XC9503 series are PWM controlled, PWM/PFM automatic switching controlled, multi-functiona l, 2 channel step-down DC/DC
controller ICs. Since the series has a built-in 0.9V reference voltage (accuracy ±2%), 0.9V to 6.0V can be set using external
components.
With a 300kHz frequency, the size of the external components can be reduced. Switching frequencies of 180kHz & 500kHz
are also available as custom-designed products.
The control of the XC9503 series can be switched bet ween PWM control and PWM/PFM automatic switching control usi ng
external signals. Control switches from PWM to PFM during light loads when automatic switching is selected and the series is
highly efficient from light loads through to large output currents. Noise is easily reduced with PWM control since the frequency
is fixed. The series gives freedom to select control suited to the application.
Soft-start time is internally set to 10msec and offers protection against in-rush currents when the power is switched on and
also protects against voltage overshoot.
■APPLICATIONS
●PDAs
●Palmtop computers
●Digital cameras
●Various multi function power supplies
FEATURES
2 ch DC/DC Controller (Step-Down & Down)
Input Voltage Range : 2.0V ~ 10V
Power Supply Voltage Range : 2.0V ~ 10V
Output Voltage Range : 0.9V ~ 6.0V (set by FB pins)
Oscillation Frequency : 300kHz (±15%)
Maximum Duty Cycle : 100%
Control Method : PWM or PWM/PFM Selectable
Output Current : More than 1000mA
High Efficiency : 92% (TPY.)
Stand-By Function : 3.0μA (MAX.)
Soft-Start Time : 10 ms (internally set)
1 EXT 1 Channel 1: External Transistor Drive Pin <Connected to P-ch Power MOSFET Gate>
2 VDD Supply Voltage
3 FB1
4 PWM1
5 EN1
6 EN2
7 PWM2
8 FB2
9 GND Ground
10 EXT2 Channel 2: External Transistor Drive Pin <Connected to P-ch Power MOSFET Gate>
PRODUCT CLASSIFICATION
●Ordering Information
XC9503①②③④⑤⑥‑⑦
Channel 1: Output Voltage Monitor Feedback Pin <Threshold value: 0.9V. Output voltage
can be set freely by connecting split resistors between V
Channel 1: PWM/PFM Switching Pin <Control Output 1. PWM control when connected to
VDD, PWM / PFM auto switching when connected to Ground. >
Channel 1: Enable Pin <Connected to Ground when Output 1 is in stand-by mode.
Connected to VDD when Output 1 is active. EXT1 is high when in stand-by mode.>
Channel 2: Enable Pin <Connected to Ground when Output 2 is in stand-by mode.
Connected to VDDwhen Output 2 is active. EXT2/ is high when in stand-by mode.>
Channel 2: PWM/PFM Switching Pin <Control Output 2. P WM control when connected to
VDD, PWM / PFM auto switching when connected to Ground.>
Channel 2: Output Voltage Monitor Feedback Pin <Threshold value: 0.9V. Output voltage
can be set freely by connecting split resistors between V
(*1)
OUT1and Ground.>
OUT2 and Ground.>
DESIGNATOR ITEM SYMBOL DESCRIPTION
①
②③
④
⑤⑥-⑦
(*1)
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
(*1)
Type of DC/DC Controller B Standard type (10 Pin)
Output Voltage 09
2 180kHz (custom)
Oscillation Frequency
Packages (Order Unit)
3 300kHz
5 500kHz (custom)
AR MSOP-10 (1,000/Reel)
AR-G MSOP-10 (1,000/Reel)
DR USP-10 (3,000/Reel)
DR-G USP-10 (3,000/Reel)
FB products→②=0, ③=9 fixed
2/32
■
■
A
BLOCK DIAGRAM
BSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL RATINGS UNITS
XC9503
Series
Ta=25℃
VDD Pin Voltage VDD- 0.3 ~ 12 V
FB1, 2 Pin Voltage VFB- 0.3 ~ 12 V
EN1, 2 Pin Voltage VEN- 0.3 ~ 12 V
PWM1, 2 Pin Voltage VPWM- 0.3 ~ 12 V
EXT1, 2 Pin Voltage VEXT- 0.3 ~ VDD + 0.3 V
EXT1, 2 Pin Current IEXT ± 100 mA
MSOP-10 150
Power Dissipation
Pd
USP-10
Operating Temperature Range Topr - 40 ~ + 85
Storage Temperature Range
Tstg - 55 ~ + 125
Note: Voltage is all ground standardized.
150
mW
℃
℃
3/32
XC9503Series
XC9503B092A
Common Characteristics
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITSCIRCUIT
Supply Voltage VDD 2.0 - 10.0 V ①
Maximum Input Voltage VIN 10.0 - - V ①
Output Voltage Range (* 1) VOUTSET VIN≧2.0V, IOUT1, 2=1mA
Supply Current 1 IDD1 FB1, 2=0V - 60 120 μA ②
Supply Current 1-1 IDD1-1
Supply Current 1-2 IDD1-2
Supply Current 2 IDD2 FB1, 2=1.0V - 60 140 μA ②
Stand-by Current ISTB Same as IDD1, EN1=EN2=0V - 1.0 3.0 μA ②
Switching Frequency FOSC Same as IDD1 153 180 207 kHz ②
EN1, 2 "High" Voltage VENH FB1, 2=0V 0.65 - - V ②
EN1, 2 "Low" Voltage VENL FB1, 2=0V - - 0.20 V ②
EN1, 2 "High" Current IENH EN1, 2=3.0V - - 0.50 μA ②
EN1, 2 "Low" Current IENLEN1, 2=0V, FB1, 2=3.0V - - -0.50 μA ②
PWM1, 2 "High" Current IPWMHFB1, 2=3.0V, PWM=3.0V - - 0.50 μA ②
PWM1, 2 "Low" Current IPWMLFB1, 2=3.0V, PWM=0V - - -0.50 μA ②
FB1, 2 "High" Current IFBH FB1, 2=3.0V - - 0.50 μA ②
FB1, 2 "Low" Current VFBL FB1, 2=1.0V - - -0.50 μA ②
*1: Please be careful not to exceed the breakdown voltage level of the peripheral parts.
*2: EFFI={ [ (output voltage) × (output current) ] / [ (input voltage) × (input current) ] } × 100
Same as I
Same as I
FB1, 2=0V
FB1, 2=0V
EN1, 2=3.0V
EN1, 2=0V, FB1, 2=3.0V
FB1, 2=3.0V, PWM=3.0V
FB1, 2=3.0V, PWM=0V
FB1, 2=3.0V
FBL
V
FB1, 2=1.0V
Step-Down Controller
FB1 VIN=3.0V, IOUT1=10mA 0.882 0.900 0.918 V
V
VINmin1
MAXDTY1 Same as IDD1 100 - - %
PWMH1 No Load 0.65 - - V
V
PWML1 No Load - - 0.20 V
V
OUT1=250mA
I
P-ch MOSFET: XP162A12A6P
V
OUT1×0.95V, EN1=0V→0.65V
Step-Down Controller
OUT2=250mA
I
P-ch MOSFET: XP162A12A6P
PWML2
V
No Load - - 0.20 V ⑦
DD1, EN1=EN2=0V
DD1
VOUT10.9 - 10.0 V
OUT20.9 - 10.0 V
V
- 90 170 μA ②
- 80 150 μA ②
- 100 180 μA ②
- 100 190 μA ②
- 1.0 3.0 μA ②
425 500 575 kHz ②
0.65 - - V ②
- - 0.20 V ②
- - 0.50 μA ②
- - -0.50 μA ②
- - 0.50 μA ②
- - -0.50 μA ②
- - 0.50 μA ②
- - -0.50 μA ②
- - 2.0 V ①
- 91 - % ④
5.0 10.0 20.0 ms
- 91 - % ⑦
Ta=25℃
①
③
②
②
④
④
Ω ⑤
Ω ⑤
④
④
6/32
■
XC9503
Series
OPERATIONAL EXPLANATION
The XC9503 series are multi-functional, 2 channel step-down DC/DC converter controller ICs with built-in high speed, low ON
resistance drivers.
<Error Amp. 1, 2>
The Error Amplifier is designed to monitor the output voltage and it compares the feedback voltage (FB) with the reference
voltage. In response to feedback of a voltage lower than the reference voltage, the output voltage of the error amp.
decreases.
<OSC Generator>
This circuit generates the switching frequency, which in turn generates the reference clock.
<Ramp Wave Generator 1, 2>
The ramp wave generator generates a saw-tooth waveform based on outputs from the phase shift generator.
<PWM Comparator 1, 2>
The PWM comparator compares outputs from the error amp. and saw-tooth waveform. When the voltage from the error
amp's output is low, the external switch will be set to ON.
<PWM/PFM Controller 1, 2>
This circuit generates PFM pulses.
Control can be switched between PWM control and PWM/PFM automatic switching control using extern al signals.
The PWM/PFM automatic switching mode is selected when the voltage of the PWM1 (2) pin is less than 0.2V, and the control
switches between PWM and PFM automatically depending on the loa d. As the PFM circuit generates pulses based on
outputs from the PWM comparator, shifting between modes occurs smoothly. PWM control mode is selected when the
voltage of the PWM1 (2) pin is more than 0.65V. Noise is easily reduced with PWM control since the switching frequency is
fixed.
Control suited to the application can easily be selected which is useful in audio applicatio ns, for example, where traditionall y,
efficiencies have been sacrificed during stand-by as a result of using PWM control (due to the noise problems associated with
the PFM mode in stand-by).
<Vref with Soft Start 1, 2>
The reference voltage, Vref (FB pin voltage)=0.9V, is adjuste d and fixe d by laser trimming (for output voltage settings, pl ease
refer to next page). To protect against inrush current, when the power is switched on, and also to protect against voltage
overshoot, soft-start time is set internally to 10ms. It should be noted, ho wever, that this circuit does not protect the load
capacitor (C
L) from inrush current. With the Vref voltage limited and depending upon the input to the error amps, the operation
maintains a balance between the two inputs of the error amps and controls the EXT pin's ON time so that it doesn't increase
more than is necessary.
<Chip Enable Function>
This function controls the operation and shutdown of the IC. When the voltage of the EN1 or EN2 pins is 0.2V or less, the
mode will be chip disable, the channel's operations will stop and the EXT pins will be kept at a high level (the ext ernal P-ch
MOSFET will be OFF). When both EN1 and EN2 are in a state of chip disable, current consumption will be no more than 3.0
μA. When the EN1 or EN2 pin's voltage is 0.65V or more , the mode will be chip enable and op erations will recommence.
With soft-start, 95% of the set output voltage will be reached within 10mS (TYP.) from the moment of chip enable.
7/32
■
)
XC9503Series
OPERATIONAL EXPLANATION (Continued
<Setting of Output Voltage>
Output voltage can be set by adding external split resistors. Output voltage is determined by the following equation, based
on the values of RFB11 (RFB21) and RFB12 (RFB22). The sum of RFB11 (RFB21) and RFB12 (RFB22) should normally be 1MΩor
less.
The value of C
equal to 12kHz. Adjustments are required from 1kHz to 50kHz depending on the application, value of inductance (L), and
value of load capacity (C
[Example of Calculation]
When R
[Typical Example]
FB11=200k
VOUT
(V)
FB1 (CFB2), speed-up capacitor for phase compensation, should be fzfb= 1 / (2
L).
Ω
and RFB12=75kΩ, VOUT1=0.9×(200k+75k) / 75k=3.3V.
RFB11
(kΩ)
1.0 30 270 430 2.5 390 220 33
1.5 220 330 62 2.7 360 180 33
1.8 220 220 62 3.0 560 240 24
2.0 330 270 39 3.3 200 75 62
2.2 390 270 33 5.0 82 18 160
The same method can be adopted for channel two also.
[External Components]
Tr : * MOSFET
SD :
L :
CL1 :
Tr :
R
CB :
The same components can be adopted for both channel 1 and channel 2.
XP162A12A6P
Note: V
please be careful with the power supply voltage.
MA2Q737 (Schottky, MATSUSHITA)
CMS02 (Schottky, TOSHIBA)
10μH
22μH (CDRH5D28, SUMIDA, FOSC = 300kHz)
22μH (CDRH5D28, SUMIDA, FOSC = 180kHz)
16V, 47μF (Tantalum)
Increase capacity according to the equation below when the step-up
voltage ratio is large and output current is high.
C=(C
L standard value)
* PNP MOSFET
2SA1213 (SANYO)
B :
500Ω ( Adjust in accordance with load & Tr.'s HFE.)
Set according to the equation below.
B≦ (VIN-0.7) × hFE / IC-REXTBH
R
2200pF (Ceramic)
Set according to the equation below.
C
B1
≦
(2π× RB× FOSC × 0.7)
(P-ch Power MOSFET, TOREX)
GS breakdown voltage of this Tr. is 12V so
(CDRH5D28, SUMIDA, FOSC = 500kHz)
×
RFB12
(kΩ)
OUT=0.9
V
×
(RFB11+RFB12) /RFB12
CFB1
(pF)
(IOUT (mA) / 500mA×VOUT / VIN
VOUT
(V)
RFB11
(kΩ)
×π×
CFB1×RFB11) which is
RFB12
(kΩ)
CFB1
(pF)
8/32
■
TEST CIRCUITS
Circuit 1
Circuit ①
V OUT1
RFB11
CFB1CFB2
CL1
RL1
RFB12
PNP
L1
Tr1
2200pF
510Ω
SBD1
1μF
V I
N
1 EXT1EX T2 10
2 VDD
3 FB1FB2 8
4 PW M 1PWM 2 7
5 EN1EN 2 6
GND 9
PNP
Tr2
2200pF
C
IN
SBD2
L2
R
RFB22
V OUT2
FB21
CL2
RL2
510Ω
Circuit 2
Circuit ② Circuit ⑥
EXT2 10
A
OSC
1μF
A
A
V
V
FB1
VPWM1 V EN1
DD
1 EXT1
2 VDD
3 FB1FB2 8
4 PWM 1 PWM 2 7
A
5 EN1EN2 6
GND 9
A
A
V PWM2
VEN2
OS C
A
VFB2
Circuit 3
VOU T 1
L1
A
V
CL1
RL
Pch
MOSFET1
SBD1
1 EXT1EXT2 10
2 VDD
GN D 9
3 FB1FB 2 8
4 PW M 1PW M 2 7
5 EN1EN2 6
A
V IN
CIN
CIN
Circuit 4
Circuit ④
A
CL1
V
RL
VOUT1
200 k Ω
75k Ω
L1
62pF
Pch
MOSFET1
SBD1
1 EXT1EXT2 10
2 VDD
GN D 9
3 FB1FB2 8
4 PWM1 PWM2 7
5 EN1EN2 6
A
VIN
CIN
Circuit 5
Circuit ⑤
A
1μ F
EXT1
V
Circuit 6
A
V IN
Circuit 7
Circuit ⑦ Circuit ③
A
VIN
V
DD
FB1
V
1 EXT1EXT2 10
2 VDD
3 FB1FB2 8
4 PWM1 PWM2 7
5 EN1EN2 6
1 EXT1EXT2 10
2 VDD
3 FB1FB2 8
4 PW M 1PWM 2 7
5 EN1EN2 6
V PWM 1
V EN1
GND 9
GND 9
1 EXT1EXT2 10
GN D 9
2 VDD
3 FB1FB 2 8
4 PWM1 PWM2 7
5 EN1EN2 6
VEN2
Pch
MOSFET2
SBD2
Pch
MOSFET2
SB D2
62pF
V PWM2
L2
L2
XC9503
Series
C
IN
VEXT2
V FB2
VOUT2
A
CL2
L
R
VOUT2
A
20 0 k Ω
CL2
L
R
75 k Ω
A
V
V
9/32
■
XC9503Series
EXTERNAL COMPONENTS USED FOR TEST CIRCUITS
Circuit ①
SD1, SD2: CRS02 (Schottk y diode, TOSHIBA) EC10QS06 (Schottky diode, NIHON INTER)
CL1, CL2: 16MCE476MD2 (Tantalum, NIHON CHEMICON)
CIN: 16MCE476MD2 (Tantalum, NIHON CHEMICON)
PNP Tr1: 2SA1213 (TOSHIBA)
RFB: Please use by the conditions as below: