CL Capacitor-Less 500mA Low Power Consumption High Speed LDO Regulator
■GENERAL DESCRIPTION
The XC6503 series is a 500mA high speed CMOS LDO regulator that can provide stable output voltages even without a load
capacitor CL. The devices are available in fixed output voltage from 1.2V to 5.0V in 0.05V increments
The C
capacitor-less is possible because phase compensation is carried out internally unlike other LDOs where it is done
L
externally. It results in saving board design space. The current limit fold-back circuit and thermal shutdown circuit work as
protection circuit. The XC6503P is a 3-Terminal regulator and the XC6503D has a chip enable function, which enables the
entire circuit to be turned off by a low level input signal to the CE pin.
When a C
while in standby state, and as a result the V
■APPLICATIONS
●Mobile phones
●Portable game consoles
●Digital still camera modules
●Wireless LAN modules
●L
●Bluetooth modules
●Digital TV tuner modules
■TYPICAL APPLICATION CIRCUIT
capacitor is used, the IC can discharge the electric charge stored at the output capacitor through the internal switch
L
quickly returns to the VSS level.
OUT
■FEATURES
Maximum Output Current: 500mA
Input Voltage Range : 1.7V ~ 6.0V
Output Voltage Range : 1.2V ~ 5.0V (0.05V
iquid crystal display modules
Output Accuracy : ±1.0% (2.0V~5.0V)
±20mV (1.2V~1.95V)
Temperature Stability : ±30ppm/℃
Dropout Voltage : 190mV@V
Low Power Consumption: 15μA (TYP.), 0.1μA (in standby)
High PSRR : 55dB@1kHz, V
Protection Current : Current Limiter (630mA TYP.)
Short-circuit Protection
Thermal Shutdown
Capacitor-Less : Internal Phase Compensation
C
L
Operating Ambient Temperature
Packages :
Environmentally Friendly: EU RoHS Compliant, Pb Free
: -40℃~+85℃
USP-4, SOT-25, SOT-89-5 (XC6503D)
SOT-89, TO-252 (Preliminary) (XC6503P)
OUT
=2.8V, I
■TYPICAL PERFORMANCE
CHARACTERISTICS
(Preliminary)
300
250
(mA)
200
OUT
150
100
Ou tputCu rren t : I
50
0
XC6503x281xx
=3.8V, tr=tf=5μs, I
V
IN
CL=0.1μF(ceramic)
wit hou t C
OutputVoltage
OutputCurrent
OUT
Time : 4 0 μs/ div
=10⇔150mA, Ta=25℃
L
OUT
ETR0346-006a
increments)
=300mA
OUT
=2.8V
3.4
3.1
2.8
2.5
2.2
1.9
1.6
1/27
(V)
OUT
OutputVoltage : V
XC6503 Series
■PIN CONFIGURATION
V
OUT
54
NC
V
OUT
5
V
V
IN
SS
2
4
V
SS
2
2
3
V
SS
1
V
OUT
USP-4
(BOTTOM VIEW)
CE
4
V
IN
132
V
IN
SOT-25
(TOP VIEW)
V
CE
SS
123
V
CENC
SS
SOT-89-5
(TOP VIEW)
V
213
V
OUT
SS
SOT-89
(TOP VIEW)
V
IN
13
V
IN
*The dissipation pad for the USP-4 package should be solder-plated in reference mount pattern and metal masking so as to enhance mounting
strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V
(No. 2) pin.
SS
V
SS
2
2
V
SS
TO-252
(TOP VIEW)
(Preliminary)
V
OUT
■PIN ASSIGNMENT
PIN NUMBER
うSP-4
4 1 4 3 1 VIN
1 5 5 1 3 V
2 2 2 2 2 VSS
3 3 3 - - CE
- 4 1 - - NC
2/27
SOT-25 SOT89-5 SOT-89
TO-252
(Preliminary)
PIN NAME FUNCTIONS
Power Input
OUT
Output
Ground
ON/OFF Control
No Connection
■PRODUCT CLASSIFICATION
●Ordering Information XC6503D with ON/OFF function
(*1)
XC6503①②③④⑤⑥-⑦
DESIGNATOR ITEM SYMBOL DESCRIPTION
① Type of Regulator
②③ Output Voltage
④
⑤⑥-⑦
(*1)
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
(*2)
For without CE Pull-down or without CL discharge function, please contact your local Torex sales office or representative.
(*3)
For the output voltage in 0.05V increments, please contact your local Torex sales office or representative.
Packages (Order Unit)
●Ordering Information XC6503P 3-Terminal regulator
XC6503①②③④⑤⑥-⑦
(*2)
(*3)
12~50 ex.) ②=2, ③=8 → 2.8V
D CE Active High, with CE Pull-down, C
Output Accuracy 1
GR-G USP-4 (3,000/Reel)
MR-G SOT-25 (3,000/Reel)
PR-G SOT-89-5 (1,000/Reel)
(*1)
±0.02V (1.2~1.9V)、±1% (2.0~5.0V)
discharge
L
XC6503
Series
DESIGNATOR ITEM SYMBOL DESCRIPTION
①
②③
④
⑤⑥-⑦
(*1)
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
(*2)
For the output voltage in 0.05V increments, please contact your local Torex sales office or representative.
Type of Regulator P 3-Terminal regulator, without CE pin
Output Voltage
Output Accuracy 1
Packages (Order Unit)
(*2)
12~50 ex.) ②=2、③=8 → 2.8V
±0.02V (1.2~1.9V)、±1% (2.0~5.0V)
PR-G SOT-89 (1,000/Reel)
JR-G TO-252(Preliminary) (2,500/Reel)
3/27
XC6503 Series
■BLOCK DIAGRAMS
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
■ABSOLUTE MAXIMUM RATINGS
Ta =2 5℃
PAR AMETER SYMBOL RATINGS UNITS
Input Voltage
Output Current
Output Voltage
CE Input Voltage
USP-4 120
SOT-25 250
Power Dissipation
Power Dissipation
(PCB mounted)
Operating Ambient Temperature
(*1) Pd>(V
(*2) The power dissipation measured with the test board condition is listed as reference data. Please refer to page 21~25 for details.
IN-VOUT
(*2)
Storage Temperature
)×I
OUT
SOT-89-5 500
SOT-89 500
TO-252(Preliminary)
USP-4 1000
SOT-25 600
SOT-89-5 1300
SOT-89 1000
TO-252(Preliminary)
VIN V
I
850
OUT
V
V
OUT
VCE V
Pd
Pd
Topr -40~+85 ℃
Tst g - 55 ~+125 ℃
-0.3~VSS+6.5
SS
-0.3~VIN+0.3≦VSS+6.5 V
SS
SS
(*1)
-0.3~VSS+6.5 V
500
1800
mA
V
mW
mW
4/27
XC6503
■ELECTRICAL CHARACTERISTICS
●XC6503D Series
PAR AMET ER SYMBOL CONDITIONS MIN. TYP. MAX. UNITSCIRCUITS
Output Voltage V
Maximum Output
Current
Load Regulation
Dropout Voltage
(*5)
Vdif VCE=VIN , I
Supply Current
Stand-by Current
Line Regulation
Input Voltage
Output Voltage
Temperature
Characteristics
Ripple Rejection Rate
PSRR
Current Limit
Short-circuit Current
CE High Level Voltage
CE Low Level Voltage
CE High Level
Current
CE Low Level Current
I
CL Discharge
Resistance
Thermal Shutdown
Detect Temperature
Thermal Shutdown
Release
Temperature
Thermal Shutdown
Hysteresis Width
OUT(E)
I
OUTMAX
ΔV
OUT
I
SS
I
STB
ΔV
OUT
(ΔV
IN・VOUT
V
IN
ΔV
OUT
(ΔTo pr ・V
I
LIM
I
SHORT
V
CEH
V
CEL
I
CEH
CEL
R
DCHG
T
TSD
T
TSR
T
HYS
2.0V≦V
VCE=VIN 500 - - mA ①
VCE=VIN, 0.1mA≦I
V
IN=VCE
VIN=6.0V, VCE=VSS - 0.01 0.1 μA ②
/
V
OUT(T)
)
V
CE=VIN
1.7 - 6.0 V ①
V
/
CE=VIN
)
-40℃≦To pr ≦85℃
OUT
V
OUT(T)
={V
V
IN
V
CE=VIN
V
OUT(T)
=5.75VDC+0.5Vp-pAC
V
IN
V
CE=VIN
V
CE=VIN
V
CE=VIN
Short V
1.0 - 6.0 V ①
VSS - 0.3 V ①
V
IN=VCE
VCE=VSS -0.1 - 0.1 μA ①
VIN=6.0V, V
Junction Temperature
Junction Temperature
T
TSD-TTSR
2.0V>V
(*2)
(*3)
, VCE=VIN, I
OUT(T
)
, VCE=VIN, I
OUT(T
)
OUT
=300mA - E-1 mV ①
OUT
=6.0V, I
+0.5V≦VIN≦
, I
OUT
, I
OUT
=0mA - 15 30 μA ②
OUT
6.0V,
=30mA
=30mA
=10mA -0.02
OUT
=10mA ×0.99
OUT
≦300mA - 20 50 mV ①
≦4.75V
+1.0}VDC+0.5Vp-pAC
OUT(T)
, I
=30mA, f=1kHz
OUT
≧4.80V
, I
=30mA, f=1kHz
OUT
510 630 750 mA ①
to VSS level
OUT
=6.0V 3.5 6 10 μA ①
=5.0V, VCE=VSS 300 430 500 Ω ①
OUT
- 25 - ℃ -
(*4)
V
OUT(T
(*4)
)
- E-2 %/V ①
- ±30 - ppm/℃①
- 55 - dB ③
- 120 210 mA ①
- 150 - ℃ -
- 125 - ℃ -
+0.02
×1.01
(*4)
(*4)
V ①
Series
Ta=25℃
NOTE:
(*1) Unless otherwise stated regarding input voltage conditions, V
(*2) V
(i.e. the output voltage when “V
(*3) V
(*4) Characteristics of the actual V
(*5) Vdif=V
(*6) V
(*7) V
: Effective output voltage
OUT(E)
: Nominal output voltage
OUT(T)
(*7)
IN1
is a voltage equal to 98% of the output voltage whenever an amply stabilized I
OUT1
is an input voltage when V
IN1
-V
OUT1
(*6)
by setting output voltage is shown in the voltage chart.
OUT(E)
appears at the V
OUT1
+1.0V” is provided at the VIN pin while maintaining a certain I
OUT(T)
OUT
(*3)
IN=VOUT(T)
+1.0V.
OUT
{V
OUT(T)
+1.0V} is input
pin while the input voltage is gradually decreased.
OUT
value.)
5/27
XC6503 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC6503P Series
PAR AMET ER SYMBOL CONDITIONS MIN. TYP. MAX. UNITSCIRCUITS
(*3)
, I
OUT(T
OUT(T
OUT
OUT
=10mA
OUT
)
, I
=10mA ×0.99
OUT
)
≦300mA - 20 50 mV ①
=0mA - 15 30 μA ②
+0.5V≦VIN≦6.0V, I
≦4.75V
+1.0}VDC+0.5Vp-pAC
OUT(T)
≧4.80V
to VSS level - 120 210 mA ①
OUT
Output Voltage V
Maximum Output
Current
Load Regulation
Dropout Voltage
(*5)
Vdif I
Supply Current
Line Regulation
Input Voltage
Output Voltage
Temperature
Characteristics
Ripple Rejection Rate
PSRR
Current Limit
Short-circuit Current
Thermal Shutdown
Detect Temperature
OUT(E)
I
OUTMAX
ΔV
OUT
I
SS
ΔV
OUT
(ΔV
IN・VOUT
V
IN
ΔV
OUT
(ΔTo pr ・V
I
LIM
I
SHORT
T
TSD
2.0V≦V
500 - - mA ①
0.1mA≦I
=300mA - E-1 mV ①
OUT
V
/
= 6.0V, I
IN
V
OUT(T)
)
1.7 - 6.0 V ①
I
/
OUT
=30mA
OUT
)
-40℃≦To pr ≦85℃
V
OUT(T)
={V
V
IN
=30mA, f=1kHz
I
OUT
V
OUT(T)
=5.75VDC+0.5Vp-pAC
V
IN
=30mA, f=1kHz
I
OUT
510 630 750 mA ①
Short V
Junction Temperature
2.0V>V
(*2)
Thermal Shutdown
Release
T
TSR
Junction Temperature
Temperature
Thermal Shutdown
Hysteresis Width
T
T
HYS
- 25 - ℃ -
TSD-TTSR
NOTE:
(*1) Unless otherwise stated regarding input voltage conditions, V
(*2) V
(i.e. the output voltage when “V
(*3) V
(*4) Characteristics of the actual V
(*5) Vdif=V
(*6) V
(*7) V
: Effective output voltage
OUT(E)
: Nominal output voltage
OUT(T)
(*7)
IN1
is a voltage equal to 98% of the output voltage whenever an amply stabilized I
OUT1
is an input voltage when V
IN1
-V
OUT1
(*6)
by setting output voltage is shown in the voltage chart.
OUT(E)
appears at the V
OUT1
+1.0V” is provided at the VIN pin while maintaining a certain I
OUT(T)
pin while the input voltage is gradually decreased.
The voltage divided by resistors R1 and R2 is compared with the internal reference voltage by the error amplifier. The
P-channel MOSFET which is connected to the V
V
pin is controlled and stabilized by a system of negative feedback. The current limit circuit and short circuit protection operate
OUT
in relation to the level of output current and heat dissipation. Current limit circuit and short protection circuit operate with output
current and thermal shutdown circuit will operate with heating. Further, the IC’s internal circuitry can be shutdown via the CE pin
signal.
<CL Auto-Discharge Function>
XC6503D can quickly discharge the electric charge at the output capacitor (C
a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the V
BLOCK DIAGRAM). The CL discharge resistance is set to 430Ω when VIN is 6.0V (TYP.) and V
discharge time of the output capacitor (C
) is set by the CL auto-discharge resistance (R
L
setting time constant of a CL auto-discharge resistance value (R
output voltage after discharge via the N-channel transistor is calculated by the following formula.
V = V
( V : Output voltage after discharge, V
auto-discharge resistance R
τ: C
L
OUT(E)
DCHG×CL
<Current Limiter, Short-Circuit Protection>
The protection circuit operates as a combination of an output current limiter and fold-back short circuit protection. When load
current reaches the current limit level, the output voltage drops. As a result, the load current starts to reduce with showing
fold-back curve. The output current finally falls at the level of 120mA when the V
<Thermal Shutdown>
When the junction temperature of the built-in driver transistor reaches the temperature limit, the thermal shutdown circuit
operates and the driver transistor will be set to OFF. The IC resumes its operation when the thermal shutdown function is
released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal
shutdown release voltage.
<CE Pin>
The IC's internal circuitry can be shutdown via the signal from the CE pin with the XC6503D series. In shutdown mode, output
at the V
pin will be pulled down to the V
OUT
XC6503P does not have the CE pin.
The XC6503D has a pulled down resistor at the CE pin in order to avoid an unstable operation with the CE pin open (the CE
pin is left open, operation will be stopped). However, the CE pin input current will increase slightly through the pulled down
resistor when operating. If the correct output voltage is applied to the CE pin, the logic is fixed and the IC will operate normally.
However, if the medium voltage is input, supply current may increase as a result of an internal through current.
pin is then driven by the subsequent output signal. The output voltage at the
OUT
), when a low signal to the CE pin, which enables
L
) and an output capacitor value (CL) as τ(τ=C x R), the
DCHG
–t/
τ
e
OUT x
: Initial Output voltage, t: Discharge time,
, or t=τln (V
OUT(E)
/ V)
) and the output capacitor (CL). By
DCHG
pin and the VSS pin (cf.
OUT
is 5.0V (TYP.). Moreover,
OUT
Output capacitance
pin is short-circuited.
OUT
level via R1, R2 and C
SS
auto-discharge resistance R
L
. Please note the
DCHG
8/27
XC6503
Series
■ NOTES ON USE
1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
2. The XC6503 series operates even if without attaching an output capacitor. However, when wiring impedance is high,
operations may become unstable due to noise and/or phase lag depending on output current. Please wire the input
capacitor (CIN) and the output capacitor (CL) as close to the IC as possible.
3. The XC6503 installs fold-back current limit circuits. When start-up, this fold-back load curve affects its start-up
characteristics. The XC6503 having output current under 2.4V may not happen to start-up with the load conditions below.
In these cases, sequence control should be taken for connecting a load after the start-up execution.
Load Condition for Start-up:I
:Nominal Output Voltage
V
OUT(T)
OUT
≧ V
OUT(T)
/4.8
3.2
XC6503x281
CIN=CL=0.1μF(ceramic),VIN=V
2.8
2.4
(V)
OUT
2.0
1.6
XC6503x121
Start-up defect area which
it may happen.
+1V
OUT
●CONDITION
NOMINAL VOLTAGE LOAD CONDITION FOR START-UP
1.2V
1.5V
1.8V
≦250mA
≦312mA
≦375mA
1.2
0.8
OutputVoltage : V
0.4
0.0
0100 200300400500 600700
OutputCurrent : I
OUT
(mA)
4. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
9/27
XC6503 Series
■TEST CIRCUITS
●Circuit ①
●測定回路①
V
CIN=0.1μF
(ceramic)
V
V
CE
A
V
A
CE
CE
●Circuit ②
●測定回路②
●Circuit ③
●測定回路③
* For the XC6503P series, CE pin is connected to the V
V
IN
V
V
SS
V
IN
V
V
SS
V
IN
V
V
SS
internally.
IN
OUT
OUT
OUT
I
OUT
A
V
I
OUT
A
V
10/27
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) OutputVoltage v.s. OutputCurrent
XC6503x121xx
V
=2.2V
1.6
1.4
1.2
(V)
OUT
1.0
0.8
Ta=-40℃
Ta=25℃
Ta=85℃
0.6
0.4
OutputVoltage : V
0.2
0.0
0100200300400500600700
IN
1.6
1.4
1.2
(V)
OUT
1.0
0.8
0.6
0.4
OutputVoltage : V
0.2
0.0
0100200300400500600700
XC6503
Series
XC6503x121xx
Ta=25℃
VIN=1.7V
VIN=2.2V
OutputCurrent : I
XC6503x281xx
3.6
3.2
2.8
(V)
2.4
OUT
2.0
1.6
Ta=-40℃
Ta=25℃
Ta=85℃
1.2
0.8
OutputVoltage : V
0.4
0.0
0100200300400500600700
OutputCurrent : I
(2) OutputVoltage v.s. InputVoltage
XC6503x121xx
1.6
1.4
1.2
(V)
OUT
1.0
0.8
0.6
0.4
OutputVoltage : V
0.2
0.0
0123456
OUT
OUT
(mA)
(mA)
V
IN
I
OUT
Ta=85℃
Ta=25℃
Ta=-40℃
=3.8V
=30mA
OutputCurrent : I
OUT
(mA)
XC6503x281xx
3.6
3.2
2.8
(V)
2.4
OUT
2.0
1.6
1.2
0.8
OutputVoltage : V
0.4
0.0
0100200300400500600700
OutputCurrent : I
OUT
(mA)
XC6503x121xx
1.26
1.24
1.22
(V)
OUT
1.20
1.18
1.16
1.14
OutputVoltage : V
1.12
1.10
1.52.02.53.03.54.04.55.05.56.0
Ta=25℃
VIN=3.3V
VIN=3.8V
I
OUT
Ta=85℃
Ta=25℃
Ta=-40℃
=30mA
InputVoltage : V
(V)
IN
InputVoltage : V
IN
(V)
11/27
XC6503 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) OutputVoltage v.s. InputVoltage
XC6503x281xx
3.6
3.2
2.8
(V)
2.4
OUT
2.0
1.6
1.2
0.8
OutputVoltage : V
0.4
Ta=85℃
Ta=25℃
Ta=-40℃
0.0
0123456
I
OUT
=30mA
2.86
2.84
2.82
(V)
OUT
2.80
2.78
2.76
2.74
OutputVoltage : V
2.72
2.70
3.03.54.04.55.05.56.0
XC6503x281xx
Ta=85℃
Ta=25℃
Ta=-40℃
I
OUT
=30mA
InputVoltage : V
XC6503x501xx
6.0
5.0
(V)
4.0
OUT
3.0
2.0
OutputVoltage : V
1.0
0.0
0123456
InputVoltage : V
(3) DropoutVoltage v.s. OutputCurrent
XC6503x121xx
900
Ta=85℃
Ta=25℃
Ta=-40℃
(mV)
dif
DropoutVoltage : V
800
700
600
500
400
300
200
100
0
0100200300400500
(V)
IN
I
=30mA
OUT
Ta=85℃
Ta=25℃
Ta=-40℃
(V)
IN
* Below is the forbidden
area due to the minimum
operating voltage.
InputVoltage : V
IN
(V)
XC6503x501xx
I
=30mA
5.06
OUT
5.04
5.02
(V)
OUT
5.00
4.98
4.96
4.94
OutputVoltage : V
4.92
Ta=85℃
Ta=25℃
Ta=-40℃
4.90
5.25.45.65.86.0
InputVoltage : V
IN
(V)
XC6503x281xx
900
Ta=85℃
Ta=25℃
Ta=-40℃
(mV)
dif
800
700
600
500
400
300
200
DropoutVoltage : V
100
0
0100200300400500
12/27
OutputCurrent : I
OUT
(mA)
OutputCurrent : I
OUT
(mA)
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) DropoutVoltage v.s. OutputCurrent
XC6503x501xx
900
Ta=85℃
Ta=25℃
Ta=-40℃
(mV)
dif
DropoutVoltage : V
800
700
600
500
400
300
200
100
0
0100200300400500
XC6503
Series
OutputCurrent : I
(4) SupplyCurrent v.s. InputVoltage
XC6503x121xx
40
36
32
28
(μA)
SS
24
20
16
12
SupplyCurrent : I
8
4
0
0123456
InputVoltage : V
XC6503x501xx
40
36
32
28
(μA)
SS
24
20
16
12
SupplyCurrent : I
8
4
0
0123456
OUT
IN
(mA)
(V)
Ta=85℃
Ta=25℃
Ta=-40℃
Ta=85℃
Ta=25℃
Ta=-40℃
XC6503x281xx
40
36
32
28
(μA)
SS
24
20
16
12
SupplyCurrent : I
8
4
0
0123456
InputVoltage : V
IN
(V)
Ta=85℃
Ta=25℃
Ta=-40℃
InputVoltage : V
IN
(V)
13/27
XC6503 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) OutputVoltage v.s. AmbientTemperature
(V)
OUT
1.26
1.24
1.22
XC6503x121xx
V
=2.2V
IN
IOUT=10mA
IOUT=30mA
IOUT=300mA
(V)
OUT
2.95
2.90
2.85
XC6503x281xx
IOUT=10mA
IOUT=30mA
IOUT=300mA
V
=3.8V
IN
1.20
1.18
OutputVoltage : V
1.16
1.14
-50-250255075100
AmbientTemperature : Ta (℃)
XC6503x501xx
5.20
5.15
5.10
(V)
OUT
5.05
5.00
4.95
4.90
OutputVoltage : V
4.85
4.80
-50-250255075100
V
IN
IOUT=10mA
IOUT=30mA
IOUT=300mA
=6.0V
2.80
2.75
OutputVoltage : V
2.70
2.65
-50-250255075100
AmbientTemperature : Ta (℃)
AmbientTemperature : Ta (℃)
(6) Rising Respose Time
4
3
2
(V)
IN
1
0
-1
InputVoltage : V
-2
-3
-4
XC6503x121xx
tr=5μs, Without CL, IOUT=30mA, Ta=25℃
VIN=0V→2.2V
InputVoltage
OutputVoltage
Time : 40μs/div
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
(V)
OUT
OutputVoltage : V
(V)
IN
-2
InputVoltage : V
-4
-6
XC6503x281xx
6
tr=5μs, Without C
4
2
0
V
, I
=30mA, Ta=25℃
L
OUT
InputVoltage
OutputVoltage
=0V→3.8V
IN
4.2
3.5
2.8
2.1
(V)
OUT
1.4
OutputVoltage : V
0.7
0.0
Time : 40μs/div
14/27
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) Rising Respose Time
(V)
IN
-2
-4
InputVoltage : V
-6
-8
XC6503x501xx
8
tr=5μs, Without C
6
4
2
0
Time : 40μs/div
, I
=30mA, Ta=25℃
L
OUT
InputVoltage
OutputVoltage
VIN=0V→6.0V
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
(V)
OUT
OutputVoltage : V
XC6503
Series
(7) Rush Current
XC6503x281xx
tr=5μs, C
800
L
600
400
(mA)
200
RUSH
0
-200
-400
Rush Current : I
InputVoltage
-600
-800
Time : 40μs/div
(8) CE Rising Respose Time
XC6503x121xx
V
=0V→2.2V, tr=5μs, Without CL, I
CE
(V)
CE
-1
CE Voltage : V
-2
-3
-4
4
3
2
1
0
=0.1μF(ceramic), I
VIN=0V→3.8V
=30mA, Ta=25℃
OUT
RushCurrent
OutputVoltage
VIN=2.2V, Ta=25℃
=30mA
OUT
CE Voltage
OutputVoltage
8
7
6
5
4
3
2
1
0
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
(V)
OUT
(V), V
IN
Voltage : V
(V)
OutputVoltage : V
OUT
800
600
400
(mA)
200
RUSH
-200
-400
Rush Current : I
-600
-800
(V)
CE
-2
CE Voltage : V
-4
-6
XC6503x281xx
tr=5μs, C
L
=22μF(ceramic), I
VIN=0V→3.8V
=30mA, Ta=25℃
OUT
RushCurrent
8
7
(V)
6
OUT
5
(V), V
0
InputVoltage
OutputVoltage
IN
4
3
2
Voltage : V
1
0
Time : 40μs/div
XC6503x281xx
=0V→3.8V, tr=5μs, Without CL, I
V
6
CE
4
2
0
V
=3.8V, Ta=25℃
IN
OUT
CE Voltage
OutputVoltage
=30mA
4.2
3.5
2.8
2.1
(V)
OUT
1.4
OutputVoltage : V
0.7
0.0
Time : 40μs/div
Time : 40μs/div
15/27
XC6503 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) CE Rising Respose Time
(V)
CE
-2
CE Voltage : V
-4
-6
-8
XC6503x501xx
=0V→6.0V, tr=5μs, Without CL, I
V
8
CE
6
4
2
0
Time : 40μs/div
=6V, Ta=25℃
V
IN
OUT
CE Voltage
OutputVoltage
=30mA
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
(V)
OUT
OutputVoltage : V
(9) Line transient response
XC6503x121xx
tr=5μs, C
=0.1μF(ceramic), I
L
InputVoltage
OutputVoltage
Time : 100μs/div
XC6503x281xx
=0.1μF(ceramic), I
tr=5μs, C
L
InputVoltage
(V)
IN
InputVoltage : V
-1
-2
(V)
IN
4
3
2
1
0
6
4
2
VIN=2.2V⇔3.2V
=30mA, Ta=25℃
OUT
V
=3.8V⇔4.8V
IN
=30mA, Ta=25℃
OUT
2.4
2.1
1.8
1.5
1.2
0.9
0.6
4.0
3.7
3.4
(V)
OUT
OutputVoltage : V
(V)
OUT
(V)
IN
InputVoltage : V
-1
-2
(V)
IN
XC6503x121xx
4
tr=5μs, Without C
InputVoltage
3
VIN=2.2V⇔3.2V
, I
=30mA, Ta=25℃
L
OUT
2.4
2.1
(V)
2
1
OutputVoltage
0
1.8
1.5
1.2
0.9
OUT
OutputVoltage : V
0.6
Time : 100μs/div
XC6503x281xx
6
4
tr=5μs, Without C
InputVoltage
V
, I
=30mA, Ta=25℃
L
OUT
=3.8V⇔4.8V
IN
4.0
3.7
(V)
2
3.4
OUT
0
-2
InputVoltage : V
-4
-6
16/27
OutputVoltage
Time : 100μs/div
3.1
2.8
2.5
2.2
0
-2
OutputVoltage
OutputVoltage : V
InputVoltage : V
-4
-6
3.1
2.8
2.5
2.2
OutputVoltage : V
Time : 100μs/div
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) Line transient response
XC6503x501xx
=0.1uF(ceramic), I
tr=5μs, C
8
L
VIN=5.5V⇔6.0V
=30mA, Ta=25℃
OUT
6.2
8
XC6503x501xx
tr=5μs, Without C
VIN=5.5V⇔6.0V
, I
=30mA, Ta=25℃
L
OUT
XC6503
Series
6.2
7
(V)
IN
6
InputVoltage
5
4
InputVoltage : V
OutputVoltage
3
2
Time : 100μs/div
(10) Load transient response
XC6503x121xx
V
=2.2V, tr=tf=5μs, I
300
250
(mA)
200
OUT
150
100
OutputCurrent : I
50
IN
CL=0.1μF(ceramic)
without C
OutputVoltage
OutputCurrent
=0.1⇔50mA, Ta=25℃
OUT
L
5.9
5.6
5.3
5.0
4.7
4.4
1.8
1.5
1.2
0.9
0.6
0.3
(V)
OUT
OutputVoltage : V
(V)
OUT
OutputVoltage : V
7
(V)
6
IN
5
4
InputVoltage : V
3
2
300
250
(mA)
200
OUT
150
100
OutputCurrent : I
50
InputVoltage
OutputVoltage
Time : 100μs/div
XC6503x121xx
V
=2.2V, tr=tf=5μs, I
IN
CL=0.1μF(ceramic)
without C
OutputVoltage
OutputCurrent
=10⇔150mA, Ta=25℃
OUT
L
5.9
5.6
5.3
5.0
4.7
4.4
1.8
1.5
1.2
0.9
0.6
0.3
(V)
OUT
OutputVoltage : V
(V)
OUT
OutputVoltage : V
300
250
(mA)
200
OUT
150
100
OutputCurrent : I
50
0
0.0
Time : 100μs/div
XC6503x281xx
V
=3.8V, tr=tf=5μs, I
IN
CL=0.1μF(ceramic)
without C
OutputVoltage
=0.1⇔50mA, Ta=25℃
OUT
L
3.4
3.1
2.8
(V)
OUT
2.5
2.2
OutputCurrent
0
1.9
1.6
OutputVoltage : V
Time : 100μs/div
300
250
(mA)
200
OUT
150
100
OutputCurrent : I
50
0
0.0
Time : 40μs/div
XC6503x281xx
V
=3.8V, tr=tf=5μs, I
IN
CL=0.1μF(ceramic)
without C
OutputVoltage
=10⇔150mA, Ta=25℃
OUT
L
3.4
3.1
2.8
(V)
OUT
2.5
OutputCurrent
2.2
OutputVoltage : V
1.9
0
1.6
Time : 40μs/div
17/27
XC6503 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) Load transient response
300
250
(mA)
200
OUT
150
100
OutputCurrent : I
50
XC6503x501xx
V
=6.0V, tr=tf=5μs, I
IN
CL=0.1μF(ceramic)
without C
OutputVoltage
OutputCurrent
=0.1⇔50mA, Ta=25℃
OUT
L
5.6
5.3
5.0
4.7
4.4
4.1
(V)
OUT
OutputVoltage : V
300
250
(mA)
200
OUT
150
100
OutputCurrent : I
50
XC6503x501xx
V
=6.0V, tr=tf=5μs, I
IN
CL=0.1μF(ceramic)
without C
OutputVoltage
OutputCurrent
OUT
=10⇔150mA, Ta=25℃
L
5.6
5.3
5.0
4.7
4.4
4.1
(V)
OUT
OutputVoltage : V
0
Time : 100μs/div
(11) Ripple Rejection Ratio
XC6503x121xx
V
=2.2V+0.5V
80
IN
70
60
50
40
30
20
10
Ripple Rejection Ratio : PSRR (dB)
0
101001k10k100k
Ripple Frequency : f (Hz)
XC6503x501xx
V
=5.75V+0.5V
80
IN
70
60
50
40
30
20
10
Ripple Rejection Ratio : PSRR (dB)
0
101001k10k100k
Ripple Frequency : f (Hz)
, I
P-PAC
OUT
CL=0.1μF(ceramic)
Without CL
, I
P-PAC
OUT
CL=0.1μF(ceramic)
Without CL
=30mA, Ta=25℃
=30mA, Ta=25℃
3.8
0
Time : 40μs/div
XC6503x281xx
80
70
=3.8V+0.5V
IN
, I
=30mA, Ta=25℃
P-PAC
OUT
CL=0.1μF(ceramic)
Without CL
V
60
50
40
30
20
10
Ripple Rejection Ratio : PSRR (dB)
0
101001k10k100k
Ripple Frequency : f (Hz)
3.8
18/27
■PACKAGING INFORMATION
XC6503
Series
(Preliminary)
19/27
XC6503 Series
■PACKAGING INFORMATION (Continued)
●USP-4 Reference Pattern Layout ●USP-4 Reference Metal Mask Design
1.0
2.0
0.350.35
43
0.4
0.7
0.4
12
0.6
1.9
0.8
0.350.35
43
0.3
0.3
0.5
0.3
12
0.6
20/27
■PACKAGING INFORMATION (Continued)
● USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
In top and back faces
Package heat-sink is tied to the copper traces
Ambient Temperature(℃) Power Dissipation Pd(mW) Thermal Resistance (℃/W)
2
in one side)
Evaluation Board (Unit:mm)
Evaluation Board (Unit: mm)
XC6503
Series
25 1000
100.00
85 400
Pd Vs. Ta
1200
1000
800
600
(mW)
400
200
Power Dissipation: Pd
0
25456585105125
Ambient Temperature: Ta (℃)
AmbientTemperatureTa:(℃)
21/27
p
(
)
XC6503 Series
■PACKAGING INFORMATION (Continued)
● SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature(℃) Power Dissipation Pd(mW) Thermal Resistance (℃/W)
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
2
in one side)
評価基板レイアウト(単位:mm)
Evaluation Board (Unit: mm)
25 600
85 240
Pd-Ta特性グラフ
Pd vs. Ta
700
mW
600
166.67
500
400
ation: Pd
300
200
100
許容損失Pd(mW)
Power Dissi
0
25456585105125
Ambient Temperature: Ta (℃)
周辺温度Ta(℃)
22/27
XC6503
Series
■PACKAGING INFORMATION (Continued)
● SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 5 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
In top and back faces
Package heat-sink is tied to the copper traces
Ambient Temperature(℃) Power Dissipation Pd(mW) Thermal Resistance (℃/W)
2
in one side)
Evaluation Board (Unit: mm)
許容損失Pd(mW)
Power Dissipation: Pd (mW)
25 1300
85 520
Pd-Ta特性グラフ
Pd vs. Ta
1400
1200
1000
800
600
400
200
0
25456585105125
Ambient Temperature: Ta (℃)
周辺温度Ta(℃)
76.92
23/27
XC6503 Series
■PACKAGING INFORMATION (Continued)
● SOT-89 Power Dissipation
Power dissipation data for the SOT-89 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition : Mount on a board
Ambient : Natural convection
Soldering : Lead (Pb) free
Board : Dimensions 40×40mm(1600mm
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
2
in one side)
Material : Glass Epoxy(FR-4)
Thickness : 1.6mm
Through-hole : 5 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Board Mount ( Tjmax=125℃)
Ambient Temperature (℃)
25 1000
Power Dissipation Pd (mW)
85 400
Pd vs Ta
1200
1000
800
600
400
200
Power Dissipation Pd(mW)
0
25456585105125
Ambient Temperature Ta(℃)
24/27
28.9
Evaluation Board (Unit: mm)
Evaluation Board (Unit: mm)
Thermal Resistance (℃/W)
100.00
40.0
2.5
XC6503
Series
■PACKAGING INFORMATION (Continued)
● TO-252 Power Dissipation (Preliminary)
Power dissipation data for the TO-252 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
Copper (Cu) traces occupy 50% of the board area
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
In top and back faces
Package heat-sink is tied to the copper traces
Ambient Temperature(℃) Power Dissipation Pd(mW) Thermal Resistance (℃/W)