)
)
XC9131 Series
1A Driver Transistor Built-In, Multi Functional Step-Up DC/DC Converters
■GENERAL DESCRIPTION
XC9131 series are synchronous step-up DC/DC converters with a 0.2Ω(TYP.) N-channel driver transistor and a 0.2Ω(TYP.)
synchronous P-channel switching transistor built-in. A highly efficient and stable current can be supplied up to 1.0A by
reducing ON resistance of the built-in transistors.
The series are able to start operation under the condition which has 0.9V input voltage to generate 3.3V output voltage with a
33Ωload resistor, suitable for mobile equipment using only one Alkaline battery or one Nickel metal hydride battery.
During the operation of a shutdown, the load disconnection function enables to cut the current conduction path from the input to
the output.
The series has 0.5V (±0.01V) reference voltage integrated and being able to set an output voltage with external components.
■APPLICATIONS
●Digital audios
●Digital cameras, Video equipments
●Wireless mice
●Various standard power supplies using batteries
such as alkaline (1 to 3 cells), nickel metal hydride,
or lithium ion (1 cell)
■TYPICAL APPLICATION CIRCUIT
●XC9131 Series (FB)
■ FEATURES
Input Voltage Range : 0.65V~5.5V
Output Voltage Range : 1.8V~5.0V
(V
Oscillation Frequency : 1.2MHz (±15%)
Input Current : 1.0A
Output Current : 500mA @ V
Control Mode Selection : PWM or Auto PWM/PFM
Load Transient Response :100mV @ V
Protection Circuits : Thermal shutdown
Functions : Soft-start
Load Disconnection Function
C
Flag-out Function
UVLO
Output Capacitor
Operating Ambient Temperature
Package : USP-10B
Environmentally Friendly : EU RoHS Compliant, Pb Free
■TYPICAL PERFORMANCE
CHARACTERISTICS
XC9131x05C (V
L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2
CIN=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA
100
90
80
70
60
50
40
Efficiency: EFFI (%)
30
20
10
0
0.1 1 10 100 1000
Output Current: I
☆GreenOperation Compatible
=0.50V±0.01V Set up with external
FB
components)
OUT
OUT
OUT
=3.3V)
VIN=1.8V
2.4V
PWM/P FM
PWM
(mA)
R
FB1
V
=1.8V, I
IN
Over-current limit
Integral latch method
Auto Discharge Function
L
: Ceramic Capacitor
: -40℃~+85℃
OUT
=560kΩ, R
=100kΩ, CFB=10pF, FO=OPEN
FB2
OUT
ETR0412-008
=3.3V, VIN=1.8V(TYP.)
=3.3V,
=1mA→200mA
1/28
XC9131 Series
■ PIN CONFIGURATION
FO
CDD
3
65
74
8
EN
FBMODE
AGND
FO
CDD
3
BAT
2
Lx
1
USP-10B
(BOTTOMVIEW)
XC9135 series
connected to the AGND (No.8) or PGND (No.9) pin.
9
10
PGND
VOUT
2
Lx
BAT
1
USP-10B
(BOTTOMVIEW)
■ PIN ASSIGNMENT
PIN NUMBER PIN NAME FUNCTIONS
1
2
3
4
5
6
7
8
9
10
* The dissipation pad for the USP-10B package should be solder-plated in recommended mount pattern and metal masking so as to
enhance mounting strength and heat release.
If the pad needs to be connected to other pins, it should be
*Please short the GND pins (pins 8 and 9).
■ FUNCTION CHART
1. EN Pin Function
EN PIN FUNCTIONS
H Operation
L Stop
* Do not leave the EN pin open.
2. MODE Pin Function
MODE PIN FUNCTIONS
H PWM
L PWM/PFM automatic control
* Do not leave the MODE pin open.
BAT Power Input
Lx Switching
CDD Bypass Capacitor Connection
MODE Mode Switching
FO Flag Output
EN Enable
FB Output Voltage Monitoring
AGND Analog Ground
PGND Power Ground
VOUT Output Voltage
65
74
8
9
10
EN
CDFMODE
AGND
PGND
VOUT
CDD
3
2
Lx
BAT
1
USP-10B
(BOTTOMVIEW)
XC9136 series
65FO
74
8
9
10
EN
NCMODE
AGND
PGND
VOUT
2/28
■ PRODUCT CLASSIFICATION
●Ordering Information
XC9131①②③④⑤⑥-⑦
(*1)
XC9131
Series
DESIGNA
TOR
ITEM SYMBOL DESCRIPTION
Ａｕｔｏ Ｄｉｓｃｈａｒｇｅ
L
pin can not be connected to the different output pin such as another supply
OUT
F
With C
V
(AC adaptor).
① TYPE
Ａｕｔｏ Ｄｉｓｃｈａｒｇｅ
L
pin can be connected to the different output pin such as another supply
H
②③ Reference Voltage (FB) 05
Without C
V
OUT
(AC adaptor).
Reference Voltage
e.g. FB product, ②③=05 (Fixed)
④ Oscillation Frequency C 1.2MHz
(*1)
⑤⑥-⑦
Package (Order Unit)
DR-G USP-10B (3,000/Reel)
(*1)
The ”-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
3/28
XC9131 Series
■ BLOCK DIAGRAMS
●XC9131F Series
* Diodes inside the circuit are an ESD protection diode and a parasitic diode.
●XC9131H Series
The XC9131H series does not have C
discharge function.
L
4/28
■ ABSOLUTE MAXIMUM RATINGS
PAR AMETE R SYMBOL RATINGS UNITS
V
Pin Voltage V
OUT
CDD Pin Voltage V
-0.3～7.0 V
OUT
-0.3～7.0 V
CDD
FO Pin Voltage VFO -0.3～7.0 V
FO Pin Current IFO 10 mA
FB Pin Voltage VFB -0.3～7.0 V
BAT Pin Voltage V
MODE Pin Voltage V
-0.3～7.0 V
BAT
-0.3～7.0 V
MODE
EN Pin Voltage VEN -0.3～7.0 V
Lx Pin Voltage VLx -0.3～V
Lx Pin Current ILx ±2000 mA
Power Dissipation USP-10B Pd 150 mW
Operating Ambient Temperature
Storage Temperature
* AGND and PGND are standard voltage for all of the voltage.
Topr -40 ～ +85
Tstg -55 ～ +125
+0.3 V
OUT
Ta=25℃
o
C
o
C
XC9131
Series
5/28
XC9131 Series
■ELECTRICAL CHARACTERISTICS
●XC9131F05C / XC9131H05C
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS
Input Voltage VIN
FB Voltage VFB
Output Voltage Setting Range V
OUTSET
Operation Start Voltage V
Operation Hold Voltage V
Supply Current Iq
Input Pin Current I
Stand-by Current (XC9131F) - 0.10 2.0
Stand-by Current (XC9131H)
Lx Leakage Current I
Oscillation Frequency f
Maximum Duty Cycle D
Minimum Duty Cycle D
PFM Switching Current I
Efficiency
LX SW "Pch" ON Resistance R
LX SW "Nch" ON Resistance R
(*2)
EFFI
I
BAT
STB
OSC
PFM
Maximum Current Limit I
Soft-Start Time tSS
Thermal Shut Temperature T
Hysteresis Width T
CL Discharge Resistance
(XC9131F)
FO ON Resistance RFO V
FO Leakage Current I
R
DCHG
FO_LEAK
EN "H" Voltage V
EN "L" Voltage V
= 3.3V, V
V
OUT
Voltage to start oscillation while V
RL=1kΩ, V
ST1
HLD
LxL
MAX
MIN
LxP
LxN
LIM
I
=100mA, L=4.7μH(LTF5022-LC), CFB=10pF
OUT
V
Lx
R
=33Ω, V
L
=1kΩ, V
R
L
=0.5V×1.1 (oscillation stops)
V
FB
V
=1.8V, VEN=3.3V, VFB=0.5V×1.1
IN
V
IN=VLx
V
IN=VLx
V
=0.5V×0.9
FB
V
=0.5V×0.9
FB
V
=0.5V×1.1
FB
V
=0V, RL=330Ω
MODE
=3.3V, VFB=0.5V×1.1, I
V
=0.5V×0.9
FB
>2.5V
V
OUT
= 3.3V, VFB=0.5V×0.95
V
IN
Time to start oscillation while V
TSD
HYS
V
ENH
ENL
Voltage to start oscillation while VEN=0.2V→0.75V
Voltage to stop oscillation while VEN=0.75V →0.2V
V
IN=VOUT
=3.3V, VFO=0.5V
EN
FO
=3.3V, VFB=0.5V×0.9
V
IN
=3.3V, VFB=0.5V×0.9
V
IN
=0V
MODE
MODE
MODE
MODE
=0V
=0V
=0V
=0.511V→0.49V
FB
0.490 0.500 0.510 V
1.8 - 5.0 V
=3.3V
=3.3V
1.02 1.20 1.38 MHz
88 93 97 %
=0V→VIN
EN
(*3)
1.2 1.5 2.0 A
2.8 5.0 8.0 ms
OUT
(*7)
=200mA
(*4)
=2.0V
(*5)
(*6)
100 150 200
100 200 400
=5.5V - 0 1
0.75 - 5.5 V
AGND - 0.2 V
- - 5.5 V
- - 0.85 V
- -
0.9
- 0.65 - V
- 36 50
- 0.65 2.0
- 0.90 5.0
- 0.1 2.0
- - 0 %
- 250 350 mA
- 93 - %
- 0.20 0.35
(*1)
- 0.20
0.35
- 150 - oC
- 20 - oC
(*1)
(*1)
Ω
(*1)
Ω
Ta=25 oC
CIRCUIT
⑤
①
①
V
①
①
μA ②
μA ⑥
μA ③
μA ④
⑤
⑤
⑤
①
①
⑧
⑨
①
⑤
Ω ⑥
Ω ⑦
μA ⑦
⑤
⑤
6/28
)
XC9131
Series
■ELECTRICAL CHARACTERISTICS (Continued
●XC9131F05C / XC9131H05C (Continued)
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS
MODE "H" Voltage V
MODE "L" Voltage V
EN "H" Current
EN "L" Current
MODE "H" Current
MODE "L" Current
FB "H" Current
FB "L" Current
External Components: CIN=10μF(ceramic), L=2.2μH(VLCF4020 TDK), CDD=0.47μF(ceramic), R
=22μF(ceramic), CFB=0pF
C
IN
Test Conditions:
For the Circuit No.1, unless otherwise stated, V
For the Circuit No.2, unless otherwise stated, V
For the Circuit No.3, unless otherwise stated, V
For the Circuit No.4, unless otherwise stated, V
For the Circuit No.5, unless otherwise stated, V
For the Circuit No.6, unless otherwise stated, V
For the Circuit No.7, unless otherwise stated, V
For the Circuit No.8, unless otherwise stated, V
For the Circuit No.9, unless otherwise stated, V
NOTE:
*
1 : Designed value
*
2 : Efficiency ={(output voltage) X (output current)} ÷ {(input voltage) X (input current)} X 100
*
3 : LX SW "P-ch" ON resistance=（VLx-V
*
4 : Testing method of LX SW "N-ch" ON resistance is stated at test circuits.
*
5 : CL Discharge resistance
*
6 : FO ON resistance = V
*
7 : When the output voltage is lower than 2.5V, the maximum current limit may become low.
= V
÷ V
OUT
÷ FO pin measure current
FO
MODEH
MODEL
I
ENH
I
ENL
I
MODEH
I
MODEL
I
FBH
I
FBL
pin test voltage）÷200mA
OUT
pin measure current
OUT
R
L
R
=330Ω, Voltage operates at PWM control
=330Ω, Voltage operates at PFM control
L
V
IN=VOUT=VFB=VEN
V
IN=VOUT=VFB
V
IN=VOUT=VFB=VEN=VMODE
V
IN=VOUT=VFB=VEN
V
IN=VOUT=VEN=VFB
V
IN=VOUT=VEN
=1.8V, VEN=V
IN
IN=VOUT=VEN
OUT=VEN=VMODE=VFB
OUT=VEN=VMODE=VFB
=0.9V, V
IN
OUT
IN=VOUT=VFB
IN=VEN=VMODE
IN=VOUT=VEN
OUT=VEN=VMODE=Vpull
=3.3V, VEN=V
=5.5V - - 0.1
=5.5V, VEN=0V -0.1 - -
=5.5V - - 0.1
=5.5V, V
=0V -0.1 - -
MODE
=5.5V - - 0.1
=5.5V, VFB=0V -0.1 - -
=3.3V
MODE
=3.3V, V
=3.3V, VEN=V
=3.3V
=3.3V,VFB=V
=0V (GND connected)
MODE
=0V (GND connected)
=0V (GND connected)
=3.3V
=0V (GND connected)
MODE=VFB
=0V (GND connected)
MODE
=0V (GND connected)
MODE
=560kΩ, R
FB1
0.75 - 5.5 V
AGND - 0.2 V
=100kΩ
FB2
μA ②
μA ②
μA ②
μA ②
μA ②
μA ②
CIRCUIT
①
①
7/28
XC9131 Series
■TYPICAL APPLICATION CIRCUIT
●XC9131 Series
<XC9131 Series Output Voltage Setting>
Output voltage can be set by adding external split resistors. Output voltage is determined by the following equation,
based on the values of R
The value of C
than 20 kHz. Also, when the input voltage, VIN is lower than 1.5V, CFB is 0pF. Adjustments are depending on
application, inductance (L), load capacitance (C
[Example of calculation]
When C
[Typical example]
V
=0.5×(R
OUT
, speed-up capacitor for phase compensation, should be 0pF or fzfb = 1/(2π×C
FB
When R
V
OUT
=560kΩ,R
FB1
=10pF, fzfb=1/（2π×10p×560k）=28.42kHz
FB
(V) R
FB1
1.8 390 150 0
3.3 560 100 10
5.0 270 30 15
[External Components]
f
=1.2MHz
OSC
L: 2.2μH～4.7μH
VLCF4020 series, LTF5022-LC series
: Should be selected in 20μF or higher
C
L
Capacitor JMK212BJ106KG×2、LMK212BJ106KG×2、LMK316BJ226ML is recommended.
Ceramic capacitor: B (JIS standard) or X7R, X5R (EIA standard)
CIN: 10μF
Capacitor JMK212BJ106KG or LMK212BJ106KG is recommended.
Ceramic capacitor: B (JIS standard) or X7R, X5R (EIA standard)
CDD: 0.47μF (Ceramic capacitor)
voltage is constantly applied to the CDD capacitor. While selecting a part, please concern about capacitance reduction and voltage
* V
DD
durability.
* For the coil L, please use 2.2μH to 4.7μH. However, when the input voltage V
* Capacitance C
When you select the external components, please consider capacitance loss and voltage durability.
* If using tantalum or low ESR electrolytic capacitors please be aware that ripple voltage will be higher due to the larger ESR (Equivalent
Series Resistance) values of those types of capacitors. Please also note that the IC’s operation may become unstable with such
capacitors so that we recommend to test on the board before usage.
* If using electrolytic capacitor for the C
is recommended 20μF or higher. (Ceramic capacitor compatible)
L
FB1 and RFB2. The sum of RFB1 and RFB2 should normally be 1000kΩ or less.
)/R
FB1+RFB2
=100kΩ, V
FB2
(kΩ) R
FB2
L) and dropout voltage.
=0.5×(560k+100k)/100k=3.3V
OUT
(kΩ) C
FB2
, please connect a ceramic capacitor in parallel.
L
FB
(pF)
is lower than 1.5V, please use 2.2μH.
IN
×
R
FB
) which is higher
FB1
8/28
XC9131
Series
■OPERATIONAL EXPLANATION
The XC9131 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase
compensation circuit, N-channel driver transistor, P-channel synchronous rectification switching transistor and current limiter
circuit.
The XC9131 series has FB pin for external components
voltage with the FB pin feed back voltage via resistors RFB1 and RFB2. Phase compensation is performed on the resulting error
amplifier output, to input a signal to the PWM comparator to determine the turn-on time of the N-channel driver transistor
during PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the
ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output
a switching duty cycle. This process is continuously performed to ensure stable output voltage. The current feedback circuit
monitors the N-channel driver transistor’s turn-on current for each switching operation, and modulates the error amplifier
output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low ESR capacitor,
such as a ceramic capacitor, is used, ensuring stable output voltage.
<Reference Voltage Source>
The source provides the reference voltage to ensure stable output of the DC/DC converter.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally at 1.2MHz. The Clock generated is
used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback
voltage divided by the internal resistors (R
the error amplifier increases. The gain and frequency characteristics of the error amplifier are optimized internally.
< Maximum Current Limit>
The current limiter circuit monitors the maximum current flowing through the N-channel driver transistor connected to the Lx
pin.
① When the driver current is greater than a specific level (equivalent to peak coil current), the maximum current limit function
starts to operate and the pulses from the Lx pin turn off the N-channel driver transistor at any given time.
② When the driver transistor is turned off, the limiter circuit is then released from the maximum current limit detection state.
③ At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an
over current state.
④ When the over current state is eliminated, the IC resumes its normal operation.
The XC9131 series does not have this latch function, so operation steps ① through ③ repeat until the over current state ends.
Please note that the current flow into the N-channel driver transistor is different from output current I
FB1 and RFB2). When the FB pin is lower than the reference voltage, output voltage of
R
FB１
and R
. The error amplifier compares the internal reference
FB2
.
OUT
9/28
XC9131 Series
■OPERATIONAL EXPLANATION (Continued)
<Thermal Shutdown>
For protection against heat damage, the thermal shutdown function monitors chip temperature. When the chip’s
temperature reaches 150OC (TYP.), the thermal shutdown circuit starts operating and the driver transistor will be
turned off. At the same time, the output voltage decreases. When the temperature drops to 130
shutting off the current flow, the IC performs the soft start function to initiate output startup operation.
<MODE>
The MODE pin operates in PWM mode by applying a high level voltage and in PFM/PWM automatic switching mode by
applying a low level voltage.
<Shut-Down, Load Disconnection Function>
The IC enters chip disable state by applying low level voltage to the EN pin. At this time, the N-channel and P-channel
synchronous switching transistors are turned OFF. Please also note that a parasitic diode of the P-channel synchronous
switch is controlled, thus, the current conduction path is disconnected.
<Flag Out>
The FO pin becomes high impedance during over current state, over temperature state, soft-start period, and shut-down
period. In normal state, the FO pin is low impedance. The FO pin is N-channel open drain output.
<CL Discharge >
XC9131F series can discharge the electric charge at the output capacitor (C
enables a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the V
P
pin. When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid
GND
application malfunction. Discharge time of the output capacitor (C
output capacitor (C
value (C
by the following formulas. However, the C
to make sure the discharge time. We recommend that you fully check actual performance.
V = V
V : Output voltage after discharge
V
OUT
t : Discharge time
τ : C×R
C : Capacitance of Output capacitor (C
R : C
●Output Voltage Discharge Characteristics
5.5
5.0
4.5
4.0
(V)
OUT
3.5
3.0
2.5
2.0
1.5
Output Voltage: V
1.0
0.5
0.0
The XC9131H series do not have CL discharge function. If the MODE pin is set low to select auto PWM/PFM mode, the output
of XC9131H series can be connected to another power supply.
However, it should be noted that when the output of XC9131F series is connected to another power supply, the IC may be
damaged.
< CDD, VDDMAX>
MAX circuit compares the input voltage and the output voltage then it will select the higher one as the power supply for the
V
DD
IC. The higher voltage will be supplied to the C
) as τ(τ=C x R), discharge time of the output voltage after discharge via the N channel transistor is calculated
L
-t /
τ
×
e
OUT
: Output voltage
Discharge resistance, it depends on supply voltage
L
V
0.000 0.005 0.010 0.015
). By setting time constant of a CL auto-discharge resistance value [R
L
or t = τLn (V
=1.8V, VIN=1.0V
OUTSET
V
OUTSET
Discharge Time: t(s)
/V)
OUT
=3.3V, VIN=2.0V
V
=5.0V, VIN=2.0V
OUTSET
) when a low signal to the EN pin which
L
) is set by the CL auto-discharge resistance (R) and the
L
DCHG
discharge resistance [R
L
)
L
CL=20μF
pin and the IC operates in stable when a capacitor is connected.
DD
] is depends on the V
DCHG
10/28
O
C (TYP.) after
pin and the
OUT
] and an output capacitor
BAT
or V
, so it is difficult
OUT
XC9131
Series
■NOTE ON USE
1. Please do not exceed the stated absolute maximum ratings values.
2. The DC/DC converter performance is greatly influenced by not only the ICs' characteristics, but also by those of the external
components. Care must be taken when selecting the external components. Especially for C
recommended to use type B capacitors (JIS regulation) or X7R, X5R capacitors (EIA regulation).
3. Make sure that the PCB GND traces are as thick and wide as possible. The ground voltage fluctuation caused by high
ground current at the time of switching may result in instability of the IC. Therefore, the GND traces close to PGND pin and
AGND pin are important.
4. Please mount each external component as close to the IC as possible. Also, please make traces thick and short to reduce
the circuit impedance.
5. When the device is used in high step-up ratio, the current limit function may not work during excessive load current. In this
case, the maximum duty cycle limits maximum current.
6. In case of connecting to another power supply as shown in below circuit diagram, please use the XC9131H series. Please
also note that the MODE pin is fixed in low level for selecting PWM/PFM auto mode. If the MODE pin is in high to maintain
fixed PWM control mode, the backflow current may happen. If the output of XC9131F series is connected to another power
supply, the IC may be damaged.
C
IN
V
IN
L
C
DD
FO
BAT
Lx
CDD
MODE
FO
USB
AC Adapter
PGND
AGND
USB
D
V
V
OUT
C
L
R
FB
EN
FB2
EN
OUT
R
FB1
C
FB
C
IN
V
IN
L
MODE
C
DD
AC Adapter
BAT
Lx
CDD
FO
MODE
FO
V
PGND
AGND
CDF
7. The maximum current limiter controls the limit of the N-channel driver transistor by monitoring current flow. This function
does not limit the current flow of the P-channel synchronous transistor. When over current flows to the P-channel
synchronous transistor in case of load, the IC may be damaged.
8. The MODE pin and EN pin are not pulled-down internally. Please make sure that the voltage applied to the MODE pin
and the EN pin.
9. When used in small step-up ratios, the device may skip pulses during PWM control mode.
10. In the PWM/PFM auto, transition from PFM to PWM mode, or PWM to PFM mode, the output voltage may be fluctuated.
(Please refer below)
V
OUT
I
Lx
VIN=4.2V, V
V
:50mV/div, ILx:200mA/div, Time:20μs/div
OUT
L=4.7μH(LTF5022-LC), C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA-T)
C
IN
R
=270kΩ, R
FB1
=5.0V, MODE: Auto PWM/PFM
OUT
=20μF(LMK212BJ106KG*2)
L
=30kΩ, CFB=10pF
FB2
load capacitor, it is
L
D
OUT
EN
C
L
EN
Cdf
V
OUT
11/28
XC9131 Series
■NOTE ON USE (Continued)
11. When used in large step-up ratios and small load current, the output voltage may change when PWM/PFM auto is
changed to PWM control mode by using the MODE pin. (Please refer below)
V
12. After the soft-start period, when used in VIN＞V
XC9131H
is tied to low, the current flows into the parasitic diode of the P-channel synchronous transistor so that results in
generating excessive heat in the IC. Please test in the board before usage with considering heat dissipation. For the
XC9131F series the P-channel synchronous transistor is always turned on which is no matter of MODE pin control.
13. During start-up, when output setting voltage is lower than 2V, the PWM/PFM auto mode should be selected. In case of the
fixed PWM control mode, the output voltage may become smaller than the setting voltage. When the setting output
voltage is higher than 2V, the IC can be started to operate in the both modes of PWM/PFM auto and fixed PWM control.
14. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
15. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
12/28
OUT
V
I
V
Lx
Lx
MODE
VIN=0.9V, V
V
OUT
L=2.2μH(VLCF4020), CL=20μF(LMK212BJ106KG*2)
CIN=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA-T)
R
FB1
（the input voltage is higher than the output voltage）, In the
OUTSET
=5.0V, MODE:PWM/PFM→PWM, I
OUT
:100mV/div, ILx:500mA/div, VLx:10V/div, V
=270kΩ, R
=30kΩ, CFB=0pF
FB2
=3mA
OUT
:5V/div, Time:200μs/div
MODE
series, the P-channel synchronous transistor is turned on when MODE pin is tied to high. When the MODE pin
XC9131
Series
■NOTE ON USE (Continued)
●Instructions for pattern layouts
1. In order to stabilize VIN voltage level, we recommend that a by-pass capacitor CIN is connected as close as possible to the
VIN and VSS pins.
2. Please mount each external component as close to the IC as possible.
3. Place external components as close to the IC as possible and use thick and short traces to reduce the circuit impedance.
4. Make sure that the PCB GND traces are thick and wide as possible. Ground voltage level fluctuation created by high
ground current at the time of switching may cause instability of the IC.
5. The internal driver transistors bring on heat because of the IIN current and ON resistance of the driver transistors.
6. Please place a capacitor between CDF pin and GND.
●Example of pattern layout
FRONT BACK
13/28
XC9131 Series
■TEST CIRCUITS
< Circuit No.1 >
XC9131F/H
Wave Form Measure Point
L
A
V
IN
V
C
IN
V
MODE
BAT
VOUT
Lx
FO
CDD
AGND PGND
C
FB
R
FB1
FB
ENMODE
V
EN
C
DD
A
C
R
FB2
V
L
OUT
R
L
V
External Components
※
:
L
2.2 μH( VLCF 4020-2R 2:
:
C
10μ F ( ceramic)
IN
:
C
0. 47μF (ceramic)
DD
:
C
22μF ( ceramic)
L
:
C
0pF
FB
Ω
:560k
R
FB1
Ω
R
:100k
FB2
TDK)
XC9135A/C/L/M/B/K/R/T
XC9136E/N
Wave Form Measure Point
L
A
V
IN
V
C
IN
V
MODE
V
FO
BAT
Lx
R
FO
FO
AGND PGND
< Circuit No.2 > < Circuit No.3 >
BAT
A
V
IN
V
MODE
Lx
A
FO
AGND PGND
※ External Components
C
DD
VOUT
(CDF)
CDD
: 0.47 μ F ( ceramic)
FB
ENMODE
VOUT
CDF
C
ENMODE
V
CDD
EN
C
C
DD
DF
A
V
FB
A
V
EN
C
DD
A
L
V
OUT
V
RL
V
※
External Components
L
: 2.2 μH (VLCF 4020 -2 R 2 :TDK)
:
C
10μ F ( ceramic)
IN
C
: 0.47 μF (ceramic)
DD
: 22μ F ( ceramic)
C
L
:
1000
C
pF
DF
:
10
R
kΩ
FB2
BAT
Lx
A
IN
V
MODE
FO
VOUT
(CDF)
CDD
FB
ENMODE
V
EN
C
DD
V
OUT
V
FB
AGND PGND
※ External Components
C
:0.47μF(ceramic)
DD
14/28
< Circuit No.4 >
A
V
IN
V
Lx
V
MODE
BAT
Lx
VOUT
(CDF)
FO
AGND PGND
※ External Components
: 0.47μF (ceramic)
C
DD
CDD
FB
ENMODE
V
EN
C
DD
V
OU
T
V
FB
XC9131
Series
■TEST CIRCUITS
<Measurement method for ON resistance of the Lx switch>
Using the layout of circuit No.9 above, set the LX pin voltage to 50mV by adjusting the Vpull voltage whilst the N-channel driver
transistor is turned on. Then, measure the voltage difference between both ends of Rpull. ON Resistance is calculated by using
the following formula:
=0.05 ÷ ((V1 – 0.05) ÷ 0.5)
R
LXN
where V1 is a node voltage between SBD and Rpull. L
pin voltage and V1 are measured by an oscilloscope.
X
15/28
XC9131 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
100
90
80
70
60
50
40
30
Efficiency: EFFI (%)
20
10
0
0.1 1 10 100 1000
100
90
80
70
60
50
40
30
Efficiency: EFFI (%)
20
10
0
0.1 1 10 100 1000
(2) Output Voltage vs. Output Current
3.5
(V)
OUT
3.4
3.3
3.2
3.1
Output Voltage: V
3.0
0.1 1 10 100 1000
16/28
XC9131x05C (V
L=2.2μH(VLCF4020), CL=20μF(LMK212BJ106KG*2)
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
C
IN
R
FB1
=560kΩ, R
=3.3V)
OUT
=100kΩ, CFB=0pF, FO=OPEN
FB2
VIN=0.9V
1.2V
1.8V
PWM/PFM
PWM
Output Current: I
XC9131x05C (V
L=2.2μH(VLCF4020), CL=20μF(LMK212BJ106KG*2)
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
C
IN
R
FB1
=390kΩ, R
(mA)
OUT
=1.8V)
OUT
=150kΩ, CFB=0pF, FO=OPEN
FB2
VIN=0.9V
1.2V
PWM/PFM
PWM
Output Current: I
XC9131x05C (V
L=2.2μH(VLCF4020), CL=20μF(LMK212BJ106KG*2)
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
R
FB1
=560kΩ, R
(mA)
OUT
=3.3V)
OUT
=100kΩ, CFB=0pF, FO=OPEN
FB2
VIN=0.9V
1.8V
PWM/PFM
PWM
Output Current: I
OUT
(mA)
2.4V
2.4V
100
90
80
70
60
50
40
30
Efficiency: EFFI (%)
20
10
0
0.1 1 10 100 1000
100
90
80
70
60
50
40
30
Efficiency: EFFI (%)
20
10
0
0.1 1 10 100 1000
3.5
3.4
(V)
OUT
3.3
3.2
3.1
Output Voltage: V
3.0
0.1 1 10 100 1000
XC9131x05C (V
L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
C
IN
R
FB1
=560kΩ, R
=3.3V)
OUT
=100kΩ, CFB=10pF, FO=OPEN
FB2
VIN=1.8V
2.4V
PWM/PFM
PWM
Output Current: I
XC9131x05C (V
L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
C
IN
=270kΩ, R
R
FB1
VIN=1.8V
(mA)
OUT
=5.0V)
OUT
=30kΩ, CFB=10pF, FO=OPEN
FB2
2.4V
PWM/PFM
PWM
Output Current: I
XC9131x05C (V
L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
R
FB1
=560kΩ, R
(mA)
OUT
=3.3V)
OUT
=100kΩ, CFB=10pF, FO=OPEN
FB2
VIN=1.8V
PWM/PFM
PWM
Output Current: I
OUT
(mA)
3.7V
2.4V
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Output Current (Continued)
2
XC9131x05C (V
L=2.2μH(VLCF4020), CL=20μF(LMK212BJ106KG*2)
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
R
FB1
=390kΩ, R
=1.8V)
OUT
=150kΩ, CFB=0pF, FO=OPEN
FB2
5.2
XC9131x05C (V
L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
R
FB1
=270kΩ, R
OUT
=30kΩ, CFB=10pF, FO=OPEN
FB2
(V)
OUT
1.9
1.8
1.7
VIN=0.9V
1.2V
(V)
OUT
5.1
5.0
4.9
VIN=1.8V
OUT
(mA)
PWM/PFM
PWM
4.8
Output Voltage: V
4.7
0.1 1 10 100 1000
Output Current: I
Output Voltage: V
1.6
1.5
0.1 1 10 100 1000
Output Current: I
(3) Ripple Voltage vs. Output Current
100
90
80
70
60
50
40
30
Ripple Voltage: Vr(mV)
20
10
0
0.1 1 10 100 1000
XC9131x05C (V
L=2.2μH(VLCF4020), CL=20μF(LMK212BJ106KG*2)
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
R
FB1
=560kΩ, R
=3.3V)
OUT
=100kΩ, CFB=0pF, FO=OPEN
FB2
PWM/PFM
PWM
1.8V
Output Current: I
2.4V
VIN=0.9V
OUT
1.2V
(mA)
XC9131x05C (V
L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
R
=560kΩ, R
FB1
OUT
=100kΩ, CFB=10pF, FO=OPEN
FB2
100
90
80
70
PWM/PFM
PWM
60
50
40
VIN=1.8V 2.4V
30
Ripple Voltage: Vr(mV)
20
10
0
0.1 1 10 100 1000
Output Current: I
100
90
80
70
60
50
40
30
Ripple Voltage: Vr(mV)
20
10
0
0.1 1 10 100 1000
XC9131x05C (V
L=2.2μH(VLCF4020), CL=20μF(LMK212BJ106KG*2)
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
R
=390kΩ, R
FB1
PWM/PFM
PWM
VIN=0.9V 1.2V
Output Current: I
=1.8V)
OUT
=150kΩ, CFB=0pF, FO=OPEN
FB2
(mA)
OUT
100
90
80
XC9131x05C (V
L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
R
=270kΩ, R
FB1
PWM/PFM
PWM
OUT
FB2
70
60
50
40
VIN=1.8V 2.4V
30
Ripple Voltage: Vr(mV)
20
10
0
0.1 1 10 100 1000
Output Current: I
XC9131
=5.0V)
2.4V
3.7V
PWM/PFM
PWM
(mA)
OUT
=3.3V)
(mA)
OUT
=5.0V)
=30kΩ, CFB=10pF, FO=OPEN
3.7V
(mA)
OUT
Series
17/28
(7)
(8)
XC9131 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) FB Voltage vs. Ambient Temperature
XC9131x05C
0.52
(V)
0.51
FB
0.50
0.49
Feedback Voltage: V
0.48
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
(6) Stand-by Current vs. Ambient Temperature
XC9131F05C
5
f
OSC
4
(μA)
STB
3
2
1
Standby Current: I
VIN=5.0V
3.3V
1.8V
0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Oscillation Frequency vs. Ambient Temperature
XC9131x05C
1.40
1.35
(MHz)
1.30
OSC
1.25
1.20
1.15
1.10
1.05
Oscillation Freqency: f
1.00
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
V
OUT
18/28
V
OUT
=1.2MHz
=1.8V
3.3V
5.0V
=5.0V
3.3V
1.8V
(5) Supply Current vs. Ambient Temperature
XC9131x05C
60
50
40
30
20
Supply Current: Iq (μA)
10
0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
XC9131H05C
5
4
(μA)
STB
3
VIN=5.0V
2
3.3V
1.8V
1
Standby Current: I
0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
Maximum Duty Cycle vs. Ambient Temperature
XC9131x05C
100
(%)
MAX
95
90
85
Maximum Duty Cycle: D
80
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
f
=1.2MHz
OSC
V
=5.0V
OUT
3.3V
1.8V
f
=1.2MHz
OSC
f
=1.2MHz
OSC
V
=1.8V
OUT
3.3V
5.0V
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) Lx SW “N-ch” ON Resistance vs. Output Voltage
XC9131x05C
(10) Lx SW “P-ch” ON Resistance vs. Ambient Temperature
XC9131x05C
1.0
0.9
(Ω)
LxN
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Lx SW Nch ON Resistance: R
0.0
012345
Output Voltage: V
25℃
OUT
Ta=85℃
-40℃
(V)
1.0
0.9
(Ω)
LxP
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Lx SW Pch ON Resistance: R
0.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
(11) Lx Leakage Current vs. Ambient Temperature
XC9131x05C
(12) Soft-Start Time vs. Ambient Temperature
XC9131x05C
V
, V
5.0
4.0
(μA)
LxL
3.0
BAT=VLx
2.0
1.0
Lx Leak Current: I
0.0
VLx=5.0V
3.3V
1.8V
-50 -25 0 25 50 75 100
Ambient Temperature : Ta (℃)
OUT=VEN
=0V
10.0
9.0
8.0
(ms)
SS
7.0
V
=5.0V
OUT
3.3V
1.8V
6.0
5.0
4.0
Soft-Start Time: t
3.0
2.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
(13) PFM Switch Current vs. Input Voltage
(14) MODE "H", "L" Voltage vs. Output Voltage
350
325
(mA)
PFM
300
275
250
225
PFM SW Current: I
200
0.0 1.0 2.0 3.0 4.0 5.0 6.0
XC9131x05C
V
=5V, f
L=4.7μH (LTF5022-LC), C
C
=10μF(ceramic), CDD=0.47μF (ceramic)
IN
Input Voltage: V
OUT
=22μF (ceramic)
L
(V)
IN
OSC
=1.2MHz
XC9131x05C
0.8
(V)
MODEL
0.7
,V
0.6
MODEH
0.5
V
=5.0V
0.4
0.3
0.2
MODE "H" "L" Voltage: V
-50 -25 0 25 50 75 100
OUT
3.3V
1.8V
Ambient Temperature: Ta (℃)
V
f
OSC
OUT
=1.2MHz
XC9131
Series
=3.3V
19/28
XC9131 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) EN "H" Voltage vs. Output Voltage
XC9131x05C
0.8
0.7
(V)
ENH
0.6
0.5
0.4
EN"H" Voltage: V
0.3
0.2
0123456
Output Voltage: V
Ta=-40℃
25℃
OUT
85℃
(V)
(17) Operation Start Voltage vs. Ambient Temperature
1.0
(V)
0.9
ST1
0.8
0.7
0.6
V
OUT
=1.8V
3.3V
5.0V
XC9131x05C
MODE:PWM/PFM, RL=1kΩ, f
L=2.2μH (VLCF4020), C
=10μF(ceramic), CDD=0.47μF (ceramic)
C
IN
=22μF (ceramic)
L
OSC
=1.2MHz
0.5
Operation Start Voltage: V
0.4
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
(18) Operation Hold Voltage vs. Ambient Temperature
1.0
(V)
0.9
HLD
0.8
V
OUT
0.7
0.6
0.5
Operation Hold Voltage: V
0.4
-50 -25 0 25 50 75 100
XC9131x05C
MODE:PWM/PFM, RL=1kΩ, f
L=2.2μH (VLCF4020), C
=10μF(ceramic), CDD=0.47μF (ceramic)
C
IN
=1.8V
3.3V
5.0V
Ambient Temperature: Ta (℃)
=1.2MHz
OSC
=22μF (ceramic)
L
20/28
(16) EN "L" Voltage vs. Output Voltage
XC9131x05C
0.8
0.7
(V)
ENL
0.6
Ta=-40℃
0.5
0.4
EN "L" Voltage: V
0.3
25℃
0.2
0123456
Output Voltage: V
OUT
XC9131x05C
MODE:PWM/PFM, RL=33Ω, f
(V)
ST1
1.0
0.9
L=2.2μH (VLCF4020), C
=10μF(ceramic), CDD=0.47μF (ceramic)
C
IN
L
V
0.8
0.7
0.6
0.5
Operation Start Voltage: V
0.4
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
(19) No Load Input Current vs. Input Voltage
XC9131x05C
MODE:PWM/PFM, RL:OPEN, f
L=2.2μH (VLCF4020), C
C
=10μF(ceramic), CDD=0.47μF (ceramic), Ta=25℃
1.0
0.8
(mA)
IN
0.6
0.4
0.2
No Load Input Current: I
0.0
0.0 1.0 2.0 3.0 4.0 5.0 6.0
IN
1.8V
Input Voltage: V
3.3V
V
OUT
(V)
IN
=22μF (ceramic)
85℃
(V)
=1.2MHz
OSC
=3.3V
OUT
=1.2MHz
OSC
=22μF (ceramic)
L
=5.0V
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(20) FO ON Resistance vs. Ambient Temperature
(21) C
Discharge Resistance vs. Ambient Temperature
L
XC9131x05C
XC9131F05C
V
400
350
(Ω)
300
FO
250
200
150
100
FO ON Resistance: R
50
0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
1.8V
BAT=VOUT=VEN
V
OUT
=5.0V
, VFO=0.5V
3.3V
400
(Ω)
350
DCHG
300
250
200
150
3.3V
100
50
CL Discharge Resistance: R
0
V
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (℃)
1.8V
OUT
V
BAT=VOUT
=5.0V
XC9131
Series
, VEN=0V
21/28
XC9131 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(22) Soft-start
V
=3.3V, VIN=1.8V, RL=33Ω,MODE:PWM/PFM V
OUT
V
OUT
I
Lx
V
V
:1V/div, ILx:200mA/div, VEN:5/div, VFO:5V/div Time:2ms/div V
OUT
L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2) L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
CIN=10μF(LMK212BJ106KG),CDD=0.47μF(EMK107BJ474KA) CIN=10μF(LMK212BJ106KG),CDD=0.47μF(EMK107BJ474KA)
FO
R
FB1
V
EN
XC9131x05C (1.2MHz) XC9131x05C (1.2MHz)
=560kΩ, R
=100kΩ, CFB=10pF R
FB2
=5.0V, VIN=5.5V, RL=50Ω
OUT
V
OUT
I
Lx
V
EN
:2V/div, ILx:500mA/div, VEN:5/div, Time:100us/div
OUT
FB1
=270kΩ, R
=30kΩ, CFB=10pF
FB2
V
=2.0V, VIN=0.9V, RL=20Ω, MODE:PWM/PFM
OUT
V
OUT
I
Lx
V
IN
V
:1V/div, I
OUT
L=2.2μH(VLS252012), CL=22μF(LMK212BJ226MG)
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
C
IN
200mA/div, VIN:1V/div, Time:2ms/div
Lx:
R
=300kΩ, R
FB1
XC9131x05C(1.2MHz)
=100kΩ, CFB=0pF
FB2
22/28
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(23) Load Transient Response
V
=1.8V, VIN=0.9V, I
OUT
=1mA→100mA V
OUT
=1.8V, VIN=0.9V, I
OUT
=100mA→1mA
OUT
V
OUT
V
OUT
I
Lx
I
OUT
:100mV/div, ILx:200mA/div, I
V
OUT
L=2.2μH(LTF5022-LC), C
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA) CIN=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
XC9131x05C (1.2MHz, PWM/PFM) XC9131x05C (1.2MHz, PWM/PFM)
:100mA/div, Time:50μs/div V
OUT
=20μF(LMK212BJ106KG*2) L=2.2μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
L
R
=390kΩ, R
FB1
=150kΩ, CFB=0pF R
FB2
I
OUT
I
Lx
:100mV/div, ILx:200mA/div, I
OUT
FB1
V
=3.3V, VIN=1.8V, I
OUT
=1mA→200mA V
OUT
=3.3V, VIN=1.8V, I
OUT
=200mA→1mA
OUT
V
OUT
V
OUT
I
Lx
I
OUT
:100mV/div, ILx:200mA/div, I
V
OUT
L=4.7μH(LTF5022-LC), C
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA) CIN=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
XC9131x05C (1.2MHz, PWM/PFM) XC9131x05C (1.2MHz, PWM/PFM)
:200mA/div, Time:50μs/div V
OUT
=20μF(LMK212BJ106KG*2) L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
L
R
=560kΩ, R
FB1
=100kΩ, CFB=10pF R
FB2
I
OUT
I
Lx
:100mV/div, ILx:200mA/div, I
OUT
FB1
V
=3.3V, VIN=1.8V, I
OUT
=1mA→200mA V
OUT
=3.3V, VIN=1.8V, I
OUT
=200mA→1mA
OUT
V
OUT
V
OUT
I
Lx
I
Lx
I
OUT
I
OUT
:100mV/div, ILx:200mA/div, I
V
OUT
L=4.7μH(LTF5022-LC), C
C
=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA) CIN=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
IN
XC9131x05C (1.2MHz, PWM) XC9131x05C (1.2MHz, PWM)
:200mA/div, Time:50μs/div V
OUT
=20μF(LMK212BJ106KG*2) L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
L
R
=560kΩ, R
FB1
=100kΩ, CFB=10pF R
FB2
:100mV/div, ILx:200mA/div, I
OUT
FB1
XC9131
:100mA/div, Time:1ms/div
OUT
=390kΩ, R
=560kΩ, R
OUT
=560kΩ, R
=150kΩ, CFB=0pF
FB2
:200mA/div, Time:1ms/div
OUT
=100kΩ, CFB=10pF
FB2
:200mA/div, Time:50μs/div
=100kΩ, CFB=10pF
FB2
Series
23/28
XC9131 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(24) Load Transient Response (Continued)
V
=5.0V, VIN=3.7V, I
OUT
V
OUT
I
V
=5.0V, VIN=3.7V, I
OUT
V
OUT
I
Lx
24/28
Lx
I
OUT
I
OUT
=1mA→300mA V
OUT
:100mV/div,ILx:200mA/div,I
V
OUT
L=4.7μH(LTF5022-LC), C
CIN=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA) CIN=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
=100mA→500mA V
OUT
V
:100mV/div, I
OUT
CIN=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA) CIN=10μF(LMK212BJ106KG), CDD=0.47μF(EMK107BJ474KA)
Lx:
L=4.7μH(LTF5022-LC), C
XC9131x05C(1.2MHz,PWM/PFM) XC9131x05C(1.2MHz,PWM/PFM)
:300mA/div,Time:50μs/div V
OUT
=20μF(LMK212BJ106KG*2) L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
L
R
500mA/div, I
R
=270kΩ, R
FB1
OUT
=270kΩ, R
FB1
=30kΩ, CFB=10pF R
FB2
XC9131x05C(1.2MHz,PWM) XC9131x05C(1.2MHz,PWM)
:400mA/div, Time:50μs/div V
=20μF(LMK212BJ106KG*2) L=4.7μH(LTF5022-LC), CL=20μF(LMK212BJ106KG*2)
L
=30kΩ, CFB=10pF R
FB2
=5.0V, VIN=3.7V, I
OUT
V
OUT
I
Lx
I
OUT
=5.0V, VIN=3.7V, I
OUT
V
OUT
I
Lx
I
OUT
=300mA→1mA
OUT
:100mV/div, ILx:500mA/div, I
OUT
=500mA→100mA
OUT
:100mV/div, I
OUT
500mA/div, I
Lx:
FB1
FB1
:300mA/div, Time:1ms/div
OUT
=270kΩ, R
OUT
=270kΩ, R
=30kΩ, CFB=10pF
FB2
:400mA/div, Time:50μs/div
=30kΩ, CFB=10pF
FB2
■PACKAGING INFORMATION
●USP-10B
XC9131
Series
25/28
XC9131 Series
■PACKAGING INFORMATION (Continued)
●USP-10B Reference Pattern Layout
0.0250.025
0.25
0.025
0.4750.475
0.025
0.20 0.40 0.20
1.50 1.50
0.45
1.05 1.05
0.80 0.80
0.20 0.20
26/28
0.45
0.125
0.125
0.125
0.225
0.25
0.125
0.125
0.125
0.25
0.225
1.25
1.25
●USP-10B Reference Metal Mask Design
1.35
0.25
1.35
0.0750.300.10
0.15 0.15
1.45 1.45
0.35 1.10 1.10 0.35
0.70 0.70
1.051.05
0.55 0.55
0.075 0.30 0.10
■MARKING RULE
●USP-10B
① represents product series
MARK PRODUCT SERIES
3 XC9131******-G
② represents a type of DC/DC converters
1
2
3
4
5
USP-10B
(TOP VIEW)
10
9
⑤ ⑥④
② ③①
8
7
6
MARK ITEM DESCRIPTION PRODUCT SERIES
XC9131
Series
F
H
Output voltage
externally set-up(FB)
Output voltage
externally set-up(FB)
With CL Auto Discharge XC9131F*****-G
Without CL Auto Discharge XC9131H*****-G
③④ represents reference voltage and oscillation frequency
MARK
③ ④
VOLTAGE(V）
OSCILLATION
FREQUENCY(kHz)
PEODUCT SERIES
5 Ｃ 0.5 1200 XC9131*05C**-G
⑤⑥ represents production lot number
01～09, 0A～0Z, 11～9Z, A1～A9, AA～Z9, ZA～ZZ in order.
(G, I, J, O, Q, W excluded)
*No character inversion used.
27/28
XC9131 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
28/28
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