mA

OUT

1μs/div

=9V, VGL=-5V, VGH=12V

OUT

=1mA, ICP1=-1mA, ICP2=1mA

OUT

VGH 3.0V/div

VGL 3.0V/div

VSRC 3.0V/div

V

IN

3.0V/div

22/25

2.0ms/div

■PACKAGING INFORMATION

●QFN-20 (Unit: mm)

1 PIN INDENT

(0.2)

4.00±0.10

+0.03

0.02

4.00±0.10

2.70±0.05

0.40±0.05

106789

-0.02

0.75±0.05

XC9516

Series

0.20±0.05

5

4

3

2

2.70±0.05

1

11

12

13

14

15

*The side of pins are not gilded, but nickel is used.

(0.5)

20

19

161718

●QFN-20 Reference Pattern Layout (Unit: mm) ●QFN-20 Reference Metal Mask Design (Unit: mm)

4.6

3.2

0.3

3.2

4.6

2.7

4.5

3.3

4.5

3.3

0.3 1.1

0.5

2.7

0.3

Solder Thickness：120μm (reference)

0.5

1.10.3

23/25

XC9516 Series

■MARKING RULE

QFN20

① represents product series

1pin

①②③④⑤⑥

01～09, 0A～0Z, 11･･･9Z, A1～A9, AA～Z9, ZA～ZZ repeated （G, I, J, O, Q, W excluded）

*No character inversion used.

MARK PRODUCT SERIES

0 XC9516******-G

② represents UVLO setting voltage and LX detect over current

MARK UVLO VOLTAGE

A

③④ represents V

③ ④

2 1 21V XC9516*21*** -G

⑤⑥ represents production lot number

Detect：1.87V, Hysteresis Width：0.44V

detect over voltage

OUT

MARK

V

DETECT OVER VOLTAGE (e.g.) PRODUCT SERIES

OUT

LX DETECT

OVER CURRENT

1.3A XC9516A**A**-G

PRODUCT

SERIES

24/25

XC9516

Series

1. The products and product specifications contained herein are subject to change without

notice to improve performance characteristics. Consult us, or our representatives

before use, to confirm that the information in this datasheet is up to date.

2. We assume no responsibility for any infringement of patents, patent rights, or other

rights arising from the use of any information and circuitry in this datasheet.

3. Please ensure suitable shipping controls (including fail-safe designs and aging

protection) are in force for equipment employing products listed in this datasheet.

4. The products in this datasheet are not developed, designed, or approved for use with

such equipment whose failure of malfunction can be reasonably expected to directly

endanger the life of, or cause significant injury to, the user.

(e.g. Atomic energy; aerospace; transport; combustion and associated safety

equipment thereof.)

5. Please use the products listed in this datasheet within the specified ranges.

Should you wish to use the products under conditions exceeding the specifications,

please consult us or our representatives.

6. We assume no responsibility for damage or loss due to abnormal use.

prior permission of TOREX SEMICONDUCTOR LTD.

25/25

TOREX XC9516 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual